TW256946B - - Google Patents
Info
- Publication number
- TW256946B TW256946B TW082106493A TW82106493A TW256946B TW 256946 B TW256946 B TW 256946B TW 082106493 A TW082106493 A TW 082106493A TW 82106493 A TW82106493 A TW 82106493A TW 256946 B TW256946 B TW 256946B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/01—Manufacture or treatment
- H10W70/04—Manufacture or treatment of leadframes
- H10W70/045—Cleaning
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/451—Multilayered leadframes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/456—Materials
- H10W70/457—Materials of metallic layers on leadframes
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US4023693A | 1993-03-30 | 1993-03-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW256946B true TW256946B (en:Method) | 1995-09-11 |
Family
ID=21909897
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW082106493A TW256946B (en:Method) | 1993-03-30 | 1993-08-13 |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP0620589A1 (en:Method) |
| JP (1) | JPH06310638A (en:Method) |
| KR (1) | KR940022819A (en:Method) |
| TW (1) | TW256946B (en:Method) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6396947A (ja) * | 1986-10-13 | 1988-04-27 | Mitsubishi Electric Corp | 半導体装置用リ−ドフレ−ム |
| MY104152A (en) * | 1988-08-12 | 1994-02-28 | Mitsui Chemicals Inc | Processes for producing semiconductor devices. |
| US4968397A (en) * | 1989-11-27 | 1990-11-06 | Asher Reginald K | Non-cyanide electrode cleaning process |
| JPH0451531A (ja) * | 1990-06-19 | 1992-02-20 | Mitsubishi Electric Corp | 絶縁封止型半導体装置の製造方法 |
-
1993
- 1993-08-13 TW TW082106493A patent/TW256946B/zh active
-
1994
- 1994-03-23 EP EP94302067A patent/EP0620589A1/en not_active Withdrawn
- 1994-03-29 KR KR1019940006324A patent/KR940022819A/ko not_active Withdrawn
- 1994-03-30 JP JP6059626A patent/JPH06310638A/ja not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| KR940022819A (ko) | 1994-10-21 |
| JPH06310638A (ja) | 1994-11-04 |
| EP0620589A1 (en) | 1994-10-19 |