TW202413495A - Photocation hardenable silicone composition, silicone hardened material and optical element - Google Patents

Abstract

The present invention is a photo-cation-curable silicone composition comprising: (A) an epoxysilicone represented by the general formula (1), In the formula (1), Me is a methyl group, Ph is a phenyl group, ^RE is a monovalent substituent having 2 to 16 carbon atoms and containing an epoxide group, ^R1 is a monovalent alkyl group having 1 to 12 carbon atoms without an aliphatic unsaturated bond, ^R2 is a methyl group or a phenyl group, ^R3 is a divalent alkyl group having 1 to 5 carbon atoms or an oxygen atom, h is an integer of 1 to 10, i is an integer of 0 to 10, j is an integer of 0 to 10, and k is an integer of 1 to 100; and (B) a photocatalytic ion polymerization initiator; and the content of phenyl groups bonded to silicon atoms in component (A) is 40 mol% or more relative to the total number of monovalent substituents bonded to silicon atoms in component (A). Thereby, a silicon oxide composition is provided, which has a high refractive index and can be cured by ultraviolet irradiation, and can obtain a cured product with excellent hardness and strength.

Description

Photo-cation-hardened silicon oxide composition, silicon oxide hardener, and optical element

The present invention relates to a photo-cation ion-curable silicon oxide composition and a cured product thereof, and an optical device using the same.

A light emitting diode (LED) lamp as an optical semiconductor device is known to have a structure in which an LED mounted on a substrate is sealed with a sealing material composed of a transparent resin. From the viewpoint of having excellent heat resistance, an addition-curing silicone composition has been widely used as the sealing material.

In recent years, the performance requirements for optical materials have become higher due to the miniaturization, thinning, and high functionality of electronic devices. For example, in order to achieve efficient light focusing and diffusion, microlens materials widely used in optical communications require high hardness, high refractive index, and high strength. In addition, in order to save energy, the heating step when curing the material is greatly reduced, so the demand for light-curing resins that can be cured at low temperatures by irradiation with ultraviolet light is increasing.

Furthermore, in the display field, a quantum dot display is being developed that uses quantum dots with excellent wavelength conversion efficiency and features low power consumption and high precision. However, such quantum dots contain sulfur, which becomes an addition catalyst poison, and thus has the problem of causing curing resistance in general addition-curing silicone. In addition, quantum dots have low heat resistance and are not suitable for manufacturing steps that require heat curing.

In response to such a problem, a radical-curing silicon oxide composition has been proposed that can be cured at low temperatures (Patent Document 1), but its mechanical properties are insufficient for applications requiring high hardness and high strength. [Prior Technical Document] (Patent Document)

Patent document 1: Japanese Patent Application Publication No. 2021-1296

[Problem to be solved by the invention] The present invention is completed in view of the above reasons, and its purpose is to provide a silicon oxide composition which has a high refractive index and can be cured by ultraviolet irradiation, and can obtain a cured product with excellent hardness and strength. [Technical means to solve the problem]

In order to solve the above-mentioned problems, the present invention provides a photo-cation-curable silicone composition comprising: (A) an epoxysilicone represented by the following general formula (1), In formula (1), Me is a methyl group, Ph is a phenyl group, R ^E is independently a monovalent substituent having 2 to 16 carbon atoms and containing an epoxide group, R ¹ is independently a substituted or unsubstituted monovalent alkyl group having 1 to 12 carbon atoms and having no aliphatic unsaturated bond, R ² is independently a methyl group or a phenyl group, R ³ are independently a substituted or unsubstituted divalent alkyl group having 1 to 5 carbon atoms or an oxygen atom, h is an integer of 1 to 10, i is an integer of 0 to 10, j is an integer of 0 to 10, and k is an integer of 1 to 100; the arrangement of the siloxane units in the brackets marked with h and i is arbitrary; and (B) a photocatalytic ion polymerization initiator; and the content of phenyl groups bonded to silicon atoms in the component (A) is 40 mol% or more relative to the total number of monovalent substituents bonded to silicon atoms in the component (A).

The photo-cation ion-curable silicone composition of the present invention has a high refractive index and can be cured by ultraviolet irradiation, and a cured product having excellent hardness and strength can be obtained.

In addition, preferably, in the above general formula (1), ^R2 is a phenyl group, ^R3 is an alkylene group having 1 to 3 carbon atoms, i is 0, j is 1, and k is 1.

If it is such a photo-ion-curing silicone composition, it has a higher refractive index and can obtain a cured product with better hardness and strength.

The composition may further contain: (C) epoxysiloxane other than the component (A).

By using such a component (C), the physical properties of the obtained cured product can be easily adjusted.

In addition, the present invention provides a cured silicon oxide material, which is a cured material of the above-mentioned photo-cation-curable silicon oxide composition.

Furthermore, the present invention provides an optical element having the above-mentioned cured silicon oxide.

The cured silicone of the present invention has excellent properties such as high refractive index, high hardness, and high strength, so it is more suitable for use in optical components such as sealing materials, lens materials, and coating materials. [Effects]

The photo-cation-curable silicone composition of the present invention can be cured by ultraviolet irradiation, and the cured product has excellent properties such as high refractive index, high hardness, and high strength, so it is more suitable for use in optical components such as sealing materials, lens materials, and coating materials.

As described above, there has been a long-standing effort to develop a silicon-oxygen composition that has a high refractive index and can be cured by ultraviolet irradiation to obtain a cured product having excellent hardness and strength.

The inventors of the present invention have made intensive researches to achieve the above-mentioned purpose and have discovered the following facts and completed the present invention: If a silicone resin composition includes the components (A) and (B) described below, the above-mentioned problem can be solved.

That is, the present invention is a photo-cation-curable silicone composition comprising: (A) an epoxysilicone represented by the following general formula (1), In formula (1), Me is a methyl group, Ph is a phenyl group, R ^E is independently a monovalent substituent having 2 to 16 carbon atoms and containing an epoxide group, R ¹ is independently a substituted or unsubstituted monovalent alkyl group having 1 to 12 carbon atoms and having no aliphatic unsaturated bond, R ² is independently a methyl group or a phenyl group, R ³ are independently a substituted or unsubstituted divalent alkyl group having 1 to 5 carbon atoms or an oxygen atom, h is an integer of 1 to 10, i is an integer of 0 to 10, j is an integer of 0 to 10, and k is an integer of 1 to 100; the arrangement of the siloxane units in the brackets marked with h and i is arbitrary; and (B) a photocatalytic ion polymerization initiator; and the content of phenyl groups bonded to silicon atoms in the component (A) is 40 mol% or more relative to the total number of monovalent substituents bonded to silicon atoms in the component (A).

The present invention is described in detail below, but the present invention is not limited thereto.

[Photo-curable ion-curable silicone composition] The photo-curable ion-curable silicone composition of the present invention contains the components (A) and (B) described below as essential components. This composition can further contain arbitrary components in addition to the aforementioned essential components as needed. The following describes each component in detail.

[Component (A)] Component (A) is an epoxysiloxane represented by the following general formula (1): In formula (1), Me is a methyl group, Ph is a phenyl group, ^RE is each independently a monovalent substituent having 2 to 16 carbon atoms and containing an epoxide group, ^R1 is each independently a substituted or unsubstituted monovalent alkyl group having 1 to 12 carbon atoms and having no aliphatic unsaturated bond, ^R2 is each independently a methyl group or a phenyl group, ^R3 is each independently a substituted or unsubstituted divalent alkyl group having 1 to 5 carbon atoms or an oxygen atom, h is an integer of 1 to 10, i is an integer of 0 to 10, j is an integer of 0 to 10, and k is an integer of 1 to 100; the arrangement of the siloxane units in the parentheses indicated by h and i is arbitrary.

Specific examples of the monovalent substituent containing an epoxy group represented by ^RE include groups represented by the following formula (2) and the following formula (3), but the group is not limited thereto.

In formula (2) and formula (3), * represents a bond with an adjacent silicon atom.

The monovalent alkyl group represented by ^R1 may be exemplified by alkyl groups having 1 to 12 carbon atoms such as methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, dibutyl, tertiary butyl, n-pentyl, n-hexyl, n-octyl, n-decyl, cyclopentyl, cyclohexyl, etc.; aryl groups having 6 to 12 carbon atoms such as phenyl and naphthyl; alkylaryl groups having 7 to 12 carbon atoms such as tolyl, xylyl, ethylphenyl, propylphenyl, butylphenyl, pentylphenyl, hexylphenyl, etc.; aralkyl groups having 7 to 12 carbon atoms such as benzyl and phenethyl, etc., preferably methyl or phenyl.

Examples of the divalent hydrocarbon group represented by R ³ include methylene, ethylidene, trimethylene, tetramethylene, pentamethylene, etc., preferably methylene, ethylidene, trimethylene. These divalent hydrocarbon groups may have O (oxygen) interposed therein, for example, a part of which may be an ether group of -O-.

The content of phenyl groups bonded to silicon atoms in component (A) is 40 mol% or more, preferably 50 mol% or more, relative to the total number of monovalent substituents bonded to silicon atoms in component (A). If the content of phenyl groups is less than 40 mol%, the refractive index, hardness, strength, etc. may be reduced. On the other hand, the upper limit of the content of phenyl groups bonded to silicon atoms in component (A) relative to the total number of monovalent substituents bonded to silicon atoms is not particularly limited, and can be, for example, less than 100 mol%, preferably 90 mol% or less, more preferably 80 mol% or less, still more preferably 70 mol% or less, and extremely preferably 60 mol% or less.

h is an integer of 1 to 10, preferably an integer of 1 to 5, and more preferably 3. i is an integer of 0 to 10, and more preferably 0. j is an integer of 0 to 10, preferably an integer of 1 to 10, and more preferably 1. k is an integer of 1 to 100, preferably an integer of 1 to 10, and more preferably 1.

As can be seen from the above, the component (A) is preferably: in the general formula (1), ^R2 is a phenyl group, ^R3 is an alkylene group having 1 to 3 carbon atoms, i is 0, j is 1, and k is 1.

Suitable examples of the component (A) are shown below, but the invention is not limited to these.

The component (A) may be used alone or in combination of two or more.

[Component (B)] Component (B) is a photo-cationic polymerization initiator that generates cationic species upon ultraviolet irradiation, and is not particularly limited as long as it is a compound having such a function, and any compound can be used. For example, _{diaryliodonium} salts ^, _{triarylsonium} salts ^, triarylselenium salts, _{tetraarylphosphonium} salts _, aryldiazonium salts, etc. represented by ^{R42I + Y-} , ^{R43S + Y- ,} _R43Se ^{+ Y-} , ^{R44P + Y-} , R4N ^{+ Y-} ( ^R4 is an aryl group which may be substituted by an alkyl group, and Y- ^is an anion such as _SbF6- ^, _AsF6- , ^PF6- , _BF4- ^, _HSO4- ^, _ClO4- , ^etc. ).

Among them, bis(4-n-alkylphenyl)iodonium hexafluoroantiphonate represented by the following formula is preferred.

The amount of component (B) is preferably 0.1 to 20.0 parts by mass, more preferably 0.1 to 5.0 parts by mass, relative to 100 parts by mass of component (A). If the amount of component (B) is 0.1 parts by mass or more, sufficient curability can be reliably obtained.

[Component (C)] The photo-curable silicone composition of the present invention may contain epoxy silicone other than component (A) as component (C).

Examples of such epoxysiloxanes include those represented by the following general formulae (4) to (6), but are not limited thereto.

In formulae (4) to (6), ^RE , ^R1 and ^R2 are the same as ^RE , ^R1 and ^R2 in general formula (1) listed in component (A) above; p is an integer of 1 to 5, q is an integer of 3 to 7, r is an integer of 1 to 5, s is an integer of 4 to 82, and t is an integer of 1 to 40.

When the component (C) is used, the blending amount is preferably 1 to 50 parts by mass based on 100 parts by mass of the component (A).

[Other ingredients] In addition to the above-mentioned components (A) to (C), the photo-curable silicone composition of the present invention may also contain epoxy diluents, organic solvents, silicone, antioxidants, light stabilizers, adhesion promoters, reinforcing fillers, dyes, pigments, etc. as needed.

[Curing method and curing conditions] The photo-cation ion-curing type silica composition of the present invention can be cured by irradiating it with ultraviolet light or other light.

Examples of ultraviolet light sources include UVLED lamps, high-pressure mercury lamps, ultra-high-pressure mercury lamps, metal halogen lamps, carbon arc lamps, and xenon lamps. The ultraviolet irradiation dose (cumulative light dose) is preferably 100 to 18,000 mJ/cm ² , and more preferably 3,000 to 18,000 mJ/cm ² , relative to a sheet formed by molding the composition of the present invention into a thickness of about 2.0 mm. In other words, when ultraviolet light with an illumination of 100 mW/cm ² is used, curing can be achieved by irradiating the ultraviolet light for about 1 to 180 seconds.

In addition, after irradiation with ultraviolet light, heating at 40℃~200℃ can promote hardening.

[Silicon oxide hardened material and optical element] In addition, the present invention provides: a silicon oxide hardened material, which is a hardened material of the above-mentioned photo-cation-curable silicon oxide composition; and an optical element having the silicon oxide hardened material.

The photo-cation-curable silicone composition of the present invention can be cured by ultraviolet irradiation, and its cured product has excellent properties such as high refractive index, high hardness, and high strength, so it is more suitable for use in optical components such as sealing materials, lens materials, and coating materials. [Example]

The present invention is specifically described with reference to the following Examples and Comparative Examples, but the present invention is not limited thereto. The viscosity is a value measured at 25° C. using a B-type rotational viscometer.

[Synthesis Example 1] In a four-necked flask equipped with a stirrer, a cooling tube, a reflux cooler, a dropping funnel and a thermometer, 400 g of an organohydrotrisiloxane represented by the following structural formula (7) and 450 g of toluene were added, and the mixture was heated to 85°C using an oil bath.

0.57 g of a toluene solution of platinum hexachloride 1,3-divinyltetramethyldisiloxane complex (platinum concentration 0.5 mass%) was added thereto, and a solution of 545.5 g of the organopolysiloxane represented by the following formula (8) and 450 g of toluene was added dropwise over 1 hour while stirring. After the addition was completed, the mixture was stirred at 90°C for 2.5 hours. The toluene was distilled off under reduced pressure to obtain 926 g of the organohydropolysiloxane represented by the following formula (9) in a colorless, transparent oily state (viscosity at 25°C: 11,820 mPa・s).

In a four-necked flask equipped with a stirrer, a cooling tube, a reflux cooler, a dropping funnel and a thermometer, 37.6 g of 1,2-epoxy-4-vinylcyclohexane (trade name: CEL2000, manufactured by DAICEL Co., Ltd.), 70 g of toluene, 70 g of isopropyl alcohol, 0.115 g of a toluene solution of platinum hexachloride 1,3-divinyltetramethyldisiloxane complex (platinum concentration 0.5 mass%), and 0.201 g of acetonitrile were added, and heated to 80° C. using an oil bath.

A solution of 250 g of the organohydropolysiloxane represented by the above formula (9) and 130 g of toluene was dripped therein over 1 hour. After the dripping was completed, the mixture was stirred at 80°C for 2 hours. The toluene was distilled off under reduced pressure to obtain 281 g of epoxysilicone (A-1) in a colorless and transparent oily state (viscosity at 25°C: 16,040 mPa・s). In epoxysilicone (A-1), the content of phenyl groups bonded to silicon atoms was 50 mol% relative to the total number of monovalent substituents bonded to silicon atoms.

[Synthesis Example 2] In a four-necked flask equipped with a stirrer, cooling tube, reflux cooler, dropping funnel and thermometer, 34.6 g of 1-allyloxy-2,3-epoxypropane (trade name: allyl glycidyl ether, manufactured by Tokyo Chemical Industry Co., Ltd.) and 140 g of toluene were added and heated to 85°C.

0.171 g of a toluene solution of platinum hexachloride 1,3-divinyltetramethyldisiloxane complex (platinum concentration 0.5 mass%) was added thereto, and a solution of 250 g of the organohydropolysiloxane represented by the above formula (9) and 130 g of toluene was added dropwise over 1 hour while stirring. After the addition was completed, the mixture was stirred at 85°C for 2 hours. The toluene was distilled off under reduced pressure to obtain 266 g of epoxysilicone (A-2) in the form of a colorless and transparent oil (viscosity at 25°C: 7,960 mPa・s). In epoxysilicone (A-2), the content of phenyl groups bonded to silicon atoms was 50 mol% relative to the total number of monovalent substituents bonded to silicon atoms.

[Synthesis Example 3] In a four-necked flask equipped with a stirrer, a cooling tube, a reflux cooler, a dropping funnel and a thermometer, 191 g of an organohydrodisiloxane represented by the following structural formula (10) and 145 g of toluene were added, and the mixture was heated to 85°C using an oil bath.

0.084 g of a toluene solution of platinum hexachloride 1,3-divinyltetramethyldisiloxane complex (platinum concentration 0.5 mass%) was added thereto, and 88.2 g of 1,2-epoxy-4-vinylcyclohexane (trade name: CEL2000, manufactured by DAICEL Co., Ltd.) was added dropwise over 1 hour while stirring. After the addition was completed, the mixture was stirred at 85° C. for 3 hours. Toluene was distilled off under reduced pressure to obtain 174 g of an organohydrodisiloxane represented by the following structural formula (11).

In a four-necked flask equipped with a stirrer, a cooling tube, a reflux cooler, a dropping funnel and a thermometer, 12.5 g of the organohydrodisiloxane represented by the above structural formula (11) and 260 g of toluene were added, and the mixture was heated to 85° C. using an oil bath.

0.158 g of a toluene solution of platinum hexachloride 1,3-divinyltetramethyldisiloxane complex (platinum concentration 0.5 mass%) was added thereto, and a solution of 250 g of an organic polysiloxane represented by the following formula (12) and 100 g of toluene was added dropwise over 1 hour while stirring. After the addition was completed, the mixture was stirred at 85°C for 3 hours. The toluene was distilled off under reduced pressure to obtain 253 g of epoxysiloxane (C-1) in the form of a colorless and transparent oil (viscosity at 25°C: 10,690 mPa・s). In epoxysiloxane (C-1), the content of phenyl groups bonded to silicon atoms was 28 mol% relative to the total number of monovalent substituents bonded to silicon atoms.

In the formula, the arrangement order of the siloxane units in the brackets is not fixed.

[Synthesis Example 4] In a four-necked flask equipped with a stirrer, a cooling tube, a reflux cooler, a dropping funnel and a thermometer, 28.3 g of 1,2-epoxy-4-vinylcyclohexane (trade name: CEL2000, manufactured by DAICEL Co., Ltd.), 160 g of toluene, 28 g of isopropyl alcohol, 0.112 g of a toluene solution of platinum hexachloride 1,3-divinyltetramethyldisiloxane complex (platinum concentration 0.5 mass%), and 0.112 g of acetonitrile were added, and heated to 80°C using an oil bath.

100 g of the organohydropolysiloxane represented by the following formula (13) was dripped into the mixture over 2 hours. After the dripping was completed, the mixture was stirred at 80°C for 3 hours. Toluene was distilled off under reduced pressure to obtain 169 g of epoxysiloxane (C-2) in the form of a colorless and transparent oil (viscosity at 25°C: 330 mPa·s).

[Synthesis Example 5] In a four-necked flask equipped with a stirrer, a cooling tube, a reflux cooler, a dropping funnel and a thermometer, 82.0 g of 1,2-epoxy-4-vinylcyclohexane (trade name: CEL2000, manufactured by DAICEL Co., Ltd.), 127 g of toluene, 39 g of isopropyl alcohol, 0.072 g of a toluene solution of platinum hexachloride 1,3-divinyltetramethyldisiloxane complex (platinum concentration 0.5 mass%), and 0.126 g of acetonitrile were added, and heated to 80°C using an oil bath.

100 g of the organohydrosiloxane represented by the above formula (7) was dripped into the mixture over 2 hours. After the dripping was completed, the mixture was stirred at 80°C for 3 hours. Toluene was distilled off under reduced pressure to obtain 169 g of epoxysiloxane (C-3) in the form of a colorless and transparent oil (viscosity at 25°C: 330 mPa·s).

[Synthesis Example 6] In a four-necked flask equipped with a stirrer, a cooling tube, a reflux cooler, a dropping funnel and a thermometer, 219.3 g of 1,2-epoxy-4-vinylcyclohexane (trade name: CEL2000, manufactured by DAICEL Co., Ltd.), 307 g of toluene, 44 g of isopropyl alcohol, 0.219 g of a toluene solution of platinum hexachloride 1,3-divinyltetramethyldisiloxane complex (platinum concentration 0.5 mass%), and 0.219 g of acetonitrile were added, and heated to 80°C using an oil bath.

160 g of the organohydrosiloxane represented by the following formula (14) was dripped into the mixture over 1 hour. After the dripping was completed, the mixture was stirred at 75°C for 15 hours. Toluene was distilled off under reduced pressure to obtain 356 g of epoxysiloxane (C-4) in the form of a colorless and transparent oil (viscosity at 25°C: 54 mPa·s).

[Synthesis Example 7] In a four-necked flask equipped with a stirrer, a cooling tube, a reflux cooler, a dropping funnel and a thermometer, 190.1 g of 1,2-epoxy-4-vinylcyclohexane (trade name: CEL2000, manufactured by DAICEL Co., Ltd.) and 340 g of toluene were added, and heated to 85°C using an oil bath.

0.204 g of a toluene solution of platinum hexachloride 1,3-divinyltetramethyldisiloxane complex (platinum concentration 0.5 mass%) was added thereto, and 150 g of an organohydropolysiloxane represented by the following formula (15) was added dropwise over 1 hour while stirring. After the addition was completed, the mixture was stirred at 85°C for 5 hours. Toluene was distilled off under reduced pressure to obtain 304 g of epoxysiloxane (C-5) in the form of a colorless, transparent oil (viscosity at 25°C: 16,640 mPa・s).

[Examples 1 to 5 and Comparative Examples 1 and 2] The components shown below were mixed in the composition (mass parts) shown in Table 1 to prepare a photo-curable ion-curable silicone composition.

(A) Components: (A-1) Epoxysilane obtained in Synthesis Example 1

(A-2) Epoxysilyl obtained in Synthesis Example 2

(B) Component: (B-1) A mixture of 92% by mass of bis(4-n-alkylphenyl)iodonium hexafluoroantiphonate represented by the following formula and 8% by mass of acetonitrile

(C) Component (C-1) Epoxysilane obtained in Synthesis Example 3 In the formula, the arrangement order of the siloxane units in the brackets is not fixed.

(C-2) Epoxysilyl obtained in Synthesis Example 4

(C-3) Epoxysilyl obtained in Synthesis Example 5

(C-4) Epoxysilyl obtained in Synthesis Example 6

(C-5) Epoxysilyl obtained in Synthesis Example 7

[Table 1]

The photo-curable ion-curable silicone compositions obtained in Examples 1 to 5 and Comparative Examples 1 and 2 were evaluated by the following method. The results are shown in Table 2.

[Refractive Index] For photo-curable silicone compositions, the refractive index (nD25) was measured using a digital refractometer (model RX-9000i) manufactured by ATAGO Co., Ltd. using sodium D-rays as the light source at 25°C.

[Hardness] For photo-curable silicone compositions, the irradiation dose was 18,000 mJ/cm2 at a wavelength of 365 nm using the EYE UV electronic control unit (model UBX0601-01) manufactured by EYE GRAPHICS Co., Ltd., and the hardness of the ² mm thick cured product was measured in accordance with JIS K6253. Type A hardness.

[Tensile strength] For a 2 mm thick hardened product produced under the same conditions as the above hardness test, the maximum breaking force against the force in the tensile direction was measured at 23°C using a Strograph (Model VG1-E) manufactured by Toyo Seiki Co., Ltd.

[Table 2]

As shown in Table 2, Examples 1 to 5 use the photo-curable silicone composition of the present invention, and the obtained cured products have a high refractive index and are excellent in hardness and strength. On the other hand, in Comparative Example 1, component (A) is changed to epoxysilicone (C-1) having a low phenyl content and a long chain, but the hardness and tensile strength are poor. In addition, in Comparative Example 2, component (A) is changed to epoxysilicone (C-2) having no phenyl group, but the tensile strength is poor.

This specification contains the following invention.

[1] A photo-curable ion-curable silicone composition comprising: (A) an epoxysilicone represented by the following general formula (1), In formula (1), Me is a methyl group, Ph is a phenyl group, R ^E is independently a monovalent substituent having 2 to 16 carbon atoms and containing an epoxide group, R ¹ is independently a substituted or unsubstituted monovalent alkyl group having 1 to 12 carbon atoms and having no aliphatic unsaturated bond, R ² is independently a methyl group or a phenyl group, R ³ are independently a substituted or unsubstituted divalent alkyl group having 1 to 5 carbon atoms or an oxygen atom, h is an integer of 1 to 10, i is an integer of 0 to 10, j is an integer of 0 to 10, and k is an integer of 1 to 100; the arrangement of the siloxane units in the brackets marked with h and i is arbitrary; and (B) a photocatalytic ion polymerization initiator; and the content of phenyl groups bonded to silicon atoms in the component (A) is 40 mol% or more relative to the total number of monovalent substituents bonded to silicon atoms in the component (A).

[2] The photo-curable silicone composition according to [1], wherein, in the general formula (1), ^R2 is a phenyl group, ^R3 is an alkylene group having 1 to 3 carbon atoms, i is 0, j is 1, and k is 1.

[3] The photo-curable silicone composition as described in [1] or [2] above, further comprising: (C) an epoxy silicone other than the component (A) above.

[4] A cured silicon oxide material, characterized in that it is a cured silicon oxide material of the photo-ion-curable silicon oxide composition described in [1], [2] or [3].

[5] An optical element comprising the cured silicon oxide material described in [4] above.

Furthermore, the present invention is not limited to the above-mentioned embodiments. The above-mentioned embodiments are merely examples, and any embodiments that have substantially the same structure and produce the same effects as the technical concept described in the scope of the patent application of the present invention are included in the technical scope of the present invention.

Domestic storage information (please note in the order of storage institution, date, and number) None Foreign storage information (please note in the order of storage country, institution, date, and number) None

Claims (5)

A photo-cation-curable silicone composition is characterized by comprising: (A) an epoxysilicone represented by the following general formula (1), In formula (1), Me is a methyl group, Ph is a phenyl group, R ^E is independently a monovalent substituent having 2 to 16 carbon atoms and containing an epoxide group, R ¹ is independently a substituted or unsubstituted monovalent alkyl group having 1 to 12 carbon atoms and having no aliphatic unsaturated bond, R ² is independently a methyl group or a phenyl group, R ³ are independently a substituted or unsubstituted divalent alkyl group having 1 to 5 carbon atoms or an oxygen atom, h is an integer of 1 to 10, i is an integer of 0 to 10, j is an integer of 0 to 10, and k is an integer of 1 to 100; the arrangement of the siloxane units in the brackets marked with h and i is arbitrary; and (B) a photocatalytic ion polymerization initiator; and the content of phenyl groups bonded to silicon atoms in the component (A) is 40 mol% or more relative to the total number of monovalent substituents bonded to silicon atoms in the component (A). The photo-curable silicone composition according to claim 1, wherein in the general formula (1), ^R2 is a phenyl group, ^R3 is an alkylene group having 1 to 3 carbon atoms, i is 0, j is 1, and k is 1. The photo-cation-curable silicone composition according to claim 1 further comprises: (C) an epoxysilicone other than the component (A). A cured silicon oxide material, characterized in that it is a cured silicon oxide material of any one of claims 1 to 3. An optical component comprising the cured silicon oxide material of claim 4.