TW237559B - Wafer carrier - Google Patents

Wafer carrier

Info

Publication number
TW237559B
TW237559B TW083104559A TW83104559A TW237559B TW 237559 B TW237559 B TW 237559B TW 083104559 A TW083104559 A TW 083104559A TW 83104559 A TW83104559 A TW 83104559A TW 237559 B TW237559 B TW 237559B
Authority
TW
Taiwan
Prior art keywords
wafer
base
edge
lateral edge
outwardly facing
Prior art date
Application number
TW083104559A
Other languages
English (en)
Inventor
Gordon Stinson Mark
Original Assignee
Memc Electronic Materials
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Memc Electronic Materials filed Critical Memc Electronic Materials
Application granted granted Critical
Publication of TW237559B publication Critical patent/TW237559B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67313—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582—Rigid and flat substrates, e.g. plates or discs
    • C23C16/4587—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Warehouses Or Storage Devices (AREA)
TW083104559A 1993-12-28 1994-05-19 Wafer carrier TW237559B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/174,046 US5417767A (en) 1993-12-28 1993-12-28 Wafer carrier

Publications (1)

Publication Number Publication Date
TW237559B true TW237559B (en) 1995-01-01

Family

ID=22634572

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083104559A TW237559B (en) 1993-12-28 1994-05-19 Wafer carrier

Country Status (4)

Country Link
US (1) US5417767A (zh)
JP (1) JPH07211658A (zh)
DE (1) DE4446972A1 (zh)
TW (1) TW237559B (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD381235S (en) * 1995-02-27 1997-07-22 Peter Bangert Compact disc holder
US5855280A (en) * 1995-12-14 1999-01-05 Lucent Technologies Inc. Cassette light
WO2000000663A1 (en) * 1998-06-30 2000-01-06 Memc Electronic Materials, Inc. Method and device for displacing wafers in a deposition reactor
US6871657B2 (en) * 2001-04-06 2005-03-29 Akrion, Llc Low profile wafer carrier
US20040221810A1 (en) * 2002-06-28 2004-11-11 Miles Ronald O. Process boat and shell for wafer processing
US6814808B1 (en) 2002-10-08 2004-11-09 Sci-Tech Glassblowing, Inc. Carrier for semiconductor wafers
US20040188319A1 (en) * 2003-03-28 2004-09-30 Saint-Gobain Ceramics & Plastics, Inc. Wafer carrier having improved processing characteristics
US7239953B2 (en) * 2004-10-05 2007-07-03 Vision Works, Llc Absolute acceleration sensor for use within moving vehicles
US20070170077A1 (en) * 2006-01-20 2007-07-26 Weir Donald W Iii Disk holder

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS598055B2 (ja) * 1978-10-17 1984-02-22 松下電子工業株式会社 半導体スライスの保持具
US4355974A (en) * 1980-11-24 1982-10-26 Asq Boats, Inc. Wafer boat
CA1158109A (en) * 1981-01-14 1983-12-06 George M. Jenkins Coating of semiconductor wafers and apparatus therefor
US4572101A (en) * 1983-05-13 1986-02-25 Asq Boats, Inc. Side lifting wafer boat assembly
US4694778A (en) * 1984-05-04 1987-09-22 Anicon, Inc. Chemical vapor deposition wafer boat
US4548159A (en) * 1984-07-06 1985-10-22 Anicon, Inc. Chemical vapor deposition wafer boat
US4586743A (en) * 1984-09-24 1986-05-06 Intelledex Incorporated Robotic gripper for disk-shaped objects
US4676008A (en) * 1986-05-16 1987-06-30 Microglass, Inc. Cage-type wafer carrier and method
US5292393A (en) * 1986-12-19 1994-03-08 Applied Materials, Inc. Multichamber integrated process system
JPS6453544A (en) * 1987-08-25 1989-03-01 Mitsubishi Electric Corp Semiconductor manufacturing apparatus
US4981222A (en) * 1988-08-24 1991-01-01 Asq Boats, Inc. Wafer boat
US5054418A (en) * 1989-05-23 1991-10-08 Union Oil Company Of California Cage boat having removable slats

Also Published As

Publication number Publication date
DE4446972A1 (de) 1995-06-29
JPH07211658A (ja) 1995-08-11
US5417767A (en) 1995-05-23

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