TW224192B - - Google Patents

Info

Publication number
TW224192B
TW224192B TW081103255A TW81103255A TW224192B TW 224192 B TW224192 B TW 224192B TW 081103255 A TW081103255 A TW 081103255A TW 81103255 A TW81103255 A TW 81103255A TW 224192 B TW224192 B TW 224192B
Authority
TW
Taiwan
Application number
TW081103255A
Other languages
Chinese (zh)
Original Assignee
Sgs Thomson Microelectronics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from ITMI911180A external-priority patent/IT1247304B/it
Application filed by Sgs Thomson Microelectronics filed Critical Sgs Thomson Microelectronics
Application granted granted Critical
Publication of TW224192B publication Critical patent/TW224192B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
TW081103255A 1991-04-30 1992-04-25 TW224192B (enrdf_load_stackoverflow)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITMI911180A IT1247304B (it) 1991-04-30 1991-04-30 Complesso circuitale di potenza a struttura modulare ad elevata compattezza e ad alta efficienza di dissipazione termica

Publications (1)

Publication Number Publication Date
TW224192B true TW224192B (enrdf_load_stackoverflow) 1994-05-21

Family

ID=11359807

Family Applications (1)

Application Number Title Priority Date Filing Date
TW081103255A TW224192B (enrdf_load_stackoverflow) 1991-04-30 1992-04-25

Country Status (3)

Country Link
KR (1) KR100284661B1 (enrdf_load_stackoverflow)
DE (1) DE69211053T2 (enrdf_load_stackoverflow)
TW (1) TW224192B (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8491717B2 (en) 2011-12-12 2013-07-23 Verifi Llc Multivariate management of entrained air and rheology in cementitious mixes

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005026233B4 (de) * 2005-06-07 2008-08-07 Tyco Electronics Ec Kft Elektrisches Leistungsmodul

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8491717B2 (en) 2011-12-12 2013-07-23 Verifi Llc Multivariate management of entrained air and rheology in cementitious mixes
US8764273B2 (en) 2011-12-12 2014-07-01 W. R. Grace & Co.-Conn. Multivariate management of entrained air and rheology in cementitious mixes

Also Published As

Publication number Publication date
KR920019885A (ko) 1992-11-20
DE69211053D1 (de) 1996-07-04
DE69211053T2 (de) 1996-10-02
KR100284661B1 (ko) 2001-03-15

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