TW202403476A - Positioning apparatus, lithography apparatus, and article manufacturing method capable of achieving both positioning an article accurately in a short time and lowering production lead-time - Google Patents

Positioning apparatus, lithography apparatus, and article manufacturing method capable of achieving both positioning an article accurately in a short time and lowering production lead-time Download PDF

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TW202403476A
TW202403476A TW112122349A TW112122349A TW202403476A TW 202403476 A TW202403476 A TW 202403476A TW 112122349 A TW112122349 A TW 112122349A TW 112122349 A TW112122349 A TW 112122349A TW 202403476 A TW202403476 A TW 202403476A
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Taiwan
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workpiece
piston rod
positioning
aforementioned
cylinder
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TW112122349A
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Chinese (zh)
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長野哲也
塩村祐輔
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日商佳能股份有限公司
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Publication of TW202403476A publication Critical patent/TW202403476A/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25BTOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70716Stages
    • G03F7/70725Stages control
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70775Position control, e.g. interferometers or encoders for determining the stage position
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023Aligning or positioning in direction perpendicular to substrate surface

Abstract

A positioning apparatus that is advantageous in achieving both positioning accuracy and cost or low production lead-time is provided. A positioning apparatus for positioning a workpiece moving over a carrier comprises: a reference member, which is movable over the aforesaid carrier; an actuator, which drives the aforesaid reference member; a pneumatic cylinder, which pushes the second side opposite to the first side of the aforesaid workpiece with the piston rod in such a way that the first side of the workpiece on top of the carrier rests against the reference member; a measuring unit, which measures the position of the workpiece on the carrier; and a control unit, which controls the actuator and the pneumatic cylinder; the control unit, on the basis of the results of the measurements under the measuring unit, performs the drive control of the actuator, and controls the pneumatic cylinder to temporarily disengage the piston rod from the workpiece in between the drive control and to once again push down on the second side of the workpiece by the piston rod.

Description

定位裝置、微影裝置及物品製造方法Positioning device, lithography device and article manufacturing method

本發明,有關定位裝置、微影裝置及物品製造方法。The present invention relates to a positioning device, a lithography device and an article manufacturing method.

在製造物品的製造裝置中,以短時間將工件進行定位,在提高生產率方面為重要。定位裝置,例如利用使用了氣缸、配重等的推壓機構而推壓載台上的工件的側面,將工件抵靠於定位銷,從而進行定位。載台上的定位銷的位置,可使用致動器來調整。 [先前技術文獻] [專利文獻] In a manufacturing device that manufactures articles, positioning a workpiece in a short time is important to improve productivity. The positioning device uses, for example, a pressing mechanism using a cylinder, a counterweight, or the like to press the side surface of the workpiece on the stage and position the workpiece against a positioning pin. The position of the positioning pin on the stage can be adjusted using an actuator. [Prior technical literature] [Patent Document]

[專利文獻1]日本特開昭59-001032號公報[Patent Document 1] Japanese Patent Application Publication No. Sho 59-001032

[發明所欲解決之課題][Problem to be solved by the invention]

尤其,在要求μm等級以下的定位精度的情況下,不僅需要設計成高精度地驅動定位銷,還需要將推壓機構設計成始終產生固定的推力。作為高精度的推壓機構,優選氣缸,尤其,採用空氣軸承氣缸,從推力變化少的觀點而言為佳。然而,空氣軸承氣缸,比起一般的氣缸,成本高。此外,雖已提出了如專利文獻1般使用配重而保持推力固定地進行推壓的技術,惟以如此之機構,以μm級的精度進行定位為困難。此外,在推壓機構的推力不穩定的情況下,定位次數增多,產距時間變長。In particular, when positioning accuracy of μm level or less is required, not only the positioning pin needs to be designed to drive with high accuracy, but also the pressing mechanism needs to be designed to always generate a fixed thrust force. As a high-precision pressing mechanism, a cylinder is preferable, and in particular, an air bearing cylinder is preferable from the viewpoint of small change in thrust force. However, air bearing cylinders are more expensive than ordinary cylinders. In addition, although a technology has been proposed that uses a counterweight to keep the thrust force constant as in Patent Document 1, it is difficult to perform positioning with μm-level accuracy using such a mechanism. In addition, when the thrust of the pushing mechanism is unstable, the number of positioning times increases and the lead time becomes longer.

本發明,例如提供在使定位精度和成本或低產距時間同時成立方面有利的定位裝置。 [用於解決課題之手段] The present invention provides a positioning device that is advantageous in achieving both positioning accuracy and cost or low throughput time, for example. [Means used to solve problems]

依本發明的一態樣時,提供一種定位裝置,進行在載台之上移動的工件的定位,具備:基準構件,其可在前述載台之上移動;致動器,其驅動前述基準構件;氣缸,其以使前述載台之上的前述工件的第1側面抵靠於前述基準構件的方式,將和前述第1側面為相反側的第2側面以活塞桿進行推壓;計測部,其對前述載台之上的前述工件的位置進行計測;以及控制部,其控制前述致動器及前述氣缸;前述控制部,基於透過了前述計測部下之計測的結果而進行前述致動器的驅動控制,將前述氣缸控制為,在該驅動控制之間,使前述活塞桿暫時從前述工件離開,並再次以前述活塞桿推壓前述工件的前述第2側面。 [發明功效] According to one aspect of the present invention, a positioning device is provided for positioning a workpiece moving on a stage, including: a reference member that can move on the stage; and an actuator that drives the reference member ; A cylinder that presses the second side opposite to the first side with a piston rod in such a manner that the first side of the workpiece on the stage is brought into contact with the reference member; the measurement part, It measures the position of the workpiece on the stage; and a control unit controls the actuator and the cylinder; and the control unit performs operation of the actuator based on the measurement result through the measurement unit. The drive control controls the cylinder so that the piston rod is temporarily separated from the workpiece during the drive control period, and the piston rod again presses the second side surface of the workpiece. [Invention effect]

依本發明時,例如可提供在使定位精度和成本或低產距時間同時成立方面有利的定位裝置。According to the present invention, for example, it is possible to provide a positioning device that is advantageous in achieving positioning accuracy and cost or low throughput time at the same time.

以下,參照圖式詳細說明實施方式。另外,以下的實施方式,非限定申請專利範圍的發明者。於實施方式雖記載複數個特徵,惟不限於此等複數個特徵的全部為發明必須者;此外,複數個特徵亦可任意進行組合。再者,圖式中,對相同或同樣的構成標注相同的參考符號,重複之說明省略。Hereinafter, embodiments will be described in detail with reference to the drawings. In addition, the following embodiments do not limit the scope of the patent claims of the inventors. Although a plurality of features are described in the embodiments, it is not limited to the case where all of the features are necessary for the invention; in addition, the features may be combined arbitrarily. In addition, in the drawings, the same or identical components are denoted by the same reference symbols, and repeated explanations are omitted.

<第1實施方式> 圖1,為針對進行工件的定位的定位裝置的構成進行繪示的圖。於本說明書及圖式,於使水平面為XY平面的XYZ座標系中表示方向。作為定位對象物的工件1,以其表面與水平面(XY平面)成為平行的方式放置在載台35上。因此,在以下,使在沿著工件1的表面之平面內彼此正交的方向為X軸及Y軸,使垂直於X軸及Y軸的方向為Z軸。此外,在以下,將分別平行於XYZ座標系中的X軸、Y軸、Z軸的方向稱為X方向、Y方向、Z方向,將繞X軸的旋轉方向、繞Y軸的旋轉方向、繞Z軸的旋轉方向分別稱為θX方向、θY方向、θZ方向。 <First Embodiment> FIG. 1 is a diagram illustrating the structure of a positioning device for positioning a workpiece. In this specification and the drawings, the direction is expressed in the XYZ coordinate system in which the horizontal plane is the XY plane. The workpiece 1 as the positioning object is placed on the stage 35 so that its surface becomes parallel to the horizontal plane (XY plane). Therefore, in the following description, the directions orthogonal to each other in the plane along the surface of the workpiece 1 are referred to as the X-axis and the Y-axis, and the direction perpendicular to the X-axis and the Y-axis is referred to as the Z-axis. In addition, in the following, the directions parallel to the X-axis, Y-axis, and Z-axis in the XYZ coordinate system will be referred to as the X-direction, the Y-direction, and the Z-direction. The directions of rotation around the Z-axis are called θX direction, θY direction, and θZ direction respectively.

工件1可在載台35上移動。在一例中,在載台35上配置有夾持工件1的工件夾持件36。工件1載置在工件夾持件36上。使工件夾持件36夾持工件1,從而可固定工件1相對於載台35的位置。此情況下,由定位裝置對工件1的位置調整,在工件夾持件36解夾持(dechuck)工件1的狀態下進行。另外,工件夾持件36所採用的工件1的夾持方式可為任意者。在一例中,工件夾持件36被構成為,在夾持時,將工件1的下表面進行吸引從而使工件1的下表面吸附於工件夾持件36的夾持面。此外,工件夾持件36被構成為,在不夾持時,對工件1的下表面噴出氣體而使工件1從工件夾持件36的夾持面上浮。The workpiece 1 can move on the carrier 35 . In one example, a workpiece holder 36 for holding the workpiece 1 is arranged on the stage 35 . The workpiece 1 is placed on the workpiece holder 36 . The workpiece holder 36 clamps the workpiece 1 so that the position of the workpiece 1 relative to the stage 35 can be fixed. In this case, the position adjustment of the workpiece 1 by the positioning device is performed in a state where the workpiece holder 36 dechucks the workpiece 1 . In addition, any method of clamping the workpiece 1 used by the workpiece holder 36 may be used. In one example, the workpiece holder 36 is configured to attract the lower surface of the workpiece 1 during clamping so that the lower surface of the workpiece 1 is attracted to the clamping surface of the workpiece holder 36 . In addition, when the workpiece holder 36 is not clamping, it blows gas to the lower surface of the workpiece 1 to float the workpiece 1 from the clamping surface of the workpiece holder 36 .

定位裝置,具備複數個氣缸2,該複數個氣缸2被配置成推壓工件1的側面。在圖1的例中,複數個氣缸2,可包括沿X方向推壓工件1的2個氣缸和沿Y方向推壓工件1的2個氣缸。工件1在載台35上的移動,被透過分別使此等氣缸進行動作從而進行。此外,定位裝置,具有複數個止動件3,該複數個止動件3對配置在載台35上的既定位置的工件1的移動範圍進行限制。複數個止動件3,可包括對工件1在X方向的移動進行限制的1個以上的止動件和對工件1在Y方向的移動進行限制的1個以上的止動件。複數個氣缸2以及複數個止動件3的數量以及配置位置,根據工件1的大小、形狀以及所要求的定位精度等而適切地決定。止動件3,可包括可在載台35上沿XY方向移動的作為基準構件的定位銷3a和沿XY方向驅動定位銷3a的致動器3b。致動器3b,例如可為由脈衝訊號進行驅動的脈衝馬達。The positioning device includes a plurality of air cylinders 2 arranged to press the side surface of the workpiece 1 . In the example of FIG. 1 , the plurality of cylinders 2 may include two cylinders that push the workpiece 1 in the X direction and two cylinders that push the workpiece 1 in the Y direction. The movement of the workpiece 1 on the stage 35 is performed by respectively actuating these air cylinders. In addition, the positioning device has a plurality of stoppers 3 that limit the movement range of the workpiece 1 arranged at a predetermined position on the stage 35 . The plurality of stoppers 3 may include one or more stoppers that restrict the movement of the workpiece 1 in the X direction and one or more stoppers that restrict the movement of the workpiece 1 in the Y direction. The number and arrangement positions of the plurality of cylinders 2 and the plurality of stoppers 3 are appropriately determined according to the size, shape, required positioning accuracy, etc. of the workpiece 1 . The stopper 3 may include a positioning pin 3a as a reference member that is movable in the XY direction on the stage 35 and an actuator 3b that drives the positioning pin 3a in the XY direction. The actuator 3b may be, for example, a pulse motor driven by a pulse signal.

定位裝置,具有控制裝置5(控制部)。控制裝置5,控制複數個止動件3中的致動器3b和複數個氣缸2。控制裝置5,經由配管回路4,進行對複數個氣缸2的空氣的供應。控制裝置5,例如可由FPGA(現場可程式化邏輯閘陣列(Field Programmable Gate Array)之縮寫)等PLD(可程式化邏輯裝置(Programmable Logic Device)之縮寫)、ASIC(特殊應用積體電路(Application Specific Integrated Circuit)之縮寫)、被置入程式的通用電腦或此等全部或一部分的組合而構成。The positioning device has a control device 5 (control unit). The control device 5 controls the actuators 3b in the plurality of stoppers 3 and the plurality of cylinders 2. The control device 5 supplies air to the plurality of cylinders 2 via the piping circuit 4 . The control device 5 may be, for example, FPGA (Field Programmable Gate Array), PLD (Programmable Logic Device), ASIC (Application Special Integrated Circuit), etc. Specific Integrated Circuit), a general-purpose computer with built-in programming, or a combination of all or part of these.

定位裝置,可具備對工件1在載台35上的位置進行計測的計測裝置6(計測部)。雖然省略了圖示,惟計測裝置6,可包括對工件1的X方向位置進行計測的X計測部,且可包括對工件1的Y方向位置進行計測的Y計測部。X計測部以及Y計測部,例如可分別為線性編碼器。亦可代替線性編碼器,使用配置於定位裝置的主體構造體的干涉儀和配置於工件1的反射鏡的組合而進行工件1在各方向上的位置的計測。The positioning device may include a measurement device 6 (measurement unit) that measures the position of the workpiece 1 on the stage 35 . Although illustration is omitted, the measurement device 6 may include an X measurement unit that measures the X-direction position of the workpiece 1 , and may include a Y-measurement unit that measures the Y-direction position of the workpiece 1 . The X measurement unit and the Y measurement unit may each be a linear encoder, for example. Instead of the linear encoder, the position of the workpiece 1 in each direction may be measured using a combination of an interferometer disposed in the main body structure of the positioning device and a reflector disposed on the workpiece 1 .

計測裝置6,與運算裝置7連接,由計測裝置6獲得的計測資料被傳送到運算裝置7。運算裝置7,算出供於將工件1定位在目標位置用的致動器3b的驅動量。另外,運算裝置7的功能亦可由控制裝置5實現。The measurement device 6 is connected to the arithmetic device 7 , and the measurement data obtained by the measurement device 6 is transmitted to the arithmetic device 7 . The arithmetic unit 7 calculates the driving amount of the actuator 3b for positioning the workpiece 1 at the target position. In addition, the function of the computing device 7 can also be realized by the control device 5 .

參照圖2,說明有關氣缸2以及配管回路4的構成。另外,雖然在圖1中示出了複數個氣缸2,惟在圖2中為了簡單化說明而代表性地僅示出了1個氣缸2。其他氣缸2方面,亦可被與圖2同樣地構成。The structure of the cylinder 2 and the piping circuit 4 will be described with reference to FIG. 2 . In addition, although a plurality of cylinders 2 are shown in FIG. 1 , only one cylinder 2 is representatively shown in FIG. 2 to simplify the description. The other cylinders 2 can also be configured in the same manner as in Fig. 2 .

氣缸2,可包括氣缸管21、活塞22和活塞桿23。活塞22,配置在氣缸管21的內部,使得將氣缸管21的內部分隔為左右的腔室A以及B,在氣缸管21的內部沿紙面左右方向往返運動。活塞桿23的一端,由活塞22支撐,活塞桿23的另一端為了推壓工件1而可與工件1接觸。配管回路4,可包括電磁閥41,該電磁閥41對氣缸2進行空氣的供應和排出的切換。透過由控制裝置5控制電磁閥41,定位裝置,可執行使活塞桿23從工件1離開的動作以及以活塞桿23推壓工件1的動作。The cylinder 2 may include a cylinder tube 21, a piston 22 and a piston rod 23. The piston 22 is arranged inside the cylinder tube 21 so as to divide the inside of the cylinder tube 21 into left and right chambers A and B, and reciprocates inside the cylinder tube 21 in the left-right direction on the paper. One end of the piston rod 23 is supported by the piston 22, and the other end of the piston rod 23 can contact the workpiece 1 in order to push the workpiece 1. The piping circuit 4 may include a solenoid valve 41 that switches the supply and discharge of air to the cylinder 2 . By controlling the solenoid valve 41 and the positioning device by the control device 5, the piston rod 23 can be moved away from the workpiece 1 and the piston rod 23 can be used to push the workpiece 1.

在圖2(a)所示的電磁閥41的非通電時,電磁閥41的第1端口p1,透過配管42連接於供應壓縮空氣的供應源45(原壓),電磁閥41的第2端口p2,透過配管43連接於氣缸2的腔室A。據此,配管42與配管43連通。此外,此時,電磁閥41的第3端口p3透過配管44連接於氣缸2的腔室B,配管44連通於作為排氣口的電磁閥41的第4端口p4。此情況下,來自供應源45的壓縮空氣向腔室A供應,活塞桿23(向紙面左側)後退,腔室B內的氣體被排出。When the solenoid valve 41 shown in FIG. 2(a) is de-energized, the first port p1 of the solenoid valve 41 is connected to the supply source 45 (original pressure) that supplies compressed air through the pipe 42, and the second port of the solenoid valve 41 p2 is connected to the chamber A of the cylinder 2 through the pipe 43. Accordingly, the pipe 42 and the pipe 43 are connected. In addition, at this time, the third port p3 of the solenoid valve 41 is connected to the chamber B of the cylinder 2 through the pipe 44, and the pipe 44 is connected to the fourth port p4 of the solenoid valve 41 serving as an exhaust port. In this case, compressed air is supplied from the supply source 45 to the chamber A, the piston rod 23 retreats (to the left side of the paper), and the gas in the chamber B is discharged.

控制裝置5,透過向線圈C供電而對線圈C進行電磁驅動。在透過控制裝置5向線圈C供電的期間,如圖2(b)所示,電磁閥41的第5端口p5,透過配管42連接於供應源45,第6端口p6,透過配管44連接於氣缸2的腔室B。據此,配管42與配管44連通。此外,電磁閥41的第7端口p7,透過配管43連接於氣缸2的腔室A,配管43連通於作為排氣口的電磁閥41的第8端口p8。此情況下,來自供應源45的壓縮空氣向腔室B供應,活塞桿23(向紙面右側)突出,腔室A內的氣體被排出。The control device 5 electromagnetically drives the coil C by supplying power to the coil C. While power is being supplied to the coil C through the control device 5, as shown in FIG. 2(b), the fifth port p5 of the solenoid valve 41 is connected to the supply source 45 through the pipe 42, and the sixth port p6 is connected to the cylinder through the pipe 44. Chamber B of 2. Accordingly, the pipe 42 and the pipe 44 are connected. In addition, the seventh port p7 of the solenoid valve 41 is connected to the chamber A of the cylinder 2 through the pipe 43, and the pipe 43 is connected to the eighth port p8 of the solenoid valve 41 serving as an exhaust port. In this case, compressed air is supplied from the supply source 45 to the chamber B, the piston rod 23 protrudes (to the right side of the paper), and the gas in the chamber A is discharged.

本實施方式的定位裝置,透過氣缸2推壓工件1的側面,使工件1抵靠於止動件3的定位銷3a,從而進行定位。例如在需要μm級以下的定位精度的情況下,需要將致動器3b設計成高精度地驅動定位銷3a。從此觀點出發,作為致動器3b,由脈衝訊號驅動的脈衝馬達(例如步進馬達)為適。此外,例如在需要μm級以下的定位精度的情況下,推壓工件1的機構方面,需要產生的推力無論在何行程位置皆為固定。從該觀點出發,推壓工件1的機構方面,優選採用氣缸。The positioning device of this embodiment uses the cylinder 2 to push the side surface of the workpiece 1 so that the workpiece 1 abuts the positioning pin 3a of the stopper 3 for positioning. For example, when positioning accuracy of μm level or less is required, the actuator 3b needs to be designed to drive the positioning pin 3a with high accuracy. From this point of view, a pulse motor (for example, a stepping motor) driven by a pulse signal is suitable as the actuator 3b. In addition, for example, when positioning accuracy of μm level or less is required, the thrust force that needs to be generated by the mechanism that presses the workpiece 1 is fixed regardless of the stroke position. From this point of view, it is preferable to use a cylinder as a mechanism for pressing the workpiece 1 .

在本實施方式中,定位裝置,一邊持續由氣缸2對工件1的側面供壓,一邊透過致動器3b調整定位銷3a的位置。具體而言,為了調整位置,工件1成為由工件夾持件36解夾持的狀態。在該狀態下,如圖3(a)、(b)所示,氣缸2,以活塞桿23推壓工件1的與第1側面1a相反側的第2側面1b,使得工件1的第1側面1a與定位銷3a抵接。之後,定位裝置,透過計測裝置6計測工件1的位置。此時,為了提高計測精度,可作成為工件1被透過工件夾持件36夾持的狀態而進行計測。控制裝置5,基於透過計測裝置6得到的計測結果而進行致動器3b的驅動控制。例如在驅動控制中,控制裝置5,以使計測到的位置落入於容許範圍內的方式,透過致動器3b調整定位銷3a的位置。In this embodiment, the positioning device adjusts the position of the positioning pin 3a through the actuator 3b while continuing to apply pressure to the side surface of the workpiece 1 from the cylinder 2. Specifically, in order to adjust the position, the workpiece 1 is released from the workpiece holder 36 . In this state, as shown in Figures 3 (a) and (b), the cylinder 2 uses the piston rod 23 to push the second side surface 1b of the workpiece 1 on the opposite side to the first side surface 1a, so that the first side surface of the workpiece 1 1a is in contact with the positioning pin 3a. Thereafter, the positioning device measures the position of the workpiece 1 through the measuring device 6 . At this time, in order to improve the measurement accuracy, measurement can be performed in a state where the workpiece 1 is clamped through the workpiece holder 36 . The control device 5 performs drive control of the actuator 3b based on the measurement results obtained by the measurement device 6 . For example, in drive control, the control device 5 adjusts the position of the positioning pin 3a through the actuator 3b so that the measured position falls within the allowable range.

在如此之定位銷3a的驅動控制中,可能會發生透過致動器3b驅動的定位銷3a的驅動方向的反轉。在定位銷3a的驅動方向反轉的動作中,氣缸2(活塞桿23)的推力產生變化。在需要μm級以下的定位精度的情況下,不能無視如此之氣缸2的推力變化。針對此點,參照圖3(a)、(b)進行說明。In such drive control of the positioning pin 3a, the driving direction of the positioning pin 3a driven by the actuator 3b may be reversed. When the driving direction of the positioning pin 3a is reversed, the thrust force of the cylinder 2 (piston rod 23) changes. When positioning accuracy of μm level or less is required, such a change in thrust of the cylinder 2 cannot be ignored. This point will be described with reference to Figures 3(a) and (b).

在圖3(a)、(b)中,氣缸管21以及活塞桿23被桿蓋24覆蓋。此外,在氣缸管21的內部,配設有墊料(packing)25,該墊料25為供於防止壓縮空氣的洩漏用的密封構件。墊料25,將活塞桿23的外周面與氣缸管21的內周面密封。墊料25,固定於氣缸管21的內周面,另一方面相對於活塞桿23僅可滑動地接觸而不被固定。隨著活塞桿23的移動,墊料25彈性變形。氣缸2的推力10,為由施加於活塞桿23的壓力產生的力12和墊料25的變形傾向恢復的力(以下,稱為墊料25的彈性力11)的合計。In FIGS. 3(a) and (b) , the cylinder tube 21 and the piston rod 23 are covered with a rod cover 24 . Furthermore, a packing 25 serving as a sealing member for preventing leakage of compressed air is disposed inside the cylinder tube 21 . The gasket 25 seals the outer peripheral surface of the piston rod 23 and the inner peripheral surface of the cylinder tube 21 . The gasket 25 is fixed to the inner peripheral surface of the cylinder tube 21, but is only in sliding contact with the piston rod 23 and is not fixed. As the piston rod 23 moves, the gasket 25 elastically deforms. The thrust force 10 of the cylinder 2 is the total of the force 12 generated by the pressure applied to the piston rod 23 and the force that restores the deformation tendency of the gasket 25 (hereinafter referred to as the elastic force 11 of the gasket 25).

思考在使定位銷3a和活塞桿23夾著工件1地互擠的狀態下定位銷3a的驅動方向發生反轉的情況。此為從圖3(a)的狀態向圖3(b)的狀態變化的情況或從圖3(b)的狀態向圖3(a)的狀態變化的情況。此情況下,活塞桿23的移動方向亦隨著定位銷3a的驅動方向的反轉而反轉。於是,墊料25的變形方向亦改變,墊料25的彈性力11作用的方向發生反轉。由此,氣缸2的推力10變小。在定位銷3a的驅動方向發生反轉之際,由於由氣缸推壓的止動件3以及工件1的彈性變形量發生改變,故產生定位銷3a的驅動量與工件1的移動量不一致的現象。Consider a case where the driving direction of the positioning pin 3a is reversed in a state where the positioning pin 3a and the piston rod 23 are pressed against each other with the workpiece 1 sandwiched between them. This is a change from the state of FIG. 3(a) to the state of FIG. 3(b) or a change from the state of FIG. 3(b) to the state of FIG. 3(a). In this case, the moving direction of the piston rod 23 is also reversed as the driving direction of the positioning pin 3a is reversed. As a result, the deformation direction of the cushion material 25 also changes, and the direction in which the elastic force 11 of the cushion material 25 acts is reversed. As a result, the thrust force 10 of the cylinder 2 becomes smaller. When the driving direction of the positioning pin 3a is reversed, the amount of elastic deformation of the stopper 3 pushed by the cylinder and the workpiece 1 changes, so the driving amount of the positioning pin 3a does not match the movement amount of the workpiece 1. .

另一方面,如圖3(c)所示,若沿相同方向(在不反轉之下)持續驅動定位銷3a,則墊料25的變形量成為最大。當在該狀態下向相同方向持續驅動活塞桿23的情況下,由於墊料25保持最大變形量,因此墊料25的彈性力11被保持為固定。On the other hand, as shown in FIG. 3(c) , if the positioning pin 3a is continuously driven in the same direction (without reversal), the deformation amount of the spacer 25 becomes maximum. When the piston rod 23 is continuously driven in the same direction in this state, since the gasket 25 maintains the maximum deformation amount, the elastic force 11 of the gasket 25 is maintained constant.

根據如以上的現象,在定位銷3a的驅動方向反轉了的情況下,在墊料25的變形量成為最大之前的區域中,不能使工件1移動所設想的移動量,變成反復進行定位驅動和計測。由此,導致定位驅動次數增加,產距時間會增加。另外,作為其解決對策,如果使用沒有墊料的空氣軸承氣缸,就可消除氣缸的推力變化。然而,空氣軸承氣缸,比起一般的氣缸,成本變高。此外,在日本特開昭59-001032號公報(專利文獻1),雖已提出了使用配重保持推力一定地進行推壓的技術,惟以此機構無法以μm級的精度進行控制。According to the above phenomenon, when the driving direction of the positioning pin 3a is reversed, the workpiece 1 cannot be moved by the expected movement amount in the area before the deformation amount of the spacer 25 reaches the maximum, and the positioning drive is repeated. and measurement. As a result, the number of positioning drives increases and the lead time increases. In addition, as a countermeasure, if an air bearing cylinder without gasket is used, the thrust change of the cylinder can be eliminated. However, the cost of air bearing cylinders is higher than that of ordinary cylinders. In addition, Japanese Patent Application Laid-Open No. 59-001032 (Patent Document 1) proposes a technique of using a weight to keep the thrust force constant for pushing, but this mechanism cannot be controlled with μm-level accuracy.

於是,在本實施方式中,控制裝置5,將氣缸2控制為,在定位銷3a的驅動控制中,僅在墊料25的彈性力11作用於相同方向的狀態下使活塞桿23推壓工件1。為了實現該控制,控制裝置5,在定位銷3a的驅動控制中,反復進行使活塞桿23暫時從工件1離開並再次以活塞桿23推壓工件1的操作。在第1例中,控制裝置5,每當驅動致動器3b時,將氣缸2控制為,使活塞桿23暫時從工件1離開並再次用活塞桿23推壓工件1的第2側面1b。在第2例中,控制裝置5,每當驅動致動器3b時,對驅動方向是否反轉進行判定。根據判定出驅動方向發生反轉的情況,控制裝置5,將氣缸2控制為,使活塞桿23暫時從工件1離開並再次用活塞桿23推壓工件1的第2側面1b。Therefore, in this embodiment, the control device 5 controls the cylinder 2 so that the piston rod 23 presses the workpiece only in a state where the elastic force 11 of the spacer 25 acts in the same direction during the driving control of the positioning pin 3a. 1. In order to realize this control, the control device 5 repeatedly performs an operation of temporarily separating the piston rod 23 from the workpiece 1 and pressing the workpiece 1 with the piston rod 23 again during the driving control of the positioning pin 3a. In the first example, the control device 5 controls the air cylinder 2 to temporarily separate the piston rod 23 from the workpiece 1 and press the second side surface 1b of the workpiece 1 with the piston rod 23 again every time the actuator 3b is driven. In the second example, the control device 5 determines whether the driving direction is reversed every time the actuator 3b is driven. Upon determining that the driving direction is reversed, the control device 5 controls the cylinder 2 to temporarily separate the piston rod 23 from the workpiece 1 and then press the second side surface 1 b of the workpiece 1 with the piston rod 23 again.

以下,參照圖4的流程圖,詳細說明依上述第2例時的工件1的定位動作的透過了控制裝置5下之控制順序之例。此控制順序,在工件1被載置於工件夾持件36的夾持面之後開始。Hereinafter, an example of the control sequence of the transmission control device 5 according to the positioning operation of the workpiece 1 in the second example will be described in detail with reference to the flowchart of FIG. 4 . This control sequence starts after the workpiece 1 is placed on the clamping surface of the workpiece holder 36 .

在S1中,控制裝置5,控制工件夾持件36而使工件1成為解夾持狀態。在一例中,工件夾持件36透過對工件1的下表面噴出氣體而使工件1從工件夾持件36的夾持面上浮,從而可成為解夾持狀態。In S1, the control device 5 controls the workpiece holder 36 to bring the workpiece 1 into an unclamped state. In one example, the workpiece holder 36 blows gas onto the lower surface of the workpiece 1 so that the workpiece 1 floats from the clamping surface of the workpiece holder 36, thereby bringing the workpiece 1 into the unclamped state.

在S2中,控制裝置5,按照根據工件1的目標位置而決定的定位銷3a的目標位置,驅動致動器3b。在S3中,控制裝置5,控制氣缸2而使活塞桿23推壓工件1。具體而言,控制裝置5,向線圈C供電。在向線圈C供電的期間,線圈C進行電磁驅動而使活塞桿2突出(圖2(b)),推壓工件1。In S2, the control device 5 drives the actuator 3b in accordance with the target position of the positioning pin 3a determined based on the target position of the workpiece 1. In S3, the control device 5 controls the cylinder 2 so that the piston rod 23 presses the workpiece 1. Specifically, the control device 5 supplies power to the coil C. While power is being supplied to the coil C, the coil C is electromagnetically driven to protrude the piston rod 2 (Fig. 2(b)), thereby pressing the workpiece 1.

在S4中,控制裝置5,控制工件夾持件36而使工件1成為夾持狀態。在一例中,工件夾持件36透過將工件1的下表面進行吸引從而將工件1吸附於工件夾持件36的夾持面,從而可成為夾持狀態。另外,此S4中的夾持,是為了高精度地進行在接下來的S5進行的工件1的位置計測的操作。在位置計測的精度得到確保的情況下,此S4中的夾持非必須。In S4, the control device 5 controls the workpiece holder 36 to bring the workpiece 1 into a clamped state. In one example, the workpiece holder 36 attracts the lower surface of the workpiece 1 to adsorb the workpiece 1 to the clamping surface of the workpiece holder 36 , so that the workpiece 1 can be in a clamped state. In addition, the clamping in S4 is an operation to perform the position measurement of the workpiece 1 performed in the subsequent S5 with high accuracy. When the accuracy of position measurement is ensured, clamping in S4 is not necessary.

在S5中,控制裝置5,使計測裝置6,對載台35上的工件1的位置進行計測。透過計測裝置6得到的計測資料,被傳送至運算裝置7。運算裝置7,計算計測資料所示的工件1的位置與工件1的目標位置之間的誤差。在S6中,運算裝置7,判定誤差是否落入於基於要求精度下的容許範圍內。若誤差落入於容許範圍內,則處理結束。在誤差沒有落入於容許範圍內的情況下,處理進入S7。In S5, the control device 5 causes the measurement device 6 to measure the position of the workpiece 1 on the stage 35. The measurement data obtained by the measurement device 6 is sent to the computing device 7 . The arithmetic unit 7 calculates an error between the position of the workpiece 1 shown in the measurement data and the target position of the workpiece 1 . In S6, the computing device 7 determines whether the error falls within the allowable range based on the required accuracy. If the error falls within the allowable range, the process ends. If the error does not fall within the allowable range, the process proceeds to S7.

在S7中,運算裝置7,基於上述誤差,算出供於將工件1定位在目標位置用的致動器3b的驅動量。算出的驅動量的資料,被向控制裝置5傳送。在S8中,控制裝置5,針對在S7算出的驅動量,判定致動器3b的驅動方向是否會發生反轉。具體而言,控制裝置5,針對在S7算出的驅動量,判定該驅動方向與S2中的致動器3b的驅動方向是否相反。若二者的驅動方向相反,則判定為驅動方向發生反轉;若二者的驅動方向相同,則判定為驅動方向沒有不會反轉。在判定為驅動方向不會反轉的情況下,處理返回到S1。在判定為驅動方向會反轉的情況下,處理進入S9。在S9中,控制裝置5控制氣缸2而使活塞桿23從工件1離開。具體而言,控制裝置5,停止向線圈C供電。透過停止向線圈C供電,使線圈C的電磁驅動被停止,活塞桿23後退(圖2(a))。由此,活塞桿23從工件1離開。之後,處理返回S1。In S7, the calculation device 7 calculates the driving amount of the actuator 3b for positioning the workpiece 1 at the target position based on the above error. The calculated driving amount data is transmitted to the control device 5 . In S8, the control device 5 determines whether the driving direction of the actuator 3b will be reversed with respect to the driving amount calculated in S7. Specifically, the control device 5 determines whether the driving direction calculated in S7 is opposite to the driving direction of the actuator 3b in S2. If the driving directions of the two are opposite, it is determined that the driving direction is reversed; if the driving directions of the two are the same, it is determined that the driving direction is not reversed. If it is determined that the driving direction will not be reversed, the process returns to S1. When it is determined that the driving direction will be reversed, the process proceeds to S9. In S9, the control device 5 controls the cylinder 2 to separate the piston rod 23 from the workpiece 1. Specifically, the control device 5 stops supplying power to the coil C. By stopping the power supply to the coil C, the electromagnetic drive of the coil C is stopped, and the piston rod 23 retreats (Fig. 2(a)). As a result, the piston rod 23 is separated from the workpiece 1 . After that, the process returns to S1.

如上述般,進行定位銷3a以及氣缸2各自的驅動控制,直到工件1的目標位置與計測到的位置之間的誤差落入於容許範圍內為止。依此驅動控制時,在致動器3b的驅動方向會反轉之際(在S8中為「是」),活塞桿23從工件1暫時離開(S9)。之後,控制氣缸2而使活塞桿23再次接觸工件1(S3)。透過作成如此,氣缸2可始終從相同的行進方向推壓工件1,定位時的墊料25的彈性力11的變化消失。由此,氣缸的推力10始終為固定,故定位精度得到提升。此外,定位驅動次數減少,可縮短產距時間。As described above, each drive control of the positioning pin 3a and the air cylinder 2 is performed until the error between the target position of the workpiece 1 and the measured position falls within the allowable range. In this drive control, when the driving direction of the actuator 3b is reversed (YES in S8), the piston rod 23 is temporarily separated from the workpiece 1 (S9). Thereafter, the cylinder 2 is controlled so that the piston rod 23 contacts the workpiece 1 again (S3). By doing so, the cylinder 2 can always push the workpiece 1 from the same traveling direction, and the change in the elastic force 11 of the pad 25 during positioning disappears. As a result, the thrust force 10 of the cylinder is always fixed, so the positioning accuracy is improved. In addition, the number of positioning drives is reduced, which shortens the production lead time.

<變形例> 在上述的第1實施方式中,定位裝置,進行在工件夾持件36上處於解夾持狀態的工件1的定位。亦可代替之,透過驅動載台35上的工件夾持件36從而進行該定位。 <Modification> In the first embodiment described above, the positioning device positions the workpiece 1 in the unclamped state on the workpiece holder 36 . Alternatively, the positioning may be performed by driving the workpiece holder 36 on the stage 35 .

在第1實施方式中,雖針對致動器3b的驅動軸數為1軸的情況進行了說明,惟致動器3b的驅動軸數亦可為2軸以上。In the first embodiment, the case where the number of drive shafts of the actuator 3b is one has been described, but the number of drive shafts of the actuator 3b may be two or more.

在第1實施方式中,作為致動器3b,雖說明脈衝馬達為適,惟不限於此。致動器3b方面,亦可例如採用可進行數μm級的精密驅動的壓電致動器等致動器。In the first embodiment, a pulse motor is suitable as the actuator 3b, but it is not limited to this. As the actuator 3b, for example, an actuator such as a piezoelectric actuator capable of precise driving on the order of several μm may be used.

在第1實施方式中,雖說明了工件夾持件36被構成為透過對工件1的下表面噴出氣體而使工件1從工件夾持件36的夾持面上浮從而成為解夾持狀態,惟不限於此。例如,亦可採用透過電磁方式使工件1從夾持面上浮的機構。In the first embodiment, it has been described that the workpiece holder 36 is configured so that the workpiece 1 floats from the clamping surface of the workpiece holder 36 by ejecting gas to the lower surface of the workpiece 1 and enters the unclamped state. However, Not limited to this. For example, a mechanism that causes the workpiece 1 to float from the clamping surface through electromagnetic means may also be used.

<第2實施方式> 上述的定位裝置,可應用於對基板轉印原版的圖案的微影裝置。微影裝置,可包括曝光裝置、壓印裝置、帶電粒子束描繪裝置等。曝光裝置,為對供應至基板之上的光阻經由原版進行曝光,從而在該光阻形成和原版的圖案對應的潛像的裝置。壓印裝置,為透過在使模具(原版)與供應到基板之上的壓印材進行接觸的狀態下使壓印材固化,從而在基板之上形成圖案的裝置。帶電粒子束描繪裝置,為對供應至基板之上的光阻透過帶電粒子束而描繪圖案從而在該光阻形成潛像的裝置。以下,為了提供具體例,針對微影裝置被構成為曝光裝置之例進行說明。 <Second Embodiment> The above-mentioned positioning device can be applied to a photolithography device that transfers a pattern of an original plate to a substrate. Lithography devices may include exposure devices, imprinting devices, charged particle beam drawing devices, etc. The exposure device is a device that exposes the photoresist supplied to the substrate through the original plate, thereby forming a latent image corresponding to the pattern of the original plate on the photoresist. The imprint device is a device that forms a pattern on a substrate by solidifying the imprint material supplied on the substrate by bringing the mold (original plate) into contact with the imprint material. The charged particle beam drawing device is a device that draws a pattern by passing a charged particle beam through the photoresist supplied to the substrate, thereby forming a latent image on the photoresist. In the following, in order to provide a specific example, an example in which the lithography device is configured as an exposure device will be described.

參照圖5,說明有關應用了上述第1實施方式的定位裝置的曝光裝置131。曝光裝置131,具有照明光學系統115、遮罩台116、投影光學系統117、基板台118和控制部119。曝光裝置131,收容於曝光室126。在此,使Y方向為遮罩M及基板P的掃描方向,使X方向為非掃描方向。Referring to FIG. 5 , the exposure device 131 to which the positioning device of the first embodiment is applied will be described. The exposure device 131 includes an illumination optical system 115, a mask stage 116, a projection optical system 117, a substrate stage 118, and a control unit 119. The exposure device 131 is housed in the exposure chamber 126 . Here, the Y direction is the scanning direction of the mask M and the substrate P, and the X direction is the non-scanning direction.

照明光學系統115,例如使用來自超高壓水銀燈等光源的光而照射遮罩M。照明光學系統115,作為本實施方式的一例,對遮罩M照射被成形為狹縫狀的照明光。遮罩M,例如為形成有要轉印於基板P的圖案(例如電路圖案)的玻璃製的原版。遮罩台116,為保持遮罩M而沿X及Y方向移動的載台。The illumination optical system 115 illuminates the mask M using light from a light source such as an ultrahigh-pressure mercury lamp, for example. As an example of this embodiment, the illumination optical system 115 irradiates the mask M with illumination light shaped into a slit shape. The mask M is, for example, a glass original plate on which a pattern (for example, a circuit pattern) to be transferred to the substrate P is formed. The mask stage 116 is a stage that moves in the X and Y directions in order to hold the mask M.

投影光學系統117,將由遮罩台116保持的遮罩M和由基板台118內的基板搭載部120保持的基板P維持為光學共軛的關係,將在遮罩M的照明區域存在的圖案的像投影於基板P。投影光學系統117,在本實施方式中,包括第1平行平板121、梯形鏡122、凹面鏡123、凸面鏡124和第2平行平板125。在投影光學系統117中,來自遮罩M的光,依序經過第1平行平板121、梯形鏡122、凹面鏡123、凸面鏡124、凹面鏡123、梯形鏡122、第2平行平板125,到達基板P。來自投影光學系統117的光在基板上的投影區域(曝光區域),設定為既定的形狀,例如圓弧形狀。The projection optical system 117 maintains the mask M held by the mask stage 116 and the substrate P held by the substrate mounting part 120 in the substrate stage 118 in an optically conjugate relationship, and converts the pattern of the pattern existing in the illumination area of the mask M The image is projected on the substrate P. In this embodiment, the projection optical system 117 includes a first parallel flat plate 121 , a trapezoidal mirror 122 , a concave mirror 123 , a convex mirror 124 and a second parallel flat plate 125 . In the projection optical system 117, the light from the mask M passes through the first parallel flat plate 121, the trapezoidal mirror 122, the concave mirror 123, the convex mirror 124, the concave mirror 123, the trapezoidal mirror 122, and the second parallel flat plate 125 in order, and reaches the substrate P. The projection area (exposure area) of the light from the projection optical system 117 on the substrate is set to a predetermined shape, for example, an arc shape.

基板P,例如為在表面形成有抗蝕層(感光劑)的玻璃製的平板。基板台118,以基板搭載部120對基板P進行真空吸附,例如為沿X、Y及Z方向(進一步而言,θX、θY及θZ方向)移動的載台。The substrate P is, for example, a glass flat plate with a resist layer (photosensitive agent) formed on the surface. The substrate stage 118 uses the substrate mounting part 120 to vacuum-suck the substrate P, and is, for example, a stage that moves in the X, Y, and Z directions (furthermore, the θX, θY, and θZ directions).

控制部119,由包括CPU、記憶體的電腦等構成,按照記憶體中儲存的程序進行曝光裝置131的各部分的控制及運算處理等。此外,在本實施方式中,雖為由控制部119控制基板台118,惟亦可設置對基板台118進行控制的專用的載台控制部。此情況下,載台控制部,基於來自控制部119的指令,控制基板台118。此外,控制部119,既可與曝光裝置131的其他部分一體(在共用的框體內)地構成,亦可和曝光裝置131的其他部分不同形體地(於別的框體內)地構成。The control unit 119 is composed of a computer including a CPU and a memory, and performs control and calculation processing of each part of the exposure device 131 according to the program stored in the memory. In addition, in this embodiment, although the substrate stage 118 is controlled by the control unit 119, a dedicated stage control unit that controls the substrate stage 118 may be provided. In this case, the stage control unit controls the substrate stage 118 based on the instruction from the control unit 119 . In addition, the control unit 119 may be configured integrally with other parts of the exposure device 131 (in a common frame), or may be configured in a different form from other parts of the exposure device 131 (in a separate frame).

在曝光室126,設有開口部127,該開口部127與收容有機械手129的介面腔室(interface chamber)128連通,經由開口部127,在曝光裝置131與機械手129之間進行基板P的搬送(交接)。在本實施方式中,若保持著基板P的機械手129經由開口部127進入曝光室126,則使基板台118移動到開口部127附近的既定位置(基板P的搬送位置)。然後,使基板搬送部130驅動(上升)到機械手129附近,從機械手129接收基板P。基板搬送部130,將接收到的基板P搭載於基板搭載部120。The exposure chamber 126 is provided with an opening 127 that communicates with an interface chamber 128 housing the robot 129. Through the opening 127, the substrate P is processed between the exposure device 131 and the robot 129. transportation (handover). In this embodiment, when the robot 129 holding the substrate P enters the exposure chamber 126 through the opening 127, the substrate stage 118 is moved to a predetermined position near the opening 127 (the transfer position of the substrate P). Then, the substrate transport unit 130 is driven (raised) to the vicinity of the robot 129 and receives the substrate P from the robot 129 . The substrate transport unit 130 mounts the received substrate P on the substrate mounting unit 120 .

如前述,在曝光裝置131中,使用使遮罩M移動的遮罩台116和使基板P移動的基板台118,同步地掃描遮罩M和基板P,將在遮罩M上描繪出的圖案投影到基板P上。為此,需要使在遮罩M上描繪的圖案方向與掃描方向一致。As described above, in the exposure device 131, the mask stage 116 that moves the mask M and the substrate stage 118 that moves the substrate P are used to scan the mask M and the substrate P synchronously, and the pattern drawn on the mask M is projected onto the substrate P. For this purpose, the direction of the pattern drawn on the mask M needs to be consistent with the scanning direction.

在遮罩M上描繪的圖案,未被相對於遮罩M的外形平行、垂直地進行描繪。此外,對各個遮罩M描繪的圖案的朝向、配置不同。因此,在遮罩台116需要以圖案基準而對準所載置的遮罩M。在本實施方式中,第1實施方式中說明的定位裝置,被構成於遮罩台116。此情況下,是定位對象物的工件1,為遮罩M。遮罩M的對準被透過定位裝置而實施。曝光裝置131,將定位後的遮罩M的圖案轉印到基板P。另外,在第1實施方式中說明的控制裝置5的功能,亦可由控制部119而實現。The pattern drawn on the mask M is not drawn parallel or perpendicular to the outer shape of the mask M. In addition, the orientation and arrangement of the pattern drawn on each mask M are different. Therefore, the mask M placed on the mask stage 116 needs to be aligned based on the pattern. In this embodiment, the positioning device described in the first embodiment is configured in the masking base 116 . In this case, the workpiece 1 of the positioning object is the mask M. The alignment of the mask M is carried out through positioning means. The exposure device 131 transfers the positioned pattern of the mask M to the substrate P. In addition, the functions of the control device 5 described in the first embodiment can also be realized by the control unit 119 .

如以上,透過將在第1實施方式中說明的定位裝置應用於遮罩台116,遮罩M的定位精度得到提升。此外,遮罩M的定位驅動次數減少,可縮短產距時間,由此曝光裝置的生產率會提升。As described above, by applying the positioning device described in the first embodiment to the mask table 116, the positioning accuracy of the mask M is improved. In addition, the number of positioning drives of the mask M is reduced, which shortens the lead time, thereby improving the productivity of the exposure device.

上述例子,示出了由定位裝置進行掩模遮罩M的定位,將定位後的掩模遮罩M的圖案轉印到基板的之例子。與此同樣地,曝光裝置131,亦可被構成為由定位裝置進行基板P的定位,向定位後的基板P轉印遮罩M的圖案。The above example shows an example in which the positioning device positions the mask mask M and transfers the pattern of the positioned mask mask M to the substrate. Similarly, the exposure device 131 may be configured such that the substrate P is positioned by a positioning device and the pattern of the mask M is transferred to the positioned substrate P.

<物品製造方法的實施方式> 本發明的實施方式中的物品製造方法,例如適於製造半導體裝置等的微型裝置、具有微細構造的元件等的物品。本實施方式的物品製造方法,包含:使用上述的微影裝置(曝光裝置、壓印裝置、描繪裝置等)對基板轉印原版的圖案的程序;以及將在該程序轉印了圖案的基板進行加工的程序。再者,該製造方法,包含其他周知的程序(氧化、成膜、蒸鍍、摻雜、平坦化、蝕刻、抗蝕劑剝離、切割、接合、封裝等)。本實施方式的物品製造方法,比起歷來的方法,有利於物品的性能、品質、生產性、生產成本中的至少一者。 <Embodiment of article manufacturing method> The article manufacturing method according to the embodiment of the present invention is suitable for manufacturing articles such as microdevices such as semiconductor devices and elements having a fine structure. The article manufacturing method of this embodiment includes: a process of transferring a pattern of an original plate to a substrate using the above-mentioned lithography device (exposure device, imprinting device, drawing device, etc.); and conducting the process on the substrate to which the pattern has been transferred. Processing procedures. Furthermore, the manufacturing method includes other well-known procedures (oxidation, film formation, evaporation, doping, planarization, etching, resist stripping, cutting, bonding, packaging, etc.). The article manufacturing method of this embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article compared to conventional methods.

發明不限於上述實施方式,在不背離發明的精神及範圍內,可進行各種的變更及變形。因此,撰寫申請專利範圍以公開發明的範圍。The invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Therefore, the patent application is drafted to disclose the scope of the invention.

1:工件 2:氣缸 3:止動件 3a:定位鞘 3b:致動器 4:配管回路 5:控制裝置 6:計測裝置 7:運算裝置 35:載台 36:工件夾持件 1: workpiece 2: Cylinder 3: Stopper 3a: Positioning sheath 3b: Actuator 4:Piping circuit 5:Control device 6: Measuring device 7:Computing device 35: Carrier platform 36: Workpiece clamping parts

[圖1]針對定位裝置的構成進行繪示的圖。 [圖2]針對氣缸及配管回路的構成進行繪示的圖。 [圖3]針對氣缸的推力變化進行說明的圖。 [圖4]定位動作的流程圖。 [圖5]針對曝光裝置的構成進行繪示的圖。 [Fig. 1] A diagram illustrating the structure of a positioning device. [Fig. 2] A diagram illustrating the structure of a cylinder and a piping circuit. [Fig. 3] A diagram illustrating changes in thrust force of the cylinder. [Fig. 4] Flowchart of positioning operation. [Fig. 5] A diagram illustrating the structure of an exposure device.

1:工件 1: workpiece

2:氣缸 2: Cylinder

3:止動件 3: Stopper

3a:定位鞘 3a: Positioning sheath

3b:致動器 3b: Actuator

4:配管回路 4:Piping circuit

5:控制裝置 5:Control device

6:計測裝置 6: Measuring device

7:運算裝置 7:Computing device

35:載台 35: Carrier platform

36:工件夾持件 36: Workpiece clamping parts

Claims (12)

一種定位裝置,進行在載台之上移動的工件的定位, 具備: 基準構件,其可在前述載台之上移動; 致動器,其驅動前述基準構件; 氣缸,其以使前述載台之上的前述工件的第1側面抵靠於前述基準構件的方式,將和前述第1側面為相反側的第2側面以活塞桿進行推壓; 計測部,其對前述載台之上的前述工件的位置進行計測;以及 控制部,其控制前述致動器及前述氣缸; 前述控制部,基於透過了前述計測部下之計測的結果而進行前述致動器的驅動控制,將前述氣缸控制為,在該驅動控制之間,使前述活塞桿暫時從前述工件離開,並再次以前述活塞桿推壓前述工件的前述第2側面。 A positioning device for positioning workpieces moving on the stage, Has: A reference component that can move on the aforementioned stage; an actuator, which drives the aforementioned reference member; a cylinder that presses a second side opposite to the first side with a piston rod in such a manner that the first side of the workpiece on the stage abuts against the reference member; a measuring unit that measures the position of the workpiece on the stage; and A control unit that controls the aforementioned actuator and the aforementioned cylinder; The control unit performs drive control of the actuator based on the measurement results passed by the measurement unit, and controls the cylinder to temporarily separate the piston rod from the workpiece during the drive control, and to control the cylinder again. The piston rod presses the second side surface of the workpiece. 如請求項1的定位裝置,其中,前述控制部,將前述氣缸控制為,每次驅動前述致動器,使前述活塞桿暫時從前述工件離開,再次以前述活塞桿推壓前述工件的前述第2側面。The positioning device of claim 1, wherein the control unit controls the cylinder to temporarily separate the piston rod from the workpiece each time the actuator is driven, and to push the piston rod against the third portion of the workpiece again. 2 sides. 如請求項1的定位裝置,其中, 前述控制部: 每次驅動前述致動器,判定驅動方向是否反轉, 將前述氣缸控制為,依判定為驅動方向發生反轉的情況,使前述活塞桿暫時從前述工件離開,再次以前述活塞桿推壓前述工件的前述第2側面。 Such as the positioning device of claim 1, wherein, The aforementioned control department: Each time the aforementioned actuator is driven, it is determined whether the driving direction is reversed, The air cylinder is controlled to temporarily separate the piston rod from the workpiece when the driving direction is determined to be reversed, and the piston rod again presses the second side surface of the workpiece. 如請求項1的定位裝置,其中, 前述氣缸,包含: 氣缸管; 活塞,其支撐前述活塞桿的一端,在前述氣缸管的內部進行往返運動;以及 密封構件,其將前述活塞的外周面與前述氣缸管的內周面之間進行密封。 Such as the positioning device of claim 1, wherein, The aforementioned cylinders include: cylinder tube; A piston that supports one end of the aforementioned piston rod and performs reciprocating motion inside the aforementioned cylinder tube; and A sealing member seals between the outer peripheral surface of the piston and the inner peripheral surface of the cylinder tube. 如請求項1的定位裝置,其中,前述致動器,為被透過脈衝訊號進行驅動的脈衝馬達。The positioning device of claim 1, wherein the aforesaid actuator is a pulse motor driven by a pulse signal. 如請求項1的定位裝置,其進一步具有控制對於前述氣缸之空氣的供應的電磁閥, 前述控制部,控制前述電磁閥,從而執行使前述活塞桿從前述工件離開的動作及以前述活塞桿推壓前述工件的動作。 The positioning device of claim 1, further having a solenoid valve that controls the supply of air to the aforementioned cylinder, The control unit controls the solenoid valve to perform an operation of moving the piston rod away from the workpiece and an operation of pressing the workpiece with the piston rod. 如請求項1的定位裝置,其進一步具備配置於前述載台之上並夾持前述工件的工件夾持件, 前述控制部,將前述工件夾持件控制為,在透過前述計測部對前述工件的位置進行計測時將前述工件進行解夾持,透過前述氣缸而推壓前述工件時將前述工件進行夾持。 The positioning device of claim 1 further includes a workpiece clamping member disposed on the aforementioned stage and clamping the aforementioned workpiece, The control unit controls the workpiece holder to unclamp the workpiece when the position of the workpiece is measured by the measurement unit, and to clamp the workpiece when the workpiece is pushed by the air cylinder. 如請求項7的定位裝置,其中,前述工件夾持件被構成為,在解夾持時,對前述工件的下表面噴出氣體而使前述工件從前述工件夾持件的夾持面上浮,在夾持時,將前述工件的下表面進行吸引從而使前述工件吸附於前述夾持面。The positioning device according to claim 7, wherein the workpiece holder is configured to eject gas to the lower surface of the workpiece to cause the workpiece to float from the clamping surface of the workpiece holder during unclamping. During clamping, the lower surface of the workpiece is attracted so that the workpiece is adsorbed to the clamping surface. 一種微影裝置, 被構成為: 具備如請求項1至8中任一項的定位裝置, 透過前述定位裝置進行原版的定位, 將前述已被定位的原版的圖案轉印於基板。 A lithography device, is constituted as: Having a positioning device as in any one of requirements 1 to 8, The original version is positioned through the aforementioned positioning device. The pattern of the positioned master plate is transferred to the substrate. 一種微影裝置, 被構成為: 具備如請求項1至8中任一項的定位裝置, 透過前述定位裝置進行基板的定位, 對前述已被定位的基板轉印原版的圖案。 A lithography device, is constituted as: Having a positioning device as in any one of requirements 1 to 8, The substrate is positioned through the aforementioned positioning device. The pattern of the original plate is transferred to the positioned substrate. 一種物品製造方法, 具有: 使用如請求項9的微影裝置而對基板轉印圖案的程序;以及 將前述被轉印了圖案的基板進行加工的程序; 從前述被進行了加工的基板製造物品。 A method of making an item, have: A process for transferring a pattern to a substrate using the lithography device of claim 9; and A procedure for processing the substrate onto which the pattern has been transferred; An article is manufactured from the above-mentioned processed substrate. 一種物品製造方法, 具有: 使用如請求項10的微影裝置而對基板轉印圖案的程序;以及 將前述被轉印了圖案的基板進行加工的程序; 從前述被進行了加工的基板製造物品。 A method of making an item, have: A process for transferring a pattern to a substrate using the lithography device of claim 10; and A procedure for processing the substrate onto which the pattern has been transferred; An article is manufactured from the above-mentioned processed substrate.
TW112122349A 2022-07-13 2023-06-15 Positioning apparatus, lithography apparatus, and article manufacturing method capable of achieving both positioning an article accurately in a short time and lowering production lead-time TW202403476A (en)

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