TW267293B - - Google Patents

Info

Publication number
TW267293B
TW267293B TW083111620A TW83111620A TW267293B TW 267293 B TW267293 B TW 267293B TW 083111620 A TW083111620 A TW 083111620A TW 83111620 A TW83111620 A TW 83111620A TW 267293 B TW267293 B TW 267293B
Authority
TW
Taiwan
Application number
TW083111620A
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Application granted granted Critical
Publication of TW267293B publication Critical patent/TW267293B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/22—Investigating strength properties of solid materials by application of mechanical stress by applying steady torsional forces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/20—Investigating strength properties of solid materials by application of mechanical stress by applying steady bending forces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/02—Details not specific for a particular testing method
    • G01N2203/026—Specifications of the specimen
    • G01N2203/0262—Shape of the specimen
    • G01N2203/0278—Thin specimens
    • G01N2203/0282—Two dimensional, e.g. tapes, webs, sheets, strips, disks or membranes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
TW083111620A 1994-03-09 1994-12-13 TW267293B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/208,774 US5567884A (en) 1994-03-09 1994-03-09 Circuit board assembly torsion tester and method

Publications (1)

Publication Number Publication Date
TW267293B true TW267293B (zh) 1996-01-01

Family

ID=22776003

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083111620A TW267293B (zh) 1994-03-09 1994-12-13

Country Status (5)

Country Link
US (1) US5567884A (zh)
JP (1) JP2859549B2 (zh)
KR (1) KR0147496B1 (zh)
MY (1) MY113344A (zh)
TW (1) TW267293B (zh)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
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US5838568A (en) * 1996-06-28 1998-11-17 International Business Machines Corporation Heated circuit assembly tester and method
EP1717734B1 (en) * 1996-11-08 2009-07-29 Fci Electronic card assembly
WO1998020451A1 (en) * 1996-11-08 1998-05-14 Berg Technology, Inc. Electronic card
US6067860A (en) * 1998-08-17 2000-05-30 Advanced Micro Devices, Inc. Circuit device integrity evaluation arrangement and method
US6127833A (en) * 1999-01-04 2000-10-03 Taiwan Semiconductor Manufacturing Co. Test carrier for attaching a semiconductor device
US6289743B1 (en) 1999-03-31 2001-09-18 Craig Norton Shoe testing apparatus and method of use
KR100442481B1 (ko) * 2002-03-11 2004-07-30 주식회사 포스코 고온 비틀림 시험기의 제어방법
US20030204507A1 (en) * 2002-04-25 2003-10-30 Li Jonathan Qiang Classification of rare events with high reliability
US7231833B2 (en) * 2003-04-01 2007-06-19 Intel Corporation Board deflection metrology using photoelectric amplifiers
US6948377B2 (en) * 2003-12-08 2005-09-27 Honeywell International, Inc. Method and apparatus for detecting the strain levels imposed on a circuit board
JP4507898B2 (ja) * 2005-02-02 2010-07-21 パナソニック株式会社 ねじり試験装置
US7454980B2 (en) * 2006-09-18 2008-11-25 Seagate Technology, Llc Electronic device torsion testing
CN101236230A (zh) * 2007-02-02 2008-08-06 深圳富泰宏精密工业有限公司 检测设备
CN102252015A (zh) * 2010-05-21 2011-11-23 鸿富锦精密工业（深圳）有限公司 枢纽器扭矩调整机
CN102338679A (zh) * 2010-07-27 2012-02-01 鸿富锦精密工业（深圳）有限公司 扭力测试装置
TWI481840B (zh) * 2010-08-04 2015-04-21 Hon Hai Prec Ind Co Ltd 扭力測試裝置
CN102411109A (zh) * 2010-09-21 2012-04-11 鸿富锦精密工业（深圳）有限公司 测试装置
CN102156079B (zh) * 2011-05-16 2012-11-07 南京工程学院 金属线材扭转试验机
CN102854128A (zh) * 2011-06-28 2013-01-02 鸿富锦精密工业（深圳）有限公司 翻转测试机
CN103293402B (zh) * 2012-02-28 2017-06-20 富泰华工业（深圳）有限公司 测试装置
KR101375721B1 (ko) * 2012-03-16 2014-03-19 한국생산기술연구원 스마트 카드용 비틀림 시험방법 및 비틀림 시험용 스마트 카드
KR20160070066A (ko) 2013-09-09 2016-06-17 멜린타 테라퓨틱스, 인크. 항균 화합물, 및 이의 제조 방법 및 이용 방법
AU2014315045A1 (en) 2013-09-09 2016-03-24 Melinta Therapeutics, Inc. Antimicrobial compounds and methods of making and using the same
CN103852251B (zh) * 2014-03-31 2017-01-11 天津博信汽车零部件有限公司 车架的耐久度检测方法及系统
US9772268B2 (en) 2015-03-30 2017-09-26 International Business Machines Corporation Predicting semiconductor package warpage
CN105807212B (zh) * 2016-05-26 2018-03-13 深圳市华星光电技术有限公司 电路板测试装置及电路板测试方法
CN106217254B (zh) * 2016-09-22 2018-08-03 广州万粤知识产权运营有限公司 一种应用于激光模板的抛光夹具
US10571377B2 (en) * 2018-07-10 2020-02-25 Delavan Inc. Torsion testing machine and methods for additive builds
US10578531B2 (en) * 2018-07-10 2020-03-03 Delavan Inc. Torsion testing machine and methods for additive builds
KR102322738B1 (ko) * 2020-04-10 2021-11-05 서울과학기술대학교 산학협력단 플렉서블한 재료를 대상으로 하는 멀티 테스터
CN115389336A (zh) * 2022-10-26 2022-11-25 盐城联翔电子科技有限公司 一种数据线性能检测装置及检测方法
CN117110056B (zh) * 2023-10-25 2023-12-26 深圳市华旭达精密电路科技有限公司 一种线路板强度检测装置
CN117113914B (zh) * 2023-10-25 2024-02-13 中国移动紫金(江苏)创新研究院有限公司 基于数字孪生的电路板可靠性预测方法、系统及存储介质

Family Cites Families (10)

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Publication number Priority date Publication date Assignee Title
US3381526A (en) * 1965-05-10 1968-05-07 Babcock & Wilcox Co Fatigue testing apparatus and method
US3665751A (en) * 1970-08-04 1972-05-30 Nasa Low-cycle fatigue testing machine
CH571715A5 (zh) * 1974-10-31 1976-01-15 Lonza Ag
US4567774A (en) * 1983-04-28 1986-02-04 Battelle Development Corporation Determining mechanical behavior of solid materials using miniature specimens
US4895027A (en) * 1988-01-19 1990-01-23 Battelle Development Corporation Determining plane strain fracture toughness and the J-Integral for solid materials using stress field modified miniature specimens
NZ227650A (en) * 1988-02-10 1990-06-26 Amcor Ltd Method of testing corrugated paperboard by twisting
SU1723679A1 (ru) * 1989-01-25 1992-03-30 Минский радиотехнический институт Способ неразрушающего контрол соединений электрических цепей печатных плат
US5079955A (en) * 1990-06-25 1992-01-14 Eberhardt Allen C Method and apparatus for fatigue crack detection and propagation analysis
US5195384A (en) * 1991-01-28 1993-03-23 Duesler Jr Ira D Environmental stress screening device transfer apparatus
US5184517A (en) * 1991-11-01 1993-02-09 Robert Kelzer Printed circuit board test fixture and method

Also Published As

Publication number Publication date
US5567884A (en) 1996-10-22
KR0147496B1 (ko) 1998-08-17
MY113344A (en) 2002-01-31
JPH07260655A (ja) 1995-10-13
KR950027381A (ko) 1995-10-16
JP2859549B2 (ja) 1999-02-17

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