TW284891B - - Google Patents

Info

Publication number
TW284891B
TW284891B TW84110072A TW84110072A TW284891B TW 284891 B TW284891 B TW 284891B TW 84110072 A TW84110072 A TW 84110072A TW 84110072 A TW84110072 A TW 84110072A TW 284891 B TW284891 B TW 284891B
Authority
TW
Taiwan
Application number
TW84110072A
Other languages
Chinese (zh)
Original Assignee
Johnson Matthey Elect Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Johnson Matthey Elect Inc filed Critical Johnson Matthey Elect Inc
Application granted granted Critical
Publication of TW284891B publication Critical patent/TW284891B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Electroplating Methods And Accessories (AREA)
TW84110072A 1994-07-19 1995-09-26 TW284891B (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US27714594A 1994-07-19 1994-07-19

Publications (1)

Publication Number Publication Date
TW284891B true TW284891B (ja) 1996-09-01

Family

ID=23059580

Family Applications (1)

Application Number Title Priority Date Filing Date
TW84110072A TW284891B (ja) 1994-07-19 1995-09-26

Country Status (2)

Country Link
TW (1) TW284891B (ja)
WO (1) WO1996002941A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109478517A (zh) * 2016-07-04 2019-03-15 三菱电机株式会社 半导体装置及其制造方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6096576A (en) * 1997-09-02 2000-08-01 Silicon Light Machines Method of producing an electrical interface to an integrated circuit device having high density I/O count
US6303986B1 (en) 1998-07-29 2001-10-16 Silicon Light Machines Method of and apparatus for sealing an hermetic lid to a semiconductor die
US6785001B2 (en) 2001-08-21 2004-08-31 Silicon Light Machines, Inc. Method and apparatus for measuring wavelength jitter of light signal
US7046420B1 (en) 2003-02-28 2006-05-16 Silicon Light Machines Corporation MEM micro-structures and methods of making the same
US9364529B2 (en) 2007-04-29 2016-06-14 Beijing Wantai Biological Pharmacy Enterprise Co., Ltd. Truncated L1 protein of human papillomavirus type 18
US9698116B2 (en) 2014-10-31 2017-07-04 Nxp Usa, Inc. Thick-silver layer interface for a semiconductor die and corresponding thermal layer

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4141029A (en) * 1977-12-30 1979-02-20 Texas Instruments Incorporated Integrated circuit device
US4291815B1 (en) * 1980-02-19 1998-09-29 Semiconductor Packaging Materi Ceramic lid assembly for hermetic sealing of a semiconductor chip
US4331258A (en) * 1981-03-05 1982-05-25 Raychem Corporation Sealing cover for an hermetically sealed container
US4666796A (en) * 1984-09-26 1987-05-19 Allied Corporation Plated parts and their production
US4601958A (en) * 1984-09-26 1986-07-22 Allied Corporation Plated parts and their production
JPS61204953A (ja) * 1985-03-08 1986-09-11 Sumitomo Metal Mining Co Ltd ハ−メチツクシ−ルカバ−及びその製造方法
US4640438A (en) * 1986-03-17 1987-02-03 Comienco Limited Cover for semiconductor device packages
JPS635550A (ja) * 1986-06-25 1988-01-11 Mitsubishi Electric Corp 半導体装置
US4737418A (en) * 1986-12-22 1988-04-12 Advanced Materials Technology Corp. Nickel clad corrosion resistant lid for semiconductor package
US4835067A (en) * 1988-01-21 1989-05-30 Electro Alloys Corp. Corrosion resistant electroplating process, and plated article
US4842961A (en) * 1988-03-04 1989-06-27 Advanced Materials Technology Corp. Alternate electrolytic/electroless-layered lid for electronics package
US5045639A (en) * 1990-08-21 1991-09-03 Tong Hsing Electronic Industries Ltd. Pin grid array package

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109478517A (zh) * 2016-07-04 2019-03-15 三菱电机株式会社 半导体装置及其制造方法
CN109478517B (zh) * 2016-07-04 2020-02-21 三菱电机株式会社 半导体装置及其制造方法

Also Published As

Publication number Publication date
WO1996002941A1 (en) 1996-02-01

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