TW202407163A - Plating method and plating device capable of reliably reducing power supply variations during plating processing and improving uniformity of the thickness of the plating formed on the substrate - Google Patents

Abstract

The plating method of the present invention involves a plating method that performs a plating process on a substrate by using a plating device provided with a substrate holder. The substrate holder includes a contact member that can conductively contact the substrate. The plating method includes the following steps: rotating the substrate holder at a first rotation speed in a state in which the substrate holder is tilted; supplying liquid on the contact member and discharging the liquid toward the substrate holder rotated at the first rotation speed; stopping discharging the liquid; starting to reduce the tilt of the substrate holder toward the horizontal position within a specified period of time before or after stopping discharging the liquid; rotating the substrate holder at a second rotation speed faster than the first rotation speed while the substrate holder is in the horizontal position; and performing the plating process on the substrate after the substrate has been mounted on the substrate holder.

Description

Plating method and plating device

The invention relates to a plating method and a plating device.

An example of a plating device is a cup-type electrolytic plating device. Cup-type electrolytic plating equipment immerses a substrate (such as a semiconductor wafer) held in a substrate holder with the plated surface facing downwards in a plating liquid, and applies a voltage between the substrate and the anode. A conductive film is deposited on the surface (see Patent Documents 1 and 2).

The substrate holder of such a plating device is provided with a contact member that is in contact with the substrate for feeding power. In addition, the substrate holder is provided with a sealing member that prevents the plating liquid from contacting the contact member during the plating process and seals the contact member. [Prior technical literature] [Patent Document]

[Patent Document 1] Japanese Patent No. 7047200 [Patent Document 2] Japanese Patent No. 7081063 [Patent Document 3] U.S. Patent Application Publication No. 2017/0056934

(Invent the problem you want to solve)

When there is dirt on the contact member or plating liquid adheres to it, feed deviation will occur during the plating process, and the uniformity of the resulting plating thickness will be reduced. Patent Document 3 describes a cleaning device that sprays cleaning fluid onto electrical contacts. Patent Documents 1 and 2 avoid feed deviation during plating by uniformly moistening the entire contact component with cleaning fluid. Therefore, it is hoped that complicated operations will not be required and the feed deviation during the plating process can be more reliably reduced.

The present invention was made in view of the above problems. One of its purposes is to provide a plating method and a plating device that do not require complicated operations, can more reliably reduce feed deviation during plating processing, and can improve the uniformity of the plating thickness formed on a substrate. (a means of solving problems)

One aspect of the present invention provides a plating method in which a substrate is plated using a plating device provided with a substrate holder. The substrate holder includes a contact member that electrically contacts the substrate. The aforementioned plating method includes the following steps: tilting the substrate holder; rotating the substrate holder at a first rotation speed while the substrate holder is tilted; and supplying liquid on the contact member toward the contact member. The substrate holder discharges the liquid before the rotation at the first rotation speed; stops the discharge of the liquid; and within a specified time before or after stopping the discharge of the liquid, starts to tilt the substrate holder less toward the horizontal position; while the substrate With the holder in the horizontal position, the substrate holder is rotated at a second rotation speed faster than the first rotation speed; the rotation of the substrate holder at the second rotation speed is stopped; after stopping the rotation, The substrate holder mounts the substrate; and performs the plating process on the mounted substrate.

Another aspect of the present invention provides a plating device, which includes: a substrate holder including a contact member that can conductively contact the substrate; and a control device. The control device of the plating device tilts the substrate holder, and in the tilted state of the substrate holder, rotates the substrate holder at a first rotational speed to supply liquid on the contact member. The substrate holder discharges the liquid before rotating at the first rotation speed, stops the discharge of the liquid, and starts to tilt the substrate holder less toward the horizontal position within a specified time before or after stopping the discharge of the liquid. With the substrate holder in the horizontal position, the substrate holder is rotated at a second rotation speed faster than the first rotation speed, and the rotation of the substrate holder at the second rotation speed is stopped. After the rotation is stopped, The substrate holder is mounted with the substrate, and is configured to perform the plating process on the mounted substrate.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings described below, the same or equivalent components are denoted by the same symbols, and repeated descriptions are omitted. ＜Overall structure of plating equipment＞

FIG. 1 is a perspective view showing the overall structure of the plating apparatus 1000 according to this embodiment. FIG. 2 is a top view showing the overall structure of the plating device 1000. As shown in FIGS. 1 and 2 , the plating device 1000 includes a loading port 100 , a transfer robot 110 , an aligner 120 , a prewet module 200 , a prepreg module 300 , a plating module 400 , and a cleaning module 500 , spin rinse dryer 600, conveying device 700, and control module 800.

The loading port 100 is a module for loading a substrate stored in a cassette such as a FOUP (not shown) into the plating apparatus 1000 and unloading the substrate from the plating apparatus 1000 to the cassette. In this embodiment, four load ports 100 are arranged side by side in the horizontal direction. However, the number and arrangement of the load ports 100 are not limited. The transfer robot 110 is a robot used to transfer substrates, and is configured to transfer substrates between the loading port 100 , the aligner 120 , and the transfer device 700 . When the transfer robot 110 and the transfer device 700 transfer the substrate between the transfer robot 110 and the transfer device 700 , the transfer of the substrate can be performed via a temporary placement table (not shown).

The aligner 120 is a module used to align the orientation planes and notches of the substrate in a specified direction. In this embodiment, two aligners 120 are arranged side by side in the horizontal direction, but the number and arrangement of the aligners 120 are not limited. The pre-wetting module 200 wets the plated surface of the substrate before plating treatment with a treatment liquid (pre-wet liquid) such as pure water or degassed water, thereby replacing the air inside the pattern formed on the surface of the substrate with the treatment liquid. liquid. The prewetting module 200 is configured to perform prewetting treatment by replacing the treatment liquid inside the pattern with the plating liquid during plating, thereby easily supplying the plating liquid inside the pattern. In this embodiment, two pre-moistening modules 200 are arranged side by side in the vertical direction, but the number and arrangement of the pre-moistening modules 200 are not limited.

The prepreg module 300 is etched with a treatment solution such as sulfuric acid or hydrochloric acid to remove, for example, an oxide film with high resistance existing on the surface of the seed layer formed on the plated surface of the substrate before the plating process, and to clean or activate the plated substrate. The surface is pre-impregnated. In this embodiment, two prepreg modules 300 are arranged in parallel in the up and down direction, but the number and arrangement of the prepreg modules 300 are not limited. The plating module 400 performs a plating process on the substrate. In this embodiment, there are two sets of 12 plating modules 400 arranged with 3 units parallel in the up and down direction and 4 units parallel in the horizontal direction. A total of 24 plating modules 400 are provided. However, the number of plating modules 400 is limited. And the configuration is informal.

The cleaning module 500 is configured to perform a cleaning process on the substrate in order to remove the plating liquid and the like remaining on the substrate after the plating process. In this embodiment, two cleaning modules 500 are arranged side by side in the up and down direction, but the number and configuration of the cleaning modules 500 are not limited. The spin rinse dryer 600 is a module used to rotate and dry the cleaned substrate at high speed. In this embodiment, two spin rinse dryers are arranged side by side in the up and down direction, but the number and configuration of the spin rinse dryers are not limited. The transport device 700 is a device for transporting substrates between a plurality of modules in the plating device 1000 . The control module 800 is configured to control a plurality of modules of the plating device 1000, and may be configured by, for example, a general computer or a dedicated computer having an input/output interface with an operator.

An example of a series of plating processes performed by the plating apparatus 1000 will be described. First, the substrate stored in the cassette is loaded into the loading port 100 . Continuing, the transport robot 110 takes out the substrate from the cassette in the loading port 100 and transports the substrate to the aligner 120 . The aligner 120 aligns the position of the orientation plane, notch, etc. of the substrate in a specified direction. The transport robot 110 delivers the substrate aligned with the aligner 120 to the transport device 700 .

The transport device 700 transports the substrate received from the transport robot 110 to the premoistening module 200 . The pre-wetting module 200 performs pre-wetting treatment on the substrate. The transport device 700 transports the pre-wetted substrate to the prepreg module 300 . The prepreg module 300 performs prepreg treatment on the substrate. The transport device 700 transports the prepreg-processed substrate to the plating module 400 . The plating module 400 performs a plating process on the substrate.

The transport device 700 transports the plated substrate to the cleaning module 500 . The cleaning module 500 performs cleaning processing on the substrate. The transport device 700 transports the cleaned substrate to the spin rinse dryer 600 . The spin rinse dryer 600 performs a drying process on the substrate. The transfer device 700 transfers the dried substrate to the transfer robot 110 . The transfer robot 110 transfers the substrate received from the transfer device 700 to the cassette in the loading port 100 . Finally, the cassette containing the substrate is unloaded from the loading port 100 . ＜Composition of plating module＞

Next, the structure of the plating module 400 will be described. Since the 24 plating modules 400 in this embodiment have the same structure, only one plating module 400 will be described. FIG. 3 is a longitudinal sectional view schematically showing the structure of the plating module 400 of this embodiment. As shown in FIG. 3 , the plating module 400 includes a plating tank 410 for containing a plating liquid. The plating tank 410 is a container with a cylindrical side wall and a circular bottom wall, and a circular opening is formed on the upper part. In addition, the plating module 400 includes an overflow tank 405 arranged outside the upper opening of the plating tank 410 . The overflow tank 405 is a container for receiving the plating liquid overflowing from the upper opening of the plating tank 410 .

The plating module 400 includes a diaphragm 420 that vertically partitions the inside of the plating tank 410 . The interior of the plating tank 410 is separated into a cathode region 422 and an anode region 424 by a separator 420 . The cathode region 422 and the anode region 424 are respectively filled with plating liquid. An anode 430 is provided on the bottom surface of the plating tank 410 in the anode region 424 . The resistor 450 is arranged in the cathode region 422 to face the separator 420 . The resistor 450 is a member for uniformizing the plating process on the plated surface Wf-a of the substrate Wf, and is composed of a plate-shaped member in which many holes are formed. As long as the plating process can be performed with desired accuracy, the resistor 450 does not need to be arranged in the plating tank 410 .

The plating solution is not particularly limited as long as it is a solution containing ions of metal elements constituting the plating film. As an example of the plating treatment, copper plating treatment can be used, and as an example of the plating solution, a copper sulfate solution can be used. In addition, in this embodiment, the plating solution contains specified additives. However, the structure is not limited to this, and the plating liquid may be constituted without additives.

The specific type of anode 430 is not particularly limited, and a dissolving anode or a non-dissolving anode may be used. In this embodiment, an insoluble anode is used as the anode 430 . The specific type of the insoluble anode is not particularly limited, and platinum, iridium oxide, etc. can be used.

In addition, the plating module 400 includes a substrate holder 440 for holding the substrate Wf with the plated surface Wf-a facing downward. The plating module 400 includes a first lifting mechanism 442 for lifting and lowering the substrate holder 440 . The first lifting mechanism 442 can be realized by a conventional mechanism such as a direct-acting actuator. In addition, the plating module 400 is provided with a rotation mechanism 446 for rotating the substrate holder 440 so that the substrate Wf rotates around a virtual rotation axis extending vertically from the center of the surface to be plated Wf-a. The rotation mechanism 446 can be implemented by a conventional mechanism such as a motor.

The plating module 400 uses the first lifting mechanism 442 to immerse the substrate Wf in the plating liquid in the cathode region 422, and uses the rotating mechanism 446 to rotate the substrate Wf, and by applying a voltage between the anode 430 and the substrate Wf, The plated surface Wf-a of the substrate Wf is plated.

In addition, the plating module 400 is provided with a tilting mechanism 447 configured to tilt the substrate holder 440 . The tilt mechanism 447 can be implemented by a conventional mechanism such as a tilt mechanism.

The plating module 400 includes a liquid supply device 470 that supplies liquid L1 to a contact member described below on the substrate holder 440 . The liquid supply device 470 is configured to supply the liquid L1 to the contact point member by discharging the liquid L1 toward the substrate holder 440 . The liquid L1 supplied to the contact member is configured to cover at least a part of the contact member. The liquid supply device 470 includes a robot arm 474, a drive device 476, a tray member 478, and a liquid supply nozzle 482.

The composition of the liquid L1 is not particularly limited as long as it has the effect of protecting the contact member. Liquid L1 should have a conductivity below a specified value or be degassed.

The conductivity of liquid L1 is preferably 50 μS/cm or less, more preferably 10 μS/cm or less. When a liquid with high electrical conductivity exists around the contact member and the substrate Wf, in addition to the current passing through the contact portion between the contact member and the substrate Wf, there will also be a shunt current that does not pass through the contact portion but passes through the liquid. There is flow between the seed layer of the substrate Wf and the contact member. At this time, due to ionization and dissolution of copper in the seed layer, the seed layer becomes thinner and the resistance increases, thereby causing a feed deviation. When the conductivity of the liquid L1 is low, this feed deviation can be suppressed. In addition, please refer to the above-mentioned Patent Document 2 for details on the shunt current.

When a liquid containing oxygen exists around the contact member and the substrate Wf, the oxygen is ionized to produce a local battery effect in which the seed layer is dissolved in the liquid. For example, copper in the seed layer donates electrons to dissolved oxygen, thereby generating hydroxide ions from the dissolved oxygen, and the copper becomes copper ions and dissolves. Through the local cell effect, the seed layer becomes thinner and the resistance increases, thus producing a feed deviation. When the liquid L1 is degassed, such feed deviation can be suppressed. In addition, please refer to the above-mentioned Patent Document 2 for details on the local cell effect.

From these viewpoints, liquid L1 is more preferably pure water, ion exchange water or degassed water.

The liquid supply nozzle 482 discharges the liquid L1. In addition to discharging the liquid L1 to cover the contact members, the liquid supply nozzle 482 may also use the liquid L1 as a cleaning liquid to appropriately clean the contact members. A pipe (not shown) is connected to the liquid supply nozzle 482 , and the liquid supply nozzle 482 discharges the liquid L1 introduced through the pipe from a liquid source (not shown). Details of supplying the liquid L1 using the liquid supply device 470 will be described later.

The liquid supply device 470 includes a drive device 476 configured to rotate the robot arm 474 . The driving device 476 can be implemented by a conventional mechanism such as a motor. The robot arm 474 is a plate-shaped member extending in the horizontal direction from the driving device 476 . The liquid supply nozzle 482 is held on the robot arm 474 . The driving device 476 rotates the robot arm 474 to move the liquid supply nozzle 482 to a supply position between the plating tank 410 and the substrate holder 440 and to retract the liquid supply nozzle 482 from between the plating tank 410 and the substrate holder 440 It is constructed by moving between retreat positions.

The liquid supply device 470 includes a tray member 478 arranged below the liquid supply nozzle 482 . The tray member 478 is configured to receive the liquid L1 discharged from the liquid supply nozzle 482 and supplied to the contact member, and then dropped. In this embodiment, the liquid supply nozzle 482 and the robot arm 474 are accommodated in the tray member 478 . The driving device 476 is configured to rotate the liquid supply nozzle 482, the robot arm 474, and the tray member 478 together between the supply position and the retracted position. However, the driving device 476 can also drive the liquid supply nozzle 482, the robot arm 474, and the tray member 478 respectively.

FIG. 4 schematically shows a longitudinal cross-sectional view of the substrate holder 440 . The substrate holder 440 includes a support portion 490 that supports the substrate Wf; a back plate assembly 492 that clamps the substrate Wf together with the support portion 490; and a rotation shaft 491 that extends vertically upward from the back plate assembly 492. The support portion 490 includes a first upper member 493, a second upper member 496, and a support mechanism 494 for supporting the outer peripheral portion of the plated surface Wf-a of the substrate Wf. The first upper member 493 holds the second upper member 496. In the illustrated example, the first upper member 493 extends in a substantially horizontal direction, and the second upper member 496 extends in a substantially vertical direction, but the invention is not limited thereto. The support mechanism 494 is an annular member having an opening in the center for exposing the plated surface Wf-a of the substrate Wf, and is suspended and held by the second upper member 496. The second upper member 496 may be one or more column members provided on the annular upper surface of the support mechanism 494 .

The back plate assembly 492 includes a disk-shaped floating plate 492 - 2 for sandwiching the substrate Wf together with the support mechanism 494 . The floating plate 492-2 is arranged on the back side of the plated surface Wf-a of the substrate Wf. In addition, the back plate assembly 492 includes a disc-shaped back plate 492-1 arranged above the floating plate 492-2. In addition, the back plate assembly 492 is provided with: a floating mechanism 492-4 for urging the floating plate 492-2 in a direction away from the back surface of the substrate Wf; and a floating mechanism 492-4 for resisting the force exerted by the floating mechanism 492-4 and causing the floating plate to float The plate 492-2 is pressed against the pressing mechanism 492-3 on the back surface of the substrate Wf.

The floating mechanism 492-4 includes a compression spring installed between the upper end of a shaft extending upward from the floating plate 492-2 through the backing plate 492-1 and the backing plate 492-1. The floating mechanism 492-4 is configured so that the floating plate 492-2 is lifted upward via the shaft by the compression reaction force of the compression spring and biased in a direction away from the back surface of the base plate Wf. The floating mechanism 492-4 is omitted from the subsequent figures.

The pressing mechanism 492-3 is configured to press the floating plate 492-2 downward by supplying fluid to the floating plate 492-2 through a flow path formed inside the back plate 492-1. When fluid is supplied, the pressing mechanism 492-3 presses the substrate Wf against the support mechanism 494 with a force stronger than the force exerted by the floating mechanism 492-4.

The first lifting mechanism 442 raises and lowers the entire substrate holder 440 (arrow A10 ). The plating module 400 further includes a second lifting mechanism 443 . The second lifting mechanism 443 is driven by a conventional mechanism such as a linear actuator, and causes the rotating shaft 491 and the back plate assembly 492 to rise and fall relative to the support part 490 (arrow A20 ).

FIG. 5 is an enlarged longitudinal cross-sectional view schematically showing a part of the structure of the substrate holder 440. The support mechanism 494 includes an annular support member 494 - 1 for supporting the outer peripheral portion of the plated surface Wf-a of the substrate Wf. The support member 494 - 1 has a flange 494 - 1 a extending from the outer peripheral portion of the lower surface of the back plate assembly 492 (floating plate 492 - 2 ). An annular sealing member 494-2 is arranged on the flange 494-1a. The sealing member 494-2 is an elastic member. The support member 494-1 supports the outer peripheral part of the plated surface Wf-a of the substrate Wf via the sealing member 494-2. When the substrate Wf is plated, the space between the support member 494-1 (substrate holder 440) and the substrate Wf is sealed by sandwiching the substrate Wf between the sealing member 494-2 and the floating plate 492-2.

The support mechanism 494 includes: an annular base 494-3 installed on the inner peripheral surface of the support member 494-1; and an annular conductive member 494-5 installed on the upper surface of the base 494-3. The base 494-3 is a conductive component, which may include stainless steel or other metals, for example. The conductive member 494-5 is an annular member with conductivity, and may include copper or other metals, for example.

The support mechanism 494 is provided with a contact member 494-4 for feeding power to the substrate Wf. The contact member 494-4 is annularly attached to the inner peripheral surface of the base 494-3 by screws or the like. The shape of the contact member 494-4 is not particularly limited as long as it can feed power to the substrate Wf. For example, a plurality of arch-shaped contact members 494 - 4 may be arranged side by side in an annular shape. The support member 494-1 holds the contact member 494-4 via the base 494-3. The contact member 494 - 4 has a conductive member for feeding power from a power source (not shown) to the substrate Wf held by the substrate holder 440 . The contact member 494-4 has a plurality of substrate contacts 494-4a that are in contact with the outer peripheral portion of the plated surface Wf-a of the substrate Wf, and a body portion 494-4b that extends above the substrate contacts 494-4a. The contact member 494-4 is in conductive contact with the substrate Wf via the substrate contact 494-4a.

FIG. 6 is a conceptual diagram illustrating the control module 800. The control module 800 functions as a control device that controls the operation of the plating module 400 . The control module 800 is equipped with a computer such as a microcomputer, which is equipped with: a CPU (Central Processing Unit) 801 as a processor; and a memory 802 as a temporary or non-transitory memory medium. The control module 800 controls the controlled part of the plating module 400 by operating the CPU 801 . The CPU 801 can perform various processes by executing a program stored in the memory 802 or by reading a program stored in a storage medium (not shown) into the memory 802 for execution. Programs include, for example, transfer control of transfer robots and transfer devices, control of processing in each processing module, control of plating processing in the plating module 400, and programs for executing control of liquid supply processing; and detection of various equipment. Abnormal program. Examples of memory media include computer-readable ROM, RAM, flash memory, disc-shaped memory media such as hard disks, CD-ROMs, DVD-ROMs, and floppy disks; or solid-state hard drives, etc. The knower. The control module 800 can be configured to communicate with an upper-layer controller (not shown) that controls the plating device 1000 and other related devices, and can exchange data with a database of the upper-layer controller. Part or all of the functions of the control module 800 can also be configured by hardware such as ASIC. Part or all of the functions of the control module 800 may also be composed of a PLC, a sequencer, etc. Part or all of the control module 800 may be configured inside and/or outside the frame of the plating device. Part or all of the control module 800 may be communicatively connected to various parts of the plating device via wires and/or wireless.

FIG. 7 is a flow chart showing the flow of the plating method according to this embodiment. The plating method is controlled by the control module 800 .

Step S11 is to perform pre-wetting treatment on the substrate Wf provided with the seed layer on the plated surface Wf-a in the pre-wet module 200. The pre-wet treatment is to wet the plated surface Wf-a of the substrate Wf before plating treatment with a treatment liquid such as pure water or degassed water, thereby replacing the air inside the resist pattern formed on the substrate surface with the treatment liquid. . After step S11, step S12 is performed.

Step S12 is to perform a prepreg process on the substrate Wf in the prepreg module 300 . The prepreg treatment is to use treatment solutions such as sulfuric acid and hydrochloric acid to etch and remove the oxide film with high resistance existing on the surface of the seed layer, etc., and clean or activate the surface of the plating substrate. In addition, after the pre-soaking process, the substrate Wf can also be cleaned with a treatment liquid such as pure water or degassed water. The pre-wetted substrate Wf is wetted with the processing liquid, and the openings of the resist pattern on the surface of the substrate Wf are filled with the processing liquid. Step S13 is performed after step S12. Step S12 may be omitted, and the plating device 1000 may not include the prepreg module 300 .

Step S13 is to perform a plating process on the substrate Wf in the plating module 400. Under the control of the control module 800, the first lifting mechanism 442 and the horizontal moving mechanism (not shown) that moves the substrate holder 440 horizontally move the substrate holder 440 to the position of the substrate Wf, and then step S11 or S12 will be performed. The substrate Wf wetted with the processing liquid is mounted on the substrate holder 440 . At this time, the substrate holder 440 supplies the liquid L1 to the contact member 494 - 4 in step S15 described below, so that at least a part of the contact member 494 - 4 is covered with the liquid L1. After the substrate Wf is mounted on the substrate holder 440, the substrate holder 440 is lowered by the first lifting mechanism 442, so that the substrate Wf is immersed in the plating liquid. Then, a voltage is applied between the anode 430 and the substrate Wf to perform plating processing.

In the plating process of this embodiment, since the substrate contact 494-4a of the contact member 494-4 and the like are covered with the liquid L1, feed deviation caused by the local cell effect or shunt current can be suppressed. Furthermore, when the substrate Wf is mounted on the substrate holder 440, if there are wet parts and dry parts in the area where the outer peripheral part of the substrate Wf contacts the contact member 494-4, it may cause power supply deviation. , and this embodiment suppresses it by uniformly covering the contact member 494-4 with the liquid L1. In addition, in order to suppress the occurrence of wet parts and dry parts, it is not necessary to dry the substrate Wf that has been wetted by pre-wetting or pre-impregnation, and it is also possible to prevent the plated surface Wf-a from drying due to this drying. Poor plating. In addition, the liquid L1 can also be used to clean or cover the contact member 494-4 to prevent local dirt in the area where the outer peripheral portion of the substrate Wf contacts the contact member 494-4 from causing power feed deviation. Step S14 is performed after step S13.

Step S14 is a substrate cleaning process for cleaning the plated substrate Wf. After the plating process, the substrate holder 440 is raised above the liquid level of the plating liquid in the plating tank 410, and the plated surface Wf-a of the substrate Wf is cleaned by the cleaning liquid supplied from the cleaning liquid nozzle (not shown). At this time, the substrate holder 440 and/or the cleaning liquid nozzle may also be rotated to apply the cleaning liquid uniformly to the substrate Wf. Through this substrate cleaning process, the plating liquid adhering to the substrate Wf can be recovered and appropriately reused, and/or the plated surface Wf-a of the substrate Wf can be moistened to prevent the plated surface Wf-a from drying out. The cleaning liquid may be, for example, pure water or degassed water, or a liquid used for processes such as prewetting, presoaking, and cleaning. The substrate Wf for substrate cleaning processing is detached from the substrate holder 440 and transported to the cleaning module 500 and the spin rinse dryer 600 in sequence, and then transported to the cassette of the loading port 100 for cleaning and drying processing. Step S15 is performed after step S14.

In step S15, liquid supply processing is performed on the contact point member 494-4. FIG. 8 is a flowchart showing the flow of liquid supply processing. In step S1501, the control module 800 controls the tilting mechanism 447 to tilt the substrate holder 440 without the substrate Wf. The angle of inclination is not particularly limited as long as the liquid L1 can be supplied to the contact point member 494-4 in step S1503 described below. For example, the substrate holder 440 can be tilted from horizontal to 3 degrees to 7 degrees, and preferably to a tilted state of 5 degrees. Here, the inclination of the substrate holder 440 refers to the inclination of the substrate Wf that can be arranged on the substrate holder 440, and is represented by, for example, the angle from the horizontal to the lower surface of the floating plate 492-2.

FIG. 9 is a conceptual diagram for explaining step S1501. The entire substrate holder 440 including the support portion 490 and the back plate assembly 492 is tilted by the tilting mechanism 447 . Step S1502 is performed after step S1501.

In step S1502, the control module 800 controls the rotation mechanism 446 to rotate the substrate holder 440 in the tilted state at a first rotation speed. Hereinafter, the rotation in step S1502 is referred to as the first rotation. The first rotation speed is preferably 8 rpm or more, more preferably 10 rpm or more. When the first rotation speed decreases, most of the liquid L1 falls along the slope from the substrate holder 440 due to gravity, and sometimes the contact member 494 - 4 cannot be fully covered by the liquid L1 . The first rotation speed is preferably 15 rpm or less, more preferably 12 rpm or less. When the first rotational speed increases, the overflowing liquid L1 will scatter to a wider area from the area above the sealing member 494-2 where the contact member 494-4 is arranged. At this time, the liquid L1 may deviate from the tray member 478 and fall into the plating tank 410, resulting in adverse effects such as thinning of the plating liquid. From these viewpoints, the first rotation speed is preferably 8 rpm to 15 rpm, and more preferably 10 rpm to 12 rpm.

FIG. 10 is a conceptual diagram for explaining step S1502. FIG. 10 schematically shows the first rotation of the substrate holder 440 with arrow A30. Step S1503 is performed after step S1502.

In step S1503, the control module 800 controls the liquid supply device 470 to discharge the liquid L1 toward the substrate holder 440. The liquid L1 is discharged by supplying the liquid L1 to the contact point member 494-4. For example, the liquid L1 is discharged from the liquid supply nozzle 482 toward the contact member 494 - 4 so that the liquid L1 directly contacts the contact member 494 - 4 . In the state where the liquid L1 is discharged, it is preferable to rotate the substrate holder 440 at the first rotation speed for at least one revolution. The supplied liquid L1 covers at least a part of the contact member 494-4.

FIG. 11 is a conceptual diagram for explaining step S1503. When the robot arm 474 and the tray member 478 are driven by the driving device 476, and the liquid supply nozzle 482 moves to the supply position, the liquid L1 is discharged from the liquid supply nozzle 482 in such a manner that the liquid L1 is supplied to the contact member 494-4. Step S1504 is performed after step S1503. In step S1503, in addition to supplying liquid to the contact member 494-4, the contact member 494-4 may also be simply cleaned.

In step S1504, the control module 800 controls the liquid supply device 470 to stop discharging the liquid L1, and controls the tilting mechanism 447 to start tilting the substrate holder 440 to a horizontal position. Here, the substrate holder 440 starts to decrease the inclination before stopping the discharge of the liquid L1 or within a specified time thereafter.

The step of stopping discharging the liquid L1 is called a discharging stop step, and the step of starting to reduce the tilt of the substrate holder 440 is called a tilt reducing step. After stopping the discharging step, when a certain amount of time passes without performing the tilt reduction step, the liquid L1 in contact with the contact member 494-4 falls from the tilted substrate holder 440 by gravity, causing the contact member 494-4 to fail. Fully covered by liquid L1. In addition, after the tilt reduction step, when a certain amount of time elapses without performing the discharging stop step, the discharged liquid L1 overflows from the substrate holder 440 and deviates from the tray member 478 and falls toward the plating tank 410 , causing the plating liquid to become thin. The specified time mentioned above should be set in advance in a way that does not cause such problems. From this point of view, the above-specified time is preferably 2 seconds or less, more preferably 1 second or less, further more preferably 0.5 seconds or less. It is better to perform the steps of stopping discharging and reducing tilt at approximately the same time.

Here, the horizontal position is not particularly limited when a sufficient range of the contact member 494 - 4 can be covered with the liquid L1 in order to achieve a desired degree of uniform plating. However, for example, it refers to the substrate holder 440 The tilt of the substrate holder 440 is less than 1 degree.

FIG. 12 is a conceptual diagram illustrating the substrate holder 440 in a horizontal position after step S1504. FIG. 13 is an enlarged cross-sectional view of the vicinity of the contact member 494 - 4 in FIG. 12 . In the illustrated example, the liquid L1 is placed above the flange 494-1a and the sealing member 494-2, and in the space inside the base 494-3 where the contact member 494-4 is placed. In the illustrated example, the sealing member 494-2 functions as a liquid holding portion 494L that holds the liquid L1 in contact with the contact member 494-4. The liquid holding portion 494L holds the liquid L1 in contact with the contact member 494-4, but is not limited to this. Immediately after step S1504, although the liquid L1 sometimes contacts a part of the contact member 494-4, it is not evenly distributed, and the substrate contact 494-4a is not fully covered. At this time, when the substrate Wf has contacted the contact member 494-4 and is mounted on the substrate holder 440, the feed deviation may be caused by local cell effect or shunt current. Step S1505 is performed after step S1504.

In step S1505, the control module 800 controls the rotation mechanism 446 to stop the rotation of the substrate holder 440. Step S1506 is performed after step S1505.

In step S1506, the control module 800 controls the second lifting mechanism 443 to lift the backplane assembly 492. The back plate assembly 492 rises toward the support portion 490 . When the liquid L1 comes into contact with the back plate assembly 492 and the like, in step S1507 described below, the liquid L1 is unevenly distributed due to surface tension and cannot evenly cover the contact member 494 - 4 , thus causing power feed deviation. . Through this step, the distance between the back plate assembly 492 and the contact member 494 - 4 is increased, and the liquid L1 in contact with the contact member 494 - 4 is less likely to contact the back plate assembly 492 such as the floating plate 492 - 2 . Therefore, when the substrate holder 440 is rotated at the second rotation speed in step S1507 described below, the liquid L1 accumulated in the liquid holding portion 494L is more evenly distributed over the entire circumference by the centrifugal force, thereby covering the contact surface more evenly. Point member 494-4. In addition, it is not limited to the back plate assembly 492, and the member facing the contact point member 494-4 may be moved away from the contact point member 494-4.

Step S1507 is performed after step S1506. In addition, steps S1505 and S1506 may be omitted as long as the plating can be formed as uniformly as desired.

In step S1507, the control module 800 controls the rotation mechanism 446 to rotate the substrate holder 440 at the second rotation speed. This rotation is called the second rotation. The second rotation speed is set to a speed greater than the first rotation speed. Here, the first rotation speed and the second rotation speed are not affected by the rotation direction and show positive values of the rotation speed. The directions of the first rotation and the second rotation may be the same or opposite.

The first rotation speed can be set from the viewpoint of step S1502. However, as illustrated in FIG. 13, the contact member 494-4 may not be fully covered with the liquid L1. The inventor of the present invention found that by rotating the substrate holder 440 at a second rotational speed that is greater than the first rotational speed, the contact member 494 - 4 can be covered with the liquid L1 more uniformly. From this point of view, the second rotation speed is preferably 30 rpm or more. From the same viewpoint and when the second rotation speed is too high, power is used inefficiently. Therefore, for example, the second rotation speed is more preferably set to 40 rpm or more and 60 rpm or less.

FIG. 14 is a conceptual diagram for explaining the substrate holder 440 in step S1507. Step S1507 is to rotate the substrate holder 440 in the horizontal position at the second rotation speed. The second rotation is shown schematically with arrow A40. In the example shown in the figure, because the back plate assembly 492 has been raised in step S1506, there is no space expansion of the component near the contact member 494-4, which can suppress the deflection of the liquid L1 caused by the contact of the liquid L1 with other components. In addition, when step S1506 is omitted, the second rotation is performed in a state where the back plate assembly 492 has been lowered. Even at this time, a certain effect of suppressing the liquid L1 from deflecting to one side can still be obtained.

FIG. 15 is an enlarged cross-sectional view of the vicinity of the contact member 494-4 after step S1507. As a result of the second rotation, the contact member 494 - 4 is suppressed from being deflected over a wider range and is covered with the liquid L1 . For example, the entire annular contact member 494 - 4 can cover the substrate contact 494 - 4 a with the liquid L1. Step S1508 is performed after step S1507.

In step S1508, the control module 800 controls the rotation mechanism 446 to stop the second rotation of the substrate holder 440. Step S13 (Fig. 7) is performed after step S1508.

The plating device and plating method of this embodiment use the control module 800 to tilt the substrate holder 440, and in the tilted state of the substrate holder 440, the substrate holder 440 is rotated at the first rotation speed, and the liquid L1 is supplied. to the contact member 494 - 4 , the liquid L1 is discharged toward the substrate holder 440 rotating at the first rotation speed, and then the discharge of the liquid L1 is stopped, and the substrate is started to be discharged within a specified time before or after stopping the discharge of the liquid L1 . The holder 440 is tilted toward the horizontal position, and when the substrate holder 440 is in the horizontal position, the substrate holder 440 is rotated at a second rotation speed faster than the first rotation speed, and then the second rotation speed of the substrate holder 440 is stopped. The substrate Wf is rotated, the substrate Wf is mounted on the substrate holder 440 that has stopped rotating, and the mounted substrate Wf is then plated. This eliminates the need for complicated operations, more reliably reduces feed deviation during the plating process, and improves the uniformity of the plating thickness formed on the substrate Wf.

The following changes are also within the scope of the present invention and can be combined with the above-described embodiments or other changes. In the following modification examples, parts showing the same structures and functions as those in the above-mentioned embodiment are referred to with the same reference numerals, and descriptions thereof are omitted as appropriate. (Modification 1)

In step S1503 of the above embodiment, the liquid L1 may also be discharged toward the back plate assembly 492 . In particular, the liquid supply nozzle 482 can discharge the liquid L1 toward the floating plate 492 - 2 that presses the substrate Wf when the substrate Wf is placed on the substrate holder 440 .

FIG. 16 is a cross-sectional view schematically showing a method of supplying liquid to the contact point member 494 - 4 by the plating method of this modification. Step S1503 is that the floating plate 492-2 of the back plate assembly 492 can be disposed at a position surrounded by the contact member 494-4. The liquid supply nozzle 482 is configured to discharge liquid L1 from the discharge port 482a toward the lower surface of the back plate assembly 492, and to contact the lower surface of the back plate assembly 492 and splash the liquid L1 toward the main body 494-4b. The liquid L1 splashed by contacting the lower surface of the back plate assembly 492 collides with the main body part 494-4b, and then flows downward from the main body part 494-4b by gravity. Thereby, the liquid L1 flows into the liquid holding part 494L. Alternatively, the plating liquid adhered to the main body part 494 - 4 b and the substrate contact 494 - 4 a falls together with the liquid L1 and is recovered to the tray member 478 .

When this variation is adopted, complicated operations are not required as in the above-mentioned embodiment, and the feed deviation during the plating process can be more reliably reduced. In addition, when this modification is adopted, the metal members (such as the conductive members 494 - 5 ) mounted on the substrate holder 440 can be inhibited from rusting. That is, when the liquid L1 is supplied to the contact member 494-4, the technique of arranging the liquid supply nozzle 482 above or to the side of the contact member 494-4 may cause the liquid supply nozzle 482 to come into contact with the back plate assembly 492. Therefore, the back plate assembly 492 should be retreated to a high position. In this way, the liquid L1 discharged from the liquid supply nozzle 482 and colliding with the contact member 494 - 4 jumps and adheres to the metal member (for example, the conductive member 494 - 5 ), which may cause corrosion. In order to prevent the liquid L1 from jumping and adhering to metal members, it is necessary to precisely control the arrangement position of the liquid supply nozzle 482, the discharge angle of the liquid L1, the discharge intensity of the liquid L1, etc., so it is not suitable.

In contrast, in this variation, the liquid supply nozzle 482 is disposed below the substrate holder 440 and discharges the liquid L1 from below the substrate holder 440 . Therefore, since a space can be formed at a position surrounded by the contact member 494 - 4 , the back plate assembly 492 can be disposed in the space. As shown in FIG. 16 , since the back plate assembly 492 serves as a wall facing the metal member (for example, the conductive member 494 - 5 ) above the contact member 494 - 4 , the liquid L1 ejected from the liquid supply nozzle 482 can be suppressed. Jump to the metal structure. As a result, according to this modification, there is no need to precisely control the arrangement position of the liquid supply nozzle 482, the discharge angle of the liquid L1, the discharge intensity of the liquid L1, etc., and the liquid L1 can be simply supplied to the contact member 494-4. (Modification 2)

In the above embodiment, the liquid supply nozzle 482 may be a direct injection nozzle.

FIG. 17 is a diagram schematically showing the liquid supply nozzle 4820 of this modification. As shown in FIG. 17 , the liquid supply nozzle 4820 is a direct nozzle that discharges the liquid L1 linearly. By using the direct injection nozzle, the liquid L1 can be ejected at a position aimed at the main body portion 494-4b of the contact member 494-4. In the illustrated example, the liquid L1 is discharged from the liquid supply nozzle 4820 so that the liquid L1 directly contacts the contact member 494 - 4 . (Modification 3)

In the above embodiment, the rotation direction of the substrate holder 440 when discharging the liquid L1 may also be adjusted.

18 and 19 are respectively a top view and a side view schematically showing the discharge of liquid L1 in step S1503 in this variation. FIG. 18 schematically shows the substrate holder 440 viewed from the upper side in the vertical direction as a dotted circle. In the illustrated example, the substrate holder 440 rotates in the counterclockwise direction (arrow A50 ). In the inclined substrate holder 440 , the inclined upper end is referred to as the upper end Hi, and the inclined lower end is referred to as the lower end Lo.

The position where the discharged liquid L1 collides with the substrate holder 440 is set as the collision position P1. The first rotation of the substrate holder 440 is preferably performed in such a manner that the substrate holder 440 has a velocity component in the direction from the lower end Ho toward the upper end Hi of the inclined substrate holder 440 at the collision position P1. This makes it difficult to impart a downward velocity component to the liquid L1, and the liquid L1 is easily accumulated in the liquid holding portion 494L so as to cover the contact member 494-4. The illustrated example is a semicircular substrate holder 440 on the right side of the figure. The semicircular substrate holder 440 has a velocity component from the lower end Ho to the upper end Hi, and the collision position P1 is arranged in this semicircle.

In addition, it is preferable that the liquid L1 is ejected at the collision position P1 so as to have a velocity component in the same direction as the rotation direction of the substrate holder 440 . Thereby, the liquid L1 can easily move to the liquid holding part 494L, and the liquid L1 can be more easily accumulated by covering the contact member 494-4. In the illustrated example, the liquid L1 is discharged to have a velocity component (arrow V10 ) toward the upper end Hi direction, and is configured to have a velocity component in the same direction as the rotation direction of the substrate holder 440 at the collision position P1.

The liquid L1 is preferably ejected from the discharge port 482a of the liquid supply nozzle 482 in a semi-fan shape. More specifically, the liquid L1 spreads from the discharge port 482a along a plane extending toward the upper end Hi side. Therefore, the discharged liquid L1 is distributed in the space on one side of the vertical plane Vp passing through the discharge port 482a. With such a configuration, more liquid L1 can be discharged in a manner that it is easily accumulated in the liquid holding portion 494L. (Modification 4)

In the above-mentioned embodiment, the plating module 400 may include a protective member that prevents the plating liquid atmosphere in the plating tank 410 from being released into the plating module 400 when the liquid L1 is supplied to the contact point member 494 - 4 . The protective cover member may be, for example, a cylindrical member surrounding the substrate holder 440 . At least two of the liquid supply nozzle 482, the cover member, and the cleaning liquid nozzle for cleaning the substrate Wf may be formed integrally.

The present invention can also be described as the following forms. [Form 1] Form 1 provides a plating method in which a substrate is plated by a plating device provided with a substrate holder, the substrate holder including a contact member conductively contacting the substrate, the plating method The method includes the following steps: tilting the substrate holder; rotating the substrate holder at a first rotation speed while the substrate holder is tilted; and rotating the substrate toward the first rotation in a manner of supplying liquid on the contact member. Before the speed rotation, the substrate holder spits out the liquid; stops spitting out the liquid; before stopping the spitting out the liquid or within a specified time after, start tilting the substrate holder less toward the horizontal position; while the substrate holder is in the In a horizontal position, the substrate holder is rotated at a second rotational speed faster than the first rotational speed; the rotation of the substrate holder at the second rotational speed is stopped; and the substrate holder is stopped before the rotation. Install the aforementioned substrate; and perform the aforementioned plating treatment on the aforementioned substrate after installation. When adopting the form 1, complicated operations are not required, the feed deviation during the plating process can be more reliably reduced, and the uniformity of the plating thickness formed on the substrate can be improved.

[Form 2] Form 2 is the same as form 1, in which the aforementioned specified time is less than 2 seconds. When the form 2 is adopted, the liquid can be suppressed from falling from the liquid holding portion near the contact member, and the liquid can be suppressed from overflowing from the substrate holder 440 and causing the plating liquid to become thin.

[Form 3] Form 3 is the same as form 1 or form 2, wherein the second rotation speed is 30 rpm or more. When using Form 3, the liquid L1 can cover the contact components more evenly, further reducing the feed deviation during the plating process.

[Form 4] Form 4 is any one of forms 1 to 3, wherein the first rotation speed is 8 rpm or more and 15 rpm or less. When the form 4 is adopted, it is possible to prevent the liquid from falling from the liquid holding area near the contact member and to prevent the liquid from scattering from the substrate holder, causing the plating liquid to become thin.

[Mode 5] Mode 5 is any one of modes 1 to 4, wherein after the substrate holder is in the horizontal position and before the substrate holder is rotated at the second rotation speed, it further includes: In the substrate holder, a step of moving a member facing the contact member away from the contact member. When using form 5, it is possible to suppress feed deviation caused by uneven distribution of liquid due to contact with other components and uneven coverage of contact components.

[Form 6] Form 6 is any one of forms 1 to 5, wherein before performing the step of discharging the liquid, the liquid is discharged toward the plate that presses the substrate when the substrate is placed in the substrate holder. spit out. When using form 6, it is possible to suppress rusting of the metal components mounted on the substrate holder due to liquid adhesion.

[Mode 7] Mode 7 is any one of modes 1 to 6, wherein the step before discharging the liquid is performed by placing the substrate holder at a collision position of the substrate holder where the liquid collides before discharging, so as to have The substrate holder is rotated in such a manner that the speed component is tilted from the lower end toward the upper end direction. When the form 7 is adopted, it is difficult to impart a downward velocity component to the liquid that collides with the substrate holder, and the liquid is easily accumulated so as to cover the contact member.

[Aspect 8] Aspect 8 is the same as aspect 7, in which, before performing the step of discharging the liquid, the liquid is discharged at the collision position in such a manner that the liquid has a velocity component in the same direction as the rotation direction of the substrate holder. When the form 8 is adopted, the liquid that collides with the substrate holder is likely to move toward the contact member, and the liquid is more likely to accumulate by covering the contact member.

[Aspect 9] Aspect 9 is the same as aspect 8, wherein before the step of discharging the liquid is performed, the liquid is discharged from the discharge port along a plane extending toward the upper end side of the substrate holder. When the form 9 is adopted, more liquid can be discharged in a manner that it is easy to accumulate in the liquid holding portion near the contact member.

[Form 10] Form 10 is any one of forms 1 to 9, wherein the conductivity of the aforementioned liquid is below a specified value or has been degassed. When using mode 10, feed deviation due to shunt current or local cell effects can be suppressed.

[Mode 11] Aspect 11 provides a plating device, which is provided with: a substrate holder including a contact member that can conductively contact the substrate; and a control device; the control device is configured to tilt the substrate holder, and in the above In the tilted state of the substrate holder, the substrate holder is rotated at a first rotation speed to supply the liquid on the contact member, and the liquid is discharged toward the substrate holder rotating at the first rotation speed, and the above process is stopped. The liquid is discharged, and before or within a specified time after stopping the discharge of the liquid, the substrate holder is tilted downward toward the horizontal position, and while the substrate holder is in the horizontal position, the substrate holder is tilted at a ratio of The first rotation speed is faster than the second rotation speed, the rotation of the substrate holder at the second rotation speed is stopped, the substrate holder is installed with the substrate before the rotation is stopped, and the substrate is plated after installation. It is composed of overlay processing method. When adopting the form 11, complicated operations are not required, the feed deviation during the plating process can be more reliably reduced, and the uniformity of the plating thickness formed on the substrate can be improved.

The embodiments of the present invention have been described above. However, the above-described embodiments of the present invention are provided for easy understanding of the present invention and do not limit the present invention. The present invention can be changed and improved without departing from the spirit thereof, and the equivalents thereof are naturally included in the present invention. In addition, the embodiments and modifications may be arbitrarily combined within the scope that can solve at least part of the above problems or achieve at least part of the effects, and the constituent elements described in the patent application and the specification may be arbitrarily combined or Omit.

100:Loading port 110:Transport robot 120:Aligner 200: Pre-wet module 300:Prepreg module 400: Plating module 405: Overflow tank 410:Plating tank 420: Diaphragm 422:Cathode area 424: Anode area 430:Anode 440:Substrate holder 442:The first lifting mechanism 443: Second lifting mechanism 446: Rotating mechanism 447:Tilt mechanism 450: Resistance body 470:Liquid supply device 474:Robotic arm 476:Driving device 478:Pallet components 482,4820: Liquid supply nozzle 482a: Discharge outlet 490:Support part 491:Rotating shaft 492:Back plate assembly 492-1:Back plate 492-2: Floating board 492-3: Pressing mechanism 493:First upper member 494:Support mechanism 494L: Liquid holding part 494-1:Supporting members 494-1a: Flange 494-2:Sealing components 494-3: Base 494-4: Contact components 494-4a:Substrate contact 494-4b: Ontology part 494-5: Conductive components 496:Second upper member 500:Cleaning module 600: Spin rinse dryer 700:Conveying device 800:Control module 801:CPU (Central Processing Unit) 802:Memory 1000:Plating device A10,A20,A40,V10: arrow Hi: upper end L1: liquid Lo:lower end P1: collision position Vp: vertical surface Wf: substrate Wf-a: plated surface

FIG. 1 is a perspective view showing the overall structure of the plating apparatus according to this embodiment. FIG. 2 is a plan view showing the overall structure of the plating apparatus according to this embodiment. FIG. 3 is a longitudinal sectional view schematically showing the structure of the plating module according to this embodiment. FIG. 4 is a cross-sectional view schematically showing the substrate holder of this embodiment. FIG. 5 is a cross-sectional view schematically showing the substrate holder of the contact member of this embodiment. FIG. 6 is a conceptual diagram showing the structure of the control module of this embodiment. FIG. 7 is a flow chart showing the flow of the plating method according to this embodiment. FIG. 8 is a flowchart showing a process flow for supplying liquid to the contact member in this embodiment. FIG. 9 is a cross-sectional view schematically showing the step of tilting the substrate holder. FIG. 10 is a cross-sectional view schematically showing a step of rotating the substrate holder at a first rotation speed. FIG. 11 is a cross-sectional view schematically showing a step of discharging liquid toward the substrate holder. FIG. 12 is a cross-sectional view schematically showing a state in which the inclination of the substrate holder is reduced and the substrate holder is in a horizontal position. FIG. 13 is a cross-sectional view schematically showing liquid supplied to the contact member. FIG. 14 is a cross-sectional view schematically showing a step of rotating the substrate holder at a first rotation speed. FIG. 15 is a cross-sectional view schematically showing liquid supplied to the contact member. FIG. 16 is a cross-sectional view schematically showing liquid discharged from the substrate holder in Modification 1. FIG. FIG. 17 is a cross-sectional view schematically showing liquid discharged from the substrate holder in Modification 2. FIG. 18 is a top view schematically showing liquid discharged from the substrate holder in Modification 3. FIG. FIG. 19 is a side view schematically showing liquid discharged from the substrate holder in Modification 3. FIG.

440:Substrate holder

442:The first lifting mechanism

443: Second lifting mechanism

446: Rotating mechanism

447:Tilt mechanism

491:Rotating shaft

492:Back plate assembly

492-1:Back plate

492-2: Floating board

492-3:Pressing mechanism

494-4: Contact components

A40:Arrow

L1: liquid

Claims (11)

A plating method is to perform plating treatment on a substrate by using a plating device equipped with a substrate holder. The substrate holder includes a contact member that can conductively contact the substrate. The plating method includes the following steps: tilt the aforementioned substrate holder; In the tilted state of the substrate holder, rotate the substrate holder at a first rotation speed; In a manner of supplying the liquid to the contact member, the liquid is discharged toward the substrate holder rotated at the first rotational speed; Stop spitting out the aforementioned liquid; Before or within a specified time after stopping the spitting out of the liquid, start to tilt the substrate holder less toward the horizontal position; In a state where the substrate holder is in the horizontal position, the substrate holder is rotated at a second rotation speed faster than the first rotation speed; Stop the rotation of the substrate holder at the second rotation speed; The substrate holder mounts the substrate before the rotation is stopped; and The aforementioned substrate is subjected to the aforementioned plating treatment after installation. Such as the plating method of claim 1, wherein the aforementioned specified time is less than 2 seconds. The plating method of claim 1, wherein the second rotation speed is above 30 rpm. The plating method of claim 1, wherein the first rotation speed is between 8 rpm and 15 rpm. The plating method according to any one of claims 1 to 4, wherein after forming the state of the substrate holder in the horizontal position and before rotating the substrate holder at the second rotation speed, further comprising: In the device, the step of moving a member opposing the contact point member away from the contact point member. The plating method according to any one of claims 1 to 4, wherein before the step of discharging the liquid, the liquid is discharged toward a plate that presses the substrate when the substrate is placed in the substrate holder. The plating method according to any one of claims 1 to 4, wherein the step before discharging the liquid is performed so that the collision position of the substrate holder where the liquid collides with the substrate holder before discharging the liquid is tilted from The substrate holder is rotated in such a manner that the lower end of the substrate holder is directed toward the upper end by a velocity component. The plating method according to claim 7, wherein before the step of discharging the liquid, the liquid is discharged at the collision position in such a manner that the liquid has a velocity component in the same direction as the rotation direction of the substrate holder. The plating method according to claim 8, wherein before the step of discharging the liquid, the liquid is discharged from the discharge port along a plane extending toward the upper end side of the substrate holder. The plating method according to any one of claims 1 to 4, wherein the conductivity of the aforementioned liquid is below a specified value or has been degassed. A plating device is provided with: a substrate holder, which includes a contact member that can conductively contact the substrate; and a control device; the aforementioned control device is based on Tilt the aforementioned substrate holder, In the tilted state of the substrate holder, the substrate holder is rotated at a first rotation speed, The liquid is discharged toward the substrate holder rotated at the first rotational speed in a manner of supplying the liquid to the contact member, Stop the aforementioned spitting out the aforementioned liquid, Before or within a specified time after stopping the spouting of the liquid, start to tilt the substrate holder less toward the horizontal position, With the substrate holder in the horizontal position, the substrate holder is rotated at a second rotational speed faster than the first rotational speed, Stop the rotation of the substrate holder at the second rotation speed, The substrate holder mounts the substrate before the rotation is stopped, It is configured by performing the above-mentioned plating treatment on the above-mentioned substrate after mounting.

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