CN121175289A - 含有胺基的化合物、固化性树脂组合物、固化物及层叠体 - Google Patents

含有胺基的化合物、固化性树脂组合物、固化物及层叠体

Info

Publication number
CN121175289A
CN121175289A CN202480030227.2A CN202480030227A CN121175289A CN 121175289 A CN121175289 A CN 121175289A CN 202480030227 A CN202480030227 A CN 202480030227A CN 121175289 A CN121175289 A CN 121175289A
Authority
CN
China
Prior art keywords
group
compound
resin composition
curable resin
amine group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202480030227.2A
Other languages
English (en)
Chinese (zh)
Inventor
有田和郎
铃木悦子
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DIC Corp
Original Assignee
DIC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DIC Corp filed Critical DIC Corp
Publication of CN121175289A publication Critical patent/CN121175289A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D209/00—Heterocyclic compounds containing five-membered rings, condensed with other rings, with one nitrogen atom as the only ring hetero atom
    • C07D209/56—Ring systems containing three or more rings
    • C07D209/58—[b]- or [c]-condensed
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
CN202480030227.2A 2023-08-10 2024-07-23 含有胺基的化合物、固化性树脂组合物、固化物及层叠体 Pending CN121175289A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023-131563 2023-08-10
JP2023131563 2023-08-10
PCT/JP2024/026255 WO2025033158A1 (ja) 2023-08-10 2024-07-23 アミノ基含有化合物、硬化性樹脂組成物、硬化物及び積層体

Publications (1)

Publication Number Publication Date
CN121175289A true CN121175289A (zh) 2025-12-19

Family

ID=94534154

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202480030227.2A Pending CN121175289A (zh) 2023-08-10 2024-07-23 含有胺基的化合物、固化性树脂组合物、固化物及层叠体

Country Status (4)

Country Link
JP (1) JP7687541B1 (https=)
CN (1) CN121175289A (https=)
TW (1) TW202513543A (https=)
WO (1) WO2025033158A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013170313A1 (en) * 2012-05-18 2013-11-21 Monash University Epoxy resins
JP2013256557A (ja) 2012-06-11 2013-12-26 Hitachi Ltd 接着剤組成物及び接着構造体の解体方法
JP6575220B2 (ja) 2015-08-18 2019-09-18 富士電機株式会社 半導体装置
JP7681273B2 (ja) * 2021-11-05 2025-05-22 国立大学法人横浜国立大学 エポキシ樹脂の硬化剤、化合物、エポキシ樹脂組成物及びエポキシ樹脂硬化物
JP2023131563A (ja) 2022-03-09 2023-09-22 パナソニックＩｐマネジメント株式会社 検出システム、検出方法、及び、検出プログラム

Also Published As

Publication number Publication date
JP7687541B1 (ja) 2025-06-03
WO2025033158A1 (ja) 2025-02-13
TW202513543A (zh) 2025-04-01
JPWO2025033158A1 (https=) 2025-02-13

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