TW233290B - - Google Patents
Info
- Publication number
- TW233290B TW233290B TW82100089A TW82100089A TW233290B TW 233290 B TW233290 B TW 233290B TW 82100089 A TW82100089 A TW 82100089A TW 82100089 A TW82100089 A TW 82100089A TW 233290 B TW233290 B TW 233290B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3300751A JPH05136565A (ja) | 1991-11-15 | 1991-11-15 | 厚膜多層セラミツクス基板 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW233290B true TW233290B (uk) | 1994-11-01 |
Family
ID=17888660
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW82100089A TW233290B (uk) | 1991-11-15 | 1993-01-08 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPH05136565A (uk) |
| TW (1) | TW233290B (uk) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI830068B (zh) * | 2020-10-13 | 2024-01-21 | 日商日本電氣硝子股份有限公司 | 半導體元件被覆用玻璃及使用此之半導體被覆用材料 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001358452A (ja) * | 2000-06-15 | 2001-12-26 | Murata Mfg Co Ltd | 電子部品の実装方法 |
| CN109156080B (zh) * | 2016-05-16 | 2021-10-08 | 株式会社村田制作所 | 陶瓷电子部件 |
-
1991
- 1991-11-15 JP JP3300751A patent/JPH05136565A/ja active Pending
-
1993
- 1993-01-08 TW TW82100089A patent/TW233290B/zh active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI830068B (zh) * | 2020-10-13 | 2024-01-21 | 日商日本電氣硝子股份有限公司 | 半導體元件被覆用玻璃及使用此之半導體被覆用材料 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05136565A (ja) | 1993-06-01 |