TW271413B - - Google Patents

Info

Publication number
TW271413B
TW271413B TW083111183A TW83111183A TW271413B TW 271413 B TW271413 B TW 271413B TW 083111183 A TW083111183 A TW 083111183A TW 83111183 A TW83111183 A TW 83111183A TW 271413 B TW271413 B TW 271413B
Authority
TW
Taiwan
Application number
TW083111183A
Other languages
Chinese (zh)
Original Assignee
Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from EP93203059A external-priority patent/EP0651600B1/en
Application filed by Philips Electronics Nv filed Critical Philips Electronics Nv
Application granted granted Critical
Publication of TW271413B publication Critical patent/TW271413B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0266—Size distribution
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0545—Pattern for applying drops or paste; Applying a pattern made of drops or paste

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW083111183A 1993-11-02 1994-12-01 TW271413B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP93203059A EP0651600B1 (en) 1993-11-02 1993-11-02 Solder-coating method, and solder paste suitable for use therein

Publications (1)

Publication Number Publication Date
TW271413B true TW271413B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1996-03-01

Family

ID=8214153

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083111183A TW271413B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-11-02 1994-12-01

Country Status (4)

Country Link
US (1) US6423154B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
KR (1) KR100352202B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE69326009T2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
TW (1) TW271413B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6680457B2 (en) * 2002-01-15 2004-01-20 Agilent Technologies, Inc. Reflowing of solder joints
JP4812429B2 (ja) * 2005-01-31 2011-11-09 三洋電機株式会社 回路装置の製造方法
JP4576270B2 (ja) * 2005-03-29 2010-11-04 昭和電工株式会社 ハンダ回路基板の製造方法
WO2007007865A1 (en) * 2005-07-11 2007-01-18 Showa Denko K.K. Method for attachment of solder powder to electronic circuit board and solder-attached electronic circuit board
WO2007029866A1 (en) * 2005-09-09 2007-03-15 Showa Denko K.K. Method for attachment of solder powder to electronic circuit board and soldered electronic circuit board
EP2219426A1 (de) * 2009-02-02 2010-08-18 Beckhoff Automation GmbH Verfahren zum Herstellen von Kontaktstellen
GB2531760A (en) * 2014-10-29 2016-05-04 Ibm Bridging Arrangement, Microelectronic component and Method for manufacturing A Bridging Arrangement
WO2017142741A1 (en) * 2016-02-19 2017-08-24 Alpha Assembly Solutions Inc. Rf shield with selectively integrated solder

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4872261A (en) * 1987-12-11 1989-10-10 Digital Equipment Corporation Method of and apparatus for surface mounting electronic components onto a printed wiring board
JPH0671134B2 (ja) 1989-05-26 1994-09-07 古河電気工業株式会社 電子部品表面実装方法
CA2030865C (en) * 1989-11-30 1993-01-12 Kenichi Fuse Method of forming a solder layer on pads of a circuit board and method of mounting an electronic part on a circuit board
US5001829A (en) * 1990-01-02 1991-03-26 General Electric Company Method for connecting a leadless chip carrier to a substrate
US5296649A (en) * 1991-03-26 1994-03-22 The Furukawa Electric Co., Ltd. Solder-coated printed circuit board and method of manufacturing the same
US5150832A (en) * 1991-06-28 1992-09-29 At&T Bell Laboratories Solder paste
US5211764A (en) * 1992-11-10 1993-05-18 At&T Bell Laboratories Solder paste and method of using the same
US5346775A (en) * 1993-02-22 1994-09-13 At&T Laboratories Article comprising solder with improved mechanical properties
SG59992A1 (en) * 1993-11-02 1999-02-22 Koninkl Philips Electronics Nv Solder-coating method and solder paste suitable for use therein
US5385290A (en) * 1993-11-24 1995-01-31 At&T Corp. Soldering material and procedure

Also Published As

Publication number Publication date
KR100352202B1 (ko) 2002-12-28
DE69326009T2 (de) 2000-02-24
US6423154B1 (en) 2002-07-23
DE69326009D1 (de) 1999-09-16
KR950016465A (ko) 1995-06-17

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