TW202436556A - 黏著片材 - Google Patents

黏著片材 Download PDF

Info

Publication number
TW202436556A
TW202436556A TW112144530A TW112144530A TW202436556A TW 202436556 A TW202436556 A TW 202436556A TW 112144530 A TW112144530 A TW 112144530A TW 112144530 A TW112144530 A TW 112144530A TW 202436556 A TW202436556 A TW 202436556A
Authority
TW
Taiwan
Prior art keywords
adhesive layer
less
carbon
adhesive
weight
Prior art date
Application number
TW112144530A
Other languages
English (en)
Chinese (zh)
Inventor
熊倉健太
本田哲士
永井田雅
Original Assignee
日商日東電工股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日東電工股份有限公司 filed Critical 日商日東電工股份有限公司
Publication of TW202436556A publication Critical patent/TW202436556A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F265/00—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
    • C08F265/04—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00 on to polymers of esters
    • C08F265/06—Polymerisation of acrylate or methacrylate esters on to polymers thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
TW112144530A 2022-11-18 2023-11-17 黏著片材 TW202436556A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-185189 2022-11-18
JP2022185189 2022-11-18

Publications (1)

Publication Number Publication Date
TW202436556A true TW202436556A (zh) 2024-09-16

Family

ID=91084389

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112144530A TW202436556A (zh) 2022-11-18 2023-11-17 黏著片材

Country Status (5)

Country Link
JP (1) JPWO2024106388A1 (enrdf_load_stackoverflow)
KR (1) KR20250099398A (enrdf_load_stackoverflow)
CN (1) CN120202265A (enrdf_load_stackoverflow)
TW (1) TW202436556A (enrdf_load_stackoverflow)
WO (1) WO2024106388A1 (enrdf_load_stackoverflow)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW221061B (enrdf_load_stackoverflow) * 1991-12-31 1994-02-11 Minnesota Mining & Mfg
JPH07193032A (ja) * 1993-12-27 1995-07-28 Mitsui Toatsu Chem Inc 半導体ウエハ裏面研削用フィルムの製造方法
JPH1017827A (ja) * 1996-07-04 1998-01-20 Sekisui Chem Co Ltd 加圧接着型両面粘着シート
JP4066394B2 (ja) * 1998-04-10 2008-03-26 日本合成化学工業株式会社 再剥離型粘着剤
JP5201768B2 (ja) * 1999-06-14 2013-06-05 日東電工株式会社 再剥離型粘着剤及び再剥離型粘着シート
JP2001240842A (ja) * 2000-02-28 2001-09-04 Nitto Denko Corp 紫外線硬化型粘着剤組成物とその粘着シ―ト類
JP2003183596A (ja) * 2001-12-25 2003-07-03 Nitto Denko Corp 粘着テープの製造方法および粘着テープ
JP6261115B2 (ja) 2013-09-19 2018-01-17 日東電工株式会社 粘着シート
CN111909622B (zh) * 2017-08-08 2022-04-29 三菱化学株式会社 光固化性粘合片
JP6927114B2 (ja) * 2018-03-27 2021-08-25 三菱ケミカル株式会社 粘着剤組成物および粘着シート

Also Published As

Publication number Publication date
WO2024106388A1 (ja) 2024-05-23
KR20250099398A (ko) 2025-07-01
JPWO2024106388A1 (enrdf_load_stackoverflow) 2024-05-23
CN120202265A (zh) 2025-06-24

Similar Documents

Publication Publication Date Title
CN113412317B (zh) 粘合片
EP2676991B1 (en) Substrate film and method for manufacturing same
JP4458515B2 (ja) アクリル系粘着剤組成物およびアクリル系粘着シート
KR102589157B1 (ko) 점착 시트
TW202436556A (zh) 黏著片材
TW202436557A (zh) 黏著片材
TW202436555A (zh) 黏著片材
TW202432756A (zh) 黏著片材
TW202432757A (zh) 黏著片材
TW202428816A (zh) 黏著片材
TW202428810A (zh) 黏著片材製造方法
KR101750589B1 (ko) 광중합에 의한 용제형 점착제 조성물
TW202510025A (zh) 構件之分離方法及黏著片材
TW202432760A (zh) 黏著片材
TW202528499A (zh) 聚合方法及黏著劑之硬化方法
TW202438621A (zh) 黏著片材
TW202411378A (zh) 黏著片材及黏著片材之剝離方法
CN119487143A (zh) 粘合片材及粘合片材的剥离方法