TW273638B - - Google Patents

Info

Publication number
TW273638B
TW273638B TW084105223A TW84105223A TW273638B TW 273638 B TW273638 B TW 273638B TW 084105223 A TW084105223 A TW 084105223A TW 84105223 A TW84105223 A TW 84105223A TW 273638 B TW273638 B TW 273638B
Authority
TW
Taiwan
Application number
TW084105223A
Other languages
Chinese (zh)
Inventor
Koki Otake
Junichi Kasai
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of TW273638B publication Critical patent/TW273638B/zh

Links

Classifications

    • H10P72/74—
    • H10W70/093—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • H10W72/01204—
    • H10W72/07251—
    • H10W72/20—
TW084105223A 1994-01-20 1995-05-24 TW273638B (index.php)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP475194 1994-01-20
JP7003679A JPH07249631A (ja) 1994-01-20 1995-01-13 はんだバンプ及びはんだボールの製造方法及び半導体装置の製造方法

Publications (1)

Publication Number Publication Date
TW273638B true TW273638B (index.php) 1996-04-01

Family

ID=26337314

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084105223A TW273638B (index.php) 1994-01-20 1995-05-24

Country Status (2)

Country Link
JP (1) JPH07249631A (index.php)
TW (1) TW273638B (index.php)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105489511A (zh) * 2015-11-30 2016-04-13 苏州瑞而美光电科技有限公司 标径bga封装金属焊球的制备方法及模具

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3401391B2 (ja) * 1996-04-16 2003-04-28 日本特殊陶業株式会社 半田バンプを有する基板の製造方法
DE19634646A1 (de) * 1996-08-27 1998-03-05 Pac Tech Gmbh Verfahren zur selektiven Belotung
EP1918991B1 (en) * 1996-08-27 2017-04-05 Nippon Steel & Sumitomo Metal Corporation Semiconductor device provided with low melting point metal bumps
KR20010023027A (ko) 1997-08-19 2001-03-26 가나이 쓰토무 범프 전극 형성 방법 및 반도체 장치 제조 방법
US6653219B2 (en) 2000-01-13 2003-11-25 Hitachi, Ltd. Method of manufacturing bump electrodes and a method of manufacturing a semiconductor device
KR20030070342A (ko) * 2002-02-25 2003-08-30 최록일 반도체 소자의 솔더볼 형성장치 및 그 탑재방법
DE102004041026A1 (de) * 2004-08-25 2005-11-03 Infineon Technologies Ag Verfahren zur Herstellung eines oder mehrerer Kontakthügel auf einer Substratscheibe
WO2015052780A1 (ja) * 2013-10-08 2015-04-16 リンテック株式会社 電子部品実装体の製造方法
JP2017157626A (ja) * 2016-02-29 2017-09-07 三菱マテリアル株式会社 はんだバンプの形成方法
EP4084051A4 (en) * 2019-12-27 2023-08-02 Resonac Corporation SOLDER BALL FORMING ELEMENT, METHOD OF MAKING A SOLDER BALL FORMING MEMBER AND METHOD OF MAKING AN ELECTRODE SUBSTRATE WITH A SOLDER BALL
KR20220122663A (ko) * 2019-12-27 2022-09-02 쇼와덴코머티리얼즈가부시끼가이샤 땜납 범프 형성용 부재, 땜납 범프 형성용 부재의 제조 방법, 및 땜납 범프 부착 전극 기판의 제조 방법

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105489511A (zh) * 2015-11-30 2016-04-13 苏州瑞而美光电科技有限公司 标径bga封装金属焊球的制备方法及模具
CN105489511B (zh) * 2015-11-30 2019-01-25 苏州瑞而美光电科技有限公司 标径bga封装金属焊球的制备方法及模具

Also Published As

Publication number Publication date
JPH07249631A (ja) 1995-09-26

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