TW202409682A - Backlight module and method of manufacturing the same - Google Patents
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- 238000004519 manufacturing process Methods 0.000 title claims description 10
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- 238000009792 diffusion process Methods 0.000 claims description 31
- 238000000034 method Methods 0.000 claims description 7
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- 239000003292 glue Substances 0.000 description 22
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- H—ELECTRICITY
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- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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Abstract
Description
本揭示是關於一種背光模組及其製造方法,特別是關於一種次毫米發光二極體(Mini LED)背光模組及其製造方法。The present disclosure relates to a backlight module and a manufacturing method thereof, in particular to a sub-millimeter light-emitting diode (Mini LED) backlight module and a manufacturing method thereof.
Mini LED為極具潛力的顯示器背光技術,近年來在顯示器領域成為重點發展的項目之一。然而,現有的Mini LED背光模組仍存在一些問題有待克服,例如組裝困難、可靠度不佳、亮度不足等。Mini LED is a highly promising display backlight technology and has become one of the key development projects in the display field in recent years. However, existing Mini LED backlight modules still have some problems to be overcome, such as difficult assembly, poor reliability, and insufficient brightness.
有鑑於此,本揭示之一目的在於提出一種改良的Mini LED背光模組,解決上述技術問題。In view of this, one purpose of this disclosure is to propose an improved Mini LED backlight module to solve the above technical problems.
為達成上述目的,依據本揭示的一些實施方式,一種背光模組包含電路板、複數個發光二極體晶片、透明膠層、第二膠層以及複數個遮光圖案。發光二極體晶片設置在電路板上,而透明膠層包覆發光二極體晶片。第二膠層設置在透明膠層上,並包含複數個擴散粒子。遮光圖案設置在第二膠層遠離透明膠層的表面上,並與發光二極體晶片對齊。To achieve the above-mentioned purpose, according to some embodiments of the present disclosure, a backlight module includes a circuit board, a plurality of light-emitting diode chips, a transparent adhesive layer, a second adhesive layer, and a plurality of light-shielding patterns. The light-emitting diode chips are arranged on the circuit board, and the transparent adhesive layer covers the light-emitting diode chips. The second adhesive layer is arranged on the transparent adhesive layer and includes a plurality of diffusion particles. The light-shielding pattern is arranged on the surface of the second adhesive layer away from the transparent adhesive layer and is aligned with the light-emitting diode chips.
在本揭示的一或多個實施方式中,透明膠層的厚度大於發光二極體晶片的高度,且透明膠層覆蓋發光二極體晶片的頂面。In one or more embodiments of the present disclosure, the thickness of the transparent adhesive layer is greater than the height of the LED chip, and the transparent adhesive layer covers the top surface of the LED chip.
在本揭示的一或多個實施方式中,第二膠層的厚度大於透明膠層的厚度。In one or more embodiments of the present disclosure, the thickness of the second adhesive layer is greater than the thickness of the transparent adhesive layer.
在本揭示的一或多個實施方式中,透明膠層具有頂面以及側面,第二膠層覆蓋透明膠層的頂面,並與透明膠層的側面分離。In one or more embodiments of the present disclosure, the transparent adhesive layer has a top surface and side surfaces, and the second adhesive layer covers the top surface of the transparent adhesive layer and is separated from the side surfaces of the transparent adhesive layer.
在本揭示的一或多個實施方式中,透明膠層具有頂面及側面,第二膠層覆蓋透明膠層的頂面及部份的側面。In one or more embodiments of the present disclosure, the transparent adhesive layer has a top surface and a side surface, and the second adhesive layer covers the top surface and a portion of the side surface of the transparent adhesive layer.
在本揭示的一或多個實施方式中,透明膠層的側面具有圓弧部分,第二膠層部分位於圓弧部分之上。In one or more embodiments of the present disclosure, the side surface of the transparent adhesive layer has an arc portion, and the second adhesive layer portion is located above the arc portion.
在本揭示的一或多個實施方式中,遮光圖案包含一第一遮光圖案,第一遮光圖案在第一位置上具有第一厚度,且在第二位置上具有第二厚度。第一位置位於第一遮光圖案的中心,第二位置遠離第一遮光圖案的中心,且第一厚度大於第二厚度。In one or more embodiments of the present disclosure, the light-shielding pattern includes a first light-shielding pattern, and the first light-shielding pattern has a first thickness at a first position and a second thickness at a second position. The first position is located at the center of the first light-shielding pattern, the second position is far from the center of the first light-shielding pattern, and the first thickness is greater than the second thickness.
依據本揭示的一些實施方式,一種背光模組的製造方法包含:提供電路板以及設置在電路板上的複數個發光二極體晶片;以透明膠層包覆發光二極體晶片;在透明膠層上設置第二膠層,其中第二膠層包含複數個擴散粒子;以及在第二膠層遠離透明膠層的表面上形成複數個遮光圖案,遮光圖案與發光二極體晶片對齊。According to some embodiments of the present disclosure, a method for manufacturing a backlight module includes: providing a circuit board and a plurality of light-emitting diode chips disposed on the circuit board; covering the light-emitting diode chips with a transparent adhesive layer; disposing a second adhesive layer on the transparent adhesive layer, wherein the second adhesive layer includes a plurality of diffused particles; and forming a plurality of shading patterns on a surface of the second adhesive layer away from the transparent adhesive layer, wherein the shading patterns are aligned with the light-emitting diode chips.
在本揭示的一或多個實施方式中,背光模組的製造方法還包含:切除透明膠層的邊緣部分以及第二膠層的邊緣部分,使得第二膠層的側面與透明膠層的側面齊平。In one or more embodiments of the present disclosure, the manufacturing method of the backlight module further includes: cutting off the edge portion of the transparent adhesive layer and the edge portion of the second adhesive layer, so that the side surfaces of the second adhesive layer are in contact with the side surfaces of the transparent adhesive layer. Flush.
綜上所述,在本揭示的背光模組中,以帶有擴散粒子的第二膠層來取代習知的背光模組中的擴散板,並在第二膠層的頂面上設置遮光圖案。藉由上述配置,可以解決習知的背光模組使用擴散板所衍生出的組裝困難問題以及可靠度不佳的問題,也可以兼顧背光模組的發光亮度。To sum up, in the backlight module of the present disclosure, a second adhesive layer with diffusion particles is used to replace the diffusion plate in the conventional backlight module, and a light-shielding pattern is provided on the top surface of the second adhesive layer . Through the above configuration, the problems of difficulty in assembly and poor reliability caused by the conventional backlight module using a diffusion plate can be solved, and the brightness of the backlight module can also be taken into consideration.
為使本揭示之敘述更加詳盡與完備,可參照所附之圖式及以下所述各種實施方式。圖式中之各元件未按比例繪製,且僅為說明本揭示而提供。以下描述許多實務上之細節,以提供對本揭示的全面理解,然而,相關領域具普通技術者應當理解可在沒有一或多個實務上之細節的情況下實施本揭示,因此,該些細節不應用以限定本揭示。In order to make the description of the present disclosure more detailed and complete, reference may be made to the attached drawings and the various implementation modes described below. Elements in the drawings are not drawn to scale and are provided solely to illustrate the present disclosure. Many practical details are described below in order to provide a thorough understanding of the present disclosure. However, one of ordinary skill in the relevant art will understand that the present disclosure may be practiced without one or more practical details, and therefore these details are not shall be used to qualify this disclosure.
在附圖中,為了清楚起見,放大了層、膜、面板、區域等的厚度。在整個說明書中,相同的附圖標記表示相同的元件。應當理解,當諸如層、膜、區域或基板的元件被稱為在另一元件「上」或「連接到」另一元件時,其可以直接在另一元件上或與另一元件連接,或者中間元件可以也存在。相反,當元件被稱為「直接在另一元件上」或「直接連接到」另一元件時,不存在中間元件。如本文所使用的,「連接」可以指物理及/或電性連接。再者,「電性連接」或「耦合」係可為二元件間存在其它元件。In the drawings, the thickness of layers, films, panels, regions, etc., are exaggerated for clarity. Throughout this specification, the same reference numbers refer to the same elements. It will be understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element, or Intermediate elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" may refer to physical and/or electrical connection. Furthermore, "electrical connection" or "coupling" may mean the presence of other components between the two components.
請參照第1圖,習知的背光模組10包含電路板11、複數個發光二極體晶片13以及透明膠層15。發光二極體晶片13設置在電路板11上,而透明膠層15覆蓋發光二極體晶片13。背光模組10還包含擴散板17以及遮光圖案19,擴散板17設置在發光二極體晶片13以及透明膠層15之上,遮光圖案19設置在擴散板17的表面上,並與發光二極體晶片13對齊。擴散板17以及遮光圖案19配置以將發光二極體晶片13發出的光均勻化。Please refer to Figure 1 . A
上述習知的背光模組10的缺點在於,將擴散板17組裝入背光模組10中時,需要將遮光圖案19與發光二極體晶片13對齊,否則會使光均勻化的效果變差。因此,習知的背光模組10的結構設計會造成組裝上的困難。此外,因遮光圖案19是設置在擴散板17上,擴散板17的漲縮也可能造成遮光圖案19偏移而未與發光二極體晶片13對齊,因此,背光模組10也有可靠度不佳的問題。The disadvantage of the above-mentioned
請參照第2圖,在另一種習知的背光模組10A中,遮光圖案19改為設置在透明膠層15上,並位於擴散板17之下。此結構設計雖然能解決背光模組10組裝困難以及可靠度不佳的問題,但犧牲了發光二極體晶片13的混光距離,導致背光模組10A發光的亮度顯著地下降(可能高達百分之十以上)。Referring to FIG. 2 , in another known
本揭示係考量到習知的背光模組10、10A的上述問題而提出一種改進的背光模組20。以下詳細介紹背光模組20的結構。The present disclosure takes into account the above-mentioned problems of the known
請參照第3圖以及第4圖。第3圖為繪示依據本揭示一實施方式之背光模組20的俯視透視圖,而第4圖為繪示第3圖所示之背光模組20沿線段3-3’的剖面示意圖。背光模組20包含電路板11以及複數個發光二極體晶片13,發光二極體晶片13彼此分離地設置在電路板11上,並電性連接電路板11。發光二極體晶片13例如是次毫米發光二極體(Mini LED)晶片。於一些實施方式中,次毫米發光二極體晶片的尺寸小於或等於兩百微米。Please refer to Figure 3 and Figure 4. Figure 3 is a top perspective view of the
如第3圖與第4圖所示,於一些實施方式中,背光模組20進一步包含殼體60,電路板11以及發光二極體晶片13設置在殼體60中。於一些實施方式中,電路板11可以透過黏膠層70固定在殼體60的底面上。As shown in FIG. 3 and FIG. 4 , in some embodiments, the
如第3圖與第4圖所示,背光模組20進一步包含透明膠層50,透明膠層50設置在電路板11上,並包覆電路板11上的發光二極體晶片13。具體而言,電路板11以及透明膠層50沿著第一方向D1堆疊設置,在第一方向D1上,透明膠層50的厚度大於發光二極體晶片13的高度,且透明膠層50覆蓋發光二極體晶片13的頂面(例如:發光二極體晶片13的出光面),並填入相鄰的發光二極體晶片13之間的間隙而覆蓋發光二極體晶片13的側面。透明膠層50包含對於發光二極體晶片13所發出的光具有高穿透率的材料。As shown in FIG. 3 and FIG. 4 , the
如第3圖與第4圖所示,背光模組20進一步包含第二膠層30,第二膠層30設置在透明膠層50上(換言之,第二膠層30位於透明膠層50遠離電路板11的一側),並包含複數個擴散粒子35。第二膠層30配置以將發光二極體晶片13所發出的光均勻化,具體而言,發光二極體晶片13所發出的光通過透明膠層50後進入第二膠層30,光穿越第二膠層30的過程中受到擴散粒子35的影響發生散射、折射及/或反射,促成光的均勻化。As shown in FIG. 3 and FIG. 4 , the
如第3圖與第4圖所示,於一些實施方式中,第二膠層30包含光學透明膠以及散佈在光學透明膠中並被光學透明膠包覆的擴散粒子35。第二膠層30的光學透明膠可以使用與透明膠層50相同的材料,但不以此為限。如同透明膠層50,第二膠層30的光學透明膠對於發光二極體晶片13所發出的光也具有高穿透率。As shown in FIGS. 3 and 4 , in some embodiments, the
如第3圖與第4圖所示,背光模組20進一步包含遮光圖案29,遮光圖案29設置在第二膠層30上,並與發光二極體晶片13對齊。具體而言,第二膠層30具有相對的第一表面31以及第二表面32,其中第一表面31遠離透明膠層50。遮光圖案29設置在第二膠層30的第一表面31上,且在第一方向D1上,每個遮光圖案29與對應的一個發光二極體晶片13對齊(換言之,每個發光二極體晶片13落在對應的一個遮光圖案29在電路板11上的垂直投影區域之中,其中「垂直投影」是指往第一方向D1的反方向投影)。As shown in FIG. 3 and FIG. 4 , the
遮光圖案29配置以將發光二極體晶片13所發出的光部分反射,並允許發光二極體晶片13所發出的光部分穿透,藉此避免正對發光二極體晶片13之處亮度突出,同樣有助於背光模組20的發光亮度的均勻化。The
於一些實施方式中,遮光圖案29可包含油墨,例如白色油墨。於一些實施方式中,如第3圖所示,在實質上垂直於第一方向D1的第二方向D2上,遮光圖案29的寬度大於發光二極體晶片13的寬度,以利遮蔽正對發光二極體晶片13的高亮度區域。In some embodiments, the
需說明的是,圖中將每個遮光圖案29畫成圓形僅是示意。遮光圖案29不限定是由單一個圖形組成,每個遮光圖案29也可以包含複數個圖形。舉例而言,每個遮光圖案29可包含設置在中央的第一圓形以及沿著第一圓形的外緣排列的複數個第二圓形,其中第二圓形的直徑小於第一圓形的直徑。舉例而言,每個遮光圖案29也可以是包含設置在中央的一個圓形以及沿著中央的圓形的外緣設置的波浪圖形。It should be noted that each light-shielding
在本揭示的背光模組20中,以帶有擴散粒子35的第二膠層30來取代習知的背光模組中的擴散板,並在第二膠層30的頂面(即第一表面31)上設置遮光圖案29。藉由上述配置,可以解決第一種習知的背光模組10使用擴散板17所衍生出的組裝困難問題以及可靠度不佳的問題。In the
另外,背光模組20在發光亮度上也可以兼顧。具體而言,因遮光圖案29與發光二極體晶片13之間還間隔了第二膠層30,不會如同第二種習知的背光模組10A因混光距離不足而造成背光亮度下降。另一方面,因第二膠層30與發光二極體晶片13之間還間隔了透明膠層50,故第二膠層30中的擴散粒子35不會貼近發光二極體晶片13的出光面而造成發光二極體晶片13發出的光直接的損失。In addition, the
此外,採用上述結構配置也有利於背光模組20的薄型化,讓背光模組20可以應用在筆記型電腦的顯示器(但不以此為限)。In addition, adopting the above structural configuration is also conducive to the thinning of the
如第3圖與第4圖所示,於一些實施方式中,透明膠層50具有頂面53 (即透明膠層50遠離電路板11的表面)以及環繞連接頂面53的側面56,第二膠層30覆蓋透明膠層50的頂面53,並與透明膠層50的側面56分離(換言之,第二膠層30不覆蓋透明膠層50的側面56)。於一些實施方式中,第二膠層30具有側面33,側面33連接在第一表面31與第二表面32之間,並與透明膠層50的側面56齊平。As shown in Figures 3 and 4, in some embodiments, the transparent
如第3圖與第4圖所示,於一些實施方式中,在第一方向D1上,第二膠層30的厚度H1大於透明膠層50的厚度H2,如此一來,發光二極體晶片13發出的光通過第二膠層30後可以擴散得更均勻,使背光模組20具有更佳的發光均勻度。As shown in Figures 3 and 4, in some embodiments, in the first direction D1, the thickness H1 of the second
於一些實施方式中,透明膠層50也可以包含少量的擴散粒子(例如:透明膠層50中擴散粒子的濃度小於第二膠層30中擴散粒子35的濃度,其中濃度例如是單位體積中的擴散粒子的數目),以利光均勻化,並維持背光模組20發光亮度。In some embodiments, the transparent
請參照第5圖,其為繪示依據本揭示另一實施方式之背光模組20A的剖面示意圖。本實施方式與第4圖所示的實施方式的差異處,在於本實施方式的遮光圖案29A具有厚度變化。如第5圖所示,遮光圖案29在第一位置上具有第一厚度H3,且在第二位置上具有第二厚度H4。第一位置位於遮光圖案29的中心,第二位置遠離遮光圖案29的中心,且第一厚度H3大於第二厚度H4。Please refer to FIG. 5 , which is a schematic cross-sectional view of a
換言之,遮光圖案29在靠近中心處厚度較大,而在遠離中心、靠近邊緣處厚度較小。因此,遮光圖案29在靠近中心處(對應發光二極體晶片13亮度較高的位置)具有較佳的遮光效果,而在靠近邊緣處(對應發光二極體晶片13亮度較低的位置)則可以讓較高比率的光穿透,藉此促進背光模組20A發光亮度的均勻化。於一些實施方式中,遮光圖案29的厚度隨著位置遠離遮光圖案29的中心而遞減。於一些實施方式中,遮光圖案29具有圓弧形表面。In other words, the thickness of the
請參照第6圖,其為繪示依據本揭示另一實施方式之背光模組20B的剖面示意圖。有別於前述實施方式,在本實施方式中,第二膠層30B覆蓋透明膠層50B的頂面53以及部份的側面56B。於一些實施方式中,透明膠層50的側面56B具有圓弧部分57,第二膠層30B部分位於圓弧部分57之上,並覆蓋圓弧部分57。於一些實施方式中,第二膠層30B的側面33B也具有圓弧部分34。Please refer to FIG. 6, which is a cross-sectional schematic diagram of a
於一些實施方式中,背光模組20B的製造方法包含:使用一框體圍繞電路板11上的發光二極體晶片13;接著,將液態封裝膠注入框體中,使其覆蓋發光二極體晶片13,再使液態封裝膠固化以形成透明膠層50B,其中透明膠層50B的側面56B形成圓弧部分57;接著,將帶有擴散粒子35的液態封裝膠注入框體中,再使帶有擴散粒子35的液態封裝膠固化以形成位在透明膠層50B之上的第二膠層30B;接著,在第二膠層30B的第一表面31上形成與發光二極體晶片13對齊的複數個遮光圖案29 (例如:透過油墨印刷的方式來形成遮光圖案29)。In some embodiments, the manufacturing method of the
於一些實施方式中,背光模組的製造方法進一步包含:切除透明膠層50B的邊緣部分(鄰近側面56B的部分,包含圓弧部分57)以及第二膠層30B的邊緣部分(鄰近側面33B的部分,包含圓弧部分34),使得第二膠層的側面與透明膠層的側面齊平(例如:形成第4圖所示的背光模組20)。進行上述切除的步驟可以縮減背光模組的寬度,但不會有光學上的影響,因切除的部分原本即落在可視區外。In some embodiments, the manufacturing method of the backlight module further includes: cutting off the edge portion of the transparent
綜上所述,在本揭示的背光模組中,以帶有擴散粒子的第二膠層來取代習知的背光模組中的擴散板,並在第二膠層的頂面上設置遮光圖案。藉由上述配置,可以解決習知的背光模組使用擴散板所衍生出的組裝困難問題以及可靠度不佳的問題,也可以兼顧背光模組的發光亮度。In summary, in the backlight module disclosed in the present invention, the diffusion plate in the conventional backlight module is replaced by a second adhesive layer with diffusion particles, and a light shielding pattern is provided on the top surface of the second adhesive layer. With the above configuration, the assembly difficulty and poor reliability problems derived from the conventional backlight module using the diffusion plate can be solved, and the luminous brightness of the backlight module can also be taken into consideration.
儘管本揭示已以實施方式揭露如上,然其並非用以限定本揭示,任何熟習此技藝者,於不脫離本揭示之精神及範圍內,當可作各種之更動與潤飾,因此本揭示之保護範圍當視後附之申請專利範圍所界定者為準。Although the disclosure has been disclosed in the above embodiments, it is not intended to limit the disclosure. Anyone skilled in the art can make various modifications and modifications without departing from the spirit and scope of the disclosure. Therefore, the protection of the disclosure is The scope shall be determined by the appended patent application scope.
10,10A,20,20A,20B:背光模組
11:電路板
13:發光二極體晶片
15,50:透明膠層
17:擴散板
19,29,29A:遮光圖案
30:第二膠層
31:第一表面
32:第二表面
33,33B,56,56B:側面
34,57:圓弧部分
35:擴散粒子
53:頂面
60:殼體
70:黏膠層
D1:第一方向
D2:第二方向
H1,H2,H3,H4:厚度
10,10A,20,20A,20B: backlight module
11:Circuit board
13: Light emitting
為使本揭示之上述及其他目的、特徵、優點與實施方式能更明顯易懂,所附圖式之說明如下: 第1圖以及第2圖繪示兩種習知的背光模組的剖面示意圖。 第3圖為繪示依據本揭示一實施方式之背光模組的俯視透視圖。 第4圖為繪示第3圖所示之背光模組沿線段3-3’的剖面示意圖。 第5圖為繪示依據本揭示另一實施方式之背光模組的剖面示意圖。 第6圖為繪示依據本揭示另一實施方式之背光模組的剖面示意圖。 In order to make the above and other purposes, features, advantages and implementation methods of the present disclosure more clearly understandable, the attached drawings are described as follows: Figure 1 and Figure 2 are schematic cross-sectional views of two known backlight modules. Figure 3 is a top perspective view of a backlight module according to an implementation method of the present disclosure. Figure 4 is a schematic cross-sectional view of the backlight module shown in Figure 3 along line segment 3-3'. Figure 5 is a schematic cross-sectional view of a backlight module according to another implementation method of the present disclosure. Figure 6 is a schematic cross-sectional view of a backlight module according to another implementation method of the present disclosure.
國內寄存資訊(請依寄存機構、日期、號碼順序註記) 無 國外寄存資訊(請依寄存國家、機構、日期、號碼順序註記) 無 Domestic storage information (please note in order of storage institution, date and number) without Overseas storage information (please note in order of storage country, institution, date, and number) without
11:電路板 11: Circuit board
13:發光二極體晶片 13: Light emitting diode chip
20:背光模組 20: Backlight module
29:遮光圖案 29: Blackout pattern
30:第二膠層 30: Second adhesive layer
31:第一表面 31: First surface
32:第二表面 32: Second surface
33,56:側面 33,56:Side
35:擴散粒子 35: Diffusion particles
50:透明膠層 50: Transparent adhesive layer
53:頂面 53:Top surface
60:殼體 60: Shell
70:黏膠層 70: Adhesive layer
D1:第一方向 D1: First direction
D2:第二方向 D2: Second direction
H1,H2:厚度 H1, H2: Thickness
Claims (10)
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CN202210990497.0A CN115295542A (en) | 2022-08-18 | 2022-08-18 | Backlight module and manufacturing method thereof |
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