TW202521909A - 蒸氣腔及電子機器 - Google Patents

蒸氣腔及電子機器 Download PDF

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Publication number
TW202521909A
TW202521909A TW114104736A TW114104736A TW202521909A TW 202521909 A TW202521909 A TW 202521909A TW 114104736 A TW114104736 A TW 114104736A TW 114104736 A TW114104736 A TW 114104736A TW 202521909 A TW202521909 A TW 202521909A
Authority
TW
Taiwan
Prior art keywords
sheet
flow path
retracted
steam chamber
capillary structure
Prior art date
Application number
TW114104736A
Other languages
English (en)
Chinese (zh)
Inventor
小田和範
太田貴之
高橋伸一郎
武田利彦
小澤昂平
小井浩司
Original Assignee
日商大日本印刷股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商大日本印刷股份有限公司 filed Critical 日商大日本印刷股份有限公司
Publication of TW202521909A publication Critical patent/TW202521909A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0283—Means for filling or sealing heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Sustainable Development (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Casings For Electric Apparatus (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Telephone Set Structure (AREA)
TW114104736A 2021-02-18 2022-02-18 蒸氣腔及電子機器 TW202521909A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2021024532 2021-02-18
JP2021-024532 2021-02-18
JP2021-024553 2021-02-18
JP2021024553 2021-02-18

Publications (1)

Publication Number Publication Date
TW202521909A true TW202521909A (zh) 2025-06-01

Family

ID=82930704

Family Applications (2)

Application Number Title Priority Date Filing Date
TW111106097A TWI876132B (zh) 2021-02-18 2022-02-18 蒸氣腔用之本體片材、蒸氣腔及電子機器
TW114104736A TW202521909A (zh) 2021-02-18 2022-02-18 蒸氣腔及電子機器

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW111106097A TWI876132B (zh) 2021-02-18 2022-02-18 蒸氣腔用之本體片材、蒸氣腔及電子機器

Country Status (5)

Country Link
US (1) US20240130081A1 (enExample)
JP (2) JP7477039B2 (enExample)
KR (2) KR20250059546A (enExample)
TW (2) TWI876132B (enExample)
WO (1) WO2022176985A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024181291A1 (ja) * 2023-02-28 2024-09-06 京セラ株式会社 放熱部材及びベイパーチャンバー

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10339591A (ja) * 1997-06-10 1998-12-22 Komatsu Ltd ヒートパイプを利用した温度制御装置
JP4823994B2 (ja) 2002-05-08 2011-11-24 古河電気工業株式会社 薄型シート状ヒートパイプ
JP2007266153A (ja) * 2006-03-28 2007-10-11 Sony Corp プレート型熱輸送装置及び電子機器
JP5178274B2 (ja) * 2008-03-26 2013-04-10 日本モレックス株式会社 ヒートパイプ、ヒートパイプの製造方法およびヒートパイプ機能付き回路基板
TWI459889B (zh) * 2008-09-18 2014-11-01 Pegatron Corp 均溫板
JP2010151352A (ja) * 2008-12-24 2010-07-08 Sony Corp 熱輸送デバイスの製造方法及び熱輸送デバイス
US20180156545A1 (en) * 2016-12-05 2018-06-07 Microsoft Technology Licensing, Llc Vapor chamber with three-dimensional printed spanning structure
TW201924512A (zh) * 2017-11-06 2019-06-16 日商大日本印刷股份有限公司 蒸氣腔、電子機器、蒸氣腔用片材以及蒸氣腔用片材及蒸氣腔之製造方法
JP7206649B2 (ja) * 2018-06-29 2023-01-18 大日本印刷株式会社 ベーパーチャンバー、電子機器、及びベーパーチャンバーの製造方法
CN119812143A (zh) * 2019-03-11 2025-04-11 大日本印刷株式会社 蒸发室、电子设备以及蒸发室用片
CN110779370A (zh) * 2019-12-06 2020-02-11 昆山联德电子科技有限公司 薄型均温板

Also Published As

Publication number Publication date
KR102800262B1 (ko) 2025-04-28
TWI876132B (zh) 2025-03-11
US20240130081A1 (en) 2024-04-18
TW202238058A (zh) 2022-10-01
KR20250059546A (ko) 2025-05-02
JP2024096836A (ja) 2024-07-17
JP7477039B2 (ja) 2024-05-01
WO2022176985A1 (ja) 2022-08-25
JPWO2022176985A1 (enExample) 2022-08-25
KR20230146587A (ko) 2023-10-19

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