TW202401818A - 半導體裝置及半導體裝置的製造方法 - Google Patents
半導體裝置及半導體裝置的製造方法 Download PDFInfo
- Publication number
- TW202401818A TW202401818A TW112116386A TW112116386A TW202401818A TW 202401818 A TW202401818 A TW 202401818A TW 112116386 A TW112116386 A TW 112116386A TW 112116386 A TW112116386 A TW 112116386A TW 202401818 A TW202401818 A TW 202401818A
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- insulating layer
- insulating
- conductive layer
- light
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
- H10D30/6733—Multi-gate TFTs
- H10D30/6734—Multi-gate TFTs having gate electrodes arranged on both top and bottom sides of the channel, e.g. dual-gate TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6757—Thin-film transistors [TFT] characterised by the structure of the channel, e.g. transverse or longitudinal shape or doping profile
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/421—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
- H10D86/423—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer comprising semiconductor materials not belonging to the Group IV, e.g. InGaZnO
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D88/00—Three-dimensional [3D] integrated devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/468—Insulated gate field-effect transistors [IGFETs] characterised by the gate dielectrics
- H10K10/472—Insulated gate field-effect transistors [IGFETs] characterised by the gate dielectrics the gate dielectric comprising only inorganic materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/468—Insulated gate field-effect transistors [IGFETs] characterised by the gate dielectrics
- H10K10/474—Insulated gate field-effect transistors [IGFETs] characterised by the gate dielectrics the gate dielectric comprising a multilayered structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/125—Active-matrix OLED [AMOLED] displays including organic TFTs [OTFT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K65/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element and at least one organic radiation-sensitive element, e.g. organic opto-couplers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Thin Film Transistor (AREA)
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Semiconductor Memories (AREA)
- Non-Volatile Memory (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022-079439 | 2022-05-13 | ||
| JP2022079439 | 2022-05-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW202401818A true TW202401818A (zh) | 2024-01-01 |
Family
ID=88729804
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW112116386A TW202401818A (zh) | 2022-05-13 | 2023-05-03 | 半導體裝置及半導體裝置的製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20250275183A1 (https=) |
| JP (1) | JPWO2023218280A1 (https=) |
| KR (1) | KR20250010010A (https=) |
| CN (1) | CN119137748A (https=) |
| TW (1) | TW202401818A (https=) |
| WO (1) | WO2023218280A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025114846A1 (ja) * | 2023-12-01 | 2025-06-05 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| TW202548389A (zh) * | 2023-12-01 | 2025-12-16 | 日商半導體能源研究所股份有限公司 | 半導體裝置 |
| WO2025114847A1 (ja) * | 2023-12-01 | 2025-06-05 | 株式会社半導体エネルギー研究所 | 半導体装置、及び半導体装置の作製方法 |
| WO2025133871A1 (ja) * | 2023-12-22 | 2025-06-26 | 株式会社半導体エネルギー研究所 | 半導体装置、及び半導体装置の作製方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20250028505A (ko) | 2014-09-12 | 2025-02-28 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치 |
| TWI685113B (zh) * | 2015-02-11 | 2020-02-11 | 日商半導體能源研究所股份有限公司 | 半導體裝置及其製造方法 |
| CN109378317A (zh) * | 2018-10-12 | 2019-02-22 | 合肥鑫晟光电科技有限公司 | 阵列基板及其制备方法、显示装置 |
| KR102551998B1 (ko) * | 2018-11-20 | 2023-07-06 | 엘지디스플레이 주식회사 | 수직 구조 트랜지스터 및 전자장치 |
-
2023
- 2023-04-28 JP JP2024520092A patent/JPWO2023218280A1/ja active Pending
- 2023-04-28 CN CN202380034576.7A patent/CN119137748A/zh active Pending
- 2023-04-28 KR KR1020247039989A patent/KR20250010010A/ko active Pending
- 2023-04-28 WO PCT/IB2023/054419 patent/WO2023218280A1/ja not_active Ceased
- 2023-04-28 US US18/858,440 patent/US20250275183A1/en active Pending
- 2023-05-03 TW TW112116386A patent/TW202401818A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| KR20250010010A (ko) | 2025-01-20 |
| US20250275183A1 (en) | 2025-08-28 |
| JPWO2023218280A1 (https=) | 2023-11-16 |
| CN119137748A (zh) | 2024-12-13 |
| WO2023218280A1 (ja) | 2023-11-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US12588290B2 (en) | Semiconductor device and method for manufacturing the semiconductor device | |
| TW202401818A (zh) | 半導體裝置及半導體裝置的製造方法 | |
| US20250374676A1 (en) | Semiconductor device | |
| KR20250048717A (ko) | 반도체 장치 | |
| KR20250055505A (ko) | 반도체 장치 | |
| WO2024116030A1 (ja) | 半導体装置、及び、半導体装置の作製方法 | |
| CN119678672A (zh) | 半导体装置及半导体装置的制造方法 | |
| CN119522638A (zh) | 晶体管及晶体管的制造方法 | |
| TW202347286A (zh) | 顯示裝置 | |
| US20250311297A1 (en) | Semiconductor device | |
| US20250261510A1 (en) | Semiconductor device | |
| CN118974947A (zh) | 半导体装置 | |
| KR20250089503A (ko) | 반도체 장치 및 표시 장치 | |
| WO2024121698A1 (ja) | 半導体装置 | |
| CN119586349A (zh) | 半导体装置 | |
| KR20250003550A (ko) | 반도체 장치 | |
| CN119653835A (zh) | 半导体装置及半导体装置的制造方法 | |
| KR20250059459A (ko) | 반도체 장치 | |
| TW202501782A (zh) | 半導體裝置 | |
| KR20250127097A (ko) | 반도체 장치 및 반도체 장치의 제작 방법 | |
| KR20250170619A (ko) | 반도체 장치 및 반도체 장치의 제작 방법 | |
| CN121400086A (zh) | 半导体装置及半导体装置的制造方法 | |
| CN121511662A (zh) | 半导体装置及半导体装置的制造方法 |