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Application filed by Chau-Jyh DayfiledCriticalChau-Jyh Day
Priority to TW83110354ApriorityCriticalpatent/TW257882B/en
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Publication of TW257882BpublicationCriticalpatent/TW257882B/en
A chip insulator structure of diode device or component includes: (1) one insulator on which each device or component unit installed with one or a set of multiple chip mounting site; (2) one semiconductor diode chip located in the chip mounting site, that is surrounded by the insulator and keeps a proper distance; (3) one adhesive material for fixing cut lateral side of the semiconductor diode chip in the fiducial hole; It features that the adhesive material can adopt P-N insulating passivation material of the semiconductor diode chip, and do not cover the surface of the semiconductor diode chip that is not opposite to the chip mounting site.
TW83110354A1994-11-091994-11-09Chip and insulator structure of silicon semiconductor diode device and component and process thereof
TW257882B
(en)