TW230834B - - Google Patents
Info
- Publication number
- TW230834B TW230834B TW83102101A TW83102101A TW230834B TW 230834 B TW230834 B TW 230834B TW 83102101 A TW83102101 A TW 83102101A TW 83102101 A TW83102101 A TW 83102101A TW 230834 B TW230834 B TW 230834B
- Authority
- TW
- Taiwan
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US1862993A | 1993-02-17 | 1993-02-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW230834B true TW230834B (OSRAM) | 1994-09-21 |
Family
ID=21788942
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW83102101A TW230834B (OSRAM) | 1993-02-17 | 1994-03-11 |
Country Status (2)
| Country | Link |
|---|---|
| TW (1) | TW230834B (OSRAM) |
| WO (1) | WO1994019699A1 (OSRAM) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5578934A (en) * | 1991-06-04 | 1996-11-26 | Micron Technology, Inc. | Method and apparatus for testing unpackaged semiconductor dice |
| JP4000638B2 (ja) * | 1997-09-26 | 2007-10-31 | モレックス インコーポレーテッド | バーンインソケット |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5123850A (en) * | 1990-04-06 | 1992-06-23 | Texas Instruments Incorporated | Non-destructive burn-in test socket for integrated circuit die |
| US5176528A (en) * | 1992-06-11 | 1993-01-05 | Molex Incorporated | Pin and socket electrical connnector assembly |
-
1994
- 1994-02-16 WO PCT/US1994/001653 patent/WO1994019699A1/en not_active Ceased
- 1994-03-11 TW TW83102101A patent/TW230834B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| WO1994019699A1 (en) | 1994-09-01 |