TW257882B - Chip and insulator structure of silicon semiconductor diode device and component and process thereof - Google Patents

Chip and insulator structure of silicon semiconductor diode device and component and process thereof

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Publication number
TW257882B
TW257882B TW83110354A TW83110354A TW257882B TW 257882 B TW257882 B TW 257882B TW 83110354 A TW83110354 A TW 83110354A TW 83110354 A TW83110354 A TW 83110354A TW 257882 B TW257882 B TW 257882B
Authority
TW
Taiwan
Prior art keywords
chip
semiconductor diode
component
insulator
insulator structure
Prior art date
Application number
TW83110354A
Other languages
Chinese (zh)
Inventor
Chau-Jyh Day
Original Assignee
Chau-Jyh Day
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chau-Jyh Day filed Critical Chau-Jyh Day
Priority to TW83110354A priority Critical patent/TW257882B/en
Application granted granted Critical
Publication of TW257882B publication Critical patent/TW257882B/en

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Abstract

A chip insulator structure of diode device or component includes: (1) one insulator on which each device or component unit installed with one or a set of multiple chip mounting site; (2) one semiconductor diode chip located in the chip mounting site, that is surrounded by the insulator and keeps a proper distance; (3) one adhesive material for fixing cut lateral side of the semiconductor diode chip in the fiducial hole; It features that the adhesive material can adopt P-N insulating passivation material of the semiconductor diode chip, and do not cover the surface of the semiconductor diode chip that is not opposite to the chip mounting site.
TW83110354A 1994-11-09 1994-11-09 Chip and insulator structure of silicon semiconductor diode device and component and process thereof TW257882B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW83110354A TW257882B (en) 1994-11-09 1994-11-09 Chip and insulator structure of silicon semiconductor diode device and component and process thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW83110354A TW257882B (en) 1994-11-09 1994-11-09 Chip and insulator structure of silicon semiconductor diode device and component and process thereof

Publications (1)

Publication Number Publication Date
TW257882B true TW257882B (en) 1995-09-21

Family

ID=51401745

Family Applications (1)

Application Number Title Priority Date Filing Date
TW83110354A TW257882B (en) 1994-11-09 1994-11-09 Chip and insulator structure of silicon semiconductor diode device and component and process thereof

Country Status (1)

Country Link
TW (1) TW257882B (en)

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees