TW284891B - - Google Patents

Info

Publication number
TW284891B
TW284891B TW084110072A TW84110072A TW284891B TW 284891 B TW284891 B TW 284891B TW 084110072 A TW084110072 A TW 084110072A TW 84110072 A TW84110072 A TW 84110072A TW 284891 B TW284891 B TW 284891B
Authority
TW
Taiwan
Application number
TW084110072A
Other languages
Chinese (zh)
Original Assignee
Johnson Matthey Elect Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Johnson Matthey Elect Inc filed Critical Johnson Matthey Elect Inc
Application granted granted Critical
Publication of TW284891B publication Critical patent/TW284891B/zh

Links

Classifications

    • H10W76/60—
    • H10W76/12—
TW084110072A 1994-07-19 1995-09-26 TW284891B (index.php)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US27714594A 1994-07-19 1994-07-19

Publications (1)

Publication Number Publication Date
TW284891B true TW284891B (index.php) 1996-09-01

Family

ID=23059580

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084110072A TW284891B (index.php) 1994-07-19 1995-09-26

Country Status (2)

Country Link
TW (1) TW284891B (index.php)
WO (1) WO1996002941A1 (index.php)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109478517A (zh) * 2016-07-04 2019-03-15 三菱电机株式会社 半导体装置及其制造方法

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US6096576A (en) * 1997-09-02 2000-08-01 Silicon Light Machines Method of producing an electrical interface to an integrated circuit device having high density I/O count
US6872984B1 (en) 1998-07-29 2005-03-29 Silicon Light Machines Corporation Method of sealing a hermetic lid to a semiconductor die at an angle
US6303986B1 (en) 1998-07-29 2001-10-16 Silicon Light Machines Method of and apparatus for sealing an hermetic lid to a semiconductor die
US7177081B2 (en) 2001-03-08 2007-02-13 Silicon Light Machines Corporation High contrast grating light valve type device
US6785001B2 (en) 2001-08-21 2004-08-31 Silicon Light Machines, Inc. Method and apparatus for measuring wavelength jitter of light signal
US6930364B2 (en) 2001-09-13 2005-08-16 Silicon Light Machines Corporation Microelectronic mechanical system and methods
US6956995B1 (en) 2001-11-09 2005-10-18 Silicon Light Machines Corporation Optical communication arrangement
US6839479B2 (en) 2002-05-29 2005-01-04 Silicon Light Machines Corporation Optical switch
US7054515B1 (en) 2002-05-30 2006-05-30 Silicon Light Machines Corporation Diffractive light modulator-based dynamic equalizer with integrated spectral monitor
US6908201B2 (en) 2002-06-28 2005-06-21 Silicon Light Machines Corporation Micro-support structures
US7057795B2 (en) 2002-08-20 2006-06-06 Silicon Light Machines Corporation Micro-structures with individually addressable ribbon pairs
US6928207B1 (en) 2002-12-12 2005-08-09 Silicon Light Machines Corporation Apparatus for selectively blocking WDM channels
US6987600B1 (en) 2002-12-17 2006-01-17 Silicon Light Machines Corporation Arbitrary phase profile for better equalization in dynamic gain equalizer
US7057819B1 (en) 2002-12-17 2006-06-06 Silicon Light Machines Corporation High contrast tilting ribbon blazed grating
US6934070B1 (en) 2002-12-18 2005-08-23 Silicon Light Machines Corporation Chirped optical MEM device
US6927891B1 (en) 2002-12-23 2005-08-09 Silicon Light Machines Corporation Tilt-able grating plane for improved crosstalk in 1×N blaze switches
US7068372B1 (en) 2003-01-28 2006-06-27 Silicon Light Machines Corporation MEMS interferometer-based reconfigurable optical add-and-drop multiplexor
US7286764B1 (en) 2003-02-03 2007-10-23 Silicon Light Machines Corporation Reconfigurable modulator-based optical add-and-drop multiplexer
US6947613B1 (en) 2003-02-11 2005-09-20 Silicon Light Machines Corporation Wavelength selective switch and equalizer
US6922272B1 (en) 2003-02-14 2005-07-26 Silicon Light Machines Corporation Method and apparatus for leveling thermal stress variations in multi-layer MEMS devices
US7391973B1 (en) 2003-02-28 2008-06-24 Silicon Light Machines Corporation Two-stage gain equalizer
US6922273B1 (en) 2003-02-28 2005-07-26 Silicon Light Machines Corporation PDL mitigation structure for diffractive MEMS and gratings
US7046420B1 (en) 2003-02-28 2006-05-16 Silicon Light Machines Corporation MEM micro-structures and methods of making the same
US7027202B1 (en) 2003-02-28 2006-04-11 Silicon Light Machines Corp Silicon substrate as a light modulator sacrificial layer
US7042611B1 (en) 2003-03-03 2006-05-09 Silicon Light Machines Corporation Pre-deflected bias ribbons
EP2147926B1 (en) 2007-04-29 2016-08-24 Beijing Wantai Biological Pharmacy Enterprise Co., Ltd. Truncated human papillomavirus type 18 l1 proteins
US9698116B2 (en) 2014-10-31 2017-07-04 Nxp Usa, Inc. Thick-silver layer interface for a semiconductor die and corresponding thermal layer
CN114883274A (zh) * 2022-04-06 2022-08-09 合肥圣达电子科技实业有限公司 一种预制金锡焊料环的气密性封装盖板及其制备方法
BE1031732B1 (nl) * 2023-06-22 2025-02-03 C Mac Electromag Bvba Halfgeleider-afdekking met soldeermateriaalpakking

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US4141029A (en) * 1977-12-30 1979-02-20 Texas Instruments Incorporated Integrated circuit device
US4291815B1 (en) * 1980-02-19 1998-09-29 Semiconductor Packaging Materi Ceramic lid assembly for hermetic sealing of a semiconductor chip
US4331258A (en) * 1981-03-05 1982-05-25 Raychem Corporation Sealing cover for an hermetically sealed container
US4601958A (en) * 1984-09-26 1986-07-22 Allied Corporation Plated parts and their production
US4666796A (en) * 1984-09-26 1987-05-19 Allied Corporation Plated parts and their production
JPS61204953A (ja) * 1985-03-08 1986-09-11 Sumitomo Metal Mining Co Ltd ハ−メチツクシ−ルカバ−及びその製造方法
US4640438A (en) * 1986-03-17 1987-02-03 Comienco Limited Cover for semiconductor device packages
JPS635550A (ja) * 1986-06-25 1988-01-11 Mitsubishi Electric Corp 半導体装置
US4737418A (en) * 1986-12-22 1988-04-12 Advanced Materials Technology Corp. Nickel clad corrosion resistant lid for semiconductor package
US4835067A (en) * 1988-01-21 1989-05-30 Electro Alloys Corp. Corrosion resistant electroplating process, and plated article
US4842961A (en) * 1988-03-04 1989-06-27 Advanced Materials Technology Corp. Alternate electrolytic/electroless-layered lid for electronics package
US5045639A (en) * 1990-08-21 1991-09-03 Tong Hsing Electronic Industries Ltd. Pin grid array package

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109478517A (zh) * 2016-07-04 2019-03-15 三菱电机株式会社 半导体装置及其制造方法
CN109478517B (zh) * 2016-07-04 2020-02-21 三菱电机株式会社 半导体装置及其制造方法

Also Published As

Publication number Publication date
WO1996002941A1 (en) 1996-02-01

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