TW202403810A - Protection element and method of manufacturing the same - Google Patents

Abstract

The present disclosure relates to a protection element. The protection element includes a substrate, a first electrode disposed on the substrate and having a first extending portion, a second electrode disposed on the substrate and spaced apart from the first electrode, and a heating element disposed between the first electrode and the second electrode. The protection element also includes a fusible conductor connecting between the first electrode and the second electrode. The fusible conductor is configured to be fused and cut off by heat from the heating element. At least a part of the first extending portion of the first electrode is disposed between the substrate and the heating element and contacting the heating element. The present disclosure also relates to a method of manufacturing a protection element.

Description

Protection element and manufacturing method thereof

The present invention relates to a protective element and a manufacturing method thereof. Specifically, it relates to a protective element in which a fusible conductor is melted by heating of a heating element to block a current path.

In the protection circuit of electronic devices (such as lithium-ion batteries or other secondary batteries), protection components with overcurrent and overvoltage protection functions can be used. The fusible conductor of the protection element can be fused when the current exceeds the rated value; and when the voltage exceeds the rated value, the fusible conductor can be fused by heating the heating element to achieve the effect of protecting the electronic device.

One embodiment of the present disclosure relates to a protection element including a substrate, a first electrode disposed on the substrate and having a first extension, a second electrode disposed on the substrate and spaced apart from the first electrode, and A heating element disposed between the first electrode and the second electrode. The protective element also includes a fusible conductor connected between the first electrode and the second electrode. The fusible conductor is configured to fuse by heat generated by the heating element. The first extending portion of the first electrode has at least a portion located between the heating element and the substrate and in contact with the heating element.

One embodiment of the present disclosure relates to a method of manufacturing a protective element, which includes providing a substrate; and forming a first electrode, a second electrode and a third electrode on the substrate. The first electrode has a first extending portion and the third electrode has a second extending portion. The manufacturing method also includes forming a heating element to cover the first extension part and the second extension part; and forming a soluble conductor connected between the first electrode and the second electrode.

FIG. 1A is a perspective view of a protection component 1 according to some embodiments of the present disclosure.

The protection element 1 may include a substrate 10, an electrode 11 (or a first electrode 11), an electrode 12 (a second electrode 12), an electrode 13 (a third electrode 13), an insulating layer 14 (a It is the first insulating layer 14), the heating element (for example, the heating element 15 shown in Figure 1B), the insulating layer 16 (or the second insulating layer 16), the solder resist layer 17a, the solder resist layer 17b, and the soluble conductor 18 and cover 19. In some embodiments, the heating element may be enclosed between the insulating layer 14 and the insulating layer 16 .

The protection element 1 can be applied in a protection circuit of an electronic device (such as a lithium-ion battery or other secondary battery). The electrodes 11 and 12 may be disposed at opposite ends or both sides of the substrate 10 . The electrode 11 and the electrode 12 can be electrically connected through the fusible conductor 18 . The soluble conductor 18 can be electrically connected to the circuit substrate of an external circuit (such as a protection circuit) through the electrode 11 and the electrode 12, and forms a part of the electrical path of the external circuit. When a current exceeding the rated value flows through the fusible conductor 18, the fusible conductor 18 fuses due to the heat generated by the current (ie, Joule heat).

The electrode 13 can be disposed at one end or one side of the substrate 10 and is separated from the electrodes 11 and 12 . The electrode 13 can electrically connect the heating element to the circuit board of the external circuit. When the voltage exceeds the rated value (for example, when the lithium-ion battery is overcharged), the fusible conductor 18 can be melted by the heating of the heating element to protect the electronics. The effect of the device.

FIG. 1B shows a top view of a protection component according to some embodiments of the present disclosure. In some embodiments, FIG. 1B is a top view of the protection component 1 of FIG. 1A. For the sake of simplicity, only the substrate 10, the electrode 11, the electrode 12, the electrode 13, the insulating layer 14 and the heating element 15 are depicted in FIG. 1B.

Referring to FIG. 1B , the substrate 10 may include an insulating substrate, such as a ceramic substrate, a glass substrate, a resin substrate, an insulated metal substrate, and the like. In some embodiments, the substrate 10 may include (but is not limited to) borosilicate glass (BPSG), undoped silicate glass (USG), silicon, silicon oxide ( silicon oxide), silicon nitride (silicon nitride), silicon oxynitride (silicon oxynitride), aluminum oxide (aluminum oxide), aluminum nitride (aluminum nitride), polyimide (PI), ABF substrate (Ajinomoto build-up film (ABF), molding compounds, pre-impregnated composite fibers (eg, prepreg materials), combinations thereof, or the like. Examples of molding rubbers may include, but are not limited to, epoxy resins (including fillers dispersed therein). Examples of prepregs may include, but are not limited to, multi-layer structures formed by stacking or laminating multiple prepregs and/or sheets. In some embodiments, the substrate 10 may include, but is not limited to, a circuit board (such as FR4). Substrate 10 may include surface 103 . In some embodiments, the surface 103 may include the sides, edges, surroundings or borders of the protective element 1 .

In some embodiments, the substrate 10 may include a through hole 10v1 (or a first through hole 10v1 ), a through hole 10v2 (or a second through hole 10v2 ), and a through hole 10v3 (or a third through hole 10v3 ). When viewed from a top view, the through hole 10v1 , the through hole 10v2 and the through hole 10v3 can be located below the electrode 11 , the electrode 12 and the electrode 13 respectively and are blocked, so they are represented by dotted lines.

In some embodiments, via 10v1 , via 10v2 , and via 10v3 may each be spaced apart from surface 103 . The through hole 10v1 , the through hole 10v2 and the through hole 10v3 can be respectively located within the surface 103 of the substrate 10 . The through hole 10v1 , the through hole 10v2 and the through hole 10v3 may be located within the boundaries of the substrate 10 respectively. For example, the through hole 10v1 , the through hole 10v2 and the through hole 10v3 may not be exposed from the surface 103 of the substrate 10 respectively.

In some embodiments, the through hole 10v1, the through hole 10v2, and the through hole 10v3 may be electrically connected to the electrode 11, the electrode 12, and the electrode 13 respectively. In some embodiments, the through hole 10v1, the through hole 10v2 and the through hole 10v3 can respectively electrically connect the electrode 11, the electrode 12 and the electrode 13 to an external terminal (such as the external terminal 11b, the external terminal 12b shown in FIG. 1D and the external terminal 12b in FIG. 1D). External terminal 13b shown in 1E).

In some embodiments, the through hole 10v1 , the through hole 10v2 and the through hole 10v3 may respectively include (but are not limited to) copper (Cu), gold (Au), silver (Ag), aluminum (Al), nickel (Ni), Titanium (Ti), tungsten (W), chromium (Cr), tin (Sn), or other metals or alloys. For example, in some embodiments, the alloy may include nickel-chromium alloys (eg, nickel-chromium aluminum, nickel-chromium silicon), nickel-copper alloys (eg, nickel-copper-manganese), and the like. In some embodiments, the electrode 11 and the electrode 12 can be connected to two through holes respectively, and the electrode 13 can be connected to one through hole. In some embodiments, the size, number and position of the through holes can be adjusted according to the rated current of the protection element 1 . For example, the electrode 11 and the electrode 12 may be connected to three or more through holes respectively. For example, electrode 13 may connect two or more vias.

As shown in FIG. 1B , the electrodes 11 , 12 and 13 may be close to three adjacent sides or sides of the substrate 10 . For example, the electrode 12 is close to the left side of the substrate 10 , the electrode 13 is close to the lower side of the substrate 10 , and the electrode 11 is close to the right side and the upper side of the substrate 10 .

In some embodiments, electrode 11 may include a composite electrode. For example, the electrode 11 may be close to two adjacent sides of the substrate 10 (eg, the right side and the upper side). The electrodes 11 may extend along two adjacent sides of the substrate 10 . The electrode 11 may extend from one side of the substrate 10 to the other adjacent side.

The electrode 11 may have an extension portion 11e (also referred to as a first extension portion 11e). The extension portion 11 e may extend from the electrode 11 toward the direction of the electrode 12 (for example, toward the X-axis direction in FIG. 1B ) and extend toward the direction of the electrode 13 (for example, toward the opposite direction of the Y-axis in FIG. 1B ). The extension portion 11e may have a corner. The extending portion 11e may have two extending directions.

The extension portion 11e may have a portion located between the insulating layer 14 and the heating element 15 . For example, the extension portion 11 e may have a portion that contacts (for example, directly contacts) the insulating layer 14 and the heating element 15 . For example, the extension portion 11 e may have a portion extending below the heating element 15 and have an end portion exposed from the heating element 15 . In some embodiments, the width of the portion of the extension portion 11e located below the heating element 15 may be constant or consistent. For example, the portion of the extension portion 11e located below the heating element 15 may be in a rectangular shape. The extension direction of the extension portion 11e may include the long side of the rectangle.

The electrode 13 may have an extension portion 13e (or referred to as a second extension portion 13e). The extension portion 13 e may extend from the electrode 13 toward the direction of the electrode 11 (for example, toward the Y-axis direction in FIG. 1B ).

The extension portion 13e may have a portion located between the insulating layer 14 and the heating element 15 . For example, the extension portion 13e may have a portion that contacts (for example, directly contacts) the insulating layer 14 and the heating element 15 . For example, the extension portion 13e may have a portion extending below the heating element 15 and have an end portion exposed from the heating element 15 . In some embodiments, the width of the portion of the extension portion 13e located below the heating element 15 may be constant or consistent. For example, the portion of the extension portion 13e located below the heating element 15 may be in a rectangular shape. The extending direction of the extending portion 13e may include the long side of the rectangle.

In some embodiments, the extension portion 11e and the extension portion 13e may extend in opposite directions. In some embodiments, the extension portion 11 e and the extension portion 13 e may be located at opposite ends or both sides of the heating element 15 . In some embodiments, the extension portion 11 e and the extension portion 13 e may not have one end exposed from the heating element 15 . For example, the extension portion 11 e and the extension portion 13 e may extend below the heating element 15 and have edges covered by the heating element 15 or flush with the heating element 15 . In some embodiments, the extension portion 11e and the extension portion 13e may be configured to heat the heating element 15. In some embodiments, the electrode 11 and the electrode 13 can heat the heating element 15 through the extension portion 11e and the extension portion 13e.

In some embodiments, the electrodes 11 , 12 and 13 may respectively include (but are not limited to) copper (Cu), gold (Au), silver (Ag), aluminum (Al), nickel (Ni), titanium (Ti). ), tungsten (W), chromium (Cr), tin (Sn), or other metals or alloys. In some embodiments, for example, in the process steps shown in FIG. 2J , the electrodes 11 , 12 and 13 can be coated with nickel/gold (Ni/Au), nickel/lead/gold (Ni/Pb/Au). ), or nickel/lead (Ni/Pb) coating film to prevent electrode oxidation and avoid changes in the rated current value or rated voltage value due to electrode oxidation. As shown in FIG. 2J , the portions of the extension portion 11 e and the extension portion 13 e covered by the insulating layer 16 are not coated with a coating film.

Continuing to refer to FIG. 1B , the insulating layer 14 may be located above the substrate 10 and between the substrate 10 and the heating element 15 . A portion of the extension portion 11e and a portion of the extension portion 13e may extend above the insulation layer 14 .

In some embodiments, the insulating layer 14 may include (but is not limited to) epoxy (including fillers dispersed therein), film plastic, silicon, or other materials applicable to substrate materials such as ceramic, glass, resin, etc. In some embodiments, insulating layer 14 may be heat resistant, such as to withstand the heat of meltable conductor 18 when it fuses. In some embodiments, the insulating layer 14 may separate the heating element 15 from the substrate 10 . In some embodiments, the insulating layer 14 can separate the electrode 11 , the electrode 12 and the electrode 13 to avoid micro-short circuits and improve device stability. In some embodiments, the insulating layer 14 can block or reduce the heat dissipation through the substrate 10 to ensure that when the voltage exceeds the rated value, the heating element 15 can be heated to cause the fusible conductor 18 to melt instantly to protect the circuit and reduce the cost of the electronic device. risk of damage.

The heating element 15 may be located above the insulation layer 14 . The heating element 15 may contact (for example, directly contact) the insulating layer 14 . The heating element 15 may cover a part of the extension part 11e and a part of the extension part 13e. The heating element 15 may include a material that can generate heat by being energized. In some embodiments, the heating element 15 may include (but is not limited to) tungsten (W), molybdenum (Mo), ruthenium (Ru), chromium (Cr), silver (Ag), ruthenium oxide (RuO or RuO ₂ ) or Other metals, alloys or metal oxides.

FIG. 1C shows an equivalent circuit diagram of a protection device according to some embodiments of the present disclosure. In some embodiments, FIG. 1C is an equivalent circuit diagram of the protection component 1 of FIG. 1A. For the sake of simplicity, only electrodes 11 , 12 , 13 and soluble conductor 18 are depicted in FIG. 1B .

Referring to FIGS. 1B and 1C , electrodes 11 , 12 , and 13 each have terminals or endpoints electrically connected to the circuit board of the external circuit. The electrode 13 can be electrically connected to the electrode 11 through the extension part 13e, the heating element 15 and the extension part 11e. A heating element resistance can be formed between the electrode 13 and the electrode 11. When the voltage exceeds the rated value, the fusible conductor 18 can be heated by the heating element resistance and fuse. In some embodiments, fusible conductor 18 may not be directly electrically connected to the heater resistor. For example, fusible conductor 18 may not directly contact the heater resistor. For example, the fusible conductor 18 may be indirectly connected to the heating element resistor via the electrode 11 .

1D and 1E are side views of a protection component according to some embodiments of the present disclosure. In some embodiments, FIG. 1D and FIG. 1E are respectively cross-sectional views of the protection component 1 of FIG. 1A cut along tangent line AA' and tangent line BB'.

Referring to FIGS. 1D and 1E , the substrate 10 has a surface 101 , a surface 102 opposite the surface 101 , and a surface 103 extending between the surface 101 and the surface 102 . In some embodiments, the through hole 10v1 , the through hole 10v2 and the through hole 10v3 can respectively penetrate the substrate 10 . The through hole 10v1, the through hole 10v2 and the through hole 10v3 may extend between the surface 101 and the surface 102 respectively. Via 10v1 , via 10v2 and via 10v3 may be exposed from surface 101 and surface 102 respectively.

The electrodes 11 , 12 and 13 may be disposed on or located on the surface 101 of the substrate 10 . The electrode 11 can be electrically connected to the external terminal 11b (also referred to as the first external terminal 11b) through the through hole 10v1. The electrode 12 can be electrically connected to the external terminal 12b (also referred to as the second external terminal 12b) through the through hole 10v2. The electrode 13 can be electrically connected to the external terminal 13b (also referred to as the third external terminal 13b) through the through hole 10v3. The external terminals 11b, 12b, and 13b may be located on the surface 102 of the substrate 10. The external terminals 11b, 12b and 13b can be used as terminals or endpoints electrically connected to the circuit board of the external circuit.

The insulating layer 14 may be disposed on or located on the surface 101 of the substrate 10 . The insulating layer 14 may be located between the electrode 11 and the electrode 12 . The insulating layer 14 may have two opposite ends covered by the electrode 11 and the electrode 12 respectively. The extension portion 11e and the extension portion 13e may be disposed on or located on the insulating layer 14. The extension portion 11e and the extension portion 13e may be covered by the heating element 15 and in contact with the heating element 15 .

In some embodiments, the extension portion 11 e may have a side surface coplanar with the side surface of the heating element 15 . The side surfaces of the extension portion 11 e may be in contact with or covered by the insulating layer 16 . In some embodiments, the extension portion 11 e may have a bottom surface coplanar with the bottom surface of the heating element 15 . The bottom surface of the extension portion 11 e and the bottom surface of the heating element 15 can contact the top surface of the insulating layer 14 .

In some embodiments, the extension portion 13e may have a side surface that is coplanar with the side surface of the heating element 15 . The side surfaces of the extension portion 13e may be in contact with or covered by the insulating layer 16 . In some embodiments, the extension portion 13e may have a bottom surface that is coplanar with the bottom surface of the heating element 15 . The bottom surface of the extension part 13e and the bottom surface of the heating element 15 may contact the top surface of the insulating layer 14.

The insulating layer 16 can be disposed on or located on the insulating layer 14 and cover the heating element 15 . For example, the heating element 15 may be surrounded by the insulating layer 14 and the insulating layer 16 . In some embodiments, insulating layer 16 may separate heating element 15 from fusible conductor 18 . In some embodiments, the insulating layer 16 may contact or cover an edge of the electrode 11 and an edge of the electrode 12 . In some embodiments, the insulating layer 16 may include (but is not limited to) the materials listed above for the insulating layer 14 , which will not be described again here.

Meltable conductor 18 may be connected between electrode 11 and electrode 12 . In some embodiments, the contact area of soluble conductor 18 with electrode 11 is substantially equal to the contact area of soluble conductor 18 with electrode 12 .

In some embodiments, as shown in FIG. 1D , in the Z-axis direction (or the direction perpendicular to the surface 101 of the substrate 10 ), the heating element 15 may have a portion located between the soluble conductor 18 and the extension 11e. The heating element 15 may have a portion located between the soluble conductor 18 and the extension 13e. In some embodiments, as shown in FIG. 1D , no other conductive layer or conductive member may be included between the heating element 15 and the soluble conductor 18 in the Z-axis direction (or the direction perpendicular to the surface 101 of the substrate 10 ).

In some embodiments, fusible conductor 18 may include, but is not limited to, copper (Cu), tin (Sn), bismuth (Bi), silver (Ag), or other metals or alloys. In some embodiments, fusible conductor 18 may be configured to fuse by heat generated by heating element 15 . In some embodiments, the soluble conductor 18 may include a plurality of metal layers, such as a copper metal layer and a tin metal layer. In some embodiments, fusible conductor 18 may include a single metal layer or a single metal block. In some embodiments, fusible conductor 18 may include a single alloy layer or a single alloy block. In some embodiments, fusible conductor 18 may include a single melting point metal layer or a single melting point metal block. In some embodiments, the weight percent of copper in fusible conductor 18 may be 50%, 60%, 70%, 80%, 90%, or higher. In some embodiments, fusible conductor 18 may include pure copper. For example, the copper of soluble conductor 18 may directly contact electrodes 11 and 12 .

The solder mask layer 17a (or called the first solder mask layer 17a) and the solder mask layer 17b (or called the second solder mask layer 17b) may be disposed or located between the insulating layer 16 and the soluble conductor 18. The solder mask layer 17a and the solder mask layer 17b may be disposed on or under the fusible conductor 18. The solder mask layers 17 a and 17 b may contact (eg, directly contact) the fusible conductor 18 . The solder mask layer 17a and the solder mask layer 17b may be covered by the fusible conductor 18. The solder mask 17a may be provided adjacent to the electrode 11. The solder mask 17b may be disposed adjacent the electrode 12 . In some embodiments, solder mask layer 17a and solder mask layer 17b may be separated or spaced apart from each other.

In some embodiments, as shown in FIG. 1D , in the Z-axis direction (or the direction perpendicular to the surface 101 of the substrate 10 ), the solder mask 17 a and the extension 13 e may not overlap. However, in other embodiments, the solder mask 17a and the extension 13e may at least partially overlap.

In some embodiments, the solder mask layer 17a and the solder mask layer 17b may have an elongated rectangular shape. For example, as shown in FIG. 1A , the solder resist layer 17 a and the solder resist layer 17 b extend in the Y-axis direction. In some embodiments, solder mask 17 a and solder mask 17 b may extend beyond one side of fusible conductor 18 . For example, both ends of the solder mask 17a may be exposed from the soluble conductor 18. For example, both ends of the solder mask 17b may be exposed from the soluble conductor 18.

In some embodiments, the solder mask layer 17a and the solder mask layer 17b can be configured to segment or separate the molten fusible conductor 18 to reliably interrupt the circuit and make the fusing characteristics of the fusible conductor 18 more stable. . For example, the solder mask layer 17a and the solder mask layer 17b can divide the fusible conductor 18 into three sections. In other embodiments, there may be only one solder mask, such as only solder mask 17a or solder mask 17b, and the fusible conductor 18 may be divided into two sections. In other embodiments, there may be only one solder mask adjacent to electrode 11 , adjacent to electrode 12 , or substantially equidistant from electrode 11 and electrode 12 . In other embodiments, there may be only one solder mask, the centerline of which may be generally aligned with the centerline of fusible conductor 18 .

In some embodiments, since the soluble conductor 18 may have a single melting point, the solder mask 17a and the solder mask 17b may simultaneously divide the soluble conductor 18 into three sections. For example, the electrode 11 and the electrode 12 can form an interruption with the soluble conductor 18 at the same time.

In some embodiments, the solder mask layer 17a and the solder mask layer 17b may respectively include (but are not limited to) epoxy, urethane, acrylic, organic and inorganic fillers, photoinitiated materials, etc. Agent (photoinitiator) and other materials.

The cover 19 may be disposed on or located on the surface 101 of the substrate 10 . In some embodiments, when viewed from the side views of FIG. 1D and FIG. 1E , the middle portion of the cover 19 may be thinner than the surrounding portion. In some embodiments, the middle portion of cover 19 may have a substantially flat inner surface when viewed from the side views of FIGS. 1D and 1E . In some embodiments, cover 19 may have a substantially flat upper surface when viewed from the side views of FIGS. 1D and 1E.

2A to 2M illustrate a manufacturing method of a protection element according to some embodiments of the present disclosure. According to some embodiments of the present disclosure, the manufacturing method disclosed in FIGS. 2A to 2M can be used to manufacture the protection element 1 shown in FIG. 1A .

Referring to Figure 2A, a substrate 10 is provided. The substrate 10 has a surface 101 and a surface 102 opposite to the surface 101 . In some embodiments, cutting lines (not shown) may be formed in the substrate 10 by laser cutting. In some embodiments, the depth of the scribe lines may account for about 20% to about 60% of the thickness of the substrate 10 .

Referring to FIG. 2B , a hole 10 h is formed in the substrate 10 . In some embodiments, the drill hole 10h may be formed by laser drilling or other feasible methods. The size, quantity and location of the 10h drilling holes can be designed according to the device specifications (such as rated current) or process requirements.

Referring to FIG. 2C , a through hole 10v1 , a through hole 10v2 and a through hole 10v3 are formed. In some embodiments, the conductive material may be formed in the drill hole 10h by sputtering, electroless plating, plating, printing, photolithography, or other feasible methods.

Referring to FIG. 2D , the surface 102 faces upward, and external terminals 11 b , external terminals 12 b and external terminals 13 b are formed on the surface 102 of the substrate 10 . In some embodiments, the external terminals 11b, 12b, and 13b may be formed by sputtering, electroless plating, electroplating, printing, photolithography, or other feasible methods. The positions of the external terminals 11b, 12b, and 13b correspond to the positions of the through holes 10v1, 10v2, and 10v3.

Referring to FIG. 2E , the surface 101 faces upward, and the insulating layer 14 is formed on the surface 101 of the substrate 10 . In some embodiments, the insulating layer 14 may be formed by coating, lamination, or other feasible methods.

Referring to FIG. 2F , electrodes 11 , 12 and 13 are formed on the surface 101 of the substrate 10 and the insulating layer 14 . In some embodiments, the electrodes 11, 12, and 13 may be formed by sputtering, electroless plating, electroplating, printing, photolithography, or other feasible methods. The electrode 11 may have an extension portion 11e and the electrode 13 may have an extension portion 13e. In other embodiments, the conductive layer can be conformally formed on the surface 101 of the substrate 10 and the insulating layer 14 through laser etching, dry etching, ion bumping, or other processes. Possible ways to remove part of the conductive layer or pattern the conductive layer.

Referring to FIG. 2G , the heating element 15 is formed on the insulating layer 14 , the extension portion 11 e and the extension portion 13 e. In some embodiments, the heating element 15 can be formed by electroplating, evaporation, or sputtering. In some embodiments, the heating element 15 can be formed by mixing metal (such as ruthenium (Ru)) powder with a binder (such as resin), forming a pattern through screen printing, and then sintering. In other embodiments, the heating element 15 can be formed by attaching a metal film.

Referring to FIG. 2H , an insulating layer 16 is formed on the heating element 15 . In some embodiments, the insulating layer 16 may be formed by coating, lamination, or other feasible methods.

Referring to FIG. 2I , solder resist layers 17 a and 17 b are formed on the insulating layer 16 . In some embodiments, the solder mask layers 17a and 17b can be formed by coating, printing, photolithography, or other feasible methods.

Referring to FIGS. 2J and 2K , a coating film 11 p is formed on the electrode 11 , the electrode 12 , the electrode 13 , the external terminal 11 b , the external terminal 12 b and the external terminal 13 b. In some embodiments, the coating film 11p may be formed by coating metals such as nickel/gold (Ni/Au), nickel/lead/gold (Ni/Pb/Au), or nickel/lead (Ni/Pb). The portions of the extension portion 11e and the extension portion 13e covered by the insulating layer 16 are not coated with the coating film 11p.

Referring to FIG. 2L , soluble conductor 18 is formed on electrode 11 and electrode 12 . In some embodiments, the fusible conductor 18 may be formed by sputtering, electroless plating, electroplating, printing, photolithography, or other feasible methods. In other embodiments, the soluble conductor 18 may be formed by attaching a metal sheet or film (eg, a copper alloy metal sheet or a pure copper metal sheet).

Referring to Figure 2M, a cover 19 is formed. In some embodiments, the substrate 10 can be separated into a plurality of independent components along the cutting lines formed by laser scribing to expose the side surface of the substrate 10 (such as the surface 103 shown in FIG. 1A ). In some embodiments, the overcurrent protection device formed by the method shown in FIGS. 2A to 2M may be the same as the protection component 1 shown in FIG. 1A .

It will be understood that embodiments of the methods and apparatus discussed herein are not limited in their application to the details of construction and arrangement of components set forth in the following description or illustrated in the accompanying drawings. The methods and apparatus are capable of implementation in other embodiments and of being practiced or performed in various ways. Examples of specific implementations are provided herein for illustrative purposes only and are not intended to be limiting. In particular, acts, elements, and features discussed in connection with any one or more embodiments are not intended to be excluded from a similar role in any other embodiments.

Furthermore, the phraseology and terminology used herein are for the purpose of description and should not be regarded as limiting. Any reference to an embodiment or element or act of the systems and methods herein that is referred to in the singular may also include embodiments that include a plurality of such elements, and to any reference to any embodiment or element or act herein in the plural Any reference may also include embodiments including only a single element. References in the singular or plural are not intended to limit the presently disclosed system or method, its components, acts or elements. The use of "includes," "includes," "has," "contains," "involves," and variations thereof herein is intended to cover the items listed thereafter and their equivalents as well as additional items. References to "or" may be deemed to be inclusive such that any item using "or" may indicate any one, more than one, or all of the items described. Any references to front and rear, left and right, top and bottom, upper and lower, and vertical and horizontal are intended for convenience of description and do not limit the systems and methods or components thereof to any one position or spatial orientation.

Thus, having described several aspects of at least one embodiment, it is to be understood that various alterations, modifications and improvements will readily occur to those skilled in the art. Such alterations, modifications and improvements are intended to be part of and within the scope of this invention. Therefore, the above description and drawings are by way of example only, and the scope of the present invention should be determined from the proper construction of the accompanying patent claims and their equivalents.

1: Protective components 10:Substrate 10v1:Through hole/first through hole 10v2:Through hole/second through hole 10v3: Through hole/Third through hole 11:Electrode/first electrode 11b:External terminal/first external terminal 11e: Extension part/first extension part 11p: Coated film 12:Electrode/second electrode 12b:External terminal/second external terminal 13:Electrode/third electrode 13b:External terminal/Third external terminal 13e:Extension/Second extension 14: Insulation layer/first insulation layer 15: Heating element 16: Insulation layer/second insulation layer 17a: Solder mask/first solder mask 17b: Solder mask/second solder mask 18:Fusible conductor 19: Cover 101:Surface 102:Surface 103:Surface AA’: tangent BB’: tangent X: axis Y: axis Z: axis

Various aspects of at least one embodiment are discussed below with reference to the accompanying drawings, which are not intended to be drawn to scale. Where technical features in the drawings, embodiments, or any claims are accompanied by reference symbols, such reference symbols have been included for the sole purpose of increasing understandability in the drawings, embodiments, or claims. Accordingly, the presence or absence of a reference symbol is not intended to have a limiting effect on the scope of any element of the patentable scope claimed. In the drawings, identical or nearly identical components shown in the various figures are designated by the same numeral. For clarity, not every component is labeled in every figure. The drawings are provided for the purpose of illustration and explanation and are not to be construed as a definition of the limits of the invention. In the picture:

FIG. 1A is a perspective view of a protection component according to some embodiments of the present disclosure;

1B shows a top view of a protection component according to some embodiments of the present disclosure;

FIG. 1C shows an equivalent circuit diagram of a protection component according to some embodiments of the present disclosure;

FIG. 1D shows a side view of a protection component according to some embodiments of the present disclosure;

FIG. 1E shows a side view of a protection component according to some embodiments of the present disclosure; and

2A to 2M illustrate a manufacturing method of a protection element according to some embodiments of the present disclosure.

1: Protective components

10:Substrate

11:Electrode/first electrode

11e: Extension part/first extension part

12:Electrode/second electrode

13:Electrode/third electrode

14: Insulation layer/first insulation layer

16: Insulation layer/second insulation layer

17a: Solder mask/first solder mask

17b: Solder mask/second solder mask

18:Fusible conductor

19: Cover

AA’: tangent

BB’: tangent

X: axis

Y: axis

Z: axis

Claims (14)

A protective component containing: a substrate; a first electrode disposed on the substrate and having a first extension; a second electrode disposed on the substrate and spaced apart from the first electrode; A heating element is disposed between the first electrode and the second electrode; A fusible conductor is connected between the first electrode and the second electrode and is configured to be melted by the heat generated by the heating element, At least a portion of the first extending portion of the first electrode is located between the heating element and the substrate and contacts the heating element. The protection element of claim 1, wherein the first electrode is connected to a first external terminal through a first through hole penetrating the substrate, and the second electrode is connected to a first external terminal through a second through hole penetrating the substrate. a second external terminal. The protection component as described in claim 1 further includes: A first insulating layer is disposed between the heating element and the substrate and separates the heating element from the substrate; and A second insulating layer is disposed between the heating element and the soluble conductor and separates the heating element from the soluble conductor. The protection element of claim 3, wherein the first electrode has an edge located between the first insulating layer and the second insulating layer. The protection component as described in claim 3 further includes: A first solder mask layer is disposed between the second insulating layer and the soluble conductor and contacts the soluble conductor. The protection component as described in claim 5 further includes: A second solder mask layer is disposed between the second insulating layer and the soluble conductor and contacts the soluble conductor, wherein the first solder mask layer is separated from the second solder mask layer. The protection component as described in claim 1 further includes: A third electrode is disposed on the substrate and has a second extension portion, wherein at least a portion of the second extension portion of the third electrode is located between the heating element and the substrate and contacts the heating element. The protection element of claim 7, wherein an extension direction of the first extension part and an extension direction of the second extension part are opposite. The protection element of claim 7, wherein the first electrode and the third electrode are configured to heat the heating element. The protection element according to claim 1, wherein the first extension portion has a side surface coplanar with a side surface of the heating element. A method of manufacturing a protective component, including: providing a substrate; Forming a first electrode, a second electrode and a third electrode on the substrate, wherein the first electrode has a first extension part and the third electrode has a second extension part; Form a heating element to cover the first extension part and the second extension part; and A soluble conductor is formed connected between the first electrode and the second electrode. The manufacturing method as described in claim 11 further includes: A first through hole, a second through hole and a third through hole are formed through the substrate. The manufacturing method as described in claim 11 further includes: Forming a first insulating layer on the substrate, wherein the heating element is formed on the first insulating layer; and A second insulating layer is formed on the heating element, wherein the soluble conductor is formed on the second insulating layer. The manufacturing method as described in claim 13 further includes: A solder mask layer is formed on the second insulating layer, wherein the fusible conductor contacts the solder mask layer.

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