TW262418B - - Google Patents

Info

Publication number
TW262418B
TW262418B TW082106869A TW82106869A TW262418B TW 262418 B TW262418 B TW 262418B TW 082106869 A TW082106869 A TW 082106869A TW 82106869 A TW82106869 A TW 82106869A TW 262418 B TW262418 B TW 262418B
Authority
TW
Taiwan
Application number
TW082106869A
Original Assignee
Bausch & Lomb
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bausch & Lomb filed Critical Bausch & Lomb
Application granted granted Critical
Publication of TW262418B publication Critical patent/TW262418B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00009—Production of simple or compound lenses
    • B29D11/00432—Auxiliary operations, e.g. machines for filling the moulds
    • B29D11/00461—Adjusting the refractive index, e.g. after implanting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ophthalmology & Optometry (AREA)
  • Laser Beam Processing (AREA)
  • Ceramic Products (AREA)
TW082106869A 1992-09-29 1993-08-25 TW262418B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/952,938 US5257706A (en) 1992-09-29 1992-09-29 Method of cleaning laser ablation debris

Publications (1)

Publication Number Publication Date
TW262418B true TW262418B (zh) 1995-11-11

Family

ID=25493375

Family Applications (1)

Application Number Title Priority Date Filing Date
TW082106869A TW262418B (zh) 1992-09-29 1993-08-25

Country Status (6)

Country Link
US (1) US5257706A (zh)
CN (1) CN1087307A (zh)
AU (1) AU4656893A (zh)
MX (1) MX9305791A (zh)
TW (1) TW262418B (zh)
WO (1) WO1994007638A1 (zh)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5319183A (en) * 1992-02-18 1994-06-07 Fujitsu Limited Method and apparatus for cutting patterns of printed wiring boards and method and apparatus for cleaning printed wiring boards
WO1994007639A1 (en) * 1992-09-29 1994-04-14 Bausch & Lomb Incorporated Symmetric scanning technique for laser ablation
US5359173A (en) * 1992-09-29 1994-10-25 Bausch & Lomb Incorporated Scanning technique for laser ablation
US5378582A (en) * 1992-09-29 1995-01-03 Bausch & Lomb Incorporated Symmetric sweep scanning technique for laser ablation
US5367141A (en) * 1993-03-26 1994-11-22 The United States Of America As Represented By The United States Department Of Energy Photochemical cutting of fabrics
US5637245A (en) * 1995-04-13 1997-06-10 Vernay Laboratories, Inc. Method and apparatus for minimizing degradation of equipment in a laser cleaning technique
JP4180654B2 (ja) 1995-04-26 2008-11-12 スリーエム カンパニー ステップアンドリピート露光の方法および装置
US5780805A (en) * 1995-05-03 1998-07-14 Gerber Garment Technology, Inc. Pattern shifting laser cutter
US5662762A (en) * 1995-07-07 1997-09-02 Clover Industries, Inc. Laser-based system and method for stripping coatings from substrates
DE19752203A1 (de) * 1997-11-25 1999-06-02 Fraunhofer Ges Forschung Verfahren zum Beseitigen von Ablationsrückständen beim Laserstrukturierungsprozeß durch Ablation
JP3303787B2 (ja) * 1998-08-24 2002-07-22 株式会社村田製作所 電極の切除方法
SG84519A1 (en) * 1998-12-07 2001-11-20 Advanced Systems Automation Method and apparatus for removal of mold flash
EP1158339B1 (en) 2000-05-25 2006-11-22 Novartis AG Contact lens with moulded inversion mark
US6693255B2 (en) 2001-03-22 2004-02-17 R. F. Envirotech, Inc. Laser ablation cleaning
US6577448B2 (en) 2001-09-25 2003-06-10 Siemens Dematic Electronic Assembly Systems, Inc. Laser system by modulation of power and energy
US8491353B2 (en) * 2003-09-30 2013-07-23 Panasonic Corporation Mold for optical components
US7531283B2 (en) * 2005-06-20 2009-05-12 Xerox Corporation Laser ablation of welded seam area
US7901075B2 (en) * 2007-12-27 2011-03-08 Johnson & Johnson Vision Care, Inc. Laser enhanced lens
DE102011103793A1 (de) * 2011-03-10 2012-09-27 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Fertigung optischer Elemente durch Bearbeitung mit energetischer Strahlung
JP5892198B2 (ja) * 2014-06-26 2016-03-23 横浜ゴム株式会社 モールドの洗浄システム
JP6457981B2 (ja) * 2016-07-08 2019-01-23 株式会社スギノマシン ノズルのクリーニング方法、およびレーザー加工装置
CN107350227A (zh) * 2017-09-05 2017-11-17 镇江金海创科技有限公司 焦距可调式激光清洗振镜
EP3540090A1 (en) * 2018-03-12 2019-09-18 Solmates B.V. Method for pulsed laser deposition
TWI686256B (zh) * 2018-04-13 2020-03-01 財團法人工業技術研究院 雷射清潔裝置及方法
US20220175449A1 (en) * 2020-12-07 2022-06-09 FA Corporation Aesthetic laser apparatus for performing treatment by irradiating a human skin to be treated by a variable pulsed laser beam

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4307046A (en) * 1979-07-16 1981-12-22 Neefe Charles W Method of laser machining contact lenses
US4417948A (en) * 1982-07-09 1983-11-29 International Business Machines Corporation Self developing, photoetching of polyesters by far UV radiation
US4568632A (en) * 1982-10-07 1986-02-04 International Business Machines Corporation Patterning of polyimide films with far ultraviolet light
US4563565A (en) * 1983-03-02 1986-01-07 Minnesota Mining And Manufacturing Company Method for forming a peripheral edge on contact lenses
US4713518A (en) * 1984-06-08 1987-12-15 Semiconductor Energy Laboratory Co., Ltd. Electronic device manufacturing methods
US4752668A (en) * 1986-04-28 1988-06-21 Rosenfield Michael G System for laser removal of excess material from a semiconductor wafer
DE3809211A1 (de) * 1988-03-18 1989-10-05 Max Planck Gesellschaft Verfahren zur ablation von polymeren kunststoffen mittels ultrakurzer laserstrahlungsimpulse
IE883228L (en) * 1988-10-25 1990-04-25 Provost Fellows Ans Scholars O Laser polishing of lens surface
US5061342A (en) * 1990-05-18 1991-10-29 Bausch & Lomb Incorporated Target domain profiling of target optical surfaces using excimer laser photoablation

Also Published As

Publication number Publication date
CN1087307A (zh) 1994-06-01
AU4656893A (en) 1994-04-26
WO1994007638A1 (en) 1994-04-14
MX9305791A (es) 1994-05-31
US5257706A (en) 1993-11-02

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