TW216439B - - Google Patents

Info

Publication number
TW216439B
TW216439B TW81101263A TW81101263A TW216439B TW 216439 B TW216439 B TW 216439B TW 81101263 A TW81101263 A TW 81101263A TW 81101263 A TW81101263 A TW 81101263A TW 216439 B TW216439 B TW 216439B
Authority
TW
Taiwan
Application number
TW81101263A
Original Assignee
Dow Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Chemical Co filed Critical Dow Chemical Co
Application granted granted Critical
Publication of TW216439B publication Critical patent/TW216439B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Reinforced Plastic Materials (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
TW81101263A 1990-08-24 1992-02-20 TW216439B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22127290A JPH04103616A (ja) 1990-08-24 1990-08-24 エポキシ樹脂組成物

Publications (1)

Publication Number Publication Date
TW216439B true TW216439B (zh) 1993-11-21

Family

ID=16764177

Family Applications (1)

Application Number Title Priority Date Filing Date
TW81101263A TW216439B (zh) 1990-08-24 1992-02-20

Country Status (3)

Country Link
EP (1) EP0556429A1 (zh)
JP (1) JPH04103616A (zh)
TW (1) TW216439B (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI506045B (zh) * 2010-04-29 2015-11-01 Dow Global Technologies Llc 聚環戊二烯化合物
EP3354672A1 (en) 2017-01-27 2018-08-01 Nan-Ya Plastics Corporation Preparation and application of dicyclopentadiene-phenol and 2,6-dimethyl phenol copolymer epoxy resin
US10544254B2 (en) 2017-01-24 2020-01-28 Nan Ya Plastics Corporation Preparation and application of dicyclopentadiene-phenol and 2,6-dimethyl phenol copolymer epoxy resin

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0705856A2 (en) * 1994-10-07 1996-04-10 Shell Internationale Researchmaatschappij B.V. Epoxy resin composition for semiconductor encapsulation
JP4491897B2 (ja) * 2000-03-07 2010-06-30 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
EP2168994A1 (en) * 2008-09-25 2010-03-31 Huntsman Advanced Materials (Switzerland) GmbH Photocurable composition
US9725816B2 (en) * 2014-12-30 2017-08-08 Rohm And Haas Electronic Materials Llc Amino sulfonic acid based polymers for copper electroplating
KR101840839B1 (ko) 2017-06-30 2018-03-21 국도화학 주식회사 변성 에폭시 수지 및 그 제조 방법, 변성 에폭시 수지 조성물 및 그 제조 방법, 적층판 및 그 제조 방법

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4394497A (en) * 1982-03-29 1983-07-19 The Dow Chemical Company Solid materials prepared from epoxy resins and phenolic hydroxyl-containing materials
US4710429A (en) * 1985-04-15 1987-12-01 The Dow Chemical Company Laminates from epoxidized phenol-hydrocarbon adducts
US4684701A (en) * 1986-02-14 1987-08-04 The Dow Chemical Company Method for preparing advanced epoxy or phenoxy resins with low aliphatic halide content
US4940740A (en) * 1989-04-21 1990-07-10 Basf Aktiengesellschaft Single phase toughened heat-curable resin systems exhibiting high strength after impact

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI506045B (zh) * 2010-04-29 2015-11-01 Dow Global Technologies Llc 聚環戊二烯化合物
US10544254B2 (en) 2017-01-24 2020-01-28 Nan Ya Plastics Corporation Preparation and application of dicyclopentadiene-phenol and 2,6-dimethyl phenol copolymer epoxy resin
EP3354672A1 (en) 2017-01-27 2018-08-01 Nan-Ya Plastics Corporation Preparation and application of dicyclopentadiene-phenol and 2,6-dimethyl phenol copolymer epoxy resin

Also Published As

Publication number Publication date
JPH04103616A (ja) 1992-04-06
EP0556429A1 (en) 1993-08-25

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