TW202512373A - 晶圓載置台 - Google Patents

晶圓載置台 Download PDF

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Publication number
TW202512373A
TW202512373A TW113115959A TW113115959A TW202512373A TW 202512373 A TW202512373 A TW 202512373A TW 113115959 A TW113115959 A TW 113115959A TW 113115959 A TW113115959 A TW 113115959A TW 202512373 A TW202512373 A TW 202512373A
Authority
TW
Taiwan
Prior art keywords
wafer
heat
cooling plate
flow channel
wafer mounting
Prior art date
Application number
TW113115959A
Other languages
English (en)
Chinese (zh)
Inventor
峯慶太
梶浦陽平
Original Assignee
日商日本碍子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日本碍子股份有限公司 filed Critical 日商日本碍子股份有限公司
Publication of TW202512373A publication Critical patent/TW202512373A/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B23Q11/14—Methods or arrangements for maintaining a constant temperature in parts of machine tools
    • B23Q11/141—Methods or arrangements for maintaining a constant temperature in parts of machine tools using a closed fluid circuit for cooling or heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B23Q11/10—Arrangements for cooling or lubricating tools or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
TW113115959A 2023-09-12 2024-04-29 晶圓載置台 TW202512373A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/JP2023/033249 WO2025057308A1 (ja) 2023-09-12 2023-09-12 ウエハ載置台
WOPCT/JP2023/033249 2023-09-12

Publications (1)

Publication Number Publication Date
TW202512373A true TW202512373A (zh) 2025-03-16

Family

ID=94874066

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113115959A TW202512373A (zh) 2023-09-12 2024-04-29 晶圓載置台

Country Status (5)

Country Link
US (1) US20250083272A1 (https=)
JP (1) JPWO2025057308A1 (https=)
CN (1) CN121844750A (https=)
TW (1) TW202512373A (https=)
WO (1) WO2025057308A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003243490A (ja) * 2002-02-18 2003-08-29 Hitachi High-Technologies Corp ウエハ処理装置とウエハステージ及びウエハ処理方法
JP2003243492A (ja) * 2003-02-19 2003-08-29 Hitachi High-Technologies Corp ウエハ処理装置とウエハステージ及びウエハ処理方法
JP2005079415A (ja) * 2003-09-02 2005-03-24 Hitachi High-Technologies Corp プラズマ処理装置
JP2006261541A (ja) * 2005-03-18 2006-09-28 Tokyo Electron Ltd 基板載置台、基板処理装置および基板処理方法

Also Published As

Publication number Publication date
JPWO2025057308A1 (https=) 2025-03-20
CN121844750A (zh) 2026-04-10
WO2025057308A1 (ja) 2025-03-20
US20250083272A1 (en) 2025-03-13

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