TW202411375A - Optical laminate and image display device - Google Patents
Optical laminate and image display device Download PDFInfo
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- TW202411375A TW202411375A TW112127380A TW112127380A TW202411375A TW 202411375 A TW202411375 A TW 202411375A TW 112127380 A TW112127380 A TW 112127380A TW 112127380 A TW112127380 A TW 112127380A TW 202411375 A TW202411375 A TW 202411375A
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- 230000003287 optical effect Effects 0.000 title claims abstract description 101
- 239000000178 monomer Substances 0.000 claims abstract description 160
- 239000000853 adhesive Substances 0.000 claims abstract description 157
- 230000001070 adhesive effect Effects 0.000 claims abstract description 157
- 239000000203 mixture Substances 0.000 claims abstract description 73
- 239000003999 initiator Substances 0.000 claims description 70
- -1 polyethylene terephthalate Polymers 0.000 claims description 70
- 125000000217 alkyl group Chemical group 0.000 claims description 52
- 239000010410 layer Substances 0.000 claims description 40
- 238000006116 polymerization reaction Methods 0.000 claims description 36
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 34
- 239000011247 coating layer Substances 0.000 claims description 31
- 239000000126 substance Substances 0.000 claims description 31
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 23
- 125000002947 alkylene group Chemical group 0.000 claims description 22
- 150000001875 compounds Chemical class 0.000 claims description 21
- 125000003342 alkenyl group Chemical group 0.000 claims description 19
- 229920000642 polymer Polymers 0.000 claims description 17
- 238000004873 anchoring Methods 0.000 claims description 16
- 238000011282 treatment Methods 0.000 claims description 16
- 125000003545 alkoxy group Chemical group 0.000 claims description 15
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 14
- 238000006243 chemical reaction Methods 0.000 claims description 13
- 229910052757 nitrogen Inorganic materials 0.000 claims description 12
- 239000002002 slurry Substances 0.000 claims description 12
- 125000006539 C12 alkyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 11
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 11
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 11
- 238000012986 modification Methods 0.000 claims description 10
- 230000004048 modification Effects 0.000 claims description 10
- 238000011156 evaluation Methods 0.000 claims description 9
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 9
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims description 8
- 229910052799 carbon Inorganic materials 0.000 claims description 8
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 claims description 8
- 125000002768 hydroxyalkyl group Chemical group 0.000 claims description 8
- NDWUBGAGUCISDV-UHFFFAOYSA-N 4-hydroxybutyl prop-2-enoate Chemical compound OCCCCOC(=O)C=C NDWUBGAGUCISDV-UHFFFAOYSA-N 0.000 claims description 7
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 claims description 7
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims description 7
- 238000000691 measurement method Methods 0.000 claims description 6
- 239000011259 mixed solution Substances 0.000 claims description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 5
- 239000001301 oxygen Substances 0.000 claims description 4
- 229910052760 oxygen Inorganic materials 0.000 claims description 4
- 125000004432 carbon atom Chemical group C* 0.000 claims description 3
- 238000005286 illumination Methods 0.000 claims description 2
- 239000010408 film Substances 0.000 description 166
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 69
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 39
- 239000003795 chemical substances by application Substances 0.000 description 26
- 230000001681 protective effect Effects 0.000 description 23
- 229920005989 resin Polymers 0.000 description 23
- 239000011347 resin Substances 0.000 description 23
- 239000000758 substrate Substances 0.000 description 20
- 229920001296 polysiloxane Polymers 0.000 description 18
- 239000000463 material Substances 0.000 description 16
- 239000004372 Polyvinyl alcohol Substances 0.000 description 13
- 238000000576 coating method Methods 0.000 description 13
- 229920002451 polyvinyl alcohol Polymers 0.000 description 13
- 238000001723 curing Methods 0.000 description 12
- 239000011248 coating agent Substances 0.000 description 11
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 11
- 238000012360 testing method Methods 0.000 description 11
- 238000003851 corona treatment Methods 0.000 description 10
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 239000000654 additive Substances 0.000 description 9
- 125000004093 cyano group Chemical group *C#N 0.000 description 9
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 9
- 238000002360 preparation method Methods 0.000 description 9
- 229920002554 vinyl polymer Polymers 0.000 description 9
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 8
- 239000003431 cross linking reagent Substances 0.000 description 8
- 239000003054 catalyst Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000006082 mold release agent Substances 0.000 description 7
- 125000004433 nitrogen atom Chemical group N* 0.000 description 7
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 6
- 239000006087 Silane Coupling Agent Substances 0.000 description 6
- 238000007259 addition reaction Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 6
- 229910052753 mercury Inorganic materials 0.000 description 6
- 239000012788 optical film Substances 0.000 description 6
- 229910052697 platinum Inorganic materials 0.000 description 6
- 229920000058 polyacrylate Polymers 0.000 description 6
- NLKNQRATVPKPDG-UHFFFAOYSA-M potassium iodide Chemical compound [K+].[I-] NLKNQRATVPKPDG-UHFFFAOYSA-M 0.000 description 6
- 238000007761 roller coating Methods 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 5
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical class C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 5
- 150000001721 carbon Chemical group 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- 238000004817 gas chromatography Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 5
- 238000011160 research Methods 0.000 description 5
- 125000004209 (C1-C8) alkyl group Chemical group 0.000 description 4
- UDJZTGMLYITLIQ-UHFFFAOYSA-N 1-ethenylpyrrolidine Chemical compound C=CN1CCCC1 UDJZTGMLYITLIQ-UHFFFAOYSA-N 0.000 description 4
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 4
- ZWVHTXAYIKBMEE-UHFFFAOYSA-N 2-hydroxyacetophenone Chemical class OCC(=O)C1=CC=CC=C1 ZWVHTXAYIKBMEE-UHFFFAOYSA-N 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 4
- 230000015556 catabolic process Effects 0.000 description 4
- 239000003086 colorant Substances 0.000 description 4
- 238000006731 degradation reaction Methods 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 229920000728 polyester Polymers 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- RWRDLPDLKQPQOW-UHFFFAOYSA-N tetrahydropyrrole Natural products C1CCNC1 RWRDLPDLKQPQOW-UHFFFAOYSA-N 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 125000004178 (C1-C4) alkyl group Chemical group 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- PCKZAVNWRLEHIP-UHFFFAOYSA-N 2-hydroxy-1-[4-[[4-(2-hydroxy-2-methylpropanoyl)phenyl]methyl]phenyl]-2-methylpropan-1-one Chemical compound C1=CC(C(=O)C(C)(O)C)=CC=C1CC1=CC=C(C(=O)C(C)(C)O)C=C1 PCKZAVNWRLEHIP-UHFFFAOYSA-N 0.000 description 3
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229920002284 Cellulose triacetate Polymers 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 3
- 239000006096 absorbing agent Substances 0.000 description 3
- 239000003522 acrylic cement Substances 0.000 description 3
- 239000003963 antioxidant agent Substances 0.000 description 3
- 239000002216 antistatic agent Substances 0.000 description 3
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 3
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 229910052740 iodine Inorganic materials 0.000 description 3
- 239000011630 iodine Substances 0.000 description 3
- 239000012948 isocyanate Substances 0.000 description 3
- 150000002513 isocyanates Chemical class 0.000 description 3
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 3
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 3
- 239000004014 plasticizer Substances 0.000 description 3
- 229920005992 thermoplastic resin Polymers 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- HGCMSCWGVAYWHR-UHFFFAOYSA-N 1,3,5-trimethyl-2-[[phenyl-[(2,4,6-trimethylphenyl)methyl]phosphoryl]methyl]benzene Chemical compound CC1=CC(C)=CC(C)=C1CP(=O)(C=1C=CC=CC=1)CC1=C(C)C=C(C)C=C1C HGCMSCWGVAYWHR-UHFFFAOYSA-N 0.000 description 2
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 2
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 2
- GAVHQOUUSHBDAA-UHFFFAOYSA-N 3-butyl-1-ethenylaziridin-2-one Chemical compound CCCCC1N(C=C)C1=O GAVHQOUUSHBDAA-UHFFFAOYSA-N 0.000 description 2
- DRIPCNMXVSPFBC-UHFFFAOYSA-N 3-ethenyl-1,2-thiazole Chemical compound C=CC=1C=CSN=1 DRIPCNMXVSPFBC-UHFFFAOYSA-N 0.000 description 2
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 2
- PGDIJTMOHORACQ-UHFFFAOYSA-N 9-prop-2-enoyloxynonyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCCCCOC(=O)C=C PGDIJTMOHORACQ-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- 101100012902 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) FIG2 gene Proteins 0.000 description 2
- 101100233916 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) KAR5 gene Proteins 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- 238000003848 UV Light-Curing Methods 0.000 description 2
- 150000008062 acetophenones Chemical class 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- 239000002318 adhesion promoter Substances 0.000 description 2
- 238000007754 air knife coating Methods 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- RDOXTESZEPMUJZ-UHFFFAOYSA-N anisole Chemical compound COC1=CC=CC=C1 RDOXTESZEPMUJZ-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- 150000001642 boronic acid derivatives Chemical class 0.000 description 2
- 125000000609 carbazolyl group Chemical class C1(=CC=CC=2C3=CC=CC=C3NC12)* 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000007766 curtain coating Methods 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N desyl alcohol Natural products C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- MHDVGSVTJDSBDK-UHFFFAOYSA-N dibenzyl ether Chemical class C=1C=CC=CC=1COCC1=CC=CC=C1 MHDVGSVTJDSBDK-UHFFFAOYSA-N 0.000 description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- GHLKSLMMWAKNBM-UHFFFAOYSA-N dodecane-1,12-diol Chemical compound OCCCCCCCCCCCCO GHLKSLMMWAKNBM-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000007756 gravure coating Methods 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 150000002596 lactones Chemical group 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 2
- 150000002923 oximes Chemical class 0.000 description 2
- 125000003884 phenylalkyl group Chemical group 0.000 description 2
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 2
- 238000000016 photochemical curing Methods 0.000 description 2
- 238000009832 plasma treatment Methods 0.000 description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 229920001230 polyarylate Polymers 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920006254 polymer film Polymers 0.000 description 2
- 229920005672 polyolefin resin Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 150000004053 quinones Chemical class 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- KZNICNPSHKQLFF-UHFFFAOYSA-N succinimide Chemical compound O=C1CCC(=O)N1 KZNICNPSHKQLFF-UHFFFAOYSA-N 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- 125000003866 trichloromethyl group Chemical group ClC(Cl)(Cl)* 0.000 description 2
- 125000006273 (C1-C3) alkyl group Chemical group 0.000 description 1
- 125000004169 (C1-C6) alkyl group Chemical group 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- VNQXSTWCDUXYEZ-UHFFFAOYSA-N 1,7,7-trimethylbicyclo[2.2.1]heptane-2,3-dione Chemical compound C1CC2(C)C(=O)C(=O)C1C2(C)C VNQXSTWCDUXYEZ-UHFFFAOYSA-N 0.000 description 1
- BQTPKSBXMONSJI-UHFFFAOYSA-N 1-cyclohexylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1CCCCC1 BQTPKSBXMONSJI-UHFFFAOYSA-N 0.000 description 1
- SJLLJZNSZJHXQN-UHFFFAOYSA-N 1-dodecylpyrrole-2,5-dione Chemical compound CCCCCCCCCCCCN1C(=O)C=CC1=O SJLLJZNSZJHXQN-UHFFFAOYSA-N 0.000 description 1
- OSSNTDFYBPYIEC-UHFFFAOYSA-N 1-ethenylimidazole Chemical compound C=CN1C=CN=C1 OSSNTDFYBPYIEC-UHFFFAOYSA-N 0.000 description 1
- PBGPBHYPCGDFEZ-UHFFFAOYSA-N 1-ethenylpiperidin-2-one Chemical compound C=CN1CCCCC1=O PBGPBHYPCGDFEZ-UHFFFAOYSA-N 0.000 description 1
- LEWNYOKWUAYXPI-UHFFFAOYSA-N 1-ethenylpiperidine Chemical compound C=CN1CCCCC1 LEWNYOKWUAYXPI-UHFFFAOYSA-N 0.000 description 1
- CTXUTPWZJZHRJC-UHFFFAOYSA-N 1-ethenylpyrrole Chemical compound C=CN1C=CC=C1 CTXUTPWZJZHRJC-UHFFFAOYSA-N 0.000 description 1
- HSKPJQYAHCKJQC-UHFFFAOYSA-N 1-ethylanthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2CC HSKPJQYAHCKJQC-UHFFFAOYSA-N 0.000 description 1
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 1
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 1
- KORJOGPPKPWOLT-UHFFFAOYSA-N 1-prop-1-enylpyrrolidine Chemical compound CC=CN1CCCC1 KORJOGPPKPWOLT-UHFFFAOYSA-N 0.000 description 1
- DGPVNNMFVYYVDF-UHFFFAOYSA-N 1-prop-2-enoylpyrrolidin-2-one Chemical compound C=CC(=O)N1CCCC1=O DGPVNNMFVYYVDF-UHFFFAOYSA-N 0.000 description 1
- NQDOCLXQTQYUDH-UHFFFAOYSA-N 1-propan-2-ylpyrrole-2,5-dione Chemical compound CC(C)N1C(=O)C=CC1=O NQDOCLXQTQYUDH-UHFFFAOYSA-N 0.000 description 1
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 1
- DQMOHZLFVGYNAN-UHFFFAOYSA-N 2-(2-phenylethenyl)-4,6-bis(trichloromethyl)-1,3,5-triazine Chemical compound ClC(Cl)(Cl)C1=NC(C(Cl)(Cl)Cl)=NC(C=CC=2C=CC=CC=2)=N1 DQMOHZLFVGYNAN-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- QRHHZFRCJDAUNA-UHFFFAOYSA-N 2-(4-methoxyphenyl)-4,6-bis(trichloromethyl)-1,3,5-triazine Chemical compound C1=CC(OC)=CC=C1C1=NC(C(Cl)(Cl)Cl)=NC(C(Cl)(Cl)Cl)=N1 QRHHZFRCJDAUNA-UHFFFAOYSA-N 0.000 description 1
- MPNIGZBDAMWHSX-UHFFFAOYSA-N 2-(4-methylphenyl)-4,6-bis(trichloromethyl)-1,3,5-triazine Chemical compound C1=CC(C)=CC=C1C1=NC(C(Cl)(Cl)Cl)=NC(C(Cl)(Cl)Cl)=N1 MPNIGZBDAMWHSX-UHFFFAOYSA-N 0.000 description 1
- LESMLVDJJCWZAJ-UHFFFAOYSA-N 2-(diphenylphosphorylmethyl)-1,3,5-trimethylbenzene Chemical compound CC1=CC(C)=CC(C)=C1CP(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 LESMLVDJJCWZAJ-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- FGTYTUFKXYPTML-UHFFFAOYSA-N 2-benzoylbenzoic acid Chemical compound OC(=O)C1=CC=CC=C1C(=O)C1=CC=CC=C1 FGTYTUFKXYPTML-UHFFFAOYSA-N 0.000 description 1
- JDCUKFVNOWJNBU-UHFFFAOYSA-N 2-ethenyl-1,3-thiazole Chemical compound C=CC1=NC=CS1 JDCUKFVNOWJNBU-UHFFFAOYSA-N 0.000 description 1
- HHTHWWIEDYRLEQ-UHFFFAOYSA-N 2-ethenyl-1,3-thiazolidine Chemical compound C=CC1NCCS1 HHTHWWIEDYRLEQ-UHFFFAOYSA-N 0.000 description 1
- LYGZOGDWCOYSGJ-UHFFFAOYSA-N 2-hydroxy-1-[4-[4-(2-hydroxy-2-methylpropanoyl)phenoxy]phenyl]-2-methylpropan-1-one Chemical compound C1=CC(C(=O)C(C)(O)C)=CC=C1OC1=CC=C(C(=O)C(C)(C)O)C=C1 LYGZOGDWCOYSGJ-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- 125000003229 2-methylhexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- MWDGNKGKLOBESZ-UHFFFAOYSA-N 2-oxooctanal Chemical compound CCCCCCC(=O)C=O MWDGNKGKLOBESZ-UHFFFAOYSA-N 0.000 description 1
- HAZQZUFYRLFOLC-UHFFFAOYSA-N 2-phenyl-4,6-bis(trichloromethyl)-1,3,5-triazine Chemical compound ClC(Cl)(Cl)C1=NC(C(Cl)(Cl)Cl)=NC(C=2C=CC=CC=2)=N1 HAZQZUFYRLFOLC-UHFFFAOYSA-N 0.000 description 1
- 125000004975 3-butenyl group Chemical group C(CC=C)* 0.000 description 1
- HDYTUPZMASQMOH-UHFFFAOYSA-N 4-ethenylmorpholine-3,5-dione Chemical compound C=CN1C(=O)COCC1=O HDYTUPZMASQMOH-UHFFFAOYSA-N 0.000 description 1
- YPIINMAYDTYYSQ-UHFFFAOYSA-N 5-ethenyl-1h-pyrazole Chemical compound C=CC=1C=CNN=1 YPIINMAYDTYYSQ-UHFFFAOYSA-N 0.000 description 1
- 125000006043 5-hexenyl group Chemical group 0.000 description 1
- YYVYAPXYZVYDHN-UHFFFAOYSA-N 9,10-phenanthroquinone Chemical compound C1=CC=C2C(=O)C(=O)C3=CC=CC=C3C2=C1 YYVYAPXYZVYDHN-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 125000002853 C1-C4 hydroxyalkyl group Chemical group 0.000 description 1
- 125000003892 C18 acyl group Chemical group 0.000 description 1
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- HIOUKDQHGAEQCU-UHFFFAOYSA-N ClC(C1=NC(C(Cl)(Cl)Cl)=NC(CC(C=C2)=CC3=C2OCO3)N1CC(C=C1)=CC2=C1OCO2)(Cl)Cl Chemical compound ClC(C1=NC(C(Cl)(Cl)Cl)=NC(CC(C=C2)=CC3=C2OCO3)N1CC(C=C1)=CC2=C1OCO2)(Cl)Cl HIOUKDQHGAEQCU-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 108010010803 Gelatin Proteins 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- AVXURJPOCDRRFD-UHFFFAOYSA-N Hydroxylamine Chemical compound ON AVXURJPOCDRRFD-UHFFFAOYSA-N 0.000 description 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- NQSMEZJWJJVYOI-UHFFFAOYSA-N Methyl 2-benzoylbenzoate Chemical compound COC(=O)C1=CC=CC=C1C(=O)C1=CC=CC=C1 NQSMEZJWJJVYOI-UHFFFAOYSA-N 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- GTTSNKDQDACYLV-UHFFFAOYSA-N Trihydroxybutane Chemical compound CCCC(O)(O)O GTTSNKDQDACYLV-UHFFFAOYSA-N 0.000 description 1
- 238000003302 UV-light treatment Methods 0.000 description 1
- DBHQYYNDKZDVTN-UHFFFAOYSA-N [4-(4-methylphenyl)sulfanylphenyl]-phenylmethanone Chemical compound C1=CC(C)=CC=C1SC1=CC=C(C(=O)C=2C=CC=CC=2)C=C1 DBHQYYNDKZDVTN-UHFFFAOYSA-N 0.000 description 1
- UIDZKLBCABAXMS-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCC(CO)CC1 UIDZKLBCABAXMS-UHFFFAOYSA-N 0.000 description 1
- MZVQCMJNVPIDEA-UHFFFAOYSA-N [CH2]CN(CC)CC Chemical group [CH2]CN(CC)CC MZVQCMJNVPIDEA-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 1
- 125000002252 acyl group Chemical group 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000005456 alcohol based solvent Substances 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 125000005376 alkyl siloxane group Chemical group 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 239000003849 aromatic solvent Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 125000005337 azoxy group Chemical group [N+]([O-])(=N*)* 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 229920006378 biaxially oriented polypropylene Polymers 0.000 description 1
- 239000011127 biaxially oriented polypropylene Substances 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 229930006711 bornane-2,3-dione Natural products 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000006059 cover glass Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- MGNCLNQXLYJVJD-UHFFFAOYSA-N cyanuric chloride Chemical compound ClC1=NC(Cl)=NC(Cl)=N1 MGNCLNQXLYJVJD-UHFFFAOYSA-N 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- KOMDZQSPRDYARS-UHFFFAOYSA-N cyclopenta-1,3-diene titanium Chemical class [Ti].C1C=CC=C1.C1C=CC=C1 KOMDZQSPRDYARS-UHFFFAOYSA-N 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001227 electron beam curing Methods 0.000 description 1
- 239000003759 ester based solvent Substances 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- 238000010559 graft polymerization reaction Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical compound CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 238000007602 hot air drying Methods 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 229920001477 hydrophilic polymer Polymers 0.000 description 1
- 125000004029 hydroxymethyl group Chemical group [H]OC([H])([H])* 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000004491 isohexyl group Chemical group C(CCC(C)C)* 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000004816 latex Substances 0.000 description 1
- 229920000126 latex Polymers 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- AWGZKFQMWZYCHF-UHFFFAOYSA-N n-octylprop-2-enamide Chemical compound CCCCCCCCNC(=O)C=C AWGZKFQMWZYCHF-UHFFFAOYSA-N 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- HMMGMWAXVFQUOA-UHFFFAOYSA-N octamethylcyclotetrasiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 HMMGMWAXVFQUOA-UHFFFAOYSA-N 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 125000005968 oxazolinyl group Chemical group 0.000 description 1
- 125000005702 oxyalkylene group Chemical group 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002958 pentadecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229960005235 piperonyl butoxide Drugs 0.000 description 1
- CLSUSRZJUQMOHH-UHFFFAOYSA-L platinum dichloride Chemical class Cl[Pt]Cl CLSUSRZJUQMOHH-UHFFFAOYSA-L 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 150000004291 polyenes Chemical class 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- QGKLPGKXAVVPOJ-UHFFFAOYSA-N pyrrolidin-3-one Chemical compound O=C1CCNC1 QGKLPGKXAVVPOJ-UHFFFAOYSA-N 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000005464 sample preparation method Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000011863 silicon-based powder Substances 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000001954 sterilising effect Effects 0.000 description 1
- 238000004659 sterilization and disinfection Methods 0.000 description 1
- 229960002317 succinimide Drugs 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- YBBRCQOCSYXUOC-UHFFFAOYSA-N sulfuryl dichloride Chemical compound ClS(Cl)(=O)=O YBBRCQOCSYXUOC-UHFFFAOYSA-N 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- NQRYJNQNLNOLGT-UHFFFAOYSA-N tetrahydropyridine hydrochloride Natural products C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 125000000026 trimethylsilyl group Chemical group [H]C([H])([H])[Si]([*])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 150000004901 trioxanes Chemical class 0.000 description 1
- 125000004417 unsaturated alkyl group Chemical group 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/023—Optical properties
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/30—Polarising elements
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/13363—Birefringent elements, e.g. for optical compensation
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
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Abstract
Description
本發明涉及光學積層體及影像顯示裝置。The present invention relates to an optical multilayer body and an image display device.
以液晶顯示裝置及電致發光(EL)顯示裝置為代表之各種影像顯示裝置一般具備有包含偏光薄膜等光學薄膜與黏著片之光學積層體。光學積層體所含之光學薄膜間之接合或光學積層體與影像顯示面板之接合通常係使用黏著片。典型上係使用藉由聚合及交聯使含丙烯酸單體或聚矽氧單體等之單體群硬化而成之片材作為黏著片。專利文獻1中揭示了一種由光硬化性組成物形成之黏著片(以下稱「光硬化型黏著片」)。在與其不同之類型方面,有藉由熱使含黏著劑組成物及溶劑之層硬化而形成之黏著片(以下稱「熱硬化型黏著片」)。
先前技術文獻
專利文獻
Various image display devices represented by liquid crystal display devices and electroluminescent (EL) display devices generally have an optical laminate including an optical film such as a polarizing film and an adhesive sheet. The bonding between the optical films contained in the optical laminate or the bonding between the optical laminate and the image display panel is usually performed using an adhesive sheet. Typically, a sheet formed by curing a monomer group containing an acrylic monomer or a polysilicone monomer by polymerization and crosslinking is used as the adhesive sheet.
專利文獻1:日本專利特開2016-155981號公報Patent document 1: Japanese Patent Publication No. 2016-155981
發明欲解決之課題 將光硬化型黏著片用於光學積層體時,相較於使用熱硬化型黏著片之情況,有於影像顯示裝置之影像品質上發生問題之傾向。上述問題特別容易發生在車載用等可能暴露於高溫環境下之影像顯示裝置中。 Problem to be solved by the invention When a photocurable adhesive sheet is used for an optical laminate, there is a tendency for problems to occur in the image quality of the image display device compared to the case of using a thermosetting adhesive sheet. The above problem is particularly prone to occur in image display devices that may be exposed to high temperature environments such as those for automotive use.
本發明目的在於提供一種光學積層體,其適於使用於可能暴露於高溫環境下之影像顯示裝置。The present invention aims to provide an optical multilayer body suitable for use in an image display device that may be exposed to a high temperature environment.
用以解決課題之手段 光學積層體一般包含有殘留於黏著片中之未反應單體等殘存單體。根據本案發明人之研討,光學積層體可包含之光學薄膜中,又以相位差薄膜容易受到殘存單體所致之影響。典型上,相位差薄膜容易產生因環境溫度反覆變化所致之裂痕。又,根據研討,比起熱硬化型黏著片,傾向於光硬化型黏著片中之所含殘存單體之量較多。其有可能係因受以下影響:因大氣中之氧,而特別容易阻礙光硬化型組成物在片材表面附近之硬化。 Means for solving the problem Optical laminates generally contain residual monomers such as unreacted monomers remaining in adhesive sheets. According to the research of the inventors of this case, among the optical films that can be contained in optical laminates, phase difference films are most susceptible to the influence of residual monomers. Typically, phase difference films are prone to cracks caused by repeated changes in ambient temperature. In addition, according to research, the amount of residual monomers contained in photocuring adhesive sheets tends to be greater than that in thermosetting adhesive sheets. This may be due to the following influence: due to oxygen in the atmosphere, it is particularly easy to hinder the curing of the photocuring composition near the surface of the sheet.
鑑於上述事項,本發明提供一種光學積層體,具備: 黏著片,其係由含單體群及/或前述單體群之部分聚合物的光硬化性組成物形成;及,相位差薄膜; 前述黏著片與前述相位差薄膜係直接或隔著厚度10µm以下之層相接;且 前述黏著片中所含之殘存單體之量為16000ppm(重量基準)以下。 In view of the above, the present invention provides an optical laminate having: an adhesive sheet formed of a photocurable composition containing a monomer group and/or a partial polymer of the monomer group; and a phase difference film; the adhesive sheet and the phase difference film are directly connected or connected via a layer with a thickness of less than 10µm; and the amount of residual monomers contained in the adhesive sheet is less than 16000ppm (weight basis).
另一面向中,本發明提供一種影像顯示裝置, 其具備上述本發明光學積層體。 In another aspect, the present invention provides an image display device, which has the above-mentioned optical multilayer body of the present invention.
發明效果 根據本發明,可提供一種光學積層體,其適於使用於可能暴露於高溫環境下之影像顯示裝置。 Effect of the invention According to the present invention, an optical multilayer body can be provided, which is suitable for use in an image display device that may be exposed to a high temperature environment.
本發明第1態樣之光學積層體,具備: 黏著片,其係由含單體群及/或前述單體群之部分聚合物的光硬化性組成物形成;及,相位差薄膜; 前述黏著片與前述相位差薄膜係直接或隔著厚度10µm以下之層相接;且 前述黏著片中所含之殘存單體之量為16000ppm(重量基準)以下。 The optical laminate of the first aspect of the present invention comprises: an adhesive sheet formed of a photocurable composition containing a monomer group and/or a partial polymer of the monomer group; and a phase difference film; the adhesive sheet and the phase difference film are directly connected or connected via a layer with a thickness of less than 10µm; and the amount of residual monomers contained in the adhesive sheet is less than 16000ppm (weight basis).
關於本發明第2態樣,例如第1態樣之光學積層體中,前述光學積層體具備2片以夾持前述相位差薄膜之方式配置之前述黏著片。Regarding the second aspect of the present invention, for example, in the optical multilayer body of the first aspect, the optical multilayer body has two adhesive sheets arranged in a manner of sandwiching the retardation film.
關於本發明第3態樣,例如第1或第2態樣之光學積層體具備2片以上前述黏著片,且,前述2片以上黏著片中所含之前述殘存單體之量合計為16000ppm(重量基準)以下。Regarding the third aspect of the present invention, for example, the optical laminate of the first or second aspect has two or more adhesive sheets, and the total amount of the residual monomer contained in the two or more adhesive sheets is less than 16000 ppm (weight basis).
關於本發明第4態樣,例如第1至第3態樣中任一態樣之光學積層體更具備偏光薄膜。Regarding the fourth aspect of the present invention, for example, the optical layered structure of any one of the first to third aspects is further provided with a polarizing film.
關於本發明第5態樣,例如第4態樣之光學積層體中,前述偏光薄膜係與前述相位差薄膜一同夾持住前述黏著片。Regarding the fifth aspect of the present invention, for example, in the optical layered structure of the fourth aspect, the polarizing film and the phase difference film together hold the adhesive sheet.
關於本發明第6態樣,例如第1至第5態樣中任一態樣之光學積層體中,前述單體群包含(甲基)丙烯酸系單體。In a sixth aspect of the present invention, for example, in the optical layered structure of any one of the first to fifth aspects, the monomer group includes a (meth)acrylic monomer.
關於本發明第7態樣,例如第1至第6態樣中任一態樣之光學積層體中,前述單體群包含含羧基單體。Regarding the seventh aspect of the present invention, for example, in the optical layer of any one of the first to sixth aspects, the monomer group includes a carboxyl group-containing monomer.
關於本發明第8態樣,例如第7態樣之光學積層體中,前述單體群中之前述含羧基單體之含有率為4.5重量%以上。In the eighth aspect of the present invention, for example, in the optical laminate of the seventh aspect, the content of the carboxyl group-containing monomer in the monomer group is 4.5% by weight or more.
關於本發明第9態樣,例如第1至第8態樣中任一態樣之光學積層體中,前述單體群包含含氮原子單體。Regarding the 9th aspect of the present invention, for example, in the optical layered structure of any one of the 1st to 8th aspects, the monomer group includes nitrogen-containing monomers.
關於本發明第10態樣,例如第1至第9態樣中任一態樣之光學積層體中,前述光硬化性組成物包含光聚合引發劑,且 前述光聚合引發劑係分子內具有以下式(1)所示化學結構之化合物; [化學式1] 前述式(1)之R 1及R 2彼此獨立為:C1~C8烷基;氫原子被-OH、C1~C4烷氧基、-CN、-COOR 51、-OOCR 52、或-NR 53R 54取代之C1~C4烷基;C3~C6烯基;或者,-CH 2-C 6H 4-R 55; R 1及R 2可相互鍵結而構成C2~C9伸烷基或C3~C6之氧伸烷基、或是氮雜伸烷基; X為-OR 56或-NR 57R 58; R 51為C1~C8烷基; R 52為C1~C4烷基; R 53及R 54彼此獨立為:氫原子、C1~C12烷基;氫原子被選自於由-OH、C1~C4烷氧基、-CN及-COOR 59所構成群組中之至少1種基取代之C2~C4烷基;C3~C5烯基;或者,環己基; R 53及R 54可相互鍵結為C3~C9伸烷基,且該C3~C9伸烷基可被-O-或-N(R 60)-中斷; R 55為C1~C4烷基; R 56為氫原子、-SiR 62 3、C1~C8烷基、或C3~C6烯基; R 57及R 58為:C1~C12烷基;氫原子被選自於由-OH、C1~C4烷氧基、-CN及-COOR 63所構成群組中之至少1種基取代之C2~C4烷基;C3~C5烯基;或者,環己基; R 57及R 58可相互鍵結為C3~C9伸烷基,且該C3~C9伸烷基可被-O-或-N(R 64)-中斷; R 59為C1~C4烷基; R 60為氫原子、C1~C4烷基、烯丙基、C1~C4羥烷基、-CH 2CH 2-COOR 61或-CH 2CH 2CN; R 61為C1~C4烷基; R 62為C1~C6烷基; R 63為C1~C4烷基; R 64為氫原子、C1~C4烷基、烯丙基、C1~C4羥烷基、-CH 2CH 2-COOR 65或-CH 2CH 2CN; R 65為C1~C4烷基; 前述化學結構可隔著前述式(1)中*所示碳原子而與氫原子或氫原子之取代結構鍵結。 In the tenth aspect of the present invention, for example, in the optical laminate of any one of the first to ninth aspects, the photocurable composition comprises a photopolymerization initiator, and the photopolymerization initiator is a compound having a chemical structure represented by the following formula (1) in the molecule; [Chemical Formula 1] In the above formula (1), R1 and R2 are independently: C1~C8 alkyl; C1~C4 alkyl whose hydrogen atom is substituted by -OH, C1~C4 alkoxy, -CN, -COOR51 , -OOCR52 , or -NR53R54 ; C3 ~C6 alkenyl; or, -CH2 - C6H4 -R55 ; R1 and R2 can be bonded to each other to form C2~C9 alkylene or C3~C6 oxygen alkylene or nitrogen heteroalkylene; X is -OR56 or -NR57R58 ; R51 is C1~C8 alkyl; R52 is C1~C4 alkyl; R53 and R54 are independently: hydrogen atom, C1~C12 alkyl; hydrogen atom is selected from -OH, C1~C4 alkoxy, -CN and -COOR51, -OOCR52 , or -NR53R54. R 53 and R 54 may be bonded to each other to form a C3~C9 alkylene group, and the C3~C9 alkylene group may be interrupted by -O- or -N(R 60 )-; R 55 is a C1~C4 alkyl group; R 56 is a hydrogen atom, -SiR 62 3 , a C1~C8 alkyl group, or a C3~C6 alkenyl group; R 57 and R 58 are: a C1~C12 alkyl group; a C2~C4 alkyl group substituted by at least one of the groups consisting of -OH, C1~C4 alkoxy, -CN and -COOR 63; a C3~C5 alkenyl group; or a cyclohexyl group; R 57 and R 58 are: a C1~C12 alkyl group; a C2~C4 alkyl group substituted by at least one of the groups consisting of -OH, C1~C4 alkoxy, -CN and -COOR 63 ; a C3~ C5 alkenyl group; or a cyclohexyl group; R 58 may be bonded to each other to form a C3~C9 alkylene group, and the C3~C9 alkylene group may be interrupted by -O- or -N(R 64 )-; R 59 is a C1~C4 alkyl group; R 60 is a hydrogen atom, a C1~C4 alkyl group, an allyl group, a C1~C4 hydroxyalkyl group, -CH 2 CH 2 -COOR 61 or -CH 2 CH 2 CN; R 61 is a C1~C4 alkyl group; R 62 is a C1~C6 alkyl group; R 63 is a C1~C4 alkyl group; R 64 is a hydrogen atom, a C1~C4 alkyl group, an allyl group, a C1~C4 hydroxyalkyl group, -CH 2 CH 2 -COOR 65 or -CH 2 CH 2 CN; R 65 is a C1~C4 alkyl group; The aforementioned chemical structure may be bonded to a hydrogen atom or a structure substituted with a hydrogen atom via the carbon atom represented by * in the aforementioned formula (1).
本發明第11態樣中,例如第1至第10態樣中任一態樣之光學積層體中,前述光硬化性組成物包含第1光聚合引發劑與第2光聚合引發劑,前述第1光聚合引發劑具有相對較小之第1反應速度,前述第2光聚合引發劑具有相對較大之第2反應速度;前述第2反應速度相對於前述第1反應速度的比藉由聚合率A的比來表示為1.1以上,該聚合率A係單一使用各個前述光聚合引發劑並利用以下測定方法評估而得者; [測定方法] 對作為單體之丙烯酸正丁酯99重量份及丙烯酸4-羥丁酯1重量份、以及評估對象之光聚合引發劑0.1重量份之混合溶液照射紫外線,製作出前述單體已部分聚合之單體漿;前述紫外線照射係實施至前述混合溶液在30℃下之黏度達20Pa・s為止;接著,於一對各自具有75µm厚度的聚對苯二甲酸乙二酯(PET)製片材之間,形成由所製出之前述單體漿構成之厚度20µm之塗佈層;接著,對前述塗佈層,從其中一前述PET製片材側照射以LED為光源之紫外線,該LED係於340nm±10nm具有峰值波長;前述照射之紫外線之照度及照射時間分別設為4mW/cm 2及1200秒;將對藉由前述紫外線照射而光硬化之前述塗佈層所測定之前述單體之聚合率特定為前述聚合率A。 In the 11th aspect of the present invention, for example, in the optical laminate of any one of the 1st to 10th aspects, the photocurable composition comprises a first photopolymerization initiator and a second photopolymerization initiator, the first photopolymerization initiator has a relatively small first reaction rate, and the second photopolymerization initiator has a relatively large second reaction rate; the ratio of the second reaction rate to the first reaction rate is expressed as a ratio of polymerization rate A of 1.1 or more, and the polymerization rate A is obtained by using each of the photopolymerization initiators alone and evaluating using the following measurement method; [Measurement method] A mixed solution of 99 parts by weight of n-butyl acrylate and 1 part by weight of 4-hydroxybutyl acrylate as monomers and 0.1 parts by weight of a photopolymerization initiator as an evaluation object was irradiated with ultraviolet light to prepare a monomer slurry in which the aforementioned monomers were partially polymerized; the aforementioned ultraviolet light irradiation was carried out until the viscosity of the aforementioned mixed solution at 30°C reached 20 Pa·s; then, a coating layer with a thickness of 20µm consisting of the aforementioned monomer slurry was formed between a pair of polyethylene terephthalate (PET) sheets each having a thickness of 75µm; then, the aforementioned coating layer was irradiated with ultraviolet light using an LED as a light source from one of the aforementioned PET sheets, the LED having a peak wavelength at 340nm±10nm; the illumination intensity and irradiation time of the aforementioned ultraviolet light were set to 4mW/cm 2 and 1200 seconds; the polymerization rate of the aforementioned monomer measured by the aforementioned coating layer photocured by the aforementioned ultraviolet irradiation is specifically referred to as the aforementioned polymerization rate A.
關於本發明第12態樣,例如第1至第11態樣中任一態樣之光學積層體中,前述黏著片具有經施行表面改質處理之表面。Regarding the twelfth aspect of the present invention, for example, in the optical laminate of any one of the first to eleventh aspects, the adhesive sheet has a surface that has been subjected to a surface modification treatment.
關於本發明第13態樣,例如第1至第12態樣中任一態樣之光學積層體中,前述黏著片之厚度為50µm以下。Regarding the 13th aspect of the present invention, for example, in the optical laminate of any one of the 1st to 12th aspects, the thickness of the adhesive sheet is less than 50µm.
關於本發明第14態樣,例如第1至第13態樣中任一態樣之光學積層體中,前述黏著片對前述相位差薄膜之投錨力在13N/25mm以上。Regarding the 14th aspect of the present invention, for example, in the optical laminate of any one of the 1st to 13th aspects, the anchoring force of the adhesive sheet on the phase difference film is greater than 13N/25mm.
本發明第15態樣之影像顯示裝置具備第1至第14態樣中任一態樣之光學積層體。The image display device of the 15th aspect of the present invention comprises an optical multilayer body of any one of the 1st to 14th aspects.
以下詳細說明本發明,惟本發明不受以下實施形態所限,可在不脫離本發明要旨之範圍內任意變更並實施。The present invention is described in detail below, but the present invention is not limited to the following implementation forms and can be arbitrarily modified and implemented within the scope of the gist of the present invention.
[光學積層體]
於圖1顯示本實施形態之光學積層體之一例。圖1之光學積層體10(10A)具備黏著片1與相位差薄膜2。黏著片1與相位差薄膜2係直接相接。惟,黏著片1與相位差薄膜2亦可隔著厚度10µm以下、宜為5µm以下之層相接。該層可為單層亦可為多層。該層之例為底塗層、抗靜電層、保護層、塗覆層及硬塗層。光學積層體10可作為附黏著片之光學薄膜使用。
[Optical laminate]
FIG. 1 shows an example of an optical laminate of the present embodiment. The optical laminate 10 (10A) of FIG. 1 has an
(黏著片)
黏著片1係由含單體群及/或上述單體群之部分聚合物的光硬化性組成物形成。光硬化性組成物係藉由光照射而形成黏著片1之組成物。黏著片1中所含之殘存單體之量為16000ppm以下。殘存單體之量亦可為15000ppm以下、12000ppm以下、10000ppm以下、9000ppm以下、8000ppm以下、7000ppm以下、6000ppm以下、5000ppm以下、小於5000ppm、4500ppm以下、4000ppm以下、3500ppm以下、3000ppm以下、2500ppm以下、2000ppm以下,更可為1500ppm以下。殘存單體之量為少量的黏著片1,其相位差薄膜2不易因環境溫度變化而產生裂痕。並且,殘存單體之量為16000ppm以下時,還適於提升對相位差薄膜2之投錨力,特別是少量之3500ppm以下、2500ppm以下、2000ppm以下之黏著片1亦適於提升對相位差薄膜2之投錨力。以已提高投錨力之黏著片1來說,藉由降低黏著片1中所含之低分子化合物之量,黏著片1之凝集力可能會提高。殘存單體之量的下限無特別限定,例如為300ppm以上,亦可為500ppm以上,更可為750ppm以上。殘存單體之量的下限在上述範圍內之黏著片1適於在對含相位差薄膜2之積層體照射光而形成黏著片1時抑制可能因光照射或熱而發生之相位差薄膜2之劣化。本說明書中,「ppm」皆為重量基準。
(Adhesive sheet)
The
黏著片1中之殘存單體之量可藉由氣相層析儀(GC)分析來評估。The amount of residual monomers in the
於圖2顯示本實施形態之光學積層體之另一例。圖2之光學積層體10(10B)具備2片以夾持相位差薄膜2之方式配置之黏著片1(1A、1B)。光學積層體10B依序具備黏著片1A、相位差薄膜2及黏著片1B。2片黏著片1A、1B中所含之殘存單體之量、換言之光學積層體10B具備2片以上黏著片1時,該2片以上黏著片1中所含之殘存單體之量合計可為16000ppm以下,亦可為15000ppm以下、12000ppm以下、10000ppm以下、小於10000ppm、9000ppm以下、8000ppm以下、7500ppm以下、7000ppm以下、6000ppm以下、5000ppm以下、4000ppm以下、3500ppm以下,更可為3000ppm以下。殘存單體之量之上述合計少之光學積層體10,其相位差薄膜2不易因環境溫度變化而產生裂痕。並且,殘存單體之量的合計為16000ppm以下時,還適於提升相位差薄膜2與黏著片1之間之投錨力,特別是少量之3500ppm以下、2500ppm以下、2000ppm以下之光學積層體10B亦適於提升相位差薄膜2與黏著片1之間之投錨力。該量的下限的合計例如為300ppm以上,亦可為500ppm以上、600ppm以上、750ppm以上,更可為1000ppm以上。下限在上述範圍內之光學積層體10B適於在對含相位差薄膜2之積層體照射光而形成黏著片1時抑制可能因光照射或熱而發生之相位差薄膜2之劣化。FIG2 shows another example of an optical laminate of the present embodiment. The optical laminate 10 (10B) of FIG2 has two adhesive sheets 1 (1A, 1B) arranged to sandwich a
黏著片1中所含之殘存單體之量會因以下事項而變化,例如:形成黏著片1所使用之光硬化性組成物之組成、光硬化性組成物中可包含之光聚合引發劑之種類及摻混量、黏著片1之形成條件及厚度、以及對黏著片1之後處理之種類及有無進行。後處理之一例為後述表面改質處理。The amount of residual monomers contained in the
於圖3顯示本實施形態之光學積層體之另一例。圖3之光學積層體10(10C)更具備偏光薄膜3。偏光薄膜3係與相位差薄膜2一同夾持住黏著片1(1A)。光學積層體10C依序具備偏光薄膜3、黏著片1A及相位差薄膜2。又,光學積層體10C依序具備偏光薄膜3、黏著片1A、相位差薄膜2及黏著片1B。惟,偏光薄膜3在光學積層體10中之位置不受該例所限。偏光薄膜3與黏著片1A係直接相接。惟,偏光薄膜3與黏著片1A亦可隔著厚度10µm以下、宜為5µm以下之層相接。該層之例如上述。FIG3 shows another example of the optical laminate of the present embodiment. The optical laminate 10 (10C) of FIG3 is further provided with a
偏光薄膜3有在光學薄膜中因熱所致之尺寸變化大之傾向。偏光薄膜3之尺寸變化會對同一光學積層體10中所含之相位差薄膜2賦予促使產生裂痕之力。因此,本發明特別有利於光學積層體10更具備偏光薄膜3之情況。
<光硬化性組成物>
可形成黏著片1之光硬化性組成物例如包含含(甲基)丙烯酸系單體之單體群及/或該單體群之部分聚合物。光硬化性組成物中之(甲基)丙烯酸系成分、亦即(甲基)丙烯酸系單體及其部分聚合物之含有率可為50重量%以上、60重量%以上、70重量%以上,更可為80重量%以上。此時,可形成以(甲基)丙烯酸聚合物及其交聯物為主成分之丙烯酸系黏著片。惟,光硬化性組成物不受上述例所限。本說明書中,(甲基)丙烯酸意指丙烯酸及甲基丙烯酸。(甲基)丙烯酸酯意指丙烯酸酯及甲基丙烯酸酯。
<Photocurable composition>
The photocurable composition that can form the
(甲基)丙烯酸系單體之例為於側鏈具有碳數1~20烷基之(甲基)丙烯酸烷基酯。烷基碳數可為7以下、6以下、5以下,更可為4以下。烷基可為直鏈狀,亦可具有支鏈。(甲基)丙烯酸烷基酯之例為:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸異丙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸二級丁酯、(甲基)丙烯酸三級丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸正戊酯、(甲基)丙烯酸異戊酯、(甲基)丙烯酸正己酯、(甲基)丙烯酸異己酯、(甲基)丙烯酸異庚酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸正辛酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸正壬酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸正癸酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸正十二酯((甲基)丙烯酸月桂酯)、(甲基)丙烯酸正十三酯、(甲基)丙烯酸正十四酯、(甲基)丙烯酸十五酯、(甲基)丙烯酸十六酯、(甲基)丙烯酸十七酯及(甲基)丙烯酸十八酯。(甲基)丙烯酸烷基酯亦可為(甲基)丙烯酸正丁酯。An example of a (meth)acrylic acid monomer is an alkyl (meth)acrylate having an alkyl group with 1 to 20 carbon atoms in the side chain. The carbon number of the alkyl group may be 7 or less, 6 or less, 5 or less, or even 4 or less. The alkyl group may be a straight chain or may have a branched chain. Examples of the alkyl (meth)acrylates are methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate, dibutyl (meth)acrylate, tertiary butyl (meth)acrylate, isobutyl (meth)acrylate, n-pentyl (meth)acrylate, isopentyl (meth)acrylate, n-hexyl (meth)acrylate, isohexyl (meth)acrylate, isoheptyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, n-octyl (meth)acrylate, isooctyl (meth)acrylate, n-nonyl (meth)acrylate, isononyl (meth)acrylate, n-decyl (meth)acrylate, isodecyl (meth)acrylate, n-dodecyl (meth)acrylate (lauryl (meth)acrylate), n-tridecyl (meth)acrylate, n-tetradecyl (meth)acrylate, pentadecyl (meth)acrylate, hexadecyl (meth)acrylate, heptadecanyl (meth)acrylate, and octadecyl (meth)acrylate. The alkyl (meth)acrylate may also be n-butyl (meth)acrylate.
單體群中之(甲基)丙烯酸烷基酯之含有率例如為40重量%以上,亦可為50重量%以上、60重量%以上、70重量%以上、80重量%以上、85重量%以上、90重量%以上,更可為95重量%以上。此外,在計算含有率時,部分聚合物之重量係換算成作為聚合前之各單體之重量。The content of the alkyl (meth)acrylate in the monomer group is, for example, 40% by weight or more, or 50% by weight or more, 60% by weight or more, 70% by weight or more, 80% by weight or more, 85% by weight or more, 90% by weight or more, or even 95% by weight or more. In calculating the content, the weight of the partial polymer is converted into the weight of each monomer before polymerization.
單體群亦可包含有含羧基單體。含羧基單體可為(甲基)丙烯酸系單體,換言之,(甲基)丙烯酸系單體亦可包含有含羧基單體。含羧基單體之例為(甲基)丙烯酸、(甲基)丙烯酸羧乙酯、(甲基)丙烯酸羧戊酯、伊康酸、馬來酸、延胡索酸及巴豆酸。單體群中之含羧基單體之含有率例如為0.1~15重量%。含有率的下限亦可為0.5重量%以上、1重量%以上、2.5重量%以上、4.5重量%以上、5重量%以上、7.5重量%以上,更可為9.5重量%以上。含有率的上限亦可為13重量%以下、11重量%以下、10重量%以下、9.5重量%以下,更可為7.5重量%以下。包含含羧基單體之單體群特別適於使用於降低黏著片1中之殘存單體之量。單體群亦可不包含有含羧基單體。The monomer group may also include carboxyl-containing monomers. The carboxyl-containing monomer may be a (meth) acrylic acid monomer, in other words, the (meth) acrylic acid monomer may also include carboxyl-containing monomers. Examples of carboxyl-containing monomers are (meth) acrylic acid, carboxyethyl (meth) acrylate, carboxypentyl (meth) acrylate, itaconic acid, maleic acid, fumaric acid and crotonic acid. The content of carboxyl-containing monomers in the monomer group is, for example, 0.1 to 15% by weight. The lower limit of the content may also be 0.5% by weight or more, 1% by weight or more, 2.5% by weight or more, 4.5% by weight or more, 5% by weight or more, 7.5% by weight or more, and may be 9.5% by weight or more. The upper limit of the content may also be 13% by weight or less, 11% by weight or less, 10% by weight or less, 9.5% by weight or less, and may be 7.5% by weight or less. The monomer group including the carboxyl group-containing monomer is particularly suitable for reducing the amount of residual monomers in the
單體群亦可包含有含羥基單體。含羥基單體可為(甲基)丙烯酸系單體,換言之,(甲基)丙烯酸系單體亦可包含有含羥基單體。含羥基單體可有助於提升黏著片之凝集力。含羥基單體之例為:(甲基)丙烯酸2-羥乙酯、(甲基)丙烯酸2-羥丙酯、(甲基)丙烯酸4-羥丁酯、(甲基)丙烯酸6-羥己酯、(甲基)丙烯酸8-羥辛酯、(甲基)丙烯酸10-羥癸酯、(甲基)丙烯酸12-羥月桂酯及(4-羥甲基環己基)-甲基丙烯酸酯。含羥基單體宜為(甲基)丙烯酸2-羥乙酯、(甲基)丙烯酸4-羥丁酯。單體群中之含羥基單體之含有率例如為5重量%以下,亦可為4重量%以下、3重量%以下、2重量%以下,更可為1重量%以下。含有率的下限例如為0.01重量%以上,亦可為0.05重量%以上,更可為0.1重量%以上。單體群亦可不包含有含羥基單體。The monomer group may also include a hydroxyl-containing monomer. The hydroxyl-containing monomer may be a (meth)acrylic monomer, in other words, the (meth)acrylic monomer may also include a hydroxyl-containing monomer. The hydroxyl-containing monomer may help to enhance the cohesive force of the adhesive sheet. Examples of hydroxyl-containing monomers are: 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate, 8-hydroxyoctyl (meth)acrylate, 10-hydroxydecyl (meth)acrylate, 12-hydroxylauryl (meth)acrylate and (4-hydroxymethylcyclohexyl)-methacrylate. The hydroxyl-containing monomer is preferably 2-hydroxyethyl (meth)acrylate and 4-hydroxybutyl (meth)acrylate. The content of the hydroxyl-containing monomer in the monomer group is, for example, 5% by weight or less, and may also be 4% by weight or less, 3% by weight or less, 2% by weight or less, or even 1% by weight or less. The lower limit of the content is, for example, 0.01% by weight or more, and may also be 0.05% by weight or more, or even 0.1% by weight or more. The monomer group may not contain a hydroxyl-containing monomer.
單體群亦可包含有含氮原子單體。根據本發明人等之研討,含氮原子單體可有助於降低殘存單體之量。含氮原子單體意指分子內(1分子內)具有至少1個氮原子之單體。此外,本說明書中,分子內具有羥基及氮原子之單體係分類成含氮原子單體。分子內具有羧基及氮原子之單體係分類成含羧基單體。The monomer group may also include nitrogen-containing monomers. According to the research of the inventors, nitrogen-containing monomers can help reduce the amount of residual monomers. Nitrogen-containing monomers refer to monomers having at least one nitrogen atom in the molecule (in one molecule). In addition, in this specification, monomers having a hydroxyl group and a nitrogen atom in the molecule are classified as nitrogen-containing monomers. Monomers having a carboxyl group and a nitrogen atom in the molecule are classified as carboxyl-containing monomers.
含氮原子單體宜為N-乙烯基環狀醯胺、(甲基)丙烯醯胺等。此外,含氮原子單體可單獨使用或亦可組合2種以上來使用。The nitrogen atom-containing monomer is preferably N-vinyl cycloamide, (meth)acrylamide, etc. The nitrogen atom-containing monomer may be used alone or in combination of two or more.
N-乙烯基環狀醯胺宜為下述式(A)所示者。 [化學式2] The N-vinyl cyclic amide is preferably represented by the following formula (A). [Chemical Formula 2]
式(A)中,R 1為2價有機基,宜為2價飽和烴基或不飽和烴基,較宜為2價飽和烴基(例如碳數3~5之伸烷基等)。此外,式(A)表示N與R 1藉由單鍵直接鍵結而形成環結構。 In formula (A), R1 is a divalent organic group, preferably a divalent saturated alkyl group or an unsaturated alkyl group, more preferably a divalent saturated alkyl group (such as an alkylene group having 3 to 5 carbon atoms). In addition, formula (A) indicates that N and R1 are directly bonded via a single bond to form a ring structure.
式(A)所示之N-乙烯基環狀醯胺宜為N-乙烯基-2-吡咯啶酮(NVP)、N-乙烯基-2-哌啶酮、N-乙烯基-2-己內醯胺、N-乙烯基-3-嗎福林、N-乙烯基-1,3-㗁𠯤-2-酮、N-乙烯基-3,5-嗎福林二酮等,較宜為N-乙烯基-2-吡咯啶酮、N-乙烯基-2-己內醯胺,更宜為N-乙烯基-2-吡咯啶酮。The N-vinyl cyclic amide represented by formula (A) is preferably N-vinyl-2-pyrrolidone (NVP), N-vinyl-2-piperidone, N-vinyl-2-caprolactam, N-vinyl-3-morpholin, N-vinyl-1,3-pyrrolidone, N-vinyl-3,5-morpholindione, etc., more preferably N-vinyl-2-pyrrolidone, N-vinyl-2-caprolactam, and more preferably N-vinyl-2-pyrrolidone.
(甲基)丙烯醯胺可舉例如(甲基)丙烯醯胺、N-烷基(甲基)丙烯醯胺、N,N-二烷基(甲基)丙烯醯胺等。N-烷基(甲基)丙烯醯胺可舉例如N-乙基(甲基)丙烯醯胺、N-異丙基(甲基)丙烯醯胺、N-正丁基(甲基)丙烯醯胺、N-辛基丙烯醯胺等。N-烷基(甲基)丙烯醯胺中還包含二甲基胺乙基(甲基)丙烯醯胺、二乙基胺乙基(甲基)丙烯醯胺、二甲基胺丙基(甲基)丙烯醯胺這類具有胺基之(甲基)丙烯醯胺。Examples of (meth)acrylamide include (meth)acrylamide, N-alkyl (meth)acrylamide, N,N-dialkyl (meth)acrylamide, etc. Examples of N-alkyl (meth)acrylamide include N-ethyl (meth)acrylamide, N-isopropyl (meth)acrylamide, N-n-butyl (meth)acrylamide, N-octyl acrylamide, etc. N-alkyl (meth)acrylamide also includes (meth)acrylamide having an amino group such as dimethylaminoethyl (meth)acrylamide, diethylaminoethyl (meth)acrylamide, and dimethylaminopropyl (meth)acrylamide.
N,N-二烷基(甲基)丙烯醯胺可列舉例如:N,N-二甲基(甲基)丙烯醯胺、N,N-二乙基(甲基)丙烯醯胺、N,N-二丙基(甲基)丙烯醯胺、N,N-二異丙基(甲基)丙烯醯胺、N,N-二(正丁基)(甲基)丙烯醯胺、N,N-二(三級丁基)(甲基)丙烯醯胺等。Examples of the N,N-dialkyl (meth)acrylamide include N,N-dimethyl (meth)acrylamide, N,N-diethyl (meth)acrylamide, N,N-dipropyl (meth)acrylamide, N,N-diisopropyl (meth)acrylamide, N,N-di(n-butyl) (meth)acrylamide, and N,N-di(tertiary butyl) (meth)acrylamide.
(甲基)丙烯醯胺還包含例如各種N-羥烷基(甲基)丙烯醯胺。N-羥烷基(甲基)丙烯醯胺可列舉例如:N-羥甲基(甲基)丙烯醯胺、N-(2-羥乙基)(甲基)丙烯醯胺、N-(2-羥丙基)(甲基)丙烯醯胺、N-(1-羥丙基)(甲基)丙烯醯胺、N-(3-羥丙基)(甲基)丙烯醯胺、N-(2-羥丁基)(甲基)丙烯醯胺、N-(3-羥丁基)(甲基)丙烯醯胺、N-(4-羥丁基)(甲基)丙烯醯胺、N-甲基-N-2-羥乙基(甲基)丙烯醯胺等。(Meth)acrylamide also includes, for example, various N-hydroxyalkyl (meth)acrylamide. Examples of N-hydroxyalkyl (meth)acrylamide include N-hydroxymethyl (meth)acrylamide, N-(2-hydroxyethyl) (meth)acrylamide, N-(2-hydroxypropyl) (meth)acrylamide, N-(1-hydroxypropyl) (meth)acrylamide, N-(3-hydroxypropyl) (meth)acrylamide, N-(2-hydroxybutyl) (meth)acrylamide, N-(3-hydroxybutyl) (meth)acrylamide, N-(4-hydroxybutyl) (meth)acrylamide, N-methyl-N-2-hydroxyethyl (meth)acrylamide, and the like.
(甲基)丙烯醯胺還包含例如各種N-烷氧基烷基(甲基)丙烯醯胺。N-烷氧基烷基(甲基)丙烯醯胺可舉例如N-甲氧基甲基(甲基)丙烯醯胺、N-丁氧基甲基(甲基)丙烯醯胺等。(Meth)acrylamide also includes, for example, various N-alkoxyalkyl (meth)acrylamide. Examples of N-alkoxyalkyl (meth)acrylamide include N-methoxymethyl (meth)acrylamide and N-butoxymethyl (meth)acrylamide.
N-乙烯基環狀醯胺、(甲基)丙烯醯胺以外之含氮原子單體可列舉例如:(甲基)丙烯酸胺乙酯、(甲基)丙烯酸二甲基胺乙酯、(甲基)丙烯酸二甲基胺丙酯、(甲基)丙烯酸三級丁基胺乙酯等含胺基單體;丙烯腈、甲基丙烯腈等含氰基單體;(甲基)丙烯醯基嗎福林、N-乙烯基哌𠯤、N-乙烯基吡咯、N-乙烯基咪唑、N-乙烯基吡𠯤、N-乙烯基嗎福林、N-乙烯基吡唑、乙烯基吡啶、乙烯基嘧啶、乙烯基㗁唑、乙烯基異㗁唑、乙烯基噻唑、乙烯基異噻唑、乙烯基嗒𠯤、(甲基)丙烯醯基吡咯啶酮、(甲基)丙烯醯基吡咯啶、(甲基)丙烯醯基哌啶、N-甲基乙烯基吡咯啶酮等含雜環單體;N-環己基馬來醯亞胺、N-異丙基馬來醯亞胺、N-月桂基馬來醯亞胺、N-苯基馬來醯亞胺等馬來醯亞胺系單體、N-甲基伊康醯亞胺、N-乙基伊康醯亞胺、N-丁基伊康醯亞胺、N-辛基伊康醯亞胺、N-2-乙基己基伊康醯亞胺、N-月桂基伊康醯亞胺、N-環己基伊康醯亞胺等伊康醯亞胺系單體、N-(甲基)丙烯醯氧基亞甲基琥珀醯亞胺、N-(甲基)丙烯醯基-6-氧基六亞甲基琥珀醯亞胺、N-(甲基)丙烯醯基-8-氧基八亞甲基琥珀醯亞胺等之琥珀醯亞胺系單體等含醯亞胺基單體;2-(甲基)丙烯醯氧基乙基異氰酸酯等含異氰酸酯基單體等。Examples of nitrogen-containing monomers other than N-vinyl cyclic amide and (meth)acrylamide include aminoethyl (meth)acrylate, dimethylaminoethyl (meth)acrylate, dimethylaminopropyl (meth)acrylate, tertiary butylaminoethyl (meth)acrylate, and the like; cyano-containing monomers such as acrylonitrile and methacrylonitrile; (meth)acryloyl pyrrolidine, N-vinyl piperidine, N-vinylpyrrole, N-vinylimidazole, N-vinylpyrrolidine, N-vinyl pyrrolidine, N-vinyl pyrrolidine, N-vinyl pyrrolidine, vinyl pyrazole, vinyl isothiazole, vinyl thiazole, vinyl isothiazole, vinyl thiazolidine, (meth)acryloyl pyrrolidone, (meth)acryloyl pyrrolidine, (meth)acryloyl piperidine, N-methylvinyl pyrrolidine, Heterocyclic monomers such as ketones; maleimide monomers such as N-cyclohexylmaleimide, N-isopropylmaleimide, N-laurylmaleimide, N-phenylmaleimide, N-methyliconimide, N-ethyliconimide, N-butyliconimide, N-octyliconimide, N-2-ethylhexyliconimide, N-lauryliconimide, N-cyclohexyl Iconimide-based monomers such as iconimide, succinimide-based monomers such as N-(meth)acryloxymethylenesuccinimide, N-(meth)acryl-6-oxyhexamethylenesuccinimide, and N-(meth)acryl-8-oxyoctamethylenesuccinimide, and the like; isocyanate-based monomers such as 2-(meth)acryloxyethyl isocyanate, and the like.
單體群中之含氮原子單體之含有率例如為40重量%以下,亦可為35重量%以下、30重量%以下、25重量%以下、20重量%以下、18重量%以下、15重量%以下、14重量%以下、13重量%以下、12重量%以下、11重量%以下,更可為10重量%以下。含有率的下限例如為1重量%以上,亦可為2重量%以上、3重量%以上、4重量%以上、5重量%以上、6重量%以上、7重量%以上、8重量%以上、9重量%以上,更可為10重量%以上。The content of the nitrogen atom-containing monomer in the monomer group is, for example, 40% by weight or less, and may also be 35% by weight or less, 30% by weight or less, 25% by weight or less, 20% by weight or less, 18% by weight or less, 15% by weight or less, 14% by weight or less, 13% by weight or less, 12% by weight or less, 11% by weight or less, and may further be 10% by weight or less. The lower limit of the content is, for example, 1% by weight or more, and may also be 2% by weight or more, 3% by weight or more, 4% by weight or more, 5% by weight or more, 6% by weight or more, 7% by weight or more, 8% by weight or more, 9% by weight or more, and may further be 10% by weight or more.
單體群亦可包含有含羧基單體及含氮原子單體兩者。The monomer group may also include both carboxyl group-containing monomers and nitrogen atom-containing monomers.
在光硬化性組成物中,上述各單體亦可作為部分聚合物來含有。部分聚合物可為均聚物及共聚物中之任一者。部分聚合物會適度增大光硬化性組成物之黏度,藉此可有助於穩定形成後述塗佈層。In the photocurable composition, each of the above monomers may also be contained as a partial polymer. The partial polymer may be any of a homopolymer and a copolymer. The partial polymer will appropriately increase the viscosity of the photocurable composition, thereby contributing to the stable formation of the coating layer described later.
光硬化性組成物通常含有光聚合引發劑。光聚合引發劑之例為利用較波長450nm更短之波長的可見光及/或紫外線產生自由基的光自由基產生劑。The photocurable composition usually contains a photopolymerization initiator. Examples of the photopolymerization initiator are photoradical generators that generate free radicals using visible light and/or ultraviolet light having a wavelength shorter than 450 nm.
光聚合引發劑之例為:苯偶姻甲基醚、苯偶姻異丙基醚、苄基二甲基縮酮等苯偶姻醚類;苯甲醚甲基醚等取代苯偶姻醚;2,2-二乙氧基苯乙酮、2,2-二甲氧基-2-苯基苯乙酮等取代苯乙酮;1-羥環己基-苯基酮等α-羥烷基苯酮;2-甲基-2-羥基苯丙酮等取代α-酮醇;2-萘磺醯氯等芳香族磺醯氯;1-苯基-1,1-丙二酮-2-(鄰乙氧基羰基)-肟等光活性肟;二苯基酮、苯甲醯苯甲酸、苯甲醯苯甲酸甲酯、4-苯基二苯基酮、羥基二苯基酮、丙烯醯化二苯基酮、4-苯甲醯基-4'-甲基二苯硫醚、3,3',4,4'-四(三級丁基過氧羰基)二苯基酮等二苯基酮系化合物;9-氧硫、2-氯9-氧硫𠮿、2-甲基9-氧硫𠮿、異丙基9-氧硫𠮿、2,4-二異丙基9-氧硫𠮿、2,4-二乙基9-氧硫𠮿等9-氧硫𠮿系化合物;2,4,6-三氯-均三𠯤、2-苯基-4,6-雙(三氯甲基)-均三𠯤、2-(對甲氧基苯基)-4,6-雙(三氯甲基)-均三𠯤、2-(對甲苯基)-4,6-雙(三氯甲基)-均三𠯤、2-胡椒基(piperonyl)-4,6-雙(三氯甲基)-均三𠯤、2,4-雙(三氯甲基)-6-苯乙烯基-均三𠯤、2-(萘甲醯-1-基)-4,6-雙(三氯甲基)-均三𠯤、2-(4-甲氧基-萘甲醯-1-基)-4,6-雙(三氯甲基)-均三𠯤、2,4-三氯甲基-(胡椒基)-6-三𠯤、2,4-三氯甲基-(4'-甲氧基苯乙烯基)-6-三𠯤等三𠯤系化合物;1,2-辛二酮,1-[4-(苯基硫基)-,2-(O-苯甲醯基肟)]、O-(乙醯基)-N-(1-苯基-2-側氧基-2-(4'-甲氧基-萘基)亞乙基)羥胺等肟酯系化合物;雙(2,4,6-三甲基苯甲醯基)苯基氧化膦、2,4,6-三甲基苯甲醯基二苯基氧化膦等膦系化合物;9,10-菲醌、樟腦醌、乙基蒽醌等醌系化合物;硼酸鹽系化合物;咔唑系化合物;咪唑系化合物;以及,二茂鈦系化合物。光硬化性組成物亦可包含有1種或2種以上光聚合引發劑。Examples of photopolymerization initiators include benzoin ethers such as benzoin methyl ether, benzoin isopropyl ether, and benzyl dimethyl ketal; substituted benzoin ethers such as anisole methyl ether; substituted acetophenones such as 2,2-diethoxyacetophenone and 2,2-dimethoxy-2-phenylacetophenone; α-hydroxyalkyl phenones such as 1-hydroxycyclohexyl-phenyl ketone; substituted α-keto alcohols such as 2-methyl-2-hydroxypropiophenone; aromatic Sulfonyl chloride; photoactive oximes such as 1-phenyl-1,1-propanedione-2-(o-ethoxycarbonyl)-oxime; diphenyl ketone compounds such as diphenyl ketone, benzoylbenzoic acid, methyl benzoylbenzoate, 4-phenyldiphenyl ketone, hydroxydiphenyl ketone, acrylated diphenyl ketone, 4-benzoyl-4'-methyl diphenyl sulfide, 3,3',4,4'-tetrakis(tertiary butylperoxycarbonyl)diphenyl ketone; 9-oxysulfur , 2-chloro-9-oxysulfuron , 2-methyl 9-oxosulfuron 、Isopropyl 9-oxysulfide 、2,4-Diisopropyl 9-oxysulfide , 2,4-diethyl 9-oxysulfide 9-Oxysulfuron Series compounds; 2,4,6-trichloro-s-triazine, 2-phenyl-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-triazine, 2-piperonyl (piperonyl)-4,6-bis(trichloromethyl)-s-triazine, 2,4-bis(trichloromethyl)-6-phenylvinyl-s-triazine, 2-(naphthoyl-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxy-naphthoyl-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2,4-trichloromethyl-(piperonyl)-6 -trioxane, 2,4-trichloromethyl-(4'-methoxyphenyl)-6-trioxane and other trioxane compounds; oxime ester compounds such as 1,2-octanedione, 1-[4-(phenylthio)-, 2-(O-benzoyloxime)], O-(acetyl)-N-(1-phenyl-2-oxo-2-(4'-methoxy-naphthyl)ethylidene)hydroxylamine; phosphine compounds such as bis(2,4,6-trimethylbenzyl)phenylphosphine oxide and 2,4,6-trimethylbenzyldiphenylphosphine oxide; quinone compounds such as 9,10-phenanthrenequinone, camphorquinone, ethylanthraquinone; borate compounds; carbazole compounds; imidazole compounds; and, titaniumocene compounds. The photocurable composition may also contain one or more photopolymerization initiators.
光聚合引發劑之另一例為分子內具有以下式(1)所示化學結構(以下記載為化學結構X)之化合物。根據本發明人等之研討,該化合物可有助於降低殘留單體之量。 [化學式3] Another example of a photopolymerization initiator is a compound having a chemical structure represented by the following formula (1) (hereinafter referred to as chemical structure X) in the molecule. According to the research of the inventors, the compound can help reduce the amount of residual monomers. [Chemical formula 3]
前述式(1)之R 1及R 2彼此獨立為:C1~C8烷基;氫原子被-OH、C1~C4烷氧基、-CN、-COOR 51、-OOCR 52、或-NR 53R 54取代之C1~C4烷基;C3~C6烯基;或者,-CH 2-C 6H 4-R 55。R 1及R 2亦可相互鍵結而構成C2~C9伸烷基或C3~C6氧伸烷基、或是氮雜伸烷基。R 51為C1~C8烷基。R 52為C1~C4烷基。R 53及R 54彼此獨立為:氫原子、C1~C12烷基;氫原子被選自於由-OH、C1~C4烷氧基、-CN及-COOR 59所構成群組中之至少1種基取代之C2~C4烷基;C3~C5烯基;或者,環己基。R 53及R 54亦可相互鍵結為C3~C9伸烷基,且該C3~C9伸烷基可被-O-或-N(R 60)-中斷。R 55為C1~C4烷基。R 59為C1~C4烷基。R 60為氫原子、C1~C4烷基、烯丙基、C1~C4羥烷基、-CH 2CH 2-COOR 61或-CH 2CH 2CN。R 61為C1~C4烷基。 In the above formula (1), R1 and R2 are independently: C1~C8 alkyl; C1~C4 alkyl whose hydrogen atom is substituted by -OH, C1~C4 alkoxy, -CN, -COOR51 , -OOCR52 , or -NR53R54 ; C3 ~C6 alkenyl; or, -CH2 - C6H4 - R55 . R1 and R2 may also be bonded to each other to form C2~C9 alkylene, C3~C6 oxygen alkylene, or nitrogen heteroalkylene. R51 is C1~C8 alkyl. R52 is C1~C4 alkyl. R 53 and R 54 are independently: a hydrogen atom, a C1~C12 alkyl group; a C2~C4 alkyl group substituted by at least one group selected from the group consisting of -OH, C1~C4 alkoxy, -CN and -COOR 59 ; a C3~C5 alkenyl group; or a cyclohexyl group. R 53 and R 54 may also be bonded to each other to form a C3~C9 alkylene group, and the C3~C9 alkylene group may be interrupted by -O- or -N(R 60 )-. R 55 is a C1~C4 alkyl group. R 59 is a C1~C4 alkyl group. R 60 is a hydrogen atom, a C1~C4 alkyl group, an allyl group, a C1~C4 hydroxyalkyl group, -CH 2 CH 2 -COOR 61 or -CH 2 CH 2 CN. R 61 is a C1~C4 alkyl group.
X為-OR 56或-NR 57R 58。R 56為氫原子、-SiR 62 3、C1~C8烷基、或C3~C6烯基。R 57及R 58為:C1~C12烷基;氫原子被選自於由-OH、C1~C4烷氧基、-CN及-COOR 63所構成群組中之至少1種基取代之C2~C4烷基;C3~C5烯基;或者,環己基。R 57及R 58亦可相互鍵結為C3~C9伸烷基,且該C3~C9伸烷基可被-O-或-N(R 64)-中斷。R 62為C1~C6烷基。R 63為C1~C4烷基。R 64為氫原子、C1~C4烷基、烯丙基、C1~C4羥烷基、-CH 2CH 2-COOR 65或-CH 2CH 2CN。R 65為C1~C4烷基。 X is -OR 56 or -NR 57 R 58 . R 56 is a hydrogen atom, -SiR 62 3 , a C1~C8 alkyl group, or a C3~C6 alkenyl group. R 57 and R 58 are: a C1~C12 alkyl group; a C2~C4 alkyl group in which the hydrogen atom is substituted by at least one group selected from the group consisting of -OH, C1~C4 alkoxy, -CN, and -COOR 63 ; a C3~C5 alkenyl group; or a cyclohexyl group. R 57 and R 58 may also be bonded to each other to form a C3~C9 alkylene group, and the C3~C9 alkylene group may be interrupted by -O- or -N(R 64 )-. R 62 is a C1~C6 alkyl group. R 63 is a C1~C4 alkyl group. R 64 is a hydrogen atom, a C1-C4 alkyl group, an allyl group, a C1-C4 hydroxyalkyl group, -CH 2 CH 2 -COOR 65 or -CH 2 CH 2 CN. R 65 is a C1-C4 alkyl group.
化學結構X可隔著式(1)中*所示碳原子而與氫原子或氫原子之取代結構鍵結。The chemical structure X may be bonded to a hydrogen atom or a structure substituted with a hydrogen atom via the carbon atom represented by * in formula (1).
式(1)之說明中記載之烷基、烷氧基、烯基、伸烷基、氧伸烷基、氮雜伸烷基及羥烷基皆可為非支鏈狀亦可為支鏈狀。又,連同式(1)之說明在內,本說明書中之「Cn1~Cn2」之記載(n1及n2為自然數)意指碳數在n1~n2之範圍內。The alkyl, alkoxy, alkenyl, alkylene, oxyalkylene, nitrogen heteroalkylene and hydroxyalkylene described in the description of formula (1) may be unbranched or branched. In addition, together with the description of formula (1), the description of "Cn1~Cn2" in this specification (n1 and n2 are natural numbers) means that the carbon number is within the range of n1~n2.
R 1及R 2可彼此獨立為C1~C8烷基或C3~C6烯基,亦可為C1~C8之烷基。R 1及R 2可彼此獨立為C1~C4烷基,亦可為C1~C3烷基、C1~C2烷基。R 1及R 2亦可為甲基。 R1 and R2 can be independently C1-C8 alkyl or C3-C6 alkenyl, or C1-C8 alkyl. R1 and R2 can be independently C1-C4 alkyl, or C1-C3 alkyl, or C1-C2 alkyl. R1 and R2 can also be methyl.
R 1及R 2可相同。 R1 and R2 may be the same.
X亦可為-OR 56。R 56可為氫原子或C1~C8烷基,亦可為氫原子。換言之,X亦可為-OH。 X may also be -OR 56 . R 56 may be a hydrogen atom or a C1-C8 alkyl group, or may be a hydrogen atom. In other words, X may also be -OH.
R 1、R 2及X可以任意組合作為上述理想例。 R 1 , R 2 and X may be arbitrarily combined as the above-mentioned ideal examples.
化學結構X亦可為以下式(2)所示之結構。式(2)之化學結構X中,當*所示之碳原子上鍵結有氫原子之取代結構時,該取代結構與式(2)中之-COCR 1XR 2基係對化學結構X所具有之苯環處於對位之關係。 [化學式4] The chemical structure X may also be a structure represented by the following formula (2). In the chemical structure X of formula (2), when a substitution structure having a hydrogen atom is bonded to the carbon atom represented by *, the substitution structure and the -COCR 1 XR 2 group in formula (2) are in a para position to the benzene ring of the chemical structure X. [Chemical formula 4]
光聚合引發劑亦可為1分子內具有2個以上化學結構X之化合物。The photopolymerization initiator may be a compound having two or more chemical structures X in one molecule.
光聚合引發劑亦可為以下式(3)所示之化合物。式(3)之化合物於1分子內具有2個化學結構X。2個化學結構X分別位於光聚合引發劑之分子兩末端。更具體而言,2個化學結構X係藉由-A-而在上述*所示之伸苯基之碳原子相互鍵結。 [化學式5] The photopolymerization initiator may also be a compound represented by the following formula (3). The compound represented by formula (3) has two chemical structures X in one molecule. The two chemical structures X are located at both ends of the photopolymerization initiator molecule. More specifically, the two chemical structures X are bonded to each other at the carbon atom of the phenylene group represented by * through -A-. [Chemical Formula 5]
式(3)之R 1’及R 2’彼此為可採用作為R 1及R 2之基;以及,係與R 1及R 2獨立為可採用作為R 1及R 2之基。R 1’及/或R 2’亦可與R 1及/或R 2相同。R 1、R 2、R 1’及R 2’亦可全部相同。 In formula (3), R 1 ' and R 2 ' are groups that can be used as R 1 and R 2 , respectively; and are groups that can be used as R 1 and R 2 independently of R 1 and R 2. R 1 ' and/or R 2 ' may be the same as R 1 and/or R 2. R 1 , R 2 , R 1 ' and R 2 ' may all be the same.
式(3)之X’係與式(1)之X獨立為可採用作為X之基。X’及X亦可相同。X' in formula (3) is independent of X in formula (1) and can be used as a group of X. X' and X may be the same.
A為-O-、-CYR 3-、或者-C(CH 3)R 4。 A is -O-, -CYR 3 -, or -C(CH 3 )R 4 .
Y為氫原子、-Cl、-Br、-O-R 71、-NR 72R 73、或者-S-R 74。R 3為氫原子、C1~C8烷基、C3~C6烯基、苄基、--CH 2-C 6H 4-R 75、或者苯基。R 4為C1~C6烷基或伸烷基,且該伸烷基係鍵結於式(3)之化合物所具有之伸苯基之碳原子上。 Y is a hydrogen atom, -Cl, -Br, -OR 71 , -NR 72 R 73 , or -SR 74 . R 3 is a hydrogen atom, a C1-C8 alkyl group, a C3-C6 alkenyl group, a benzyl group, -CH 2 -C 6 H 4 -R 75 , or a phenyl group. R 4 is a C1-C6 alkyl group or an alkylene group, and the alkylene group is bonded to the carbon atom of the phenylene group of the compound of formula (3).
R 71為氫原子、-Si(R 76) 3、C1~C12烷基、C2~C18醯基、-CO-NH-R 77、C2~C20羥烷基、C2~C20甲氧基烷基、3-R 78-2-羥-丙基、3-[1,3,3,3-四甲基-1-[(三甲基矽基)氧基]二矽氧烷基]-丙基、2,3-二羥基-丙基、或者碳鏈被1~9個氧原子中斷之C2~C21羥烷基、或C3~C25烷基。R 72及R 73彼此獨立為:C1~C12烷基;氫原子被選自於由-OH、C1~C4烷氧基、-CN及-COOR 79所構成群組中之至少1種基取代之C2~C4烷基;C3~C5烯基;環己基;或者,C7~C9苯基烷基。R 72及R 73亦可相互鍵結為C3~C9伸烷基,且該C3~C9伸烷基可被-O-或-N(R 80)-中斷。R 74為C1~C18烷基、羥乙基、2,3-二羥丙基、環己基、苄基、苯基、C1~C12烷基苯基、-CH 2-COOR 81-CH 2CH 2-COOR 82、或-CH(CH 3)-COOR 83。R 75為C1~C4烷基。R 76為C1~C6烷基。R 77為C1~C12烷基。R 78為C1~C18烷氧基。R 79為C1~C4烷基。R 80為氫原子、C1~C4烷基、烯丙基、苄基、C1~C4羥烷基、-CH 2CH 2-COOR 84、或-CH 2CH 2CN。R 81、R 82及R 83彼此獨立為C1~C18烷基。R 84為C1~C4烷基。 R 71 is a hydrogen atom, -Si(R 76 ) 3 , a C1~C12 alkyl group, a C2~C18 acyl group, -CO-NH-R 77 , a C2~C20 hydroxyalkyl group, a C2~C20 methoxyalkyl group, 3-R 78 -2-hydroxy-propyl group, 3-[1,3,3,3-tetramethyl-1-[(trimethylsilyl)oxy]disiloxyalkyl]-propyl group, 2,3-dihydroxy-propyl group, or a C2~C21 hydroxyalkyl group whose carbon chain is interrupted by 1 to 9 oxygen atoms, or a C3~C25 alkyl group. R 72 and R 73 are independently: C1~C12 alkyl; C2~C4 alkyl substituted with at least one group selected from the group consisting of -OH, C1~C4 alkoxy, -CN and -COOR 79 ; C3~C5 alkenyl; cyclohexyl; or C7~C9 phenylalkyl. R 72 and R 73 may also be bonded to each other to form a C3~C9 alkylene group, and the C3~C9 alkylene group may be interrupted by -O- or -N(R 80 )-. R 74 is C1~C18 alkyl, hydroxyethyl, 2,3-dihydroxypropyl, cyclohexyl, benzyl, phenyl, C1~C12 alkylphenyl, -CH 2 -COOR 81 -CH 2 CH 2 -COOR 82 , or -CH(CH 3 )-COOR 83 . R 75 is a C1~C4 alkyl group. R 76 is a C1~C6 alkyl group. R 77 is a C1~C12 alkyl group. R 78 is a C1~C18 alkoxy group. R 79 is a C1~C4 alkyl group. R 80 is a hydrogen atom, a C1~C4 alkyl group, an allyl group, a benzyl group, a C1~C4 hydroxyalkyl group, -CH 2 CH 2 -COOR 84 , or -CH 2 CH 2 CN. R 81 , R 82 and R 83 are independently a C1~C18 alkyl group. R 84 is a C1~C4 alkyl group.
式(3)之說明中記載之烷基、烯基、醯基、羥烷基、甲氧基烷基、烷氧基、苯基烷基之烷基部分、伸烷基皆可為非支鏈狀亦可為支鏈狀。The alkyl part and alkylene group of the alkyl, alkenyl, acyl, hydroxyalkyl, methoxyalkyl, alkoxy and phenylalkyl described in the description of formula (3) may be unbranched or branched.
式(3)之R 1、R 2、R 1’及R 2’之理想例係與先前於式(1)之說明中所述之R 1及R 2之理想例相同。式(3)之X’之理想例係與先前於式(1)之說明中所述之X之理想例相同。A亦可為-CYR 3-。Y亦可為氫原子。R 3亦可為氫原子。A為-CYR 3-的同時,Y及R 3亦可皆為為氫原子。換言之,A亦可為-CH 2-。 The preferred examples of R 1 , R 2 , R 1 ' and R 2 ' in formula (3) are the same as the preferred examples of R 1 and R 2 described previously in the description of formula (1). The preferred example of X' in formula (3) is the same as the preferred example of X described previously in the description of formula (1). A may be -CYR 3 -. Y may be a hydrogen atom. R 3 may be a hydrogen atom. When A is -CYR 3 -, Y and R 3 may both be hydrogen atoms. In other words, A may be -CH 2 -.
式(3)之R 1、R 2、R 1’、R 2’、X、X’、A可以任意組合作為上述理想例。 R 1 , R 2 , R 1 ′, R 2 ′, X, X′, and A in formula (3) may be arbitrarily combined as in the above-mentioned ideal examples.
光聚合引發劑亦可為以下式(4)所示之化合物。式(4)之化合物為式(3)之化合物之1種。 [化學式6] The photopolymerization initiator may also be a compound represented by the following formula (4). The compound of formula (4) is one of the compounds of formula (3). [Chemical Formula 6]
將光聚合引發劑之具體例列示於以下式(5)~(9)。光聚合引發劑可為選自於由式(5)~(9)所構成群組中之至少一式所示之化合物,可為選自於由式(5)~(8)所構成群組中之至少一式所示之化合物,可為選自於由式(5)~(7)所構成群組中之至少一式所示之化合物,亦可為式(5)所示之化合物。此外,式(8)之化合物係源自於側鏈具有化學結構X之乙烯基化合物。更具體而言,為該乙烯基化合物之寡聚物。Specific examples of photopolymerization initiators are shown in the following formulas (5) to (9). The photopolymerization initiator may be a compound represented by at least one formula selected from the group consisting of formulas (5) to (9), a compound represented by at least one formula selected from the group consisting of formulas (5) to (8), a compound represented by at least one formula selected from the group consisting of formulas (5) to (7), or a compound represented by formula (5). In addition, the compound of formula (8) is derived from a vinyl compound having a chemical structure X in the side chain. More specifically, it is an oligomer of the vinyl compound.
[化學式7] [Chemical formula 7]
[化學式8] [Chemical formula 8]
[化學式9] [Chemical formula 9]
[化學式10] [Chemical formula 10]
[化學式11] [Chemical formula 11]
式(5)~(9)所示之光聚合引發劑分別以Omnirad127、Esacure KIP160、Esacure one、Esacure KIP150、Omnirad1173(皆為IGM Resins製)販售於市面上。光聚合引發劑亦可為選自該等群組中之至少1者。The photopolymerization initiators represented by formulas (5) to (9) are sold on the market as Omnirad127, Esacure KIP160, Esacure one, Esacure KIP150, and Omnirad1173 (all manufactured by IGM Resins). The photopolymerization initiator may also be at least one selected from the above groups.
具體之光聚合引發劑之例為1-羥環己基-苯基酮、雙(2,4,6-三甲基苯甲醯基)苯基膦氧化物及2-羥-1-(4-(4-(2-羥-2-甲基丙醯基)苄基)苯基)2-甲基丙-1-酮。其中,宜為2-羥-1-(4-(4-(2-羥-2-甲基丙醯基)苄基)苯基)2-甲基丙-1-酮。上述各光聚合引發劑分別以Omnirad184、Omnirad819及Omnirad127販售於市面上(皆為IGM Resin公司製)。Specific examples of photopolymerization initiators include 1-hydroxycyclohexyl-phenyl ketone, bis(2,4,6-trimethylbenzyl)phenylphosphine oxide, and 2-hydroxy-1-(4-(4-(2-hydroxy-2-methylpropionyl)benzyl)phenyl)2-methylpropan-1-one. Among them, 2-hydroxy-1-(4-(4-(2-hydroxy-2-methylpropionyl)benzyl)phenyl)2-methylpropan-1-one is preferred. The above-mentioned photopolymerization initiators are sold on the market as Omnirad184, Omnirad819, and Omnirad127, respectively (all manufactured by IGM Resin Co., Ltd.).
相對於單體群及其部分聚合物之合計100重量份,光硬化性組成物中之光聚合引發劑之摻混量例如為20重量份以下,亦可為10重量份以下、5.0重量份以下、4.0重量份以下、3.0重量份以下、2.5重量份以下、2.0重量份以下、1.5重量份以下、1.0重量份以下、0.5重量份以下、0.3重量份以下、0.25重量份以下,更可為0.2重量份以下。相對於單體群及其部分聚合物之合計100重量份,光聚合引發劑之摻混量的下限例如為0.01重量份以上,亦可為0.03重量份以上、0.05重量份以上、0.08重量份以上、0.1重量份以上、0.13重量份以上、0.15重量份以上,更可為0.18重量份以上。The amount of the photopolymerization initiator in the photocurable composition may be, for example, 20 parts by weight or less, 10 parts by weight or less, 5.0 parts by weight or less, 4.0 parts by weight or less, 3.0 parts by weight or less, 2.5 parts by weight or less, 2.0 parts by weight or less, 1.5 parts by weight or less, 1.0 parts by weight or less, 0.5 parts by weight or less, 0.3 parts by weight or less, 0.25 parts by weight or less, or even 0.2 parts by weight or less, relative to 100 parts by weight of the total of the monomer group and its partial polymer. The lower limit of the amount of the photopolymerization initiator may be, for example, 0.01 parts by weight or more, 0.03 parts by weight or more, 0.05 parts by weight or more, 0.08 parts by weight or more, 0.1 parts by weight or more, 0.13 parts by weight or more, 0.15 parts by weight or more, or even 0.18 parts by weight or more, relative to 100 parts by weight of the total of the monomer group and its partial polymer.
光硬化性組成物可包含1種或2種以上光聚合引發劑。The photocurable composition may contain one or more photopolymerization initiators.
光硬化性組成物亦可包含有第1光聚合引發劑與第2光聚合引發劑,前述第1光聚合引發劑具有相對較小之第1反應速度,前述第2光聚合引發劑具有相對較大之第2反應速度。各光聚合引發劑之反應速度可藉由僅使用該光聚合引發劑使單體聚合時所達到之聚合率來特定。第2反應速度相對於第1反應速度的比藉由聚合率A的比來表示為1.1以上,該聚合率A係單一使用各個光聚合引發劑並利用以下測定方法評估而得者。聚合率A的比可為1.15以上,亦可為1.2以上、1.22以上、1.25以上,更可為1.27以上。比的上限無特別限定,例如為3以下。此外,聚合率A的比可藉由[單一使用第2光聚合引發劑時之聚合率A]/[單一使用第1光聚合引發劑時之聚合率A]來特定。 [測定方法] 對作為單體之丙烯酸正丁酯99重量份及丙烯酸4-羥丁酯1重量份、以及評估對象之光聚合引發劑0.1重量份之混合溶液照射紫外線,製作出前述單體已部分聚合之單體漿。紫外線照射係實施至混合溶液在30℃下之黏度達20Pa・s為止。接著,於一對各自具有75µm厚度的聚對苯二甲酸乙二酯(PET)製片材之間,形成由所製出之單體漿構成之厚度20µm之塗佈層。接著,對塗佈層,從其中一PET製片材側照射以LED為光源之紫外線,該LED係於340nm±10nm具有峰值波長。照射之紫外線之照度及照射時間分別設為4mW/cm 2及1200秒。將對藉由紫外線照射而光硬化之塗佈層所測定之前述單體之聚合率特定為聚合率A。 The photocurable composition may also include a first photopolymerization initiator and a second photopolymerization initiator, wherein the first photopolymerization initiator has a relatively small first reaction rate, and the second photopolymerization initiator has a relatively large second reaction rate. The reaction rate of each photopolymerization initiator can be specified by the polymerization rate achieved when the monomer is polymerized using only the photopolymerization initiator. The ratio of the second reaction rate to the first reaction rate is expressed as a ratio of polymerization rate A of 1.1 or more, and the polymerization rate A is obtained by using each photopolymerization initiator alone and evaluating using the following measurement method. The ratio of polymerization rate A may be 1.15 or more, or 1.2 or more, 1.2 or more, 1.22 or more, 1.25 or more, or 1.27 or more. The upper limit of the ratio is not particularly limited, and is, for example, 3 or less. In addition, the ratio of the polymerization rate A can be specified by [polymerization rate A when the second photopolymerization initiator is used alone]/[polymerization rate A when the first photopolymerization initiator is used alone]. [Measurement method] A mixed solution of 99 parts by weight of n-butyl acrylate and 1 part by weight of 4-hydroxybutyl acrylate as monomers and 0.1 parts by weight of the photopolymerization initiator to be evaluated is irradiated with ultraviolet light to prepare a monomer slurry in which the aforementioned monomers are partially polymerized. The ultraviolet irradiation is carried out until the viscosity of the mixed solution reaches 20 Pa·s at 30°C. Then, a coating layer with a thickness of 20µm consisting of the prepared monomer slurry is formed between a pair of polyethylene terephthalate (PET) sheets each having a thickness of 75µm. Next, the coating layer is irradiated with ultraviolet light from one of the PET sheets, using an LED as a light source, the LED having a peak wavelength of 340 nm ± 10 nm. The irradiation intensity and irradiation time of the ultraviolet light are set to 4 mW/cm 2 and 1200 seconds, respectively. The polymerization rate of the aforementioned monomer measured for the coating layer photocured by ultraviolet irradiation is designated as polymerization rate A.
根據本發明人等之研討,第1及第2光聚合引發劑之組合會影響黏著片形成時之聚合狀態,故有助於降低殘存單體之量。此外,已知用以形成丙烯酸系黏著片之一般組成為評估聚合率A所使用之單體漿之組成。又,上述紫外線之照射條件適於評估聚合狀態。According to the research of the inventors, the combination of the first and second photopolymerization initiators affects the polymerization state when the adhesive sheet is formed, and thus helps to reduce the amount of residual monomers. In addition, the general composition used to form acrylic adhesive sheets is known to be the composition of the monomer slurry used to evaluate the polymerization rate A. In addition, the above-mentioned ultraviolet irradiation conditions are suitable for evaluating the polymerization state.
第1光聚合引發劑之聚合率A可為80%以下,亦可為79%以下,更可為78%以下。聚合率A的下限例如為65%以上,亦可為66%以上、67%以上、68%以上、69%以上,更可為70%以上。The polymerization rate A of the first photopolymerization initiator may be 80% or less, 79% or less, or 78% or less. The lower limit of the polymerization rate A is, for example, 65% or more, 66% or more, 67% or more, 68% or more, 69% or more, or 70% or more.
第2光聚合引發劑之聚合率A可為90%以上,亦可為91%以上、92%以上、93%以上、94%以上、95%以上、96%以上、97%以上、98%以上,更可為99%以上。聚合率A的上限例如為99.9%以下,更可為99.5%以下。The polymerization rate A of the second photopolymerization initiator may be 90% or more, or 91% or more, 92% or more, 93% or more, 94% or more, 95% or more, 96% or more, 97% or more, 98% or more, or even 99% or more. The upper limit of the polymerization rate A is, for example, 99.9% or less, or even 99.5% or less.
第1光聚合引發劑之聚合率A及第2光聚合引發劑之聚合率A亦可同時滿足上述範圍。例如,第1光聚合引發劑之聚合率A亦可為80%以下,第2光聚合引發劑之聚合率A亦可為90%以上。The polymerization rate A of the first photopolymerization initiator and the polymerization rate A of the second photopolymerization initiator may also satisfy the above ranges at the same time. For example, the polymerization rate A of the first photopolymerization initiator may be 80% or less, and the polymerization rate A of the second photopolymerization initiator may be 90% or more.
第1及第2光聚合引發劑之例為:苯甲醯基醚類、取代苯甲醯基醚系化合物、取代苯乙酮系化合物、α-羥苯乙酮系化合物、取代α-酮醇系化合物、芳香族磺醯氯系化合物、光活性肟類、二苯基酮系化合物、9-氧硫𠮿系化合物、三𠯤系化合物、肟酯系化合物、異次磷酸系化合物、醌系化合物、硼酸鹽系化合物、咔唑系化合物、咪唑系化合物及二茂鈦系化合物。Examples of the first and second photopolymerization initiators include: benzyl ethers, substituted benzyl ether compounds, substituted acetophenone compounds, α-hydroxyacetophenone compounds, substituted α-ketoalcohol compounds, aromatic sulfonyl chloride compounds, photoactive oximes, diphenyl ketone compounds, 9-oxysulfuronium compounds, The invention also includes oxime ester compounds, isophosphite compounds, quinone compounds, borate compounds, carbazole compounds, imidazole compounds and titanocene compounds.
第1光聚合引發劑宜為α-羥苯乙酮系化合物。屬α-羥苯乙酮系化合物之第1光聚合引發劑在與第2光聚合引發劑之組合中特別適於提高聚合物之分子量。第1光聚合引發劑於1分子內具有之α-羥苯乙酮結構之數量例如為1~3,宜為1或2,較宜為1。The first photopolymerization initiator is preferably an α-hydroxyacetophenone compound. The first photopolymerization initiator, which is an α-hydroxyacetophenone compound, is particularly suitable for increasing the molecular weight of the polymer in combination with the second photopolymerization initiator. The number of α-hydroxyacetophenone structures in one molecule of the first photopolymerization initiator is, for example, 1 to 3, preferably 1 or 2, and more preferably 1.
第1光聚合引發劑之具體例為1-[4-(2-羥乙氧基)-苯基]-2-羥-2-甲基丙酮。該光聚合引發劑為α-羥苯乙酮系化合物,且以Omnirad2959(IGM Resins製)販售於市面上。A specific example of the first photopolymerization initiator is 1-[4-(2-hydroxyethoxy)-phenyl]-2-hydroxy-2-methylacetone. The photopolymerization initiator is an α-hydroxyacetophenone compound and is commercially available as Omnirad 2959 (manufactured by IGM Resins).
第2光聚合引發劑無限定,亦可為α-羥苯乙酮系化合物。屬α-羥苯乙酮系化合物之第2光聚合引發劑在與第1光聚合引發劑、尤其是在與屬α-羥苯乙酮系化合物之第1光聚合引發劑之組合中特別適於提高聚合物之分子量。第2光聚合引發劑於1分子內具有之α-羥苯乙酮結構之數量例如為1~3,宜為1或2,較宜為2。The second photopolymerization initiator is not limited and may be an α-hydroxyacetophenone compound. The second photopolymerization initiator, which is an α-hydroxyacetophenone compound, is particularly suitable for increasing the molecular weight of the polymer in combination with the first photopolymerization initiator, especially with the first photopolymerization initiator, which is an α-hydroxyacetophenone compound. The number of α-hydroxyacetophenone structures in one molecule of the second photopolymerization initiator is, for example, 1 to 3, preferably 1 or 2, and more preferably 2.
第2聚合引發劑連同理想例亦可為分子內具有化學結構X之上述化合物。The second polymerization initiator may also be the above-mentioned compound having a chemical structure X in the molecule, as well as a preferred example.
光硬化性組成物可包含1種或2種以上第1光聚合引發劑。光硬化性組成物可包含1種或2種以上第2光聚合引發劑。The photocurable composition may contain one or more first photopolymerization initiators. The photocurable composition may contain one or more second photopolymerization initiators.
第1光聚合引發劑之摻混量X1與第2光聚合引發劑之摻混量X2的比以重量比計,例如為5:1~1:5,4:1~1:4、3:1~1:3、2:1~1:2,更可為1.5:1~1:1.5。The weight ratio of the blending amount X1 of the first photopolymerization initiator to the blending amount X2 of the second photopolymerization initiator is, for example, 5:1-1:5, 4:1-1:4, 3:1-1:3, 2:1-1:2, and may further be 1.5:1-1:1.5.
光硬化性組成物亦可包含有交聯劑。交聯劑之例為1分子中具有2個以上聚合性官能基之多官能單體。多官能單體亦可為(甲基)丙烯酸系單體。多官能單體之例為:1分子中具有2個以上C=C鍵之單體、及1分子中具有1個以上C=C鍵與1個以上環氧基、吖𠰂、㗁唑啉基、肼基、羥甲基等聚合性官能基之單體。多官能單體宜為1分子中具有2個以上C=C鍵之單體。The photocurable composition may also contain a crosslinking agent. An example of a crosslinking agent is a multifunctional monomer having two or more polymerizable functional groups in one molecule. The multifunctional monomer may also be a (meth)acrylic monomer. Examples of multifunctional monomers are: a monomer having two or more C=C bonds in one molecule, and a monomer having one or more C=C bonds and one or more polymerizable functional groups such as epoxy, azoxy, oxazolinyl, hydrazine, hydroxymethyl, etc. in one molecule. The multifunctional monomer is preferably a monomer having two or more C=C bonds in one molecule.
多官能單體之例為:(聚)乙二醇二(甲基)丙烯酸酯、(聚)丙二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、新戊四醇二(甲基)丙烯酸酯、新戊四醇三(甲基)丙烯酸酯、二新戊四醇六(甲基)丙烯酸酯、1,2-乙二醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、1,9-壬二醇二丙烯酸酯(NDDA)、1,12-十二烷二醇二(甲基)丙烯酸酯、三羥甲丙烷三(甲基)丙烯酸酯、四羥甲基甲烷三(甲基)丙烯酸酯等多官能丙烯酸酯(多元醇與(甲基)丙烯酸之酯化合物等);(甲基)丙烯酸烯丙酯、(甲基)丙烯酸乙烯酯、二乙烯苯、環氧丙烯酸酯、聚酯丙烯酸酯、胺甲酸酯丙烯酸酯、二(甲基)丙烯酸丁酯、二(甲基)丙烯酸己酯。多官能單體宜為多官能丙烯酸酯,較宜為三羥甲丙烷三(甲基)丙烯酸酯、己二醇二(甲基)丙烯酸酯、二新戊四醇六(甲基)丙烯酸酯。Examples of the multifunctional monomer include: (poly)ethylene glycol di(meth)acrylate, (poly)propylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, 1,2-ethylene glycol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,9-nonanediol diacrylate (NDDA), 1,12-dodecanediol di(meth)acrylate, trihydroxymethylpropane tri(meth)acrylate, tetrahydroxymethylmethane tri(meth)acrylate and other multifunctional acrylates (ester compounds of polyols and (meth)acrylic acid, etc.); allyl (meth)acrylate, vinyl (meth)acrylate, divinylbenzene, epoxy acrylate, polyester acrylate, urethane acrylate, butyl di(meth)acrylate, hexyl di(meth)acrylate. The multifunctional monomer is preferably a multifunctional acrylate, more preferably trihydroxymethylenepropane tri(meth)acrylate, hexanediol di(meth)acrylate, or dipentatriol hexa(meth)acrylate.
交聯劑之摻混量依分子量或官能基數等而異,惟單體群及其部分聚合物之合計每100重量份,例如為5重量份以下,亦可為3重量份以下、2重量份以下、1重量份以下,更可為0.5重量份以下。摻混量的下限例如為0.01重量份以上,更可為0.05重量份以上。The amount of the crosslinking agent to be mixed varies depending on the molecular weight or the number of functional groups, but is, for example, 5 parts by weight or less, 3 parts by weight or less, 2 parts by weight or less, 1 part by weight or less, or even 0.5 parts by weight or less per 100 parts by weight of the total of the monomer group and its partial polymer. The lower limit of the mixing amount is, for example, 0.01 parts by weight or more, and even 0.05 parts by weight or more.
光硬化性組成物亦可包含有上述以外之添加劑。添加劑之例為:鏈轉移劑、矽烷耦合劑、黏度調整劑、賦黏劑、塑化劑、軟化劑、抗老化劑、充填劑、著色劑、抗氧化劑、界面活性劑、抗靜電劑及紫外線吸收劑。The photocurable composition may also contain additives other than those mentioned above. Examples of additives include chain transfer agents, silane coupling agents, viscosity modifiers, tackifiers, plasticizers, softeners, anti-aging agents, fillers, colorants, antioxidants, surfactants, antistatic agents, and ultraviolet absorbers.
矽烷耦合劑之摻混量以單體群及其部分聚合物之合計每100重量份,例如為3重量份以下,亦可為2重量份以下、1重量份以下,更可為0.5重量份以下。摻混量的下限例如為0.1重量份以上,更可為0.2重量份以上。光硬化性組成物亦可不含矽烷耦合劑。The blending amount of the silane coupling agent is, for example, 3 parts by weight or less, 2 parts by weight or less, 1 part by weight or less, or even 0.5 parts by weight or less, based on 100 parts by weight of the total of the monomer group and its partial polymer. The lower limit of the blending amount is, for example, 0.1 parts by weight or more, or 0.2 parts by weight or more. The photocurable composition may not contain a silane coupling agent.
光硬化性組成物中之溶劑之含有率例如為5重量%以下,亦可為4重量%以下、3重量%以下、2重量%以下、1重量%以下,更可為0.5重量%以下。光硬化性組成物亦可實質上不含溶劑。所謂實質上不含溶劑,其旨在以例如0.1重量%以下、宜為0.05重量%以下、較宜以0.01重量%以下之含有率容許源自添加劑等之溶劑等。The content of the solvent in the photocurable composition is, for example, 5 wt % or less, and may also be 4 wt % or less, 3 wt % or less, 2 wt % or less, 1 wt % or less, or even 0.5 wt % or less. The photocurable composition may be substantially free of solvent. The term "substantially free of solvent" means that the content of solvent derived from additives, etc., is allowed to be, for example, 0.1 wt % or less, preferably 0.05 wt % or less, and more preferably 0.01 wt % or less.
光硬化性組成物之黏度宜為5~100泊。具有上述範圍之黏度的光硬化性組成物特別適於形成後述塗佈層。The viscosity of the photocurable composition is preferably 5 to 100 poise. The photocurable composition having a viscosity within the above range is particularly suitable for forming the coating layer described below.
黏著片1中之單體群之聚合率宜為95%以上。聚合率亦可為96%以上、97%以上、98%以上,更可為99%以上。The polymerization rate of the monomer group in the
黏著片1之凝膠分率例如為50%以上,亦可為75%以上、80%以上,更可為85%以上。The gel fraction of the
黏著片1之厚度例如為70µm以下,亦可為50µm以下、40µm以下、30µm以下、25µm以下,更可為20µm以下。厚度的下限例如為2µm以上,亦可為5µm以上,更可為10µm以上。The thickness of the
黏著片1亦可具有經施行表面改質處理之表面(以下稱「改質處理面」)4。表面改質處理典型上為使用活性能量線之處理。表面改質處理例如係選自於由電暈處理、電漿處理、準分子UV光處理及火焰處理所構成群組中之至少1者,可為電暈處理及/或電漿處理,亦可為電暈處理。各表面改質處理可藉由對應之公知處理裝置來實施。The
電暈處理之表面改質處理的條件係藉由放電量來表示,例如為0.6~100kJ/m 2。放電量的下限亦可為1kJ/m 2以上、2kJ/m 2以上、5kJ/m 2以上、7kJ/m 2以上、10kJ/m 2以上、13kJ/m 2以上、15kJ/m 2以上、20kJ/m 2以上、25kJ/m 2以上、30kJ/m 2以上,更可為35kJ/m 2以上。放電量的上限亦可為70kJ/m 2以下、60kJ/m 2以下、50kJ/m 2以下、45kJ/m 2以下、40kJ/m 2以下、30kJ/m 2以下、20kJ/m 2以下,更可為18kJ/m 2以下。 The conditions of the surface modification treatment of the corona treatment are expressed by the discharge amount, for example, 0.6~100kJ/ m2 . The lower limit of the discharge amount may be 1kJ/ m2 or more, 2kJ/ m2 or more, 5kJ/ m2 or more, 7kJ/ m2 or more, 10kJ/ m2 or more, 13kJ/ m2 or more, 15kJ/ m2 or more, 20kJ/ m2 or more, 25kJ/ m2 or more, 30kJ/ m2 or more, and may be 35kJ/ m2 or more. The upper limit of the discharge amount may be 70 kJ/m 2 or less, 60 kJ/m 2 or less, 50 kJ/m 2 or less, 45 kJ/m 2 or less, 40 kJ/m 2 or less, 30 kJ/m 2 or less, 20 kJ/m 2 or less, and may further be 18 kJ/m 2 or less.
圖1之黏著片1係於相位差薄膜2側具有改質處理面4。該態樣特別適於提升黏著片1對相位差薄膜2之投錨力。黏著片1可於與相位差薄膜2側相反側具有改質處理面4,亦可於相位差薄膜2側及相反側兩側具有改質處理面4。The
黏著片1對相位差薄膜2之投錨力亦可為10N/25mm以上、12N/25mm以上、13N/25mm以上、14N/25mm以上、15N/25mm以上、16N/25mm以上、17N/25mm以上,更可為18N/25mm以上。投錨力的上限例如為50N/25mm以下,亦可為30N/25mm以下。The anchoring force of the
提高黏著片1對相位差薄膜2之投錨力,可有助於例如抑制在黏著片1與相位差薄膜2之間之剝落。上述已抑制住剝落之光學積層體適於例如在可長期於嚴酷環境下使用之影像顯示裝置中抑制影像品質降低。Improving the anchoring force of the
黏著片1對相位差薄膜2之投錨力可藉由以下方法測定。將包含相位差薄膜2及黏著片1之積層體裁切成寬度25mm×長度150mm,做成試驗片。接著,透過雙面膠帶將試驗片具備之相位差薄膜2的表面整體疊合於不鏽鋼製試驗板上,使2kg滾筒來回1次,使該等壓接。接著,將試驗片具備之黏著片1疊合於評估用片材上,使2kg滾筒來回1次,使該等壓接。評估用片材只要是具有寬30mm×長150mm之尺寸且在試驗中不會從黏著片1剝離者,便無特別限定。評估用片材可使用例如ITO薄膜(125 TETOLIGHT OES(尾池工業公司製)等)。接著,使用市售之拉伸試驗機,在把持評估用片材之狀態下,以剝離角度180°、拉伸速度300mm/分鐘將黏著片1從相位差薄膜2剝開,並特定此時之剝離力的平均值作為黏著片1對相位差薄膜2之投錨力。上述試驗係在23℃±5℃之氣體環境中進行。The anchoring force of the
(相位差薄膜)
相位差膜薄膜2可使用使高分子薄膜延伸而得者或已使液晶材料定向、固定化者。相位差薄膜2例如於面內及/或厚度方向上具有雙折射。
(Phase difference film)
The
相位差薄膜2包含:抗反射用相位差薄膜(參照日本專利特開2012-133303號公報[0221]、[0222]、[0228])、視角補償用相位差薄膜(參照日本專利特開2012-133303號公報[0225]、[0226])、視角補償用傾斜定向相位差薄膜(參照日本專利特開2012-133303號公報[0227])等。The
相位差薄膜2之具體構成、例如相位差值、配置角度、3維雙折射率、單層或多層等無特別限制,可使用公知之相位差薄膜。The specific structure of the
相位差薄膜2之厚度例如為30~200µm,宜為40~150µm。The thickness of the
相位差薄膜2亦可包含有例如液晶材料經定向且固定化之1/4波長板及/或1/2波長板。The
含環烯烴系聚合物之相位差薄膜2特別容易產生裂痕。且,關於屬延伸薄膜之相位差薄膜2,相較於其為雙軸延伸薄膜之情況,其為單軸延伸薄膜時更容易產生裂痕。因此,本發明特別有利於相位差薄膜2包含環烯烴系聚合物之情況及為單軸延伸薄膜之情況。The
相位差薄膜2亦可具有改質處理面。圖1之相位差薄膜2於黏著片1側具有改質處理面5。該態樣特別適於提升相位差薄膜2與黏著片1之間之投錨力。表面改質處理之例連同理想例係如上述。The
相位差薄膜2及光學積層體10可包含之殘存單體之例為(甲基)丙烯酸系單體。(甲基)丙烯酸系單體之例係與可形成黏著片1之光硬化性組成物所包含之(甲基)丙烯酸系單體之例相同。An example of a residual monomer that can be contained in the
(偏光薄膜)
偏光薄膜3包含偏光件。偏光薄膜3典型上包含偏光件及保護薄膜(透明保護薄膜)。保護薄膜例如係配置成與偏光件之主面(具有最寬廣面積之表面)相接。偏光件亦可配置在2片保護薄膜之間。保護薄膜亦可配置於偏光件之至少一面。
(Polarizing film)
The
偏光件無特別限定,可舉例如使聚乙烯醇系薄膜、部分縮甲醛化聚乙烯醇系薄膜、乙烯-乙酸乙烯酯共聚物系部分皂化薄膜等親水性高分子薄膜吸附碘、二色性染料等二色性物質並單軸延伸而得者;聚乙烯醇之脫水處理物、聚氯乙烯之脫鹽酸處理物等多烯系定向薄膜等。偏光件典型上係由聚乙烯醇系薄膜(聚乙烯醇系薄膜中包含乙烯・乙酸乙烯酯共聚物系部分皂化薄膜)及碘等二色性物質構成。The polarizer is not particularly limited, and examples thereof include those obtained by adsorbing dichroic substances such as iodine and dichroic dyes on hydrophilic polymer films such as polyvinyl alcohol films, partially formalized polyvinyl alcohol films, and partially saponified films of ethylene-vinyl acetate copolymers and then uniaxially stretching them; polyene-based oriented films such as dehydrated polyvinyl alcohol films and dehydrogenated polyvinyl chloride films, etc. The polarizer is typically composed of a polyvinyl alcohol film (polyvinyl alcohol films include partially saponified films of ethylene-vinyl acetate copolymers) and dichroic substances such as iodine.
偏光件之厚度無特別限定,例如為80µm以下,亦可為50µm以下、30µm以下、28µm以下、25µm以下、20µm以下,更可為18µm以下。偏光件之厚度的下限無特別限定,例如為1µm以上,亦可為5µm以上、10µm以上,更可為15µm以上。薄型偏光件(例如厚度20µm以下)有抑制住熱所致之尺寸變化,而可有助於提升光學積層體之耐久性、尤其是高溫下之耐久性。又,偏光件之厚度愈大,有熱所致之尺寸變化變大之傾向,因此本發明特別有利於例如偏光件之厚度大於20µm之情況、尤其是25µm以上之情況。There is no particular limitation on the thickness of the polarizer, for example, it is less than 80µm, and it can also be less than 50µm, less than 30µm, less than 28µm, less than 25µm, less than 20µm, and can also be less than 18µm. There is no particular limitation on the lower limit of the thickness of the polarizer, for example, it is more than 1µm, and it can also be more than 5µm, more than 10µm, and can also be more than 15µm. Thin polarizers (for example, thickness less than 20µm) can suppress dimensional changes caused by heat, and can help improve the durability of the optical laminate, especially durability under high temperatures. In addition, the greater the thickness of the polarizer, the greater the dimensional changes caused by heat. Therefore, the present invention is particularly beneficial, for example, when the thickness of the polarizer is greater than 20µm, especially when it is greater than 25µm.
保護薄膜之材料可使用例如透明性、機械強度、熱穩定性、水分阻隔性、各向同性等優異之熱塑性樹脂。所述熱塑性樹脂的具體例可列舉例如:三醋酸纖維素等之纖維素樹脂、聚酯樹脂、聚醚碸樹脂、聚碸樹脂、聚碳酸酯樹脂、聚醯胺樹脂、聚醯亞胺樹脂、聚烯烴樹脂、(甲基)丙烯酸樹脂、環狀聚烯烴樹脂(降𦯉烯系樹脂)、聚芳酯樹脂、聚苯乙烯樹脂、聚乙烯醇樹脂及該等之混合物。保護薄膜之材料亦可為(甲基)丙烯酸系、胺甲酸酯系、丙烯酸胺甲酸酯系、環氧系、聚矽氧系等熱硬化性樹脂或紫外線硬化型樹脂。偏光薄膜具有2片保護薄膜時,2片保護薄膜之材料可互同亦可互異。例如,亦可對偏光件之一主面透過接著劑貼合有以熱塑性樹脂構成之保護薄膜,且對偏光件之另一主面貼合有以熱硬化性樹脂或紫外線硬化型樹脂構成之保護薄膜。保護薄膜亦可包含有1種以上任意之添加劑。添加劑可舉例如紫外線吸收劑、抗氧化劑、滑劑、塑化劑、脫模劑、抗著色劑、阻燃劑、成核劑、抗靜電劑、顏料、著色劑等。The protective film may be made of thermoplastic resins having excellent transparency, mechanical strength, thermal stability, moisture barrier properties, isotropy, etc. Specific examples of the thermoplastic resins include cellulose resins such as cellulose triacetate, polyester resins, polyether resins, polyester resins, polycarbonate resins, polyamide resins, polyimide resins, polyolefin resins, (meth)acrylic resins, cyclic polyolefin resins (northene resins), polyarylate resins, polystyrene resins, polyvinyl alcohol resins, and mixtures thereof. The material of the protective film may also be a thermosetting resin or UV-curing resin such as (meth) acrylic acid, urethane, acrylic urethane, epoxy, silicone, etc. When the polarizing film has two protective films, the materials of the two protective films may be the same or different. For example, a protective film made of a thermoplastic resin may be bonded to one main surface of the polarizer through an adhesive, and a protective film made of a thermosetting resin or a UV-curing resin may be bonded to the other main surface of the polarizer. The protective film may also contain one or more arbitrary additives. Examples of additives include ultraviolet absorbers, antioxidants, lubricants, plasticizers, mold release agents, anti-coloring agents, flame retardants, nucleating agents, antistatic agents, pigments, colorants, etc.
保護薄膜之厚度可適當決定,惟一般由強度或操作性等作業性、薄膜性等方面來看,例如為5~200µm,宜為10~80µm。The thickness of the protective film can be appropriately determined, but is generally considered from aspects such as strength or operability, film properties, etc., for example, 5~200µm, preferably 10~80µm.
偏光件與保護薄膜通常係透過水系接著劑等密著。水系接著劑方面可例示異氰酸酯系接著劑、聚乙烯醇系接著劑、明膠系接著劑、乙烯基系乳膠、水系聚胺甲酸酯、水系聚酯等。上述接著劑以外之其他接著劑可舉紫外線硬化型接著劑、電子束硬化型接著劑等。電子束硬化型偏光板用接著劑係對各種保護薄膜展現適宜之接著性。接著劑亦可包含有金屬化合物填料。Polarizers and protective films are usually bonded together through water-based adhesives. Examples of water-based adhesives include isocyanate adhesives, polyvinyl alcohol adhesives, gelatin adhesives, vinyl latex, water-based polyurethane, and water-based polyester. Other adhesives besides the above adhesives include UV-curable adhesives and electron beam-curable adhesives. Electron beam-curable adhesives for polarizing plates exhibit suitable adhesion to various protective films. Adhesives may also contain metal compound fillers.
關於保護薄膜,可於與偏光件接著之表面相對向之表面設置有硬塗層,亦可施行為了抗反射、抗黏、擴散、防眩等之處理。Regarding the protective film, a hard coating layer may be provided on the surface opposite to the surface in contact with the polarizer, and treatments such as anti-reflection, anti-sticking, diffusion, and anti-glare may also be performed.
偏光薄膜3亦可為圓偏光薄膜。The
偏光薄膜3之厚度例如為500µm以下,亦可為300µm以下、200µm以下、100µm以下,更可為60µm以下。厚度的下限例如為10µm以上,亦可為25µm以上,更可為40µm以上。The thickness of the
光學積層體10亦可具備有黏著片1、相位差薄膜2及偏光薄膜3以外之層。該層之例為:相位差薄膜2及偏光薄膜3以外之光學薄膜、底塗層、抗靜電層、保護層、塗覆層、硬塗層、蓋玻璃、黏著片1以外之黏著片、及可用於形成黏著片1之基材片材。The
[光學積層體之製造方法]
光學積層體10例如可積層黏著片1、相位差薄膜2及視需求之偏光薄膜3等其他層來形成。黏著片1例如可對第1積層體15照射光14來形成,該第1積層體15依序包含基材片材21、含光硬化性組成物之塗佈層22及剝離襯材23(參照圖4A~圖4C)。塗佈層22受光14照射而硬化,成為黏著片1。
[Manufacturing method of optical laminate]
The
圖4A之例中,係從基材片材21之側照射光14。此時,光14會透射基材片材21到達塗佈層22。惟,光14可從剝離襯材23側照射,亦可從剝離襯材23及基材片材21這兩側照射(圖4B)。所形成之黏著片1在剝離襯材23被剝離之前,係被基材片材21及剝離襯材23夾持而構成第2積層體16之一部分。In the example of FIG. 4A , the light 14 is irradiated from the side of the
剝離襯材23之基材(以下稱「襯材基材」)之例為樹脂薄膜。襯材基材中可含之樹脂之例為:聚對苯二甲酸乙二酯及聚萘二甲酸乙二酯等聚酯、乙酸酯樹脂、聚醚碸、聚碳酸酯、聚醯胺、聚醯亞胺、聚烯烴、(甲基)丙烯酸樹脂、聚氯乙烯、聚二氯亞乙烯、聚苯乙烯、聚乙烯醇、聚芳酯、以及聚伸苯硫醚。樹脂宜為聚對苯二甲酸乙二酯等聚酯。An example of the substrate of the release substrate 23 (hereinafter referred to as "substrate substrate") is a resin film. Examples of resins that may be contained in the substrate substrate are polyesters such as polyethylene terephthalate and polyethylene naphthalate, acetate resins, polyether sulphates, polycarbonates, polyamides, polyimides, polyolefins, (meth) acrylic resins, polyvinyl chloride, polyvinylidene chloride, polystyrene, polyvinyl alcohol, polyarylates, and polyphenylene sulfide. The resin is preferably a polyester such as polyethylene terephthalate.
剝離襯材23可具有光14的透射性,亦可具有與基材片材21相同程度之光14的透射性。The
剝離襯材23之厚度例如為10~200µm,亦可為25~150µm。The thickness of the
剝離襯材23亦可具備有襯材基材以外之層。剝離襯材23亦可具備有脫模層。剝離襯材23具備例如襯材基材與形成於襯材基材之一面的脫模層。該剝離襯材23可以使脫模層在塗佈層22側之方式來使用。The
脫模層典型上為含脫模劑之脫模劑組成物的硬化層。對於脫模劑,可使用聚矽氧系脫模劑、氟系脫模劑、長鏈烷基系脫模劑、脂肪酸醯胺系脫模劑、矽粉等各種脫模劑。剝離襯材23亦可具備有包含聚矽氧系脫模劑作為主成分之脫模劑組成物之硬化層(以下稱「聚矽氧脫模層」)。聚矽氧脫模層特別適於兼顧對黏著片1之密著性及剝離性。此外,本說明書中,主成分意指含有率最大之成分。The release layer is typically a hardened layer of a release agent composition containing a release agent. For the release agent, various release agents such as polysilicone release agents, fluorine release agents, long-chain alkyl release agents, fatty acid amide release agents, and silicon powder can be used. The
聚矽氧系脫模劑例如為加成反應型、縮合反應型、紫外線硬化型、電子束硬化型、無溶劑型等各種硬化型聚矽氧材料,宜為加成反應硬化型聚矽氧材料。加成反應硬化型聚矽氧材料特別適於形成兼顧對黏著片1之密著性及剝離性的脫模層。硬化型聚矽氧材料亦可為藉由接枝聚合等對胺甲酸酯、環氧、醇酸樹脂等有機樹脂導入了反應性聚矽氧的聚矽氧改質樹脂。The silicone-based mold release agent includes various curing silicone materials such as addition reaction type, condensation reaction type, ultraviolet curing type, electron beam curing type, solvent-free type, etc., preferably addition reaction curing silicone materials. Addition reaction curing silicone materials are particularly suitable for forming a mold release layer that takes into account both adhesion to the
加成反應硬化型聚矽氧材料之例為分子內具有乙烯基或烯基之聚有機矽氧烷。加成反應硬化型聚矽氧材料亦可不具有氫矽基。烯基之例為:3-丁烯基、4-戊烯基、5-己烯基、6-庚烯基、7-辛烯基、8-壬烯基、9-癸烯基、10-十一烯基及11-十二烯基。聚有機矽氧烷之例為:聚二甲基矽氧烷、聚二乙基矽氧烷及聚甲基乙基矽氧烷等聚烷基烷基矽氧烷、聚烷基芳基矽氧烷、以及聚(二甲基矽氧烷-二乙基矽氧烷)等複數種含Si原子單體之共聚物。聚有機矽氧烷宜為聚二甲基矽氧烷。Examples of addition reaction curing polysiloxane materials are polyorganosiloxanes having vinyl or alkenyl groups in the molecule. Addition reaction curing polysiloxane materials may not have hydrosilyl groups. Examples of alkenyl groups are: 3-butenyl, 4-pentenyl, 5-hexenyl, 6-heptenyl, 7-octenyl, 8-nonenyl, 9-decenyl, 10-undecenyl and 11-dodecenyl. Examples of polyorganosiloxanes are: polyalkyl alkyl siloxanes such as polydimethylsiloxane, polydiethylsiloxane and polymethylethylsiloxane, polyalkylaryl siloxane, and copolymers of multiple Si atom-containing monomers such as poly(dimethylsiloxane-diethylsiloxane). The polyorganosiloxane is preferably polydimethylsiloxane.
包含聚矽氧系脫模劑作為主成分之脫模劑組成物(以下稱「聚矽氧脫模劑組成物」)通常包含交聯劑。交聯劑之例為具有氫矽基之聚有機矽氧烷。交聯劑亦可於一分子中具有2個以上氫矽基。A mold release agent composition containing a polysilicone-based mold release agent as a main component (hereinafter referred to as a "polysilicone mold release agent composition") generally contains a crosslinking agent. An example of a crosslinking agent is a polyorganosiloxane having a hydrosilyl group. The crosslinking agent may also have two or more hydrosilyl groups in one molecule.
聚矽氧脫模劑組成物亦可包含有硬化觸媒。硬化觸媒之例為鉑系觸媒。鉑系觸媒之例為氯化鉑酸、鉑之烯烴錯合物、氯化鉑酸之烯烴錯合物。鉑系觸媒之使用量相對於組成物之總固體成分例如為10~1000ppm(重量基準,換算成鉑)。The silicone release agent composition may also contain a hardening catalyst. An example of a hardening catalyst is a platinum-based catalyst. Examples of platinum-based catalysts are platinum chloride, platinum olefin complexes, and platinum chloride olefin complexes. The amount of the platinum-based catalyst used is, for example, 10 to 1000 ppm (weight basis, converted to platinum) relative to the total solid content of the composition.
聚矽氧脫模劑組成物亦可包含有添加劑。添加劑之例為剝離控制劑及密著性提升劑。剝離控制劑之例為未反應性之聚矽氧樹脂,更具體之例為八甲基環四矽氧烷等有機矽氧烷及MQ樹脂。相對於組成物之總固體成分,剝離控制劑及密著性提升劑之使用量合計為例如1~30重量%。添加劑之其他例為充填劑、抗靜電劑、抗氧化劑、紫外線吸收劑、塑化劑及著色劑。相對於組成物之總固體成分,其他添加劑之使用量合計為例如10重量%以下。The silicone release agent composition may also contain additives. Examples of additives are peeling control agents and adhesion promoters. Examples of peeling control agents are unreactive silicone resins, and more specifically, organic silicones such as octamethylcyclotetrasiloxane and MQ resins. The total amount of peeling control agents and adhesion promoters used is, for example, 1 to 30% by weight relative to the total solid content of the composition. Other examples of additives are fillers, antistatic agents, antioxidants, ultraviolet absorbers, plasticizers, and colorants. The total amount of other additives used is, for example, less than 10% by weight relative to the total solid content of the composition.
聚矽氧脫模劑組成物亦可包含有有機溶劑。有機溶劑之例為:環己烷、正己烷、正庚烷等烴系溶劑;甲苯、二甲苯等芳香族系溶劑;乙酸乙酯、乙酸甲酯等酯系溶劑;丙酮、甲基乙基酮等酮系溶劑;甲醇、乙醇、丁醇等醇系溶劑。亦可包含有2種以上有機溶劑。有機溶劑之使用量宜為聚矽氧脫模劑組成物之80~99.9重量%。The silicone mold release agent composition may also contain an organic solvent. Examples of organic solvents include hydrocarbon solvents such as cyclohexane, n-hexane, and n-heptane; aromatic solvents such as toluene and xylene; ester solvents such as ethyl acetate and methyl acetate; ketone solvents such as acetone and methyl ethyl ketone; and alcohol solvents such as methanol, ethanol, and butanol. Two or more organic solvents may also be included. The amount of organic solvent used is preferably 80 to 99.9% by weight of the silicone mold release agent composition.
脫模層例如可將形成於襯材基材上之含脫模劑組成物的塗佈膜加熱及乾燥而形成。脫模劑組成物之塗佈可應用輥塗佈、接觸輥塗佈、凹版塗佈、反向塗佈、輥刷、噴塗、浸漬輥塗佈、棒塗佈、刮刀塗佈、氣刀塗佈、簾塗佈、唇塗佈、模具塗佈等各種塗佈方法。加熱及乾燥可應用例如熱風乾燥。加熱溫度及時間依襯材基材之耐熱性而異,但通常為80~150℃及10秒~10分鐘左右。亦可視需要併用紫外線等活性能量線之照射。The release layer can be formed, for example, by heating and drying a coating film containing a release agent composition formed on a liner substrate. The release agent composition can be applied by various coating methods such as roller coating, contact roller coating, gravure coating, reverse coating, roller brush, spray coating, dip roller coating, rod coating, doctor blade coating, air knife coating, curtain coating, lip coating, and mold coating. Heating and drying can be applied by, for example, hot air drying. The heating temperature and time vary depending on the heat resistance of the substrate, but are usually 80~150℃ and 10 seconds~10 minutes. Active energy rays such as ultraviolet rays can also be used as needed.
脫模層之厚度例如為10~300nm。厚度的上限亦可為200nm以下、150nm以下、120nm以下、110nm以下、100nm以下、小於100nm、90nm以下、80nm以下、70nm以下、小於70nm,更可為65nm以下。厚度的下限亦可為15nm以上、20nm以上、25nm以上、30nm以上、35nm以上、40nm以上、45nm以上,更可為50nm以上。The thickness of the release layer is, for example, 10 to 300 nm. The upper limit of the thickness may be 200 nm or less, 150 nm or less, 120 nm or less, 110 nm or less, 100 nm or less, less than 100 nm, 90 nm or less, 80 nm or less, 70 nm or less, less than 70 nm, or less than 65 nm. The lower limit of the thickness may be 15 nm or more, 20 nm or more, 25 nm or more, 30 nm or more, 35 nm or more, 40 nm or more, 45 nm or more, or 50 nm or more.
剝離襯材23可為單片狀亦可為長條狀。The
基材片材21之例為樹脂薄膜。基材片材21中所含之樹脂之例係與襯材基材中可含之樹脂之例相同。An example of the
基材片材21宜具有優異之光14的透射性。The
基材片材21之厚度例如為10~200µm,亦可為25~150µm。The thickness of the
基材片材21亦可於塗佈層22側的面具備有脫模層。基材片材21可具備之脫模層及其製法之例係與剝離襯材23可具備之脫模層及其製法之例相同。剝離襯材23及基材片材21兩者亦可具備有脫模層。此時,兩脫模層亦可由包含相同脫模劑作為主成分之脫模劑組成物形成。又,兩脫模層之厚度可不同,例如基材片材21所具備之脫模層亦可較厚。The
對於基材片材21,通常可選擇與黏著片1的剝離力較剝離襯材23更大之片材。For the
基材片材21可為單片狀亦可為長條狀。The
第1積層體15例如可於基材片材21(或剝離襯材23)上形成塗佈層22,並於所形成之塗佈層22上配置剝離襯材23(或基材片材21)來形成。又,亦可使光硬化性組成物流入基材片材21及剝離襯材23間之以彼此主面相對向之方式保持預定間隔所形成之空間來進行塗佈,而形成第1積層體15。The
塗佈層22之形成可應用輥塗佈、接觸輥塗佈、凹版塗佈、反向塗佈、輥刷、噴塗佈、浸漬輥塗佈、棒塗佈、刮刀塗佈、氣刀塗佈、簾塗佈、唇塗佈、模具塗佈等各種塗佈方法。The
塗佈層22之厚度可按所欲之黏著片1之厚度來調整。The thickness of the
對第1積層體15照射之光14例如為具有較波長450nm更短之波長的可見光或紫外線。光14亦可包含有與光硬化性組成物所含之光聚合引發劑之吸收波長相同區域之波長的光。亦可照射經濾光器等截止波長300nm以下之短波長光之光14,截止短波長光適於抑制光14造成基材片材21及/或剝離襯材23劣化。光14之光源例如為具備紫外線照射燈之光照射裝置。紫外線照射燈之例為:紫外光LED、低壓水銀燈、中壓水銀燈、高壓水銀燈、超高壓水銀燈、金屬鹵素燈、氙燈、微波激發水銀燈、黑光燈、化學燈、殺菌燈、低壓放電水銀燈、準分子雷射。亦可組合2個以上紫外線照射燈。The light 14 irradiated to the
光14之照射可連續亦可間斷。The irradiation of the light 14 may be continuous or intermittent.
光14之照射強度例如為1~20mW/cm
2。光14之照射時間例如為5分鐘~5小時。光14對第1積層體15之累積光量例如為100~5000mJ/cm
2。
The irradiation intensity of the light 14 is, for example, 1 to 20 mW/cm 2 . The irradiation time of the light 14 is, for example, 5 minutes to 5 hours. The accumulated light quantity of the light 14 on the
接著,從第2積層體16剝離剝離襯材23,使黏著片1之表面露出。藉由於黏著片1之露出面配置相位差薄膜2,可形成光學積層體10。亦可在配置相位差薄膜2之前,對黏著片1之露出面施行表面改質處理。Next, the
本實施形態之光學積層體例如可以將帶狀光學積層體捲繞而成之捲繞體之形態、或以單片狀光學積層體之形態進行流通及保管。The optical multilayer of the present embodiment can be distributed and stored in the form of a rolled body formed by rolling a strip-shaped optical multilayer or in the form of a single-sheet optical multilayer.
本實施形態之光學積層體典型上可用於影像顯示裝置。影像顯示裝置例如可接合光學積層體10與影像顯示面板來形成。接合係藉由例如黏著片1來進行。影像顯示裝置可為有機EL顯示器,亦可為液晶顯示器。惟,影像顯示裝置不受上述例所限。影像顯示裝置亦可為電致發光(EL)顯示器、電漿顯示器(PD)、場發射顯示器(FED:Field Emission Display)等。影像顯示裝置亦可為用於可能暴露於高溫環境下之用途者,典型上為車載用。惟,影像顯示裝置之用途無限定。影像顯示裝置可用於家電用途或公共資訊顯示器(PID)用途等各種用途上。The optical multilayer body of this embodiment can typically be used in an image display device. The image display device can be formed by, for example, joining the
實施例 以下藉由實施例進一步詳細說明本發明。本發明不受以下所示實施例所限。 Implementation Examples The present invention is further described in detail below through implementation examples. The present invention is not limited to the implementation examples shown below.
[偏光薄膜之準備] (偏光薄膜A) 將厚度80µm的聚乙烯醇薄膜在速度比不同之輥間,於溫度30℃、濃度0.3%的碘溶液中染色1分鐘並延伸至3倍為止。接著,一邊將其浸漬於以濃度4%包含硼酸且以濃度10%包含碘化鉀之溫度60℃的水溶液中0.5分鐘,一邊進行延伸至總和延伸倍率達6倍為止。接著,將其浸漬於以濃度1.5%包含碘化鉀之溫度30℃的水溶液中10秒鐘洗淨後,在50℃下進行4分鐘乾燥,藉此獲得了厚度18µm之偏光件。藉由聚乙烯醇系接著劑,將由具有內酯環結構之改質丙烯酸系聚合物構成的厚度30µm之透明保護薄膜貼合於該偏光件之單面。並且,藉由聚乙烯醇系接著劑,將於三醋酸纖維素薄膜(Konica Minolta製,商品名「KC4UY」)上形成有硬塗層(HC)之厚度47µm的透明保護薄膜貼合於偏光件之另一面。使其在設定成70℃之烘箱內加熱乾燥5分鐘,藉此製出偏光薄膜A。並且,對偏光薄膜A之由改質丙烯酸系聚合物構成之透明保護薄膜側之表面,以放電量63W/(m 2・分鐘)進行電暈處理。 [Preparation of polarizing film] (Polarizing film A) A polyvinyl alcohol film with a thickness of 80µm was dyed in an iodine solution with a concentration of 0.3% at a temperature of 30°C for 1 minute between rollers with different speed ratios and stretched to 3 times. Then, it was immersed in an aqueous solution containing boric acid at a concentration of 4% and potassium iodide at a concentration of 10% at a temperature of 60°C for 0.5 minutes, and stretched to a total stretching ratio of 6 times. Then, it was immersed in an aqueous solution containing potassium iodide at a concentration of 1.5% at a temperature of 30°C for 10 seconds, washed, and dried at 50°C for 4 minutes to obtain a polarizer with a thickness of 18µm. A transparent protective film with a thickness of 30µm made of a modified acrylic polymer having a lactone ring structure was bonded to one side of the polarizer using a polyvinyl alcohol adhesive. Furthermore, a transparent protective film with a thickness of 47µm formed on a cellulose triacetate film (manufactured by Konica Minolta, trade name "KC4UY") was bonded to the other side of the polarizer using a polyvinyl alcohol adhesive. The film was heated and dried in an oven set at 70°C for 5 minutes to produce a polarizing film A. Furthermore, the surface of the polarizing film A on the transparent protective film side made of a modified acrylic polymer was subjected to a corona treatment with a discharge amount of 63W/( m2 ·min).
(偏光薄膜B) 除了變更延伸條件外,以與偏光薄膜A之製作相同方式,而獲得厚28µm之偏光件。藉由聚乙烯醇系接著劑,將由具有內酯環結構之改質丙烯酸系聚合物構成的厚度30µm之透明保護薄膜貼合於該偏光件之單面。並且,藉由聚乙烯醇系接著劑,將於三醋酸纖維素薄膜(Konica Minolta製,商品名「KC4UY」)上形成有硬塗層(HC)之厚度40µm的透明保護薄膜貼合於偏光件之另一面。使其在設定成70℃之烘箱內加熱乾燥5分鐘,藉此製出偏光薄膜B。並且,對偏光薄膜B之由改質丙烯酸系聚合物構成之透明保護薄膜側之表面,以放電量63W/(m 2・分鐘)進行電暈處理。 (Polarizing film B) A polarizing element with a thickness of 28 µm was obtained in the same manner as the preparation of polarizing film A except that the stretching conditions were changed. A transparent protective film with a thickness of 30 µm composed of a modified acrylic polymer having a lactone ring structure was bonded to one side of the polarizing element using a polyvinyl alcohol-based adhesive. Furthermore, a transparent protective film with a thickness of 40 µm formed on a cellulose triacetate film (manufactured by Konica Minolta, trade name "KC4UY") was bonded to the other side of the polarizing element using a polyvinyl alcohol-based adhesive. It was heated and dried in an oven set at 70°C for 5 minutes to produce polarizing film B. Furthermore, the surface of the polarizing film B on the transparent protective film side made of a modified acrylic polymer was subjected to a corona treatment at a discharge amount of 63 W/(m 2 ·min).
[相位差薄膜之準備] 透過丙烯酸系黏著劑層(厚度15µm),將雙軸延伸聚丙烯薄膜(Toray製,商品名「TORAYFAN」BO 2570A-5,厚度60µm)貼合於包含使降𦯉烯系單體之開環聚合物氫化而得之樹脂的高分子薄膜(日本ZEON股份公司製,商品名「ZEONOR ZF14-100」,厚度100µm)兩側。之後,利用輥延伸機保持薄膜之長邊方向,在146℃±1℃之空氣循環式恆溫烘箱內延伸1.38倍,而製出厚度108µm之相位差薄膜。 [Preparation of phase difference film] A biaxially oriented polypropylene film (Toray, trade name "TORAYFAN" BO 2570A-5, thickness 60µm) was attached to both sides of a polymer film (ZEON Corporation, Japan, trade name "ZEONOR ZF14-100", thickness 100µm) containing a resin obtained by hydrogenating a ring-opening polymer of a nor-butylene monomer through an acrylic adhesive layer (thickness 15µm). After that, the film was stretched 1.38 times in an air circulation constant temperature oven at 146℃±1℃ while maintaining the long side direction of the film using a roll stretching machine, and a phase difference film with a thickness of 108µm was produced.
[單體漿之製作] (合成例1) 將丙烯酸正丁酯(BA)99重量份、丙烯酸4-羥丁酯(HBA)1重量份及丙烯酸(AA)10重量份、作為光聚合引發劑之Omnirad184(1-羥環己基-苯基酮,IGM RESINS製)0.1重量份投入四口燒瓶中,在氮氣環境下照射紫外線,藉此獲得已部分光聚合之單體漿A1。紫外線照射係實施至燒瓶內液體之黏度(計測條件:BH黏度計No.5轉子,10rpm,測定溫度30℃)達約20Pa・s為止。 [Preparation of monomer slurry] (Synthesis Example 1) 99 parts by weight of n-butyl acrylate (BA), 1 part by weight of 4-hydroxybutyl acrylate (HBA), 10 parts by weight of acrylic acid (AA), and 0.1 parts by weight of Omnirad184 (1-hydroxycyclohexyl-phenyl ketone, manufactured by IGM RESINS) as a photopolymerization initiator were placed in a four-necked flask and irradiated with ultraviolet light in a nitrogen environment to obtain partially photopolymerized monomer slurry A1. Ultraviolet light irradiation was performed until the viscosity of the liquid in the flask (measurement conditions: BH viscometer No. 5 rotor, 10 rpm, measurement temperature 30°C) reached about 20 Pa·s.
(合成例2) 除了將要使用之單體如表1變更外,以與單體漿A1相同方式調製出單體漿A2~A14。 (Synthesis Example 2) Except that the monomers to be used are changed as shown in Table 1, monomer slurries A2 to A14 are prepared in the same manner as monomer slurry A1.
[表1] [Table 1]
表1中之簡稱如下。此外,Omnirad2959及Omnirad127宜為α-羥苯乙酮系化合物。 BA:丙烯酸正丁酯 HBA:丙烯酸4-羥丁酯 AA:丙烯酸 NVP:N-乙烯基-2-吡咯啶酮 Omnirad184:1-羥環己基-苯基酮(Omnirad184,IGM Resins公司製) Omnirad651:2,2-二甲氧基-1,2-二苯基乙-1-酮(Omnirad651,IGM Resin公司製) Omnirad127:2-羥-1-(4-(4-(2-羥-2-甲基丙醯基)苄基)苯基)2-甲基丙-1-酮(Omnirad127,IGM Resin公司製) Omnirad2959:1-[4-(2-羥乙氧基)-苯基]-2-羥-2-甲基丙酮(Omnirad2959,IGM Resin公司製) The abbreviations in Table 1 are as follows. In addition, Omnirad2959 and Omnirad127 are preferably α-hydroxyacetophenone compounds. BA: n-butyl acrylate HBA: 4-hydroxybutyl acrylate AA: acrylic acid NVP: N-vinyl-2-pyrrolidone Omnirad184: 1-Hydroxycyclohexyl-phenyl ketone (Omnirad184, manufactured by IGM Resins) Omnirad651: 2,2-dimethoxy-1,2-diphenylethan-1-one (Omnirad651, manufactured by IGM Resin) Omnirad127: 2-Hydroxy-1-(4-(4-(2-hydroxy-2-methylpropionyl)benzyl)phenyl)2-methylpropan-1-one (Omnirad127, manufactured by IGM Resin) Omnirad2959: 1-[4-(2-hydroxyethoxy)-phenyl]-2-hydroxy-2-methylpropanone (Omnirad2959, manufactured by IGM Resin)
[光硬化性組成物之製作] 以成為以下表2所示組成之方式混合單體漿、交聯劑及矽烷耦合劑,而獲得光硬化性組成物C1~C14。交聯劑係使用1,9-壬二醇二丙烯酸酯(NDDA)。矽烷耦合劑中係使用含環氧基之矽烷耦合劑(Shin-Etsu Silicone製,KBM-403)。 [Preparation of photocurable composition] The monomer slurry, crosslinking agent and silane coupling agent were mixed in a manner as shown in Table 2 below to obtain photocurable compositions C1 to C14. 1,9-nonanediol diacrylate (NDDA) was used as the crosslinking agent. An epoxy-containing silane coupling agent (manufactured by Shin-Etsu Silicone, KBM-403) was used as the silane coupling agent.
[表2] [Table 2]
[黏著片之製作] (製造例1:剝離襯材A之製作) 將加成反應硬化型聚矽氧(包含含己烯基之聚有機矽氧烷之LTC761,30重量%甲苯溶液,Dow Corning Toray Co., Ltd.製)30重量份、剝離控制劑(含未反應性聚矽氧樹脂之BY24-856,Dow Corning Toray Co., Ltd.製)0.9重量份及硬化觸媒(含鉑觸媒之SRX212,Dow Corning Toray Co., Ltd.製)2重量份、以及作為稀釋溶劑之甲苯/己烷混合溶劑(體積比1:1)混合,而獲得聚矽氧系脫模劑組成物。脫模劑組成物中之聚矽氧固體成分之濃度為1.0重量%。接著,利用線棒將脫模劑組成物塗佈於襯材基材(聚酯薄膜Lumirror XD500P,厚度75µm)之單面,並在130℃下加熱1分鐘,製作出於單面具備脫模層(厚度60nm)之剝離襯材A。 [Preparation of Adhesive Sheet] (Preparation Example 1: Preparation of Release Backing Material A) 30 parts by weight of addition reaction curing type silicone (LTC761 containing hexene-containing polyorganosiloxane, 30% by weight toluene solution, manufactured by Dow Corning Toray Co., Ltd.), 0.9 parts by weight of stripping control agent (BY24-856 containing unreacted silicone resin, manufactured by Dow Corning Toray Co., Ltd.), 2 parts by weight of curing catalyst (SRX212 containing platinum catalyst, manufactured by Dow Corning Toray Co., Ltd.), and a toluene/hexane mixed solvent (volume ratio 1:1) as a diluent were mixed to obtain a silicone-based release agent composition. The concentration of the polysilicone solid component in the release agent composition is 1.0 wt%. Then, the release agent composition is coated on one side of the liner substrate (polyester film Lumirror XD500P, thickness 75µm) using a wire rod and heated at 130°C for 1 minute to produce a release liner A with a release layer (thickness 60nm) prepared on one side.
(製造例2:剝離襯材B之製作) 除了變更脫模劑組成物對襯材基材之塗佈厚度外,以與製造例1相同方式製出於單面具備脫模層(厚度120nm)之剝離襯材B。 (Manufacturing Example 2: Preparation of Release Liner B) Except for changing the coating thickness of the release agent composition on the liner substrate, a release liner B with a release layer (thickness 120nm) on one side was prepared in the same manner as in Manufacturing Example 1.
(實施例1) 利用灑佈器將光硬化性組成物C1塗佈於製造例1製出之剝離襯材A之單面而形成塗佈層。接著,於所形成之塗佈層上配置製造例2製出之剝離襯材B而獲得第1積層體。剝離襯材A、B皆配置成使脫模層與塗佈層相接。接著,從第1積層體之剝離襯材A側,在照射強度2.5mW/cm 2、照射時間640秒之條件下照射紫外線(黑光燈光源)使塗佈層光硬化,而形成由剝離襯材A、黏著片(厚度20µm)及剝離襯材B構成之第2積層體。接著,從第2積層體剝離剝離襯材B,並對藉由剝離而形成之黏著片的露出面接合已預先對兩面施行電暈處理之上述相位差薄膜。接著,對相位差薄膜之露出面接合以與上述相同方式形成之另一黏著片,而獲得具有剝離襯材A/黏著片/相位差薄膜/黏著片/剝離襯材A之積層結構的光學積層體。接著,從該光學積層體剝離其中一剝離襯材A,並對露出之黏著片接合上述準備之偏光薄膜A或偏光薄膜B。接合係以黏著片與偏光薄膜A、B中之由改質丙烯酸系聚合物構成之透明保護薄膜相接之方式來實施。藉此,獲得具有偏光薄膜A/黏著片/相位差薄膜/黏著片/剝離襯材A之積層結構的光學積層體A(偏光件之厚度為18µm)、及具有偏光薄膜B/黏著片/相位差薄膜/黏著片/剝離襯材A之積層結構的光學積層體B(偏光件之厚度為28µm)。 (Example 1) A photocurable composition C1 was applied to one side of the release liner A produced in Production Example 1 by a sprayer to form a coating layer. Then, the release liner B produced in Production Example 2 was arranged on the formed coating layer to obtain a first laminate. The release liners A and B were arranged so that the release layer was in contact with the coating layer. Next, the coating layer was photocured by irradiating ultraviolet light (black light source) from the release liner A side of the first laminate at an irradiation intensity of 2.5 mW/cm 2 and an irradiation time of 640 seconds, thereby forming a second laminate consisting of the release liner A, the adhesive sheet (thickness 20 µm) and the release liner B. Next, the release liner B was peeled off from the second laminate, and the above-mentioned retardation film, both surfaces of which had been previously subjected to a corona treatment, was bonded to the exposed surface of the adhesive sheet formed by peeling. Next, another adhesive sheet formed in the same manner as above is bonded to the exposed surface of the phase difference film, thereby obtaining an optical laminate having a laminate structure of release liner A/adhesive sheet/phase difference film/adhesive sheet/release liner A. Next, one of the release liner A is peeled off from the optical laminate, and the prepared polarizing film A or polarizing film B is bonded to the exposed adhesive sheet. The bonding is performed in such a manner that the adhesive sheet is bonded to the transparent protective film made of modified acrylic polymer in the polarizing films A and B. Thus, an optical laminate A having a laminate structure of polarizing film A/adhesive sheet/phase difference film/adhesive sheet/peeling liner A (the thickness of the polarizer is 18µm) and an optical laminate B having a laminate structure of polarizing film B/adhesive sheet/phase difference film/adhesive sheet/peeling liner A (the thickness of the polarizer is 28µm) were obtained.
(實施例2) 使用光硬化性組成物C2來取代光硬化性組成物C1,並且在與相位差薄膜接合前,對各黏著片之相位差薄膜側之面施行電暈處理(放電量61W/(m 2・分鐘)),除此之外以與實施例1相同方式而獲得實施例2之光學積層體A及光學積層體B。 (Example 2) Optical laminates A and B of Example 2 were obtained in the same manner as in Example 1 except that photocurable composition C2 was used instead of photocurable composition C1 and the surface of the phase difference film side of each adhesive sheet was subjected to a corona treatment (discharge amount 61 W/(m 2 ·min)) before bonding with the phase difference film.
(實施例3~10) 除了使用光硬化性組成物C3~C11之各組成物來取代光硬化性組成物C1外,以與實施例1相同方式而獲得實施例3~10之各光學積層體A及光學積層體B。 (Examples 3 to 10) Except that the photocurable compositions C3 to C11 are used instead of the photocurable composition C1, the optical laminates A and B of Examples 3 to 10 are obtained in the same manner as in Example 1.
(實施例11) 除了使用光硬化性組成物C11來取代光硬化性組成物C2外,以與實施例2相同方式而獲得實施例11之光學積層體A及光學積層體B。 (Example 11) Except that the photocurable composition C11 is used instead of the photocurable composition C2, the optical laminate A and the optical laminate B of Example 11 are obtained in the same manner as Example 2.
(比較例1~4) 除了使用光硬化性組成物C5、C12-14之各組成物來取代光硬化性組成物C1外,以與實施例1相同方式而獲得比較例1~4之各光學積層體A及光學積層體B。 (Comparative Examples 1-4) Except that the photocurable compositions C5, C12-14 are used instead of the photocurable composition C1, the optical laminates A and B of Comparative Examples 1-4 are obtained in the same manner as in Example 1.
[聚合率] 實施例及比較例中形成之各黏著片之聚合率係由黏著片在130℃、2小時之加熱乾燥前後之重量的變化算出。具體而言,係令剛從第2積層體剝離剝離襯材A及剝離襯材B後之黏著片之重量為W 0(乾燥前重量),且令上述加熱後在常溫(23℃)下冷卻約20分鐘之時間點之黏著片之重量為W 1(乾燥後重量),藉由式:聚合率(%)=W 1/W 0×100求得。 [Polymerization rate] The polymerization rate of each adhesive sheet formed in the Examples and Comparative Examples was calculated from the change in weight of the adhesive sheet before and after heating and drying at 130°C for 2 hours. Specifically, the weight of the adhesive sheet just after peeling off the peeling liner A and the peeling liner B from the second laminate was set as W 0 (weight before drying), and the weight of the adhesive sheet at the time point of cooling at room temperature (23°C) for about 20 minutes after the above heating was set as W 1 (weight after drying), and the polymerization rate was calculated by the formula: polymerization rate (%) = W 1 /W 0 × 100.
[殘存單體之量] 實施例及比較例中形成之各黏著片中之殘存單體之量係藉由GC分析來評估。將GC分析所用之裝置及測定條件列示如下。 ・使用裝置:GC7890A(Agilent Technologies製) ・管柱:HP-1(Agilent Technologies製) ・檢測器:火焰電離檢測器氫能源離子化檢測器(FID) ・注入口溫度:250℃ ・測定溫度條件:依序實施以下(1)至(4)。(1)在0℃下維持3分鐘;(2)以升溫速度10℃/分鐘升溫;(3)到達120℃後,以升溫速度20℃/分鐘升溫;(4)在300℃下維持 ・試料調整方法:採取試料(黏著片)0.05g至螺口瓶中,添加乙酸乙酯2.5mL後振動一晩。將所得溶液0.45µm以膜濾器過濾後,將過濾液1µL注入GC並進行分析。 [Amount of residual monomers] The amount of residual monomers in each adhesive sheet formed in the embodiment and the comparative example was evaluated by GC analysis. The apparatus and measurement conditions used for GC analysis are listed below. ・ Apparatus used: GC7890A (manufactured by Agilent Technologies) ・ Column: HP-1 (manufactured by Agilent Technologies) ・ Detector: Flame ionization detector hydrogen energy ionization detector (FID) ・ Injection port temperature: 250°C ・ Measurement temperature conditions: The following (1) to (4) were implemented in order. (1) Maintain at 0℃ for 3 minutes; (2) Increase the temperature at a rate of 10℃/min; (3) After reaching 120℃, increase the temperature at a rate of 20℃/min; (4) Maintain at 300℃ ・Sample preparation method: Take 0.05g of the sample (adhesive sheet) into a screw-cap bottle, add 2.5mL of ethyl acetate and shake overnight. Filter the resulting solution with a 0.45µm membrane filter, and inject 1µL of the filtered solution into the GC for analysis.
[投錨力] 使用實施例及比較例製出之各光學積層體A,藉由上述方法評估黏著片對相位差薄膜之投錨力。雙面膠帶係使用日東電工公司製之商品名「No.531」。不鏽鋼製試驗材係使用SUS304之板(寬度40mm×長度120mm)。評估用片材係使用ITO薄膜(125 TETOLIGHT OES,尾池工業製)。拉伸試驗機係使用Autograph SHIMAZU AG-I 10KN(島津製作所製)。 [Anchoring force] Using each optical laminate A produced in the embodiment and the comparative example, the anchoring force of the adhesive sheet on the phase difference film was evaluated by the above method. The double-sided adhesive tape used was the product name "No.531" manufactured by Nitto Denko Corporation. The stainless steel test material used was a SUS304 plate (width 40mm×length 120mm). The evaluation sheet used was an ITO film (125 TETOLIGHT OES, manufactured by Oike Industries). The tensile testing machine used was Autograph SHIMAZU AG-I 10KN (manufactured by Shimadzu Corporation).
[裂痕之易產生性] 針對實施例及比較例之各光學積層體A及光學積層體B,依以下方式評估相位差薄膜之裂痕易產生性。將光學積層體裁切成300mm×210mm之矩形做成試驗片。接著,剝離剝離襯材A,並透過藉由剝離而露出之黏著片將試驗片貼合於玻璃板之表面。接著,在50℃之高壓釜中加熱15分鐘,藉此使試驗片與玻璃板之接合穩定,而獲得評估用試樣。對所得試樣實施反覆-40℃及85℃之熱震試驗,並藉由光學顯微鏡確認相位差薄膜在100次、200次及300次熱循環後有無裂痕。針對各光學積層體準備3個試樣,藉由有產生裂痕之試樣數量來評估相位差薄膜之裂痕易產生性。熱循環之條件如下。 1個循環:於-40℃之氣體環境下放置30分鐘後,於85℃之氣體環境下放置30分鐘。 [Crack Proneness] For each optical laminate A and optical laminate B of the embodiment and comparative example, the crack proneness of the phase difference film was evaluated in the following manner. The optical laminate was cut into a 300 mm × 210 mm rectangle to make a test piece. Then, the peeling backing material A was peeled off, and the test piece was attached to the surface of the glass plate through the adhesive sheet exposed by the peeling. Then, it was heated in an autoclave at 50°C for 15 minutes to stabilize the bond between the test piece and the glass plate, and an evaluation sample was obtained. The obtained samples were subjected to repeated thermal shock tests at -40℃ and 85℃, and the presence or absence of cracks in the retardation film after 100, 200 and 300 thermal cycles was confirmed by an optical microscope. Three samples were prepared for each optical laminate, and the crack susceptibility of the retardation film was evaluated by the number of samples with cracks. The thermal cycle conditions are as follows. 1 cycle: After being placed in a gas environment at -40℃ for 30 minutes, it was placed in a gas environment at 85℃ for 30 minutes.
將評估結果列示於以下表3。此外,表3之「電暈處理」意指對黏著片材之電暈處理。表3中所示殘存單體之量為評估對象之光學積層體中包含之全部黏著片中之殘存單體之量的合計。於「裂痕易產生性」之欄位中,令評估之3個試樣中有產生裂痕之試樣的數量為n時,記載為「n/3」。The evaluation results are shown in Table 3 below. In addition, "corona treatment" in Table 3 means the corona treatment of the adhesive sheet. The amount of residual monomers shown in Table 3 is the total amount of residual monomers in all adhesive sheets included in the optical laminate to be evaluated. In the "crack formation susceptibility" column, when the number of samples that have cracks among the three samples evaluated is n, it is recorded as "n/3".
[表3] [table 3]
產業上之可利用性 本發明光學積層體可使用於例如影像顯示裝置。 Industrial Applicability The optical multilayer body of the present invention can be used in, for example, image display devices.
1,1A,1B:黏著片
2:相位差薄膜
3:偏光薄膜
4:改質處理面
5:改質處理面
10,10A,10B,10C:光學積層體
14:光
15:第1積層體
16:第2積層體
21:基材片材
22:塗佈層
23:剝離襯材
1,1A,1B: Adhesive sheet
2: Retardation film
3: Polarizing film
4: Modified surface
5: Modified
圖1係剖面圖,其示意顯示本發明光學積層體之一例。 圖2係剖面圖,其示意顯示本發明光學積層體之一例。 圖3係剖面圖,其示意顯示本發明光學積層體之一例。 圖4A係示意圖,其用以說明本發明光學積層體所具備之黏著片之形成方法之一例。 圖4B係示意圖,其用以說明本發明光學積層體所具備之黏著片之形成方法之一例。 圖4C係示意圖,其用以說明本發明光學積層體所具備之黏著片之形成方法之一例。 FIG. 1 is a cross-sectional view schematically showing an example of the optical multilayer body of the present invention. FIG. 2 is a cross-sectional view schematically showing an example of the optical multilayer body of the present invention. FIG. 3 is a cross-sectional view schematically showing an example of the optical multilayer body of the present invention. FIG. 4A is a schematic view for illustrating an example of a method for forming an adhesive sheet provided by the optical multilayer body of the present invention. FIG. 4B is a schematic view for illustrating an example of a method for forming an adhesive sheet provided by the optical multilayer body of the present invention. FIG. 4C is a schematic view for illustrating an example of a method for forming an adhesive sheet provided by the optical multilayer body of the present invention.
1:黏著片 1: Adhesive sheet
2:相位差薄膜 2: Phase difference film
4:改質處理面 4: Modified surface
5:改質處理面 5: Modified surface
10,10A:光學積層體 10,10A: Optical laminates
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WO2024019160A1 (en) | 2024-01-25 |
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