TW259892B - - Google Patents

Info

Publication number
TW259892B
TW259892B TW083108452A TW83108452A TW259892B TW 259892 B TW259892 B TW 259892B TW 083108452 A TW083108452 A TW 083108452A TW 83108452 A TW83108452 A TW 83108452A TW 259892 B TW259892 B TW 259892B
Authority
TW
Taiwan
Application number
TW083108452A
Other languages
Chinese (zh)
Original Assignee
Yamaha Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP25517893A external-priority patent/JP3348485B2/ja
Priority claimed from JP5255177A external-priority patent/JPH0786449A/ja
Application filed by Yamaha Corp filed Critical Yamaha Corp
Application granted granted Critical
Publication of TW259892B publication Critical patent/TW259892B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
TW083108452A 1993-09-17 1994-09-13 TW259892B (oth)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP25517893A JP3348485B2 (ja) 1993-09-17 1993-09-17 半導体装置と実装基板
JP5255177A JPH0786449A (ja) 1993-09-17 1993-09-17 半導体装置と実装基板

Publications (1)

Publication Number Publication Date
TW259892B true TW259892B (oth) 1995-10-11

Family

ID=26542063

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083108452A TW259892B (oth) 1993-09-17 1994-09-13

Country Status (2)

Country Link
KR (1) KR100200289B1 (oth)
TW (1) TW259892B (oth)

Also Published As

Publication number Publication date
KR100200289B1 (ko) 1999-06-15
KR950010031A (ko) 1995-04-26

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees