TW202413849A - Hot air transfer channel, hot air system and semiconductor process equipment - Google Patents

Abstract

A hot air transfer channel, a hot air system and a semiconductor process equipment. The hot air transfer channel includes a hot air input structure and/or a hot air output structure, and the hot air input structure includes an input structure member and first and second input channels disposed within the input structure member, entrances of the first and second input channels are arranged at one end of the input structure member, both of the first and second input channels extend to the other end of the input structure member and bend downwards, and the outlets of the first and second input channels are spaced at a certain distance and located at the lower side of the input structure member; the hot air output structure includes the output structure member and the first to third output channels disposed within the output structure member, entrances of the first output channel and the second output channel are located on the lower side of the output structure member and separated at a certain distance, both of the first and the second output channels extend upward and connect to the third output channel, and the outlet of the third channel is arranged at one end of the output structure member. The hot air transfer channel of the present invention heats the semiconductor process equipment by providing the hot air from external environment, thereby improving the heating efficiency and etching uniformity.

Description

Hot air transfer duct, hot air system and semiconductor process equipment

The invention belongs to the field of semiconductor technology, and specifically relates to a hot air transfer duct, a hot air system and a semiconductor process equipment.

At present, in processes such as dry etching or vapor deposition, the process gas will be ionized into ions under the influence of the electric field. In addition to the magnetic field and electric field that will affect the etching or deposition results, the temperature field is also an important factor in the process that cannot be ignored. There are two main meanings of controlling the temperature: on the one hand, by controlling the temperature, the chamber environment can quickly enter the environment required by the process, which will shorten the time required for process preparation and thus improve mass production efficiency. On the other hand, by controlling the temperature field, the uniformity of the distribution of plasma in the process chamber can be improved, thereby improving the uniformity of plasma etching or deposition on the wafer surface.

Generally, controlling the temperature of the inner wall and the upper cover of the process chamber is an important means of controlling the temperature field. Among them, the temperature of the process chamber can be achieved by monitoring and controlling the power of the heater. The temperature control of the upper cover can be achieved in many ways. At first, since the adjustment bracket was usually controlled to a certain temperature, the upper cover could be heated by making the adjustment bracket contact the upper cover. Later, heater equipment was used to control the temperature of the upper cover by wrapping a heating belt around the upper cover. With the development of process technology, the demand for temperature field control in the etching process has gradually increased, and the uniformity of the upper cover temperature has attracted attention and become a problem that needs to be solved urgently.

In order to overcome the problems existing in the prior art, the present invention provides a hot air transfer duct, a hot air system and a semiconductor process equipment to overcome the existing defects.

A hot air transfer duct is used in a hot air system of a semiconductor process equipment. The hot air transfer duct includes a hot air input structure and/or a hot air output structure. The hot air input structure includes: an input structure body; a first input channel located in the input structure body, an inlet of the first input channel located at one end of the input structure body, the first input channel extends from the inlet to the other end of the input structure body and bends downward. The outlet of the input channel is located at the lower side of the input structure body; the second input channel is located in the input structure body and below the first input channel, the inlet of the second input channel is located at the one end of the input structure body, the second input channel extends from the inlet to the other end of the input structure body and bends downward, and the distance that the second input channel extends to the other end of the input structure body is less than the distance that the first input channel extends to the input The hot air output structure comprises: an output structure body; a first output channel, which is located in the output structure body, and the inlet of the first output channel is located at the lower side of the output structure body, and the first output channel extends upward from the inlet; a second output channel, which is located in the output structure body, and the inlet of the second output channel is located at the lower side of the output structure body; Located at the lower side of the output structure body, the second output channel extends upward from the entrance; the third output channel is located in the output structure body and is connected to the first output channel and the second output channel, the outlet of the third output channel is located at one end of the output structure body, and the distance between the entrance of the first output channel and the one end of the output structure body is greater than the distance between the entrance of the second output channel and the one end of the output structure body.

As described above, an implementation method is further provided, which also includes: an air volume adjustment module, which is arranged at one end of the input structure body and is used to adjust the air volume input to the first input channel and/or the second input channel.

As described above and any possible implementation method, a further implementation method is provided, wherein the air volume adjustment module includes: a plug plate fixing member, which is arranged on the hot air input structure; and a plug plate, which is slidably connected to the plug plate fixing member to change the size of the entrance of the first input channel and/or the second input channel.

The present invention also provides a hot air system for semiconductor process equipment, comprising: at least one hot air supply module; at least one pair of hot air transfer ducts described in the present invention, the output port of the hot air supply module is connected to the inlet of the first input channel and the inlet of the second input channel of the hot air input structure, and the input port of the hot air supply module is connected to the outlet of the third input channel of the hot air output structure; a first hot air ring is arranged at Below the hot air transfer air duct, the first hot air ring is respectively connected with the outlet of the first input channel of the hot air input structure and the inlet of the first output channel of the hot air output structure; the second hot air ring is arranged around the outer side of the first hot air ring and is arranged below the hot air transfer air duct, and the second hot air ring is respectively connected with the outlet of the second input channel of the hot air input structure and the inlet of the second output channel of the hot air output structure.

As described above, an implementation method is further provided, wherein the hot air transfer ducts are two pairs, and the two pairs of hot air transfer ducts are arranged opposite to each other; the hot air supply modules are two, and the two hot air supply modules are arranged opposite to each other, each hot air supply module is adjacent to or adjacent to the hot air transfer duct, and the hot air supply module is located on one side of the two pairs of hot air transfer ducts away from each other.

The aspects described above and any possible implementation methods further provide an implementation method, which also includes: at least one first temperature sensor, arranged on the first hot air ring; at least one second temperature sensor, arranged on the second hot air ring; when the temperature of the first hot air ring is higher than that of the second hot air ring, the entrance of the first input channel is reduced or the entrance of the second input channel is expanded; or when the temperature of the first hot air ring is lower than that of the second hot air ring, the entrance of the first input channel is expanded or the entrance of the second input channel is reduced.

According to the aspects described above and any possible implementation method, an implementation method is further provided, wherein the first hot air ring includes two first semi-circular cavities, and the upper surface of each of the first semi-circular cavities includes two first openings, and the two first openings are respectively connected to the outlet of the first input channel of the hot air input structure of the hot air transfer air duct and the inlet of the first output channel of the hot air output structure; the second hot air ring includes two second semi-circular cavities, and the upper surface of each of the second semi-circular cavities includes two second openings, and the two second openings are respectively connected to the outlet of the second input channel of the hot air input structure of the hot air transfer air duct and the inlet of the second output channel of the hot air output structure; and the two first semi-circular cavities and the two second semi-circular cavities are symmetrically arranged.

As described above and any possible implementation method, a further implementation method is provided, wherein the two first openings of the first semicircular cavity are respectively arranged at the two ends of the first semicircular cavity; the two second openings of the second semicircular cavity are respectively arranged at the two ends of the second semicircular cavity.

As described above and any possible implementation method, a further implementation method is provided, wherein the hot air supply module is a high-temperature upper electrode module, comprising a heating wire and an air amplifier connected to each other, the heating wire is arranged at the input port of the hot air supply module; the air amplifier is arranged at the output port of the hot air supply module.

The present invention also provides a semiconductor process equipment, including: a process chamber, including a chamber body and an upper cover; a first coil group, arranged on the upper cover; a second coil group, arranged on the upper cover and arranged around the outer side of the first coil group; the hot air system described in the present invention, the first hot air ring and the second hot air ring of the hot air system are arranged on the upper cover, the first hot air ring is arranged between the first coil group and the second coil group, and the second hot air ring is arranged between the second coil group and the edge of the upper cover; a coil bracket, arranged above the first coil group and the second coil group and the first hot air ring and the second hot air ring, for fixing the first coil group and the second coil group.

As described above, an implementation method is further provided, wherein at least four avoidance holes are provided on the coil bracket, and all the first openings and the second openings on the first hot air ring and the second hot air ring are provided in the corresponding avoidance holes.

According to the aspects and any possible implementations described above, an implementation is further provided, wherein the semiconductor process equipment is a plasma process equipment.

Beneficial effects of the present invention

Compared with the prior art, the present invention has the following beneficial effects:

The hot air transfer air duct provided by the present invention comprises a hot air input structure and/or a hot air output structure with adjustable air volume; the hot air system comprises a hot air transfer air duct, a hot air supply module, a first hot air ring and a temperature sensor; the semiconductor process equipment adopts the hot air system provided by the present invention, and at the same time adopts a double hot air ring structure arranged between the first and second coil groups and the edge of the upper cover, which cooperates with the hot air transfer air duct to increase the contact area between the hot air and the upper surface of the upper cover, and the hot air input structure of the hot air transfer air duct adopts a layered double input air duct and a hot air output structure. The output structure adopts a layered double output air duct to ensure that the air volume entering and flowing out of the first and second hot air rings is fixed and does not interfere with each other, which improves the efficiency of heating the upper cover to a certain extent, thereby shortening the preparation time of the process conditions inside the chamber of the etching machine, thereby improving the mass production efficiency. In addition, the present invention adjusts the air volume entering the first and/or second hot air rings by adjusting the air volume of the hot air input structure, thereby reducing the temperature difference between the center and edge parts of the upper cover, thereby increasing the uniformity of the temperature field in the semiconductor process chamber and improving the uniformity of etching.

In order to better understand the technical solution of the present invention, the content of the present invention includes but is not limited to the specific implementation methods described below, and similar technologies and methods should be regarded as within the scope of protection of the present invention. In order to make the technical problems, technical solutions and advantages to be solved by the present invention clearer, the following will be described in detail in conjunction with the attached drawings and specific embodiments.

It should be clear that the embodiments described in the present invention are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative labor are within the scope of protection of the present invention.

First, the hot air system involved in the relevant technology is introduced.

As shown in FIG1 , a related technology 1 uses a hot air system to control the upper cover temperature of a process chamber of a semiconductor process equipment. The hot air system includes a hot air ring 2, a transfer air duct 3, a first high-temperature upper electrode module 6, a second high-temperature upper electrode module 7, an inner coil group 8, an outer coil group 9 and a thermocouple 10. The upper cover 1 is a short cylindrical cover made of quartz or ceramic material for a process chamber. The upper cover 1, the inner coil group 8 and the outer coil group 9 belong to the same assembly, namely, the upper cover assembly. The first high-temperature upper electrode module 6 and the second high-temperature upper electrode module 7 are both installed outside the process chamber, and both include a heating wire and an air amplifier. The heating wire continuously heats the compressed air that flows through and contacts it, and the compressed air comes from the factory. The air amplifier accelerates the flow rate of the heated compressed air, so that the heated compressed air circulates in the hot air ring 2 to form hot air. The switching air duct 3 is connected to the first high-temperature upper electrode module 6 and the second high-temperature upper electrode module 7 respectively. The switching air duct 3 transmits the hot air to the hot air ring 2, and can also return the air in the hot air ring 2 to the first high-temperature upper electrode module 6 and the second high-temperature upper electrode module 7 for continued heating. The hot air ring 2 is placed above the upper cover 1 and between the inner coil group 8 and the outer coil group 9. The hot air circulating in the hot air ring 2 transfers heat to the upper cover 1, thereby heating the upper cover 1. A temperature measuring thermocouple 10 is provided to measure the temperature of the upper cover in real time, and the temperature automatic control module automatically controls the power of the heating wires in the first high-temperature upper electrode module 6 and the second high-temperature upper electrode module 7 according to the measured temperature. The temperature automatic control module (including but not limited to parts such as thermostats) is a prior art and is not described in detail in the present invention. The thermocouple 10 measures the temperature of the upper cover 1 corresponding to the area where the hot air ring 2 is located. However, this technology has the following disadvantages:

1. The coil is an important component that determines the distribution of the magnetic field. Therefore, for mass-produced semiconductor etching process equipment, the number of turns and placement of the coil cannot be changed. Due to the restrictions on the number of turns and position of the coil, the hot air ring 2 can only be placed between the inner coil group 8 and the outer coil group 9. As a result, the coverage area of the hot air ring 2 on the upper cover 1 is limited by the distance between the inner coil group 8 and the outer coil group 9, which limits the contact area between the upper cover 1 and the hot air ring, resulting in low heating efficiency for the upper cover 1.

2. The heated area of the upper cover 1 is concentrated in the area covered by the hot air ring 2, which will inevitably lead to a temperature distribution of the upper cover 1 with a high temperature in the area covered by the hot air ring 2 and a gradually decreasing temperature on both sides of the hot air ring 2, especially the heating effect of the edge of the upper cover 1 is relatively poor.

Related technology 2 is based on related technology 1, and adds a heating device to the outer ring of the upper cover 1. As shown in Figure 2, the heating device includes a uniform heating ring 4 and a heating belt 5. This setting can solve the shortcomings of low hot air heating efficiency and relatively poor heating effect of the edge of the upper cover in related technology 1. The heat of the heating belt 5 is transferred to the cylindrical surface of the upper cover 1 facing the outside through the aluminum uniform heating ring 4, thereby heating the edge of the upper cover 1. In general, the heating device cooperates with the first high-temperature upper electrode module 6 and the second high-temperature upper electrode module 7, the transfer air duct 3, the hot air ring 2 and the thermocouple 10 to control the temperature of the upper cover 1. At this time, the value measured by the temperature measuring thermocouple 10 can be used as a basis for regulating the power of the heating wire of the first high-temperature upper electrode module 6 and the second high-temperature upper electrode module 7 and the power of the heating belt 5. However, this technology has the following disadvantages:

1. The material of the heat-leveling ring 4 is aluminum, which is easy to deform after working for a long time. This deformation makes the heat transfer of the heat-leveling ring 4 to the upper cover uneven and insufficient, which will lead to uneven temperature distribution of the upper cover;

2. Due to the limited space inside the machine, there is a risk of the heating belt 5 bumping into other parts in the semiconductor process chamber when replacing or installing it.

The embodiment of the present invention provides a hot air transfer duct for a hot air system of a semiconductor process equipment, as shown in FIG3, FIG4 and FIG7, to illustrate its specific structural composition, the hot air transfer duct includes a hot air input structure 12 and/or a hot air output structure 19. In this embodiment, the hot air transfer duct includes a hot air input structure 12 and a hot air output structure 19. The hot air transfer duct is used to provide hot air provided by the outside to the semiconductor process equipment for heating, and/or to transport the hot air at the upper cover out. More specifically, the hot air transfer duct is used to transport the hot air provided by the hot air supply module such as the high-temperature upper electrode module to a heating structure such as a hot air ring, so as to heat the upper cover of the process chamber of the semiconductor process equipment, wherein the hot air input structure 12 is used to introduce hot air from the hot air supply module to the heating structure such as the hot air ring, and the hot air output structure 19 is used to transport the hot air output by the heating structure such as the hot air ring back to the above-mentioned hot air supply module to realize loop heating.

Furthermore, the hot air input structure 12 includes: an input structure body 31; a first input channel 20, located in the input structure body 31, the inlet of the first input channel 20 is located at one end of the input structure body 31, the first input channel 20 extends from the inlet to the other end of the input structure body 31 and bends downward, and the outlet of the first input channel 20 is located at the lower side of the input structure body 31; a second input channel 21, located in the input structure body 31 and at the outlet of the first input channel 20; The inlet of the second input channel 21 is located at one end of the input structure body 31 and below the inlet of the first input channel 20. The second input channel 21 extends from the inlet to the other end of the input structure body 31 and bends downward. The distance that the second input channel 21 extends to the other end of the input structure body 31 is less than the distance that the first input channel 20 extends to the other end of the input structure body 31, and the outlet of the second input channel 21 is located at the lower side of the input structure body 31. In an optional embodiment, the inlet of the second input channel 21 and the inlet of the first input channel 20 are located at the same end of the input structure body 31, and the two together constitute the inlet 14 of the first input channel 20 and the second input channel 21.

Furthermore, the hot air output structure 19 includes: an output structure body 32; a first output channel 33, located in the output structure body 32, the entrance of the first output channel 33 is located at the lower side of the output structure body 32, and the first output channel 33 extends upward from the entrance; a second output channel 34, located in the output structure body 32, the entrance of the second output channel 34 is located at the lower side of the output structure body 32, and the second output channel 34 extends upward from the entrance; a third output channel 15, located in the output structure body 32, and connected to the first output channel 33 and the second output channel 34, the outlet of the third output channel 15 is located at one end of the output structure body 32, and the distance between the entrance of the first output channel 33 and one end of the output structure body 32 is greater than the distance between the entrance of the second output channel 34 and one end of the output structure body 32. In an optional embodiment, the third output channel 15 extends horizontally from one end of the output structure body 32 (i.e., the end where the outlet is located) to the other end, and passes through the outlet of the second output channel 34 and the outlet of the first output channel 33 respectively, and is connected to the two.

Those skilled in the art should understand that, although in the examples of FIG. 3 and FIG. 4 , the hot air input structure 12 has two input channels and the hot air output structure 19 has two output channels, the present invention is not limited thereto, and more input channels and output channels are feasible as long as the number of input channels and output channels is the same.

The inlets of the first input channel 20 and the second input channel 21 of the hot air transfer channel of the embodiment of the present invention are suitable for communicating with the high-temperature upper electrode module 6 to receive the hot air provided by the high-temperature upper electrode module 6, and transport the hot air to a heating structure such as a hot air ring (such as the first hot air ring 11 and the second hot air ring 16 in FIG. 7, which will be described in detail in the latter part of the present invention). It should be understood by those skilled in the art that the number of hot air rings is not limited to two, and as long as the number of hot air rings is the same as the number of input channels and output channels, more hot air rings are feasible.

The hot air input structure 12 provides the received hot air to a heating structure such as a hot air ring (for example, the first hot air ring 11 and the second hot air ring 16 in FIG. 7 ) through the outlet of the first input channel 20 and the outlet of the second input channel 21, and the inlet of the first output channel 33 and the inlet of the second output channel 34 of the hot air output structure 19 are suitable for being connected to an opening on a heating structure such as a hot air ring (for example, the first hot air ring 11 and the second hot air ring 16 in FIG. 7 ) to receive the hot air flowing out of the opening of the heating structure such as a hot air ring (for example, the first hot air ring 11 and the second hot air ring 16 in FIG. 7 ). The hot air circulation process is specifically described in detail in the later part of the present invention.

As some optional implementation methods of the embodiments of the present invention, as shown in Figure 5, an air volume adjustment module 22 is provided at the inlet of the first input channel 20, which is used to adjust the air volume of the first input channel 20 and the second input channel 21 output to the input structure main body 31 in the hot air input structure 12. Since the distance that the second input channel 21 extends to the other end of the input structure main body 31 is shorter than the distance that the first input channel 20 extends to the other end of the input structure main body 31, the outlet of the second input channel 21 is closer to the edge of the upper cover than the outlet of the first input channel 20. In other words, the outlet of the second input channel 21 and the outlet of the first input channel 20 are respectively located at the edge and center of the upper cover. In this case, by adjusting the air volume output to the first input channel 20 and/or the second input channel 21 through the air volume adjustment module 22, the temperature difference between the center and edge of the upper cover can be reduced, thereby increasing the uniformity of the temperature field in the semiconductor process chamber and improving the uniformity of etching. The air volume regulating module of the present invention can solve the disadvantages of the first related technology that the temperature on both sides of the hot air ring is gradually reduced in the gradient distribution, especially the relatively poor heating effect of the edge of the upper cover. Those skilled in the art should understand that the air volume regulating module 22 can be arranged at one end of the input structure main body 31 to regulate the air volume input to the first input channel 20 and/or the second input channel 21. That is to say, the air volume regulating module 22 can be arranged at the entrance of the first input channel 20 to separately regulate the air volume of the first input channel 20; it can also be arranged at the entrance of the second input channel 21 to separately regulate the air volume of the second input channel 21; it can also be arranged at the entrance 14 of both the first input channel 20 and the second input channel 21 to simultaneously regulate the air volume of the first input channel 20 and the second input channel 21, thereby realizing the regulation of the air volume input to the first input channel and/or the second input channel.

As shown in FIG6 , the air volume regulating module 22 in the embodiment of the present invention adopts a plug plate regulating structure 13 to realize the above-mentioned function, and the plug plate regulating structure 13 includes a plug plate 25 and a plug plate fixing member 26, wherein the plug plate fixing member 26 is arranged on the hot air input structure, specifically, it can be located on one side (left side, right side or upper side) of the input structure main body 31 adjacent to the entrance of the first input channel 20. , and is fixedly connected to the input structure main body 31. Of course, it can also be fixed on the left side, right side or lower side of a side of the input structure main body 31 adjacent to the entrance of the second input channel 21), and can also be fixed on the left side, right side, upper side or lower side of a side of the input structure main body 31 adjacent to the entrance 14 composed of the entrance of the first input channel 20 and the entrance of the second input channel 21. The plug plate 25 is slidably connected to the plug plate fixing member 26, and a part of the plug plate 25 passes through the input structure main body 31, so as to make the plug plate 25 slide relative to the plug plate fixing member 26 through insertion or withdrawal, so as to at least partially block the entrance of the first input channel 20, or the entrance of the second input channel 21, or the entrance 14 composed of the entrance of the first input channel 20 and the entrance of the second input channel 21, thereby changing the size of the entrance of the first input channel 20, or the size of the entrance of the second input channel 21, or the size of the entrance 14 composed of the entrance of the first input channel 20 and the entrance of the second input channel 21.

Specifically, the specific way of sliding connection between the plug plate 25 and the plug plate fixing member 26 is, for example, a strip through hole is provided on the plug plate fixing member 26, and a threaded hole or through hole is correspondingly provided on the plug plate 25. After the plug plate 25 completes the insertion or withdrawal action to determine the stop position of the plug plate 25, a screw 27 (or bolt) is used to pass through the above-mentioned strip through hole and the threaded hole (or through hole) on the plug plate 25 in sequence to lock the plug plate 25 on the plug plate fixing member 26. The plug plate 25 and the plug plate fixing member 26 are connected and locked by threaded connection. However, the embodiments of the present invention are not limited to this. In actual applications, other connection and locking structures can also be used, and the present invention is not limited thereto.

As shown in Figure 6, the plug plate 25 can be pushed and slid left and right or up and down along the entrance of the first input channel 20, and can also be pushed and slid left and right or up and down along the entrance of the second input channel 21, and can also be pushed and slid left and right or up and down along the entrance 14 composed of the entrance of the first input channel 20 and the entrance of the second input channel 21. According to the needs of temperature regulation, the plug plate 25 can be moved to any position of the entrance of the first input channel 20, and can also be moved to any position of the entrance of the second input channel 21, and can also be moved to any position of the entrance 14 composed of the entrance of the first input channel 20 and the entrance of the second input channel 21. Taking the example of the plug plate adjustment structure 13 being fixed on one side of the entrance of the first input channel 20 and sliding left and right, one end of the plug plate 25 can be moved left and right to a position of 1/8, 1/4, or 3/8 of the entrance area of the first input channel 20, thereby changing the size of the entrance of the first input channel 20, and then changing the opening area of the entrance of the first input channel 20, thereby adjusting the air volume output from the outlet of the first input channel 20 and/or the outlet of the second input channel 21 in the input structure main body 31.

The plug plate 25 is inserted into the entrance of the first input channel 20 in the input structure main body 31 of the hot air input structure 12. The size of the entrance of the first input channel 20 is changed by pulling it out left and right or up and down, thereby increasing or decreasing the amount of hot air entering the first input channel 20. At the same time, since the total amount of air entering the hot air transfer duct of the hot air input structure 12 remains unchanged, the amount of air entering the second input channel 21 will also be reduced or increased accordingly. Similarly, when the plug plate adjustment structure 13 is fixed at the entrance of the second input channel 21 and at the entrance 14 composed of the entrance of the first input channel 20 and the entrance of the second input channel 21, the movement method of the plug plate 25 is similar to the above method and will not be repeated.

Another embodiment of the present invention provides a hot air system for semiconductor process equipment, the hot air system includes at least one pair of hot air transfer ducts provided in the above embodiment, and also includes at least one hot air supply module; the output port of the hot air supply module is connected to the inlet of the first input channel and the inlet of the second input channel of the hot air input structure, that is, connected to the inlet of both the first input channel and the second input channel, and the input port of the hot air supply module is connected to the outlet of the third input channel of the hot air output structure.

The first hot air ring 11 is an inner hot air ring, which is arranged below the hot air transfer air duct. The first hot air ring 11 is respectively connected to the outlet of the first input channel of the hot air input structure and the inlet of the first output channel of the hot air output structure; the second hot air ring 16 is an outer hot air ring, which is arranged around the outer side of the first hot air ring 11 and is arranged below the hot air transfer air duct. The second hot air ring 16 is respectively connected to the outlet of the second input channel of the hot air input structure and the inlet of the second output channel of the hot air output structure.

It should be noted that in the above-mentioned embodiment, the hot air transfer duct includes a hot air input structure 12 and a hot air output structure 19, and when the hot air transfer duct includes the hot air input structure 12 or the hot air output structure 19, the input port or output port of the hot air supply module can adopt other hot air output structures or hot air input structures to realize the connection between the input port or output port of the hot air supply module and the first hot air ring 11 and the second hot air ring 16 respectively. In other words, the hot air input structure 12 and the hot air output structure 19 in the embodiment of the present invention are not limited to being used at the same time, and can also be used in combination with other hot air output structures or hot air input structures.

As some optional implementation methods of the embodiments of the present invention, there are two pairs of hot air transfer air ducts in the present invention, and the two pairs of hot air transfer air ducts are relatively arranged, as shown in Figure 7, the first pair of hot air transfer air ducts include a hot air input structure 12 and a hot air output structure 19, and the second pair of hot air transfer air ducts include a hot air input structure 12' and a hot air output structure 19', wherein the structural components of the hot air input structure 12' and the hot air output structure 19' are exactly the same as the structural components of the hot air input structure 12 and the hot air output structure 19, respectively, and the present invention will not elaborate on them. There are two hot air supply modules in the present invention, and the two hot air supply modules are arranged opposite to each other. The two modules respectively include a first high-temperature upper electrode module 6 and a second high-temperature upper electrode module 7 with exactly the same structure. Each hot air supply module and the hot air transfer air duct are adjacent to or arranged adjacent to each other, and the hot air supply module is located on the side of the two pairs of hot air transfer air ducts far away from each other, that is, it is arranged on the side of the hot air transfer air duct far away from the first hot air ring 11 and the second hot air ring 16. Since hot air is provided, the setting of the module adjacent to or adjacent to the hot air transfer air duct ensures that the temperature and speed of the hot air output by the hot air supply module are not affected.

As some optional implementations of this embodiment, as shown in FIG. 11, the first hot air ring 11 includes two symmetrically arranged first semi-circular cavities, and the upper surface of each first semi-circular cavity includes two first openings, and the two first openings are respectively arranged at the two ends of each first semi-circular cavity. The four first openings can be, for example, circular through holes 24, 28, 29 and 30, wherein the through hole 24 at one end of a first semi-circular cavity is connected to the first hot air transfer device. The through hole 28 at the other end is connected to the entrance of the first output channel 33' of the hot air output structure 19' of the second hot air transfer air duct; the through hole 29 at one end of the other first semi-circular cavity is connected to the outlet of the first input channel 20' of the second hot air input structure 12'; the through hole 30 at the other end is connected to the entrance of the first output channel 33 of the hot air output structure 19 of the first hot air transfer air duct. Based on the same arrangement, the second hot air ring 16 in the embodiment of the present invention also includes two symmetrically arranged second semi-circular cavities, and the upper surface of each second semi-circular cavity includes two second openings, and the two second openings are respectively arranged at the two ends of each second semi-circular cavity. The four second openings can be, for example, circular through holes, and the first through hole at one end of one of the second semi-circular cavities is connected to the hot air input structure of the first hot air transfer duct. The outlet of the second input channel 21 of the second hot air input structure 12; the second through hole at the other end is connected to the inlet of the second output channel 34' of the hot air output structure 19' of the second hot air transfer air duct; the third through hole at one end of the other second semi-circular cavity is connected to the outlet of the second input channel 21' of the second hot air input structure 12'; the fourth through hole at the other end is connected to the inlet of the second output channel 34 of the hot air output structure 19 of the first hot air transfer air duct. The first hot air ring 11 and the second hot air ring 16 of the present invention are both symmetrically arranged in the form of two first and second semicircular ring cavities, serving as a flow channel for hot air circulation, receiving hot air from the hot air input structure through the first through hole and the fourth through hole thereon, and after flowing in the two first and second semicircular ring cavities, flowing into the inlet of the first output channel and the second output channel of the hot air output structure through the second through hole and the third through hole, thereby realizing the circulation recovery of the hot air. The through holes on the first hot air ring 11 and the second hot air ring 16 of the present invention can both flow in and out of hot air, which is specifically determined according to the different positions of the through holes.

As some optional embodiments of the embodiments of the present invention, the input port of the first high-temperature upper electrode module 6 is connected to an external compressed air device, and the output port is connected to the inlet 14 composed of the inlet of the first input channel 20 and the inlet of the second input channel 21 of the hot air input structure 12 of the hot air transfer channel. The first high-temperature upper electrode module 6 includes a heating wire and an air amplifier connected to each other. The heating wire is arranged at the input port of the first high-temperature upper electrode module 6 to heat the compressed air flowing into the input port; the air amplifier is arranged at the output port of the first high-temperature upper electrode module 6 to amplify and accelerate the flow rate of the compressed air or hot air heated by the heating wire. The compressed air device is the factory's CDA (compressed dry air). The compressed air it delivers is heated by the heating wire in the first high-temperature upper electrode module 6, and then the flow rate is amplified and accelerated by the air amplifier. The heated and accelerated air circulates to form hot air. The hot air circulates back and forth from the first high-temperature upper electrode module 6 into the hot air input structure, the first hot air ring 11 and the second hot air ring 16, and the hot air output structure, and finally flows back to the first high-temperature upper electrode module 6. The specific hot air circulation process will be described in detail later.

As some optional implementation methods of the embodiments of the present invention, the present invention further includes at least one first temperature sensor and at least one second temperature sensor, at least one first temperature sensor is arranged on the first hot air ring 11, specifically arranged near the through hole of the first hot air ring 11; at least one second temperature sensor is arranged on the second hot air ring 16, specifically arranged near the through hole of the second hot air ring 16; when the temperature of the first hot air ring 11 measured by the first temperature sensor is higher than that of the second temperature sensor, the temperature of the first hot air ring 11 is higher than that of the second temperature sensor. or when the temperature of the first hot air ring 11 measured by the first temperature sensor is lower than the temperature of the second hot air ring 16 measured by the second temperature sensor, the entrance size of the first input channel 20 of the hot air input structure 12 is expanded and/or the entrance size of the second input channel 21 is expanded through the air volume regulating structure; or when the temperature of the first hot air ring 11 measured by the first temperature sensor is lower than the temperature of the second hot air ring 16 measured by the second temperature sensor, the entrance size of the first input channel 20 of the hot air input structure 12 is expanded and/or the entrance size of the second input channel 21 is reduced through the air volume regulating structure.

As some optional implementation methods of the embodiments of the present invention, the first temperature sensor and the second temperature sensor in the present invention are implemented by thermocouples 10, at least four thermocouples are arranged on each hot air ring, and each thermocouple 10 is installed near each through hole on the first hot air ring 11 and the second hot air ring 16, and these thermocouples are used to measure the temperature of the first hot air ring 11 and the second hot air ring 16 at different setting positions of the thermocouples.

Another embodiment of the present invention further provides a semiconductor process equipment, which can be a plasma process equipment, and further a plasma etching or deposition process equipment. As shown in FIG. 7 , the semiconductor process equipment includes a process chamber having an upper cover 1 and a chamber body; a first coil group 8, which is disposed on the upper cover 1; a second coil group 9, which is also disposed on the upper cover 1 and is disposed around the outer side of the first coil group 8; In the hot air system of the embodiment of the present invention, the first hot air ring 11 and the second hot air ring 16 of the hot air system are both arranged on the upper cover 1, so as to heat the process chamber. Taking the plasma etching process as an example, during the dry etching process, the process gas in the process chamber is ionized into ions under the support of the electric field to form a plasma. This high-energy plasma bombards the surface of the wafer, thereby obtaining the pattern required for preparing the integrated circuit. In the semiconductor process equipment of the embodiment of the present invention, the first hot air ring 11 is arranged between the first coil group 8 and the second coil group 9, and the second hot air ring 16 is arranged between the second coil group 9 and the edge of the upper cover 1; as shown in Figure 12, the coil bracket 23 is arranged above the first coil group 8 and the second coil group 9 and the first hot air ring 11 and the second hot air ring 16, and is used to fix the first coil group 8 and the second coil group 9, wherein the first coil group 8 is an inner coil group and the second coil group 9 is an outer coil group.

The semiconductor process equipment of the present invention may also include multiple coil groups, each coil group may include multiple coils, wherein the arrangement of the multiple coil groups and the hot air ring is similar to the arrangement of the semiconductor process equipment provided by the embodiment of the present invention when the two coil groups are included and the hot air ring is within the protection scope of the present invention. Among them, the second hot air ring 16 replaces the heating device in the related technology 2, that is, the heating belt 5 and the aluminum uniform heat ring 4, to avoid the disadvantage of the aluminum uniform heat ring 4 in the related technology 2 being deformed and causing frequent replacement of the entire heating device. Four avoidance holes are arranged on the coil bracket 23 for fixedly supporting the first coil group 8 and the second coil group 9. The four through holes on the first hot air ring 11 and the second hot air ring 16 are respectively embedded in each avoidance hole, so that the through holes are connected with the corresponding channels of the hot air transfer air duct. The hot air flowing in and/or flowing out of these embedded through holes heats the upper surface of the upper cover 1. The two hot air transfer air ducts are symmetrically arranged on both sides of the coil bracket 23, and the outlet of the first input air duct 20 of the hot air input structure 12 of the first hot air transfer air duct is connected to the through hole 24 on the first hot air ring 11, and the outlet of the second input air duct 21 is connected to the first through hole on the second hot air ring 16; The inlet of the first output channel 33' of the hot air output structure 19' of the hot air transfer air duct is connected to the through hole 28 of the first hot air ring 11, and the inlet of the second output channel 34' is connected to the second through hole of the second hot air ring 16; the outlet of the first input channel 20' of the hot air input structure 12' of the second hot air transfer air duct is connected to the through hole 29 of the first hot air ring 11, and the outlet of the second input channel 21' is connected to the third through hole of the second hot air ring 16; the inlet of the first output air duct 33 of the hot air output structure 19 of the first hot air transfer air duct is connected to the through hole 30 on the first hot air ring 11, and the inlet of the second output air duct 34 is connected to the fourth through hole on the second hot air ring 16. The hot air transfer duct and the high-temperature upper electrode module symmetrically arranged on both sides of the upper surface of the upper cover of the present invention can heat the upper cover 1 evenly and ensure the uniformity of heating of the upper surface of the upper cover 1.

As some optional implementation methods of the embodiments of the present invention, the present invention takes the first hot air ring 11 as an example to describe the flow process of the hot air after the hot air system of the present invention is started to heat the upper cover 1. After the input port of the first high-temperature upper electrode module 6 receives the compressed air from the factory, the heating wire arranged inside it heats the compressed air; the air amplifier amplifies and accelerates the flow rate of the heated compressed air, and the heated and accelerated air circulates to form hot air, and the hot air is output from the output port of the first high-temperature upper electrode module 6 to the input structure main body 31 of the hot air input structure 12 of the hot air transfer duct, and the inlet 14 is composed of the inlet of the first input channel 20 and the inlet of the second input channel 21. The hot air flows into the through hole 24 at the end of the first semi-circular cavity on the right side of the first hot air ring 11 through the outlet of the first input channel 20 in the input structure main body 31. The hot air entering the through hole 24 flows in the first semi-circular cavity. The hot air flows along the first semicircular cavity path to the other end, and the flowing hot air flows out through the through hole 28 at the end and enters the hot air output structure 19' through the inlet of the first output channel 33' in the output structure main body 32' of the hot air output structure 19', and flows out through the outlet of the third output channel 18, and the outflowing hot air flows into the input port of the second high-temperature upper electrode module 7 connected to the outlet, and the second high-temperature upper electrode module 7 heats and accelerates the received hot air and outputs it through its output port, and the output hot air passes through the inlet of the first input channel 20' in the input structure main body 31' of the hot air input structure 12' of the second hot air transfer duct and the second input channel 21'. The hot air flows into the inlet 17 formed by the inlet of the first input channel 21', and flows into the end through hole 29 of the other first semi-circular cavity on the left side of the first hot air ring 11 again through the outlet of the first input channel 20'. The hot air entering the through hole 29 flows in the first semi-circular cavity, and heats the upper surface of the upper cover during the flow. When the hot air flows to the other end in the first semi-circular cavity, the flowing hot air enters the hot air output structure 19 through the through hole 30 at the end from the inlet of the first output channel 33 of the hot air output structure 19, and flows out through the outlet of the third output channel 15. The outflowing hot air flows back into the input port of the first high-temperature upper electrode module 6 connected to the outlet, and the first high-temperature upper electrode module 6 receives the hot air. After the hot air is heated and accelerated again, it is output as hot air, thereby circulating to ensure the temperature and speed of the hot air flowing in the first hot air ring 11, so that the upper surface of the upper cover where the first hot air ring 11 is located is evenly heated. Similarly, the principle of hot air circulation in the second hot air ring 16 is the same as that of the first hot air ring 11, and the present invention will not be repeated. Therefore, Through the two hot air input structures and the hot air output structures provided in the present invention and the combined effect with the two high-temperature upper electrode modules, it is ensured that the hot air entering the first hot air ring 11 and the second hot air ring 16 continuously and evenly heats the upper surface of the upper cover, thereby reducing the temperature difference between the center and the edge of the upper cover, and achieving the purpose of evenly heating the upper surface of the entire upper cover.

As some optional implementation methods of the embodiments of the present invention, the total number of thermocouples 10 is at least 8, as shown in Figure 7, and four holes for installing temperature-measuring thermocouples 10 are evenly distributed on the first hot air ring 11 and the second outer hot air ring 16, and the temperature-measuring thermocouples 10 are installed in these holes. The adjustment of the left and right or up and down movement of the plug plate 25 is determined according to the temperatures measured by the eight temperature-measuring thermocouples 10. In other words, the air volume adjustment mechanism of the present invention needs to adjust the air intake of the hot air input structure by reading the temperatures measured by all the thermocouples 10. The specific operation mechanism is explained by taking the left-right movement as an example: the hot air system is activated on the semiconductor etching process equipment, and the temperature of different areas on the upper cover surface read by the eight thermocouples 10 fixed on the first hot air ring 11 and the second hot air ring 16 is used to determine the movement amount of the plug 25 in the plug adjustment structure 13. According to the temperature measurement data read from all the thermocouples 10, the inlet area of the first input channel 20 of the hot air input structure 12 is manually adjusted using the dichotomy method to adjust the heating effect. If the temperature readings of the four temperature measuring thermocouples 10 fixed on the first hot air ring 11 are higher than the temperature readings of the four temperature measuring thermocouples 10 on the second hot air ring 16, the plug plate 25 needs to be located at a position blocking one-fourth of the inlet area of the first input channel 20. At this time, the position of the plug plate 25 is as shown in Figure 8, where the measurement value can be the average of the readings measured by the four thermocouples or a calculated value obtained by other calculations. If at this time the reading measurement value of the temperature measuring thermocouple 10 at the first hot air ring 11 is still higher than the reading measurement value of the temperature measuring thermocouple 10 at the second hot air ring 16, it is necessary to continue to push the plug plate 25 inwardly to one eighth of the movement amount of the entrance of the entire first input channel 20. At this time, the position of the plug plate 25 is as shown in FIG. 9. At this time, the plug plate 25 is located at a position blocking three eighths of the entrance area of the first input channel 20; if at this time the temperature measurement value of the temperature measuring thermocouple arranged on the first hot air ring 11 is lower than the temperature measurement value of the temperature measuring thermocouple arranged on the second hot air ring 16, To read the measured value, the plug plate 25 needs to be pulled back one eighth of the movement of the entire first input channel 20 entrance. The position of the plug plate 25 at this time is shown in Figure 10, that is, the plug plate 25 is pulled back, and the movement of the plug plate 25 at the entrance of the first input channel 20 of the hot air input structure 12 is adjusted according to the temperature readings of all thermocouples 10 on the first hot air ring 11 and the second hot air ring 16. Stop when the upper surface temperature distribution of the upper cover 1 is relatively uniform, record the position of the plug plate 25 at this time, and fix it with screws 27 and plug plate fixings 26. It is worth noting that each adjustment action needs to be performed after the first high-temperature upper electrode module 6 and the second high-temperature upper electrode module 7 stop working and the upper cover 1 cools to room temperature. After adjusting the position of the plug plate 25, the first high-temperature upper electrode module 6 and the second high-temperature upper electrode module 7 are turned on, and then the next step of temperature measurement is performed. After the plug plate 25 is fixed, the etching machine can start working. During operation, the eight thermocouples 10 can monitor the upper surface temperature of the upper cover in real time, calculate the average value of the temperature read by the eight thermocouples and compare it with the set temperature. When the average value exceeds the set temperature, the etching machine automatically adjusts to reduce the power of the heating wire in the first high-temperature upper electrode module 6 and the second high-temperature upper electrode module 7; and when the average value is lower than the set temperature, the etching machine automatically increases the power of the heating wire in the first high-temperature upper electrode module 6 and the second high-temperature upper electrode module 7.

The terms used in the embodiments of the present invention are for the purpose of describing specific embodiments only and are not intended to limit the present invention. The singular forms "a", "an", "the" and "the" used in the embodiments of the present invention and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings.

The above description shows and describes several preferred embodiments of the present invention, but as mentioned above, it should be understood that the present invention is not limited to the form disclosed herein, and should not be regarded as excluding other embodiments, but can be used in various other combinations, modifications and environments, and can be modified within the scope of the application concept described herein through the above teachings or the technology or knowledge of the relevant fields. The changes and modifications made by those skilled in the art do not deviate from the spirit and scope of the present invention, and should be within the scope of protection of the claims attached to the present invention.

1: Upper cover 2: Hot air ring 3: Transfer air duct 4: Uniform heat ring 5: Heating belt 6: First high temperature upper electrode module 7: Second high temperature upper electrode module 8: Inner coil group 9: Outer coil group 10: Thermocouple 11: First hot air ring 12: Hot air input structure 12': Hot air input structure 13: Plug plate adjustment structure 14: Inlet 15: Third output channel 16: Second hot air ring 17: Inlet 18: Third output channel 19: Hot air output structure 19': Hot air output structure 20: First input channel 20': First input channel 21: Second input channel 21': Second input channel 22: Air volume adjustment module 23: Coil bracket 24: Through hole 25: Plug plate 26: Plug plate fixing piece 27: Screw 28: Through hole 29: Through hole 30: Through hole 31: Input structure body 31': Input structure body 32: Output structure body 32': Output structure body 33: First output channel 33': First output channel 34: Second output channel 34': Second output channel

The present disclosure is best understood from the following detailed description when read in conjunction with the accompanying drawings. It should be noted that, in accordance with standard practice in the industry, the various components are not drawn to scale. In fact, the dimensions of the various components may be arbitrarily increased or decreased for clarity of discussion. Figure 1 is a schematic diagram of a hot air system of related technology 1; Figure 2 is a schematic diagram of a hot air system of related technology 2; Figure 3 is a schematic diagram of a hot air input structure of the present invention; Figure 4 is a schematic diagram of a hot air output structure of the present invention; Figure 5 is a schematic diagram of the position of an air volume regulating module of the present invention; Figure 6 is a schematic diagram of the structure of an air volume regulating module of the present invention; Figure 7 is a schematic diagram of a hot air system of a semiconductor process equipment of the present invention; Figure 8 is a schematic diagram of a quarter position adjustment of the present invention; Figure 9 is a schematic diagram of a three-eighth position adjustment of the present invention; Figure 10 is a schematic diagram of a one-eighth position adjustment of the present invention; Figure 11 is a schematic diagram of the structure of an inner hot air ring of the present invention; Figure 12 is a schematic diagram of the structure of a coil support of the present invention.

1: Upper cover

6: The first high temperature upper electrode module

7: Second highest temperature upper electrode module

8: Inner coil assembly

9: Outer coil assembly

10: Thermocouple

11: First hot air ring

12: Hot air input structure

12’: Hot air input structure

13: Plug plate adjustment structure

14: Entrance

15: The third output channel

16: Second hot air ring

17: Entrance

18: The third output channel

19: Hot air output structure

19’: Hot air output structure

Claims (12)

A hot air transfer duct is used in a hot air system of a semiconductor process equipment, wherein the hot air transfer duct includes a hot air input structure and/or a hot air output structure; wherein the hot air input structure includes: an input structure body; a first input channel, located in the input structure body, the inlet of the first input channel is located at one end of the input structure body, the first input channel extends from the inlet to the other end of the input structure body and bends downward, and the outlet of the first input channel is located at the lower side of the input structure body; a second input channel, located in the input structure body and below the first input channel, the inlet of the second input channel is located at the one end of the input structure body, the second input channel extends from the inlet to the other end of the input structure body and bends downward, the distance the second input channel extends to the other end of the input structure body is less than the distance the first input channel extends to the other end of the input structure body, and the outlet of the second input channel is located at the lower side of the input air duct body; and/or The hot air output structure includes: an output structure body; a first output channel, located in the output structure body, the inlet of the first output channel is located at the lower side of the output structure body, and the first output channel extends upward from the inlet; A second output channel is located in the output structure body, the entrance of the second output channel is located at the lower side of the output structure body, and the second output channel extends upward from the entrance; A third output channel is located in the output structure body and is connected to the first output channel and the second output channel, the exit of the third output channel is located at one end of the output structure body, and the distance between the entrance of the first output channel and the end of the output structure body is greater than the distance between the entrance of the second output channel and the end of the output structure body. The hot air transfer duct as described in claim 1 further comprises: An air volume adjustment module, arranged at the one end of the input structure body, for adjusting the air volume input to the first input channel and/or the second input channel. The hot air transfer duct as described in claim 2, wherein the air volume adjustment module comprises: a plug plate fixing member, arranged on the hot air input structure; a plug plate, slidably connected to the plug plate fixing member, to change the size of the entrance of the first input channel and/or the second input channel. A hot air system for semiconductor process equipment, comprising: At least one hot air supply module; At least one pair of hot air transfer ducts as described in any one of claims 1 to 3, the output port of the hot air supply module is connected to the inlet of the first input channel and the inlet of the second input channel of the hot air input structure, and the input port of the hot air supply module is connected to the outlet of the third input channel of the hot air output structure; A first hot air ring, arranged below the hot air transfer duct, the first hot air ring is connected to the outlet of the first input channel of the hot air input structure and the inlet of the first output channel of the hot air output structure respectively; A second hot air ring is arranged around the outer side of the first hot air ring and below the hot air transfer duct. The second hot air ring is connected to the outlet of the second input channel of the hot air input structure and the inlet of the second output channel of the hot air output structure. A hot air system as described in claim 4, wherein the hot air transfer ducts are two pairs, and the two pairs of hot air transfer ducts are arranged opposite to each other; the hot air supply modules are two, and the two hot air supply modules are arranged opposite to each other, each of the hot air supply modules is adjacent to or adjacent to the hot air transfer duct, and the hot air supply modules are located on one side of the two pairs of hot air transfer ducts far away from each other. The hot air system as described in claim 4 further comprises: At least one first temperature sensor, disposed on the first hot air ring; At least one second temperature sensor, disposed on the second hot air ring; When the temperature of the first hot air ring is higher than that of the second hot air ring, the inlet of the first input channel is reduced or the inlet of the second input channel is expanded; or When the temperature of the first hot air ring is lower than that of the second hot air ring, the inlet of the first input channel is expanded or the inlet of the second input channel is reduced. A hot air system as described in claim 5, wherein the first hot air ring includes two first semi-circular cavities, and the upper surface of each of the first semi-circular cavities includes two first openings, and the two first openings are respectively connected to the outlet of the first input channel of the hot air input structure of the hot air transfer duct and the inlet of the first output channel of the hot air output structure; The second hot air ring includes two second semi-circular cavities, and the upper surface of each of the second semi-circular cavities includes two second openings, and the two second openings are respectively connected to the outlet of the second input channel of the hot air input structure of the hot air transfer duct and the inlet of the second output channel of the hot air output structure; and The two first semi-circular cavities and the two second semi-circular cavities are symmetrically arranged. A hot air system as described in claim 7, wherein the two first openings of the first semicircular cavity are respectively disposed at two ends of the first semicircular cavity; The two second openings of the second semicircular cavity are respectively disposed at two ends of the second semicircular cavity. A hot air system as described in claim 4, wherein the hot air supply module is a high-temperature upper electrode module, including a heating wire and an air amplifier connected to each other, the heating wire is arranged at the input port of the hot air supply module; the air amplifier is arranged at the output port of the hot air supply module. A semiconductor process equipment, comprising: A process chamber, comprising a chamber body and an upper cover; A first coil group, arranged on the upper cover; A second coil group, arranged on the upper cover and arranged around the outer side of the first coil group; A hot air system as described in any one of claims 4 to 9, wherein the first hot air ring and the second hot air ring of the hot air system are arranged on the upper cover, the first hot air ring is arranged between the first coil group and the second coil group, and the second hot air ring is arranged between the second coil group and the edge of the upper cover; A coil bracket, arranged above the first coil group and the second coil group and the first hot air ring and the second hot air ring, for fixing the first coil group and the second coil group. A semiconductor processing equipment as described in claim 10, wherein at least four avoidance holes are arranged on the coil support, and all the first openings and the second openings on the first hot air ring and the second hot air ring are arranged in the corresponding avoidance holes. A semiconductor processing equipment as described in claim 10, wherein the semiconductor processing equipment is a plasma processing equipment.

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