TW202513543A - 含有胺基之化合物、硬化性樹脂組成物、硬化物及積層體 - Google Patents

含有胺基之化合物、硬化性樹脂組成物、硬化物及積層體 Download PDF

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Publication number
TW202513543A
TW202513543A TW113127813A TW113127813A TW202513543A TW 202513543 A TW202513543 A TW 202513543A TW 113127813 A TW113127813 A TW 113127813A TW 113127813 A TW113127813 A TW 113127813A TW 202513543 A TW202513543 A TW 202513543A
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TW
Taiwan
Prior art keywords
group
compound
resin composition
curable resin
resin
Prior art date
Application number
TW113127813A
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English (en)
Chinese (zh)
Inventor
有田和郎
鈴木悅子
Original Assignee
日商Ｄｉｃ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商Ｄｉｃ股份有限公司 filed Critical 日商Ｄｉｃ股份有限公司
Publication of TW202513543A publication Critical patent/TW202513543A/zh

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    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D209/00—Heterocyclic compounds containing five-membered rings, condensed with other rings, with one nitrogen atom as the only ring hetero atom
    • C07D209/56—Ring systems containing three or more rings
    • C07D209/58—[b]- or [c]-condensed
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
TW113127813A 2023-08-10 2024-07-26 含有胺基之化合物、硬化性樹脂組成物、硬化物及積層體 TW202513543A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023-131563 2023-08-10
JP2023131563 2023-08-10

Publications (1)

Publication Number Publication Date
TW202513543A true TW202513543A (zh) 2025-04-01

Family

ID=94534154

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113127813A TW202513543A (zh) 2023-08-10 2024-07-26 含有胺基之化合物、硬化性樹脂組成物、硬化物及積層體

Country Status (4)

Country Link
JP (1) JP7687541B1 (https=)
CN (1) CN121175289A (https=)
TW (1) TW202513543A (https=)
WO (1) WO2025033158A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013170313A1 (en) * 2012-05-18 2013-11-21 Monash University Epoxy resins
JP2013256557A (ja) 2012-06-11 2013-12-26 Hitachi Ltd 接着剤組成物及び接着構造体の解体方法
JP6575220B2 (ja) 2015-08-18 2019-09-18 富士電機株式会社 半導体装置
JP7681273B2 (ja) * 2021-11-05 2025-05-22 国立大学法人横浜国立大学 エポキシ樹脂の硬化剤、化合物、エポキシ樹脂組成物及びエポキシ樹脂硬化物
JP2023131563A (ja) 2022-03-09 2023-09-22 パナソニックＩｐマネジメント株式会社 検出システム、検出方法、及び、検出プログラム

Also Published As

Publication number Publication date
JP7687541B1 (ja) 2025-06-03
WO2025033158A1 (ja) 2025-02-13
CN121175289A (zh) 2025-12-19
JPWO2025033158A1 (https=) 2025-02-13

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