TW282573B - - Google Patents
Info
- Publication number
- TW282573B TW282573B TW83111008A TW83111008A TW282573B TW 282573 B TW282573 B TW 282573B TW 83111008 A TW83111008 A TW 83111008A TW 83111008 A TW83111008 A TW 83111008A TW 282573 B TW282573 B TW 282573B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12662693A JP2789563B2 (ja) | 1993-05-28 | 1993-05-28 | 集積回路装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW282573B true TW282573B (cs) | 1996-08-01 |
Family
ID=14939852
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW83111008A TW282573B (cs) | 1993-05-28 | 1994-11-26 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2789563B2 (cs) |
| TW (1) | TW282573B (cs) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6181006B1 (en) | 1998-05-28 | 2001-01-30 | Ericsson Inc. | Thermally conductive mounting arrangement for securing an integrated circuit package to a heat sink |
| JP5382049B2 (ja) | 2010-06-30 | 2014-01-08 | 株式会社デンソー | 半導体装置 |
| JP6316731B2 (ja) * | 2014-01-14 | 2018-04-25 | 新光電気工業株式会社 | 配線基板及びその製造方法、並びに半導体パッケージ |
-
1993
- 1993-05-28 JP JP12662693A patent/JP2789563B2/ja not_active Expired - Fee Related
-
1994
- 1994-11-26 TW TW83111008A patent/TW282573B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06338577A (ja) | 1994-12-06 |
| JP2789563B2 (ja) | 1998-08-20 |