TW202444802A - 嵌段共聚物、嵌段共聚物的製造方法、絕緣材料、耐熱絕緣材料、組成物、絕緣體用組成物、耐熱絕緣體用組成物、印刷基板用組成物、聚醯亞胺、成形體、絕緣體、耐熱絕緣體、及印刷基板 - Google Patents
嵌段共聚物、嵌段共聚物的製造方法、絕緣材料、耐熱絕緣材料、組成物、絕緣體用組成物、耐熱絕緣體用組成物、印刷基板用組成物、聚醯亞胺、成形體、絕緣體、耐熱絕緣體、及印刷基板 Download PDFInfo
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- TW202444802A TW202444802A TW113109495A TW113109495A TW202444802A TW 202444802 A TW202444802 A TW 202444802A TW 113109495 A TW113109495 A TW 113109495A TW 113109495 A TW113109495 A TW 113109495A TW 202444802 A TW202444802 A TW 202444802A
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- Prior art keywords
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- block copolymer
- polyimide
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- formula
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| WOPCT/JP2023/017047 | 2023-05-01 | ||
| PCT/JP2023/017047 WO2024228237A1 (ja) | 2023-05-01 | 2023-05-01 | ブロック共重合体、ブロック共重合体の製造方法、絶縁材料、ポリイミド、及びプリント基板 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW202444802A true TW202444802A (zh) | 2024-11-16 |
Family
ID=93332922
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW113109495A TW202444802A (zh) | 2023-05-01 | 2024-03-14 | 嵌段共聚物、嵌段共聚物的製造方法、絕緣材料、耐熱絕緣材料、組成物、絕緣體用組成物、耐熱絕緣體用組成物、印刷基板用組成物、聚醯亞胺、成形體、絕緣體、耐熱絕緣體、及印刷基板 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2024228304A1 (https=) |
| CN (1) | CN119256041A (https=) |
| TW (1) | TW202444802A (https=) |
| WO (2) | WO2024228237A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025253919A1 (ja) * | 2024-06-07 | 2025-12-11 | 住友化学株式会社 | ポリイミド系樹脂、ポリアミック酸樹脂、ポリアミック酸樹脂組成物及びその硬化膜、並びに半導体パッケージ |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3257325B2 (ja) * | 1995-01-31 | 2002-02-18 | ジェイエスアール株式会社 | ポリイミド系共重合体の製造方法、薄膜形成剤、並びに液晶配向膜の製造方法 |
| JP4514247B2 (ja) * | 1998-11-12 | 2010-07-28 | Jsr株式会社 | 液晶配向剤および液晶表示素子 |
| KR101317020B1 (ko) * | 2009-03-31 | 2013-10-11 | 미쓰이 가가쿠 가부시키가이샤 | 저열팽창성 블록 폴리이미드 및 그의 전구체, 및 그의 용도 |
| US8730437B2 (en) * | 2010-04-14 | 2014-05-20 | Chi Mei Corporation | Method for making a treated polymer for a liquid crystal alignment agent, the treated polymer made thereby, and liquid crystal alignment agent, liquid crystal alignment film and liquid crystal display element containing the treated polymer |
| CN104937454A (zh) * | 2013-01-15 | 2015-09-23 | 旭硝子株式会社 | 光学补偿层叠膜、电极基板、液晶显示装置用基板及液晶显示装置 |
-
2023
- 2023-05-01 WO PCT/JP2023/017047 patent/WO2024228237A1/ja not_active Ceased
-
2024
- 2024-03-14 TW TW113109495A patent/TW202444802A/zh unknown
- 2024-03-14 WO PCT/JP2024/009987 patent/WO2024228304A1/ja not_active Ceased
- 2024-03-14 JP JP2025518107A patent/JPWO2024228304A1/ja active Pending
- 2024-03-14 CN CN202480002384.2A patent/CN119256041A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN119256041A (zh) | 2025-01-03 |
| WO2024228304A1 (ja) | 2024-11-07 |
| JPWO2024228304A1 (https=) | 2024-11-07 |
| WO2024228237A1 (ja) | 2024-11-07 |
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