TW273638B - - Google Patents
Info
- Publication number
- TW273638B TW273638B TW084105223A TW84105223A TW273638B TW 273638 B TW273638 B TW 273638B TW 084105223 A TW084105223 A TW 084105223A TW 84105223 A TW84105223 A TW 84105223A TW 273638 B TW273638 B TW 273638B
- Authority
- TW
- Taiwan
Links
Classifications
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- H10P72/74—
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- H10W70/093—
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
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- H10W72/01204—
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- H10W72/07251—
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- H10W72/20—
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP475194 | 1994-01-20 | ||
| JP7003679A JPH07249631A (ja) | 1994-01-20 | 1995-01-13 | はんだバンプ及びはんだボールの製造方法及び半導体装置の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW273638B true TW273638B (d) | 1996-04-01 |
Family
ID=26337314
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW084105223A TW273638B (d) | 1994-01-20 | 1995-05-24 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPH07249631A (d) |
| TW (1) | TW273638B (d) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105489511A (zh) * | 2015-11-30 | 2016-04-13 | 苏州瑞而美光电科技有限公司 | 标径bga封装金属焊球的制备方法及模具 |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3401391B2 (ja) * | 1996-04-16 | 2003-04-28 | 日本特殊陶業株式会社 | 半田バンプを有する基板の製造方法 |
| DE19634646A1 (de) * | 1996-08-27 | 1998-03-05 | Pac Tech Gmbh | Verfahren zur selektiven Belotung |
| JP3633941B2 (ja) * | 1996-08-27 | 2005-03-30 | 新日本製鐵株式会社 | 半導体装置製造方法 |
| WO1999009590A1 (en) * | 1997-08-19 | 1999-02-25 | Hitachi, Ltd. | Method for forming bump electrode and method for manufacturing semiconductor device |
| US6653219B2 (en) | 2000-01-13 | 2003-11-25 | Hitachi, Ltd. | Method of manufacturing bump electrodes and a method of manufacturing a semiconductor device |
| KR20030070342A (ko) * | 2002-02-25 | 2003-08-30 | 최록일 | 반도체 소자의 솔더볼 형성장치 및 그 탑재방법 |
| DE102004041026A1 (de) * | 2004-08-25 | 2005-11-03 | Infineon Technologies Ag | Verfahren zur Herstellung eines oder mehrerer Kontakthügel auf einer Substratscheibe |
| JP6225193B2 (ja) * | 2013-10-08 | 2017-11-01 | リンテック株式会社 | 電子部品実装体の製造方法 |
| JP2017157626A (ja) * | 2016-02-29 | 2017-09-07 | 三菱マテリアル株式会社 | はんだバンプの形成方法 |
| US12246398B2 (en) * | 2019-12-27 | 2025-03-11 | Resonac Corporation | Solder bump forming member, method for manufacturing solder bump forming member, and method for manufacturing electrode substrate provided with solder bump |
| JP7661891B2 (ja) * | 2019-12-27 | 2025-04-15 | 株式会社レゾナック | はんだバンプ形成用部材、はんだバンプ形成用部材の製造方法、及びはんだバンプ付き電極基板の製造方法 |
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1995
- 1995-01-13 JP JP7003679A patent/JPH07249631A/ja active Pending
- 1995-05-24 TW TW084105223A patent/TW273638B/zh active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105489511A (zh) * | 2015-11-30 | 2016-04-13 | 苏州瑞而美光电科技有限公司 | 标径bga封装金属焊球的制备方法及模具 |
| CN105489511B (zh) * | 2015-11-30 | 2019-01-25 | 苏州瑞而美光电科技有限公司 | 标径bga封装金属焊球的制备方法及模具 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07249631A (ja) | 1995-09-26 |