TW202426258A - 樹脂組成物、預浸體、積層板、印刷線路板及半導體封裝體 - Google Patents

樹脂組成物、預浸體、積層板、印刷線路板及半導體封裝體 Download PDF

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Publication number
TW202426258A
TW202426258A TW112138890A TW112138890A TW202426258A TW 202426258 A TW202426258 A TW 202426258A TW 112138890 A TW112138890 A TW 112138890A TW 112138890 A TW112138890 A TW 112138890A TW 202426258 A TW202426258 A TW 202426258A
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TW
Taiwan
Prior art keywords
group
resin composition
carbon atoms
resin
component
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TW112138890A
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English (en)
Chinese (zh)
Inventor
松岡志織
中村幸雄
柳田真
上野史貴
Original Assignee
日商力森諾科股份有限公司
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Application filed by 日商力森諾科股份有限公司 filed Critical 日商力森諾科股份有限公司
Publication of TW202426258A publication Critical patent/TW202426258A/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
    • C08K5/523—Esters of phosphoric acids, e.g. of H3PO4 with hydroxyaryl compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Reinforced Plastic Materials (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
TW112138890A 2022-10-19 2023-10-12 樹脂組成物、預浸體、積層板、印刷線路板及半導體封裝體 TW202426258A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-167373 2022-10-19
JP2022167373 2022-10-19

Publications (1)

Publication Number Publication Date
TW202426258A true TW202426258A (zh) 2024-07-01

Family

ID=90737441

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112138890A TW202426258A (zh) 2022-10-19 2023-10-12 樹脂組成物、預浸體、積層板、印刷線路板及半導體封裝體

Country Status (5)

Country Link
JP (1) JPWO2024085028A1 (https=)
KR (1) KR20250085752A (https=)
CN (1) CN119095891A (https=)
TW (1) TW202426258A (https=)
WO (1) WO2024085028A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7537146B2 (ja) 2020-07-03 2024-08-21 味の素株式会社 樹脂組成物
WO2022102782A1 (ja) * 2020-11-16 2022-05-19 昭和電工マテリアルズ株式会社 マレイミド樹脂組成物、プリプレグ、積層板、樹脂フィルム、プリント配線板及び半導体パッケージ
KR20230108275A (ko) * 2020-11-16 2023-07-18 가부시끼가이샤 레조낙 말레이미드 수지 조성물, 프리프레그, 적층판, 수지 필름, 프린트 배선판 및 반도체 패키지
JPWO2022131151A1 (https=) * 2020-12-14 2022-06-23
CN116333481A (zh) * 2021-12-22 2023-06-27 广东生益科技股份有限公司 一种树脂组合物、包含其的预浸料以及覆铜板和印制电路板
CN119013353A (zh) * 2022-03-31 2024-11-22 三菱瓦斯化学株式会社 树脂组合物、预浸料、树脂片、层叠板、覆金属箔层叠板、及印刷电路板
JP2023170864A (ja) * 2022-05-20 2023-12-01 株式会社レゾナック 樹脂組成物、プリプレグ、積層板、樹脂フィルム、プリント配線板、アンテナ装置及びアンテナモジュール

Also Published As

Publication number Publication date
WO2024085028A1 (ja) 2024-04-25
JPWO2024085028A1 (https=) 2024-04-25
CN119095891A (zh) 2024-12-06
KR20250085752A (ko) 2025-06-12

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