TW202403954A - Substrate transfer system characterized by precisely regulating the moving direction and position of a substrate to prevent surface damage of the substrate during the process of using a substrate transfer robot to transfer the substrates such as wafers - Google Patents

Abstract

The present invention discloses a substrate transfer system. The substrate transfer system is related to a technique that is capable of precisely regulating the moving direction and position of a substrate to prevent surface damage of the substrate during the process of transferring substrates such as wafers, by using a substrate transfer robot to deposit the substrate into a conveyance container (such as a front opening unified pod, FOUP) or to take the substrate out of the conveyance container. The substrate transfer system includes: a conveyance container having an internal space to store substrates; a substrate transfer robot that includes an end effector used to arrange the substrates and is used to deposit the substrates into the conveyance container or take the substrates out of the conveyance container; a measuring unit arranged at the upper side or lower side of the internal space of the conveyance container and used to measure the motions of the substrate and the end effector; and a control unit that is based on the measurement values of the measuring unit to control the substrate transfer robot.

Description

Substrate transfer system

The present invention relates to a substrate transfer system, and more specifically, to a technology that can accurately measure and control the distance, movement direction and position between a substrate and a hand of a substrate transfer robot, that is, by providing a technology that can accurately measure and control High-precision positioning technology that optimizes the substrate transfer state of a substrate transfer robot to stably transfer substrates such as semiconductor wafers. The substrate transfer robot can be used to transfer substrates such as wafers to and from transfer containers (FOUP, etc.). (FOUP, etc.) to prevent damage to the surface of the substrate.

In the production process of semiconductor products, countless processes are required to produce finished products, and hundreds of thousands of logistics movements occur during the execution of the semiconductor manufacturing process.

In particular, for wafers and other substrates, multiple substrates are accommodated in a transportation container such as a front opening unified pod (FOUP) or a front opening shipping box (FOSB) and transported through the air. Overhead Hoist Transfer (OHT) is a logistics transfer system that transports containers from any port to the destination port.

When a substrate transfer robot receives a substrate at a specific port into a transport container or takes a substrate out of a transport container, the surface of the substrate may be damaged.

For example, when various factors such as the substrate placement position on the end effector (End Effector) of the substrate transfer robot, the movement of the end effector, and the substrate placement position on the substrate placement groove of the transport container are not accurately adjusted, it may cause Substrate surface damage.

For semiconductor components produced through ultra-fine processes, minute damage to the surface of the substrate will directly lead to product defects, thus causing a decline in the yield of the entire semiconductor manufacturing process.

Therefore, more precise measurement and control are required to prevent damage to the surface of substrates such as wafers during their transportation.

In order to solve these problems, the existing technology proposes a method of using a special jig to detect whether a substrate such as a wafer is placed at an accurate position inside a transport container, and thereby correcting the manipulation position of the transfer robot to measure the accurate position. However, there may be differences between the fixture environment and the actual process environment, so there are limitations in detecting the causes of errors that may occur in the end effector of the substrate transfer robot during the transfer of substrates such as wafers. That is, it should be possible to operate in the actual process environment as much as possible. However, existing technology has limitations when errors need to be observed during dynamic motion.

The present invention is proposed to solve the problems of the prior art as described above, and aims to provide a method for detecting substrates or terminals during the process of taking out wafers and other substrates from a transfer container through a substrate transfer robot or accommodating wafers and other substrates into a transfer container. The movement of the actuator is precisely measured and controlled to prevent damage to the surface of the substrate when the substrate is transported.

In particular, an object of the present invention is to solve the problem of the substrate placement position on the end effector of the substrate transfer robot, the movement of the end effector, and the transfer container when the substrate is loaded into or taken out of the transfer container by the substrate transfer robot. Various factors such as the substrate placement position on the substrate placement slot are not accurately adjusted, resulting in surface damage to the substrate.

Furthermore, an object of the present invention is to solve the problem of product defects and a decrease in the yield of the entire semiconductor manufacturing process due to micro-damage on the substrate surface of semiconductor elements produced through ultra-fine processes.

The objects of the present invention are not limited to the above contents, and other objects and advantages of the present invention not mentioned can be understood from the following description.

According to an embodiment of the substrate transfer system of the present invention, the substrate transfer system may include: a transport container having an internal space for storing substrates; a substrate transfer robot including an end effector (End Effector) for placing the substrate, used to accommodate the substrate into the transport container or take out the substrate from the transport container; a measuring unit, disposed on the upper or lower side of the internal space of the transport container, used to measure the movement of the substrate and the end effector ; and a control unit that controls the substrate transfer robot based on the measurement value of the measurement unit.

Preferably, the measurement unit may include: at least two photographic lenses, spaced apart from each other and used to photograph the movement of the substrate or the end effector; and a ranging sensor, used to measure the distance between the base plate or the end effector. Actuator distance.

As an example, the measurement unit may include: a first photography lens for tracking the movement of the end of the end effector; a second photography lens for tracking the movement of the substrate; and a laser ranging sensor. It is used to measure the separation distance and change amount from the substrate or the end effector in the internal space of the transportation container.

Further, the control unit may measure, through the measurement unit, the movement of the substrate transfer robot to accommodate the reference substrate corresponding to the substrate to be transferred into the internal space of the transport container or to remove it from the transport container, Furthermore, three-dimensional transfer coordinate data regarding the position and direction of the end effector and the position and direction of the reference substrate are acquired, and teaching data for substrate transfer is acquired based on the three-dimensional transfer coordinate data.

As an example, the surface of the reference substrate is provided with a plurality of marks with identification marks, and the first photographic lens acquires a first photographed image of the end of the end effector just before the reference substrate is placed, so The second photographic lens acquires a second photographed image of at least one mark provided on the reference substrate, and the laser ranging sensor measures the distance of the substrate or the end effector in the internal space of the transport container. The control unit extracts the ROI based on the end of the end effector from the first captured image and extracts the ROI based on the mark of the reference substrate from the second captured image. ROI obtains the transmission coordinate data of the X-axis and Y-axis, obtains the transmission coordinate data of the Z-axis based on the height and the height change, and collects three-dimensional transmission coordinate data for substrate transportation based on the obtained transmission coordinate data.

As an example, the control unit can calculate a model hyper-plane (Hyper-plane) based on the collected three-dimensional transmission coordinate data, and obtain teaching data by estimating the position and direction of the reference substrate on the model hyper-plane.

As an example, the control unit may extract feature points from the first captured image, estimate a transformation matrix through matching between the feature points, and determine the reference substrate and the reference base through coordinate transformation of the matrix. Geometric relationships between substrates and obtaining teaching materials based on the geometric relationships.

According to the present invention as described above, it is possible to detect and precisely control the movement of the substrate and the end effector during the process of taking out wafers and other substrates from the transfer container through the substrate transfer robot or accommodating the wafers and other substrates into the transfer container, thereby This prevents damage to the substrate surface when transporting the substrate.

In particular, when the substrate transfer robot accommodates the substrate into the transfer container or takes the substrate out of the transfer container, the substrate placement position on the end effector of the substrate transfer robot, the movement of the end effector, and the transfer container are precisely measured and controlled. Various factors such as the substrate placement position on the substrate placement groove enable the substrate to be transported stably without damaging the substrate surface.

Furthermore, by solving the problem of producing a large number of defective products due to micro-damage on the substrate surface of semiconductor components produced through ultra-fine processes, the overall process yield can be improved.

The effects of the present invention are not limited to the above-mentioned effects, and other effects not mentioned will be clearly understood by those of ordinary skill in the technical field to which the present invention belongs from the following description.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, but the present invention is not limited to these embodiments.

In order to describe the present invention, its operational advantages and the objects achieved through embodiments of the present invention, preferred embodiments of the present invention will be shown and described in conjunction with the preferred embodiments.

First of all, the terms used in the present invention are only used to describe specific embodiments, but not to limit the present invention. Unless the context clearly indicates otherwise, singular expressions may include plural expressions. In addition, it should be understood that in the present invention, terms such as "comprising" or "having" are intended to mean having the features, numbers, steps, operations, components, accessories or combinations thereof described in the specification, but do not exclude having or adding at least The possibility of one other feature, number, step, operation, component, accessory or combination thereof.

In describing the present invention, if detailed description of related known structures or functions is considered to deviate from the gist of the present invention, the detailed description thereof will be omitted.

The present invention provides a method that can accurately measure and control the moving direction and position of a substrate, thereby preventing the substrate from being transferred to or from a transfer container (FOUP, etc.) by a substrate transfer robot. Technology in which the substrate surface is damaged.

In particular, in the present invention, three-dimensional transfer coordinate data is acquired by estimating the positions and directions of the reference substrate and the end effector, and teaching for actual substrate transfer is performed based on the three-dimensional transfer coordinate data, thereby enabling precise control of the transfer of the substrate. transmission location and direction.

Figure 1 shows a schematic structural diagram of an embodiment of a substrate transfer system according to the present invention.

The substrate transfer system may include a transport container 100, a measurement unit 150, a substrate transfer robot 200, a control unit 300, and the like.

The transfer container 100 may store wafers waiting to transfer substrates, and the substrate transfer robot 200 may be driven to accommodate the substrates to be transferred into or take out the substrates from the transfer container 100 . At this time, the measurement unit 150 can measure the motion of the substrate W and the substrate transfer robot 200 .

The substrate transfer robot 200 may include an arm 220 capable of multi-stage operation and an end effector 210 provided at an end of the arm 220 to place the substrate W thereon.

The substrate transfer robot 200 can accommodate the substrate W mounted on the end effector 210 into the transport container 100 through the operation of the arm 220 , or take out the substrate W stored in the transport container 100 while being mounted on the end effector 210 . .

The control unit 300 may control the operation of the substrate transfer robot 200 based on the measurement value of the measurement unit 150 .

In particular, the control unit 300 may acquire three-dimensional transfer coordinate data for operation of the substrate transfer robot 200 using a reference substrate, and may perform teaching for substrate transfer based on the three-dimensional transfer coordinate data.

Regarding the transport container 100 and the measurement unit 150, FIG. 2 shows an embodiment of the measurement unit provided in the transport container of the present invention.

In this embodiment, the transportation container 100 is described by taking a front opening unified pod (FOUP) as an example. However, the present invention is not limited thereto and can be applied to transporting various transportation containers.

The wafers used in the semiconductor manufacturing process have standardized sizes specified by Semiconductor Equipment and Materials International (SEMI). Therefore, such as front opening unified pod (FOUP) and front opening unified pod (FOUP). The size of the transport container 100 such as a front opening shipping box (FOSB) can also be standardized according to the size of the wafer to be transported. Of course, the present invention can also be applied to the transportation of non-standardized transportation containers.

The transport container 100 includes a container body 110 and a container door (not shown). The container body 110 is provided with an internal space 111 for storing transport objects such as wafers. As an example, a plurality of slots 113 may be provided on a side wall of the interior space 111 of the transport container 100 for storing wafers, and a plurality of wafers can be sequentially inserted and stacked in the plurality of slots 113 . The front of the container body 110 can be opened or closed through a container door (not shown).

This transportation container 100 can be transported by an overhead hoist transfer (OHT) or the like.

The transportation container 100 may include a measurement unit 150 , and the measurement unit 150 may be provided on a lower side of the inner space 111 of the transportation container 100 . Depending on the situation, the measurement unit 150 may be provided on the upper side or the side of the internal space 111 of the transportation container 100 .

The main body 151 of the measurement unit 150 may include two or more photographic lenses 153, a distance measuring sensor 155, and the like.

The photographic lens 153 may include a focus module including the photographic lens and a motor and controller for adjusting focus.

As an example, the first photographing lens 153a may be disposed corresponding to the tip of the end effector of the substrate transfer robot 200 and provide a first photographed image tracking the movement of the tip of the end effector by photographing the tip of the end effector.

Furthermore, the second photographing lens 153b may be disposed corresponding to a portion of the substrate that is not covered by the end effector, and provides a second photographed image that tracks the movement of the substrate by photographing the substrate.

In addition, the ranging sensor 155 can measure the distance to the substrate or the end effector, for example, by applying a laser ranging sensor to measure the distance between the internal space 111 of the handling container 100 and the substrate or the end effector. The separation distance or amount of change.

The number and arrangement position of the photographic lenses 153 provided in the measurement unit 150 can be changed as needed, and the number and arrangement position of the ranging sensors 155 can also be changed as needed.

3 shows an example of using a measurement unit to measure the position and direction of the substrate and the end effector when the substrate is transported by the substrate transport robot in the present invention.

The first photographing lens 153a of the measurement unit 150 can acquire a first photographed image of the ends 211a and 211b of the end effector 210 in a state where the substrate W is about to be placed in front of the end effector 210. In this embodiment, the measurement unit 150 is provided with a first photographic lens 153a for acquiring a first photographed image of an end 211a of the end effector 210. However, two first photographic lenses may be provided to acquire respectively. A first captured image of the two ends 211a and 211b of the end effector 210.

In addition, the second photography lens 153b of the measurement unit 150 may capture a portion of the substrate W that is not covered by the end effector 210 to obtain a second captured image of the substrate W when the substrate W is about to be placed on the end effector 210 .

Furthermore, the distance measuring sensor 155 of the measurement unit 150 can measure the separation distance and variation between the substrate W and the end effector 210 when the substrate W is placed in front of the end effector 210 or in a moving state in the internal space 111 of the transportation container 100 .

In the present invention, the motion of the substrate and the end effector can be measured for precise control through this configuration of the measurement unit 150, that is, the reference substrate for substrate transfer can be obtained by using the reference substrate before transferring the actual substrate to be transferred. Three-dimensional transmission coordinate data and teaching based on the three-dimensional transmission coordinate data.

FIG. 4 shows an example of a reference substrate used for acquiring teaching materials in the present invention and an ROI of a captured image.

The reference substrate 400 has the same specifications as the substrate to be transferred, and can be manufactured with low reflective properties in order to properly perform optical measurements.

A plurality of marks 401 for identification may be provided on the surface of the reference substrate 400 .

Each of the plurality of marks 401 has a determined position on the reference substrate 400, so the position of the corresponding mark 401 on the reference substrate 400 can be determined through the identification mark of the mark 401.

The substrate transfer robot may acquire a first photographed image of the tip of the end effector through the first photographing lens when transferring the reference substrate 400, and may extract the ROI 420 based on the tip of the end effector from the first photographed image.

Furthermore, a second photographed image of the reference substrate 400 may be acquired through the second photographing lens of the measurement unit, and the ROI 420 including the plurality of markers 401 may be extracted from the second photographed image. Preferably, the ROI 420 can be adjusted to be able to detect at least three marks 401 in order to accurately determine the position of the reference substrate. The position of the mark 410 on the reference substrate 400 can be determined by identifying the identification mark of the mark 401 on the ROI 420, and by identifying three or more marks 410, the direction and position of the reference substrate 400 can be accurately determined.

In the present invention, the control unit can use the above-described reference substrate to obtain three-dimensional transmission coordinate data, and perform teaching of substrate transmission based on the three-dimensional transmission coordinate data. The method of obtaining teaching data will be understood below in conjunction with the embodiment of the substrate transmission system of the present invention. Process.

The embodiments described below are based on the premise that the measurement unit is used to measure the motion of the substrate transfer robot to accommodate the reference substrate corresponding to the substrate to be transferred into the internal space of the transport container or to remove it from the transport container.

5 and 6 illustrate an example of obtaining teaching data by estimating the position and direction of a reference substrate in the substrate transfer system according to the present invention.

The measurement unit 150 may acquire the second photographed image of the reference substrate 400 just before the substrate transfer robot 200 transfers the reference substrate 400 . In addition, the control unit 300 may extract the ROI including the plurality of markers 401 from the second captured image, and detect at least three markers 401 on the ROI (step S110 ).

The control unit 300 may identify the identification mark of the detected mark 401 and identify the X coordinate and Y coordinate position of the specific reference position of the reference substrate through the preset mark outline (step S120 ).

Moreover, since the size of the mark 401 is preset, the control unit 300 can determine the height distance Z coordinate based on the relative size of the mark 401 on the ROI. Furthermore, the control unit 300 can determine the height distance Z coordinate based on the distance measured by the ranging sensor of the measurement unit 150 . The measured value is used to determine the height distance Z coordinate (step S130).

The control unit 300 may collect data on the X coordinate value, Y coordinate value and Z coordinate value of each mark 401 (step S140), and calculate a model hyperplane (Hyper-plane) based on the collected data (step S150).

For example, 3D data of three or more markers can be collected and the position of each marker represented as a point in 3D space. Moreover, the hyperplane of each point can be calculated through the plane with the smallest normal vector size of any two-dimensional plane.

Furthermore, since the hyperplane is a two-dimensional plane, various linear regression (Linear Regression) methods such as Ordinary Least Square (OLS) can be applied.

It can be assumed that the reference substrate moves on the hyperplane, and the actual position and direction of the reference substrate on the hyperplane can be inferred (step S160), that is, its posture is estimated. Among them, the position and direction of the reference substrate can be inferred based on the points projected on the X-Y plane of the hyperplane.

The reference coordinates of each mark on the reference substrate at the corresponding position on the reference substrate have been predetermined, so coordinate data related to substrate transfer can be obtained by analyzing the movement and rotation relationship of the mark based on the position of the mark on the hyperplane. At this time, the movement of the marker can be determined by the distance between the centers of gravity of the two sets of points, and by calculating the angle between the center points using trigonometric functions (arctan) or by applying a Least Square method such as the Kabsch algorithm. Method) algorithm to obtain the optimal rotation matrix, etc. to calculate the movement of the marker.

For example, as shown in FIG. 6 , the movement and rotation relationships of four markers ID0 to ID3 (401a, 401b, 401c, 401d) included in the ROI can be determined on the hyperplane, and thereby the predetermined parameters for the virtual reference substrate 450 can be determined. Estimated reference substrate 460 position and orientation.

Through these processes, it is possible to confirm the movement and rotation between the reference coordinates and the measurement coordinates of each mark on the reference substrate, and thereby estimate the position and direction of the reference substrate.

In addition, the control unit 300 may apply the estimated coordinates of the reference substrate as teaching data (step S170 ).

7 and 8 illustrate examples of obtaining teaching data by estimating the position and direction of an end effector in the substrate transfer system according to the present invention.

The measurement unit 150 may acquire the first photographed image of the end effector 210 when the substrate transfer robot 200 transfers the reference substrate 400 . In addition, the control unit 300 may extract the ROI including the end of the end effector 210 from the first captured image.

The control unit 300 performs image preprocessing on the extracted ROI (step S210 ). As an example, the distortion of the image can be corrected based on the photography lens parameters and the outline of the end effector can be detected.

In addition, the control unit 300 may extract feature points for identifying the end effector from the preprocessed image (step S220), and match the preset outline data of the end effector (step S230) with the extracted feature points (step S230). Step S240).

Among them, when matching feature points, the transformation matrix can be estimated through matching between feature points (pair-wise). However, since the feature points of the image to be compared do not necessarily match each other 1:1, it is also possible Matching is performed by applying regional feature point extraction methods such as ORB, SURF, SIFT or BRISK. In addition, feature point matching can also be performed by applying various algorithms such as Brute-Force Matcher (BF) or Fast Library for Approximate Nearest Neighbors Matching (FLANN).

In addition, the control unit 300 may perform coordinate transformation (step S250) on the extracted feature points to determine geometric relationships.

When determining the coordinates of feature points, since the end effector has no reference coordinates, the coordinates estimated through the reference substrate can be used.

For example, as shown in FIG. 8 , the positions of the center point of the measurement unit 150, the first photography lens 153a, and the second photography lens 153b are fixed. Therefore, the coordinate information C0, C1, and C2 can be known, and can be estimated through the above-mentioned reference substrate. Position and orientation steps to obtain the estimated coordinate C4 of the reference substrate.

The control unit 300 can determine the coordinate information C3 of the end effector through the predetermined coordinate information C0, C1, C2 and C4 and the geometric relationship related to the relative position of the end effector.

The control unit 300 may estimate the position and direction of the end effector based on the determined coordinate information of the end effector (step S260 ).

In addition, the control unit 300 may apply the estimated coordinates of the end effector as teaching data (S270).

The substrate transfer system according to the present invention can obtain the teaching data required when the substrate transfer robot accommodates wafers and other substrates into a transfer container or takes out wafers and other substrates from the transfer container through the above-described technical configuration, and is based on the teaching data to carry out the teachings.

In particular, the present invention can detect and precisely control the movement of the substrate and the end effector during the process of taking out wafers and other substrates from the transfer container through the substrate transfer robot or accommodating the wafer and other substrates into the transfer container, thereby preventing the transfer of the substrate. may cause damage to the substrate surface.

Furthermore, by solving the problem of producing a large number of defective products due to micro-damage on the substrate surface of semiconductor components produced through ultra-fine processes, the overall process yield can be improved.

The above description is only an exemplary description of the technical idea of the present invention. For those of ordinary skill in the technical field to which the present invention belongs, various modifications and changes can be made without departing from the essential characteristics of the present invention. Therefore, the embodiments described in the present invention are only used to describe the present invention and are not intended to limit the technical spirit of the present invention, and the technical spirit of the present invention is not limited by these embodiments. The protection scope of the present invention shall be subject to the scope of the attached patent application, and all technical ideas within the equivalent scope shall be deemed to be included in the scope of the present invention.

100:Transportation container 110: Container body 111:Internal space 113:Slot 150:Measurement unit 151:Subject 153:Photography lens 153a: First photographic lens 153b: Second camera lens 155:Ranging sensor 200:Substrate transfer robot 210: End effector 211:end 211a: end 211b: end 220: arm 300:Control unit 400: Reference substrate 401: mark 401a: Tag 401b: mark 401c: Tag 401d: mark 410: mark 420:ROI (attention area) 450:Virtual reference substrate 460: Reference substrate C0: Coordinate information C1:Coordinate information C2: Coordinate information C3: Coordinate information C4: Coordinate information ID:mark ID0~ID9: mark R,t: moving and rotating coordinate data ROI: attention area W: substrate X:X coordinate data Xref: reference position X coordinate data Y:Y coordinate data Yref: reference position Y coordinate data Z:Z coordinate data S110~S170: steps S210~S270: steps

Figure 1 shows a schematic structural diagram of an embodiment of a substrate transfer system according to the present invention. Figure 2 shows an embodiment of a measuring unit arranged in a transport container of the present invention. FIG. 3 shows an example of using a measurement unit to measure the position and direction of the substrate and the end effector when the substrate is transported by the substrate transport robot in the present invention. FIG. 4 shows an example of a reference substrate used for acquiring teaching materials in the present invention and an ROI of a captured image. 5 and 6 illustrate an example of obtaining teaching data by estimating the position and direction of a reference substrate in the substrate transfer system according to the present invention. 7 and 8 illustrate examples of obtaining teaching data by estimating the position and direction of an end effector in the substrate transfer system according to the present invention.

100:Transportation container

110: Container body

150:Measurement unit

200:Substrate transfer robot

210: End effector

220: arm

300:Control unit

W: substrate

Claims (7)

A substrate transfer system, which includes: A shipping container having an interior space for storing substrates; A substrate transfer robot, including an end effector for placing the substrate, for accommodating the substrate into the transport container or taking out the substrate from the transport container; A measuring unit, disposed on the upper or lower side of the internal space of the transport container, for measuring the movement of the base plate and the end effector; and A control unit controls the substrate transfer robot based on the measurement value of the measurement unit. The substrate transfer system according to claim 1, wherein the measurement unit includes: At least two photographic lenses spaced apart from each other for photographing the movement of the substrate or the end effector; and A distance sensor used to measure the distance to the substrate or the end effector. The substrate transfer system according to claim 1, wherein the measurement unit includes: a first photographic lens used to track the movement of the end of the end effector; a second camera lens for tracking the movement of the substrate; and A laser ranging sensor is used to measure the separation distance and change amount from the substrate or the end effector in the internal space of the transportation container. The substrate transfer system as claimed in claim 3, wherein, The control unit measures, through the measurement unit, the movement of the substrate transfer robot in accommodating the reference substrate corresponding to the substrate to be transferred into the internal space of the transfer container or taking it out of the transfer container, and obtains information about The three-dimensional transfer coordinate data of the position and direction of the end effector and the position and direction of the reference substrate are used to obtain teaching data for substrate transfer based on the three-dimensional transfer coordinate data. The substrate transfer system as claimed in claim 4, wherein, The surface of the reference substrate is provided with a plurality of marks with identification marks, The first photographic lens acquires a first photographed image of the end of the end effector just before the reference substrate is placed, The second photographic lens acquires a second photographed image of at least one mark provided on the reference substrate, The laser ranging sensor measures the height and height change of the substrate or the end effector in the internal space of the transport container; The control unit extracts the ROI (Region of Interest, attention area) based on the end of the end effector from the first captured image and extracts the ROI based on the reference substrate from the second captured image. The marked ROI is used to obtain the transmission coordinate data of the X-axis and Y-axis, and the transmission coordinate data of the Z-axis is obtained based on the height and height change amount, and the three-dimensional transmission coordinates for substrate transportation are collected based on the obtained transmission coordinate data. material. The substrate transfer system as claimed in claim 5, wherein, The control unit calculates a model hyperplane based on the collected three-dimensional transmission coordinate data, and obtains teaching data by estimating the position and direction of the reference substrate on the model hyperplane. The substrate transfer system as claimed in claim 5, wherein, The control unit extracts feature points from the first captured image, estimates a transformation matrix through matching between the feature points, and determines the reference substrate and the reference base through coordinate transformation of the matrix. Geometric relationships between substrates and obtaining teaching materials based on the geometric relationships.

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