TW251388B - Process of paste-type LED dice - Google Patents
Process of paste-type LED diceInfo
- Publication number
- TW251388B TW251388B TW81107457A TW81107457A TW251388B TW 251388 B TW251388 B TW 251388B TW 81107457 A TW81107457 A TW 81107457A TW 81107457 A TW81107457 A TW 81107457A TW 251388 B TW251388 B TW 251388B
- Authority
- TW
- Taiwan
- Prior art keywords
- dice
- paste
- type led
- led dice
- adhered
- Prior art date
Links
Landscapes
- Led Devices (AREA)
Abstract
A process of paste-type LED dice features that a epitaxy dice after ohmic contact is adhered to another conductive substrate with proper adhesive material to achieve the effect of inverting electrode to increase illumination or adjusting dice thickness, the adhered die could be cut into dice.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW81107457A TW251388B (en) | 1992-09-22 | 1992-09-22 | Process of paste-type LED dice |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW81107457A TW251388B (en) | 1992-09-22 | 1992-09-22 | Process of paste-type LED dice |
Publications (1)
Publication Number | Publication Date |
---|---|
TW251388B true TW251388B (en) | 1995-07-11 |
Family
ID=51401383
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW81107457A TW251388B (en) | 1992-09-22 | 1992-09-22 | Process of paste-type LED dice |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW251388B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7619259B2 (en) | 2005-12-12 | 2009-11-17 | High Power Optoelectronics, Inc. | Semiconductor device integrated with heat sink and method of fabricating the same |
-
1992
- 1992-09-22 TW TW81107457A patent/TW251388B/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7619259B2 (en) | 2005-12-12 | 2009-11-17 | High Power Optoelectronics, Inc. | Semiconductor device integrated with heat sink and method of fabricating the same |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MC4A | Revocation of granted patent | ||
MK4A | Expiration of patent term of an invention patent |