TW241437B - Solder pad allocation and soldering method for IC - Google Patents

Solder pad allocation and soldering method for IC

Info

Publication number
TW241437B
TW241437B TW83107877A TW83107877A TW241437B TW 241437 B TW241437 B TW 241437B TW 83107877 A TW83107877 A TW 83107877A TW 83107877 A TW83107877 A TW 83107877A TW 241437 B TW241437 B TW 241437B
Authority
TW
Taiwan
Prior art keywords
soldering method
solder
solder pad
row
pcb
Prior art date
Application number
TW83107877A
Other languages
Chinese (zh)
Inventor
Jiun-Uei Yang
Shinn-Yih Chen
Original Assignee
Generall Instr Of Taiwan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Generall Instr Of Taiwan Ltd filed Critical Generall Instr Of Taiwan Ltd
Priority to TW83107877A priority Critical patent/TW241437B/en
Application granted granted Critical
Publication of TW241437B publication Critical patent/TW241437B/en

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

A soldering method of IC which leads the PCB with rectangle IC to pass the fused wave soldering material in about 7 degree slope by wave soldering technology, includes the following steps: 1. allocating the IC with its diagonal line parallel to the PCB moving direction; 2. putting one dummy chip between the last pin and one solder thief of each IC row, drawing fused solder to the solder thief to make every pin on the tail of each row no short circuit.
TW83107877A 1994-08-27 1994-08-27 Solder pad allocation and soldering method for IC TW241437B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW83107877A TW241437B (en) 1994-08-27 1994-08-27 Solder pad allocation and soldering method for IC

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW83107877A TW241437B (en) 1994-08-27 1994-08-27 Solder pad allocation and soldering method for IC

Publications (1)

Publication Number Publication Date
TW241437B true TW241437B (en) 1995-02-21

Family

ID=51400934

Family Applications (1)

Application Number Title Priority Date Filing Date
TW83107877A TW241437B (en) 1994-08-27 1994-08-27 Solder pad allocation and soldering method for IC

Country Status (1)

Country Link
TW (1) TW241437B (en)

Similar Documents

Publication Publication Date Title
GB9326551D0 (en) Integrated circuit chip
JPS53149763A (en) Mounting method of semiconductor integrate circuit
IE830584L (en) Dense mounting of semiconductor chip packages
TW370764B (en) Method for producing an apparatus that includes a print circuit board
SG81960A1 (en) Semiconductor device, substrate for a semiconductor device, method of manufacture thereof, and electronic instrument
WO1997040532A3 (en) Molded flex circuit ball grid array and method of making
GB2177641B (en) Solder preforms
EP0279769A3 (en) Electrical substrate material, multilayer circuit and integrated circuit chip carrier package comprising said material
CA2171458A1 (en) Multi-chip module
IL75237A0 (en) Encapsulated electronic circuit device,and method and apparatus for making same
DE69315451D1 (en) Chip carrier package for printed circuit board, the chip being partially encapsulated, and their production
EP1041633A4 (en) Semiconductor device, method of manufacture thereof, circuit board, and electronic device
EP1034942A4 (en) Semiconductor device and method of manufacturing the same
DE3276624D1 (en) Wavesoldering of chips
EP0179577A3 (en) Method for making a semiconductor device having conductor pins
TW344123B (en) Semiconductor device and process for producing the same
EP0675532A3 (en) Method for forming solder bump in IC mounting board.
EP0393584A3 (en) High frequency semiconductor device
KR940012578A (en) Semiconductor device
EP0119272A4 (en) Method and device for soldering printed board.
JPH03145186A (en) Semiconductor module
JPS5279773A (en) Bonding method of ic
TW241437B (en) Solder pad allocation and soldering method for IC
JPS5661151A (en) Package semiconductor integrated circuit
EP0293970A3 (en) Pad for supporting a chip of an integrated-circuit electronic component