TW202409420A - Fluid routing for a vacuum pumping system - Google Patents

Abstract

A fluid routing module (104) for a vacuum pumping system (100), the fluid routing module (104) comprising: a first fluid inlet (110a); a first fluid outlet (114a); a first fluid line (200) coupled between the first fluid inlet (110a) and the fluid outlet (114a); and a restrictor module (212) disposed along the first fluid line (200) between the first fluid inlet (110a) and the first fluid outlet (114a), the restrictor module (212) being configured to variably restrict a flow of fluid between the first fluid inlet (110a) and the first fluid outlet (114a).

Description

Used for fluid routing and transportation in vacuum pumping systems

The present invention relates to fluid routing for use with vacuum pumping systems, including, but not limited to, vacuum systems for pumping fluids from semiconductor processing tools.

Semiconductor manufacturing plants manufacture integrated circuit chips. In the fabrication of these devices, wafers are processed through several different processing stations, including stations where the wafers undergo, for example, chemical vapor deposition, physical vapor deposition, implantation, etching, and lithography processes. Many of these procedures involve the use of a gas environment and often require the use of high vacuum and reduced gas pressure.

A vacuum pump is used to provide this reduced gas pressure in the processing chamber, provide chamber evacuation and maintain the flow of process gases.

When the pressure inside a chamber of a semiconductor processing tool is not at the operating vacuum, for example, after a processing chamber has been evacuated to atmospheric pressure for servicing or maintenance, a so-called "pump-down event" is performed to establish a desired reduced gas pressure in the chamber. A pump-down event involves pumping gas from the chamber in order to reduce the pressure in the chamber to a desired level.

Similarly, when the pressure inside a pumping chamber of a vacuum pump (eg, a turbopump) is at atmospheric pressure, for example, after activation of the vacuum pump has been deactivated for service or maintenance, a pumping depressurization event is performed to A reduced gas pressure is established in the pumping chamber of the vacuum pump.

Vacuum and abatement systems can be used to simultaneously pump gases from multiple processing chambers of a semiconductor processing tool through a common manifold using a common pump. The inventors have appreciated that in such systems, since multiple chambers and/or multiple turbopumps may be fluidly connected to a common manifold, performing operations on one of the chambers and/or turbopumps A pumping depressurization event can affect conditions within others within those chambers. For example, performing a pumping depressurization event on one chamber can cause undesirable fluctuations in height in other chambers connected to the same manifold.

Aspects of the present invention provide a valve module for controlling fluid from chambers of a semiconductor processing tool in a manner that reduces or eliminates such deficiencies.

In a first aspect, a fluid routing and delivery module for a vacuum pumping system is provided. The fluid routing and delivery module includes: a first fluid inlet; a first fluid outlet; a first fluid pipeline coupled between the first fluid inlet and the fluid outlet; and a flow restrictor module, Disposed along the first fluid line between the first fluid inlet and the first fluid outlet, the flow restrictor module is configured to variably restrict the connection between the first fluid inlet and the first fluid outlet. One of the fluids flowing between them.

The restrictor module may include a plurality of restrictors disposed along the first fluid line between the first fluid inlet and the fluid outlet, the plurality of restrictors being arranged in parallel with each other, each of the plurality of restrictors being configured to restrict the flow of one of the fluids passing therethrough. The fluid selector delivery module may further include a component configured to selectively direct a fluid flow through a selected one or more restrictors of the plurality of restrictors while preventing the fluid from flowing through other restrictors of the plurality of restrictors. The component configured to selectively direct a fluid flow through a selected one or more restrictors may include a plurality of valves, each of the plurality of valves being arranged in series with a respective one of the plurality of restrictors. The fluid calibrating delivery module may further include: a bypass line, which is arranged in parallel with the flow restrictor module, thereby allowing a fluid flow to bypass the plurality of flow restrictors; and one or more further valves, which are configured to selectively direct a fluid flow through the bypass line or the plurality of flow restrictors. The fluid calibrating delivery module may further include a valve controller configured to control the operation of a valve. Each of the plurality of flow restrictors may be configured to restrict a flow of a fluid passing therethrough to a different degree. Each of the plurality of flow restrictors may include a flow restricting orifice having a different respective diameter.

The fluid routing module may further include a vacuum pump positioned along the first fluid line between the first fluid inlet and the flow restrictor module. The vacuum pump may be a turbine pump.

The fluid calibrating and delivery module may further include: a second fluid inlet; a second fluid outlet; a second fluid pipeline coupled between the second fluid inlet and the fluid outlet; and one or more valves disposed along the second fluid pipeline.

In a further aspect, a system is provided that includes: a semiconductor processing tool including a processing chamber; a fluid routing module of any of the preceding aspects, wherein a first fluid inlet is fluidly coupled to the processing chamber chamber; and a vacuum pump operably coupled to the first fluid outlet.

The semiconductor processing tool may further include one or more further processing chambers. The system may further include one or more further fluid routing and delivery modules, each further fluid routing and delivery module being a fluid routing and delivery module according to any of the foregoing aspects, wherein each further fluid routing and delivery module is The first fluid inlets are fluidly coupled to a respective further processing chamber. The system may further include a fluid line manifold, wherein the first fluid outlets of each of the fluid routing module and the further fluid routing modules are fluidly coupled to the fluid line manifold. The vacuum pump is operably coupled to the fluid line manifold.

A second fluid inlet may be fluidly coupled to the processing chamber. The system may further include a further vacuum pump operatively coupled to the second fluid outlet.

In a further aspect, a method for routing a fluid through a fluid routing module is provided. The fluid routing and delivery module can be based on any of the aforementioned aspects. The method includes: receiving a flow of fluid at a first fluid inlet; variably restricting the fluid passing through the flow restrictor module by a flow restrictor module; and thereafter, flowing the fluid from the first fluid outlet .

The fluid routing module may further include: a vacuum pump disposed along the first fluid line between the first fluid inlet and the flow restrictor module; a bypass line configured to allow one of the fluid flow to a flow restriction portion of the flow restrictor module; and a member configured to selectively direct a fluid flow through the bypass line. The method may further include, in response to satisfying one or more conditions, controlling further components to cause the fluid to flow through the bypass line, thereby bypassing the flow restricting portion of the flow restrictor module. The one or more conditions may include a condition in which a pressure in a pumping chamber of the vacuum pump is below a threshold pressure.

In any of the above aspects, there may be multiple fluid routing and delivery modules, that is, there may be multiple first fluid inlets, multiple first fluid pipelines, and multiple first fluid outlets. Additionally, a fluid line manifold may be present. The plurality of first fluid outlets of the plurality of fluid routing modules may be fluidly coupled to the fluid line manifold.

FIG. 1 is a schematic illustration (not to scale) of a semiconductor fabrication facility 100 according to an embodiment.

The semiconductor manufacturing facility 100 includes a semiconductor processing tool 102 , a fluid routing delivery module 104 , a first vacuum pump 106 , and a second vacuum pump 107 .

The semiconductor processing tool 102 includes a plurality of processing chambers 108 in which semiconductor wafers undergo various processes. Examples of such processes include, but are not limited to, chemical vapor deposition, physical vapor deposition, implantation, etching, and lithography processes.

The first vacuum pump 106 is configured to pump fluid (ie, process gas) out of the processing chamber 108 of the semiconductor processing tool 102 via the fluid routing module 104 .

The second vacuum pump 107 is configured to pump fluid (ie, process gas) out of the processing chamber 108 of the semiconductor processing tool 102 through the fluid routing delivery module 104.

The fluid selection and delivery module 104 includes a plurality of fluid inlets (specifically, a plurality of first fluid inlets 110a and a plurality of second fluid inlets 110b), a plurality of pumping modules 112, a plurality of fluid outlets (specifically, a plurality of first fluid outlets 114a and a plurality of second fluid outlets 114b), a first fluid pipeline manifold 116, and a second fluid pipeline manifold 122.

A respective pair of first and second fluid inlets 110a, 110b are fluidly connected between a respective processing chamber 108 and a respective pumping module 112, such that fluid can flow from the processing chamber 108 to the pumping module 112 through either or both of the first and second fluid inlets 110a, 110b.

The pumping module 112 will be described in more detail later below with reference to FIG. 2 .

Each pumping module 112 is fluidly connected to the first fluid line manifold 116 via a respective first fluid outlet 114a, so that fluid can flow from the pumping module 112 to the first fluid line manifold 116. Each pumping module 112 is fluidly connected to the second fluid line manifold 122 via a respective second fluid outlet 114b, so that fluid can flow from the pumping module 112 to the second fluid line manifold 122.

The first fluid line manifold 116 fluidly connects the plurality of first fluid outlets 114a to the first vacuum pump 106.

The second fluid line manifold 122 is fluidly connected between the plurality of second fluid outlets 114 b and the second vacuum pump 107 .

The fluid routing module 104 further includes a valve controller 118 .

The valve controller 118 is operably coupled to each of the plurality of valves included in the pumping module 112 via respective pneumatic lines and/or electrical connections (not shown). These valves will be described in more detail later below with reference to FIG. 2. As described in more detail later below with reference to FIG. 4, the valve controller 118 is configured to control the operation of the valves of the pumping module 112, for example, by delivering pneumatic fluid thereto via pneumatic lines.

2 is a schematic illustration (not to scale) showing further details of a pumping module 112. In this embodiment, the pumping modules 112 of the fluid selection and delivery module 104 are substantially identical to each other.

In this embodiment, the first fluid inlet 110 a and the second fluid inlet 110 b are fluid inlets of the pumping module 112 . In addition, the first fluid outlet 114a and the second fluid outlet 114b are fluid outlets of the pumping module 112.

The pumping module 112 includes a first fluid line 200 coupled between the first fluid inlet 110a and the first fluid outlet 114a, and a second fluid line 202 coupled between the second fluid inlet 110b and the second fluid outlet 114b.

The pumping module 112 includes an automatic pressure control (APC) module 208, a turbo pump 210, a flow restrictor module 212, a pressure sensor 214, and a valve 216.

The APC module 208 , turbo pump 210 , flow restrictor module 212 and pressure sensor 214 are positioned along the first fluid line 200 . The APC module 208 is disposed between the first fluid inlet 110 a and the turbo pump 210 . The turbo pump 210 is disposed between the APC module 208 and the flow restrictor module 212 . The flow restrictor module 212 is disposed between the turbo pump 201 and the pressure sensor 214 . The pressure sensor 214 is disposed between the flow restrictor module 212 and the first fluid outlet 114a.

A valve 216 , which may be considered a chamber roughing valve, is disposed along the second fluid line 202 and between the second fluid inlet 110 b and the second fluid outlet 114 b .

The APC module 208 is configured to control a flow of a fluid therethrough. The APC module 208 may include a movable valve having a controller. The movable valve of the APC module 208 may include a movable pendulum that may be controlled by the controller of the APC module 208 to increase or decrease the size of an orifice in the chamber exhaust path. The APC module 208 may receive a pressure set point and an actual pressure reading of the pressure inside the processing chamber 108. The controller of the APC module 208 may then control the pendulum according to a control algorithm until the actual pressure measurement matches the set point. In some embodiments, the valve of the APC module 208 may be controlled by the valve controller 118.

Turbopump 210 is coupled to a respective process chamber 108 via first fluid inlet 110a. Turbopump 210 is configured to pump exhaust gas from processing chamber 108 through first fluid line 200 and out of first fluid outlet 114a.

Current limiter module 212 is described in greater detail later below with reference to FIG. 3 .

Pressure sensor 214 is configured to measure a pressure of fluid in first fluid line 200 flowing out of flow restrictor module 212 . Pressure sensor 214 is operably coupled to valve controller 118 such that pressure measurements obtained by pressure sensor 214 are received by valve controller 118 .

The valve 216 is configured to control the flow of a fluid therethrough. Specifically, in this embodiment, the valve 216 is configured to be controlled by the valve controller 118 to selectively allow or prevent the flow of a fluid therethrough.

Figure 3 is a schematic illustration (not to scale) showing further details of a current limiter module 212. In this embodiment, the flow restrictor modules 212 of the pumping module 112 are substantially identical to each other.

The current limiter module 212 includes a plurality of current limiters. Specifically, the current limiter module 212 includes a first current limiter 301, a second current limiter 302, a third current limiter 303, a fourth current limiter 304 and a fifth current limiter 305. . Flow restrictors 301 to 305 are positioned along the first fluid line 200 . The current limiters 301 to 305 are arranged in parallel with each other.

Each flow restrictor 301 to 305 is configured to restrict a flow of a fluid passing therethrough. Specifically, in this embodiment, each flow restrictor 301 to 305 includes a flow restriction orifice.

In this embodiment, each flow restrictor 301-305 is configured to restrict a flow of a fluid therethrough to a different degree. Each flow restrictor 301-305 includes a flow restricting orifice having a different respective diameter. That is, the diameters of the flow restricting orifices of the flow restrictors 301-305 are of different sizes from one another. The diameters of the flow restricting orifices of the flow restrictors 301-305 can be any suitable size, for example, a size selected from the group consisting of: 0.5 mm, 0.6 mm, 0.75 mm, 1 mm, and 2 mm. In this embodiment, the first restrictor 301 has a diameter of 0.5 mm, the second restrictor 302 has a diameter of 0.6 mm, the third restrictor 303 has a diameter of 0.75 mm, the fourth restrictor 304 has a diameter of 1 mm and the fifth restrictor 305 has a diameter of 2 mm.

The flow restrictor module 212 further includes components configured to selectively direct a fluid flow through selected one or more of the flow restrictors 301 - 305 while preventing the fluid flow through others of the flow restrictors 301 - 305 . In this embodiment, the means for selectively directing fluid flow through a selected one or more of flow restrictors 301 - 305 includes a plurality of valves (hereinafter referred to as "restrictor valves"). Specifically, the flow limiter module 212 includes a first flow limiter valve 311, a second flow limiter valve 312, a third flow limiter valve 313, a fourth flow limiter valve 314 and a fifth flow limiter valve 314. Restrictor valve 315. Each restrictor valve 311-315 is fluidly coupled in series with a respective restrictor 301-305. Specifically, the first flow limiter valve 311 is connected in series with the first flow limiter 301, the second flow limiter valve 312 is connected in series with the second flow limiter 302, and the third flow limiter valve 313 is connected with the third flow limiter in series. The fourth flow limiter valve 314 is connected in series with the fourth flow limiter 304 and the fifth flow limiter valve 315 is connected with the fifth flow limiter 305 in series. The series connected pairs of flow restrictors and flow restrictor valves are connected in parallel to each other.

Each restrictor valve 311-315 is configured to control the flow of one of the fluids therethrough. Specifically, in this embodiment, each restrictor valve 311-315 is configured to be controlled by the valve controller 118 to selectively allow or prevent one of the fluids from flowing therethrough. Thus, each restrictor valve 311-315 is capable of selectively allowing or preventing the flow of fluid through the respective restrictor 301-305 coupled in series thereto.

In this embodiment, the flow restrictor module 212 further includes a bypass line 320 . The bypass line 320 is arranged in parallel with a plurality of flow restrictors 301 to 305 (and flow restrictor valves 311 to 315). Bypass line 320 is configured to allow flow of one of the fluids to bypass the plurality of flow restrictors 301 - 305 . The bypass line 320 allows one of the fluids to flow around the plurality of flow restrictors 301 - 305 and flow relatively unrestricted between the turbopump 210 and the first fluid outlet 114a.

In this embodiment, the flow restrictor module 212 further includes a valve (hereinafter referred to as a "bypass valve 322"). A bypass valve 322 is positioned along bypass line 320 . Bypass valve 322 is configured to control the flow of one of the fluids therethrough. Specifically, in this embodiment, bypass valve 322 is configured to be controlled by valve controller 118 to selectively allow or prevent one of the fluids from flowing therethrough. Thus, bypass line 322 can selectively allow or prevent fluid flow through bypass line 320 .

The flow restrictor module 212 may be oriented vertically, ie, such that process fluid flows through the flow restrictor in a vertical downward direction. This orientation and configuration of the flow restrictor module 212 tends to prevent clogging of the flow restrictors 301 - 305 , for example, by liquid that would flow out of the flow restrictors 301 - 305 under gravity.

The apparatus including the valve controller 118 for implementing the above configuration and executing the method steps to be described below may be provided by configuring or adapting any suitable apparatus (e.g., one or more computers or other processing apparatus or processors) and/or providing additional modules. The apparatus may include a computer, a network of computers, or one or more processors for implementing instructions and using data including instructions and data in the form of a computer program or multiple computer programs stored in or on a machine-readable storage medium (such as computer memory, a computer disk, ROM, PROM, etc., or any combination of these or other storage media).

The system described above may undergo a pump-down event to pump gas from one or more of the processing chambers 108, which may be at atmospheric pressure, to reduce the pressure therein to a level suitable for semiconductor processing. The pump-down event may be performed to pump gas from a pumping chamber of a turbo pump of one or more of the pumping modules.

A procedure for pumping gas in a semiconductor manufacturing facility 100, including a pumping depressurization event, will now be described with reference to FIGS. 4-6.

It should be noted that certain process steps depicted in the flow charts of Figures 4 and 5 and described below may be omitted or may be performed in a sequence different from the sequence presented below and shown in Figures 4 and 5. In addition, although all process steps have been depicted as discrete time sequential steps for convenience and ease of understanding, some process steps may actually be performed simultaneously or at least overlapped in time to a certain extent.

4 is a process flow diagram illustrating certain steps of a process 400 for pumping gas in a semiconductor manufacturing facility 100, including a pumping depressurization event.

In step s402, a semiconductor process is performed in the processing chamber 108. These semiconductor processes generate process gases.

In this embodiment, at this stage, for each of the pumping modules 112, valve 216 is closed, restrictor valves 311 to 315 are closed, and bypass valve 322 is open. Therefore, at step s402 , the first vacuum pump 106 pumps the process gas out of the processing chamber 108 through the relatively unrestricted first fluid line 200 of the pumping module 112 and into the first fluid line manifold 116 .

At step s404, one of the processing chambers 108 (hereinafter referred to as the "first processing chamber 108" for convenience) is closed for inspection, service, repair, or maintenance. In this embodiment, closing the first processing chamber 108 includes ceasing pumping of gas from the first processing chamber 108 . In this embodiment, this is accomplished by closing the bypass valve 322 of the pumping module 112 associated with the first processing chamber 108 . The turbopump 210 of the pumping module 112 associated with the first processing chamber 108 is also turned off. In this embodiment, closing the first processing chamber 108 further includes increasing the pressure in the first processing chamber 108 to approximately atmospheric pressure. This can be accomplished by opening a valve coupled to the first processing chamber 108 to allow air to enter the first processing chamber 108 . Additionally, in this embodiment, the pressure in the pumping chamber of the turbopump 210 of the pumping module 112 associated with the first processing chamber 108 is also increased to approximately atmospheric pressure.

In step s406, a human operator performs an inspection, service, repair or maintenance operation on the first processing chamber 108. Alternatively or additionally, inspection, servicing, repair, or maintenance may be performed on one or more components of the pumping module 112 associated with the first processing chamber 108 .

After the inspection, maintenance, repair or maintenance operation, a low pressure environment is re-established in the first processing chamber 108 so that semiconductor processes can be performed therein.

Therefore, at step s408, the valve 216 of the pumping module 112 associated with the first processing chamber 108 is opened by the valve controller 118.

At step s410 , the second vacuum pump 107 pumps gas from the first processing chamber 108 into the second fluid line manifold 122 along the second fluid line 202 with the valve 216 open.

Therefore, "pumping and depressurizing" the first processing chamber 108 is performed. This gas flow from the first processing chamber 108 is independent of the gas flow through the first fluid line manifold 116 . Advantageously, this separation of gas flows tends to reduce or eliminate pumping depressurization of the first processing chamber 108 that adversely affects conditions within the parallel processing chamber 108 .

At step s412 , in response to completing the pumping depressurization of the first processing chamber 108 , the valve controller 118 closes the valve 216 of the pumping module 112 associated with the first processing chamber 108 .

Completion of pumping depressurization of first processing chamber 108 may be detected by any suitable means. For example, in response to a measured value of the pressure within the first processing chamber 108 being at or below a first threshold and/or a calculated decrease in the measured pressure associated with the first processing chamber 108 When the rate is at or below a second threshold, the valve controller 118 may determine that pumping depressurization of the first processing chamber 108 is complete. The first threshold can be any suitable threshold. The second threshold can be any suitable threshold.

In step s414, in response to completion of the pumping depressurization of the first processing chamber 108, the valve controller 118 controls the flow restrictor valves 311 to 315 to open in a predefined sequence. Therefore, in step s414, the restrictor valves 311 to 315 are opened and closed in a predefined pattern.

In some embodiments, at step s414, the valve controller 118 may also control the APC module to prevent or block one of the fluids from flowing therethrough.

FIG. 5 is a process flow chart showing certain steps of a process 500 for operating the restrictor valves 311 to 315 that may be performed at step s414. FIG. 6 is a schematic illustration (not to scale) of the operation of the restrictor valves 311 to 315. The remaining steps of FIG. 4 will be described in more detail later below, following the description of FIG. 5 and FIG. 6.

In step s502, the first flow restrictor valve 311 is opened. In step s502, the remaining flow restrictor valves 312 to 315 and the bypass valve 322 are closed. With the first restrictor valve 311 open, the fluid flow is directed through the first restrictor 301, which in this embodiment has a minimum diameter of 0.5 mm. Fluid does not flow through other flow restrictors 302 to 305 or bypass line 320 . Therefore, in step s502, the first vacuum pump 106 pumps gas from the pumping chamber of the turbine pump 210 into the first fluid line manifold 116 along the first fluid line 200 via the first flow restrictor 301.

At step s504, the first restrictor valve 311 is closed and the second restrictor valve 312 is opened. At step s504, the first and third to fifth restrictor valves 311, 313 to 315 and the bypass valve 322 are closed. With the second restrictor valve 312 opened, the fluid flow is directed through the second restrictor 302, which in this embodiment has a larger diameter than the first restrictor 301, which is 0.6 mm. The fluid does not flow through the other restrictors 301, 303 to 305 or the bypass line 320. Therefore, in step s504, the first vacuum pump 106 pumps the gas from the pumping chamber of the turbo pump 210 along the first fluid line 200 into the first fluid line manifold 116 via the second restrictor 302.

At step s506, the second restrictor valve 312 is closed and the third restrictor valve 313 is opened. At step s506, the first, second, fourth and fifth restrictor valves 311, 312, 314, 315 and the bypass valve 322 are closed. With the third restrictor valve 313 open, the fluid flow is directed through the third restrictor 303, which in this embodiment has a larger diameter than the second restrictor 302, which is 0.75 mm. The fluid does not flow through the other restrictors 301, 303, 304, 305 or the bypass line 320. Therefore, in step s506, the first vacuum pump 106 pumps the gas from the pumping chamber of the turbo pump 210 along the first fluid line 200 into the first fluid line manifold 116 via the third restrictor 303.

At step s508, the third restrictor valve 313 is closed and the fourth restrictor valve 314 is opened. At step s508, the first to third and fifth restrictor valves 311 to 313, 315 and the bypass valve 322 are closed. With the fourth restrictor valve 314 opened, the fluid flow is directed through the fourth restrictor 304, which in this embodiment has a larger diameter than the third restrictor 303, which is 1 mm. The fluid does not flow through the other restrictors 301 to 303, 305 or the bypass line 320. Therefore, in step s508, the first vacuum pump 106 pumps the gas from the pumping chamber of the turbo pump 210 along the first fluid line 200 into the first fluid line manifold 116 via the fourth restrictor 304.

At step s510, the fourth flow restrictor valve 314 is closed and the fifth flow restrictor valve 315 is opened. In step s510, the first to fourth flow restrictor valves 311 to 314 and the bypass valve 322 are closed. With the fifth restrictor valve 315 open, fluid flow is directed through the fifth restrictor 305, which in this embodiment has a diameter larger than the fourth restrictor 304, The diameter is 2 mm. Fluid does not flow through other flow restrictors 301 to 304 or bypass line 320. Therefore, at step s510 , the first vacuum pump 106 pumps gas from the pumping chamber of the turbine pump 210 into the first fluid line manifold 116 along the first fluid line 200 via the fifth flow restrictor 305 .

FIG. 6 is a schematic illustration (not to scale) showing a diagram 600 associated with the process of FIG. 5 .

The x-axis 602 of the graph 600 indicates time in seconds (s).

The main y-axis 604 of graph 600 indicates pressure in millibars (ie, the pressure in the turbopump).

Secondary y-axis 605 of graph 600 indicates airflow in standard liters per minute (slm).

Graph 600 includes two plotted lines, namely, a first line 606 and a second line 608. The first line 606 is a solid line. The second line 608 is a dotted line. The first line 606 shows a chamber pressure within the pumping chamber of the turbopump 210 . The second line 608 shows a pressure within a foreline of the pumping system (ie, within the first fluid inlet 110a).

The x-axis 602 of the graph 600 is divided or partitioned into five time intervals, namely, a first time interval 611 , a second time interval 612 , a third time interval 613 , a fourth time interval 614 , and a fifth time interval 615 .

In this embodiment, the duration of each time interval is approximately 190 seconds. However, in other embodiments, one or more of the time intervals may be of a different respective duration other than 190 seconds.

The first time interval 611 corresponds to step s502. Therefore, during the first time interval 611, the first restrictor valve 311 is open and the other restrictor valves 312 to 315 and the bypass valve 322 are closed. Therefore, fluid flows from the pumping chamber of the turbine pump 210 through the first flow restrictor 301 .

At the end of the first time interval 611, the second time interval 612 begins. Furthermore, when the first time interval 611 ends/the second time interval 612 starts, the first flow restrictor valve 311 is closed and the second flow restrictor valve 312 is opened.

The second time interval 612 corresponds to step s504. Therefore, during the second time interval 612, the second flow restrictor valve 312 is open and the other flow restrictor valves 311, 313 to 315 and the bypass valve 322 are closed. Therefore, fluid flows from the pumping chamber of the turbine pump 210 through the second flow restrictor 302 .

At the end of the second time interval 612, the third time interval 613 begins. Furthermore, when the second time interval 612 ends/the third time interval 613 starts, the second flow restrictor valve 312 is closed and the third flow limiter valve 313 is opened.

The third time interval 613 corresponds to step s506. Therefore, during the third time interval 613, the third restrictor valve 313 is opened and the other restrictor valves 311, 312, 314, 315 and the bypass valve 322 are closed. Therefore, the fluid flows from the pumping chamber of the turbo pump 210 through the third restrictor 303.

At the end of the third time interval 613, the fourth time interval 614 begins. In addition, when the third time interval 613 ends/the fourth time interval 614 starts, the third flow restrictor valve 313 is closed and the fourth flow limiter valve 314 is opened.

The fourth time interval 614 corresponds to step s508. Therefore, during the fourth time interval 614, the fourth restrictor valve 314 is opened and the other restrictor valves 311 to 313, 315 and the bypass valve 322 are closed. Therefore, the fluid flows from the pumping chamber of the turbo pump 210 through the fourth restrictor 304.

At the end of the fourth time interval 614, the fifth time interval 615 begins. Also, at the end of the fourth time interval 614/the beginning of the fifth time interval 615, the fourth flow restrictor valve 314 is closed and the fifth flow limiter valve 315 is open.

The fifth time interval 615 corresponds to step s510. Therefore, during the fifth time interval 615, the fifth restrictor valve 315 is opened and the other restrictor valves 311 to 314 and the bypass valve 322 are closed. Therefore, the fluid flows from the pumping chamber of the turbo pump 210 through the fifth restrictor 305.

At the end of the fifth time period 615, the fifth restrictor valve 315 is closed.

At the end of the fifth time period 615, the pressure in the pumping chamber of the turbo pump 210 tends to be less than or equal to a critical value, for example, 2 mbar, 3 mbar, 4 mbar, 5 mbar, 6 mbar, 7 mbar, 8 mbar, 9 mbar or 10 mbar.

Thus, the pumping chamber of the turbo pump 210 is "pumped down." This gas flow from the pumping chamber of the turbo pump 210 is sequentially restricted by the first through fifth restrictors 301 through 305. Advantageously, this flow restriction by the restrictors 301 through 305 tends to reduce or eliminate pumping down of the pumping chamber of the turbo pump 210 that adversely affects conditions within the parallel processing chamber 108. Additionally, sequentially pumping down the pumping chamber of the turbo pump 210 through restrictors of increasing sizes advantageously tends to provide for faster pumping down of the pumping chamber, for example, as compared to the case where a single restrictor of a fixed size is used.

In this embodiment, as shown in graph 600, the process flow through each chamber 108 is limited to 2 slm (maximum). This tends to prevent a single vacuum pump from being overloaded and failing to provide the necessary vacuum conditions to maintain proper function of all turbo pumps 210. The flow restrictor is sized to ensure that a turbo pumping depressurization from atmosphere never exceeds the chamber flow limit of 2 slm. The flow restrictor is preferably sized to reduce pressure as quickly as possible. In other embodiments, a different process flow maximum value other than 2 slm may be implemented.

At the end of the fifth time period 615, ie after step s510 of the process of FIG. 5, step s414 ends and the process of FIG. 4 continues to step s416.

Returning to the description of FIG. 4 , in step s416 , in response to the completion of the pumping depressurization of the pumping chamber of the turbo pump 210 , the valve controller 118 controls the fifth flow restrictor valve 315 to close and the bypass valve 322 to open. Therefore, the flow of fluid is directed through the bypass line 320 and does not pass through the flow restriction portions 301 to 305 of the flow restrictor module 212 .

In some embodiments, at step s416, the valve controller 118 may also control the APC module 208 to allow one of the fluids to flow therethrough.

The completion of pumping depressurization of the pumping chamber of turbopump 210 may be detected by any suitable means. For example, in response to a measured value of a pressure within the pumping chamber of turbine pump 210 being at or below a threshold pressure value and/or a measured pressure associated with the pumping chamber of pump 210 Once the calculated drop rate is at or below a threshold rate value, valve controller 118 may determine that pumping depressurization of the pumping chamber of turbopump 210 is complete. The threshold pressure value may be any suitable threshold value, for example, 2 mbar, 3 mbar, 4 mbar, 5 mbar, 6 mbar, 7 mbar, 8 mbar, 9 mbar or 10 mbar. The threshold rate value can be any suitable threshold value. Valve controller 118 may be based on quantities obtained by pressure sensor 214 and/or any other pressure sensor (eg, a pressure sensor configured to measure a pressure within a pumping chamber of turbopump 210 ). The measured value is used to determine that the pumping pressure reduction of the pumping chamber of the turbine pump 210 is completed.

In step s418, after controlling the bypass valve 322 to direct the flow of fluid through the bypass line 320, the semiconductor process may be performed in the first processing chamber 108. These semiconductor processes generate process gases.

At step s420, the first vacuum pump 106 pumps the gas out of the first processing chamber 108 through the relatively unrestricted first fluid line 200 of its associated pumping module 112 and to the first fluid line manifold. 116 in.

Thus, a process 400 for pumping gases in a semiconductor fabrication facility 100 is provided.

The systems and methods described above advantageously tend to reduce or eliminate pumping depressurization events that adversely affect conditions within parallel processing chambers. This tends to be accomplished by pumping the depressurized gas through a restrictor (ie, a restricted conduit or a reduced diameter orifice).

Advantageously, pumping down can be performed relatively quickly by sequentially pumping the pumping down gas through restrictors of increasing diameter.

Advantageously, pump down events and the end of pump down events tend to be automatically detected and mitigated.

Advantageously, the fluid routing delivery module described above may be integrated into a horizontal manifold line connecting a semiconductor processing tool to a vacuum pump.

Advantageously, the fluid routing modules described above tend to be robust. The vacuum module may be fully assembled, leak checked, and pre-tested (eg, off-site prior to delivery to a semiconductor manufacturing facility, or on-site upon delivery). This tends to simplify the installation procedure and reduce installation time.

Advantageously, the fluid routing and delivery modules described above tend to be modular and scalable.

Advantageously, components in the airstream of a fluid routing module tend to be easy to service, repair or replace.

Advantageously, the status and operating conditions of the system tend to be easily monitored, for example, via a human machine interface of a valve module or remotely.

Advantageously, each fluid routing module in a system tends to be easily controlled by a system controller, for example, using a communication protocol such as EtherCAT or Ethernet.

Advantageously, the fluid routing module described above allows for multiple mounting options. For example, a fluid routing module can be suspended from a ceiling in a semiconductor manufacturing facility, which provides the benefit of not consuming floor space. Alternatively, the fluid routing module may be mounted in a floor-standing stand or on top of other equipment.

In the above embodiments, the fluid routing module is implemented in a semiconductor manufacturing facility for routing pumped process gas. However, in other embodiments, the fluid routing module may be implemented in a different system and used to route a different type of fluid.

In the above embodiment, there is a single semiconductor processing tool that includes one of six processing chambers. However, in other embodiments, there is more than one semiconductor processing tool. One or more of the semiconductor processing tools may include a different number of processing chambers other than six.

In the above embodiment, there is a single fluid calibrating delivery module including six pumping modules. However, in other embodiments, there may be a different number of fluid calibrating delivery modules, i.e., a plurality of fluid calibrating delivery modules. In some embodiments, one or more of the fluid calibrating delivery modules may include a different number of pumping modules other than six.

In the above embodiment, a pumping module includes two inlets connected to two outlets. However, in other embodiments, one or more of the pumping modules includes a different number of inlets (other than two) and a different number of outlets (other than two). By way of example, a pumping module may include two inlets coupled to a single common outlet.

In the above embodiments, each pumping module includes a restrictor module having a plurality of restrictors disposed along a first fluid line between a first fluid inlet and a fluid outlet. The restrictors are arranged in parallel with each other. Thereby, the functionality described above is provided. However, in other embodiments, the restrictor module is configured to variably restrict a flow of a fluid between the first fluid inlet and the first fluid outlet in a different manner. For example, in some embodiments, the restrictor module includes one or more variable restrictors, i.e., one or more restrictors that can each be controlled so as to change the degree to which they restrict a flow of a fluid therethrough.

In the above embodiments, each of the plurality of flow restrictors is coupled in series to a respective flow restrictor valve. In addition, a bypass valve is arranged in parallel with the flow restrictor valve. However, in other embodiments, one or more of the flow restrictors and/or bypass valves may be replaced by valves of different configurations or configurations that provide the functionality described above. For example, in some embodiments, multiple valves (i.e., flow restrictor valves and/or bypass valves) may be replaced by a multi-way valve disposed at the junction of the corresponding fluid pipelines. This multi-way valve may be configured to direct fluid along a selected one or more of the corresponding fluid pipelines.

In the above embodiments, the pumping chamber of the turbo pump is pumped down through the restrictor module. However, in other embodiments, a different entity (e.g., a processing chamber) is pumped down through the restrictor module instead of or in addition to the pumping chamber of the turbo pump.

In the above embodiments, the pumping chamber of the turbo pump is pumped down using a monotonically increasing size restriction orifice. However, in other embodiments, the size of the restriction orifice does not increase monotonically, for example, the restriction orifice may decrease in size in response to meeting a certain criterion (such as an effect on a parallel processing chamber).

In the above embodiments, fluid flow switches between different restrictors in response to a time period (e.g., 190 s) elapsed. However, in other embodiments, fluid flow switches between different restrictors in response to a different criterion being met, for example, in response to a measured pressure within the pumping chamber or a rate of change (e.g., drop) in the measured pressure meeting a predetermined threshold. The switch to a larger restrictor size may be controlled by time and/or vacuum diagnostics of the turbo pump. An optimization process may be performed to manage maximum throughput and minimum pump down time.

In some embodiments, the APC module may be omitted or replaced by one or more valves.

100:Semiconductor manufacturing facilities 102:Semiconductor Processing Tools 104: Fluid diameter selection and transportation module 106:First vacuum pump 107: Second vacuum pump 108: Processing chamber 110a: First fluid inlet 110b: Second fluid inlet 112:Pumping module 114a: first fluid outlet 114b: Second fluid outlet 116: First fluid line manifold 118:Valve controller 122: Second fluid line manifold 200: First fluid line 202: Second fluid line 208:APC module 210: Turbo pump 212:Current limiter module 214: Pressure sensor 216:Valve 301: First current limiter 302: Second current limiter 303: The third current limiter 304: The fourth current limiter 305:Fifth current limiter 311: First flow limiter valve 312: Second flow restrictor valve 313:Third flow limiter valve 314: The fourth flow limiter valve 315:Fifth flow limiter valve 320:Bypass line 322:Bypass valve 400:Program s402 to s420: steps 500:Program s502 to s510: steps 600: Chart 602: x-axis 604: y-axis 605: Secondary y-axis 606:Frontline 608:Second line 611: First time interval 612: Second time interval 613: The third time interval 614: The fourth time interval 615: The fifth time interval

Figure 1 is a schematic illustration (not to scale) of a semiconductor manufacturing facility; Figure 2 is a schematic illustration (not to scale) showing further details of a pumping module of a semiconductor manufacturing facility; Figure 3 is a schematic illustration (not to scale) showing further details of a current limiter module of a semiconductor manufacturing facility; Figure 4 is a process flow diagram illustrating certain steps of a process for pumping gases in a semiconductor manufacturing facility; Figure 5 is a process flow diagram illustrating certain steps of a process for operating a flow restrictor valve; and Figure 6 is a schematic illustration (not to scale) of the operation of a flow restrictor valve.

110a: First fluid inlet

110b: Second fluid inlet

112: Pumping module

114a: First fluid outlet

114b: Second fluid outlet

200: First fluid pipeline

202: Second fluid pipeline

208:APC module

210: Turbine pump

212:Current limiter module

214: Pressure sensor

216:Valve

Claims (15)

A fluid calibrating and delivering module for a vacuum pumping system, the fluid calibrating and delivering module comprising: a first fluid inlet; a first fluid outlet; a first fluid pipeline coupled between the first fluid inlet and the fluid outlet; and a restrictor module disposed along the first fluid pipeline between the first fluid inlet and the first fluid outlet, the restrictor module being configured to variably restrict the flow of a fluid between the first fluid inlet and the first fluid outlet. A fluid selection and delivery module as claimed in claim 1, wherein: the restrictor module includes a plurality of restrictors arranged along the first fluid pipeline between the first fluid inlet and the fluid outlet, the plurality of restrictors are arranged in parallel with each other, and each of the plurality of restrictors is configured to restrict the flow of a fluid passing therethrough; and the fluid selection and delivery module further includes a component configured to selectively guide a fluid to flow through a selected one or more restrictors of the plurality of restrictors while preventing the fluid from flowing through other restrictors of the plurality of restrictors. A fluid selective delivery module as claimed in claim 2, wherein the component configured to selectively direct a fluid flow through one or more selected flow restrictors includes a plurality of valves, each of the plurality of valves being configured in series with a respective one of the plurality of flow restrictors. A fluid selection delivery module as in any one of claims 2 to 3, further comprising: a bypass line arranged in parallel with the restrictor module, thereby allowing a fluid flow to bypass the plurality of restrictors; and one or more further valves configured to selectively direct a fluid flow through the bypass line or the plurality of restrictors. A fluid calibrating delivery module as in claim 3 or 4, further comprising a valve controller configured to control the operation of a valve. A fluid calibrating delivery module as in any one of claims 2 to 5, wherein each of the plurality of restrictors is configured to restrict the flow of a fluid therethrough to a different degree. A fluid calibrating delivery module as claimed in claim 6, wherein each of the plurality of restrictors comprises a flow restricting orifice having a different respective diameter. The fluid routing and delivery module of any one of claims 1 to 7, further comprising a vacuum pump disposed along the first fluid pipeline between the first fluid inlet and the flow restrictor module. For example, in claim 8, the fluid routing and transport module is provided, wherein the vacuum pump is a turbine pump. The fluid selection and delivery module of any one of claims 1 to 9 further comprises: a second fluid inlet; a second fluid outlet; a second fluid pipeline coupled between the second fluid inlet and the fluid outlet; and one or more valves disposed along the second fluid pipeline. A system that includes: A semiconductor processing tool including a processing chamber; The fluid routing module of any one of claims 1 to 10, wherein the first fluid inlet is fluidly coupled to the processing chamber; and A vacuum pump operably coupled to the first fluid outlet. Such as the system of request item 11, wherein: The semiconductor processing tool further includes one or more further processing chambers; The system further includes one or more further fluid routing and delivery modules, each further fluid routing and delivery module is a fluid routing and delivery module according to any one of claims 1 to 10, wherein each further fluid routing and delivery module the first fluid inlets of the module are fluidly coupled to a respective further processing chamber; The system further includes a fluid line manifold, wherein the first fluid outlets of each of the fluid routing module and the further fluid routing modules are fluidly coupled to the fluid line manifold; and The vacuum pump is operably coupled to the fluid line manifold. Such as the system of request item 11 or 12, wherein: The fluid routing and delivery module is as in claim 10; and The second fluid inlet is fluidly coupled to the processing chamber; and The system further includes a further vacuum pump operatively coupled to the second fluid outlet. A method for selectively conveying a fluid through a fluid selective conveying module, the fluid selective conveying module being any one of claims 1 to 10, the method comprising: receiving a flow of a fluid at a first fluid inlet; variably restricting the fluid passing through the restrictor module by a restrictor module; and thereafter, the fluid flows out of a first fluid outlet. The method of claim 14, wherein: the fluid selection delivery module further comprises: a vacuum pump disposed along the first fluid line between the first fluid inlet and the restrictor module; a bypass line configured to allow a fluid to flow to a flow restriction portion of the restrictor module; and a component configured to selectively direct a fluid flow through the bypass line; the method further comprises, in response to one or more conditions being met, controlling a further component to cause the fluid to flow through the bypass line, thereby bypassing the flow restriction portion of the restrictor module; and the one or more conditions include a condition that a pressure in a pumping chamber of the vacuum pump is less than a critical pressure.