TW259898B - - Google Patents
Info
- Publication number
- TW259898B TW259898B TW083112303A TW83112303A TW259898B TW 259898 B TW259898 B TW 259898B TW 083112303 A TW083112303 A TW 083112303A TW 83112303 A TW83112303 A TW 83112303A TW 259898 B TW259898 B TW 259898B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/116,944 US5397921A (en) | 1993-09-03 | 1993-09-03 | Tab grid array |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW259898B true TW259898B (https=) | 1995-10-11 |
Family
ID=51401853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW083112303A TW259898B (https=) | 1993-09-03 | 1994-12-24 |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW259898B (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI771217B (zh) * | 2020-10-29 | 2022-07-11 | 雙鴻科技股份有限公司 | 流體散熱裝置 |
| TWI831420B (zh) * | 2022-10-17 | 2024-02-01 | 鴻海精密工業股份有限公司 | 封裝結構 |
-
1994
- 1994-12-24 TW TW083112303A patent/TW259898B/zh active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI771217B (zh) * | 2020-10-29 | 2022-07-11 | 雙鴻科技股份有限公司 | 流體散熱裝置 |
| TWI831420B (zh) * | 2022-10-17 | 2024-02-01 | 鴻海精密工業股份有限公司 | 封裝結構 |