TW202349739A - Light emitting device substrate and method of fabricating the same - Google Patents

Abstract

A light emitting device substrate including a substrate and a plurality of light emitting devices disposed on the substrate is provided. Each light emitting device has a light emitting surface far away from the substrate. At least one adhesive pattern is provided on at least one edge of the light emitting surface of each of at least part of the light emitting devices. A method of fabricating the light emitting device substrate is also provided.

Description

Light emitting element substrate and manufacturing method thereof

The present invention relates to an element substrate and a manufacturing method thereof, and in particular, to a light-emitting element substrate and a manufacturing method thereof.

In addition to the advantages of low energy consumption and long material life, micro-light-emitting element displays also have excellent optical performance, such as high color saturation, fast response speed and high contrast. In order to achieve lower production costs and larger product design margins, the manufacturing technology of micro-light-emitting element displays uses die transfer. For example: Mass transfer technology that directly transfers micro-light-emitting element dies pre-made on the temporary storage substrate to the drive circuit backplane.

A solution using an adhesive layer to extract crystal grains and combining it with laser lift-off technology was proposed. Among them, the adhesive layer used to adhere micro-light-emitting element chips will lose its viscosity after being irradiated by laser light, allowing the chips to separate from the adhesive layer. However, after the die is separated from the adhesive layer, part of the adhesive material will still remain on its light-emitting surface (i.e., the extraction surface), causing the light-emitting efficiency, light-type distribution, and even light-emitting wavelength of subsequent micro-light-emitting devices to change, affecting the original Optical performance.

The present invention provides a light-emitting element substrate, the light-emitting element of which has relatively stable light extraction performance.

The present invention provides a method for manufacturing a light-emitting element substrate, which allows the light-emitting element to maintain its original light-emitting characteristics after undergoing a transfer process.

The light-emitting element substrate of the present invention includes a substrate and a plurality of light-emitting elements arranged on the substrate. The light-emitting element has a light-emitting surface facing away from the substrate. At least one edge of the light-emitting surface of at least part of the light-emitting elements is provided with at least one adhesive pattern.

The manufacturing method of a light-emitting element substrate of the present invention includes providing a temporary substrate and a plurality of light-emitting elements arranged on the temporary substrate, using a carrier structure to extract these light-emitting elements on the temporary substrate, and performing a laser lift-off process to make these light-emitting elements Detached from the carrier structure and transferred to the target substrate. The carrier board structure includes a carrier board, a plurality of bumps and an adhesive layer. These bumps are dispersedly arranged on the carrier board, and each has a receiving surface for receiving any light-emitting element. The area of the receiving surface is smaller than the area of the light-emitting surface of the light-emitting element. The adhesive layer is filled between the bumps and covers at least part of the receiving surface of each bump. The step of extracting the light-emitting elements includes applying pressure to the light-emitting elements overlapping the bumps, so that the portion of the adhesive layer overlapping the bumps is discharged from the area of the receiving surface, and the light-emitting surface of each light-emitting element contacts the corresponding one. The receiving surface of the bump and part of the adhesive layer. When these light-emitting elements are separated from the carrier structure, the portion of the adhesive layer that overlaps at least part of the light-emitting surface of each of the light-emitting elements forms at least one adhesive pattern connected to at least one edge of the light-emitting surface.

Based on the above, in the manufacturing method of a light-emitting element substrate according to an embodiment of the present invention, a plurality of bumps are provided on the carrier structure used to extract the light-emitting elements, and an adhesive layer is filled between the bumps. The arrangement of these bumps allows the adhesive layer to be separated from the receiving surface of the bumps and the light-emitting surface of the light-emitting element during the process of pressing down and adhering to the light-emitting element, and because the area of the receiving surface is smaller than the area of the light-emitting surface of the light-emitting element, The adhesive relationship between the adhesive layer and the light-emitting element is generally limited to the vicinity of the bumps. After the light-emitting element is transferred to the target substrate and separated from the carrier structure, the residual degree of the adhesive layer on the light-emitting surface can be significantly reduced, and is generally distributed near the edge of the light-emitting surface. Accordingly, the residual adhesive material can be prevented from affecting the light extraction efficiency and light emission wavelength of the light-emitting element, which helps ensure the optical performance of the light-emitting element.

As used herein, "about," "approximately," "substantially," or "substantially" includes the stated value and an average within an acceptable range of deviations from a particular value as determined by one of ordinary skill in the art, taking into account that Discuss the measurement and the specific amount of error associated with the measurement (i.e., the limitations of the measurement system). For example, "about" can mean within one or more standard deviations of the stated value, or within ±30%, ±20%, ±15%, ±10%, ±5%, for example. Furthermore, the terms "approximately", "approximately", "substantially" or "substantially" used in this article can be used to select a more acceptable deviation range or standard deviation based on the measurement properties, cutting properties or other properties, and can Not one standard deviation applies to all properties.

In the drawings, the thickness of layers, films, panels, regions, etc., are exaggerated for clarity. It will be understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element, or Intermediate elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" may refer to physical and/or electrical connections. Furthermore, "electrical connection" can be the presence of other components between the two components.

Additionally, relative terms, such as "lower" or "bottom" and "upper" or "top," may be used herein to describe one element's relationship to another element as illustrated in the Figures. It will be understood that relative terms are intended to encompass different orientations of the device in addition to the orientation illustrated in the figures. For example, if the device in one of the figures is turned over, elements described as "lower" than other elements would then be oriented "above" the other elements. Thus, the exemplary term "lower" may include both "lower" and "upper" orientations, depending on the particular orientation of the drawing. Similarly, if the device in one of the figures is turned over, elements described as "below" or "beneath" other elements would then be oriented "above" the other elements. Thus, the exemplary terms "upper" or "lower" may include both upper and lower orientations.

Example embodiments are described herein with reference to cross-sectional illustrations that are schematic illustrations of idealized embodiments. Accordingly, variations in the shapes illustrated in the illustrations are to be expected as a result of, for example, manufacturing techniques and/or tolerances. Thus, embodiments described herein should not be construed as limited to the particular shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. For example, regions shown or described as flat may typically have rough and/or non-linear characteristics. Additionally, the acute angles shown may be rounded. Accordingly, the regions shown in the figures are schematic in nature and their shapes are not intended to show the precise shapes of the regions and are not intended to limit the scope of the claims.

Reference will now be made in detail to the exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numbers are used in the drawings and descriptions to refer to the same or similar parts.

FIG. 1 is a schematic top view of a light-emitting element substrate according to the first embodiment of the present invention. FIG. 2 is a schematic side view of the light emitting element substrate of FIG. 1 . 3A to 3E are schematic cross-sectional views of the manufacturing process of the light-emitting element substrate of FIG. 1 . FIG. 4 is a schematic bottom view of the carrier structure and multiple light-emitting elements of FIG. 3C.

Referring to FIGS. 1 and 2 , the light-emitting element substrate 10 includes a substrate SUB and a plurality of light-emitting elements 100 . For example, the light-emitting elements 100 can be arranged in multiple columns and rows along the direction X and the direction Y respectively, that is, the light-emitting elements 100 can be arranged in an array on the substrate SUB, but it is not limited thereto.

The substrate SUB is, for example, a circuit board with a driving element layer (not shown), where the driving element layer may include a variety of signal lines (such as data lines, power lines, and scan lines), a plurality of active components (such as thin film transistors), and multiple pad set. Each light-emitting element 100 is adapted to be bonded to a corresponding pad group to electrically connect to the circuit board. At least one active element is adapted to receive switching signals, data signals or driving signals from different signal lines to control the corresponding light-emitting element 100 to emit light. That is to say, these light-emitting elements 100 bonded to the substrate SUB can individually emit light through the control of corresponding active elements to achieve the effect of displaying images.

However, the present invention is not limited to this. In other embodiments, the substrate SUB may also be a temporary substrate provided with an adhesion layer to serve as an intermediary substrate before these light-emitting elements 100 are transferred to the above-mentioned circuit board.

In this embodiment, the light-emitting element 100 is, for example, a flip-chip light emitting diode (lateral-type light emitting diode), which may include an epitaxial structure ES and a first electrode E1 and a third electrode E1 disposed on the same side of the epitaxial structure ES. Two electrodes E2, wherein the first electrode E1 and the second electrode E2 are respectively electrically connected to different semiconductor layers (such as a P-type semiconductor layer and an N-type semiconductor layer not shown) of the epitaxial structure ES. For example, the electrical connection between the light-emitting element 100 and the substrate SUB can be achieved through the bonding relationship between the two electrodes of the light-emitting element 100 and the two pads of the aforementioned pad group, but it is not limited to this.

It is particularly important to note that the light-emitting element 100 has a light-emitting surface 100es facing away from the substrate SUB, and at least one edge of the light-emitting surface 100es is provided with at least one adhesive pattern. For example, the light-emitting surface 100es of the light-emitting element 100 has a first edge 100e1 and a second edge 100e2 arranged along the direction Y, and a third edge 100e3 and 100e3 connecting the first edge 100e1 and the second edge 100e2 and arranged along the direction X. Fourth edge 100e4.

In this embodiment, the first edge 100e1 and the second edge 100e2 of the light-emitting surface 100es are respectively provided with the first adhesive pattern 200P1 and the second adhesive pattern 200P2, while the third edge 100e3 and the fourth edge 100e4 are not provided with any Adhesion pattern, wherein the extension direction of the first adhesion pattern 200P1 is parallel to the extension direction of the first edge 100e1, and the extension direction of the second adhesion pattern 200P2 is parallel to the extension direction of the second edge 100e2. Accordingly, the impact of the adhesion pattern on the light extraction efficiency and light emission wavelength of the light-emitting element 100 can be significantly reduced, which helps ensure the optical performance of the light-emitting element 100 after the transfer process.

In order to explain more clearly how the above-mentioned adhesive pattern is formed on the edge of the light-emitting surface 100es of the light-emitting element 100, the manufacturing method of the light-emitting element substrate 10 will be exemplified below. Please refer to FIG. 3A . First, a temporary substrate 80 is provided, on which the aforementioned plurality of light-emitting elements 100 are disposed, wherein the light-emitting surface 100es of the light-emitting element 100 is away from the temporary substrate 80 . The light-emitting elements 100 on the temporary substrate 80 are extracted using a carrier structure composed of a carrier CS, a plurality of bumps BP and an adhesive layer 200, wherein the bumps BP are dispersedly provided on the carrier CS, and the adhesive layer 200 200 is filled between these bumps BP. The material of the bump BP includes, for example, polymer materials, photoresist, metal, or any material with flatness and thickness.

In this embodiment, the adhesive layer 200 can selectively completely cover the bump BP for receiving the receiving surface BPs of the light-emitting element 100, but is not limited to this. As shown in FIG. 3B , when the carrier structure touches the plurality of light-emitting elements 100 on the temporary substrate 80 , its adhesive layer 200 will contact the light-emitting surfaces 100es of the light-emitting elements 100 . In order to discharge part of the adhesive layer 200 existing between the bump BP and the light-emitting element 100 from the area of the receiving surface BPs of the bump BP, pressure PSR is applied to the carrier structure to overlap the plurality of light-emitting elements 100 along the direction D3. The plurality of bumps BP continue to move toward the light-emitting elements 100 . During the process, the portion of the adhesive layer sandwiched between the overlapping bump BP and the light-emitting element 100 will be extruded and discharged around the bump BP, and the light-emitting surface 100es of the light-emitting element 100 will contact the receiving surface of the bump BP. The surface BPs and part of the adhesive layer 200 are shown in Figure 3C.

When the receiving surface BPs of the bump BP of the carrier structure contacts the light emitting surface 100es of the light emitting element 100, the carrier structure is moved away from the temporary substrate 80 in the direction D2. During the process, the carrier structure can drive the light-emitting element 100 away from the temporary substrate 80 through the connection relationship between the adhesive layer 200 and the edge area of the light-emitting surface 100es of the light-emitting element 100 . That is to say, the carrier structure does not utilize the entire surface contact between the adhesive layer 200 and the light-emitting surface 100es of the light-emitting element 100 to form an adhesive force to extract the light-emitting element 100 .

In order to achieve the above-mentioned connection mode, the area of the receiving surface BPs of the bump BP is smaller than the area of the light-emitting surface 100es of the light-emitting element 100. Please refer to FIG. 4 as well. In this embodiment, the width w1a of the receiving surface BPs of the bump BP along the direction D1 is smaller than the width w2a of the light emitting surface 100es of the light emitting element 100 along the direction D1. However, the width w1b of the receiving surface BPs of the bump BP along the direction D2 may be substantially equal to the width w2b of the light emitting surface 100es of the light emitting element 100 along the direction D2, but is not limited thereto.

That is to say, in this embodiment, during the process of extracting the light-emitting element 100, the carrier structure generally utilizes the first first elements of the adhesive layer 200 that overlap with the light-emitting surface 100es along the direction D3 and are arranged in the direction D1 and separated from each other. The two parts of the edge 100e1 and the second edge 100e2 are used to adhere the light-emitting element 100 .

Referring to FIG. 3D , a plurality of light-emitting elements 100 are then transferred to a target substrate (such as a substrate SUB) using a carrier structure. For example, in this embodiment, after the alignment step of the plurality of light-emitting elements 100 on the carrier CS and the plurality of pad groups (not shown) on the substrate SUB is completed, a thermal bonding process can be performed. The first electrode E1 and the second electrode E2 of the light-emitting element 100 are electrically connected to the corresponding pad groups and fixed on the substrate SUB.

A laser lift-off process is performed to separate the light-emitting elements 100 from the carrier structure. In detail, the steps may include using laser light LB to irradiate the adhesive layer 200 to weaken the connection relationship between the adhesive layer 200 and the light-emitting element 100 (eg, adhesive failure). That is, the adhesive layer 200 is, for example, a polymer material layer, which can be heated, laser irradiated, or other suitable processing means to change the characteristics of the material itself to achieve the purpose of transferring the light-emitting element 100 . However, during the process of the light-emitting element 100 being separated from the carrier structure, part of the adhesive layer 200 will still remain on the light-emitting surface 100es of the light-emitting element 100, and form the first edge 100e1 and the second edge 100e2 connected to the light-emitting surface 100es. The first adhesive pattern 200P1 and the second adhesive pattern 200P2 are as shown in Figure 3E. At this point, the production of the light-emitting element substrate 10 of this embodiment is completed.

Since the carrier CS of the carrier structure is provided with a plurality of bumps BP at positions corresponding to the plurality of light-emitting elements 100, the contact surface between the adhesive layer 200 and the light-emitting elements 100 can be roughly limited to the edge of the light-emitting surface 100es of the light-emitting element 100. . Therefore, during the separation process of the light-emitting element 100 from the carrier structure, it is possible to avoid excessive adhesive material remaining on the light-emitting surface 100es, which would affect the light-emitting efficiency and light-emitting wavelength of the light-emitting element 100 during subsequent operations. In other words, it is ensured that the light-emitting element 100 can still maintain its original optical performance after the transfer process.

Other embodiments will be enumerated below to describe the present disclosure in detail, in which the same components will be marked with the same symbols, and the description of the same technical content will be omitted. Please refer to the previous embodiments for the omitted parts, which will not be described again below.

FIG. 5 is a schematic top view of the light-emitting element substrate according to the second embodiment of the present invention. FIG. 6 is a schematic side view of the light emitting element substrate of FIG. 5 . FIG. 7 is a schematic bottom view of the light-emitting element extracted from the carrier structure in the manufacturing process of the light-emitting element substrate of FIG. 5 .

Please refer to FIGS. 5 and 6 . The difference between the light-emitting element substrate 10A of this embodiment and the light-emitting element substrate 10 of FIG. 1 is that the adhesive pattern 200P-A of this embodiment is also extended and distributed on the light-emitting surface 100es of the light-emitting element 100 . The third edge 100e3 and the fourth edge 100e4. More specifically, the adhesive pattern 200P-A of this embodiment is arranged around the light emitting surface 100es.

In order to form the distribution of the above-mentioned adhesive pattern 200P-A, during the manufacturing process of the light-emitting element substrate 10A, the carrier structure used to transfer the light-emitting element 100 has a bearing surface BPs of the bump BP-A except for the width w1a along the direction D1 In addition to being smaller than the width w2a of the light-emitting element 100 (or the light-emitting surface 100es) along the direction D1, the width w1b″ of the receiving surface BPs along the direction D2 is also smaller than the width w2b″ of the light-emitting element 100 along the direction D2, as shown in FIG. 7 . In this embodiment, the direction D1 and the direction D2 intersect (for example, are perpendicular to each other).

Therefore, during the transfer process of the light-emitting element 100, the contact surface between the adhesive layer and the light-emitting element 100 is generally limited to the vicinity of the four edges 100e1~100e4 of the light-emitting surface 100es of the light-emitting element 100. After the light-emitting element 100 is transferred to the target substrate and separated from the carrier structure, the residual degree of the adhesive layer on the light-emitting surface 100es can be significantly reduced, and the remaining adhesive pattern 200P-A is roughly distributed near the edges of the light-emitting surface 100es (As shown in Figure 5). Accordingly, the residual adhesive material can be prevented from affecting the light emitting efficiency and light emitting wavelength of the light emitting element 100, which helps ensure the optical performance of the light emitting element 100.

FIG. 8 is a schematic top view of a light-emitting element substrate according to the third embodiment of the present invention. FIG. 9 is a schematic bottom view of the light-emitting element extracted from the carrier structure in the manufacturing process of the light-emitting element substrate of FIG. 8 . Please refer to Figures 8 and 9. The difference between the light-emitting element substrate 10B of this embodiment and the light-emitting element substrate 10A of Figure 5 is that the plurality of adhesive patterns of this embodiment are only located at the four corners of the light-emitting surface 100es of the light-emitting element 100. .

Specifically, in this embodiment, the number of adhesive patterns remaining on the light-emitting element 100 is four, which are the first adhesive pattern 200P1-B, the second adhesive pattern 200P2-B, the third adhesive pattern 200P3-B and the third adhesive pattern 200P3-B. Quad adhesive pattern 200P4-B. The first adhesive pattern 200P1-B is located at the connection between the first edge 100e1 and the third edge 100e3. The second adhesive pattern 200P2-B is located at the connection between the second edge 100e2 and the third edge 100e3. The third adhesive pattern 200P3-B is located at the connection between the first edge 100e1 and the fourth edge 100e4. The fourth adhesive pattern 200P4-B is located at the connection between the second edge 100e2 and the fourth edge 100e4.

In order to form the distribution of the above four adhesion patterns, during the manufacturing process of the light-emitting element substrate 10B, the carrier structure used to transfer the light-emitting element 100 has a carrier structure at each of the four corners of the receiving surface BPs-B of the bump BP-B. gap. For example, the receiving surface BPs-B of the bump BP-B has a first edge BPe1 and a second edge BPe2 arranged along the direction D1, a third edge BPe3 and a fourth edge BPe4 arranged along the direction D2, and adjacent The first notch BPn1 on the first edge BPe1 and the third edge BPe3, the second notch BPn2 adjacent to the second edge BPe2 and the third edge BPe3, and the third notch adjacent to the first edge BPe1 and the fourth edge BPe4. BPn3 and the fourth gap BPn4 adjacent to the second edge BPe2 and the fourth edge BPe4 (as shown in Figure 9). In this embodiment, the direction D1 and the direction D2 intersect (for example, are perpendicular to each other).

Therefore, during the transfer process of the light-emitting element 100, the contact surface between the adhesive layer and the light-emitting element 100 is generally limited to the four corners of the light-emitting surface 100es of the light-emitting element 100. After the light-emitting element 100 is transferred to the target substrate and separated from the carrier structure, the residual degree of the adhesive layer on the light-emitting surface 100es can be further reduced compared to the embodiment of FIG. 5 , and the remaining four adhesive patterns 200P1-B~ 200P4-B is roughly distributed at the four corners of the light-emitting surface 100es (as shown in Figure 8). Accordingly, the residual adhesive material can be prevented from affecting the light emitting efficiency and light emitting wavelength of the light emitting element 100, which helps ensure the optical performance of the light emitting element 100.

10 is a schematic bottom view of the light-emitting element extracted from the carrier structure during the manufacturing process of the light-emitting element substrate according to the fourth embodiment of the present invention. 11A to 11D are schematic cross-sectional views of the manufacturing process of the light-emitting element substrate according to the fourth embodiment of the present invention. Please refer to Figure 10. The main difference between the carrier structure of this embodiment and the carrier structure of the previous embodiment is that the adhesive layer 200A of the carrier structure of this embodiment has multiple openings corresponding to the plurality of bumps BP-C. OP.

It is particularly noted that in this embodiment, the width w3b of the opening OP along the direction D2 is greater than the width w1b of the bump BP-C along the direction D2. Accordingly, during the process of extracting the light-emitting element 100, the carrier structure can increase the overflow space when the adhesive layer 200A is squeezed by the light-emitting element 100 (as shown in Figure 11C and Figure 11D), and at the same time prevent the adhesive layer 200A from moving along the direction. D2 or its reverse overflow reaches the junction of the light-emitting surface 100es of the light-emitting element 100 and the receiving surface BPs of the bump BP-C. Therefore, after the light-emitting element 100 is separated from the carrier structure, the adhesive material remaining on the light-emitting surface 100es of the light-emitting element 100 can be limited to the edge area of the light-emitting surface 100es to avoid affecting the light-emitting efficiency and light-emitting wavelength of the light-emitting element 100, which is helpful. To ensure the optical performance of the light-emitting element 100.

In order to obtain the above-mentioned carrier structure, the manufacturing method of the light-emitting element substrate may also optionally include: after the formation step of the adhesive layer 200 is completed, a patterning process is performed on the adhesive layer 200 to form a plurality of openings OP. Adhesion layer 200A (shown in Figures 11A and 11B). The patterning process is, for example, photolithography, microcontact printing, screen printing, or nanoimprinting, but is not limited thereto.

12 is a schematic bottom view of the light-emitting element extracted from the carrier structure during the manufacturing process of the light-emitting element substrate according to the fifth embodiment of the present invention. Please refer to Figure 12. The difference between the carrier structure of this embodiment and the carrier structure of Figure 10 is that the opening configuration of the adhesive layer is different. Compared with the carrier structure of Figure 10, in the carrier structure of this embodiment, in addition to the width w3b of the opening OP" of the adhesive layer 200B along the direction D2 being larger than the width w1b of the bump BP-C along the direction D2, the opening OP" The width w3a of OP" along the direction D1 is also larger than the width w1a of the bump BP-C along the direction D1.

Therefore, during the process of extracting the light-emitting element 100, the carrier structure can increase the overflow space when the adhesive layer 200B is squeezed by the light-emitting element 100, and at the same time prevent the adhesive layer 200B from overflowing to the light-emitting surface 100es and the bump BP of the light-emitting element 100. The junction of -C's undertaking surface BPs. Therefore, after the light-emitting element 100 is separated from the carrier structure, the adhesive material remaining on the light-emitting surface 100es of the light-emitting element 100 can be limited to the edge area of the light-emitting surface 100es to avoid affecting the light-emitting efficiency and light-emitting wavelength of the light-emitting element 100, which is helpful. To ensure the optical performance of the light-emitting element 100.

To sum up, in the light-emitting element substrate and the manufacturing method thereof according to an embodiment of the present invention, the carrier structure for extracting the light-emitting element is provided with a plurality of bumps, and an adhesive layer is filled between the bumps. The arrangement of these bumps allows the adhesive layer to be separated from the receiving surface of the bumps and the light-emitting surface of the light-emitting element during the process of pressing down and adhering to the light-emitting element, and because the area of the receiving surface is smaller than the area of the light-emitting surface of the light-emitting element, The adhesive relationship between the adhesive layer and the light-emitting element is generally limited to the vicinity of the bumps. After the light-emitting element is transferred to the target substrate and separated from the carrier structure, the degree of residue of the adhesive layer on the light-emitting surface can be significantly reduced, and remains substantially near the edge of the light-emitting surface. Accordingly, the residual adhesive material can be prevented from affecting the light extraction efficiency and light emission wavelength of the light-emitting element, which helps ensure the optical performance of the light-emitting element.

10, 10A, 10B: Light emitting element substrate 80: Temporary substrate 100:Light-emitting components 100e1, BPe1: first edge 100e2, BPe2: second edge 100e3, BPe3: The third edge 100e4, BPe4: The fourth edge 100es: light-emitting surface 200, 200A, 200B: Adhesive layer 200P-A: Adhesive pattern 200P1, 200P1-B: First adhesive pattern 200P2, 200P2-B: Second adhesion pattern 200P3-B: The third adhesive pattern 200P4-B: The fourth adhesive pattern BP, BP-A, BP-B, BP-C: Bump BPn1, BPn2, BPn3, BPn4: Gap BPs: undertaking surface CS: carrier board D1, D2, D3, X, Y, Z: direction E1: first electrode E2: second electrode ES: epitaxial structure LB: laser light OP, OP”: Open your mouth PSR: pressure SUB:Substrate w1a, w2a, w1b, w2b, w1b”, w2b”, w3a, w3b: width

FIG. 1 is a schematic top view of a light-emitting element substrate according to the first embodiment of the present invention. FIG. 2 is a schematic side view of the light emitting element substrate of FIG. 1 . 3A to 3E are schematic cross-sectional views of the manufacturing process of the light-emitting element substrate of FIG. 1 . FIG. 4 is a schematic bottom view of the carrier structure and multiple light-emitting elements of FIG. 3C. FIG. 5 is a schematic top view of the light-emitting element substrate according to the second embodiment of the present invention. FIG. 6 is a schematic side view of the light emitting element substrate of FIG. 5 . FIG. 7 is a schematic bottom view of the light-emitting element extracted from the carrier structure in the manufacturing process of the light-emitting element substrate of FIG. 5 . FIG. 8 is a schematic top view of a light-emitting element substrate according to the third embodiment of the present invention. FIG. 9 is a schematic bottom view of the light-emitting element extracted from the carrier structure in the manufacturing process of the light-emitting element substrate of FIG. 8 . 10 is a schematic bottom view of the light-emitting element extracted from the carrier structure during the manufacturing process of the light-emitting element substrate according to the fourth embodiment of the present invention. 11A to 11D are schematic cross-sectional views of the manufacturing process of the light-emitting element substrate according to the fourth embodiment of the present invention. 12 is a schematic bottom view of the light-emitting element extracted from the carrier structure during the manufacturing process of the light-emitting element substrate according to the fifth embodiment of the present invention.

10:Light-emitting element substrate

100:Light-emitting components

100e1: first edge

100e2: Second edge

100es: light-emitting surface

200P1: First adhesive pattern

200P2: Second adhesive pattern

E1: first electrode

E2: second electrode

ES: epitaxial structure

SUB:Substrate

X, Y, Z: direction

Claims (12)

A light-emitting element substrate including: a substrate; and A plurality of light-emitting elements are arranged on the substrate, each of the light-emitting elements has a light-emitting surface facing away from the substrate, and at least one edge of the light-emitting surface of at least part of the light-emitting elements is provided with at least one adhesive pattern. The light-emitting element substrate of claim 1, wherein the at least one adhesive pattern is an adhesive pattern surrounding the light-emitting surface. The light-emitting element substrate of claim 1, wherein the at least one edge includes a first edge and a second edge arranged along a first direction, and the at least one adhesive pattern includes a first edge disposed on the first edge. An adhesive pattern and a second adhesive pattern disposed on the second edge. The light-emitting element substrate of claim 3, wherein the extending direction of the first adhesive pattern is parallel to the extending direction of the first edge, and the extending direction of the second adhesive pattern is parallel to the extending direction of the second edge. The light-emitting element substrate of claim 3, wherein the at least one edge further includes a third edge and a fourth edge arranged along a second direction, the second direction intersects the first direction, and the at least one edge The adhesion pattern further includes a third adhesion pattern disposed on the first edge and a fourth adhesion pattern disposed on the second edge, the first adhesion pattern being located at the connection between the first edge and the third edge, The second adhesive pattern is located at the connection between the second edge and the third edge, the third adhesive pattern is located at the connection between the first edge and the fourth edge, and the fourth adhesive pattern is located at the second edge. The connection between the edge and the fourth edge. A method for manufacturing a light-emitting element substrate, including: Provide a temporary substrate and a plurality of light-emitting elements disposed on the temporary substrate; A carrier board structure is used to extract the light-emitting elements on the temporary substrate. The carrier board structure includes a carrier board, a plurality of bumps and an adhesive layer. The bumps are dispersedly arranged on the carrier board. The bumps are Each block has a receiving surface for receiving any of the light-emitting elements. The area of the receiving surface is smaller than the area of a light-emitting surface of each of the light-emitting elements. The adhesive layer is filled between the bumps and covers each of the light-emitting elements. At least part of the receiving surface of the bumps, wherein the step of extracting the light-emitting elements includes applying pressure to the bumps overlapping the light-emitting elements to overlap the adhesive layer with the portion of the bumps It is discharged from the area of the receiving surface, and the light-emitting surface of each of the light-emitting elements contacts the corresponding receiving surface of the bump and part of the adhesive layer; and A laser lift-off process is performed to detach the light-emitting elements from the carrier structure and transfer them to a target substrate, wherein the adhesive layer overlaps at least part of the light-emitting elements during the process of being detached from the carrier structure. The portion of the light-emitting surface of each light-emitting element forms at least one adhesive pattern connected to at least one edge of the light-emitting surface. The manufacturing method of a light-emitting element substrate as claimed in claim 6, wherein the width of the receiving surface of each of the bumps along a first direction is smaller than the width of the light-emitting surface of each of the light-emitting elements along the first direction. . The manufacturing method of a light-emitting element substrate as claimed in claim 7, wherein the width of the receiving surface of each of the bumps along a second direction is smaller than the width of the light-emitting surface of each of the light-emitting elements along the second direction. . The manufacturing method of a light-emitting element substrate as claimed in claim 6, wherein the receiving surface of each of the bumps has a first edge and a second edge arranged along a first direction, and a second edge arranged along a second direction. A third edge and a fourth edge, a first notch adjacent to the first edge and the third edge, a second notch adjacent to the second edge and the third edge, and a first notch adjacent to the second edge and the third edge. There is a third notch on the first edge and the fourth edge and a fourth notch adjacent to the second edge and the fourth edge. The first direction intersects the second direction. The manufacturing method of the light-emitting element substrate as described in claim 6 further includes: A patterning process is performed to make the adhesive layer have a plurality of openings corresponding to the bumps. The manufacturing method of a light-emitting element substrate as claimed in claim 10, wherein the width of each of the openings along the first direction is greater than the width of the receiving surface of each of the bumps along the first direction. The manufacturing method of a light-emitting element substrate as claimed in claim 11, wherein the width of each of the openings along the second direction is greater than the width of the receiving surface of each of the bumps along the second direction.

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