TW202413543A - Compositions, films, filters, solid-state imaging devices, image display devices, infrared sensors, camera modules, compounds and infrared absorbers - Google Patents

Abstract

The present invention provides a composition containing a compound represented by formula (1), a curable compound and a solvent, a film using the composition, a filter, a solid-state imaging element, an image display device, an infrared sensor and a camera module, a compound represented by formula (1) and an infrared absorber containing the same.

Description

Composition, film, filter, solid-state imaging element, image display device, infrared sensor, camera module, compound and infrared absorber

The present invention relates to a polymethine compound, a composition containing the polymethine compound, and an infrared absorber. In addition, the present invention relates to a film, a filter, a solid-state imaging element, an image display device, an infrared sensor, and a camera module using the composition containing the polymethine compound.

Solid-state imaging devices that use color images in video cameras, digital cameras, and mobile phones with camera functions are CCDs (charge-coupled devices) or CMOSs (complementary metal oxide semiconductors). These solid-state imaging devices use silicon photodiodes that are sensitive to infrared rays in their light-receiving parts. Therefore, infrared cutoff filters are sometimes set to perform luminosity factor correction.

Infrared cut filters are manufactured using a composition containing an infrared absorber. Polymethine compounds and the like are known as infrared absorbers.

Patent document 1 discloses that an infrared cut filter and the like are manufactured using a composition containing a specific polymethine compound and the like.

[Patent Document 1] International Publication No. 2021/085372

Polymethine compounds tend to have low light resistance. Therefore, there is room for further improvement in the light resistance of a film obtained using a composition containing these compounds.

In addition, regarding the composition containing a polymethine compound, the polymethine compound is aggregated during storage of the composition and aggregates are easily precipitated. When a film is formed using the stored composition, foreign matter is easily generated in the film. Therefore, there is room for further improvement in the storage stability of the composition containing a polymethine compound.

Therefore, the object of the present invention is to provide a composition capable of forming a film having excellent storage stability and excellent light resistance. In addition, the present invention provides a film, a filter, a solid-state imaging element, an image display device, an infrared sensor, a camera module, a compound, and an infrared absorber.

The present invention provides the following contents. <1> A composition comprising a compound represented by formula (1), a curable compound and a solvent, [Chemical formula 1] In formula (1), ^X1 and ^X2 each independently represent an oxygen atom, a sulfur atom, a selenium atom, a tellurium atom or ^-NRX1- , ^RX1 represents a hydrogen atom, a halogen atom, an alkyl group, an aryl group, a heterocyclic group or an acyl group, ^R1 and ^R2 each independently represent an alkyl group, an alkoxy group, an acyl group, an acyloxy group, an alkoxycarbonyl _group , an aryl group, ^a heterocyclic group, ^-SR41 , _-SO2R42 , ^-OSO2R43 or ^{-NR44R45 , R41} to ^R43 each independently represent an alkyl group, an aryl group or a heterocyclic group, ^R44 and ^R45 each independently represent a hydrogen atom, a halogen atom, an alkyl group, an aryl group, a heterocyclic group, an acyl group or an alkoxycarbonyl group, and ^R44 and ^R45 may be linked to form a ring. R ³ to R ⁵ , R ¹¹ to R ¹⁴ , R ²¹ to R ²⁴ , R ³¹ and R ³² each independently represent a hydrogen atom, a halogen atom, a sulfone group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a phosphate group, an alkyl group, an aryl group, a heterocyclic group, an alkoxy group, an acyl group, -SR ⁵¹ , -SO ₂ R ⁵² , -OSO ₂ R ⁵³ or -NR ⁵⁴ R ⁵⁵ , R ⁵¹ to R ⁵³ each independently represent a hydrogen atom, an alkyl group, an aryl group or a heterocyclic group, R ⁵⁴ and R ⁵⁵ each independently represent a hydrogen atom, a halogen atom, an alkyl group, an aryl group, a heterocyclic group, an acyl group or an alkoxycarbonyl group, R ⁵⁴ and R ⁵⁵ may be linked to form a ring, R ³ to R ⁵ , R Adjacent two of R ¹¹ to R ¹⁴ and R ²¹ to R ²⁴ may be linked to each other to form a 5-8 membered ring, R ³¹ and R ³² may be linked to form a 5-8 membered ring, R ¹¹ and R ³¹ may be linked to form a 5-8 membered ring, R ²¹ and R ³² may be linked to form a 5-8 membered ring, m and n each independently represent an integer of 1 to 10, and A ^- represents an anion. <2> The composition as described in <1>, wherein m and n in the above formula (1) are each independently 2 or 3. <3> The composition as described in <1> or <2>, wherein m and n in the above formula (1) are the same integer. <4> The composition as described in any one of <1> to <3>, wherein X ¹ and X ² in the above formula (1) each independently represent an oxygen atom or a sulfur atom. ＜5＞ A composition as described in any one of ＜1＞ to ＜3＞, wherein ^X1 and ^X2 in the above formula (1) are oxygen atoms. ＜6＞ A composition as described in any one of ＜1＞ to ＜5＞, further comprising an infrared absorber other than the compound represented by the above formula (1). ＜7＞ A film obtained using the composition as described in any one of ＜1＞ to ＜6＞. ＜8＞ A filter having the film described in ＜7＞. ＜9＞ A solid-state imaging element having the film described in ＜7＞. ＜10＞ An image display device having the film described in ＜7＞. ＜11＞ An infrared sensor having the film described in ＜7＞. ＜12＞ A camera module having the film described in ＜7＞. ＜13＞ A compound represented by formula (1), [Chemical Formula 2] In formula (1), ^X1 and ^X2 each independently represent an oxygen atom, a sulfur atom, a selenium atom, a tellurium atom or ^-NRX1- , ^RX1 represents a hydrogen atom, a halogen atom, an alkyl group, an aryl group, a heterocyclic group or an acyl group, ^R1 and ^R2 each independently represent an alkyl group, an alkoxy group, an acyl group, an acyloxy group, an alkoxycarbonyl _group , an aryl group, ^a heterocyclic group, ^-SR41 , _-SO2R42 , ^-OSO2R43 or ^{-NR44R45 , R41} to ^R43 each independently represent an alkyl group, an aryl group or a heterocyclic group, ^R44 and ^R45 each independently represent a hydrogen atom, a halogen atom, an alkyl group, an aryl group, a heterocyclic group, an acyl group or an alkoxycarbonyl group, and ^R44 and ^R45 may be linked to form a ring. R ³ to R ⁵ , R ¹¹ to R ¹⁴ , R ²¹ to R ²⁴ , R ³¹ and R ³² each independently represent a hydrogen atom, a halogen atom, a sulfone group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a phosphate group, an alkyl group, an aryl group, a heterocyclic group, an alkoxy group, an acyl group, -SR ⁵¹ , -SO ₂ R ⁵² , -OSO ₂ R ⁵³ or -NR ⁵⁴ R ⁵⁵ , R ⁵¹ to R ⁵³ each independently represent a hydrogen atom, an alkyl group, an aryl group or a heterocyclic group, R ⁵⁴ and R ⁵⁵ each independently represent a hydrogen atom, a halogen atom, an alkyl group, an aryl group, a heterocyclic group, an acyl group or an alkoxycarbonyl group, R ⁵⁴ and R ⁵⁵ may be linked to form a ring, R ³ to R ⁵ , R Adjacent two of ^R11 to ^R14 and ^R21 to ^R24 may be linked to each other to form a 5-8 membered ring, ^R31 and ^R32 may be linked to form a 5-8 membered ring, ^R11 and ^R31 may be linked to form a 5-8 membered ring, ^R21 and ^R32 may be linked to form a 5-8 membered ring, m and n each independently represent an integer of 1 to 10, and ^A- represents an anion. <14> An infrared absorber comprising the compound described in <13>. [Effects of the invention]

According to the present invention, a composition capable of forming a film having excellent storage stability and excellent light resistance can be provided. In addition, the present invention can provide a film, a filter, a solid-state imaging element, an image display device, an infrared sensor, a camera module, a compound, and an infrared absorber.

The content of the present invention is described in detail below. In this specification, "～" is used to mean that the numerical values recorded before and after it are included as lower limits and upper limits. In the marking of groups (atomic groups) in this specification, the markings not marked with substituted and unsubstituted include groups (atomic groups) without substituents and groups (atomic groups) with substituents. For example, "alkyl" includes not only alkyl groups without substituents (unsubstituted alkyl groups) but also alkyl groups with substituents (substituted alkyl groups). In this specification, "exposure" includes not only exposure using light, but also drawing using particle beams such as electron beams and ion beams, unless otherwise specified. In addition, as the light used in the exposure, there can be cited the bright line spectrum of mercury lamp, far ultraviolet light represented by excimer laser, extreme ultraviolet light (EUV light), X-rays, active light or radiation such as electron beams. In this specification, "(meth)acrylate" means both or either acrylate and methacrylate, "(meth)acrylic acid" means both or either acrylic acid and methacrylic acid, and "(meth)acryloyl" means both or either acryl and methacryloyl. In this specification, the weight average molecular weight and the number average molecular weight are defined as polystyrene conversion values measured by gel permeation chromatography (GPC). In this specification, Me in the chemical formula represents methyl, Et represents ethyl, Bu represents butyl, and Ph represents phenyl. In this specification, infrared light means light (electromagnetic wave) with a wavelength of 700 to 2500 nm. In this specification, the total solid content refers to the total mass of the components excluding the solvent from all the components of the composition. In this specification, the term "step" includes not only independent steps, but also steps that achieve the expected effect of the step even if they cannot be clearly distinguished from other steps.

<Composition> The composition of the present invention is characterized by comprising a compound represented by formula (1), a curable compound and a solvent.

The composition of the present invention can form a film having excellent storage stability and in which the generation of foreign matter and the like is suppressed even after long-term storage. In addition, the present invention can form a film having excellent light resistance. The reason for obtaining such an effect can be inferred as follows. That is, it is inferred that the compound represented by formula (1) contained in the composition of the present invention has good compatibility with the solvent or curable compound contained in the composition, and as a result, a composition having excellent storage stability can be formed. In addition, it is inferred that the compound represented by formula (1) has high steric hindrance at the methine site because R ¹ and R ² in formula (1) are alkyl, alkoxy, acyl, acyloxy, aryl, heterocyclic or -NR ⁴¹ R ⁴² , and thus the cleavage of the methine site can be suppressed by light irradiation. Therefore, by using the composition of the present invention, a film having excellent light resistance can be formed.

The composition of the present invention can be used as a composition for an optical filter. Examples of optical filters include infrared cut filters and infrared transmission filters. The compound represented by formula (1) has excellent visible light transmittance and infrared shielding properties, and therefore, the composition of the present invention is particularly preferably used as a composition for an infrared cut filter.

Hereinafter, each component used in the composition of the present invention will be described.

<<Specific compound (compound represented by formula (1))>> The composition of the present invention includes a compound represented by formula (1). The compound represented by formula (1) is also a compound of the present invention. Hereinafter, the compound represented by formula (1) is also referred to as a specific compound.

[Chemical formula 3] In formula (1), ^X1 and ^X2 each independently represent an oxygen atom, a sulfur atom, a selenium atom, a tellurium atom or ^-NRX1- , ^RX1 represents a hydrogen atom, a halogen atom, an alkyl group, an aryl group, a heterocyclic group or an acyl group, ^R1 and ^R2 each independently represent an alkyl group, an alkoxy group, an acyl group, an acyloxy group, an alkoxycarbonyl _group , an aryl group, ^a heterocyclic group, ^-SR41 , _-SO2R42 , ^-OSO2R43 or ^{-NR44R45 , R41} to ^R43 each independently represent an alkyl group, an aryl group or a heterocyclic group, ^R44 and ^R45 each independently represent a hydrogen atom, a halogen atom, an alkyl group, an aryl group, a heterocyclic group, an acyl group or an alkoxycarbonyl group, and ^R44 and ^R45 may be linked to form a ring. R ³ to R ⁵ , R ¹¹ to R ¹⁴ , R ²¹ to R ²⁴ , R ³¹ and R ³² each independently represent a hydrogen atom, a halogen atom, a sulfone group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a phosphate group, an alkyl group, an aryl group, a heterocyclic group, an alkoxy group, an acyl group, -SR ⁵¹ , -SO ₂ R ⁵² , -OSO ₂ R ⁵³ or -NR ⁵⁴ R ⁵⁵ , R ⁵¹ to R ⁵³ each independently represent a hydrogen atom, an alkyl group, an aryl group or a heterocyclic group, R ⁵⁴ and R ⁵⁵ each independently represent a hydrogen atom, a halogen atom, an alkyl group, an aryl group, a heterocyclic group, an acyl group or an alkoxycarbonyl group, R ⁵⁴ and R ⁵⁵ may be linked to form a ring, R ³ to R ⁵ , R Adjacent two of R ¹¹ to R ¹⁴ and R ²¹ to R ²⁴ may be linked to each other to form a 5-8 membered ring, R ³¹ and R ³² may be linked to form a 5-8 membered ring, R ¹¹ and R ³¹ may be linked to form a 5-8 membered ring, R ²¹ and R ³² may be linked to form a 5-8 membered ring, m and n each independently represent an integer of 1 to 10, and A ^- represents an anion.

In formula (1), ^X1 and ^X2 are preferably independently an oxygen atom or a sulfur atom, and more preferably an oxygen atom. According to this aspect, light resistance and storage stability can be further improved. Furthermore, visible transparency and infrared shielding properties can also be improved.

In the formula (1), R ^X1 in -NR ^X1 - represented by ^X1 and ^X2 is preferably a hydrogen atom or an alkyl group.

In formula (1), ^R1 and ^R2 each independently represent an alkyl group, an alkoxy group, an acyl group, an acyloxy group, an alkoxycarbonyl group, an aryl group ^, a ^heterocyclic group, ^-SR41 , _-SO2R42 , _-OSO2R43 or ^-NR44R45 ; ^R41 to ^R43 each independently represent an alkyl group, an ^aryl group or a heterocyclic group; and ^R44 and ^R45 each independently represent a hydrogen atom, a halogen atom, an alkyl group, an aryl group, a heterocyclic group, an acyl group or an alkoxycarbonyl group.

The carbon number of the alkyl group is preferably 1 to 30. The lower limit is preferably 2 or more, and more preferably 3 or more. The upper limit is preferably 20 or less. The alkyl group may be any of a straight chain, a branched chain, and a cyclic group, and a branched chain or a cyclic group is preferred. In addition, the cyclic alkyl group may be a monocyclic cyclic alkyl group or a polycyclic cyclic alkyl group. As specific examples of the alkyl group, there can be mentioned methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, dibutyl, tertiary butyl, n-pentyl, n-hexyl, n-heptyl, n-octyl, n-nonyl, n-decyl, n-undecyl, n-dodecyl, n-tridecayl, n-tetradecyl, n-pentadecayl, n-hexadecyl, n-heptadecyl, n-octadecyl, n-nonadecayl, n-eicosyl, cyclopentyl, cyclobutyl, cyclohexyl, norbornyl, tricyclodecyl, tetracyclododecyl, adamantyl, methyladamantyl, ethyladamantyl, butyladamantyl, etc. The above alkyl groups may have a substituent or may be unsubstituted. As the substituent, there can be mentioned the groups listed in the substituent T described later, preferably a halogen atom, an aryl group or an alkoxy group.

The carbon number of the alkoxy group is preferably 1 to 20, more preferably 1 to 15, and even more preferably 1 to 8. The alkoxy group is preferably a straight chain or a branched chain. The alkoxy group represented by ^R1 and ^R2 may have a substituent or may be unsubstituted. As the substituent, the groups listed in the substituent T described below can be cited, and a halogen atom, an aryl group or an alkoxy group is preferred.

The carbon number of the acyl group, acyloxy group and alkoxycarbonyl group is preferably 2 to 30, more preferably 2 to 15, and even more preferably 2 to 8. The acyl group, acyloxy group and alkoxycarbonyl group may have a substituent or may be unsubstituted. As the substituent, the groups listed in the substituent T described below can be cited, and a halogen atom, an aryl group or an alkoxy group is preferred.

The carbon number of the aryl group is preferably 6 to 30, more preferably 2 to 20, and even more preferably 6 to 12. The aryl group may have a substituent or may be unsubstituted. As the substituent, the groups listed in the substituent T described below can be cited, and a halogen atom, an alkyl group, or an alkoxy group is preferred.

The above-mentioned heterocyclic group is preferably a 5-membered or 6-membered heterocyclic group. Furthermore, the heterocyclic group is preferably a monocyclic heterocyclic group or a condensed heterocyclic group having a condensation number of 2 to 8, and more preferably a monocyclic heterocyclic group or a condensed heterocyclic group having a condensation number of 2 to 4. The hetero atom constituting the heterocyclic group is preferably a nitrogen atom, an oxygen atom or a sulfur atom. The number of hetero atoms constituting the heterocyclic group is preferably 1 to 3, and more preferably 1 to 2. The number of carbon atoms in the ring constituting the heterocyclic group is preferably 1 to 30, more preferably 1 to 18, and even more preferably 1 to 12. The heterocyclic group represented by ^R1 and ^R2 may have a substituent or may be unsubstituted. As the substituent, the groups listed in the substituent T described below can be cited, and a halogen atom, an alkyl group, or an alkoxy group is preferred.

Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom and an iodine atom.

R ⁴⁴ and R ⁴⁵ of the group represented by -NR ⁴⁴ R ⁴⁵ may be linked to form a ring. The formed ring is preferably a 5- to 8-membered ring, more preferably a 5- or 6-membered ring.

From the viewpoint of further improving light resistance, ^R1 and ^R2 in formula (1) are preferably independently an alkyl group or an aryl group, and from the viewpoint of further improving visible transparency, an alkyl group is more preferred.

In formula (1), R ³ to R ⁵ , R ¹¹ to R ¹⁴ , R ²¹ to R ²⁴ , R ³¹ and R ³² each independently represent a hydrogen atom, a halogen atom, a sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a phosphate group, an alkyl group, an aryl group, a heterocyclic group, an alkoxy group, an acyl group, -SR ⁵¹ , -SO ₂ R ⁵² , -OSO ₂ R ⁵³ or -NR ⁵⁴ R ⁵⁵ , R ⁵¹ to R ⁵³ each independently represent a hydrogen atom, an alkyl group, an aryl group or a heterocyclic group, and R ⁵⁴ and R ⁵⁵ each independently represent a hydrogen atom, a halogen atom, an alkyl group, an aryl group, a heterocyclic group, an acyl group or an alkoxycarbonyl group.

The above-mentioned groups represented by R ³ to R ⁵ , R ¹¹ to R ¹⁴ , R ²¹ to R ²⁴ , R ³¹ and R ³² may be the same groups as those described for the groups represented by R ¹ and R ² , and the preferred ranges are the same.

R ⁵⁴ and R ⁵⁵ of the group represented by -NR ⁵⁴ R ⁵⁵ may be linked to form a ring. The formed ring is preferably a 5- to 8-membered ring, more preferably a 5- or 6-membered ring.

In formula (1), R ³ to R ⁵ are each independently a hydrogen atom or an alkyl group, preferably a hydrogen atom.

In the formula (1), R ¹¹ to R ¹⁴ and R ²¹ to R ²⁴ each independently represent a hydrogen atom or an alkyl group.

In formula (1), R ³¹ and R ³² are each independently preferably a hydrogen atom or an alkyl group, and more preferably a hydrogen atom.

In formula (1), two adjacent groups of R ³ to R ⁵ , R ¹¹ to R ¹⁴ , and R ²¹ to R ²⁴ may be linked to each other to form a 5- to 8-membered ring, and R ³¹ and R ³² may be linked to each other to form a 5- to 8-membered ring. The formed ring is preferably a 5- or 6-membered ring. The formed ring may be an aliphatic ring or an aromatic ring. The formed ring is preferably an aromatic ring, and a benzene ring is more preferably. The formed ring may have a substituent. As the substituent, the groups listed in the substituent T described later may be cited, and a halogen atom, an alkyl group, or an aryl group is preferred.

In formula (1), ^R11 and ^R31 may be linked to form a 5- to 8-membered ring, and ^R21 and ^R32 may be linked to form a 5- to 8-membered ring. The formed ring is preferably a 5- or 6-membered ring. The formed ring may have a substituent. As the substituent, the groups listed in the substituent T described below can be cited, and a halogen atom, an alkyl group or an aryl group is preferred.

As a preferred embodiment of R ¹¹ to R ¹⁴ and R ²¹ to R ²⁴ in formula (1), there can be mentioned an embodiment in which R ¹² , R ¹³ , R ²² and R ²³ are each independently an alkyl group and R ¹¹ , R ¹⁴ , R ²¹ and R ²⁴ are a hydrogen atom.

Another preferred embodiment of ^R11 to ^R14 and ^R21 to ^R24 in formula (1) includes an embodiment in which ^R11 and ^R21 are hydrogen atoms, ^R12 and ^R22 are independently alkyl groups, ^R13 and ^R14 are linked to form a benzene ring, and ^R23 and ^R24 are linked to form a benzene ring.

Another preferred embodiment of ^R11 to ^R14 and ^R21 to ^R24 in formula (1) includes an embodiment in which ^R14 and ^R24 are hydrogen atoms, ^R13 and ^R23 are independently alkyl groups, ^R11 and ^R12 are linked to form a benzene ring, and ^R21 and ^R22 are linked to form a benzene ring.

m and n in formula (1) are independently integers of 1 to 10, preferably integers of 1 to 3, more preferably 2 or 3, and even more preferably 2. In addition, m and n in formula (1) are preferably the same integer for the purpose of further improving storage stability and light resistance.

^A- in formula (1) represents an anion. There is no particular limitation on the anion. It may be an organic anion or an inorganic anion. Examples of the anion include anions represented by formula (AN1), anions represented by formula (AN2), anions represented by formula (AN3), anions represented by formula (AN4), anions represented by formula (AN5), fluorine anions, chlorine anions, bromine anions, iodine anions, cyanide anions, perchloric acid anions, carboxylic acid anions, sulfonic acid anions, and phosphoric acid anions. [Chemical Formula 4]

In formula (AN1), R ^AN1 and R ^AN2 each independently represent a halogen atom or an alkyl group, and R ^AN1 and R ^AN2 may be bonded to form a ring; In formula (AN2), R ^AN3 to R ^AN5 each independently represent a halogen atom or an alkyl group, and R ^AN3 and R ^AN4 , R ^AN4 and R ^AN5 , or R ^AN3 and R ^AN5 may be bonded to form a ring; In formula (AN3), R ^AN6 to R ^AN9 each independently represent a halogen atom, an alkyl group, an aryl group, an alkoxy group, an aryloxy group, or a cyano group; In formula (AN4), R ^AN10 represents a halogenated alkyl group that may be linked via a linking group having a nitrogen atom or an oxygen atom; In formula (AN5), R ^AN11 to R ^AN16 each independently represent a halogenated alkyl group.

Examples of the halogen atom represented by R ^AN1 and R ^AN2 of the formula (AN1), the halogen atom represented by R ^AN3 to R ^AN5 of the formula (AN2), and the halogen atom represented by R ^AN6 to R ^AN9 of the formula (AN3) include fluorine atom, chlorine atom, bromine atom and iodine atom, with fluorine atom being preferred.

The alkyl groups represented by R ^AN1 and R ^AN2 of formula (AN1), the alkyl groups represented by R ^AN3 to R ^AN5 of formula (AN2), and the alkyl groups represented by R ^AN6 to R ^AN9 of formula (AN3) preferably have 1 to 10 carbon atoms, more preferably 1 to 6 carbon atoms, and even more preferably 1 to 3 carbon atoms. The alkyl group may be a straight chain, a branched chain, or a ring. A straight chain or a branched chain is preferred, and a straight chain is more preferred. The alkyl group may have a substituent or may be unsubstituted. The alkyl group is preferably an alkyl group having a halogen atom as a substituent, and more preferably an alkyl group having a fluorine atom as a substituent (fluoroalkyl group). Furthermore, the fluoroalkyl group is preferably a perfluoroalkyl group.

The number of carbon atoms in the aryl group represented by R ^AN6 to R ^AN9 in the formula (AN3) is preferably 6 to 20, more preferably 6 to 12, and even more preferably 6. The aryl group may have a substituent or may be unsubstituted. Examples of the substituent include a halogen atom and an alkyl group. As the halogen atom, a fluorine atom is preferred. As the alkyl group, a fluoroalkyl group is preferred.

The carbon number of the alkoxy group represented by R ^AN6 to R ^AN9 in the formula (AN3) is preferably 1 to 10, more preferably 1 to 6, and even more preferably 1 to 3. The alkoxy group may be a straight chain, a branched chain, or a ring. A straight chain or a branched chain is preferred, and a straight chain is more preferred. The alkoxy group may have a substituent or may be unsubstituted. As the substituent, a halogen atom and an alkyl group may be cited. As the halogen atom, a fluorine atom is preferred. As the alkyl group, a fluoroalkyl group is preferred.

The carbon number of the aryloxy group represented by R ^AN6 to R ^AN9 in formula (AN3) is preferably 6 to 20, more preferably 6 to 12, and even more preferably 6. The aryloxy group may have a substituent or may be unsubstituted. Examples of the substituent include a halogen atom and an alkyl group. As the halogen atom, a fluorine atom is preferred. As the alkyl group, a fluoroalkyl group is preferred.

In formula (AN1), R ^AN1 and R ^AN2 may bond to form a ring. In formula (AN2), R ^AN3 and R ^AN4 , R ^AN4 and R ^AN5 , or R ^AN3 and R ^AN5 may bond to form a ring.

R ^AN10 in formula (AN4) represents a halogenated alkyl group which may be linked via a linking group having a nitrogen atom or an oxygen atom. The halogenated alkyl group refers to a monovalent alkyl group substituted by a halogen atom, and a monovalent alkyl group substituted by a fluorine atom is preferred. Examples of the alkyl group include an alkyl group, an aryl group, and the like. The monovalent alkyl group substituted by a halogen atom may further have a substituent. Examples of the linking group having a nitrogen atom or an oxygen atom include -O-, -CO-, -COO-, -CO-NH-, and the like.

R ^AN11 to R ^AN16 in formula (AN5) each independently represents a halogen atom or a halogenated alkyl group. Examples of the halogenated alkyl group include a fluorine atom, a chlorine atom, a bromine atom and an iodine atom, with a fluorine atom being preferred. As the halogenated alkyl group, an alkyl group having a halogen atom as a substituent is preferred, and an alkyl group having a fluorine atom as a substituent is more preferred.

-About substituent T- As substituent T, the following groups can be cited. a halogen atom (e.g., a fluorine atom, a chlorine atom, a bromine atom, an iodine atom), an alkyl group (preferably an alkyl group having 1 to 30 carbon atoms), an alkenyl group (preferably an alkenyl group having 2 to 30 carbon atoms), an alkynyl group (preferably an alkynyl group having 2 to 30 carbon atoms), an aryl group (preferably an aryl group having 6 to 30 carbon atoms), a heterocyclic group (preferably a heterocyclic group having 1 to 30 carbon atoms), an amino group (preferably an amino group having 0 to 30 carbon atoms), an alkoxy group (preferably an alkoxy group having 1 to 30 carbon atoms), an aryloxy group (preferably an aryloxy group having 6 to 30 carbon atoms), a heterocyclicoxy group (preferably a heterocyclicoxy group having 1 to 30 carbon atoms), an acyl group (preferably an acyl group having 2 to 30 carbon atoms), an alkoxycarbonyl group (preferably The present invention is an alkoxycarbonyl group having 2 to 30 carbon atoms), an aryloxycarbonyl group (preferably an aryloxycarbonyl group having 7 to 30 carbon atoms), a heterocyclic oxycarbonyl group (preferably a heterocyclic oxycarbonyl group having 2 to 30 carbon atoms), an acyloxy group (preferably an acyloxy group having 2 to 30 carbon atoms), an amide group (preferably an amide group having 2 to 30 carbon atoms), an aminocarbonylamino group (preferably an aminocarbonylamino group having 2 to 30 carbon atoms), an alkoxycarbonylamino group (preferably an alkoxycarbonylamino group having 2 to 30 carbon atoms), an aryloxycarbonylamino group (preferably an aryloxycarbonylamino group having 7 to 30 carbon atoms), an aminesulfonyl group (preferably an aminesulfonyl group having 0 to 30 carbon atoms), an aminesulfonylamino group (preferably a aminesulfonyl group having 0 to 30 carbon atoms), a aminesulfonylamino group (preferably a aminesulfonyl group having 0 to 30 carbon atoms), a aminesulfonylamino group (preferably a aminesulfonyl group having 0 to 30 carbon atoms), a aminesulfonylamino group (preferably a aminesulfonyl group having 0 to 30 carbon atoms), a aminesulfonylamino group (preferably a aminesulfonylamino ...carbonylamino group (preferably a aminecarbonylamino group having 0 to 30 carbon atoms), a ～30 aminosulfonylamino), carbamoyl (preferably carbamoyl with 1 to 30 carbon atoms), alkylthio (preferably alkylthio with 1 to 30 carbon atoms), arylthio (preferably arylthio with 6 to 30 carbon atoms), heterocyclic thio (preferably heterocyclic thio with 1 to 30 carbon atoms), alkylsulfonyl (preferably ), alkylsulfonylamino (preferably an alkylsulfonylamino having 1 to 30 carbon atoms), arylsulfonyl (preferably an arylsulfonylamino having 6 to 30 carbon atoms), arylsulfonylamino (preferably an arylsulfonylamino having 6 to 30 carbon atoms), heterocyclic sulfonyl (preferably a heterocyclic sulfonyl having 1 to 30 carbon atoms) , heterocyclic sulfonylamine (preferably a heterocyclic sulfonylamine with 1 to 30 carbon atoms), alkylsulfinyl (preferably an alkylsulfinyl with 1 to 30 carbon atoms), arylsulfinyl (preferably an arylsulfinyl with 6 to 30 carbon atoms), heterocyclic sulfinyl (preferably a heterocyclic sulfinyl with 1 to 30 carbon atoms), urea (preferably Preferably, the group is a urea group having 1 to 30 carbon atoms), a hydroxyl group, a nitro group, a carboxyl group, a sulfo group, a phosphate group, a carboxylic acid amide group, a sulfonic acid amide group, an imide group, a phosphino group, a sulfonyl group, a cyano group, an alkylsulfinic acid group, an arylsulfinic acid group, an arylazo group, a heterocyclic azo group, an oxyphosphinyl group, an oxyphosphinyl amine group, a silyl group, a hydrazine group, and an imino group. When these groups are groups that can be further substituted, they may further have substituents. As substituents, the groups described in the above substituent T can be cited.

As specific examples of specific compounds, compounds having the structures shown below can be cited. As specific examples of specific compounds, resonance structures of these compounds can also be cited. In the structural formula shown below, Me is a methyl group, Et is an ethyl group, nPr is an n-propyl group, iPr is an isopropyl group, nBu is an n-butyl group, tBu is a tertiary butyl group, Hex is a hexyl group, Cy is a cyclohexyl group, Ad is an adamantyl group, Ph is a phenyl group, and Ac is an acetyl group.

[Table 1] [Chemical formula 5] [Table 2] [table 3] [Table 4] [table 5]

The maximum absorption wavelength of the specific compound is preferably in the range of 650 to 1500 nm, more preferably in the range of 680 to 1200 nm, and even more preferably in the range of 700 to 1000 nm.

Certain compounds are preferably used as infrared absorbers.

The content of the specific compound (the compound represented by formula (1)) in the total solid content of the composition is preferably 0.1 mass % or more, more preferably 0.5 mass % or more, further preferably 3 mass % or more, and particularly preferably 5 mass % or more. In addition, the upper limit of the content of the infrared absorber is preferably 50 mass % or less, more preferably 40 mass % or less, and further preferably 30 mass % or less. The composition of the present invention may contain only one specific compound or two or more. When containing two or more, the total amount of the specific compounds is preferably within the above range.

＜＜Hardening compound＞＞ The composition of the present invention contains a curing compound. Examples of the curing compound include polymerizable compounds, resins, and the like. The resin may be a non-polymerizable resin (a resin having no polymerizable group) or a polymerizable resin (a resin having a polymerizable group). Examples of the polymerizable group include groups containing ethylenic unsaturated bonds, cyclic ether groups, hydroxymethyl groups, alkoxymethyl groups, and the like. Examples of the group containing ethylenic unsaturated bonds include vinyl, vinylphenyl, (meth)allyl, (meth)acryloyl, (meth)acryloyloxy, (meth)acryloylamide, and the like. (Meth)allyl, (meth)acryloyl, and (meth)acryloyloxy are preferred, and (meth)acryloyloxy is more preferred. Examples of the cyclic ether group include an epoxy group, an oxycyclobutane group, etc., and an epoxy group is preferred.

As the curable compound, it is preferred to use a compound containing at least a resin. Furthermore, when the composition of the present invention is used as a composition for photolithography, it is preferred to use a resin and a polymerizable compound (preferably a polymerizable monomer that is a monomer-type polymerizable compound) as the curable compound, and it is more preferred to use a resin and a polymerizable monomer having a group containing an ethylenic unsaturated bond (monomer-type polymerizable compound).

(Polymerizable compound) As polymerizable compounds, compounds having a group containing an ethylenic unsaturated bond, compounds having a cyclic ether group, compounds having a hydroxymethyl group, compounds having an alkoxymethyl group, etc. can be cited. Compounds having a group containing an ethylenic unsaturated bond can be preferably used as free radical polymerizable compounds. In addition, compounds having a cyclic ether group can be preferably used as cationic polymerizable compounds.

Examples of the resin type polymerizable compound include resins containing repeating units having a polymerizable group.

The molecular weight of the monomer type polymerizable compound (polymerizable monomer) is preferably less than 2000, and more preferably 1500 or less. The lower limit of the molecular weight of the polymerizable monomer is preferably 100 or more, and more preferably 200 or more. The weight average molecular weight (Mw) of the resin type polymerizable compound is preferably 2000 to 2000000. The upper limit of the weight average molecular weight is preferably 1000000 or less, and more preferably 500000 or less. The lower limit of the weight average molecular weight is preferably 3000 or more, and more preferably 5000 or more.

The compound having a group containing an ethylenically unsaturated bond as a polymerizable monomer is preferably a tri- to penta-functional (meth)acrylate compound, and more preferably a tri- to hexa-functional (meth)acrylate compound. As specific examples, there can be cited the compounds described in paragraphs 0095 to 0108 of Japanese Patent Application No. 2009-288705, paragraph 0227 of Japanese Patent Application No. 2013-029760, paragraphs 0254 to 0257 of Japanese Patent Application No. 2008-292970, paragraphs 0034 to 0038 of Japanese Patent Application No. 2013-253224, paragraph 0477 of Japanese Patent Application No. 2012-208494, Japanese Patent Application No. 2017-048367, Japanese Patent No. 6057891, Japanese Patent No. 6031807, and Japanese Patent Application No. 2017-194662, and the contents thereof are incorporated into this specification.

Examples of the compound having a group containing an ethylenic unsaturated bond include dipentatriol tri(meth)acrylate (commercially available as KAYARAD D-330; manufactured by Nippon Kayaku Co., Ltd.), dipentatriol tetra(meth)acrylate (commercially available as KAYARAD D-320; manufactured by Nippon Kayaku Co., Ltd.), dipentatriol penta(meth)acrylate (commercially available as KAYARAD D-310; manufactured by Nippon Kayaku Co., Ltd.), dipentatriol hexa(meth)acrylate (commercially available as KAYARAD DPHA; NK ESTER A-DPH-12E manufactured by Nippon Kayaku Co., Ltd.; SHIN-NAKAMURA CHEMICAL Co., Ltd. Ltd.) and compounds having a structure in which the (meth)acryloyl group of these compounds is bonded via an ethylene glycol and/or propylene glycol residue (for example, commercially available products SR454 and SR499 from SARTOMER Company, Inc.). As the compound having a group containing an ethylenic unsaturated bond, diglycerol EO (ethylene oxide) modified (meth) acrylate (commercially available as M-460; manufactured by TOAGOSEI CO., LTD.), pentaerythritol tetraacrylate (NK ESTER A-TMMT manufactured by SHIN-NAKAMURA CHEMICAL Co., Ltd.), 1,6-hexanediol diacrylate (KAYARAD HDDA manufactured by Nippon Kayaku Co., Ltd.), RP-1040 (manufactured by Nippon Kayaku Co., Ltd.), ARONIX TO-2349 (manufactured by TOAGOSEI CO., LTD.), NK Oligo UA-7200 (manufactured by SHIN-NAKAMURA CHEMICAL Co., Ltd.), 8UH-1006, 8UH-1012 (manufactured by Taisei Fine Chemical Co., Ltd.), LIGHT ACRYLATE POB-A0 (made by KYOEISHA CHEMICAL Co., LTD.), etc.

Furthermore, as the compound having a group containing an ethylenic unsaturated bond, a trifunctional (meth)acrylate compound such as trihydroxymethylpropane tri(meth)acrylate, trihydroxymethylpropane propylene oxide modified tri(meth)acrylate, trihydroxymethylpropane ethylene oxide modified tri(meth)acrylate, isocyanurate ethylene oxide modified tri(meth)acrylate, or pentaerythritol tri(meth)acrylate is also preferably used. Commercially available products of the trifunctional (meth)acrylate compound include ARONIX M-309, M-310, M-321, M-350, M-360, M-313, M-315, M-306, M-305, M-303, M-452, and M-450 (manufactured by TOAGOSEI CO., LTD.), NK ESTER A9300, A-GLY-9E, A-GLY-20E, A-TMM-3, A-TMM-3L, A-TMM-3LM-N, A-TMPT, and TMPT (manufactured by SHIN-NAKAMURA CHEMICAL Co., Ltd.), KAYARAD GPO-303, TMPTA, THE-330, TPA-330, and PET-30 (manufactured by Nippon Kayaku Co., Ltd.).

The compound having a group containing an ethylenically unsaturated bond may further have an acid group such as a carboxyl group, a sulfonic group, or a phosphoric acid group. Examples of commercially available products of such compounds include ARONIX M-305, M-510, M-520, and ARONIX TO-2349 (manufactured by TOAGOSEI CO., LTD.).

As the compound having a group containing an ethylenic unsaturated bond, a compound having a caprolactone structure can also be used. For the compound having a caprolactone structure, reference can be made to paragraphs 0042 to 0045 of Japanese Patent Application Publication No. 2013-253224, which is incorporated into this specification. For example, commercial products DPCA-20, DPCA-30, DPCA-60, and DPCA-120 of Nippon Kayaku Co., Ltd. can be cited as examples of the compound having a caprolactone structure.

As the compound having a group containing an ethylenic unsaturated bond, a compound having a group containing an ethylenic unsaturated bond and an alkoxy group can also be used. Such a compound is preferably a compound having a group containing an ethylenic unsaturated bond and an ethyleneoxy group and/or an alkyloxy group, more preferably a compound having a group containing an ethylenic unsaturated bond and an ethyleneoxy group, and further preferably a tri- to hexa-functional (meth)acrylate compound having 4 to 20 ethyleneoxy groups. Examples of commercially available products include SR-494, a tetrafunctional (meth)acrylate having 4 ethyleneoxy groups manufactured by SARTOMER Company, Inc., and KAYARAD TPA-330, a trifunctional (meth)acrylate having 3 isobutyloxy groups manufactured by Nippon Kayaku Co., Ltd.

As the compound having a group containing an ethylenically unsaturated bond, a polymerizable compound having a fluorene skeleton can also be used. Examples of commercially available products include OGSOL EA-0200 and EA-0300 (a (meth)acrylate monomer having a fluorene skeleton manufactured by Osaka Gas Chemicals Co., Ltd.).

As the compound having a group containing an ethylenically unsaturated bond, it is also preferable to use a compound that does not substantially contain environmentally regulated substances such as toluene. Examples of commercially available products of such a compound include KAYARAD DPHA LT and KAYARAD DPEA-12 LT (manufactured by Nippon Kayaku Co., Ltd.).

As the compound having a cyclic ether group, there can be mentioned a compound having an epoxy group, a compound having an oxetane group, etc., and preferably a compound having an epoxy group. As the compound having an epoxy group, there can be mentioned a compound having 1 to 100 epoxy groups in one molecule. The upper limit of the number of epoxy groups can be set to, for example, 10 or less, or 5 or less. The lower limit of the number of epoxy groups is preferably 2 or more.

The compound having a cyclic ether group may be a low molecular weight compound (e.g., a molecular weight of less than 1000) or a high molecular weight compound (e.g., a molecular weight of 1000 or more, and in the case of a polymer, a weight average molecular weight of 1000 or more). The weight average molecular weight of the cyclic ether group is preferably 200 to 100,000, more preferably 500 to 50,000. The upper limit of the weight average molecular weight is preferably 10,000 or less, more preferably 5,000 or less, and even more preferably 3,000 or less.

As the compound having a cyclic ether group, the compounds described in paragraphs 0034 to 0036 of JP-A-2013-011869, the compounds described in paragraphs 0147 to 0156 of JP-A-2014-043556, the compounds described in paragraphs 0085 to 0092 of JP-A-2014-089408, and the compounds described in JP-A-2017-179172 can also be used.

Examples of commercially available compounds having a cyclic ether group include DENACOL EX-212L, EX-212, EX-214L, EX-214, EX-216L, EX-216, EX-321L, EX-321, EX-850L, EX-850 (all manufactured by Nagase ChemteX Corporation), ADEKA RESIN EP-4000S, EP-4003S, EP-4010S, EP-4011S (all manufactured by ADEKA CORPORATION), NC-2000, NC-3000, NC-7300, XD-1000, EPPN-501, EPPN-502 (all manufactured by ADEKA CORPORATION), CELLOXIDE 2021P, CELLOXIDE 2081, CELLOXIDE 2083, CELLOXIDE 2085, EHPE3150, EPOLEAD PB 3600, PB 4700 (all manufactured by Daicel Corporation), CYCLOMER P ACA 200M, ACA 230AA, ACA Z250, ACA Z251, ACA Z300, ACA Z320 (all manufactured by Daicel Corporation), jER1031S, jER157S65, jER152, jER154, jER157S70 (all manufactured by Mitsubishi Chemical Corporation), ARONE OXETANE OXT-121, OXT-221, OX-SQ, PNOX (all manufactured by TOAGOSEI CO., LTD.), ADEKA GLYCIROL ED-505 (epoxy-containing monomer manufactured by ADEKA CORPORATION), Marproof G-0150M, G-0105SA, G-0130SP, G-0250SP, G-1005S, G-1005SA, G-1010S, G-2050M, G-01100, G-01758 (epoxy-containing polymers manufactured by NOF CORPORATION), OXT-101, OXT-121, OXT-212, OXT-221 (oxycyclobutane-containing monomers manufactured by TOAGOSEI CO., LTD.), OXE-10, OXE-30 (oxycyclobutane-containing monomers manufactured by OSAKA ORGANIC CHEMICAL INDUSTRY LTD.), etc.

As the compound having a hydroxymethyl group (hereinafter, also referred to as a hydroxymethyl compound), there can be mentioned a compound in which a hydroxymethyl group is bonded to a nitrogen atom or a carbon atom forming an aromatic ring. Furthermore, as the compound having an alkoxymethyl group (hereinafter, also referred to as an alkoxymethyl compound), there can be mentioned a compound in which an alkoxymethyl group is bonded to a nitrogen atom or a carbon atom forming an aromatic ring. As the compound in which an alkoxymethyl group or a hydroxymethyl group is bonded to a nitrogen atom, alkoxymethylated melamine, hydroxymethylated melamine, alkoxymethylated benzoguanamine, hydroxymethylated benzoguanamine, alkoxymethylated glycoluril, hydroxymethylated glycoluril, alkoxymethylated urea, and hydroxymethylated urea are preferred. Furthermore, compounds described in paragraphs 0134 to 0147 of JP-A-2004-295116 and paragraphs 0095 to 0126 of JP-A-2014-089408 can also be used.

(Resin) The composition of the present invention can use a resin as a curable compound. It is preferred that the curable compound contains at least a resin. The resin is formulated, for example, for the purpose of dispersing a pigment in a composition or for the purpose of an adhesive. Furthermore, a resin mainly used for dispersing a pigment in a composition is also referred to as a dispersant. However, this use of the resin is an example, and the resin can also be used for purposes other than this use. Furthermore, a resin having a polymerizable group is also equivalent to a polymerizable compound.

The weight average molecular weight of the resin is preferably 3,000 to 2,000,000. The upper limit is preferably 1,000,000 or less, more preferably 500,000 or less, and the lower limit is preferably 4,000 or more, more preferably 5,000 or more.

Examples of the resin include (meth)acrylic resins, epoxy resins, ene-thiol resins, polycarbonate resins, polyether resins, polyarylate resins, polysulfide resins, polyethersulfide resins, polyphenylene resins, polyarylether phosphine oxide resins, polyimide resins, polyamide resins, polyamideimide resins, polyolefin resins, cycloolefin resins, polyester resins, styrene resins, vinyl acetate resins, polyvinyl alcohol resins, polyvinyl acetal resins, polyurethane resins, polyurea resins, etc. These resins may be used alone or in combination of two or more. As a cycloolefin hydrocarbon resin, from the perspective of improving heat resistance, norbornene resin is preferred. As commercially available products of norbornene resins, for example, the ARTON series manufactured by JSR Corporation (for example, ARTON F4520) and the like can be cited. In addition, as the resin, the resin described in paragraphs 0091 to 0099 of International Publication No. 2022/065215, the blocked polyisocyanate resin described in Japanese Patent Gazette No. 2016-222891, the resin described in Japanese Patent Gazette No. 2020-122052, and the resin described in Japanese Patent Gazette No. 2020-11165 can also be used. A resin described in Japanese Patent Publication No. 6, a resin described in Japanese Patent Publication No. 2020-139021, a resin containing a structural unit having a ring structure in the main chain and a structural unit having a biphenyl group in the side chain described in Japanese Patent Publication No. 2017-138503, paragraphs 0199 to 0233 of Japanese Patent Publication No. 2020-186373 The resin described in , the alkali-soluble resin described in Japanese Patent Publication No. 2020-186325, the resin represented by Formula 1 described in Korean Patent Publication No. 10-2020-0078339, the copolymer containing an epoxy group and an acid group described in International Publication No. 2022/030445, Japanese Patent Publication No. 2020-1 The resin described in paragraphs 0199 to 0233 of the Gazette of 86373, the alkali-soluble resin described in the Gazette of Japanese Patent No. 2020-186325, the resin represented by Formula 1 described in the Gazette of Korean Patent No. 10-2020-0078339, and the resin described in the Gazette of Japanese Patent No. 2021-134350. In addition, as a resin, a resin having a fluorene skeleton can also be preferably used. As a resin having a fluorene skeleton, a resin described in the specification of U.S. Patent Application Publication No. 2017/0102610 can be cited.

As the resin, it is preferred to use a resin having an acid group. As the acid group, for example, a carboxyl group, a phosphoric acid group, a sulfonic group, a phenolic hydroxyl group, etc. can be cited. Such acid groups can be only one kind, or can be two or more kinds. The resin having an acid group can also be used as a dispersant. The acid value of the resin having an acid group is preferably 30 to 500 mgKOH/g. The lower limit is preferably 50 mgKOH/g or more, and 70 mgKOH/g or more is more preferred. The upper limit is preferably 400 mgKOH/g or less, 200 mgKOH/g or less is more preferred, 150 mgKOH/g or less is further preferred, and 120 mgKOH/g or less is the best.

As the resin, a resin having a polymerizable group is also preferably used. The polymerizable group is preferably a group containing an ethylenic unsaturated bond and a cyclic ether group, and more preferably a group containing an ethylenic unsaturated bond.

The resin preferably includes a resin as a dispersant. As the dispersant, an acidic dispersant (acidic resin) and an alkaline dispersant (alkaline resin) can be cited. Here, the acidic dispersant (acidic resin) refers to a resin in which the amount of acid groups is greater than the amount of alkaline groups. As the acidic dispersant (acidic resin), when the total amount of the amount of acid groups and the amount of alkaline groups is set to 100 mol%, a resin in which the amount of acid groups is 70 mol% or more is preferred. The acid group possessed by the acidic dispersant (acidic resin) is preferably a carboxyl group. The acid value of the acidic dispersant (acidic resin) is preferably 10 to 105 mgKOH/g. In addition, an alkaline dispersant (alkaline resin) refers to a resin in which the amount of alkaline groups is greater than the amount of acidic groups. As an alkaline dispersant (alkaline resin), when the total amount of acidic groups and alkaline groups is set to 100 mol%, a resin in which the amount of alkaline groups exceeds 50 mol% is preferred. The alkaline groups possessed by the alkaline dispersant are preferably amine groups.

The resin used as the dispersant is preferably a grafted resin. For details of the grafted resin, reference can be made to paragraphs 0025 to 0094 of Japanese Patent Application Laid-Open No. 2012-255128, which is incorporated herein by reference.

The resin used as the dispersant is preferably a polyimine-based dispersant containing nitrogen atoms in at least one of the main chain and the side chain. As the polyimine-based dispersant, a resin having a main chain and a side chain and having a basic nitrogen atom in at least one of the main chain and the side chain is preferred, the main chain containing a partial structure having a functional group with a pKa of 14 or less, and the number of atoms in the side chain is 40 to 10,000. There is no particular limitation on the basic nitrogen atom as long as it is alkaline. The polyimine-based dispersant can be described in paragraphs 0102 to 0166 of Japanese Patent Application Publication No. 2012-255128, and the content is incorporated into this specification.

The resin used as the dispersant is preferably a resin having a structure in which a plurality of polymer chains are bonded to the core. Examples of such resins include dendritic polymers (including star polymers). Specific examples of dendritic polymers include polymer compounds C-1 to C-31 described in paragraphs 0196 to 0209 of Japanese Patent Application Publication No. 2013-043962.

The resin used as the dispersant is also preferably a resin containing repeating units having a group containing an ethylenically unsaturated bond in the side chain. The content of the repeating units having a group containing an ethylenically unsaturated bond in the side chain is preferably 10 mol% or more, more preferably 10 to 80 mol%, and even more preferably 20 to 70 mol% in all the repeating units of the resin.

As the dispersant, the resin described in Japanese Patent Publication No. 2018-087939, the block copolymers (EB-1) to (EB-9) described in paragraphs 0219 to 0221 of Japanese Patent Publication No. 6432077, the polyethyleneimine having a polyester side chain described in International Publication No. 2016/104803, the block copolymer described in International Publication No. 2019/125940, the block polymer having an acrylamide structural unit described in Japanese Patent Publication No. 2020-066687, the block polymer having an acrylamide structural unit described in Japanese Patent Publication No. 2020-066688, etc. can also be used.

Dispersants can also be obtained as commercial products, and specific examples thereof include DISPERBYK series manufactured by BYK-Chemie GmbH, SOLSPERSE series manufactured by Japan Lubrizol Corporation, Efka series manufactured by BASF, and Ajispar series manufactured by Ajinomoto Fine-Techno Co., Inc. In addition, the product described in paragraph 0129 of Japanese Patent Application Publication No. 2012-137564 and the product described in paragraph 0235 of Japanese Patent Application Publication No. 2017-194662 can also be used as the dispersant.

The content of the curable compound in the total solid content of the composition is preferably 1 to 95 mass %. The lower limit is preferably 2 mass % or more, more preferably 5 mass % or more, further preferably 7 mass % or more, and particularly preferably 10 mass % or more. The upper limit is preferably 94 mass % or less, more preferably 90 mass % or less, further preferably 85 mass % or less, and particularly preferably 80 mass % or less.

When the composition of the present invention contains a polymerizable compound as a curable compound, the content of the polymerizable compound in the total solid content of the composition is preferably 1 to 85 mass %. The lower limit is preferably 2 mass % or more, more preferably 3 mass % or more, and even more preferably 5 mass % or more. The upper limit is preferably 80 mass % or less, and more preferably 70 mass % or less.

When the composition of the present invention contains a polymerizable monomer as a curable compound, the content of the polymerizable monomer in the total solid content of the composition is preferably 1 to 50 mass %. The lower limit is preferably 2 mass % or more, more preferably 3 mass % or more, and even more preferably 5 mass % or more. The upper limit is preferably 30 mass % or less, and more preferably 20 mass % or less.

When the composition of the present invention contains a compound having a group containing an ethylenically unsaturated bond as a curable compound, the content of the compound having a group containing an ethylenically unsaturated bond in the total solid content of the composition is preferably 1 to 70% by mass. The lower limit is preferably 2% by mass or more, more preferably 3% by mass or more, and even more preferably 5% by mass or more. The upper limit is preferably 65% by mass or less, and more preferably 60% by mass or less.

When the composition of the present invention contains a compound having a cyclic ether group as a curable compound, the content of the compound having a cyclic ether group in the total solid content of the composition is preferably 1 to 95% by mass. The lower limit is preferably 2% by mass or more, more preferably 3% by mass or more, and even more preferably 5% by mass or more. The upper limit is preferably 80% by mass or less, more preferably 70% by mass or less, and even more preferably 60% by mass or less.

When the composition of the present invention contains a resin as a curable compound, the content of the resin in the total solid content of the composition is preferably 1 to 85 mass %. The lower limit is preferably 2 mass % or more, more preferably 5 mass % or more, even more preferably 7 mass % or more, and particularly preferably 10 mass % or more. The upper limit is preferably 80 mass % or less, more preferably 75 mass % or less, even more preferably 70 mass % or less, and particularly preferably 40 mass % or less.

When the composition of the present invention contains a resin as a dispersant, the content of the resin as a dispersant in the total solid content of the composition is preferably 0.1 to 40 mass %. The upper limit is preferably 25 mass % or less, and 20 mass % or less is further preferably. The lower limit is preferably 0.5 mass % or more, and 1 mass % or more is further preferably. In addition, the content of the resin as a dispersant is preferably 1 to 100 mass parts relative to 100 mass parts of the pigment. The upper limit is preferably 80 mass parts or less, and 75 mass parts or less is more preferably. The lower limit is preferably 2.5 mass parts or more, and 5 mass parts or more is more preferably.

The composition of the present invention may contain only one curable compound or may contain two or more curable compounds. When containing two or more curable compounds, the total amount thereof is preferably within the above range.

<<Solvent>> The composition of the present invention contains a solvent. As the solvent, water and organic solvents can be cited, and organic solvents are preferred. As the organic solvent, ester solvents, ketone solvents, alcohol solvents, amide solvents, ether solvents, hydrocarbon solvents, etc. can be cited. For details of the above, reference can be made to paragraph 0223 of International Publication No. 2015/166779, which is incorporated into this specification. In addition, cyclic alkyl-substituted ester solvents and cyclic alkyl-substituted ketone solvents can also be preferably used. Specific examples of the organic solvent include polyethylene glycol monomethyl ether, dichloromethane, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, ethyl celulose acetate, ethyl lactate, diethylene glycol dimethyl ether, butyl acetate, methyl 3-methoxypropionate, 2-heptanone, 2-pentanone, 3-pentanone, 4-heptanone, cyclohexanone, 2-methylcyclohexanone, 3-methylcyclohexanone, 4-methylcyclohexanone, cycloheptanone, cyclooctanone, cyclohexyl acetate, cyclopentanone, ethyl carbitol acetate, butyl carbitol acetate, propylene glycol monomethyl ether, Propylene glycol monomethyl ether acetate, 3-methoxy-N,N-dimethylpropionamide, 3-butoxy-N,N-dimethylpropionamide, propylene glycol diacetate, 3-methoxybutanol, methyl ethyl ketone, γ-butyrolactone, cyclobutane, anisole, 1,4-diethoxybutane, diethylene glycol monoethyl ether acetate, 1,3-butanediol diacetate, dipropylene glycol methyl ether acetate, diacetone alcohol (also known as 4-hydroxy-4-methyl-2-pentanone), 2-methoxypropyl acetate, 2-methoxy-1-propanol, isopropyl alcohol, etc. However, sometimes for environmental reasons, it is better to reduce the amount of aromatic hydrocarbons (benzene, toluene, xylene, ethylbenzene, etc.) used as organic solvents (for example, relative to the total amount of organic solvents, it can be set to less than 50 mass ppm (parts per million), can be set to less than 10 mass ppm, and can also be set to less than 1 mass ppm).

In the present invention, it is preferred to use an organic solvent with a low metal content. For example, the metal content of the organic solvent is preferably 10 ppb (parts per billion) or less. An organic solvent with a mass ppt (parts per trillion) level can be used as needed. Such an organic solvent is provided, for example, by Toyo Gosei Co., Ltd. (Chemical Industry Daily, November 13, 2015).

As a method for removing impurities such as metals from an organic solvent, for example, distillation (molecular distillation, thin film distillation, etc.) or filtration using a filter can be cited. The pore size of the filter used for filtration is preferably 10 μm or less, more preferably 5 μm or less, and even more preferably 3 μm or less. The material of the filter is preferably polytetrafluoroethylene, polyethylene or nylon.

The organic solvent may contain isomers (compounds having the same atomic number but different structures). The isomers may contain only one type or may contain a plurality of types.

The content of peroxide in the organic solvent is preferably 0.8 mmol/L or less, and it is more preferred that the organic solvent contains substantially no peroxide.

The content of the solvent in the composition is preferably 10 to 97% by mass. The lower limit is preferably 30% by mass or more, more preferably 40% by mass or more, further preferably 50% by mass or more, further preferably 60% by mass or more, and particularly preferably 70% by mass or more. The upper limit is preferably 96% by mass or less, and more preferably 95% by mass or less. The composition may contain only one solvent or two or more. When two or more solvents are included, the total amount thereof is preferably within the above range.

＜＜Other infrared absorbers＞＞ The composition of the present invention can contain infrared absorbers (other infrared absorbers) other than the above-mentioned specific compounds. By further containing other infrared absorbers, a film capable of shielding infrared rays in a wider wavelength range can be formed. Other infrared absorbers can be dyes or pigments (particles). As other infrared absorbers, pyrrolopyrrole compounds, polymethine compounds, squarylene compounds, phthalocyanine compounds, naphthalocyanine compounds, quaterrylene compounds, merocyanine compounds, crotonium compounds, oxocyanine compounds, ammonium compounds, dithiol compounds, triarylmethane compounds, pyrrole methylene compounds, azomethine compounds, anthraquinone compounds, dibenzofuranone compounds, dithiolene metal complexes, metal oxides, metal borides, etc. are cited. At least one selected from squarylene compounds and phthalocyanine compounds is preferred.

Examples of the pyrrolopyrrole compound include compounds described in paragraphs 0016 to 0058 of JP-A-2009-263614, compounds described in paragraphs 0037 to 0052 of JP-A-2011-068731, and compounds described in paragraphs 0010 to 0033 of International Publication No. 2015/166873. Examples of the squarylium compound include the compounds described in paragraphs 0044 to 0049 of Japanese Patent Publication No. 2011-208101, the compounds described in paragraphs 0060 to 0061 of Japanese Patent Publication No. 6065169, the compounds described in paragraph 0040 of International Publication No. 2016/181987, the compounds described in Japanese Patent Publication No. 2015-176046, the compounds described in paragraph 0072 of International Publication No. 2016/190162. Compounds described in paragraphs 0196 to 0228 of Japanese Patent Application Publication No. 2016-074649, compounds described in paragraph 0124 of Japanese Patent Application Publication No. 2017-067963, compounds described in International Publication No. 2017/135359, compounds described in Japanese Patent Application Publication No. 2017-114956, compounds described in Japanese Patent Application No. 6197940, compounds described in International Publication No. 2016/120166, etc. Examples of the polymethine compound include compounds described in paragraphs 0044 to 0045 of Japanese Patent Application Publication No. 2009-108267, compounds described in paragraphs 0026 to 0030 of Japanese Patent Application Publication No. 2002-194040, compounds described in Japanese Patent Application Publication No. 2015-172004, compounds described in Japanese Patent Application Publication No. 2015-172102. Compounds described in Japanese Patent Publication No. 2008-088426, compounds described in paragraph 0090 of International Publication No. 2016/190162, compounds described in Japanese Patent Publication No. 2017-031394, compounds described in Japanese Patent Publication No. 2021-134350, compounds described in International Publication No. 2021/085372, etc. As the crotonium compound, the compound described in Japanese Patent Publication No. 2017-082029 can be cited. Examples of the ammonium compound include compounds described in JP-A-2008-528706, compounds described in JP-A-2012-012399, compounds described in JP-A-2007-092060, and compounds described in paragraphs 0048 to 0063 of International Publication No. 2018/043564. Phthalocyanine compounds include compounds described in paragraph 0093 of Japanese Patent Application Laid-Open No. 2012-077153, titanium phthalocyanine described in Japanese Patent Application Laid-Open No. 2006-343631, compounds described in paragraphs 0013 to 0029 of Japanese Patent Application Laid-Open No. 2013-195480, vanadium phthalocyanine compounds described in Japanese Patent Application Laid-Open No. 6081771, and compounds described in International Publication No. 2020/071470. Naphthalocyanine compounds include compounds described in paragraph 0093 of Japanese Patent Application Laid-Open No. 2012-077153. Disulfide metal complexes include compounds described in Japanese Patent Application Laid-Open No. 5733804. As metal oxides, for example, indium tin oxide, antimony tin oxide, zinc oxide, Al-doped zinc oxide, fluorine-doped tin dioxide, niobium-doped titanium dioxide, tungsten oxide, etc. can be cited. For details of tungsten oxide, reference can be made to paragraph 0080 of Japanese Patent Publication No. 2016-006476, which is incorporated into this specification. As metal borides, titanium boride, etc. can be cited. As commercial products of titanium boride, LaB ₆ -F (manufactured by Japan New Metals Co., Ltd.) can be cited. In addition, as metal borides, compounds described in International Publication No. 2017/119394 can also be used. Examples of commercially available indium tin oxide include F-ITO (manufactured by DOWA HIGHTECH CO., LTD.).

As the infrared absorber, the squaryl cyanine compound described in Japanese Patent Publication No. 2017-197437, the squaryl cyanine compound described in Japanese Patent Publication No. 2017-025311, the squaryl cyanine compound described in International Publication No. 2016/154782, the squaryl cyanine compound described in Japanese Patent No. 5884953, and the squaryl cyanine compound described in Japanese Patent No. 6036689 can also be used. , the squarylium cyanine compound described in Japanese Patent No. 5810604, the squarylium cyanine compound described in paragraphs 0090 to 0107 of International Publication No. 2017/213047, the pyrrole ring-containing compound described in paragraphs 0019 to 0075 of Japanese Patent Publication No. 2018-054760, the pyrrole ring-containing compound described in paragraphs 0078 to 0082 of Japanese Patent Publication No. 2018-040955, the Japanese Patent Publication No. The pyrrole ring-containing compound described in paragraphs 0043 to 0069 of the Japanese Patent Publication No. 2018-002773, the squarylium compound having an aromatic ring at the amide α position described in paragraphs 0024 to 0086 of the Japanese Patent Publication No. 2018-041047, the amide-linked squarylium compound described in Japanese Patent Publication No. 2017-179131, the pyrrole bi-type squarylium compound described in Japanese Patent Publication No. 2017-141215 Compounds having a carboxycyanine skeleton or a crotonium skeleton, dihydrocarbazole bis-type squarylium compounds described in Japanese Patent Application Laid-Open No. 2017-082029, asymmetric compounds described in paragraphs 0027 to 0114 of Japanese Patent Application Laid-Open No. 2017-068120, pyrrole ring-containing compounds (carbazole type) described in Japanese Patent Application Laid-Open No. 2017-067963, phthalocyanine compounds described in Japanese Patent Application No. 6251530, etc.

_As another infrared absorber _, tungsten oxide represented by the following formula described in paragraph 0025 of the specification of European Patent No. 3628645 can also be used. ^M1aM2bWcOd ₍ P(O) _nRm ) ^eM1 and ^M2 represent _ammonium cations or metal cations, _a is 0.01 to 0.5, b is 0 to 0.5, c is 1, d is 2.5 to 3, _e is 0.01 to 0.75, n is 1, 2 or 3, m is 1, 2 or 3, and ^R represents a hydrocarbon group which may have a substituent.

The content of other infrared absorbers is preferably 1 to 100 parts by mass, preferably 3 to 60 parts by mass, and more preferably 5 to 40 parts by mass relative to 100 parts by mass of the above-mentioned specific compound. The total content of the above-mentioned specific compound and other infrared absorbers in the total solid content of the composition is preferably 1% by mass or more, more preferably 3% by mass or more, and more preferably 5% by mass or more. The upper limit of the above-mentioned total content is preferably 50% by mass or less, more preferably 40% by mass or less, and more preferably 30% by mass or less.

＜＜Pigment derivative＞＞ The composition of the present invention can contain a pigment derivative. The pigment derivative can be used as a dispersing aid. A dispersing aid refers to a material used to improve the dispersibility of a pigment in a composition.

As the pigment derivative, there can be cited a compound having at least one structure selected from the group consisting of a pigment structure and a tribasic structure and an acid group or a base group.

Examples of the pigment structure include a squarylium pigment structure, a pyrrolopyrrole pigment structure, a diketopyrrolopyrrole pigment structure, a quinacridone pigment structure, an anthraquinone pigment structure, a dianthraquinone pigment structure, a benzisoindole pigment structure, a thiazolidine indigo pigment structure, an azo pigment structure, a quinoline yellow pigment structure, a phthalocyanine pigment structure, a naphthalocyanine pigment structure, a dithiazolidine pigment structure, and a perylene pigment structure. , purple ring ring pigment structure, benzimidazolone pigment structure, benzothiazole pigment structure, benzimidazole pigment structure and benzophenone pigment structure, squarylium pigment structure, pyrrolopyrrole pigment structure, diketopyrrolopyrrole pigment structure, phthalocyanine pigment structure, quinacridone pigment structure and benzimidazolone pigment structure are preferred, and squarylium pigment structure and pyrrolopyrrole pigment structure are more preferred.

Examples of the acid group possessed by the pigment derivative include carboxyl, sulfonic, phosphoric, boric, carboxylic acid amide, sulfonic acid amide, imidic acid and salts thereof. Examples of atoms or atomic groups constituting the salt include alkaline metal ions (Li ⁺ , Na ⁺ , K ⁺ , etc.), alkaline earth metal ions (Ca ²⁺ , Mg ²⁺ , etc.), ammonium ions, imidazolium ions, pyridinium ions, phosphonium ions, etc. As the carboxylic acid amide group, a group represented by -NHCOR ^y1 is preferred. As the sulfonic acid amide group, a group represented by -NHSO ₂ R ^y2 is preferred. As the imidic acid group, a group represented by -SO ₂ NHSO ₂ R ^y3 , -CONHSO ₂ R ^y4 , -CONHCOR ^y5 or -SO ₂ NHCOR ^y6 is preferred, and -SO ₂ NHSO ₂ R ^y3 is more preferred. R ^y1 to R ^y6 each independently represent an alkyl group or an aryl group. The alkyl group and aryl group represented by R ^y1 to R ^y6 may have a substituent. As the substituent, a halogen atom is preferred, and a fluorine atom is more preferred.

Examples of the base group of the pigment derivative include amino groups, pyridyl groups and their salts, ammonium salts, and phthalimide methyl groups. Examples of the atom or atom group constituting the salt include hydroxide ions, halogen ions, carboxylic acid ions, sulfonic acid ions, and phenoxy ions.

Specific examples of pigment derivatives include the compounds described in paragraphs 0037 to 0054 of International Publication No. 2016/035695, the compounds described in paragraphs 0061 to 0086 of International Publication No. 2017/146092, the compounds described in paragraphs 0017 to 0068 of International Publication No. 2018/230387, and the compounds described in paragraphs 0085 to 0086 of International Publication No. 2020/054718. The compounds described in paragraph 099 of International Publication No. 2020/054718, the compounds described in paragraph 0124 of International Publication No. 2022/085485, the benzimidazolone compounds or salts thereof described in Japanese Patent Application Publication No. 2018-168244, and the compounds having an isoindoline skeleton of the general formula (1) described in Japanese Patent No. 6996282.

The content of the pigment derivative is preferably 1 to 50 parts by mass relative to 100 parts by mass of the pigment. The lower limit is preferably 3 parts by mass or more, and more preferably 5 parts by mass or more. The upper limit is preferably 40 parts by mass or less, and more preferably 30 parts by mass or less. Only one type of the pigment derivative may be used, or two or more types may be used. When two or more types are used, the total amount is preferably within the above range.

<<Photopolymerization initiator>> When the composition of the present invention contains a polymerizable compound, it is preferred that the composition of the present invention further contains a photopolymerization initiator. The photopolymerization initiator is not particularly limited and can be appropriately selected from known photopolymerization initiators. For example, a compound having photosensitivity to light in the ultraviolet region to the visible region is preferred. The photopolymerization initiator is preferably a photoradical polymerization initiator.

As the photopolymerization initiator, there can be mentioned halogenated hydrocarbon derivatives (for example, compounds having a trioxane skeleton, compounds having a diazole skeleton, etc.), acylphosphine compounds, hexaarylbisimidazole compounds, oxime compounds, organic peroxides, sulfur compounds, ketone compounds, aromatic onium salts, α-hydroxyketone compounds, α-aminoketone compounds, etc. From the viewpoint of exposure sensitivity, the photopolymerization initiator is preferably a trihalomethyl trioxane compound, a benzyl dimethyl ketal compound, an α-hydroxy ketone compound, an α-amino ketone compound, an acyl phosphine compound, a phosphine oxide compound, a metallocene compound, an oxime compound, a hexaarylbisimidazole compound, an onium compound, a benzothiazole compound, a benzophenone compound, an acetophenone compound, a cyclopentadiene-benzene-iron complex, a halogenated methyl oxadiazole compound, and a 3-aryl substituted coumarin compound. A compound selected from the group consisting of an oxime compound, an α-hydroxy ketone compound, an α-amino ketone compound, and an acyl phosphine compound is more preferred, and an oxime compound is further preferred. In addition, as the photopolymerization initiator, there can be cited the compounds described in paragraphs 0065 to 0111 of Japanese Patent Publication No. 2014-130173, the compounds described in Japanese Patent Publication No. 6301489, the peroxide-based photopolymerization initiator described in MATERIAL STAGE 37 to 60p, vol. 19, No. 3, 2019, the photopolymerization initiator described in International Publication No. 2018/221177, the photopolymerization initiator described in International Publication No. 2018/110179, the photopolymerization initiator described in Japanese Patent Publication No. 2019-043864, and the photopolymerization initiator described in Japanese Patent Publication No. 2019 -044030, the peroxide-based initiator described in Japanese Patent Publication No. 2019-167313, the aminoacetophenone-based initiator having an oxazolidinyl group described in Japanese Patent Publication No. 2020-055992, the oxime-based photopolymerization initiator described in Japanese Patent Publication No. 2013-190459, the The polymer described in the publication No. 72619, the compound represented by formula 1 described in International Publication No. 2020/152120, the compound described in Japanese Patent Publication No. 2021-181406, the photopolymerization initiator described in Japanese Patent Publication No. 2022-013379, the compound represented by formula (1) described in Japanese Patent Publication No. 2022-015747 Compounds, fluorinated fluorine oxime ester-based photoinitiators described in Japanese Patent Publication No. 2021-507058, initiators described in the specification of Chinese Patent Application Publication No. 110764367, initiators described in Japanese Patent Publication No. 2022-518535, initiators described in International Publication No. 2021/175855, etc., the contents of which are incorporated into this specification.

Specific examples of the hexaarylbiimidazole compound include 2,2',4-tris(2-chlorophenyl)-5-(3,4-dimethoxyphenyl)-4,5-diphenyl-1,1'-biimidazole and the like.

Examples of commercially available α-hydroxyketone compounds include Omnirad 184, Omnirad 1173, Omnirad 2959, and Omnirad 127 (all manufactured by IGM Resins B.V.), Irgacure 184, Irgacure 1173, Irgacure 2959, and Irgacure 127 (all manufactured by BASF). Examples of commercially available α-aminoketone compounds include Omnirad 907, Omnirad 369, Omnirad 369E, and Omnirad 379EG (all manufactured by IGM Resins B.V.), Irgacure 907, Irgacure 369, Irgacure 369E, and Irgacure 379EG (all manufactured by BASF). Examples of commercially available acylphosphine compounds include Omnirad 819 and Omnirad TPO (both manufactured by IGM Resins B.V.), Irgacure 819 and Irgacure TPO (both manufactured by BASF).

Examples of the oxime compound include compounds described in paragraph 0142 of International Publication No. 2022/085485, compounds described in Japanese Patent No. 5430746, compounds described in Japanese Patent No. 5647738, compounds represented by the general formula (1) or compounds described in paragraphs 0022 to 0024 of Japanese Patent Application Laid-Open No. 2021-173858, and compounds represented by the general formula (1) or compounds described in paragraphs 0117 to 0120 of Japanese Patent Application Laid-Open No. 2021-170089. Specific examples of the oxime compound include 3-benzoyloxyiminobutan-2-one, 3-acetyloxyiminobutan-2-one, 3-propionyloxyiminobutan-2-one, 2-acetyloxyiminopentan-3-one, 2-acetyloxyimino-1-phenylpropan-1-one, 2-benzoyloxyimino-1-phenylpropan-1-one, 3-(4-toluenesulfonyloxy)iminobutan-2-one, 2-ethoxycarbonyloxyimino-1-phenylpropan-1-one, and the like, and 1-[4-(phenylthio)phenyl]-3-cyclohexane-propane-1,2-dione-2-(O-acetyl oxime). As commercial products, Irgacure OXE01, Irgacure OXE02, Irgacure OXE03, Irgacure OXE04 (all manufactured by BASF), TR-PBG-301, TR-PBG-304, TR-PBG-327 (manufactured by TRONLY), Adeka Optomer N-1919 (manufactured by ADEKA CORPORATION, photopolymerization initiator 2 described in Japanese Patent Publication No. 2012-014052). In addition, as the oxime compound, it is also preferable to use a compound without coloring or a compound with high transparency and low color change. As commercial products, ADEKA ARKLS NCI-730, NCI-831, NCI-930 (all manufactured by ADEKA CORPORATION) and the like can be cited.

As the photopolymerization initiator, an oxime compound having a fluorene ring, an oxime compound having a carbazole ring in which at least one benzene ring is a naphthalene ring skeleton, an oxime compound having a fluorine atom, an oxime compound having a nitro group, an oxime compound having a benzofuran skeleton, an oxime compound having a hydroxyl substituent bonded to the carbazole skeleton, and the compounds described in paragraphs 0143 to 0149 of International Publication No. 2022/085485 can also be used.

Specific examples of oxime compounds that can be preferably used in the present invention are shown below, but the present invention is not limited thereto.

[Chemical formula 6] [Chemical formula 7] [Chemical formula 8] [Chemical formula 9]

The oxime compound is preferably a compound having a maximum absorption wavelength in the range of 350 to 500 nm, and more preferably a compound having a maximum absorption wavelength in the range of 360 to 480 nm. In addition, from the perspective of sensitivity, the oxime compound preferably has a high molar absorption coefficient at a wavelength of 365 nm or a wavelength of 405 nm, preferably 1000 to 300,000, more preferably 2000 to 300,000, and particularly preferably 5000 to 200,000. The molar absorption coefficient of the compound can be measured using a known method. For example, it is preferably measured by a spectrophotometer (Cary-5 spectrophotometer manufactured by Varian) using an ethyl acetate solvent at a concentration of 0.01 g/L.

As a photopolymerization initiator, a difunctional or trifunctional or higher photoradical polymerization initiator can be used. By using this type of photoradical polymerization initiator, two or more free radicals are generated from one molecule of the photoradical polymerization initiator, so that good sensitivity can be obtained. In addition, when a compound with an asymmetric structure is used, the crystallinity decreases and the solubility in a solvent or the like increases, and it becomes difficult to precipitate over time, thereby improving the time stability of the composition. As a specific example of a difunctional or trifunctional or higher photoradical polymerization initiator, the compound described in paragraph 0148 of International Publication No. 2022/065215 can be cited.

The content of the photopolymerization initiator in the total solid content of the composition is preferably 0.1 to 40 mass %, more preferably 0.5 to 35 mass %, and even more preferably 1 to 30 mass %. The composition may contain only one photopolymerization initiator or two or more. When two or more photopolymerization initiators are contained, the total amount thereof is preferably within the above range.

<<Hardener>> When the composition of the present invention contains a compound having a cyclic ether group, it is preferable to further contain a hardener. As the hardener, for example, amine compounds, acid anhydride compounds, amide compounds, phenol compounds, polycarboxylic acids, thiol compounds, etc. can be cited. As specific examples of the hardener, succinic acid, trimellitic acid, pyromelitic acid, N,N-dimethyl-4-aminopyridine, pentaerythritol tetrakis (3-butyl propionate) and the like can be cited. The hardener can also use compounds described in paragraphs 0072 to 0078 of Japanese Patent Publication No. 2016-075720 and compounds described in Japanese Patent Publication No. 2017-036379. The content of the hardener is preferably 0.01 to 20 parts by mass, more preferably 0.01 to 10 parts by mass, and even more preferably 0.1 to 6.0 parts by mass relative to 100 parts by mass of the compound having a cyclic ether group.

＜＜Color coloring agent＞＞ The composition of the present invention can contain a color coloring agent. As the color coloring agent, red coloring agent, green coloring agent, blue coloring agent, yellow coloring agent, purple coloring agent and orange coloring agent can be cited. The color coloring agent can be a pigment or a dye. A pigment and a dye can be used at the same time. In addition, the pigment can be any of an inorganic pigment and an organic pigment. In addition, the pigment can also use a material in which a part of an inorganic pigment or an organic-inorganic pigment is replaced with an organic chromophore. By replacing an inorganic pigment or an organic-inorganic pigment with an organic chromophore, hue design can be easily performed.

The average primary particle size of the pigment is preferably 1 to 200 nm. The lower limit is preferably 5 nm or more, and more preferably 10 nm or more. The upper limit is preferably 180 nm or less, more preferably 150 nm or less, and even more preferably 100 nm or less. Furthermore, in this specification, the primary particle size of the pigment can be obtained by observing the primary particles of the pigment under a transmission electron microscope and based on the image photographs obtained. Specifically, the projected area of the primary particles of the pigment is obtained, and the equivalent circular diameter corresponding thereto is calculated as the primary particle size of the pigment. In addition, the average primary particle size in this specification is set to the arithmetic mean of the primary particle sizes of 400 primary particles of the pigment. In addition, the primary particles of the pigment refer to independent particles that are not agglomerated.

The coloring agent preferably contains a pigment. The content of the pigment in the coloring agent is preferably 50% by mass or more, more preferably 70% by mass or more, further preferably 80% by mass or more, and particularly preferably 90% by mass or more. Examples of the pigment include the following.

Color Index (C.I.) Color Yellow 1, 2, 3, 4, 5, 6, 10, 11, 12, 13, 14, 15, 16, 17, 18, 20, 24, 31, 32, 34, 35, 35:1, 36, 36:1, 37, 37:1, 40, 42, 43, 53, 55, 60, 61, 62, 63, 65, 73, 74, 77, 81, 83, 86, 93, 94, 95, 97, 98, 100, 101, 104, 106, 108, 109, 110, 113, 114, 115, 116, 117, 118, 119, 120, 123, 125, 126, 127, 128 、129、137、138、139、147、148、150、151、152、153、154、155、156、161、162、164、166、167、168、169、170、171、172、173、174、175、176、177、179、180、181、182、185、187、188、193、194、199、213、214、215、228、231、232 (methyl series), 233 (quinoline series), 234 (amino ketone series), 235 (amino ketone series), 236 (amino ketone series), etc. (the above are yellow pigments), C.I. pigment orange 2, 5, 13, 16, 17: 1, 31, 34, 36, 38, 43, 46, 48, 49, 51, 52, 55, 59, 60, 61, 62, 64, 71, 73, etc. (the above are orange pigments), C.I. Pigment Red 1, 2, 3, 4, 5, 6, 7, 9, 10, 14, 17, 22, 23, 31, 38, 41, 48:1, 48:2, 48:3, 48:4, 49, 49:1, 49:2, 52:1, 52:2, 53:1, 57:1, 60:1, 63:1, 66, 67, 81:1, 81:2, 81:3, 83, 88, 90, 105, 112, 119, 122, 123, 144, 146, 149 、150、155、166、168、169、170、171、172、175、176、177、178、179、184、185、187、188、190、200、202、206、207、208、209、210、216、220、224、226、242、246、254、255、264、269、270、272、279、291、294 (𠮿口 Galaxy, Organo Ultramarine (organic ultramarine), Bluish Red (blue red), 295 (monoazo series), 296 (diazo series), 297 (amino ketone), etc. (the above are red pigments), C.I. pigment green 7, 10, 36, 37, 58, 59, 62, 63, 64 (phthalocyanine series), 65 (phthalocyanine series), 66 (phthalocyanine series), etc. (the above are green pigments), C.I. pigment purple 1, 19, 23, 27, 32, 37, 42, 60 (triarylmethane series), 61 (Phosphorus galaxy), etc. (the above are purple pigments), C.I. Pigment Blue 1, 2, 15, 15:1, 15:2, 15:3, 15:4, 15:6, 16, 22, 29, 60, 64, 66, 79, 80, 87 (monoazo series), 88 (methine series), etc. (the above are blue pigments).

As a green colorant, a zinc phthalocyanine halide pigment having an average of 10 to 14 halogen atoms, an average of 8 to 12 bromine atoms, and an average of 2 to 5 chlorine atoms in one molecule can also be used. As a specific example, the compound described in International Publication No. 2015/118720 can be cited. In addition, as a green colorant, the compound described in paragraph 0029 of International Publication No. 2022/085485, the aluminum phthalocyanine compound described in Japanese Patent Publication No. 2020-070426, and the diarylmethane compound described in Japanese Patent Publication No. 2020-504758 can also be used.

As a blue coloring agent, an aluminum phthalocyanine compound having a phosphorus atom can also be used. Specific examples include compounds described in paragraphs 0022 to 0030 of Japanese Patent Application Laid-Open No. 2012-247591 and paragraph 0047 of Japanese Patent Application Laid-Open No. 2011-157478.

As the yellow coloring agent, the compounds described in paragraphs 0031 to 0033 of International Publication No. 2022/085485, the methine dyes described in JP-A-2019-073695, and the methine dyes described in JP-A-2019-073696 can be used.

As the red coloring agent, the compound described in paragraph 0034 of International Publication No. 2022/085485 and the brominated diketopyrrolopyrrole compound described in Japanese Patent Application Publication No. 2020-085947 can also be used.

The coloring agent may also be a dye. There is no particular limitation on the dye, and known dyes may be used. For example, pyrazole azo dyes, aniline azo dyes, triarylmethane dyes, anthraquinone dyes, anthrapyridone dyes, benzylidene dyes, oxocyanine dyes, pyrazolotriazole azo dyes, pyridone azo dyes, cyanine dyes, phenothiocyanate dyes, pyrrolopyrazole azoimine dyes, galaxy dyes, phthalocyanine dyes, benzopyran dyes, indigo dyes, pyrromethene dyes, etc. may be cited. Moreover, as the dye, the thiazole compound described in Japanese Patent Application Laid-Open No. 2012-158649, the azo compound described in Japanese Patent Application Laid-Open No. 2011-184493, and the azo compound described in Japanese Patent Application Laid-Open No. 2011-145540 can also be used.

As a coloring agent, triarylmethane dye polymers described in Korean Patent Publication No. 10-2020-0028160, phthalocyanine compounds described in Japanese Patent Publication No. 2020-117638, phthalocyanine compounds described in International Publication No. 2020/174991, isoindoline compounds or salts thereof described in Japanese Patent Publication No. 2020-160279, and phthalocyanine compounds described in Korean Patent Publication No. 10-2020-0069442 can also be used. The compound represented by formula 1, the compound represented by formula 1 described in Korean Publication No. 10-2020-0069730, the compound represented by formula 1 described in Korean Publication No. 10-2020-0069070, the compound represented by formula 1 described in Korean Publication No. 10-2020-0069067, the compound represented by formula 1 described in Korean Publication No. 10-2020-0069062, the compound represented by formula 1 described in Japanese Patent No. The zinc phthalocyanine halogenide pigment described in the publication No. 6809649, the isoindoline compound described in the publication No. 2020-180176, the thiophene thiocyanate compound described in the publication No. 2021-187913, the zinc phthalocyanine halogenide described in the publication No. 2022/004261, the zinc phthalocyanine halogenide described in the publication No. 2021/250883, the quinoline yellow pigment represented by formula 1 in the publication No. 10-2020-0030759 Compounds, polymer dyes described in Korean Patent Publication No. 10-2020-0061793, colorants described in Japanese Patent Publication No. 2022-029701, isoindoline compounds described in International Publication No. 2022/014635, aluminum phthalocyanine compounds described in International Publication No. 2022/024926, compounds described in Japanese Patent Publication No. 2022-045895, and compounds described in International Publication No. 2022/050051. The colorant may be a rotaxane, and the pigment skeleton may be used for the cyclic structure of the rotaxane, may be used for the rod-shaped structure, or may be used for both the cyclic and rod-shaped structures.

When the composition of the present invention contains a coloring agent, the content of the coloring agent in the total solid content of the composition is preferably 1 to 50 mass %. When the composition of the present invention contains two or more coloring agents, the total amount of the coloring agents is preferably within the above range.

When the composition of the present invention is used as an infrared cutoff filter, it is preferred that the composition of the present invention substantially does not contain a coloring agent. Furthermore, the composition of the present invention substantially does not contain a coloring agent means that the content of the coloring agent in the total solid content of the composition is 0.5 mass% or less, preferably 0.1 mass% or less, and it is more preferred that the composition does not contain a coloring agent.

<<Color material that transmits infrared light and blocks visible light>> The composition of the present invention can also contain a color material that transmits infrared light and blocks visible light (hereinafter, also referred to as a color material that blocks visible light). The composition containing the color material that blocks visible light can be preferably used as a composition for forming an infrared transmission filter.

The color material that shields visible light is preferably a color material that absorbs light in the wavelength range of purple to red. In addition, the color material that shields visible light is preferably a color material that shields light in the wavelength range of 450 to 650 nm. In addition, the color material that shields visible light is preferably a color material that transmits light in the wavelength range of 900 to 1500 nm. The color material that shields visible light is preferably one that satisfies at least one of the following necessary conditions (A) and (B). (A): Contains two or more color colorants, and the combination of two or more color colorants forms black. (B): Contains an organic black colorant.

As color coloring agents, the above-mentioned ones can be cited. As organic black coloring agents, for example, bisbenzofuranone compounds, azomethine compounds, perylene compounds, azo compounds, etc. can be cited, and bisbenzofuranone compounds and perylene compounds are preferred. As bisbenzofuranone compounds, compounds described in Japanese Patent Publication No. 2010-534726, Japanese Patent Publication No. 2012-515233, Japanese Patent Publication No. 2012-515234, etc. can be cited, for example, they can be obtained as "Irgaphor Black" manufactured by BASF. As perylene compounds, compounds described in paragraphs 0016 to 0020 of Japanese Patent Publication No. 2017-226821, C.I. Pigment Black 31, 32, etc. can be cited. Examples of the azomethine compound include compounds described in Japanese Patent Application Laid-Open No. 01-170601 and Japanese Patent Application Laid-Open No. 02-034664. For example, it is available as "CHROMO FINE BLACK A1103" manufactured by Dainichiseika Color & Chemicals Mfg. Co., Ltd.

As a combination of color colorants for forming black by combining two or more color colorants, for example, the following (1) to (8) can be cited. (1) A state in which a yellow colorant, a blue colorant, a purple colorant, and a red colorant are contained. (2) A state in which a yellow colorant, a blue colorant, and a red colorant are contained. (3) A state in which a yellow colorant, a purple colorant, and a red colorant are contained. (4) A state in which a yellow colorant and a purple colorant are contained. (5) A state in which a green colorant, a blue colorant, a purple colorant, and a red colorant are contained. (6) A state in which a purple colorant and an orange colorant are contained. (7) Samples containing green colorant, purple colorant and red colorant. (8) Samples containing green colorant and red colorant.

When the composition of the present invention contains a colorant that shields visible light, the content of the colorant that shields visible light in the total solid content of the composition is preferably 1 to 50% by mass. The lower limit is preferably 5% by mass or more, more preferably 10% by mass or more, further preferably 20% by mass or more, and particularly preferably 30% by mass or more.

When the composition of the present invention is used as an infrared cutoff filter, it is preferred that the composition of the present invention substantially does not contain a colorant that blocks visible light. Furthermore, the composition of the present invention substantially does not contain a colorant that blocks visible light means that the content of the colorant that blocks visible light in the total solid content of the composition is 0.5 mass % or less, preferably 0.1 mass % or less, and it is more preferred that the composition does not contain a colorant that blocks visible light.

<<Surfactant>> The composition of the present invention can contain a surfactant. As the surfactant, various surfactants such as fluorine-based surfactants, non-ionic surfactants, cationic surfactants, anionic surfactants, and silicone-based surfactants can be used. The surfactant is preferably a silicone-based surfactant or a fluorine-based surfactant. For the surfactant, reference can be made to the surfactants described in paragraphs 0238 to 0245 of International Publication No. 2015/166779, which is incorporated into this specification.

As the fluorine-based surfactant, the compounds described in paragraphs 0167 to 0173 of International Publication No. 2022/085485 can be used.

As non-ionic surfactants, the compounds described in paragraph 0174 of International Publication No. 2022/085485 can be cited.

Examples of the silicone-based surfactant include SH8400, SH8400 FLUID, FZ-2122, 67 Additive, 74 Additive, M Additive, SF 8419 OIL (all manufactured by Dow Corning Toray Co., Ltd.), TSF-4440, TSF-4300, TSF-4445, TSF-4460, TSF-4452 (all manufactured by Momentive Performance Materials Inc.), KP-341, KF-6000, KF-6001, KF-6002, KF-6003 (all manufactured by Shin-Etsu Chemical Co., Ltd.), BYK-307, BYK-322, BYK-323, BYK-330, BYK-3760, BYK-UV3510 (all manufactured by BYK-Chemie GmbH) etc. The following compounds can also be used as polysilicone surfactants. [Chemical formula 10]

The content of the surfactant in the total solid content of the composition is preferably 0.001 to 1 mass %, more preferably 0.001 to 0.5 mass %, and even more preferably 0.001 to 0.2 mass %. The composition may contain only one surfactant or two or more. When two or more surfactants are included, the total amount thereof is preferably within the above range.

＜＜Polymerization inhibitor＞＞ The composition of the present invention can contain a polymerization inhibitor. Examples of the polymerization inhibitor include hydroquinone, p-methoxyphenol, di-tert-butyl-p-cresol, gallol, tert-butyl o-catechol, benzoquinone, 4,4'-thiobis(3-methyl-6-tert-butylphenol), 2,2'-methylenebis(4-methyl-6-tert-butylphenol), N-nitrosophenylhydroxylamine salts (ammonium salts, first arsenic salts, etc.), and p-methoxyphenol is preferred. The content of the polymerization inhibitor in the total solid content of the composition is preferably 0.0001 to 5% by mass. The composition may contain only one polymerization inhibitor, or may contain two or more. When two or more types are included, the total amount thereof is preferably within the above range.

＜＜Silane coupling agent＞＞ The composition of the present invention can contain a silane coupling agent. The silane coupling agent is preferably a silane compound having a hydrolyzable group, and a silane compound having a hydrolyzable group and a functional group other than the hydrolyzable group is more preferred. The hydrolyzable group refers to a substituent that directly bonds to a silicon atom and can generate a siloxane bond by at least one of a hydrolysis reaction and a condensation reaction. Examples of the hydrolyzable group include a halogen atom, an alkoxy group, an acyloxy group, and the like, with an alkoxy group being preferred. The silane coupling agent is preferably a compound having an alkoxysilyl group. In addition, as functional groups other than hydrolyzable groups, for example, vinyl, styryl, (meth)acryl, octyl, epoxy, oxobutyl, amino, urea, thioether, isocyanate, phenyl, etc. can be cited, and (meth)acryl and epoxy are preferred. The silane coupling agent can be exemplified by the compounds described in paragraphs 0018 to 0036 of Japanese Patent Application Publication No. 2009-288703 and the compounds described in paragraphs 0056 to 0066 of Japanese Patent Application Publication No. 2009-242604. The content of the silane coupling agent in the total solid content of the composition is preferably 0.01 to 15.0 mass %, and more preferably 0.05 to 10.0 mass %. The composition may contain only one silane coupling agent or two or more. When two or more silane coupling agents are included, the total amount thereof is preferably within the above range.

＜＜Ultraviolet absorber＞＞ The composition of the present invention can contain an ultraviolet absorber. Examples of the ultraviolet absorber include conjugated diene compounds, amino diene compounds, salicylate compounds, benzophenone compounds, benzotriazole compounds, acrylonitrile compounds, hydroxyphenyl trisoxane compounds, indole compounds, trisoxane compounds, dibenzoyl compounds, and the like. As specific examples of such compounds, there are compounds described in paragraphs 0038 to 0052 of Japanese Patent Application No. 2009-217221, paragraphs 0052 to 0072 of Japanese Patent Application No. 2012-208374, paragraphs 0317 to 0334 of Japanese Patent Application No. 2013-068814, paragraphs 0061 to 0080 of Japanese Patent Application No. 2016-162946, paragraphs 0052 and 0074 of International Publication No. 2021/131355, and paragraphs 0022 to 0024 of International Publication No. 2021/132247, and the contents thereof are incorporated into this specification. As commercially available products of ultraviolet absorbers, there are Tinuvin series and Uvinul series manufactured by BASF. In addition, as benzotriazole compounds, the MYUA series manufactured by MIYOSHI OIL & FAT CO., LTD. can be cited (Chemical Industry Daily, February 1, 2016). The ultraviolet absorber can also use the compounds described in the embodiments described below, the compounds described in paragraphs 0049 to 0059 of Japanese Patent No. 6268967, and the compounds described in paragraphs 0059 to 0076 of International Publication No. 2016/181987. The content of the ultraviolet absorber in the total solid content of the composition is preferably 0.01 to 30% by mass, and more preferably 0.05 to 25% by mass. The composition may contain only one ultraviolet absorber, or may contain two or more. When two or more types are included, the total amount thereof is preferably within the above range.

<<Antioxidant>> The composition of the present invention can contain an antioxidant. As the antioxidant, phenolic antioxidants, amine antioxidants, phosphorus antioxidants, sulfur antioxidants, etc. can be cited. As the phenolic antioxidant, hindered phenol compounds can be cited. The phenolic antioxidant is preferably a compound having a substituent at a position adjacent to the phenolic hydroxyl group (adjacent position). As the aforementioned substituent, a substituted or unsubstituted alkyl group having 1 to 22 carbon atoms is preferred. The antioxidant is also preferably a compound having a phenol group and a phosphite group in the same molecule. As the phosphorus-based antioxidant, there can be mentioned tris[2-[[2,4,8,10-tetrakis(1,1-dimethylethyl)dibenzo[d,f][1,3,2]dioxaphosphinocycloheptadien-6-yl]oxy]ethyl]amine, tris[2-[(4,6,9,11-tetrakis-tert-butyldibenzo[d,f][1,3,2]dioxaphosphinocycloheptadien-2-yl)oxy]ethyl]amine, bis(2,4-di-tert-butyl-6-methylphenyl)ethyl phosphite, tris(2,4-di-tert-butylphenyl)phosphite, and the like. Examples of commercially available antioxidants include ADEKA STAB AO-20, ADEKA STAB AO-30, ADEKA STAB AO-40, ADEKA STAB AO-50, ADEKA STAB AO-50F, ADEKA STAB AO-60, ADEKA STAB AO-60G, ADEKA STAB AO-80, ADEKA STAB AO-330, ADEKA STAB AO-412S, ADEKA STAB 2112, ADEKA STAB PEP-36, ADEKA STAB HP-10 (all manufactured by ADEKA CORPORATION), and JP-650 (manufactured by JOHOKU CHEMICAL CO., LTD.). Antioxidants can also use compounds described in paragraphs 0023 to 0048 of Japanese Patent No. 6268967, compounds described in International Publication No. 2017/006600, compounds described in International Publication No. 2017/164024, and compounds described in Korean Publication No. 10-2019-0059371. The content of the antioxidant in the total solid content of the composition is preferably 0.01 to 20% by mass, and more preferably 0.3 to 15% by mass. The composition may contain only one antioxidant, or may contain two or more. When containing two or more, the total amount of the antioxidants is preferably within the above range.

<<Other ingredients>> The composition of the present invention may also contain sensitizers, fillers, thermosetting accelerators, plasticizers and other additives (e.g., conductive particles, defoamers, flame retardants, levelers, peeling accelerators, fragrances, surface tension modifiers, chain transfer agents, potential antioxidants, etc.) as needed. By appropriately containing these ingredients, the properties of the film can be adjusted. These ingredients can use the compounds described in paragraph 0182 of International Publication No. 2022/085485.

<Storage container> The storage container for the composition of the present invention is not particularly limited, and a known storage container can be used. In addition, as a storage container, the container described in paragraph 0187 of International Publication No. 2022/085485 can be used.

<Method for preparing the composition> The composition of the present invention can be prepared by mixing the aforementioned components. When preparing the composition, all the components can be dissolved or dispersed in a solvent at the same time to prepare the composition, or two or more solutions or dispersions containing each component can be prepared in advance as needed, and these can be mixed to prepare the composition when used (when applied).

When preparing the composition, a pigment dispersion process may be included. In the pigment dispersion process, as the mechanical force used to disperse the pigment, compression, extrusion, impact, shearing, erosion, etc. can be cited. As specific examples of such processes, bead milling, sand milling, roller milling, ball milling, paint stirring, micro jet, high-speed impeller, sand mixing, jet mixing, high-pressure wet micronization, ultrasonic dispersion, etc. can be cited. In addition, when the pigment is pulverized in a sand mill (bead mill), it is preferred to process it under the condition of improving the pulverization efficiency by using micro beads with a small diameter and increasing the filling rate of micro beads. In addition, after the pulverization process, it is preferred to remove coarse particles by filtering, centrifugal separation, etc. In addition, regarding the pigment dispersion process and the disperser, the process and the disperser described in paragraph 0022 of "Dispersion Technology Collection, JOHOKIKO CO., LTD., July 15, 2005" or "Dispersion Technology and Practical Industrial Applications Focusing on Suspension (Solid/Liquid Dispersion System), Business Development Center Publishing Department, October 10, 1978" and Japanese Patent Publication No. 2015-157893 can be preferably used. In addition, in the pigment dispersion process, the pigment can be finely processed by the salt grinding step. For example, the materials, devices, and treatment conditions used in the salt grinding step can refer to the descriptions of Japanese Patent Publication No. 2015-194521 and Japanese Patent Publication No. 2012-046629. As the microbead material used for dispersion, zirconia, agate, quartz, titanium dioxide, tungsten carbide, silicon nitride, aluminum oxide, stainless steel, and glass can be cited. In addition, the beads can also use inorganic compounds with a Mohs hardness of 2 or more. The above beads can be included in the composition at 1 to 10,000 ppm.

When preparing a composition, it is preferred to filter the composition with a filter for the purpose of removing foreign matter, reducing defects, etc. As the type of filter used for filtering and the filtering method, the filter and filtering method described in paragraphs 0196 to 0199 of International Publication No. 2022/085485 can be cited.

<Membrane> Next, the membrane of the present invention is described. The membrane of the present invention is a membrane obtained from the composition of the present invention described above. The membrane of the present invention can be preferably used as an optical filter. The use of the optical filter is not particularly limited, and examples thereof include infrared cutoff filters, infrared transmission filters, etc. Examples of the infrared cut filter include an infrared cut filter on the light receiving side of a solid-state imaging device (e.g., an infrared cut filter for a wafer-level lens, etc.), an infrared cut filter on the back side (the side opposite to the light receiving side) of a solid-state imaging device, and an infrared cut filter for an ambient light sensor (e.g., an illuminance sensor that senses the illuminance and hue of the environment where an intelligence terminal device is placed and adjusts the hue of a display, a color correction sensor that adjusts the hue), etc. In particular, it can be preferably used as an infrared cut filter on the light receiving side of a solid-state imaging device. As an infrared transmission filter, a filter that blocks visible light and selectively transmits infrared light above a specific wavelength can be cited.

The film of the present invention may have a pattern or may be a film without a pattern (flat film). Furthermore, the film of the present invention may be used by being laminated on a support or by being peeled off from a support. As the support, a semiconductor substrate such as a silicon substrate or a transparent substrate may be cited.

A charge coupled device (CCD), a complementary metal oxide semiconductor (CMOS), a transparent conductive film, etc. may be formed on a semiconductor substrate used as a support. In addition, a black matrix for isolating each pixel may be formed on the semiconductor substrate. In addition, an undercoat layer may be provided on the semiconductor substrate as needed to improve adhesion with an upper layer, prevent diffusion of a substance, or flatten the substrate surface.

As for the transparent substrate that can be used as a support, there is no particular limitation as long as it is made of a material that can at least transmit visible light. For example, substrates made of materials such as glass and resins can be cited. As resins, polyester resins such as polyethylene terephthalate and polybutylene terephthalate, polyolefin resins such as polyethylene, polypropylene, and ethylene/vinyl acetate copolymers, norbornene resins, polyacrylates, acrylic resins such as polymethyl methacrylate, urethane resins, vinyl chloride resins, fluororesins, polycarbonate resins, polyvinyl butyral resins, polyvinyl alcohol resins, etc. can be cited. As glass, sodium calcium glass, borosilicate glass, alkali-free glass, quartz glass, copper-containing glass, etc. can be cited. Examples of the copper-containing glass include copper-containing phosphate glass and copper-containing fluorophosphate glass. Commercially available copper-containing glass may be used. Examples of commercially available copper-containing glass include NF-50 (manufactured by AGC TECHNO GLASS Co., Ltd.).

The thickness of the film of the present invention can be appropriately adjusted according to the purpose. The thickness of the film can be set to 200 μm or less, or 150 μm or less, or 120 μm or less, or 20 μm or less, or 10 μm or less, or 5 μm or less. The lower limit of the thickness of the film is preferably 0.1 μm or more, and more preferably 0.2 μm or more.

When the film of the present invention is used as an infrared cutoff filter, it is preferred that the film of the present invention has a maximum absorption wavelength in the range of 650 to 1500 nm (preferably 660 to 1200 nm, and more preferably 660 to 1000 nm). In addition, the average transmittance in the range of 700 to 720 nm is preferably 10% or less, more preferably 7% or less, further preferably 4% or less, and particularly preferably 2% or less. In addition, the average transmittance in the range of 420 to 550 nm is preferably 86% or more, more preferably 89% or more, further preferably 92% or more, and particularly preferably 95% or more. Furthermore, the transmittance in the entire range of wavelengths from 420 to 550 nm is preferably 50% or more, more preferably 70% or more, and even more preferably 80% or more. Furthermore, the transmittance at at least one point in the range of wavelengths from 650 to 1500 nm (preferably wavelengths from 660 to 1200 nm, and even more preferably wavelengths from 660 to 1000 nm) is preferably 10% or less, more preferably 7% or less, even more preferably 4% or less, and particularly preferably 2% or less. Furthermore, when the absorbance at the maximum absorption wavelength is set to 1, the average absorbance of the film of the present invention in the range of wavelengths from 420 to 550 nm is preferably less than 0.030, and even more preferably less than 0.025.

When the film of the present invention is used as an infrared transmission filter, the film of the present invention preferably has any one of the following spectral characteristics (i1) to (i3). (i1): A filter having a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400 to 850 nm and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 1000 to 1500 nm. A film having such spectral characteristics can shield light in the wavelength range of 400 to 850 nm and transmit light with a wavelength greater than 950 nm. (i2): A filter having a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400 to 950 nm and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 1100 to 1500 nm. A film having such spectral characteristics can shield light in the wavelength range of 400 to 950 nm and transmit light with a wavelength greater than 1050 nm. (i3): A filter having a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400 to 1050 nm and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 1200 to 1500 nm. Films with this type of spectral properties can shield light in the wavelength range of 400 to 1050 nm and transmit light with a wavelength greater than 1150 nm.

The film of the present invention can also be used in combination with a filter containing a color coloring agent. The filter can be manufactured using a coloring composition containing a color coloring agent. When the film of the present invention is used as an infrared cutoff filter and the film of the present invention and the filter are used in combination, it is preferred that the filter is arranged on the optical path of the film of the present invention. For example, it is preferred that the film of the present invention and the filter are stacked and used as a laminate. In the laminate, the film of the present invention and the filter may be adjacent to each other in the thickness direction, or may not be adjacent to each other. When the film of the present invention and the color filter are not adjacent to each other in the thickness direction, the film of the present invention may be formed on a support body different from the support body on which the color filter is formed, or other components constituting a solid-state imaging element (for example, a microlens, a planarization layer, etc.) may be sandwiched between the film of the present invention and the color filter.

The film of the present invention can be used in various devices such as solid-state imaging devices such as CCD (charge coupled device), CMOS (complementary metal oxide semiconductor), infrared sensors, and image display devices.

<Method for producing film> The film of the present invention can be produced by applying the composition of the present invention.

As the support, the above-mentioned ones can be cited. As the coating method of the composition, a known method such as a spin coating method can be used. For example, the coating method described in paragraph 0207 of International Publication No. 2022/085485 can be used.

The composition layer formed by the coating composition can be dried (pre-baked). When pre-baking, the pre-baking temperature is preferably below 150°C, more preferably below 120°C, and further preferably below 110°C. The lower limit can be set to, for example, above 50°C, and can also be set to above 80°C. The pre-baking time is preferably 10 seconds to 3000 seconds, more preferably 40 to 2500 seconds, and further preferably 80 to 220 seconds. Drying can be performed using a heating plate, an oven, etc.

The film manufacturing method may further include a pattern forming step. As the pattern forming method, a pattern forming method using photolithography and a pattern forming method using dry etching can be cited, and the pattern forming method using photolithography is preferred. Furthermore, when the film of the present invention is used as a flat film, the pattern forming step may not be performed. The pattern forming step is described in detail below.

(The case of forming a pattern by photolithography) The method of forming a pattern by photolithography includes a step of exposing the composition layer formed by applying the composition of the present invention in a pattern-like manner (exposure step) and a step of developing and removing the unexposed portion of the composition layer to form a pattern (development step). A step of baking the developed pattern (post-baking step) can be provided as needed. The following describes each step.

In the exposure step, the component layer is exposed in a pattern. For example, a stepper or scanner is used to expose the component layer through a mask having a predetermined mask pattern, thereby exposing in a pattern. This allows the exposed portion to be cured.

As radiation (light) that can be used for exposure, g-ray, i-ray, etc. can be cited. In addition, light with a wavelength of 300nm or less (preferably light with a wavelength of 180 to 300nm) can also be used. As light with a wavelength of 300nm or less, KrF ray (wavelength 248nm), ArF ray (wavelength 193nm), etc. can be cited, and KrF ray (wavelength 248nm) is preferred. In addition, a long-wave light source of 300nm or more can also be used.

Furthermore, during exposure, light may be irradiated continuously or in pulses (pulse exposure). Pulse exposure refers to an exposure method in which light is irradiated and paused repeatedly in a short period of time (e.g., less than milliseconds) to perform exposure.

The irradiation dose (exposure dose) is preferably 0.03 to 2.5 J/cm ² , and more preferably 0.05 to 1.0 J/cm ^2. The oxygen concentration during exposure can be appropriately selected. In addition to being performed in the atmosphere, exposure can be performed in a low oxygen atmosphere with an oxygen concentration of 19 volume % or less (for example, 15 volume %, 5 volume % or substantially oxygen-free), or in a high oxygen atmosphere with an oxygen concentration exceeding 21 volume % (for example, 22 volume %, 30 volume % or 50 volume %). The exposure illuminance can be appropriately set and can generally be selected from a range of 1000 W/m ² to 100,000 W/m ² (e.g., 5000 W/m ² , 15000 W/m ² or 35000 W/m ² ). The conditions of oxygen concentration and exposure illuminance can be appropriately combined, for example, the conditions can be set to an oxygen concentration of 10 vol% and an illuminance of 10,000 W/m ² , an oxygen concentration of 35 vol% and an illuminance of 20,000 W/m ² , etc.

Next, the unexposed portion of the component layer after exposure is developed and removed to form a pattern. The development and removal of the unexposed portion of the component layer can be performed using a developer. Thereby, the unexposed portion of the component layer in the exposure step is dissolved into the developer, and only the light-hardened portion remains on the support. The temperature of the developer is preferably 20 to 30°C, for example. The developing time is preferably 20 to 180 seconds. In addition, in order to improve the removability of residues, the following steps can be repeated multiple times: the developer is discarded every 60 seconds, and a new developer is supplied.

The developer may be an organic solvent, an alkaline developer, etc., and an alkaline developer is preferably used. Regarding the developer and the cleaning (rinsing) method after development, the developer or cleaning method described in paragraph 0214 of International Publication No. 2022/085485 can be used.

After development, it is preferred to perform additional exposure treatment or heat treatment (post-baking) after drying. Additional exposure treatment or post-baking is a post-development hardening treatment used to make a completely cured film. For example, the heating temperature in the post-baking is preferably 100 to 240°C, and 200 to 240°C is more preferred. The developed film can be post-baked continuously or intermittently using a heating mechanism such as a heating plate or a convection oven (hot air circulation dryer), a high-frequency heater, etc. in such a manner as to achieve the above conditions. When performing additional exposure treatment, it is preferred that the light used for exposure has a wavelength of less than 400nm. In addition, the additional exposure treatment can be performed by the method described in the Korean Patent Publication No. 10-2017-0122130.

(Forming a pattern by dry etching) When forming a pattern by dry etching, the following method can be used: a composition layer formed by coating the above-mentioned composition on a support is hardened to form a hardened layer, and then a patterned photoresist layer is formed on the hardened layer, and then the patterned photoresist layer is used as a mask to dry-etch the hardened layer using an etching gas. When forming the photoresist layer, it is preferred to perform a pre-baking treatment. For the content of forming a pattern by dry etching, reference can be made to paragraphs 0010 to 0067 of Japanese Patent Publication No. 2013-064993, and the content is incorporated into this specification.

<Optical filter> The optical filter of the present invention has the above-mentioned film of the present invention. As the type of the optical filter, there can be cited an infrared cut filter and an infrared transmission filter.

In addition to the above-mentioned film of the present invention, the filter of the present invention may further have a copper-containing layer, a dielectric multilayer film, an ultraviolet absorption layer, etc. As the ultraviolet absorption layer, for example, the absorption layer described in paragraphs 0040 to 0070 and 0119 to 0145 of International Publication No. 2015/099060 can be cited. As the dielectric multilayer film, the dielectric multilayer film described in paragraphs 0255 to 0259 of Japanese Patent Publication No. 2014-041318 can be cited. As the copper-containing layer, a glass substrate composed of copper-containing glass (copper-containing glass substrate) and a layer containing a copper complex (copper-containing complex layer) can also be used. Examples of the copper-containing glass substrate include copper-containing phosphate glass, copper-containing fluorophosphate glass, etc. Examples of commercially available copper-containing glass include NF-50 (manufactured by AGC TECHNO GLASS Co., Ltd.), BG-60, BG-61 (manufactured by Schott AG), and CD5000 (manufactured by HOYA CORPORATION).

<Solid-state imaging device> The solid-state imaging device of the present invention has the above-mentioned film of the present invention. The structure of the solid-state imaging device is not particularly limited as long as it has the structure of the film of the present invention and functions as a solid-state imaging device. For example, the following structure can be cited.

The above structure is a structure in which a transmission electrode composed of a plurality of photodiodes and polysilicon, etc., constituting a light receiving area of a solid-state imaging element, is provided on a support, a light shielding film composed of tungsten, etc., which is opened only in the light receiving part of the photodiode, is provided on the photodiode and the transmission electrode, a device protection film composed of silicon nitride, etc., which is formed in a manner covering the entire light shielding film and the light receiving part of the photodiode, is provided on the light shielding film, and the film of the present invention is provided on the device protection film. Furthermore, it can also be a structure in which a focusing mechanism (for example, a micro lens, etc., the same below) is provided on the device protection film and on the lower side of the film of the present invention (the side close to the support), or a structure in which a focusing mechanism is provided on the film of the present invention. In addition, the color filter may have a structure in which, for example, a film forming each pixel is embedded in a space divided into a grid shape by a partition wall. In this case, the refractive index of the partition wall is preferably lower than that of each pixel. As examples of imaging devices having such a structure, devices described in Japanese Patent Publication No. 2012-227478 and Japanese Patent Publication No. 2014-179577 can be cited.

<Image display device> The image display device of the present invention has the film of the present invention. As the image display device, a liquid crystal display device, an organic electroluminescent (organic EL) display device, etc. can be cited. The definition and details of the image display device are described in, for example, "Electronic Display Device (written by Akio Sasaki, Kogyo Chosakai Publishing Co., Ltd., published in 1990)" and "Display Device (written by Junaki Ibuki, Sangyo Tosho Publishing Co., Ltd., published in 1989)". In addition, regarding the liquid crystal display device, it is described in, for example, "Next Generation Liquid Crystal Display Technology (edited by Tatsuo Uchida, Kogyo Chosakai Publishing Co., Ltd., published in 1994)". There is no particular limitation on the liquid crystal display device to which the present invention can be applied. For example, it can be applied to various types of liquid crystal display devices described in the above-mentioned "Next Generation Liquid Crystal Display Technology". The image display device can have a white organic EL element. As a white organic EL element, a series structure is preferred. The series structure of the organic EL element is described in Japanese Patent Gazette No. 2003-045676, supervised by Akiyoshi Mikami, "The Cutting Edge of Organic EL Technology Development - High Brightness. High Precision. Long Life. Technology Collection -", TECHNICAL INFORMATION INSTITUTE CO., LTD., pp. 326-328, 2008, etc. The spectrum of white light emitted by organic EL elements preferably has strong maximum luminescence peaks in the blue region (430-485nm), green region (530-580nm) and yellow region (580-620nm). In addition to these luminescence peaks, it is even better to have a maximum luminescence peak in the red region (650-700nm).

<Infrared sensor> The infrared sensor of the present invention has the above-mentioned film of the present invention. The structure of the infrared sensor is not particularly limited as long as it is a structure that functions as an infrared sensor. Hereinafter, an embodiment of the infrared sensor of the present invention will be described using the attached drawings.

In FIG1 , reference numeral 110 denotes a solid-state imaging element. An infrared cut filter 111 and an infrared transmission filter 114 are disposed on the imaging region of the solid-state imaging element 110. A color filter 112 is disposed on the infrared cut filter 111. A microlens 115 is disposed on the incident light hv side of the color filter 112 and the infrared transmission filter 114. A planarization layer 116 is formed so as to cover the microlens 115.

The infrared cutoff filter 111 can be formed using the composition of the present invention. The color filter 112 is a color filter formed with pixels that transmit and absorb light of a specific wavelength in the visible region, and is not particularly limited, and a conventionally known color filter for forming pixels can be used. For example, a color filter formed with pixels of red (R), green (G), and blue (B) can be used. For example, reference can be made to paragraphs 0214 to 0263 of Japanese Patent Gazette No. 2014-043556, which are incorporated into this specification. The infrared transmission filter 114 can select its characteristics according to the emission wavelength of the infrared LED used. The infrared transmission filter 114 can be formed using the composition of the present invention.

In the infrared sensor shown in FIG1 , an infrared cut filter (other infrared cut filter) different from the infrared cut filter 111 may be further arranged on the flattening layer 116. As other infrared cut filters, there may be cited those having a copper-containing layer and/or a dielectric multilayer film. For details thereof, the above-mentioned ones may be cited. In addition, as other infrared cut filters, dual-band pass filters may be used.

<Camera module> The camera module of the present invention has the above-mentioned film of the present invention. As a structure of the camera module, there is no particular limitation as long as it has a structure of the film of the present invention and functions as a camera module. For example, as a camera module, a structure having a solid-state imaging element, a lens, and a circuit for processing an image obtained from the solid-state imaging element can be cited. As a lens used in the camera module and a circuit for processing an image obtained from the above-mentioned solid-state imaging element, known ones can be used. As an example of a camera module, the camera modules described in Japanese Patent Publication No. 2016-006476 and Japanese Patent Publication No. 2014-197190 can be referred to, and these contents are incorporated into this manual.

<Compound, infrared absorber> The compound of the present invention is a compound (specific compound) represented by the above formula (1). In addition, the infrared absorber of the present invention includes a compound (specific compound) represented by the above formula (1). The infrared absorber of the present invention may include only one compound represented by the above formula (1), or may include two or more compounds. [Example]

The present invention is further described in detail below with reference to the following examples. The materials, usage amounts, ratios, treatment contents, treatment sequences, etc. shown in the following examples can be appropriately changed without departing from the gist of the present invention. In the structural formula shown below, Me is methyl, Et is ethyl, and iPr is isopropyl.

<Synthesis Example> (Synthesis Example 1) Synthesis of Compound PM-a-4 [Step 1] Compound 1 was synthesized with reference to paragraphs 0113 to 0121 of JP-A-2009-019145. [Chemical Formula 11]

[Step 2] Referring to the method described in International Publication No. 2012/054367, compound 3 was synthesized according to the following scheme. DMF is dimethylformamide. [Chemical Formula 12]

[Step 3] Compound 1 (17.8 g, 2 mmol) obtained in step 1 and compound 3 (9.2 g, 4 mmol) obtained in step 2 were placed in a 300 ml eggplant-shaped flask and dissolved in 100 ml of pyridine. A small amount of triethylamine was added and the mixture was heated and refluxed for 1 hour. After the reaction was completed, the solvent was concentrated and purified by column chromatography (ethyl acetate/dichloromethane) to obtain a solid. The obtained solid was precipitated in hexane/dichloromethane to isolate a brown solid (1.0 g, 0.8 mmol, yield 41%). The obtained brown solid was identified by MS and ¹⁹ F NMR (nuclear magnetic resonance analysis) and confirmed to be compound PM-a-4. MS (Mass spectrometry): m/z = 609.47 [MB (C ₆ F ₅ ) ₄ )] ⁺ The following peaks derived from B (C ₆ F ₅ ) ₄ ) were confirmed in ¹⁹ F-NMR (fluorine 19 nuclear magnetic resonance). -132.4 ppm (2F), -163.2 ppm (1F), -166.8 ppm (2F) [Chemical formula 13]

<Production of composition> The components listed in the following table were mixed in the mass parts listed in the following table, stirred, and then filtered using a nylon filter with a pore size of 0.45 μm (manufactured by Nihon Pall Ltd.) to produce a composition.

[Table 6] Infrared absorber (polymethine) Infrared absorber (other) Infrared absorber (other) Resin UV absorber Antioxidants Solvent Type Quality Type Quality Type Quality Type Quality Type Quality Type Quality Type Quality Embodiment 1 PM-a-1 0.1 A-1 0.035 B-1 0.02 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 2 PM-a-2 0.1 A-1 0.035 B-1 0.02 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 3 PM-a-3 0.1 A-1 0.035 B-1 0.02 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 4 PM-a-4 0.1 A-1 0.035 B-1 0.02 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 5 PM-a-5 0.1 A-1 0.035 B-1 0.02 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 6 PM-a-6 0.1 A-1 0.035 B-1 0.02 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 7 PM-a-7 0.1 A-1 0.035 B-1 0.02 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 8 PM-a-8 0.1 A-1 0.035 B-1 0.02 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 9 PM-a-9 0.1 A-1 0.035 B-1 0.02 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 10 PM-a-10 0.1 A-1 0.035 B-1 0.02 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 11 PM-a-11 0.1 A-1 0.035 B-1 0.02 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 12 PM-a-12 0.1 A-1 0.035 B-1 0.02 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 13 PM-a-13 0.1 A-1 0.035 B-1 0.02 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 14 PM-a-14 0.1 A-1 0.035 B-1 0.02 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 15 PM-a-15 0.1 A-1 0.035 B-1 0.02 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 16 PM-a-16 0.1 A-1 0.035 B-1 0.02 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 17 PM-a-17 0.1 A-1 0.035 B-1 0.02 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 18 PM-a-18 0.1 A-1 0.035 B-1 0.02 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 19 PM-a-19 0.1 A-1 0.035 B-1 0.02 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 20 PM-a-20 0.1 A-1 0.035 B-1 0.02 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 21 PM-a-21 0.1 A-1 0.035 B-1 0.02 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 22 PM-a-22 0.1 A-1 0.035 B-1 0.02 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 23 PM-a-23 0.1 A-1 0.035 B-1 0.02 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 24 PM-a-24 0.1 A-1 0.035 B-1 0.02 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 25 PM-a-25 0.1 A-1 0.035 B-1 0.02 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 [Table 7] Infrared absorber (polymethine) Infrared absorber (other) Infrared absorber (other) Resin UV absorber Antioxidants Solvent Type Quality Type Quality Type Quality Type Quality Type Quality Type Quality Type Quality Embodiment 26 PM-b-1 0.2 A-1 0.038 B-1 0.075 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 27 PM-b-2 0.2 A-1 0.038 B-1 0.075 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 28 PM-b-3 0.2 A-1 0.038 B-1 0.075 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 29 PM-b-4 0.2 A-1 0.038 B-1 0.075 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 30 PM-b-5 0.2 A-1 0.038 B-1 0.075 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 31 PM-b-6 0.2 A-1 0.038 B-1 0.075 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 32 PM-b-7 0.2 A-1 0.038 B-1 0.075 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 33 PM-b-8 0.2 A-1 0.038 B-1 0.075 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 34 PM-b-9 0.2 A-1 0.038 B-1 0.075 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 35 PM-b-10 0.2 A-1 0.038 B-1 0.075 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 36 PM-b-11 0.2 A-1 0.038 B-1 0.075 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 37 PM-b-12 0.2 A-1 0.038 B-1 0.075 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 38 PM-b-13 0.2 A-1 0.038 B-1 0.075 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 39 PM-b-14 0.2 A-1 0.038 B-1 0.075 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 40 PM-b-15 0.2 A-1 0.038 B-1 0.075 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 41 PM-c-1 0.04 A-1 0.06 B-1 0.07 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 42 PM-c-2 0.04 A-1 0.06 B-1 0.07 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 43 PM-c-3 0.04 A-1 0.06 B-1 0.07 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 44 PM-c-4 0.04 A-1 0.06 B-1 0.07 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 45 PM-c-5 0.04 A-1 0.06 B-1 0.07 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 46 PM-c-6 0.04 A-1 0.06 B-1 0.07 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 47 PM-c-7 0.04 A-1 0.06 B-1 0.07 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 48 PM-c-8 0.04 A-1 0.06 B-1 0.07 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 49 PM-c-9 0.04 A-1 0.06 B-1 0.07 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 50 PM-c-10 0.04 A-1 0.06 B-1 0.07 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 [Table 8] Infrared absorber (polymethine) Infrared absorber (other) Infrared absorber (other) Resin UV absorber Antioxidants Solvent Type Quality Type Quality Type Quality Type Quality Type Quality Type Quality Type Quality Embodiment 51 PM-c-11 0.04 A-1 0.06 B-1 0.07 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 52 PM-c-12 0.04 A-1 0.06 B-1 0.07 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 53 PM-c-13 0.04 A-1 0.06 B-1 0.07 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 54 PM-c-14 0.04 A-1 0.06 B-1 0.07 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 55 PM-c-15 0.04 A-1 0.06 B-1 0.07 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 56 PM-d-1 0.04 A-1 0.06 B-1 0.07 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 57 PM-d-2 0.04 A-1 0.06 B-1 0.07 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 58 PM-d-3 0.04 A-1 0.06 B-1 0.07 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 59 PM-d-4 0.04 A-1 0.06 B-1 0.07 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 60 PM-d-5 0.04 A-1 0.06 B-1 0.07 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 61 PM-d-6 0.04 A-1 0.06 B-1 0.07 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 62 PM-d-7 0.04 A-1 0.06 B-1 0.07 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 63 PM-d-8 0.04 A-1 0.06 B-1 0.07 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 64 PM-d-9 0.04 A-1 0.06 B-1 0.07 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 65 PM-d-10 0.04 A-1 0.06 B-1 0.07 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 66 PM-d-11 0.04 A-1 0.06 B-1 0.07 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 67 PM-d-12 0.04 A-1 0.06 B-1 0.07 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 68 PM-d-13 0.04 A-1 0.06 B-1 0.07 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 69 PM-d-14 0.04 A-1 0.06 B-1 0.07 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 70 PM-d-15 0.04 A-1 0.06 B-1 0.07 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 71 PM-e-1 0.04 A-1 0.06 B-1 0.07 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 72 PM-e-2 0.04 A-1 0.06 B-1 0.07 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 73 PM-e-3 0.04 A-1 0.06 B-1 0.07 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 74 PM-e-4 0.04 A-1 0.06 B-1 0.07 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 75 PM-e-5 0.04 A-1 0.06 B-1 0.07 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 [Table 9] Infrared absorber (polymethine) Infrared absorber (other) Infrared absorber (other) Resin UV absorber Antioxidants Solvent Type Quality Type Quality Type Quality Type Quality Type Quality Type Quality Type Quality Embodiment 76 PM-e-6 0.04 A-1 0.06 B-1 0.07 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 77 PM-e-7 0.04 A-1 0.06 B-1 0.07 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 78 PM-e-8 0.04 A-1 0.06 B-1 0.07 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 79 PM-e-9 0.04 A-1 0.06 B-1 0.07 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 80 PM-e-10 0.04 A-1 0.06 B-1 0.07 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 81 PM-e-11 0.04 A-1 0.06 B-1 0.07 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 82 PM-e-12 0.04 A-1 0.06 B-1 0.07 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 83 PM-e-13 0.04 A-1 0.06 B-1 0.07 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 84 PM-e-14 0.04 A-1 0.06 B-1 0.07 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 85 PM-e-15 0.04 A-1 0.06 B-1 0.07 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 86 PM-a-4 0.135 - - B-1 0.02 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 87 PM-a-4 0.12 A-2 0.035 - - C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 88 PM-a-4 0.155 - - - - C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 89 PM-a-4 0.1 A-2 0.035 B-1 0.02 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 90 PM-a-4 0.1 A-3 0.035 B-1 0.02 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 91 PM-a-4 0.1 A-4 0.035 B-1 0.02 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 92 PM-a-4 0.1 A-1 0.035 B-2 0.02 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 93 PM-a-4 0.1 A-1 0.035 B-3 0.02 C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 94 PM-a-4 0.1 A-1 0.035 B-1 0.02 C-2 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 95 PM-a-4 0.1 A-1 0.035 B-1 0.02 C-3 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 96 PM-a-4 0.1 A-1 0.035 B-1 0.02 C-4 99.4 D-1 0.17 E-1 0.3 F-1 400 Embodiment 97 PM-a-4 0.1 A-1 0.035 B-1 0.02 C-1 99.4 D-2 0.17 E-1 0.3 F-1 400 Embodiment 98 PM-a-4 0.1 A-1 0.035 B-1 0.02 C-1 99.4 D-3 0.17 E-1 0.3 F-1 400 Embodiment 99 PM-a-4 0.1 A-1 0.035 B-1 0.02 C-1 99.4 D-4 0.17 E-1 0.3 F-1 400 Embodiment 100 PM-a-4 0.1 A-1 0.035 B-1 0.02 C-1 99.4 D-5 0.17 E-1 0.3 F-1 400 [Table 10] Infrared absorber (polymethine) Infrared absorber (other) Infrared absorber (other) Resin UV absorber Antioxidants Solvent Type Quality Type Quality Type Quality Type Quality Type Quality Type Quality Type Quality Embodiment 101 PM-a-4 0.1 A-1 0.035 B-1 0.02 C-1 99.4 D-6 0.17 E-1 0.3 F-1 400 Embodiment 102 PM-a-4 0.1 A-1 0.035 B-1 0.02 C-1 99.4 D-7 0.17 E-1 0.3 F-1 400 Embodiment 103 PM-a-4 0.1 A-1 0.035 B-1 0.02 C-1 99.4 D-8 0.17 E-1 0.3 F-1 400 Embodiment 104 PM-a-4 0.1 A-1 0.035 B-1 0.02 C-1 99.4 D-9 0.17 E-1 0.3 F-1 400 Embodiment 105 PM-a-4 0.1 A-1 0.035 B-1 0.02 C-1 99.4 D-1 0.17 E-2 0.3 F-1 400 Embodiment 106 PM-a-4 0.1 A-1 0.035 B-1 0.02 C-1 99.4 D-1 0.17 E-3 0.3 F-1 400 Embodiment 107 PM-a-4 0.1 A-1 0.035 B-1 0.02 C-1 99.4 D-1 0.17 E-4 0.3 F-1 400 Embodiment 108 PM-a-4 0.1 A-1 0.035 B-1 0.02 C-1 99.4 D-1 0.17 E-5 0.3 F-1 400 Embodiment 109 PM-a-4 0.1 A-1 0.035 B-1 0.02 C-1 99.4 D-1 0.17 E-6 0.3 F-1 400 Embodiment 110 PM-a-4 0.1 A-1 0.035 B-1 0.02 C-1 99.4 D-1 0.17 E-7 0.3 F-1 400 Embodiment 111 PM-a-4 0.1 A-1 0.035 B-1 0.02 C-1 99.4 D-1 0.17 E-1 E-5 0.15 0.15 F-1 400 Embodiment 112 PM-a-4 0.1 A-1 0.035 B-1 0.02 C-1 99.4 D-1 0.17 E-1 0.3 F-2 400 Embodiment 113 PM-a-4 0.1 A-1 0.035 B-1 0.02 C-1 99.4 D-1 0.17 E-1 0.3 F-3 F-4 280 120 Comparison Example 1 PM-x-1 0.1 - - - - C-1 99.4 D-1 0.17 E-1 0.3 F-1 400 [Table 11] Infrared absorber (polymethine) Infrared absorber (other) Infrared absorber (other) Resin Hardener UV absorber Antioxidants Surfactant Solvent Type Quality Type Quality Type Quality Type Quality Type Quality Type Quality Type Quality Type Quality Type Quality Embodiment 201 PM-a-1 0.5 A-1 0.2 B-1 0.1 C-5 95.1 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 202 PM-a-2 0.5 A-1 0.2 B-1 0.1 C-5 95.1 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 203 PM-a-3 0.5 A-1 0.2 B-1 0.1 C-5 95.1 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 204 PM-a-4 0.5 A-1 0.2 B-1 0.1 C-5 95.1 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 205 PM-a-5 0.5 A-1 0.2 B-1 0.1 C-5 95.1 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 206 PM-a-6 0.5 A-1 0.2 B-1 0.1 C-5 95.1 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 207 PM-a-7 0.5 A-1 0.2 B-1 0.1 C-5 95.1 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 208 PM-a-8 0.5 A-1 0.2 B-1 0.1 C-5 95.1 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 209 PM-a-9 0.5 A-1 0.2 B-1 0.1 C-5 95.1 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 210 PM-a-10 0.5 A-1 0.2 B-1 0.1 C-5 95.1 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 211 PM-a-11 0.5 A-1 0.2 B-1 0.1 C-5 95.1 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 212 PM-a-12 0.5 A-1 0.2 B-1 0.1 C-5 95.1 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 213 PM-a-13 0.5 A-1 0.2 B-1 0.1 C-5 95.1 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 214 PM-a-14 0.5 A-1 0.2 B-1 0.1 C-5 95.1 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 215 PM-a-15 0.5 A-1 0.2 B-1 0.1 C-5 95.1 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 216 PM-a-16 0.5 A-1 0.2 B-1 0.1 C-5 95.1 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 217 PM-a-17 0.5 A-1 0.2 B-1 0.1 C-5 95.1 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 218 PM-a-18 0.5 A-1 0.2 B-1 0.1 C-5 95.1 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 219 PM-a-19 0.5 A-1 0.2 B-1 0.1 C-5 95.1 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 220 PM-a-20 0.5 A-1 0.2 B-1 0.1 C-5 95.1 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 221 PM-a-21 0.5 A-1 0.2 B-1 0.1 C-5 95.1 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 222 PM-a-22 0.5 A-1 0.2 B-1 0.1 C-5 95.1 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 223 PM-a-23 0.5 A-1 0.2 B-1 0.1 C-5 95.1 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 224 PM-a-24 0.5 A-1 0.2 B-1 0.1 C-5 95.1 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 225 PM-a-25 0.5 A-1 0.2 B-1 0.1 C-5 95.1 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 [Table 12] Infrared absorber (polymethine) Infrared absorber (other) Infrared absorber (other) Resin Hardener UV absorber Antioxidants Surfactant Solvent Type Quality Type Quality Type Quality Type Quality Type Quality Type Quality Type Quality Type Quality Type Quality Embodiment 226 PM-b-1 1.0 A-1 0.2 B-1 0.4 C-5 94.3 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 227 PM-b-2 1.0 A-1 0.2 B-1 0.4 C-5 94.3 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 228 PM-b-3 1.0 A-1 0.2 B-1 0.4 C-5 94.3 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 229 PM-b-4 1.0 A-1 0.2 B-1 0.4 C-5 94.3 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 230 PM-b-5 1.0 A-1 0.2 B-1 0.4 C-5 94.3 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 231 PM-b-6 1.0 A-1 0.2 B-1 0.4 C-5 94.3 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 232 PM-b-7 1.0 A-1 0.2 B-1 0.4 C-5 94.3 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 233 PM-b-8 1.0 A-1 0.2 B-1 0.4 C-5 94.3 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 234 PM-b-9 1.0 A-1 0.2 B-1 0.4 C-5 94.3 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 235 PM-b-10 1.0 A-1 0.2 B-1 0.4 C-5 94.3 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 236 PM-b-11 1.0 A-1 0.2 B-1 0.4 C-5 94.3 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 237 PM-b-12 1.0 A-1 0.2 B-1 0.4 C-5 94.3 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 238 PM-b-13 1.0 A-1 0.2 B-1 0.4 C-5 94.3 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 239 PM-b-14 1.0 A-1 0.2 B-1 0.4 C-5 94.3 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 240 PM-b-15 1.0 A-1 0.2 B-1 0.4 C-5 94.3 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 241 PM-c-1 0.2 A-1 0.3 B-1 0.4 C-5 95.0 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 242 PM-c-2 0.2 A-1 0.3 B-1 0.4 C-5 95.0 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 243 PM-c-3 0.2 A-1 0.3 B-1 0.4 C-5 95.0 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 244 PM-c-4 0.2 A-1 0.3 B-1 0.4 C-5 95.0 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 245 PM-c-5 0.2 A-1 0.3 B-1 0.4 C-5 95.0 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 246 PM-c-6 0.2 A-1 0.3 B-1 0.4 C-5 95.0 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 247 PM-c-7 0.2 A-1 0.3 B-1 0.4 C-5 95.0 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 248 PM-c-8 0.2 A-1 0.3 B-1 0.4 C-5 95.0 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 249 PM-c-9 0.2 A-1 0.3 B-1 0.4 C-5 95.0 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 250 PM-c-10 0.2 A-1 0.3 B-1 0.4 C-5 95.0 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 [Table 13] Infrared absorber (polymethine) Infrared absorber (other) Infrared absorber (other) Resin Hardener UV absorber Antioxidants Surfactant Solvent Type Quality Type Quality Type Quality Type Quality Type Quality Type Quality Type Quality Type Quality Type Quality Embodiment 251 PM-c-11 0.2 A-1 0.3 B-1 0.4 C-5 95.0 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 252 PM-c-12 0.2 A-1 0.3 B-1 0.4 C-5 95.0 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 253 PM-c-13 0.2 A-1 0.3 B-1 0.4 C-5 95.0 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 254 PM-c-14 0.2 A-1 0.3 B-1 0.4 C-5 95.0 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 255 PM-c-15 0.2 A-1 0.3 B-1 0.4 C-5 95.0 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 256 PM-d-1 0.2 A-1 0.3 B-1 0.4 C-5 95.0 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 257 PM-d-2 0.2 A-1 0.3 B-1 0.4 C-5 95.0 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 258 PM-d-3 0.2 A-1 0.3 B-1 0.4 C-5 95.0 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 259 PM-d-4 0.2 A-1 0.3 B-1 0.4 C-5 95.0 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 260 PM-d-5 0.2 A-1 0.3 B-1 0.4 C-5 95.0 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 261 PM-d-6 0.2 A-1 0.3 B-1 0.4 C-5 95.0 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 262 PM-d-7 0.2 A-1 0.3 B-1 0.4 C-5 95.0 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 263 PM-d-8 0.2 A-1 0.3 B-1 0.4 C-5 95.0 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 264 PM-d-9 0.2 A-1 0.3 B-1 0.4 C-5 95.0 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 265 PM-d-10 0.2 A-1 0.3 B-1 0.4 C-5 95.0 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 266 PM-d-11 0.2 A-1 0.3 B-1 0.4 C-5 95.0 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 267 PM-d-12 0.2 A-1 0.3 B-1 0.4 C-5 95.0 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 268 PM-d-13 0.2 A-1 0.3 B-1 0.4 C-5 95.0 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 269 PM-d-14 0.2 A-1 0.3 B-1 0.4 C-5 95.0 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 270 PM-d-15 0.2 A-1 0.3 B-1 0.4 C-5 95.0 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 271 PM-e-1 0.2 A-1 0.3 B-1 0.4 C-5 95.0 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 272 PM-e-2 0.2 A-1 0.3 B-1 0.4 C-5 95.0 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 273 PM-e-3 0.2 A-1 0.3 B-1 0.4 C-5 95.0 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 274 PM-e-4 0.2 A-1 0.3 B-1 0.4 C-5 95.0 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 275 PM-e-5 0.2 A-1 0.3 B-1 0.4 C-5 95.0 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 [Table 14] Infrared absorber (polymethine) Infrared absorber (other) Infrared absorber (other) Resin Hardener UV absorber Antioxidants Surfactant Solvent Type Quality Type Quality Type Quality Type Quality Type Quality Type Quality Type Quality Type Quality Type Quality Embodiment 276 PM-e-6 0.2 A-1 0.3 B-1 0.4 C-5 95.0 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 277 PM-e-7 0.2 A-1 0.3 B-1 0.4 C-5 95.0 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 278 PM-e-8 0.2 A-1 0.3 B-1 0.4 C-5 95.0 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 279 PM-e-9 0.2 A-1 0.3 B-1 0.4 C-5 95.0 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 280 PM-e-10 0.2 A-1 0.3 B-1 0.4 C-5 95.0 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 281 PM-e-11 0.2 A-1 0.3 B-1 0.4 C-5 95.0 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 282 PM-e-12 0.2 A-1 0.3 B-1 0.4 C-5 95.0 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 283 PM-e-13 0.2 A-1 0.3 B-1 0.4 C-5 95.0 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 284 PM-e-14 0.2 A-1 0.3 B-1 0.4 C-5 95.0 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 285 PM-e-15 0.2 A-1 0.3 B-1 0.4 C-5 95.0 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 286 PM-a-4 0.7 - - B-1 0.1 C-5 95.1 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 287 PM-a-4 0.6 A-2 0.2 - - C-5 95.1 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 288 PM-a-4 0.8 - - - - C-5 95.1 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 289 PM-a-4 0.5 A-2 0.2 B-1 0.1 C-5 95.1 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 290 PM-a-4 0.5 A-3 0.2 B-1 0.1 C-5 95.1 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 291 PM-a-4 0.5 A-4 0.2 B-1 0.1 C-5 95.1 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 292 PM-a-4 0.5 A-1 0.2 B-2 0.1 C-5 95.1 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 293 PM-a-4 0.5 A-1 0.2 B-3 0.1 C-5 95.1 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 294 PM-a-4 0.5 A-1 0.2 B-1 0.1 C-6 95.1 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 295 PM-a-4 0.5 A-1 0.2 B-1 0.1 C-7 95.1 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 296 PM-a-4 0.5 A-1 0.2 B-1 0.1 C-8 95.1 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 297 PM-a-4 0.5 A-1 0.2 B-1 0.1 C-9 95.1 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 298 PM-a-4 0.5 A-1 0.2 B-1 0.1 C-10 95.1 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 299 PM-a-4 0.5 A-1 0.2 B-1 0.1 C-11 C-13 47.6 47.5 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 300 PM-a-4 0.5 A-1 0.2 B-1 0.1 C-12 C-13 47.6 47.5 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 [Table 15] Infrared absorber (polymethine) Infrared absorber (other) Infrared absorber (other) Resin Hardener UV absorber Antioxidants Surfactant Solvent Type Quality Type Quality Type Quality Type Quality Type Quality Type Quality Type Quality Type Quality Type Quality Embodiment 301 PM-a-4 0.5 A-1 0.2 B-1 0.1 C-5 95.1 - - D-2 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 302 PM-a-4 0.5 A-1 0.2 B-1 0.1 C-5 95.1 - - D-3 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 303 PM-a-4 0.5 A-1 0.2 B-1 0.1 C-5 95.1 - - D-4 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 304 PM-a-4 0.5 A-1 0.2 B-1 0.1 C-5 95.1 - - D-5 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 305 PM-a-4 0.5 A-1 0.2 B-1 0.1 C-5 95.1 - - D-6 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 306 PM-a-4 0.5 A-1 0.2 B-1 0.1 C-5 95.1 - - D-7 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 307 PM-a-4 0.5 A-1 0.2 B-1 0.1 C-5 95.1 - - D-8 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 308 PM-a-4 0.5 A-1 0.2 B-1 0.1 C-5 95.1 - - D-9 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 309 PM-a-4 0.5 A-1 0.2 B-1 0.1 C-5 95.1 - - D-1 0.85 E-2 3.3 G-1 0.01 F-5 233 Embodiment 310 PM-a-4 0.5 A-1 0.2 B-1 0.1 C-5 95.1 - - D-1 0.85 E-3 3.3 G-1 0.01 F-5 233 Embodiment 311 PM-a-4 0.5 A-1 0.2 B-1 0.1 C-5 95.1 - - D-1 0.85 E-4 3.3 G-1 0.01 F-5 233 Embodiment 312 PM-a-4 0.5 A-1 0.2 B-1 0.1 C-5 95.1 - - D-1 0.85 E-5 3.3 G-1 0.01 F-5 233 Embodiment 313 PM-a-4 0.5 A-1 0.2 B-1 0.1 C-5 95.1 - - D-1 0.85 E-6 3.3 G-1 0.01 F-5 233 Embodiment 314 PM-a-4 0.5 A-1 0.2 B-1 0.1 C-5 95.1 - - D-1 0.85 E-7 3.3 G-1 0.01 F-5 233 Embodiment 315 PM-a-4 0.5 A-1 0.2 B-1 0.1 C-5 95.1 - - D-1 0.85 E-1 E-5 1.7 1.6 G-1 0.01 F-5 233 Embodiment 316 PM-a-4 0.5 A-1 0.2 B-1 0.1 C-5 95.1 - - D-1 0.85 E-1 3.3 G-2 0.01 F-5 233 Embodiment 317 PM-a-4 0.5 A-1 0.2 B-1 0.1 C-5 95.1 - - D-1 0.85 E-1 3.3 G-3 0.01 F-5 233 Embodiment 318 PM-a-4 0.5 A-1 0.2 B-1 0.1 C-5 95.1 - - D-1 0.85 E-1 3.3 G-4 0.01 F-5 233 Embodiment 319 PM-a-4 0.5 A-1 0.2 B-1 0.1 C-5 92.1 H-1 3 D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 320 PM-a-4 0.5 A-1 0.2 B-1 0.1 C-5 92.1 H-2 3 D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 321 PM-a-4 0.5 A-1 0.2 B-1 0.1 C-5 92.1 H-3 3 D-1 0.85 E-1 3.3 G-1 0.01 F-5 233 Embodiment 322 PM-a-4 0.5 A-1 0.2 B-1 0.1 C-5 95.1 - - D-1 0.85 E-1 3.3 G-1 0.01 F-6 233 Embodiment 323 PM-a-4 0.5 A-1 0.2 B-1 0.1 C-5 95.1 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 F-7 117 116 Comparison Example 2 PM-x-1 0.5 - - - - C-5 95.1 - - D-1 0.85 E-1 3.3 G-1 0.01 F-5 233

[Table 16] Infrared absorber (polymethine) Infrared absorber (other) Infrared absorber (other) Resin Sealing agent Polymeric compounds Type Quality Type Quality Type Quality Type Quality Type Quality Type Quality Embodiment 401 PM-a-1 10.0 A-1 3.5 B-1 2.0 C-14 76 - - I-1 20 Embodiment 402 PM-a-2 10.0 A-1 3.5 B-1 2.0 C-14 76 - - I-1 20 Embodiment 403 PM-a-3 10.0 A-1 3.5 B-1 2.0 C-14 76 - - I-1 20 Embodiment 404 PM-a-4 10.0 A-1 3.5 B-1 2.0 C-14 76 - - I-1 20 Embodiment 405 PM-a-5 10.0 A-1 3.5 B-1 2.0 C-14 76 - - I-1 20 Embodiment 406 PM-a-6 10.0 A-1 3.5 B-1 2.0 C-14 76 - - I-1 20 Embodiment 407 PM-a-7 10.0 A-1 3.5 B-1 2.0 C-14 76 - - I-1 20 Embodiment 408 PM-a-8 10.0 A-1 3.5 B-1 2.0 C-14 76 - - I-1 20 Embodiment 409 PM-a-9 10.0 A-1 3.5 B-1 2.0 C-14 76 - - I-1 20 Embodiment 410 PM-a-10 10.0 A-1 3.5 B-1 2.0 C-14 76 - - I-1 20 Embodiment 411 PM-a-11 10.0 A-1 3.5 B-1 2.0 C-14 76 - - I-1 20 Embodiment 412 PM-a-12 10.0 A-1 3.5 B-1 2.0 C-14 76 - - I-1 20 Embodiment 413 PM-a-13 10.0 A-1 3.5 B-1 2.0 C-14 76 - - I-1 20 Embodiment 414 PM-a-14 10.0 A-1 3.5 B-1 2.0 C-14 76 - - I-1 20 Embodiment 415 PM-a-15 10.0 A-1 3.5 B-1 2.0 C-14 76 - - I-1 20 Embodiment 416 PM-a-16 10.0 A-1 3.5 B-1 2.0 C-14 76 - - I-1 20 Embodiment 417 PM-a-17 10.0 A-1 3.5 B-1 2.0 C-14 76 - - I-1 20 Embodiment 418 PM-a-18 10.0 A-1 3.5 B-1 2.0 C-14 76 - - I-1 20 Embodiment 419 PM-a-19 10.0 A-1 3.5 B-1 2.0 C-14 76 - - I-1 20 Embodiment 420 PM-a-20 10.0 A-1 3.5 B-1 2.0 C-14 76 - - I-1 20 Embodiment 421 PM-a-21 10.0 A-1 3.5 B-1 2.0 C-14 76 - - I-1 20 Embodiment 422 PM-a-22 10.0 A-1 3.5 B-1 2.0 C-14 76 - - I-1 20 Embodiment 423 PM-a-23 10.0 A-1 3.5 B-1 2.0 C-14 76 - - I-1 20 Embodiment 424 PM-a-24 10.0 A-1 3.5 B-1 2.0 C-14 76 - - I-1 20 Embodiment 425 PM-a-25 10.0 A-1 3.5 B-1 2.0 C-14 76 - - I-1 20 Embodiment 426 PM-b-1 20.0 A-1 3.8 B-1 7.5 C-14 61 - - I-1 20 Embodiment 427 PM-b-2 20.0 A-1 3.8 B-1 7.5 C-14 61 - - I-1 20 Embodiment 428 PM-b-3 20.0 A-1 3.8 B-1 7.5 C-14 61 - - I-1 20 Embodiment 429 PM-b-4 20.0 A-1 3.8 B-1 7.5 C-14 61 - - I-1 20 Embodiment 430 PM-b-5 20.0 A-1 3.8 B-1 7.5 C-14 61 - - I-1 20 Embodiment 431 PM-b-6 20.0 A-1 3.8 B-1 7.5 C-14 61 - - I-1 20 Embodiment 432 PM-b-7 20.0 A-1 3.8 B-1 7.5 C-14 61 - - I-1 20 Embodiment 433 PM-b-8 20.0 A-1 3.8 B-1 7.5 C-14 61 - - I-1 20 Embodiment 434 PM-b-9 20.0 A-1 3.8 B-1 7.5 C-14 61 - - I-1 20 Embodiment 435 PM-b-10 20.0 A-1 3.8 B-1 7.5 C-14 61 - - I-1 20 Embodiment 436 PM-b-11 20.0 A-1 3.8 B-1 7.5 C-14 61 - - I-1 20 Embodiment 437 PM-b-12 20.0 A-1 3.8 B-1 7.5 C-14 61 - - I-1 20 Embodiment 438 PM-b-13 20.0 A-1 3.8 B-1 7.5 C-14 61 - - I-1 20 Embodiment 439 PM-b-14 20.0 A-1 3.8 B-1 7.5 C-14 61 - - I-1 20 Embodiment 440 PM-b-15 20.0 A-1 3.8 B-1 7.5 C-14 61 - - I-1 20 Embodiment 441 PM-c-1 4.0 A-1 6.0 B-1 7.0 C-14 75 - - I-1 20 Embodiment 442 PM-c-2 4.0 A-1 6.0 B-1 7.0 C-14 75 - - I-1 20 Embodiment 443 PM-c-3 4.0 A-1 6.0 B-1 7.0 C-14 75 - - I-1 20 Embodiment 444 PM-c-4 4.0 A-1 6.0 B-1 7.0 C-14 75 - - I-1 20 Embodiment 445 PM-c-5 4.0 A-1 6.0 B-1 7.0 C-14 75 - - I-1 20 [Table 17] Photopolymerization initiator UV absorber Antioxidants Surfactant Polymerization inhibitor Silane coupling agent Solvent Type Quality Type Quality Type Quality Type Quality Type Quality Type Quality Embodiment 401 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 402 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 403 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 404 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 405 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 406 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 407 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 408 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 409 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 410 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 411 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 412 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 413 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 414 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 415 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 416 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 417 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 418 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 419 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 420 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 421 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 422 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 423 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 424 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 425 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 426 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 427 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 428 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 429 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 430 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 431 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 432 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 433 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 434 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 435 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 436 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 437 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 438 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 439 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 440 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 441 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 442 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 443 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 444 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 445 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400

[Table 18] Infrared absorber (polymethine) Infrared absorber (other) Infrared absorber (other) Resin Sealing agent Polymeric compounds Type Quality Type Quality Type Quality Type Quality Type Quality Type Quality Embodiment 446 PM-c-6 4.0 A-1 6.0 B-1 7.0 C-14 75 - - I-1 20 Embodiment 447 PM-c-7 4.0 A-1 6.0 B-1 7.0 C-14 75 - - I-1 20 Embodiment 448 PM-c-8 4.0 A-1 6.0 B-1 7.0 C-14 75 - - I-1 20 Embodiment 449 PM-c-9 4.0 A-1 6.0 B-1 7.0 C-14 75 - - I-1 20 Embodiment 450 PM-c-10 4.0 A-1 6.0 B-1 7.0 C-14 75 - - I-1 20 Embodiment 451 PM-c-11 4.0 A-1 6.0 B-1 7.0 C-14 75 - - I-1 20 Embodiment 452 PM-c-12 4.0 A-1 6.0 B-1 7.0 C-14 75 - - I-1 20 Embodiment 453 PM-c-13 4.0 A-1 6.0 B-1 7.0 C-14 75 - - I-1 20 Embodiment 454 PM-c-14 4.0 A-1 6.0 B-1 7.0 C-14 75 - - I-1 20 Embodiment 455 PM-c-15 4.0 A-1 6.0 B-1 7.0 C-14 75 - - I-1 20 Embodiment 456 PM-d-1 4.0 A-1 6.0 B-1 7.0 C-14 75 - - I-1 20 Embodiment 457 PM-d-2 4.0 A-1 6.0 B-1 7.0 C-14 75 - - I-1 20 Embodiment 458 PM-d-3 4.0 A-1 6.0 B-1 7.0 C-14 75 - - I-1 20 Embodiment 459 PM-d-4 4.0 A-1 6.0 B-1 7.0 C-14 75 - - I-1 20 Embodiment 460 PM-d-5 4.0 A-1 6.0 B-1 7.0 C-14 75 - - I-1 20 Embodiment 461 PM-d-6 4.0 A-1 6.0 B-1 7.0 C-14 75 - - I-1 20 Embodiment 462 PM-d-7 4.0 A-1 6.0 B-1 7.0 C-14 75 - - I-1 20 Embodiment 463 PM-d-8 4.0 A-1 6.0 B-1 7.0 C-14 75 - - I-1 20 Embodiment 464 PM-d-9 4.0 A-1 6.0 B-1 7.0 C-14 75 - - I-1 20 Embodiment 465 PM-d-10 4.0 A-1 6.0 B-1 7.0 C-14 75 - - I-1 20 Embodiment 466 PM-d-11 4.0 A-1 6.0 B-1 7.0 C-14 75 - - I-1 20 Embodiment 467 PM-d-12 4.0 A-1 6.0 B-1 7.0 C-14 75 - - I-1 20 Embodiment 468 PM-d-13 4.0 A-1 6.0 B-1 7.0 C-14 75 - - I-1 20 Embodiment 469 PM-d-14 4.0 A-1 6.0 B-1 7.0 C-14 75 - - I-1 20 Embodiment 470 PM-d-15 4.0 A-1 6.0 B-1 7.0 C-14 75 - - I-1 20 Embodiment 471 PM-e-1 4.0 A-1 6.0 B-1 7.0 C-14 75 - - I-1 20 Embodiment 472 PM-e-2 4.0 A-1 6.0 B-1 7.0 C-14 75 - - I-1 20 Embodiment 473 PM-e-3 4.0 A-1 6.0 B-1 7.0 C-14 75 - - I-1 20 Embodiment 474 PM-e-4 4.0 A-1 6.0 B-1 7.0 C-14 75 - - I-1 20 Embodiment 475 PM-e-5 4.0 A-1 6.0 B-1 7.0 C-14 75 - - I-1 20 Embodiment 476 PM-e-6 4.0 A-1 6.0 B-1 7.0 C-14 75 - - I-1 20 Embodiment 477 PM-e-7 4.0 A-1 6.0 B-1 7.0 C-14 75 - - I-1 20 Embodiment 478 PM-e-8 4.0 A-1 6.0 B-1 7.0 C-14 75 - - I-1 20 Embodiment 479 PM-e-9 4.0 A-1 6.0 B-1 7.0 C-14 75 - - I-1 20 Embodiment 480 PM-e-10 4.0 A-1 6.0 B-1 7.0 C-14 75 - - I-1 20 Embodiment 481 PM-e-11 4.0 A-1 6.0 B-1 7.0 C-14 75 - - I-1 20 Embodiment 482 PM-e-12 4.0 A-1 6.0 B-1 7.0 C-14 75 - - I-1 20 Embodiment 483 PM-e-13 4.0 A-1 6.0 B-1 7.0 C-14 75 - - I-1 20 Embodiment 484 PM-e-14 4.0 A-1 6.0 B-1 7.0 C-14 75 - - I-1 20 Embodiment 485 PM-e-15 4.0 A-1 6.0 B-1 7.0 C-14 75 - - I-1 20 Embodiment 486 PM-a-4 13.5 - - B-1 2.0 C-14 76 - - I-1 20 Embodiment 487 PM-a-4 12.0 A-1 3.5 - - C-14 76 - - I-1 20 Embodiment 488 PM-a-4 15.5 - - - - C-14 76 - - I-1 20 Embodiment 489 PM-a-4 10.0 A-2 3.5 B-1 2.0 C-14 76 - - I-1 20 Embodiment 490 PM-a-4 10.0 A-3 3.5 B-1 2.0 C-14 76 - - I-1 20 [Table 19] Photopolymerization initiator UV absorber Antioxidants Surfactant Polymerization inhibitor Silane coupling agent Solvent Type Quality Type Quality Type Quality Type Quality Type Quality Type Quality Embodiment 446 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 447 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 448 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 449 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 450 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 451 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 452 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 453 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 454 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 455 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 456 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 457 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 458 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 459 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 460 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 461 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 462 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 463 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 464 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 465 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 466 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 467 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 468 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 469 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 470 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 471 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 472 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 473 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 474 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 475 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 476 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 477 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 478 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 479 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 480 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 481 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 482 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 483 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 484 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 485 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 486 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 487 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 488 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 489 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 490 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400

[Table 20] Infrared absorber (polymethine) Infrared absorber (other) Infrared absorber (other) Resin Sealing agent Polymeric compounds Type Quality Type Quality Type Quality Type Quality Type Quality Type Quality Embodiment 491 PM-a-4 10.0 A-4 3.5 B-1 2.0 C-14 76 - - I-1 20 Embodiment 492 PM-a-4 10.0 A-1 3.5 B-2 2.0 C-14 76 - - I-1 20 Embodiment 493 PM-a-4 10.0 A-1 3.5 B-3 2.0 C-14 76 - - I-1 20 Embodiment 494 PM-a-4 10.0 A-1 3.5 B-1 2.0 C-10 76 - - I-1 20 Embodiment 495 PM-a-4 10.0 A-1 3.5 B-1 2.0 C-15 76 - - I-1 20 Embodiment 496 PM-a-4 10.0 A-1 3.5 B-1 2.0 C-16 76 - - I-1 20 Embodiment 497 PM-a-4 10.0 A-1 3.5 B-1 2.0 C-17 76 - - I-1 20 Embodiment 498 PM-a-4 10.0 A-1 3.5 B-1 2.0 C-18 76 - - I-1 20 Embodiment 499 PM-a-4 10.0 A-1 3.5 B-1 2.0 C-14 76 - - I-2 20 Embodiment 500 PM-a-4 10.0 A-1 3.5 B-1 2.0 C-14 76 - - I-3 20 Embodiment 501 PM-a-4 10.0 A-1 3.5 B-1 2.0 C-14 76 - - I-1 20 Embodiment 502 PM-a-4 10.0 A-1 3.5 B-1 2.0 C-14 76 - - I-1 20 Embodiment 503 PM-a-4 10.0 A-1 3.5 B-1 2.0 C-14 76 - - I-1 20 Embodiment 504 PM-a-4 10.0 A-1 3.5 B-1 2.0 C-14 76 - - I-1 20 Embodiment 505 PM-a-4 10.0 A-1 3.5 B-1 2.0 C-14 76 - - I-1 20 Embodiment 506 PM-a-4 10.0 A-1 3.5 B-1 2.0 C-14 76 - - I-1 20 Embodiment 507 PM-a-4 10.0 A-1 3.5 B-1 2.0 C-14 76 - - I-1 20 Embodiment 508 PM-a-4 10.0 A-1 3.5 B-1 2.0 C-14 76 - - I-1 20 Embodiment 509 PM-a-4 10.0 A-1 3.5 B-1 2.0 C-14 76 - - I-1 20 Embodiment 510 PM-a-4 10.0 A-1 3.5 B-1 2.0 C-14 76 - - I-1 20 Embodiment 511 PM-a-4 10.0 A-1 3.5 B-1 2.0 C-14 76 - - I-1 20 Embodiment 512 PM-a-4 10.0 A-1 3.5 B-1 2.0 C-14 76 - - I-1 20 Embodiment 513 PM-a-4 10.0 A-1 3.5 B-1 2.0 C-14 76 - - I-1 20 Embodiment 514 PM-a-4 10.0 A-1 3.5 B-1 2.0 C-14 76 - - I-1 20 Embodiment 515 PM-a-4 10.0 A-1 3.5 B-1 2.0 C-14 76 - - I-1 20 Embodiment 516 PM-a-4 10.0 A-1 3.5 B-1 2.0 C-14 76 - - I-1 20 Embodiment 517 PM-a-4 10.0 A-1 3.5 B-1 2.0 C-14 76 - - I-1 20 Embodiment 518 PM-a-4 10.0 A-1 3.5 B-1 2.0 C-14 76 - - I-1 20 Embodiment 519 PM-a-4 10.0 A-1 3.5 B-1 2.0 C-14 76 - - I-1 20 Embodiment 520 PM-a-4 10.0 A-1 3.5 B-1 2.0 C-14 76 - - I-1 20 Embodiment 521 PM-a-4 10.0 A-1 3.5 B-1 2.0 C-14 76 - - I-1 20 Embodiment 522 PM-a-4 10.0 A-1 3.5 B-1 2.0 C-14 76 - - I-1 20 Embodiment 523 PM-a-4 10.0 A-1 3.5 B-1 2.0 C-14 76 - - I-1 20 Embodiment 524 PM-a-4 10.0 A-1 3.5 B-1 2.0 C-14 73 L-1 3 I-1 20 Embodiment 525 PM-a-4 10.0 A-1 3.5 B-1 2.0 C-14 73 L-2 3 I-1 20 Embodiment 526 PM-a-4 10.0 A-1 3.5 B-1 2.0 C-14 76 - - I-1 20 Embodiment 527 PM-a-4 10.0 A-1 3.5 B-1 2.0 C-14 76 - - I-1 20 Embodiment 528 PM-a-4 10.0 A-1 3.5 B-1 2.0 C-14 76 - - I-1 20 Comparison Example 3 PM-x-1 10.0 - - - - C-14 76 - - I-1 20 [Table 21] Photopolymerization initiator UV absorber Antioxidants Surfactant Polymerization inhibitor Silane coupling agent Solvent Type Quality Type Quality Type Quality Type Quality Type Quality Type Quality Embodiment 491 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 492 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 493 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 494 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 495 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 496 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 497 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 498 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 499 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 500 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 501 J-2 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 502 J-3 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 503 J-4 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 504 J-5 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 505 J-2 J-3 5 5 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 506 J-1 10 D-2 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 507 J-1 10 D-3 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 508 J-1 10 D-4 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 509 J-1 10 D-5 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 510 J-1 10 D-6 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 511 J-1 10 D-7 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 512 J-1 10 D-8 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 513 J-1 10 D-9 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 514 J-1 10 D-1 5 E-2 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 515 J-1 10 D-1 5 E-3 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 516 J-1 10 D-1 5 E-4 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 517 J-1 10 D-1 5 E-5 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 518 J-1 10 D-1 5 E-6 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 519 J-1 10 D-1 5 E-7 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 520 J-1 10 D-1 5 E-1 E-5 1.5 1.5 G-1 0.01 K-1 0.003 F-5 400 Embodiment 521 J-1 10 D-1 5 E-1 3 G-2 0.01 K-1 0.003 F-5 400 Embodiment 522 J-1 10 D-1 5 E-1 3 G-3 0.01 K-1 0.003 F-5 400 Embodiment 523 J-1 10 D-1 5 E-1 3 G-4 0.01 K-1 0.003 F-5 400 Embodiment 524 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 525 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400 Embodiment 526 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-6 400 Embodiment 527 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 F-7 200200 Embodiment 528 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 F-8 200200 Comparison Example 3 J-1 10 D-1 5 E-1 3 G-1 0.01 K-1 0.003 F-5 400

The details of the materials listed in the above table are as follows.

(Infrared absorber) PM-a-1 to PM-a-25, PM-b-1 to PM-b-15, PM-c-1 to PM-c-15, PM-d-1 to PM-d-15, PM-e-1 to PM-e-15: the compounds PM-a-1 to PM-a-25, PM-b-1 to PM-b-15, PM-c-1 to PM-c-15, PM-d-1 to PM-d-15, PM-e-1 to PM-e-15 shown in the specific examples of the above-mentioned specific compounds

PM-x-1: Compound with the following structure (comparative compound) [Chemical formula 14]

A-1 to A-4: Compounds with the following structures (squarylium compounds) [Chemical formula 15]

B-1 to B-3: Compounds with the following structures (phthalocyanine compounds) [Chemical formula 16]

(Resin) C-1: A resin having the following structure synthesized by the method described in Resin Synthesis Example 1 of Japanese Patent Publication No. 2021-134350 (weight average molecular weight 137,000, number average molecular weight 32,000, glass transition temperature 165°C) C-2: A resin having the following structure synthesized by the method described in Resin Synthesis Example 2 of Japanese Patent Publication No. 2021-134350 (weight average molecular weight 188,000, number average molecular weight 75,000, glass transition temperature 285°C) C-3: A resin having the following structure synthesized by the method described in Resin Synthesis Example 3 of Japanese Patent Publication No. 2021-134350 (the numerical value annotated on the main chain represents the molar ratio of the repeating unit. Glass transition temperature 310°C. Logarithmic viscosity 0.87) C-4: ACRYVIEWA (acrylic resin manufactured by NIPPON SHOKUBAI CO., LTD.) C-5: Resin having the following structure (the values attached to the main chain represent the mass ratio of the repeating units. Weight average molecular weight 26100, number average molecular weight 8600, epoxy equivalent 355 g/eq, acid value 163 mgKOH/g, glass transition temperature 133°C) C-6: Resin having the following structure (the values attached to the main chain represent the mass ratio of the repeating units. Weight average molecular weight 22900, number average molecular weight 8800, epoxy equivalent 316 g/eq, acid value 130 mgKOH/g, glass transition temperature 124°C) C-7: Resin with the following structure (the values attached to the main chain represent the mass ratio of the repeating units. Weight average molecular weight 18300, number average molecular weight 9100, epoxy equivalent 284g/eq, acid value 98mgKOH/g, glass transition temperature 134℃) C-8: Resin with the following structure (the values attached to the main chain represent the mass ratio of the repeating units. Weight average molecular weight 20000, number average molecular weight 8300, epoxy equivalent 284g/eq, acid value 130mgKOH/g, glass transition temperature 136℃) C-9: Resin having the following structure (the values attached to the main chain represent the mass ratio of the repeating units. Weight average molecular weight 21100, number average molecular weight 8500, epoxy equivalent 355 g/eq, acid value 157 mgKOH/g, glass transition temperature 157°C) C-10: Resin having the following structure (the values attached to the main chain represent the mass ratio of the repeating units. Weight average molecular weight 9500, number average molecular weight 5800) C-11: Resin having the following structure (the values attached to the main chain represent the mass ratio of the repeating units. Weight average molecular weight 23700, number average molecular weight 10300, epoxy equivalent 284 g/eq, glass transition temperature 83°C) C-12: EPICLON N-695 (phenolic varnish type epoxy resin manufactured by DIC Corporation) C-13: Resin with the following structure (the values attached to the main chain represent the molar ratio of the repeating units. Weight average molecular weight 30000, number average molecular weight 15100, acid value 113 mgKOH/g) C-14: Resin with the following structure (the values attached to the main chain represent the molar ratio of the repeating units. Weight average molecular weight 9700, number average molecular weight 5700, acid value 130mgKOH/g) C-15: Resin with the following structure (The values attached to the main chain represent the molar ratio of the repeating units. Weight average molecular weight 15100, number average molecular weight 7000, acid value 136mgKOH/g) C-16: Resin with the following structure (The values attached to the main chain represent the molar ratio of the repeating units. Weight average molecular weight 17000, number average molecular weight 7700, acid value 32mgKOH/g) C-17: Resin with the following structure (The values attached to the main chain represent the molar ratio of the repeating units. Weight average molecular weight 16000, number average molecular weight 5800, acid value 101mgKOH/g) C-18: Resin with the following structure (the numbers attached to the main chain represent the molar ratio of repeating units. Weight average molecular weight 10000, number average molecular weight 3900, acid value 69 mgKOH/g) [Chemical formula 17] [Chemical formula 18]

(Ultraviolet light absorber) D-1: Compound with the following structure (maximum absorption wavelength in dichloromethane is 394 nm) D-2: Uvinul 3050 (compound with the following structure manufactured by BASF) D-3: Tinuvin 477 (hydroxyphenyl trisulphonium-based ultraviolet light absorber manufactured by BASF) D-4: Tinuvin 326 (compound with the following structure manufactured by BASF) D-5: Compound (2)-22 described in International Publication No. 2021/131355 (compound with the following structure) D-6: Compound (1)-46 described in International Publication No. 2021/131355 (compound with the following structure) D-7: Compound A-1 described in International Publication No. 2021/132247 (compound with the following structure) D-8: NeoHeliopan 357 (Symrise AG: Compound of the following structure) D-9: Compound of the following structure [Chemical Formula 19]

(Antioxidant) E-1: ADEKA STAB AO-60 (Compound with the following structure manufactured by ADEKA CORPORATION) E-2: ADEKA STAB AO-80 (Compound with the following structure manufactured by ADEKA CORPORATION) E-3: Compound with the following structure E-4: ADEKA STAB 2112 (Compound with the following structure manufactured by ADEKA CORPORATION) E-5: ADEKA STAB PEP-36 (Compound with the following structure manufactured by ADEKA CORPORATION) E-6: ADEKA STAB HP-10 (Compound with the following structure manufactured by ADEKA CORPORATION) E-7: ADEKA STAB AO-412S (Compound with the following structure manufactured by ADEKA CORPORATION) [Chemical formula 20]

(Solvent) F-1: Dichloromethane F-2: N,N-dimethylacetamide F-3: Cyclohexane F-4: Xylene F-5: Cyclopentanone F-6: Cyclohexanone F-7: Propylene glycol monomethyl ether acetate (PGMEA) F-8: Propylene glycol monomethyl ether (PGME)

(Surfactant) G-1: FTX-218D (fluorine-based surfactant manufactured by Neos Corporation) G-2: MEGAFACE F-554 (fluorine-based surfactant manufactured by DIC Corporation) G-3: KF-6001 (polysilicone-based surfactant manufactured by Shin-Etsu Chemical Co., Ltd.) G-4: Compound having the following structure (weight average molecular weight 14,000, % values representing the ratio of repeating units are molar %) [Chemical Formula 21]

(Hardener) H-1: trimellitic acid H-2: 2-ethyl-4-methylimidazole H-3: methyltetrahydrophthalic anhydride

(Polymerizable compound) I-1: KAYARAD DPHA (mixture of dipentaerythritol hexaacrylate and dipentaerythritol pentaacrylate manufactured by Nippon Kayaku Co., Ltd.) I-2: KAYARAD RP-1040 (ethylene oxide-modified neopentylthritol tetraacrylate manufactured by Nippon Kayaku Co., Ltd.) I-3: ARONIX M-510 (polyacid-modified acrylic oligomer manufactured by TOAGOSEI CO., LTD.)

(Photopolymerization initiator) J-1: Irgacure OXE01 (oxime ester compound manufactured by BASF) J-2: Compound No. 1 described in International Publication No. 2017/169819 (compound having the following structure) J-3: Compound No. 10 described in International Publication No. 2017/169819 (compound having the following structure) J-4: Compound No. 5 described in Japanese Patent Publication No. 2019-168654 (compound having the following structure) J-5: Compound No. 73 described in Japanese Patent Publication No. 2019-168654 (compound having the following structure) [Chemical formula 22]

(Polymerization inhibitor) K-1: p-methoxyphenol (silane coupling agent) L-1, L-2: Compounds with the following structure [Chemical formula 23]

<Production of film> (Production Example 1) Production method of film using the composition of Examples 1 to 113 and Comparative Example 1 Each composition was cast on a glass substrate, dried at 20°C for 8 hours, and then peeled off from the glass substrate. The peeled coating was further dried at 100°C for 8 hours under reduced pressure to obtain a film with a thickness of 0.1 mm, a length of 60 mm, and a width of 60 mm.

(Manufacturing Example 2) Method for manufacturing a film using the composition of Examples 201 to 323 and Comparative Example 2 Each composition was applied to a glass substrate by spin coating, and then heated at 100°C for 2 minutes using a heating plate, and then heated at 200°C for 8 minutes for hardening, thereby obtaining a film with a thickness of 10 μm.

(Manufacturing Example 3) Method for manufacturing a film using the composition of Examples 401 to 528 and Comparative Example 3 Each composition was applied to a glass substrate by spin coating, and then heated at 100°C for 2 minutes using a heating plate, thereby obtaining a composition layer. The obtained composition layer was fully exposed using an i-ray stepper exposure device FPA-3000i5+ (manufactured by Canon Inc.) at an exposure amount of 500mJ/ ^cm2 . Then, the exposed composition layer was heated at 200°C for 5 minutes using a heating plate to perform a curing treatment, thereby obtaining a film with a thickness of 1.0μm.

<Performance evaluation> (Evaluation criteria for infrared shielding properties) The absorbance and transmittance of the obtained film in the wavelength range of 400 to 1100 nm were measured using a spectrophotometer U-4100 (manufactured by Hitachi High-Tech Corporation), and the wavelength (λmax) showing the maximum absorbance (Absλmax) was measured, and the infrared shielding properties were evaluated according to the following criteria. A: Average transmittance within the range of λmax±10nm ≤2% B: Average transmittance within the range of 2%＜λmax±10nm ≤4% C: Average transmittance within the range of 4%＜λmax±10nm ≤7% D: Average transmittance within the range of 7%＜λmax±10nm ≤10% E: Average transmittance within the range of 10%＜λmax±10nm

(Evaluation of visible light transmittance) The average transmittance of the obtained film in the wavelength range of 420 to 550 nm was measured using a spectrophotometer U-4100 (manufactured by Hitachi High-Tech Corporation), and the visible light transmittance was evaluated according to the following criteria. A: Average transmittance in the wavelength range of 420 nm to 550 nm ≥ 95% B: 92% ≤ Average transmittance in the wavelength range of 420 nm to 550 nm < 95% C: 89% ≤ Average transmittance in the wavelength range of 420 nm to 550 nm < 92% D: 86% ≤ Average transmittance in the wavelength range of 420 nm to 550 nm < 89% E: Average transmittance in the wavelength range of 420 nm to 550 nm < 86%

(Evaluation of light resistance) The obtained film was irradiated with 50,000 lux of light for 20 hours using a Xe lamp through an ultraviolet cutoff filter to conduct a light resistance test, and the ΔEab value of the color difference before and after light irradiation was measured using a colorimeter MCPD-1000 (manufactured by Otsuka Electronics Co., Ltd.). The smaller the ΔEab value, the better the light resistance. The ΔEab value is the value obtained by the following color difference formula based on the CIE1976 (L*, a*, b*) spatial color system (New Color Science Handbook compiled by the Japan Color Society (1985) page 266). ΔEab={（ΔL*） ² +（Δa*） ² +（Δb*） ² } ^1/2 A: ΔEab value < 2.5 B: 2.5 ≤ ΔEab value < 5 C: 5 ≤ ΔEab value < 10 D: 10 ≤ ΔEab value < 15 E: 15 ≤ ΔEab value

(Evaluation of storage stability) After storing each composition in a thermostat at 45°C for 3 days, a membrane was produced according to the above membrane production method. The obtained membrane was observed using a scanning electron microscope (measurement magnification = 10,000 times), and the number of foreign matter present in the range of 10μm×15μm was measured, and the storage stability was evaluated according to the following criteria. A: No foreign matter exists within the range of 10μm×15μm B: The number of foreign matter within the range of 10μm×15μm exceeds 0 and is less than 50 C: The number of foreign matter within the range of 10μm×15μm exceeds 50 and is less than 100 D: The number of foreign matter within the range of 10μm×15μm exceeds 100 and is less than 200 E: The number of foreign matter within the range of 10μm×15μm exceeds 200

[Table 22] Evaluation results Infrared shielding Visible light transmittance Lightfastness Preserve stability Embodiment 1 A A C A Embodiment 2 A A B A Embodiment 3 A A A A Embodiment 4 A A A A Embodiment 5 A A A A Embodiment 6 A A A A Embodiment 7 A A A A Embodiment 8 A A A A Embodiment 9 A A A A Embodiment 10 A A C A Embodiment 11 A A B A Embodiment 12 A B A A Embodiment 13 B B C A Embodiment 14 A A B A Embodiment 15 B B C B Embodiment 16 A A A A Embodiment 17 A A A A Embodiment 18 A A A A Embodiment 19 A A A A Embodiment 20 A A A A Embodiment 21 A A C C Embodiment 22 A A B A Embodiment 23 B B C C Embodiment 24 B B C C Embodiment 25 B B C C Embodiment 26 A A C A Embodiment 27 A A B A Embodiment 28 A A A A Embodiment 29 A A A A Embodiment 30 A A A A Embodiment 31 A A A A Embodiment 32 A A A A Embodiment 33 A A A A Embodiment 34 A A A A Embodiment 35 A A C A Embodiment 36 A A B A Embodiment 37 A B A A Embodiment 38 B B C A Embodiment 39 A A B A Embodiment 40 B B C B [Table 23] Evaluation results Infrared shielding Visible light transmittance Lightfastness Preserve stability Embodiment 41 A A C A Embodiment 42 A A B A Embodiment 43 A A A A Embodiment 44 A A A A Embodiment 45 A A A A Embodiment 46 A A A A Embodiment 47 A A A A Embodiment 48 A A A A Embodiment 49 A A A A Embodiment 50 A A C A Embodiment 51 A A B A Embodiment 52 A B A A Embodiment 53 B B C A Embodiment 54 A A B A Embodiment 55 B B C B Embodiment 56 A A C A Embodiment 57 A A B A Embodiment 58 A A A A Embodiment 59 A A A A Embodiment 60 A A A A Embodiment 61 A A A A Embodiment 62 A A A A Embodiment 63 A A A A Embodiment 64 A A A A Embodiment 65 A A C A Embodiment 66 A A B A Embodiment 67 A B A A Embodiment 68 B B C A Embodiment 69 A A B A Embodiment 70 B B C B Embodiment 71 A A D A Embodiment 72 A A C A Embodiment 73 A A B A Embodiment 74 A A A A Embodiment 75 A A B A Embodiment 76 A A A A Embodiment 77 A A B A Embodiment 78 A A B A Embodiment 79 A A A A Embodiment 80 A A C B [Table 24] Evaluation results Infrared shielding Visible light transmittance Lightfastness Preserve stability Embodiment 81 A A B A Embodiment 82 A B B A Embodiment 83 B B C A Embodiment 84 A A B A Embodiment 85 B B D B Embodiment 86 C A A A Embodiment 87 C A A A Embodiment 88 D A A A Embodiment 89 A A A A Embodiment 90 A A A A Embodiment 91 A A A A Embodiment 92 A A A A Embodiment 93 A A A A Embodiment 94 A A A A Embodiment 95 A A A A Embodiment 96 A A A A Embodiment 97 A A A A Embodiment 98 A A A A Embodiment 99 A A A A Embodiment 100 A A A A Embodiment 101 A A A A Embodiment 102 A A A A Embodiment 103 A A A A Embodiment 104 A A A A Embodiment 105 A A A A Embodiment 106 A A A A Embodiment 107 A A A A Embodiment 108 A A A A Embodiment 109 A A A A Embodiment 110 A A A A Embodiment 111 A A A A Embodiment 112 A A A A Embodiment 113 A A A A Comparison Example 1 D A E E

[Table 25] Evaluation results Infrared shielding Visible light transmittance Lightfastness Preserve stability Embodiment 201 A A C A Embodiment 202 A A B A Embodiment 203 A A A A Embodiment 204 A A A A Embodiment 205 A A A A Embodiment 206 A A A A Embodiment 207 A A A A Embodiment 208 A A A A Embodiment 209 A A A A Embodiment 210 A A C A Embodiment 211 A A B A Embodiment 212 A B A A Embodiment 213 B B C A Embodiment 214 A A B A Embodiment 215 B B C B Embodiment 216 A A A A Embodiment 217 A A A A Embodiment 218 A A A A Embodiment 219 A A A A Embodiment 220 A A A A Embodiment 221 A A C C Embodiment 222 A A B A Embodiment 223 B B C C Embodiment 224 B B C C Embodiment 225 B B C C Embodiment 226 A A C A Embodiment 227 A A B A Embodiment 228 A A A A Embodiment 229 A A A A Embodiment 230 A A A A Embodiment 231 A A A A Embodiment 232 A A A A Embodiment 233 A A A A Embodiment 234 A A A A Embodiment 235 A A C A Embodiment 236 A A B A Embodiment 237 A B A A Embodiment 238 B B C A Embodiment 239 A A B A Embodiment 240 B B C B [Table 26] Evaluation results Infrared shielding Visible light transmittance Lightfastness Preserve stability Embodiment 241 A A C A Embodiment 242 A A B A Embodiment 243 A A A A Embodiment 244 A A A A Embodiment 245 A A A A Embodiment 246 A A A A Embodiment 247 A A A A Embodiment 248 A A A A Embodiment 249 A A A A Embodiment 250 A A C A Embodiment 251 A A B A Embodiment 252 A B A A Embodiment 253 B B C A Embodiment 254 A A B A Embodiment 255 B B C B Embodiment 256 A A C A Embodiment 257 A A B A Embodiment 258 A A A A Embodiment 259 A A A A Embodiment 260 A A A A Embodiment 261 A A A A Embodiment 262 A A A A Embodiment 263 A A A A Embodiment 264 A A A A Embodiment 265 A A C A Embodiment 266 A A B A Embodiment 267 A B A A Embodiment 268 B B C A Embodiment 269 A A B A Embodiment 270 B B C B Embodiment 271 A A D A Embodiment 272 A A C A Embodiment 273 A A B A Embodiment 274 A A A A Embodiment 275 A A B A Embodiment 276 A A A A Embodiment 277 A A B A Embodiment 278 A A B A Embodiment 279 A A A A Embodiment 280 A A C A [Table 27] Evaluation results Infrared shielding Visible light transmittance Lightfastness Preserve stability Embodiment 281 A A B A Embodiment 282 A B B A Embodiment 283 B B C A Embodiment 284 A A B A Embodiment 285 B B D B Embodiment 286 C A A A Embodiment 287 C A A A Embodiment 288 D A A A Embodiment 289 A A A A Embodiment 290 A A A A Embodiment 291 A A A A Embodiment 292 A A A A Embodiment 293 A A A A Embodiment 294 A A A A Embodiment 295 A A A A Embodiment 296 A A A A Embodiment 297 A A A A Embodiment 298 A A A A Embodiment 299 A A A A Embodiment 300 A A A A Embodiment 301 A A A A Embodiment 302 A A A A Embodiment 303 A A A A Embodiment 304 A A A A Embodiment 305 A A A A Embodiment 306 A A A A Embodiment 307 A A A A Embodiment 308 A A A A Embodiment 309 A A A A Embodiment 310 A A A A Embodiment 311 A A A A Embodiment 312 A A A A Embodiment 313 A A A A Embodiment 314 A A A A Embodiment 315 A A A A Embodiment 316 A A A A Embodiment 317 A A A A Embodiment 318 A A A A Embodiment 319 A A A A Embodiment 320 A A A A Embodiment 321 A A A A Embodiment 322 A A A A Embodiment 323 A A A A Comparison Example 2 D A E E

[Table 28] Evaluation results Infrared shielding Visible light transmittance Lightfastness Preserve stability Embodiment 401 A A C A Embodiment 402 A A B A Embodiment 403 A A A A Embodiment 404 A A A A Embodiment 405 A A A A Embodiment 406 A A A A Embodiment 407 A A A A Embodiment 408 A A A A Embodiment 409 A A A A Embodiment 410 A A C A Embodiment 411 A A B A Embodiment 412 A B A A Embodiment 413 B B C A Embodiment 414 A A B A Embodiment 415 B B C B Embodiment 416 A A A A Embodiment 417 A A A A Embodiment 418 A A A A Embodiment 419 A A A A Embodiment 420 A A A A Embodiment 421 A A C C Embodiment 422 A A B A Embodiment 423 B B C C Embodiment 424 B B C C Embodiment 425 B B C C Embodiment 426 A A C A Embodiment 427 A A B A Embodiment 428 A A A A Embodiment 429 A A A A Embodiment 430 A A A A Embodiment 431 A A A A Embodiment 432 A A A A Embodiment 433 A A A A Embodiment 434 A A A A Embodiment 435 A A C A Embodiment 436 A A B A Embodiment 437 A B A A Embodiment 438 B B C A Embodiment 439 A A B A Embodiment 440 B B C B [Table 29] Evaluation results Infrared shielding Visible light transmittance Lightfastness Preserve stability Embodiment 441 A A C A Embodiment 442 A A B A Embodiment 443 A A A A Embodiment 444 A A A A Embodiment 445 A A A A Embodiment 446 A A A A Embodiment 447 A A A A Embodiment 448 A A A A Embodiment 449 A A A A Embodiment 450 A A C A Embodiment 451 A A B A Embodiment 452 A B A A Embodiment 453 B B C A Embodiment 454 A A B A Embodiment 455 B B C B Embodiment 456 A A C A Embodiment 457 A A B A Embodiment 458 A A A A Embodiment 459 A A A A Embodiment 460 A A A A Embodiment 461 A A A A Embodiment 462 A A A A Embodiment 463 A A A A Embodiment 464 A A A A Embodiment 465 A A C A Embodiment 466 A A B A Embodiment 467 A B A A Embodiment 468 B B C A Embodiment 469 A A B A Embodiment 470 B B C B Embodiment 471 A A D A Embodiment 472 A A C A Embodiment 473 A A B A Embodiment 474 A A A A Embodiment 475 A A B A Embodiment 476 A A A A Embodiment 477 A A B A Embodiment 478 A A B A Embodiment 479 A A A A Embodiment 480 A A C A [Table 30] Evaluation results Infrared shielding Visible light transmittance Lightfastness Preserve stability Embodiment 481 A A B A Embodiment 482 A B B A Embodiment 483 B B C A Embodiment 484 A A B A Embodiment 485 B B D B Embodiment 486 C A A A Embodiment 487 C A A A Embodiment 488 D A A A Embodiment 489 A A A A Embodiment 490 A A A A Embodiment 491 A A A A Embodiment 492 A A A A Embodiment 493 A A A A Embodiment 494 A A A A Embodiment 495 A A A A Embodiment 496 A A A A Embodiment 497 A A A A Embodiment 498 A A A A Embodiment 499 A A A A Embodiment 500 A A A A Embodiment 501 A A A A Embodiment 502 A A A A Embodiment 503 A A A A Embodiment 504 A A A A Embodiment 505 A A A A Embodiment 506 A A A A Embodiment 507 A A A A Embodiment 508 A A A A Embodiment 509 A A A A Embodiment 510 A A A A Embodiment 511 A A A A Embodiment 512 A A A A Embodiment 513 A A A A Embodiment 514 A A A A Embodiment 515 A A A A Embodiment 516 A A A A Embodiment 517 A A A A Embodiment 518 A A A A Embodiment 519 A A A A Embodiment 520 A A A A [Table 31] Evaluation results Infrared shielding Visible light transmittance Lightfastness Preserve stability Embodiment 521 A A A A Embodiment 522 A A A A Embodiment 523 A A A A Embodiment 524 A A A A Embodiment 525 A A A A Embodiment 526 A A A A Embodiment 527 A A A A Embodiment 528 A A A A Comparison Example 3 D A E E

As shown in the above table, the examples were evaluated as being superior in terms of visible light transmittance, infrared shielding properties, light resistance, and storage stability compared to the comparative examples.

110: Solid-state imaging element 111: Infrared cutoff filter 112: Color filter 114: Infrared transmission filter 115: Microlens 116: Flattening layer

FIG1 is a schematic diagram showing an embodiment of an infrared sensor.

Claims (14)

A composition comprising a compound represented by formula (1), a curable compound and a solvent, [Chemical Formula 1] In formula (1), ^X1 and ^X2 each independently represent an oxygen atom, a sulfur atom, a selenium atom, a tellurium atom or ^-NRX1- , ^RX1 represents a hydrogen atom, a halogen atom, an alkyl group, an aryl group, a heterocyclic group or an acyl group, ^R1 and ^R2 each independently represent an alkyl group, an alkoxy group, an acyl group, an acyloxy group, an alkoxycarbonyl _group , an aryl group, ^a heterocyclic group, ^-SR41 , _-SO2R42 , ^-OSO2R43 or ^{-NR44R45 , R41} to ^R43 each independently represent an alkyl group, an aryl group or a heterocyclic group, ^R44 and ^R45 each independently represent a hydrogen atom, a halogen atom, an alkyl group, an aryl group, a heterocyclic group, an acyl group or an alkoxycarbonyl group, and ^R44 and ^R45 may be linked to form a ring. R ³ to R ⁵ , R ¹¹ to R ¹⁴ , R ²¹ to R ²⁴ , R ³¹ and R ³² each independently represent a hydrogen atom, a halogen atom, a sulfone group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a phosphate group, an alkyl group, an aryl group, a heterocyclic group, an alkoxy group, an acyl group, -SR ⁵¹ , -SO ₂ R ⁵² , -OSO ₂ R ⁵³ or -NR ⁵⁴ R ⁵⁵ , R ⁵¹ to R ⁵³ each independently represent a hydrogen atom, an alkyl group, an aryl group or a heterocyclic group, R ⁵⁴ and R ⁵⁵ each independently represent a hydrogen atom, a halogen atom, an alkyl group, an aryl group, a heterocyclic group, an acyl group or an alkoxycarbonyl group, R ⁵⁴ and R ⁵⁵ may be linked to form a ring, R ³ to R ⁵ , R Adjacent two of R ¹¹ to R ¹⁴ and R ²¹ to R ²⁴ may be linked to each other to form a 5-8 membered ring, R ³¹ and R ³² may be linked to form a 5-8 membered ring, R ¹¹ and R ³¹ may be linked to form a 5-8 membered ring, R ²¹ and R ³² may be linked to form a 5-8 membered ring, m and n each independently represent an integer of 1 to 10, and A ^- represents an anion. The composition as described in claim 1, wherein m and n in the aforementioned formula (1) are independently 2 or 3. A composition as described in claim 1 or claim 2, wherein m and n in the aforementioned formula (1) are the same integer. The composition as claimed in claim 1 or claim 2, wherein ^X1 and ^X2 in the aforementioned formula (1) each independently represent an oxygen atom or a sulfur atom. The composition as claimed in claim 1 or claim 2, wherein ^X1 and ^X2 in the aforementioned formula (1) are oxygen atoms. The composition as described in claim 1 or claim 2, further comprising an infrared absorber other than the compound represented by the aforementioned formula (1). A membrane obtained using the composition described in any one of claims 1 to 6. A filter comprising the film as described in claim 7. A solid-state imaging element comprising the film described in claim 7. An image display device comprising the film as described in claim 7. An infrared sensor comprising the film as described in claim 7. A camera module comprising the film described in claim 7. A compound represented by formula (1), [Chemical Formula 2] In formula (1), ^X1 and ^X2 each independently represent an oxygen atom, a sulfur atom, a selenium atom, a tellurium atom or ^-NRX1- , ^RX1 represents a hydrogen atom, a halogen atom, an alkyl group, an aryl group, a heterocyclic group or an acyl group, ^R1 and ^R2 each independently represent an alkyl group, an alkoxy group, an acyl group, an acyloxy group, an alkoxycarbonyl _group , an aryl group, ^a heterocyclic group, ^-SR41 , _-SO2R42 , ^-OSO2R43 or ^{-NR44R45 , R41} to ^R43 each independently represent an alkyl group, an aryl group or a heterocyclic group, ^R44 and ^R45 each independently represent a hydrogen atom, a halogen atom, an alkyl group, an aryl group, a heterocyclic group, an acyl group or an alkoxycarbonyl group, and ^R44 and ^R45 may be linked to form a ring. R ³ to R ⁵ , R ¹¹ to R ¹⁴ , R ²¹ to R ²⁴ , R ³¹ and R ³² each independently represent a hydrogen atom, a halogen atom, a sulfone group, a hydroxyl group, a cyano group, a nitro group, a carboxyl group, a phosphate group, an alkyl group, an aryl group, a heterocyclic group, an alkoxy group, an acyl group, -SR ⁵¹ , -SO ₂ R ⁵² , -OSO ₂ R ⁵³ or -NR ⁵⁴ R ⁵⁵ , R ⁵¹ to R ⁵³ each independently represent a hydrogen atom, an alkyl group, an aryl group or a heterocyclic group, R ⁵⁴ and R ⁵⁵ each independently represent a hydrogen atom, a halogen atom, an alkyl group, an aryl group, a heterocyclic group, an acyl group or an alkoxycarbonyl group, R ⁵⁴ and R ⁵⁵ may be linked to form a ring, R ³ to R ⁵ , R Adjacent two of R ¹¹ to R ¹⁴ and R ²¹ to R ²⁴ may be linked to each other to form a 5-8 membered ring, R ³¹ and R ³² may be linked to form a 5-8 membered ring, R ¹¹ and R ³¹ may be linked to form a 5-8 membered ring, R ²¹ and R ³² may be linked to form a 5-8 membered ring, m and n each independently represent an integer of 1 to 10, and A ^- represents an anion. An infrared absorber comprising the compound described in claim 13.