TW258676B - - Google Patents

Info

Publication number
TW258676B
TW258676B TW082106181A TW82106181A TW258676B TW 258676 B TW258676 B TW 258676B TW 082106181 A TW082106181 A TW 082106181A TW 82106181 A TW82106181 A TW 82106181A TW 258676 B TW258676 B TW 258676B
Authority
TW
Taiwan
Application number
TW082106181A
Other languages
Chinese (zh)
Original Assignee
Foseco Int
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foseco Int filed Critical Foseco Int
Application granted granted Critical
Publication of TW258676B publication Critical patent/TW258676B/zh

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22DCASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D41/00Casting melt-holding vessels, e.g. ladles, tundishes, cups or the like
    • B22D41/02Linings
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22DCASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D41/00Casting melt-holding vessels, e.g. ladles, tundishes, cups or the like
    • B22D41/02Linings
    • B22D41/023Apparatus used for making or repairing linings

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Furnace Housings, Linings, Walls, And Ceilings (AREA)
  • Casting Support Devices, Ladles, And Melt Control Thereby (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
TW082106181A 1992-07-28 1993-08-03 TW258676B (US06235095-20010522-C00021.png)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB929216079A GB9216079D0 (en) 1992-07-28 1992-07-28 Lining of molten metal handling vessel

Publications (1)

Publication Number Publication Date
TW258676B true TW258676B (US06235095-20010522-C00021.png) 1995-10-01

Family

ID=10719469

Family Applications (1)

Application Number Title Priority Date Filing Date
TW082106181A TW258676B (US06235095-20010522-C00021.png) 1992-07-28 1993-08-03

Country Status (13)

Country Link
US (1) US5360200A (US06235095-20010522-C00021.png)
EP (1) EP0581516B1 (US06235095-20010522-C00021.png)
JP (1) JP3197697B2 (US06235095-20010522-C00021.png)
KR (1) KR100267453B1 (US06235095-20010522-C00021.png)
AU (1) AU660556B2 (US06235095-20010522-C00021.png)
BR (1) BR9303019A (US06235095-20010522-C00021.png)
CA (1) CA2101513C (US06235095-20010522-C00021.png)
DE (1) DE69314406T2 (US06235095-20010522-C00021.png)
ES (1) ES2108229T3 (US06235095-20010522-C00021.png)
FI (1) FI101052B (US06235095-20010522-C00021.png)
GB (1) GB9216079D0 (US06235095-20010522-C00021.png)
MX (1) MX9304527A (US06235095-20010522-C00021.png)
TW (1) TW258676B (US06235095-20010522-C00021.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI750205B (zh) * 2016-08-24 2021-12-21 美商維蘇威美國公司 具有包覆的金屬層的冶金容器內襯及將熔融金屬之氧化縮減到最小的方法

Families Citing this family (30)

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US5484138A (en) * 1993-11-22 1996-01-16 Magneco/Metrel, Inc. Consumable form with adjustable walls
US6143981A (en) 1998-06-24 2000-11-07 Amkor Technology, Inc. Plastic integrated circuit package and method and leadframe for making the package
US6281568B1 (en) 1998-10-21 2001-08-28 Amkor Technology, Inc. Plastic integrated circuit device package and leadframe having partially undercut leads and die pad
US6580159B1 (en) 1999-11-05 2003-06-17 Amkor Technology, Inc. Integrated circuit device packages and substrates for making the packages
US6847103B1 (en) 1999-11-09 2005-01-25 Amkor Technology, Inc. Semiconductor package with exposed die pad and body-locking leadframe
US6476478B1 (en) 1999-11-12 2002-11-05 Amkor Technology, Inc. Cavity semiconductor package with exposed leads and die pad
KR20010081199A (ko) * 2000-02-11 2001-08-29 이영숙 헬멧투시창의 쉴드 회동 및 인출 장치
KR100583494B1 (ko) 2000-03-25 2006-05-24 앰코 테크놀로지 코리아 주식회사 반도체패키지
US7042068B2 (en) 2000-04-27 2006-05-09 Amkor Technology, Inc. Leadframe and semiconductor package made using the leadframe
KR20020058209A (ko) 2000-12-29 2002-07-12 마이클 디. 오브라이언 반도체패키지
KR100731007B1 (ko) 2001-01-15 2007-06-22 앰코 테크놀로지 코리아 주식회사 적층형 반도체 패키지
US6605865B2 (en) 2001-03-19 2003-08-12 Amkor Technology, Inc. Semiconductor package with optimized leadframe bonding strength
KR100393448B1 (ko) 2001-03-27 2003-08-02 앰코 테크놀로지 코리아 주식회사 반도체 패키지 및 그 제조 방법
KR100369393B1 (ko) 2001-03-27 2003-02-05 앰코 테크놀로지 코리아 주식회사 리드프레임 및 이를 이용한 반도체패키지와 그 제조 방법
US6756658B1 (en) 2001-04-06 2004-06-29 Amkor Technology, Inc. Making two lead surface mounting high power microleadframe semiconductor packages
US6611047B2 (en) 2001-10-12 2003-08-26 Amkor Technology, Inc. Semiconductor package with singulation crease
US6798046B1 (en) 2002-01-22 2004-09-28 Amkor Technology, Inc. Semiconductor package including ring structure connected to leads with vertically downset inner ends
US6885086B1 (en) 2002-03-05 2005-04-26 Amkor Technology, Inc. Reduced copper lead frame for saw-singulated chip package
US6608366B1 (en) 2002-04-15 2003-08-19 Harry J. Fogelson Lead frame with plated end leads
US6627977B1 (en) 2002-05-09 2003-09-30 Amkor Technology, Inc. Semiconductor package including isolated ring structure
US6905914B1 (en) 2002-11-08 2005-06-14 Amkor Technology, Inc. Wafer level package and fabrication method
US6847099B1 (en) 2003-02-05 2005-01-25 Amkor Technology Inc. Offset etched corner leads for semiconductor package
US20040159988A1 (en) * 2003-02-11 2004-08-19 Kotyuk Mark D. Adjustable form
US7611666B2 (en) * 2008-02-07 2009-11-03 North American Refractories Company Tundish dry vibratable form
US9691734B1 (en) 2009-12-07 2017-06-27 Amkor Technology, Inc. Method of forming a plurality of electronic component packages
BR112012013775B1 (pt) * 2009-12-10 2020-09-01 Novelis Inc Estrutura de contenção de metal em fusão
US8552548B1 (en) 2011-11-29 2013-10-08 Amkor Technology, Inc. Conductive pad on protruding through electrode semiconductor device
US9704725B1 (en) 2012-03-06 2017-07-11 Amkor Technology, Inc. Semiconductor device with leadframe configured to facilitate reduced burr formation
CA2876518C (en) * 2012-06-14 2017-03-28 Les Produits Industriels De Haute Temperature Pyrotek Inc. Receptacle for handling molten metal, casting assembly and manufacturing method
US9673122B2 (en) 2014-05-02 2017-06-06 Amkor Technology, Inc. Micro lead frame structure having reinforcing portions and method

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US939059A (en) * 1908-08-20 1909-11-02 George C Terry Form of mold for concrete receptacles.
US992652A (en) * 1910-03-09 1911-05-16 John F Glavin Concrete-mold.
US1161356A (en) * 1914-11-02 1915-11-23 Lyman C Stewart Core for molds.
GB1469513A (en) * 1973-07-30 1977-04-06 Foseco Trading Ag Tundishes
US3944193A (en) * 1972-08-26 1976-03-16 Nippon Steel Corporation Method and apparatus for forming by vibration a refractory lining of a container for a molten metal
US3955721A (en) * 1974-09-12 1976-05-11 Bate Micheal Donald Expendable tundish liner
GB1542962A (en) * 1976-04-07 1979-03-28 Foseco Trading Ag Tundishes
GB1540090A (en) * 1976-04-07 1979-02-07 Foseco Trading Ag Tundishes
JPS57184884A (en) * 1981-05-08 1982-11-13 Fuaizaa Kuiguree Kk Protective layer for metallurgical vessel
CA1194894A (en) * 1982-02-09 1985-10-08 Masaru Takashima Core for blow-forming the lining of vessel for molten metal, a lining method using said core, and a lining composition used in said lining method
JPS58221644A (ja) * 1982-06-15 1983-12-23 Tokyo Yogyo Co Ltd タンデイツシユ内張保護材の施工法
US4589633A (en) * 1984-01-26 1986-05-20 Jacques Gilson Process and installation for moulding a refractory lining of a container for liquid metal
FR2657549B1 (fr) * 1990-01-26 1992-04-24 Daussan & Co Procede pour appliquer sur les faces interieures d'un recipient metallurgique un revetement de protection comportant au moins deux couches et revetement de protection ainsi obtenu.
GB9012677D0 (en) * 1990-06-07 1990-08-01 Foseco Int Refractory composition
GB9018205D0 (en) * 1990-08-18 1990-10-03 Foseco Int Lining of metallurgical vessels
DE4041610C1 (en) * 1990-12-22 1992-02-20 Intocast Gmbh Feuerfestprodukte Und Giesshilfsmittel, 4030 Ratingen, De Prodn. of monolithic, refractory coating in metallurgical ladle - by lowering upright ladle into burner appts. having basket-like structure of pipes coated with burning medium and jets along their length
US5110096A (en) * 1991-02-15 1992-05-05 Foseco International Limited One-piece tundish lining
GB2257779B (en) * 1991-07-17 1995-05-17 Foseco Int Lining of metallurical vessels

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI750205B (zh) * 2016-08-24 2021-12-21 美商維蘇威美國公司 具有包覆的金屬層的冶金容器內襯及將熔融金屬之氧化縮減到最小的方法

Also Published As

Publication number Publication date
GB9216079D0 (en) 1992-09-09
CA2101513A1 (en) 1994-01-29
DE69314406T2 (de) 1998-05-07
FI933381A (fi) 1994-01-29
EP0581516B1 (en) 1997-10-08
FI101052B (fi) 1998-04-15
FI933381A0 (fi) 1993-07-28
AU660556B2 (en) 1995-06-29
AU4423393A (en) 1994-02-03
CA2101513C (en) 2000-01-25
JPH07232265A (ja) 1995-09-05
KR100267453B1 (ko) 2000-10-16
KR940001979A (ko) 1994-02-16
DE69314406D1 (de) 1997-11-13
US5360200A (en) 1994-11-01
BR9303019A (pt) 1994-03-15
JP3197697B2 (ja) 2001-08-13
ES2108229T3 (es) 1997-12-16
EP0581516A1 (en) 1994-02-02
MX9304527A (es) 1994-02-28

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees