TW223688B - - Google Patents

Info

Publication number
TW223688B
TW223688B TW81104852A TW81104852A TW223688B TW 223688 B TW223688 B TW 223688B TW 81104852 A TW81104852 A TW 81104852A TW 81104852 A TW81104852 A TW 81104852A TW 223688 B TW223688 B TW 223688B
Authority
TW
Taiwan
Application number
TW81104852A
Other languages
Chinese (zh)
Original Assignee
Fu Chieh Hsu
Wingyu Leung
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fu Chieh Hsu, Wingyu Leung filed Critical Fu Chieh Hsu
Application granted granted Critical
Publication of TW223688B publication Critical patent/TW223688B/zh

Links

TW81104852A 1992-04-08 1992-06-20 TW223688B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US86541092A 1992-04-08 1992-04-08

Publications (1)

Publication Number Publication Date
TW223688B true TW223688B (en) 1994-05-11

Family

ID=25345448

Family Applications (1)

Application Number Title Priority Date Filing Date
TW81104852A TW223688B (en) 1992-04-08 1992-06-20

Country Status (2)

Country Link
JP (1) JP3192220B2 (en)
TW (1) TW223688B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6551844B1 (en) 1997-01-15 2003-04-22 Formfactor, Inc. Test assembly including a test die for testing a semiconductor product die
US6557020B1 (en) 1997-12-10 2003-04-29 Seiko Epson Corporation Information processing system, enciphering/deciphering system, system LSI, and electronic apparatus
JP3816034B2 (en) 2002-07-16 2006-08-30 松下電器産業株式会社 Memory integrated semiconductor integrated circuit
JP4821198B2 (en) 2005-07-12 2011-11-24 ソニー株式会社 Semiconductor integrated circuit and manufacturing method thereof
JP4552803B2 (en) 2005-08-10 2010-09-29 ソニー株式会社 Semiconductor integrated circuit
JP2007101395A (en) 2005-10-05 2007-04-19 Sony Corp Inspection device, inspection method and manufacturing method for circuit device
KR102065288B1 (en) * 2016-01-29 2020-01-10 바렉스 이미징 코포레이션 Row Driver Fault Isolation Circuit for Matrix Type Integrated Circuits
TWI738328B (en) * 2017-09-28 2021-09-01 美商伊路米納有限公司 Fluid dispenser assembly and method for dispensing fluid into a fluid cartridge
CN117153817A (en) * 2022-05-23 2023-12-01 华为技术有限公司 Chip and method for chip interconnection

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6095641A (en) * 1983-10-28 1985-05-29 Nec Corp Dualizing device
JPS63246843A (en) * 1987-04-02 1988-10-13 Toshiba Corp Semiconductor integrated circuit device
JPS6419745A (en) * 1987-07-15 1989-01-23 Hitachi Ltd Wafer scale integrated circuit device
JPH03201551A (en) * 1989-12-28 1991-09-03 Hitachi Ltd Semiconductor integrated circuit device
JP2660090B2 (en) * 1990-08-31 1997-10-08 株式会社東芝 Semiconductor integrated circuit

Also Published As

Publication number Publication date
JP3192220B2 (en) 2001-07-23
JPH06295958A (en) 1994-10-21

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Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent