TW202420530A - 具備浸泡與清洗蝕刻功能的單晶圓旋轉清洗設備 - Google Patents

具備浸泡與清洗蝕刻功能的單晶圓旋轉清洗設備 Download PDF

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TW202420530A
TW202420530A TW111141469A TW111141469A TW202420530A TW 202420530 A TW202420530 A TW 202420530A TW 111141469 A TW111141469 A TW 111141469A TW 111141469 A TW111141469 A TW 111141469A TW 202420530 A TW202420530 A TW 202420530A
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wafer
turntable
cleaning device
receiving plate
rotation cleaning
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TW111141469A
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黃立佐
張修凱
吳進原
許明哲
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弘塑科技股份有限公司
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Priority to TW111141469A priority Critical patent/TW202420530A/zh
Priority to US18/104,976 priority patent/US20240145292A1/en
Publication of TW202420530A publication Critical patent/TW202420530A/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/022—Cleaning travelling work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

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  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Cleaning Or Drying Semiconductors (AREA)
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Abstract

本發明具浸泡與清洗蝕刻功能的單晶圓旋轉清洗設備包括一旋轉驅動裝置、一晶圓轉盤、以及一晶圓承接盤。該晶圓轉盤受旋轉驅動裝置而旋轉。該晶圓承接盤呈環狀而圍繞該晶圓轉盤，可相對該晶圓轉盤上下作動到晶圓承接位置或晶圓脫離位置，且包括一浸泡槽。該晶圓承接盤可在該晶圓承接位置時承托一晶圓以利該晶圓浸泡在注入浸泡槽的藥液中進行高效的清洗或蝕刻製程。

Description

具備浸泡與清洗蝕刻功能的單晶圓旋轉清洗設備
本發明關於一種單晶圓清洗裝置，尤指一種具備浸泡與清洗蝕刻功能的晶圓旋轉清洗裝置。
現有的清洗製程需要晶圓表面有充分浸泡於清洗用的化學藥液中的時間，才能產生有效的化學清洗反應。一般的半導體單晶圓旋轉清洗製程設備，無法在晶圓轉盤上進行浸泡處理，因此晶圓必需先於專用的浸泡槽體(Soaking Tank)執行浸泡清洗製程，讓藥液與晶圓能產生充分化學反應，以進行初步清洗製程。接著，初步清洗後的晶圓經由機械手臂(Transfer Robot)傳送到單晶圓旋轉清洗腔體，再進行晶圓旋轉清洗與旋乾等後續製程。
上述多個清洗步驟須將晶圓分別置於不同設備處方能完成，這使得整體清洗製程趨於複雜，進而增加製程時間與生產成本。
因此，在當今晶圓清洗製程領域上，迫切需要能連續完成上述複雜清洗步驟，並且將多道清洗步驟整合在單一晶圓清洗裝置上進行，以提高製程效率與降低生產成本。
本發明主要目的在於提供一種具備浸泡與清洗蝕刻功能的晶圓旋轉清洗裝置，其在晶圓轉盤外圍設置一環繞該晶圓轉盤的晶圓承接盤，該晶圓承接盤可相對該晶圓轉盤升降，並在晶圓承接盤上升位置時讓晶圓位於該晶圓承接盤內的浸泡槽，以達到晶圓充分浸泡於藥液中之目的。
為達上述目的，本發明提供一種具浸泡與清洗蝕刻功能的晶圓旋轉清洗裝置，包括：
一旋轉驅動裝置；
一晶圓轉盤，連接在該旋轉驅動裝置上，經由該旋轉驅動裝置的驅動而旋轉，且用於固定一放置於該晶圓轉盤上表面的晶圓；以及
一晶圓承接盤，呈環狀而環繞設置於該晶圓轉盤外側，且用於相對該晶圓轉盤上升到一晶圓承接位置或相對該晶圓轉盤下降到一晶圓脫離位置，該晶圓承接盤具有一底盤部以及一自該底盤部的外緣突伸出的外環牆部，在該底盤部與該外環牆部之間形成一浸泡槽，以用於容納該晶圓，在該晶圓承接盤上貫穿形成有一與該浸泡槽相連通的容置孔以用於供該晶圓轉盤進出該容置孔；
其中，當該晶圓承接盤上升到該晶圓承接位置時，該底盤部的晶圓接觸頂面對齊該晶圓轉盤的該上表面；當該晶圓承接盤下降到該晶圓脫離位置時，該底盤部的該晶圓接觸頂面低於該晶圓轉盤的該上表面。
在本發明一較佳實施例中，該晶圓承接盤的該底盤部的該晶圓接觸頂面形成有一集液槽，且該集液槽位於該浸泡槽下方且與該浸泡槽相連通。
在本發明一較佳實施例中，該集液槽為環形，且在該底盤部上形成有一介於該集液槽與該容置孔之間的內環牆部。
在本發明一較佳實施例中，該內環牆部的頂端與該晶圓接觸頂面齊平。
在本發明一較佳實施例中，該集液槽與該外環牆部之間相隔一間距。
在本發明一較佳實施例中，該底盤部貫穿形成有至少一與該集液槽相連通的排液孔。
在本發明一較佳實施例中，在該底盤部的底面上突伸形成有對應各該排液孔的排放管。
在本發明一較佳實施例中，該底盤部的該晶圓接觸頂面為平坦面。
在本發明一較佳實施例中，該旋轉驅動裝置上設置一真空幫浦連接埠，且該晶圓轉盤上貫穿形成一與該真空幫浦連接埠相連通的真空吸孔，且該真空吸孔用於固定該晶圓於該晶圓轉盤上。
在本發明一較佳實施例中，在該晶圓承接盤的該外環牆部上設置有至少一突伸入該浸泡槽內的液體噴嘴。
在本發明一較佳實施例中，該晶圓承接盤連接一升降驅動機構，且該升降驅動機構用於驅動該晶圓承接盤，相對該晶圓轉盤進行上升或下降。
在本發明一較佳實施例中，該晶圓轉盤連接一升降驅動機構，且該升降驅動機構用於驅動該晶圓轉盤，相對該晶圓承接盤進行上升或下降。
在本發明一較佳實施例中，該升降驅動機構固定在該旋轉驅動裝置上。
在本發明一較佳實施例中，該升降驅動機構為氣壓缸、液壓缸、電磁閥、以及馬達的其中一種。
在本發明一較佳實施例中，該旋轉驅動裝置包括一馬達，該馬達以一轉軸連接該晶圓轉盤以用於驅動該晶圓轉盤進行旋轉。
本發明具浸泡與清洗蝕刻功能的晶圓旋轉清洗裝置至少具有下列優點：
1、本發明具浸泡與清洗蝕刻功能的晶圓旋轉清洗裝置，在晶圓轉盤外圍設置一環繞該晶圓轉盤的晶圓承接盤，該晶圓承接盤呈環形而能容納晶圓轉盤，該晶圓承接盤外緣為高起之外環牆部，當該晶圓承接盤上升到該晶圓承接位置而與該晶圓轉盤具相同高度時，該晶圓承接盤恰可緊密支撐與包圍晶圓側面與底部，並使晶圓封閉該晶圓承接盤中央的容置孔，使得噴灑在晶圓上方的藥液能在該浸泡槽中維持穩定液位而不會從該容置孔洩漏流失，進而使藥液在浸泡槽中發揮對晶圓進行充分浸泡效果。
2、當上述浸泡步驟完成後，該晶圓承接盤可下降到該晶圓脫離位置，以使晶圓相對該晶圓承接盤升起，進而使藥液流入該晶圓承接盤的集液槽，並進一步自排液孔排出。或者，該容置孔也可設計為具有引流、排液的效果。當該晶圓承接盤下降到該晶圓脫離位置後，該旋轉驅動裝置可驅動該晶圓轉盤連同被真空吸力固定在該晶圓轉盤上的晶圓進行後續清洗與旋乾步驟，以達到對晶圓的旋轉清洗與乾燥效果。
3、根據晶圓製程的需要，由晶圓上方製程噴嘴( Process Nozzle)注入到該浸泡槽內到晶圓上的藥液可以是清洗液或蝕刻液，也可以是去離子水（Deionized Water，DI水）。若該藥液為蝕刻液，則位於該晶圓承接位置的該晶圓承接盤能夠維持蝕刻液的液位而使蝕刻液充分發揮清洗蝕刻效果。待清洗蝕刻步驟完成後，該晶圓承接盤再下降至該晶圓脫離位置以便使蝕刻液能夠自該晶圓承接盤處排出。
4、由上述三點可知，本發明的晶圓旋轉清洗裝置可在相同晶圓轉盤上執行單晶圓浸泡、旋轉清洗、蝕刻與旋乾等連續製程，因此本發明可有效避免上述多個連續製程之間須仰賴機械手臂不斷移動晶圓到相應的獨立裝置上進行對應製程步驟的問題，進而達到簡化晶圓清洗或蝕刻製程，避免製程間繁複移動晶圓而對晶圓造成損傷的缺點，並進而提升晶圓製程的效率與產率。
請參照圖1至圖3，本發明具備浸泡與清洗蝕刻功能的晶圓旋轉清洗裝置1包括：一旋轉驅動裝置10、一晶圓轉盤20、以及一晶圓承接盤30。
該晶圓轉盤20連接在該旋轉驅動裝置10上，經由該旋轉驅動裝置10的驅動而旋轉，且用於固定一放置於該晶圓轉盤20上表面21的晶圓40。
該晶圓承接盤30呈環狀而環繞設置於該晶圓轉盤20外側，且用於相對該晶圓轉盤20上升到一晶圓40承接位置或相對該晶圓轉盤20下降到一晶圓脫離位置，該晶圓承接盤30具有一底盤部31以及一自該底盤部31的外緣突伸出的外環牆部32。在該底盤部31與該外環牆部32之間形成一浸泡槽305，用於容納該晶圓40，且該浸泡槽305能夠通過一位於該晶圓轉盤20上方的製程噴嘴80注入藥液50或是純水，以便使藥液50塗佈於該晶圓40上而進行清潔或蝕刻等製程。在該晶圓承接盤30上貫穿形成有一與該浸泡槽305相連通的容置孔300以用於供該晶圓轉盤20進出該容置孔300。此外，上述注入到浸泡槽305的藥液50可為清潔藥液50或是蝕刻藥液50，視晶圓製程的需要而變化。此外，上述製程噴嘴80通常為主要的藥液50或純水噴灑裝置，可連接一藥液或純水儲存容器，並用於在對晶圓40進行浸泡及旋轉清洗的步驟中進行藥液50或純水的噴灑。
其中，當該晶圓承接盤30上升到該晶圓40承接位置時，該底盤部31的晶圓接觸頂面311對齊該晶圓轉盤20的該上表面21；當該晶圓承接盤30下降到該晶圓脫離位置時，該底盤部31的該晶圓接觸頂面311低於該晶圓轉盤20的該上表面21。
詳細而言，該晶圓40承接位置高於該晶圓脫離位置。當該晶圓承接盤30在該晶圓40承接位置時，該底盤部31能夠緊密接觸該晶圓40的底部，以在該底盤部31與該晶圓40底部之間形成近似或完全氣密或水密狀態，藉此避免藥液50自該晶圓40底部下方洩漏到該晶圓承接盤30之外。當該晶圓承接盤30位於較低的該晶圓脫離位置時，該底盤部31與該晶圓40底部之間分離而解除氣密或水密狀態，此時藥液50能夠流淌入該晶圓40底部下方，進而被該晶圓承接盤30該處的孔隙排放出。
請進一步參照圖 3, 4在本發明一較佳實施例中，該晶圓承接盤30的該底盤部31的該晶圓接觸頂面311形成有一集液槽33，且該集液槽33位於該浸泡槽305下方且與該浸泡槽305相連通。在本發明一較佳實施例中，該集液槽33為環形，且在該底盤部31上形成有一介於該集液槽33與該容置孔300之間的內環牆部34，以避免藥液50或水從該集液槽33處滲漏到該容置孔300中。由於該容置孔300下方對應該旋轉驅動裝置10，此處未必會有用於集水的設備，因此該內環牆部34能夠有效避免藥液50或水意外從該容置孔300滲漏。此外，該集液槽33也可以是複數個而環繞排列在該容置孔300外圍。該集液槽33主要用來蒐集施加在該晶圓40上的藥液50或水，以便進一步從該晶圓40乘接盤排放及回收藥液50或水。
在本發明一較佳實施例中，該內環牆部34的頂端與該晶圓接觸頂面311齊平。
在本發明一較佳實施例中，該集液槽33與該外環牆部32之間相隔一間距D，如圖4所示。通過該間距D，可使該底盤部31的該晶圓接觸頂面311具有充分面積來接觸該晶圓40。
在本發明一較佳實施例中，該底盤部31貫穿形成有至少一與該集液槽33相連通的排液孔35，以用於排放該集液槽33內的藥液50或水。
在本發明一較佳實施例中，在該底盤部31的底面上突伸形成有對應各該排液孔35的排放管36。該排放管36可進一步連接外部管線，以用於排放該集液槽33內的藥液50或水到外部的藥液50回收設備。
在本發明一較佳實施例中，該底盤部31的該晶圓接觸頂面311為平坦面。該平坦面能夠良好地以大面積接觸該晶圓40底部，形成近似氣密或水密的狀態，避免藥液50或水在還沒完全與該晶圓40表面充分作用達到清洗或蝕刻等用途的狀況下就流入該晶圓40下方的該集液槽33內，藉此提升晶圓製程的效率。
在本發明一較佳實施例中，該旋轉驅動裝置10上設置一真空幫浦連接埠13，且該晶圓轉盤上貫穿形成一與該真空幫浦連接埠13相連通的真空吸孔200，且該真空吸孔200用於固定該晶圓於該晶圓轉盤20上。
在本發明一較佳實施例中，在該晶圓承接盤30的該外環牆部32上設置有至少一突伸入該浸泡槽305內的液體噴嘴37。該液體噴嘴37用於連接一盛裝有純水的外部注液裝置以向浸泡槽305內噴灑純水而進行清洗晶圓承接盤30。此外，該液體噴嘴37與該製程噴嘴80互為獨立的裝置，可視晶圓清洗蝕刻製程的需要而通過該液體噴嘴37及該製程噴嘴80的其一噴灑藥液50或純水，或者，兩者也分別在不同清洗步驟中噴灑不同種類的藥液50或純水。
請參照圖7，在本發明一較佳實施例中，該晶圓承接盤30連接一升降驅動機構60，且該升降驅動機構60用於驅動該晶圓承接盤30相對該晶圓轉盤20進行上升或下降。
請參照圖8，在本發明另一較佳實施例中，該晶圓轉盤20連接一升降驅動機構60，且該升降驅動機構60用於驅動該晶圓轉盤20相對該晶圓承接盤30進行上升或下降。此時，該晶圓轉盤20通過滑動件（氣壓缸、伸縮管等）等機構而能相對旋轉驅動裝置10上下滑動，例如通過滑動套筒套設在該旋轉驅動裝置10的轉軸上下滑動。此時，該晶圓承接盤30通過其他固定件固定到該驅動旋轉裝置或是地面上而不上下作動。
在本發明一較佳實施例中，該升降驅動機構60通過一支架12固定在該旋轉驅動裝置10上，如圖8所示。此外，在本發明一較佳實施例中，該升降驅動機構60為氣壓缸、液壓缸、電磁閥、以及馬達的其中一種。
在本發明一較佳實施例中，該旋轉驅動裝置10包括一馬達11，該馬達11 以一轉軸111連接該晶圓轉盤20以用於驅動該晶圓轉盤20進行旋轉。該馬達11可為變速馬達11以便根據所採用的晶圓40、藥液50、製程的種類不同而調整轉速，讓該晶圓轉盤20能夠以適當的速度進行旋轉並達到高效的藥液50塗布或旋乾效果。
本發明具備浸泡與清洗蝕刻功能的單晶圓旋轉清洗設備1至少具有下列優點：
1、本發明具備浸泡與清洗蝕刻功能的單晶圓旋轉清洗設備1，在晶圓轉盤20外圍設置一環繞該晶圓轉盤20的晶圓承接盤30，該晶圓承接盤30呈環形而能容納晶圓轉盤20，該晶圓承接盤30外緣為高起之外環牆部32，當該晶圓承接盤30上升到該晶圓40承接位置而與該晶圓轉盤20具相同高度時，該晶圓承接盤30恰可緊密支撐與包圍晶圓40側面與底部並使晶圓40封閉該晶圓承接盤30中央的容置孔300，使得噴灑在晶圓40上方的藥液50能在該浸泡槽305中維持穩定液位而不會從該容置孔300洩漏流失，進而使藥液50在浸泡槽305中發揮對晶圓40進行充分浸泡效果。
2、當上述浸泡步驟完成後，該晶圓承接盤30可下降到該晶圓脫離位置，以使晶圓40相對該晶圓承接盤30升起，進而使藥液50流入該晶圓承接盤30的集液槽33，並進一步自排液孔35排出。或者，該容置孔300也可設計為具有引流、排液的效果。當該晶圓承接盤30下降到該晶圓脫離位置後，該旋轉驅動裝置10可驅動該晶圓轉盤20連同被真空吸力固定在該晶圓轉盤20上的晶圓40進行後續清洗與旋乾步驟，以達到對晶圓40的旋轉清洗與乾燥效果。
3、根據晶圓製程的需要，由晶圓40上方製程噴嘴80注入到該浸泡槽305內到晶圓40上的藥液50可以是清洗液或蝕刻液，也可以是去離子水（Deionized Water，DI水）。若該藥液50為蝕刻液，則位於該晶圓40承接位置的該晶圓承接盤30能夠維持蝕刻液的液位而使蝕刻液充分發揮清洗蝕刻效果。待清洗蝕刻步驟完成後，該晶圓承接盤30再下降至該晶圓脫離位置以便使蝕刻液能夠自該晶圓承接盤30處排出。
1:晶圓旋轉清洗裝置 10:旋轉驅動裝置 11:馬達 111:轉軸 12:支架 13:真空幫浦連接埠 20:晶圓轉盤 200:真空吸孔 21:上表面 30:晶圓承接盤 300:容置孔 305:浸泡槽 31:底盤部 311:晶圓接觸頂面 32:外環牆部 33:集液槽 34:內環牆部 35:排液孔 36:排放管 37:液體噴嘴 40:晶圓 50:藥液 60:升降驅動機構 80:製程噴嘴 D:間距
圖1為本發明具浸泡與清洗蝕刻功能的晶圓旋轉清洗裝置的立體外觀圖。
圖2為本發明晶圓旋轉清洗裝置上放置晶圓及藥液的立體示意圖，其中一製程噴嘴位於該晶圓旋轉清洗裝置上方。
圖3為本發明晶圓旋轉清洗裝置的側面視圖。
圖4為本發明的晶圓旋轉清洗裝置的側面剖視圖。
圖5為本發明的晶圓旋轉清洗裝置省略旋轉驅動裝置的馬達的側面剖視圖，其中晶圓承接盤位於晶圓承接位置。
圖6為本發明的晶圓旋轉清洗裝置省略旋轉驅動裝置的馬達的另一側面剖視圖，其中該晶圓承接盤位於晶圓脫離位置。
圖7為本發明的晶圓旋轉清洗裝置的一實施例的側面剖視圖。
圖8為本發明的晶圓旋轉清洗裝置的另一實施例的側面剖視圖。
1:晶圓旋轉清洗裝置
10:旋轉驅動裝置
11:馬達
12:支架
13:真空幫浦連接埠
20:晶圓轉盤
200:真空吸孔
21:上表面
30:晶圓承接盤
300:容置孔
305:浸泡槽
31:底盤部
311:晶圓接觸頂面
32:外環牆部
33:集液槽
34:內環牆部
35:排液孔
36:排放管
37:液體噴嘴

Claims (15)

  1. 一種具備浸泡與清洗蝕刻功能的單晶圓旋轉清洗設備，包括： 一旋轉驅動裝置； 一晶圓轉盤，連接在該旋轉驅動裝置上，經由該旋轉驅動裝置的驅動而旋轉，且用於固定一放置於該晶圓轉盤的上表面的晶圓；以及 一晶圓承接盤，呈環狀而環繞設置於該晶圓轉盤外側，且用於相對該晶圓轉盤上升到一晶圓承接位置或相對該晶圓轉盤下降到一晶圓脫離位置，該晶圓承接盤具有一底盤部以及一自該底盤部的外緣突伸出的外環牆部，在該底盤部與該外環牆部之間形成一浸泡槽，用於容納該晶圓，在該晶圓承接盤上貫穿形成有一與該浸泡槽相連通的容置孔以用於供該晶圓轉盤進出該容置孔； 其中，當該晶圓承接盤上升到該晶圓承接位置時，該底盤部的晶圓接觸頂面對齊該晶圓轉盤的該上表面；當該晶圓承接盤下降到該晶圓脫離位置時，該底盤部的該晶圓接觸頂面低於該晶圓轉盤的該上表面。
  2. 如請求項1所述的晶圓旋轉清洗裝置，其中該晶圓承接盤的該底盤部的該晶圓接觸頂面形成有一集液槽，且該集液槽位於該浸泡槽下方且與該浸泡槽相連通。
  3. 如請求項2所述的晶圓旋轉清洗裝置，其中該集液槽為環形，且在該底盤部上形成有一介於該集液槽與該容置孔之間的內環牆部。
  4. 如請求項3所述的晶圓旋轉清洗裝置，其中該內環牆部的頂端與該晶圓接觸頂面齊平。
  5. 如請求項2所述的晶圓旋轉清洗裝置，其中該集液槽與該外環牆部之間相隔一間距。
  6. 如請求項2所述的晶圓旋轉清洗裝置，其中該底盤部貫穿形成有至少一與該集液槽相連通的排液孔。
  7. 如請求項1所述的晶圓旋轉清洗裝置，其中在該底盤部的底面上突伸形成有對應各該排液孔的排放管。
  8. 如請求項1所述的晶圓旋轉清洗裝置，其中該底盤部的該晶圓接觸頂面為平坦面。
  9. 如請求項1所述的晶圓旋轉清洗裝置，其中該旋轉驅動裝置上設置一真空幫浦連接埠，且該晶圓轉盤上貫穿形成一與該真空幫浦連接埠相連通的真空吸孔，且該真空吸孔用於固定該晶圓於該晶圓轉盤上。
  10. 如請求項1所述的晶圓旋轉清洗裝置，其中在該晶圓承接盤的該外環牆部上設置有至少一突伸入該浸泡槽內的液體噴嘴。
  11. 如請求項1所述的晶圓旋轉清洗裝置，其中該晶圓承接盤連接一升降驅動機構，且該升降驅動機構用於驅動該晶圓承接盤，相對該晶圓轉盤進行上升或下降。
  12. 如請求項1所述的晶圓旋轉清洗裝置，其中該晶圓轉盤連接一升降驅動機構，且該升降驅動機構用於驅動該晶圓轉盤，相對該晶圓承接盤進行上升或下降。
  13. 如請求項11或12所述的晶圓旋轉清洗裝置，其中該升降驅動機構固定在該旋轉驅動裝置上。
  14. 如請求項11或12所述的晶圓旋轉清洗裝置，其中該升降驅動機構為氣壓缸、液壓缸、電磁閥、以及馬達的其中一種。
  15. 如請求項1至10項中任一項所述的晶圓旋轉清洗裝置，其中該旋轉驅動裝置包括一馬達，該馬達以一轉軸連接該晶圓轉盤以用於驅動該晶圓轉盤進行旋轉。
TW111141469A 2022-10-31 2022-10-31 具備浸泡與清洗蝕刻功能的單晶圓旋轉清洗設備 TW202420530A (zh)

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US18/104,976 US20240145292A1 (en) 2022-10-31 2023-02-02 Single wafer spin cleaning apparatus with soaking, cleaning, and etching functions

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