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Application filed by Generall Instr Of Taiwan LtdfiledCriticalGenerall Instr Of Taiwan Ltd
Priority to TW83107877ApriorityCriticalpatent/TW241437B/en
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Publication of TW241437BpublicationCriticalpatent/TW241437B/en
Electric Connection Of Electric Components To Printed Circuits
(AREA)
Abstract
A soldering method of IC which leads the PCB with rectangle IC to pass the fused wave soldering material in about 7 degree slope by wave soldering technology, includes the following steps: 1. allocating the IC with its diagonal line parallel to the PCB moving direction; 2. putting one dummy chip between the last pin and one solder thief of each IC row, drawing fused solder to the solder thief to make every pin on the tail of each row no short circuit.
TW83107877A1994-08-271994-08-27Solder pad allocation and soldering method for IC
TW241437B
(en)