TW274676B - - Google Patents

Info

Publication number
TW274676B
TW274676B TW082106334A TW82106334A TW274676B TW 274676 B TW274676 B TW 274676B TW 082106334 A TW082106334 A TW 082106334A TW 82106334 A TW82106334 A TW 82106334A TW 274676 B TW274676 B TW 274676B
Authority
TW
Taiwan
Application number
TW082106334A
Other languages
Chinese (zh)
Original Assignee
Sony Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP4245511A external-priority patent/JPH0667683A/ja
Priority claimed from JP4257188A external-priority patent/JPH0683378A/ja
Application filed by Sony Co Ltd filed Critical Sony Co Ltd
Application granted granted Critical
Publication of TW274676B publication Critical patent/TW274676B/zh

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B7/00—Radio transmission systems, i.e. using radiation field
    • H04B7/14—Relay systems
    • H04B7/15—Active relay systems

Landscapes

  • Cable Transmission Systems, Equalization Of Radio And Reduction Of Echo (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
TW082106334A 1992-08-21 1993-08-07 TW274676B (cg-RX-API-DMAC7.html)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP4245511A JPH0667683A (ja) 1992-08-21 1992-08-21 残響付加装置
JP4257188A JPH0683378A (ja) 1992-08-31 1992-08-31 残響付加装置

Publications (1)

Publication Number Publication Date
TW274676B true TW274676B (cg-RX-API-DMAC7.html) 1996-04-21

Family

ID=51397250

Family Applications (1)

Application Number Title Priority Date Filing Date
TW082106334A TW274676B (cg-RX-API-DMAC7.html) 1992-08-21 1993-08-07

Country Status (2)

Country Link
KR (1) KR940004993A (cg-RX-API-DMAC7.html)
TW (1) TW274676B (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7518217B2 (en) 2004-11-11 2009-04-14 Yamaha Corporation Semiconductor device, semiconductor wafer, chip size package, and methods of manufacturing and inspection therefor

Also Published As

Publication number Publication date
KR940004993A (ko) 1994-03-16

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