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Application filed by 大陸商杭州眾硅電子科技有限公司filedCritical大陸商杭州眾硅電子科技有限公司
Publication of TW202419207ApublicationCriticalpatent/TW202419207A/en
An electrochemical mechanical polishing system for CMP equipment，which comprises a power supply, with a first electrode and a second electrode; a conductive polishing head connected to a rotating bracket and connected to the first electrode of the power supply source; polishing table, corresponding to the lower part of the rotating bracket, with conductive chemical liquid, and connected to the second electrode of the power supply source; the switching unit is used to switch between the polishing head and polishing table that are connected vertically when the polishing head is driven to rotate by the rotating bracket, in order to form an electrical circuit between the second electrode, polishing table, conductive chemical solution, conductive wafer, polishing head, and first electrode, and to form an electrochemical reaction layer on the polishing surface of the conductive wafer; the polishing head can drive the movement of conductive wafers relative to the polishing table, achieving chemical mechanical polishing of the electrochemical reaction layer.
TW112142163A2022-11-032023-11-02Electrochemical mechanical polishing system for cmp equipment
TW202419207A
(en)