TW202403476A - Positioning apparatus, lithography apparatus, and article manufacturing method capable of achieving both positioning an article accurately in a short time and lowering production lead-time - Google Patents
Positioning apparatus, lithography apparatus, and article manufacturing method capable of achieving both positioning an article accurately in a short time and lowering production lead-time Download PDFInfo
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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- G—PHYSICS
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
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- G03F7/70725—Stages control
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
Abstract
Description
本發明,有關定位裝置、微影裝置及物品製造方法。The present invention relates to a positioning device, a lithography device and an article manufacturing method.
在製造物品的製造裝置中,以短時間將工件進行定位,在提高生產率方面為重要。定位裝置,例如利用使用了氣缸、配重等的推壓機構而推壓載台上的工件的側面,將工件抵靠於定位銷,從而進行定位。載台上的定位銷的位置,可使用致動器來調整。 [先前技術文獻] [專利文獻] In a manufacturing device that manufactures articles, positioning a workpiece in a short time is important to improve productivity. The positioning device uses, for example, a pressing mechanism using a cylinder, a counterweight, or the like to press the side surface of the workpiece on the stage and position the workpiece against a positioning pin. The position of the positioning pin on the stage can be adjusted using an actuator. [Prior technical literature] [Patent Document]
[專利文獻1]日本特開昭59-001032號公報[Patent Document 1] Japanese Patent Application Publication No. Sho 59-001032
[發明所欲解決之課題][Problem to be solved by the invention]
尤其,在要求μm等級以下的定位精度的情況下,不僅需要設計成高精度地驅動定位銷,還需要將推壓機構設計成始終產生固定的推力。作為高精度的推壓機構,優選氣缸,尤其,採用空氣軸承氣缸,從推力變化少的觀點而言為佳。然而,空氣軸承氣缸,比起一般的氣缸,成本高。此外,雖已提出了如專利文獻1般使用配重而保持推力固定地進行推壓的技術,惟以如此之機構,以μm級的精度進行定位為困難。此外,在推壓機構的推力不穩定的情況下,定位次數增多,產距時間變長。In particular, when positioning accuracy of μm level or less is required, not only the positioning pin needs to be designed to drive with high accuracy, but also the pressing mechanism needs to be designed to always generate a fixed thrust force. As a high-precision pressing mechanism, a cylinder is preferable, and in particular, an air bearing cylinder is preferable from the viewpoint of small change in thrust force. However, air bearing cylinders are more expensive than ordinary cylinders. In addition, although a technology has been proposed that uses a counterweight to keep the thrust force constant as in
本發明,例如提供在使定位精度和成本或低產距時間同時成立方面有利的定位裝置。 [用於解決課題之手段] The present invention provides a positioning device that is advantageous in achieving both positioning accuracy and cost or low throughput time, for example. [Means used to solve problems]
依本發明的一態樣時,提供一種定位裝置,進行在載台之上移動的工件的定位,具備:基準構件,其可在前述載台之上移動;致動器,其驅動前述基準構件;氣缸,其以使前述載台之上的前述工件的第1側面抵靠於前述基準構件的方式,將和前述第1側面為相反側的第2側面以活塞桿進行推壓;計測部,其對前述載台之上的前述工件的位置進行計測;以及控制部,其控制前述致動器及前述氣缸;前述控制部,基於透過了前述計測部下之計測的結果而進行前述致動器的驅動控制,將前述氣缸控制為,在該驅動控制之間,使前述活塞桿暫時從前述工件離開,並再次以前述活塞桿推壓前述工件的前述第2側面。 [發明功效] According to one aspect of the present invention, a positioning device is provided for positioning a workpiece moving on a stage, including: a reference member that can move on the stage; and an actuator that drives the reference member ; A cylinder that presses the second side opposite to the first side with a piston rod in such a manner that the first side of the workpiece on the stage is brought into contact with the reference member; the measurement part, It measures the position of the workpiece on the stage; and a control unit controls the actuator and the cylinder; and the control unit performs operation of the actuator based on the measurement result through the measurement unit. The drive control controls the cylinder so that the piston rod is temporarily separated from the workpiece during the drive control period, and the piston rod again presses the second side surface of the workpiece. [Invention effect]
依本發明時,例如可提供在使定位精度和成本或低產距時間同時成立方面有利的定位裝置。According to the present invention, for example, it is possible to provide a positioning device that is advantageous in achieving positioning accuracy and cost or low throughput time at the same time.
以下,參照圖式詳細說明實施方式。另外,以下的實施方式,非限定申請專利範圍的發明者。於實施方式雖記載複數個特徵,惟不限於此等複數個特徵的全部為發明必須者;此外,複數個特徵亦可任意進行組合。再者,圖式中,對相同或同樣的構成標注相同的參考符號,重複之說明省略。Hereinafter, embodiments will be described in detail with reference to the drawings. In addition, the following embodiments do not limit the scope of the patent claims of the inventors. Although a plurality of features are described in the embodiments, it is not limited to the case where all of the features are necessary for the invention; in addition, the features may be combined arbitrarily. In addition, in the drawings, the same or identical components are denoted by the same reference symbols, and repeated explanations are omitted.
<第1實施方式>
圖1,為針對進行工件的定位的定位裝置的構成進行繪示的圖。於本說明書及圖式,於使水平面為XY平面的XYZ座標系中表示方向。作為定位對象物的工件1,以其表面與水平面(XY平面)成為平行的方式放置在載台35上。因此,在以下,使在沿著工件1的表面之平面內彼此正交的方向為X軸及Y軸,使垂直於X軸及Y軸的方向為Z軸。此外,在以下,將分別平行於XYZ座標系中的X軸、Y軸、Z軸的方向稱為X方向、Y方向、Z方向,將繞X軸的旋轉方向、繞Y軸的旋轉方向、繞Z軸的旋轉方向分別稱為θX方向、θY方向、θZ方向。
<First Embodiment>
FIG. 1 is a diagram illustrating the structure of a positioning device for positioning a workpiece. In this specification and the drawings, the direction is expressed in the XYZ coordinate system in which the horizontal plane is the XY plane. The
工件1可在載台35上移動。在一例中,在載台35上配置有夾持工件1的工件夾持件36。工件1載置在工件夾持件36上。使工件夾持件36夾持工件1,從而可固定工件1相對於載台35的位置。此情況下,由定位裝置對工件1的位置調整,在工件夾持件36解夾持(dechuck)工件1的狀態下進行。另外,工件夾持件36所採用的工件1的夾持方式可為任意者。在一例中,工件夾持件36被構成為,在夾持時,將工件1的下表面進行吸引從而使工件1的下表面吸附於工件夾持件36的夾持面。此外,工件夾持件36被構成為,在不夾持時,對工件1的下表面噴出氣體而使工件1從工件夾持件36的夾持面上浮。The
定位裝置,具備複數個氣缸2,該複數個氣缸2被配置成推壓工件1的側面。在圖1的例中,複數個氣缸2,可包括沿X方向推壓工件1的2個氣缸和沿Y方向推壓工件1的2個氣缸。工件1在載台35上的移動,被透過分別使此等氣缸進行動作從而進行。此外,定位裝置,具有複數個止動件3,該複數個止動件3對配置在載台35上的既定位置的工件1的移動範圍進行限制。複數個止動件3,可包括對工件1在X方向的移動進行限制的1個以上的止動件和對工件1在Y方向的移動進行限制的1個以上的止動件。複數個氣缸2以及複數個止動件3的數量以及配置位置,根據工件1的大小、形狀以及所要求的定位精度等而適切地決定。止動件3,可包括可在載台35上沿XY方向移動的作為基準構件的定位銷3a和沿XY方向驅動定位銷3a的致動器3b。致動器3b,例如可為由脈衝訊號進行驅動的脈衝馬達。The positioning device includes a plurality of
定位裝置,具有控制裝置5(控制部)。控制裝置5,控制複數個止動件3中的致動器3b和複數個氣缸2。控制裝置5,經由配管回路4,進行對複數個氣缸2的空氣的供應。控制裝置5,例如可由FPGA(現場可程式化邏輯閘陣列(Field Programmable Gate Array)之縮寫)等PLD(可程式化邏輯裝置(Programmable Logic Device)之縮寫)、ASIC(特殊應用積體電路(Application Specific Integrated Circuit)之縮寫)、被置入程式的通用電腦或此等全部或一部分的組合而構成。The positioning device has a control device 5 (control unit). The
定位裝置,可具備對工件1在載台35上的位置進行計測的計測裝置6(計測部)。雖然省略了圖示,惟計測裝置6,可包括對工件1的X方向位置進行計測的X計測部,且可包括對工件1的Y方向位置進行計測的Y計測部。X計測部以及Y計測部,例如可分別為線性編碼器。亦可代替線性編碼器,使用配置於定位裝置的主體構造體的干涉儀和配置於工件1的反射鏡的組合而進行工件1在各方向上的位置的計測。The positioning device may include a measurement device 6 (measurement unit) that measures the position of the
計測裝置6,與運算裝置7連接,由計測裝置6獲得的計測資料被傳送到運算裝置7。運算裝置7,算出供於將工件1定位在目標位置用的致動器3b的驅動量。另外,運算裝置7的功能亦可由控制裝置5實現。The
參照圖2,說明有關氣缸2以及配管回路4的構成。另外,雖然在圖1中示出了複數個氣缸2,惟在圖2中為了簡單化說明而代表性地僅示出了1個氣缸2。其他氣缸2方面,亦可被與圖2同樣地構成。The structure of the
氣缸2,可包括氣缸管21、活塞22和活塞桿23。活塞22,配置在氣缸管21的內部,使得將氣缸管21的內部分隔為左右的腔室A以及B,在氣缸管21的內部沿紙面左右方向往返運動。活塞桿23的一端,由活塞22支撐,活塞桿23的另一端為了推壓工件1而可與工件1接觸。配管回路4,可包括電磁閥41,該電磁閥41對氣缸2進行空氣的供應和排出的切換。透過由控制裝置5控制電磁閥41,定位裝置,可執行使活塞桿23從工件1離開的動作以及以活塞桿23推壓工件1的動作。The
在圖2(a)所示的電磁閥41的非通電時,電磁閥41的第1端口p1,透過配管42連接於供應壓縮空氣的供應源45(原壓),電磁閥41的第2端口p2,透過配管43連接於氣缸2的腔室A。據此,配管42與配管43連通。此外,此時,電磁閥41的第3端口p3透過配管44連接於氣缸2的腔室B,配管44連通於作為排氣口的電磁閥41的第4端口p4。此情況下,來自供應源45的壓縮空氣向腔室A供應,活塞桿23(向紙面左側)後退,腔室B內的氣體被排出。When the
控制裝置5,透過向線圈C供電而對線圈C進行電磁驅動。在透過控制裝置5向線圈C供電的期間,如圖2(b)所示,電磁閥41的第5端口p5,透過配管42連接於供應源45,第6端口p6,透過配管44連接於氣缸2的腔室B。據此,配管42與配管44連通。此外,電磁閥41的第7端口p7,透過配管43連接於氣缸2的腔室A,配管43連通於作為排氣口的電磁閥41的第8端口p8。此情況下,來自供應源45的壓縮空氣向腔室B供應,活塞桿23(向紙面右側)突出,腔室A內的氣體被排出。The
本實施方式的定位裝置,透過氣缸2推壓工件1的側面,使工件1抵靠於止動件3的定位銷3a,從而進行定位。例如在需要μm級以下的定位精度的情況下,需要將致動器3b設計成高精度地驅動定位銷3a。從此觀點出發,作為致動器3b,由脈衝訊號驅動的脈衝馬達(例如步進馬達)為適。此外,例如在需要μm級以下的定位精度的情況下,推壓工件1的機構方面,需要產生的推力無論在何行程位置皆為固定。從該觀點出發,推壓工件1的機構方面,優選採用氣缸。The positioning device of this embodiment uses the
在本實施方式中,定位裝置,一邊持續由氣缸2對工件1的側面供壓,一邊透過致動器3b調整定位銷3a的位置。具體而言,為了調整位置,工件1成為由工件夾持件36解夾持的狀態。在該狀態下,如圖3(a)、(b)所示,氣缸2,以活塞桿23推壓工件1的與第1側面1a相反側的第2側面1b,使得工件1的第1側面1a與定位銷3a抵接。之後,定位裝置,透過計測裝置6計測工件1的位置。此時,為了提高計測精度,可作成為工件1被透過工件夾持件36夾持的狀態而進行計測。控制裝置5,基於透過計測裝置6得到的計測結果而進行致動器3b的驅動控制。例如在驅動控制中,控制裝置5,以使計測到的位置落入於容許範圍內的方式,透過致動器3b調整定位銷3a的位置。In this embodiment, the positioning device adjusts the position of the
在如此之定位銷3a的驅動控制中,可能會發生透過致動器3b驅動的定位銷3a的驅動方向的反轉。在定位銷3a的驅動方向反轉的動作中,氣缸2(活塞桿23)的推力產生變化。在需要μm級以下的定位精度的情況下,不能無視如此之氣缸2的推力變化。針對此點,參照圖3(a)、(b)進行說明。In such drive control of the
在圖3(a)、(b)中,氣缸管21以及活塞桿23被桿蓋24覆蓋。此外,在氣缸管21的內部,配設有墊料(packing)25,該墊料25為供於防止壓縮空氣的洩漏用的密封構件。墊料25,將活塞桿23的外周面與氣缸管21的內周面密封。墊料25,固定於氣缸管21的內周面,另一方面相對於活塞桿23僅可滑動地接觸而不被固定。隨著活塞桿23的移動,墊料25彈性變形。氣缸2的推力10,為由施加於活塞桿23的壓力產生的力12和墊料25的變形傾向恢復的力(以下,稱為墊料25的彈性力11)的合計。In FIGS. 3(a) and (b) , the
思考在使定位銷3a和活塞桿23夾著工件1地互擠的狀態下定位銷3a的驅動方向發生反轉的情況。此為從圖3(a)的狀態向圖3(b)的狀態變化的情況或從圖3(b)的狀態向圖3(a)的狀態變化的情況。此情況下,活塞桿23的移動方向亦隨著定位銷3a的驅動方向的反轉而反轉。於是,墊料25的變形方向亦改變,墊料25的彈性力11作用的方向發生反轉。由此,氣缸2的推力10變小。在定位銷3a的驅動方向發生反轉之際,由於由氣缸推壓的止動件3以及工件1的彈性變形量發生改變,故產生定位銷3a的驅動量與工件1的移動量不一致的現象。Consider a case where the driving direction of the
另一方面,如圖3(c)所示,若沿相同方向(在不反轉之下)持續驅動定位銷3a,則墊料25的變形量成為最大。當在該狀態下向相同方向持續驅動活塞桿23的情況下,由於墊料25保持最大變形量,因此墊料25的彈性力11被保持為固定。On the other hand, as shown in FIG. 3(c) , if the
根據如以上的現象,在定位銷3a的驅動方向反轉了的情況下,在墊料25的變形量成為最大之前的區域中,不能使工件1移動所設想的移動量,變成反復進行定位驅動和計測。由此,導致定位驅動次數增加,產距時間會增加。另外,作為其解決對策,如果使用沒有墊料的空氣軸承氣缸,就可消除氣缸的推力變化。然而,空氣軸承氣缸,比起一般的氣缸,成本變高。此外,在日本特開昭59-001032號公報(專利文獻1),雖已提出了使用配重保持推力一定地進行推壓的技術,惟以此機構無法以μm級的精度進行控制。According to the above phenomenon, when the driving direction of the
於是,在本實施方式中,控制裝置5,將氣缸2控制為,在定位銷3a的驅動控制中,僅在墊料25的彈性力11作用於相同方向的狀態下使活塞桿23推壓工件1。為了實現該控制,控制裝置5,在定位銷3a的驅動控制中,反復進行使活塞桿23暫時從工件1離開並再次以活塞桿23推壓工件1的操作。在第1例中,控制裝置5,每當驅動致動器3b時,將氣缸2控制為,使活塞桿23暫時從工件1離開並再次用活塞桿23推壓工件1的第2側面1b。在第2例中,控制裝置5,每當驅動致動器3b時,對驅動方向是否反轉進行判定。根據判定出驅動方向發生反轉的情況,控制裝置5,將氣缸2控制為,使活塞桿23暫時從工件1離開並再次用活塞桿23推壓工件1的第2側面1b。Therefore, in this embodiment, the
以下,參照圖4的流程圖,詳細說明依上述第2例時的工件1的定位動作的透過了控制裝置5下之控制順序之例。此控制順序,在工件1被載置於工件夾持件36的夾持面之後開始。Hereinafter, an example of the control sequence of the
在S1中,控制裝置5,控制工件夾持件36而使工件1成為解夾持狀態。在一例中,工件夾持件36透過對工件1的下表面噴出氣體而使工件1從工件夾持件36的夾持面上浮,從而可成為解夾持狀態。In S1, the
在S2中,控制裝置5,按照根據工件1的目標位置而決定的定位銷3a的目標位置,驅動致動器3b。在S3中,控制裝置5,控制氣缸2而使活塞桿23推壓工件1。具體而言,控制裝置5,向線圈C供電。在向線圈C供電的期間,線圈C進行電磁驅動而使活塞桿2突出(圖2(b)),推壓工件1。In S2, the
在S4中,控制裝置5,控制工件夾持件36而使工件1成為夾持狀態。在一例中,工件夾持件36透過將工件1的下表面進行吸引從而將工件1吸附於工件夾持件36的夾持面,從而可成為夾持狀態。另外,此S4中的夾持,是為了高精度地進行在接下來的S5進行的工件1的位置計測的操作。在位置計測的精度得到確保的情況下,此S4中的夾持非必須。In S4, the
在S5中,控制裝置5,使計測裝置6,對載台35上的工件1的位置進行計測。透過計測裝置6得到的計測資料,被傳送至運算裝置7。運算裝置7,計算計測資料所示的工件1的位置與工件1的目標位置之間的誤差。在S6中,運算裝置7,判定誤差是否落入於基於要求精度下的容許範圍內。若誤差落入於容許範圍內,則處理結束。在誤差沒有落入於容許範圍內的情況下,處理進入S7。In S5, the
在S7中,運算裝置7,基於上述誤差,算出供於將工件1定位在目標位置用的致動器3b的驅動量。算出的驅動量的資料,被向控制裝置5傳送。在S8中,控制裝置5,針對在S7算出的驅動量,判定致動器3b的驅動方向是否會發生反轉。具體而言,控制裝置5,針對在S7算出的驅動量,判定該驅動方向與S2中的致動器3b的驅動方向是否相反。若二者的驅動方向相反,則判定為驅動方向發生反轉;若二者的驅動方向相同,則判定為驅動方向沒有不會反轉。在判定為驅動方向不會反轉的情況下,處理返回到S1。在判定為驅動方向會反轉的情況下,處理進入S9。在S9中,控制裝置5控制氣缸2而使活塞桿23從工件1離開。具體而言,控制裝置5,停止向線圈C供電。透過停止向線圈C供電,使線圈C的電磁驅動被停止,活塞桿23後退(圖2(a))。由此,活塞桿23從工件1離開。之後,處理返回S1。In S7, the
如上述般,進行定位銷3a以及氣缸2各自的驅動控制,直到工件1的目標位置與計測到的位置之間的誤差落入於容許範圍內為止。依此驅動控制時,在致動器3b的驅動方向會反轉之際(在S8中為「是」),活塞桿23從工件1暫時離開(S9)。之後,控制氣缸2而使活塞桿23再次接觸工件1(S3)。透過作成如此,氣缸2可始終從相同的行進方向推壓工件1,定位時的墊料25的彈性力11的變化消失。由此,氣缸的推力10始終為固定,故定位精度得到提升。此外,定位驅動次數減少,可縮短產距時間。As described above, each drive control of the
<變形例>
在上述的第1實施方式中,定位裝置,進行在工件夾持件36上處於解夾持狀態的工件1的定位。亦可代替之,透過驅動載台35上的工件夾持件36從而進行該定位。
<Modification>
In the first embodiment described above, the positioning device positions the
在第1實施方式中,雖針對致動器3b的驅動軸數為1軸的情況進行了說明,惟致動器3b的驅動軸數亦可為2軸以上。In the first embodiment, the case where the number of drive shafts of the
在第1實施方式中,作為致動器3b,雖說明脈衝馬達為適,惟不限於此。致動器3b方面,亦可例如採用可進行數μm級的精密驅動的壓電致動器等致動器。In the first embodiment, a pulse motor is suitable as the
在第1實施方式中,雖說明了工件夾持件36被構成為透過對工件1的下表面噴出氣體而使工件1從工件夾持件36的夾持面上浮從而成為解夾持狀態,惟不限於此。例如,亦可採用透過電磁方式使工件1從夾持面上浮的機構。In the first embodiment, it has been described that the
<第2實施方式> 上述的定位裝置,可應用於對基板轉印原版的圖案的微影裝置。微影裝置,可包括曝光裝置、壓印裝置、帶電粒子束描繪裝置等。曝光裝置,為對供應至基板之上的光阻經由原版進行曝光,從而在該光阻形成和原版的圖案對應的潛像的裝置。壓印裝置,為透過在使模具(原版)與供應到基板之上的壓印材進行接觸的狀態下使壓印材固化,從而在基板之上形成圖案的裝置。帶電粒子束描繪裝置,為對供應至基板之上的光阻透過帶電粒子束而描繪圖案從而在該光阻形成潛像的裝置。以下,為了提供具體例,針對微影裝置被構成為曝光裝置之例進行說明。 <Second Embodiment> The above-mentioned positioning device can be applied to a photolithography device that transfers a pattern of an original plate to a substrate. Lithography devices may include exposure devices, imprinting devices, charged particle beam drawing devices, etc. The exposure device is a device that exposes the photoresist supplied to the substrate through the original plate, thereby forming a latent image corresponding to the pattern of the original plate on the photoresist. The imprint device is a device that forms a pattern on a substrate by solidifying the imprint material supplied on the substrate by bringing the mold (original plate) into contact with the imprint material. The charged particle beam drawing device is a device that draws a pattern by passing a charged particle beam through the photoresist supplied to the substrate, thereby forming a latent image on the photoresist. In the following, in order to provide a specific example, an example in which the lithography device is configured as an exposure device will be described.
參照圖5,說明有關應用了上述第1實施方式的定位裝置的曝光裝置131。曝光裝置131,具有照明光學系統115、遮罩台116、投影光學系統117、基板台118和控制部119。曝光裝置131,收容於曝光室126。在此,使Y方向為遮罩M及基板P的掃描方向,使X方向為非掃描方向。Referring to FIG. 5 , the
照明光學系統115,例如使用來自超高壓水銀燈等光源的光而照射遮罩M。照明光學系統115,作為本實施方式的一例,對遮罩M照射被成形為狹縫狀的照明光。遮罩M,例如為形成有要轉印於基板P的圖案(例如電路圖案)的玻璃製的原版。遮罩台116,為保持遮罩M而沿X及Y方向移動的載台。The illumination
投影光學系統117,將由遮罩台116保持的遮罩M和由基板台118內的基板搭載部120保持的基板P維持為光學共軛的關係,將在遮罩M的照明區域存在的圖案的像投影於基板P。投影光學系統117,在本實施方式中,包括第1平行平板121、梯形鏡122、凹面鏡123、凸面鏡124和第2平行平板125。在投影光學系統117中,來自遮罩M的光,依序經過第1平行平板121、梯形鏡122、凹面鏡123、凸面鏡124、凹面鏡123、梯形鏡122、第2平行平板125,到達基板P。來自投影光學系統117的光在基板上的投影區域(曝光區域),設定為既定的形狀,例如圓弧形狀。The projection
基板P,例如為在表面形成有抗蝕層(感光劑)的玻璃製的平板。基板台118,以基板搭載部120對基板P進行真空吸附,例如為沿X、Y及Z方向(進一步而言,θX、θY及θZ方向)移動的載台。The substrate P is, for example, a glass flat plate with a resist layer (photosensitive agent) formed on the surface. The
控制部119,由包括CPU、記憶體的電腦等構成,按照記憶體中儲存的程序進行曝光裝置131的各部分的控制及運算處理等。此外,在本實施方式中,雖為由控制部119控制基板台118,惟亦可設置對基板台118進行控制的專用的載台控制部。此情況下,載台控制部,基於來自控制部119的指令,控制基板台118。此外,控制部119,既可與曝光裝置131的其他部分一體(在共用的框體內)地構成,亦可和曝光裝置131的其他部分不同形體地(於別的框體內)地構成。The
在曝光室126,設有開口部127,該開口部127與收容有機械手129的介面腔室(interface chamber)128連通,經由開口部127,在曝光裝置131與機械手129之間進行基板P的搬送(交接)。在本實施方式中,若保持著基板P的機械手129經由開口部127進入曝光室126,則使基板台118移動到開口部127附近的既定位置(基板P的搬送位置)。然後,使基板搬送部130驅動(上升)到機械手129附近,從機械手129接收基板P。基板搬送部130,將接收到的基板P搭載於基板搭載部120。The
如前述,在曝光裝置131中,使用使遮罩M移動的遮罩台116和使基板P移動的基板台118,同步地掃描遮罩M和基板P,將在遮罩M上描繪出的圖案投影到基板P上。為此,需要使在遮罩M上描繪的圖案方向與掃描方向一致。As described above, in the
在遮罩M上描繪的圖案,未被相對於遮罩M的外形平行、垂直地進行描繪。此外,對各個遮罩M描繪的圖案的朝向、配置不同。因此,在遮罩台116需要以圖案基準而對準所載置的遮罩M。在本實施方式中,第1實施方式中說明的定位裝置,被構成於遮罩台116。此情況下,是定位對象物的工件1,為遮罩M。遮罩M的對準被透過定位裝置而實施。曝光裝置131,將定位後的遮罩M的圖案轉印到基板P。另外,在第1實施方式中說明的控制裝置5的功能,亦可由控制部119而實現。The pattern drawn on the mask M is not drawn parallel or perpendicular to the outer shape of the mask M. In addition, the orientation and arrangement of the pattern drawn on each mask M are different. Therefore, the mask M placed on the
如以上,透過將在第1實施方式中說明的定位裝置應用於遮罩台116,遮罩M的定位精度得到提升。此外,遮罩M的定位驅動次數減少,可縮短產距時間,由此曝光裝置的生產率會提升。As described above, by applying the positioning device described in the first embodiment to the mask table 116, the positioning accuracy of the mask M is improved. In addition, the number of positioning drives of the mask M is reduced, which shortens the lead time, thereby improving the productivity of the exposure device.
上述例子,示出了由定位裝置進行掩模遮罩M的定位,將定位後的掩模遮罩M的圖案轉印到基板的之例子。與此同樣地,曝光裝置131,亦可被構成為由定位裝置進行基板P的定位,向定位後的基板P轉印遮罩M的圖案。The above example shows an example in which the positioning device positions the mask mask M and transfers the pattern of the positioned mask mask M to the substrate. Similarly, the
<物品製造方法的實施方式> 本發明的實施方式中的物品製造方法,例如適於製造半導體裝置等的微型裝置、具有微細構造的元件等的物品。本實施方式的物品製造方法,包含:使用上述的微影裝置(曝光裝置、壓印裝置、描繪裝置等)對基板轉印原版的圖案的程序;以及將在該程序轉印了圖案的基板進行加工的程序。再者,該製造方法,包含其他周知的程序(氧化、成膜、蒸鍍、摻雜、平坦化、蝕刻、抗蝕劑剝離、切割、接合、封裝等)。本實施方式的物品製造方法,比起歷來的方法,有利於物品的性能、品質、生產性、生產成本中的至少一者。 <Embodiment of article manufacturing method> The article manufacturing method according to the embodiment of the present invention is suitable for manufacturing articles such as microdevices such as semiconductor devices and elements having a fine structure. The article manufacturing method of this embodiment includes: a process of transferring a pattern of an original plate to a substrate using the above-mentioned lithography device (exposure device, imprinting device, drawing device, etc.); and conducting the process on the substrate to which the pattern has been transferred. Processing procedures. Furthermore, the manufacturing method includes other well-known procedures (oxidation, film formation, evaporation, doping, planarization, etching, resist stripping, cutting, bonding, packaging, etc.). The article manufacturing method of this embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article compared to conventional methods.
發明不限於上述實施方式,在不背離發明的精神及範圍內,可進行各種的變更及變形。因此,撰寫申請專利範圍以公開發明的範圍。The invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Therefore, the patent application is drafted to disclose the scope of the invention.
1:工件
2:氣缸
3:止動件
3a:定位鞘
3b:致動器
4:配管回路
5:控制裝置
6:計測裝置
7:運算裝置
35:載台
36:工件夾持件
1: workpiece
2: Cylinder
3:
[圖1]針對定位裝置的構成進行繪示的圖。 [圖2]針對氣缸及配管回路的構成進行繪示的圖。 [圖3]針對氣缸的推力變化進行說明的圖。 [圖4]定位動作的流程圖。 [圖5]針對曝光裝置的構成進行繪示的圖。 [Fig. 1] A diagram illustrating the structure of a positioning device. [Fig. 2] A diagram illustrating the structure of a cylinder and a piping circuit. [Fig. 3] A diagram illustrating changes in thrust force of the cylinder. [Fig. 4] Flowchart of positioning operation. [Fig. 5] A diagram illustrating the structure of an exposure device.
1:工件 1: workpiece
2:氣缸 2: Cylinder
3:止動件 3: Stopper
3a:定位鞘 3a: Positioning sheath
3b:致動器 3b: Actuator
4:配管回路 4:Piping circuit
5:控制裝置 5:Control device
6:計測裝置 6: Measuring device
7:運算裝置 7:Computing device
35:載台 35: Carrier platform
36:工件夾持件 36: Workpiece clamping parts
Claims (12)
Applications Claiming Priority (2)
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---|---|---|---|
JP2022112572A JP2024010951A (en) | 2022-07-13 | 2022-07-13 | Positioning device, lithography device, and article production method |
JP2022-112572 | 2022-07-13 |
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TW202403476A true TW202403476A (en) | 2024-01-16 |
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TW112122349A TW202403476A (en) | 2022-07-13 | 2023-06-15 | Positioning apparatus, lithography apparatus, and article manufacturing method capable of achieving both positioning an article accurately in a short time and lowering production lead-time |
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JP (1) | JP2024010951A (en) |
KR (1) | KR20240009350A (en) |
CN (1) | CN117406553A (en) |
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Publication number | Priority date | Publication date | Assignee | Title |
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DE3208989A1 (en) | 1982-03-12 | 1983-09-22 | Trumpf GmbH & Co, 7257 Ditzingen | ANCHOR, IN PARTICULAR FOR PUNCHING MACHINES |
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