TW223683B - - Google Patents
Info
- Publication number
- TW223683B TW223683B TW81102294A TW81102294A TW223683B TW 223683 B TW223683 B TW 223683B TW 81102294 A TW81102294 A TW 81102294A TW 81102294 A TW81102294 A TW 81102294A TW 223683 B TW223683 B TW 223683B
- Authority
- TW
- Taiwan
Links
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH93691 | 1991-03-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW223683B true TW223683B (ko) | 1994-05-11 |
Family
ID=4198626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW81102294A TW223683B (ko) | 1991-03-27 | 1992-03-25 |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW223683B (ko) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7517636B2 (en) | 2000-05-29 | 2009-04-14 | Hitachi Chemical Co., Ltd. | Photosensitive resin composition, photosensitive element, production method of resist pattern and production method for printed circuit board |
| TWI454390B (zh) * | 2009-12-31 | 2014-10-01 | Hon Hai Prec Ind Co Ltd | 轉印膜及轉印膜之製造方法 |
| CN113906066A (zh) * | 2019-05-30 | 2022-01-07 | 罗杰斯公司 | 用于立体光刻的可光固化组合物、使用所述组合物的立体光刻方法、通过立体光刻方法形成的聚合物组件、以及包含所述聚合物组件的装置 |
-
1992
- 1992-03-25 TW TW81102294A patent/TW223683B/zh active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7517636B2 (en) | 2000-05-29 | 2009-04-14 | Hitachi Chemical Co., Ltd. | Photosensitive resin composition, photosensitive element, production method of resist pattern and production method for printed circuit board |
| TWI454390B (zh) * | 2009-12-31 | 2014-10-01 | Hon Hai Prec Ind Co Ltd | 轉印膜及轉印膜之製造方法 |
| CN113906066A (zh) * | 2019-05-30 | 2022-01-07 | 罗杰斯公司 | 用于立体光刻的可光固化组合物、使用所述组合物的立体光刻方法、通过立体光刻方法形成的聚合物组件、以及包含所述聚合物组件的装置 |