TW202348675A - Resin composition, adhesive resin composition, adhesive resin layer, adhesive sheet, and dynamoelectric machine - Google Patents

Abstract

An object of the invention is to provide a resin composition that contains an epoxy resin, a curing agent, a foaming agent and a filler, wherein the shape of the filler is scaly, plate-like, needle-like, fibrous or dendritic, and the amount of the filler is at least 12% by mass but not more than 80% by mass if the entire resin composition excluding solvents is deemed 100% by mass, and also to provide an adhesive sheet comprising an adhesive resin layer formed using the resin composition.

Description

Resin composition, adhesive resin composition, adhesive resin layer, adhesive sheet and rotating electrical machine

The present invention relates to a resin composition, an adhesive resin composition, an adhesive resin layer formed from the adhesive resin composition, and an adhesive sheet provided with the adhesive resin layer. In addition, the present invention also relates to a rotating electrical machine used for fixing an adhesive resin composition or an adhesive sheet.

Since epoxy resin has excellent electrical properties, mechanical properties, heat resistance, water resistance, etc., it is widely used as a forming material for motors, electronic parts, automobile parts, etc. In addition, adhesives containing epoxy resin have excellent adhesiveness and are excellent in the above-mentioned properties, so they are used for fixing various parts.

For example, in rotating electrical machines such as motors or generators of electric vehicles or hybrid vehicles, the coils wound with enameled wire are fixed to the core of the stator with adhesives. In recent years, literature has discussed the use of adhesives containing foaming resins. The method of using adhesives or adhesive sheets replaces the conventional method of using liquid adhesives (Patent Documents 1 and 2). In addition, there is also a document proposing that when a magnet is placed in a through-hole arranged facing the stator in the outer peripheral area of the rotor core arranged at the center of the stator, an adhesive or an adhesive sheet containing a foaming resin is used to fix the magnet to the stator. Rotor core (Patent Documents 3 and 4). The foamable adhesive or adhesive sheet is inserted into the clearance between the coil and the stator core or between the rotor core and the magnet, and is heated and foamed to harden the adhesive layer and fill the gap. , can fix the coil to the stator core, the rotor core to the magnet.

For the foam adhesive sheet, in addition to the high foamability of the adhesive layer, it must also be able to quickly insert into the narrow gap between the coil and the stator core. The surface of the adhesive layer needs to have a low friction coefficient and good adhesion. Low viscosity, or strong toughness. When the friction coefficient or stickiness of the surface of the adhesive layer is high, there is a problem that the resistance during insertion is large and the insertion cannot be made quickly. In addition, if the adhesive layer is fragile, problems may arise such that the adhesive layer is cracked or chipped off. If the foam adhesive sheet is weak in toughness, it may bend when inserted into a narrow gap. , there will be problems that are difficult to insert.

In addition, the adhesive layer after heating and foaming requires high shear bonding strength during heating. If the shear bonding strength is insufficient, there is a possibility that the coil will be detached from the stator core due to the vibration of the rotating motor. This is caused by Therefore, there is a concern that the rotating electrical machine may malfunction.

In addition, in order to suppress the performance degradation caused by the temperature rise of the rotating electrical machine, the adhesive layer after heating and foaming must also have excellent heat dissipation properties.

Patent Document 5 discloses a thermally expandable adhesive sheet that has no stickiness before use and exhibits high operability. In this expandable adhesive sheet, an adhesive permeable layer (nonwoven fabric, etc.) is laminated on each surface of a thermally expandable adhesive layer provided on both sides, so that the surface becomes non-sticky. It can be seen from this that even when the adherend has a complex structure, the adhesive sheet can be placed at a predetermined position, and by heating after placement, the expanded adhesive appears on the outermost surface through the adhesive permeable layer. on, showing adhesion. However, the expandable adhesive sheet disclosed in Patent Document 5 has a fluffy adhesive layer permeable layer like various nonwoven fabrics provided on both sides. Therefore, not only is the production time-consuming, but the entire adhesive sheet must be thickened. Because of this, when the gap between the adherends is narrow, there is a high possibility that the adhesive sheet will be bent when inserted or that the adhesive sheet may not be inserted quickly.

Patent Document 6 discloses an adhesive sheet that contains resin and a foaming agent and can be bonded to an adherend by foaming and expanding through heating. This adhesive sheet has excellent adhesion, sliding properties and strength. In addition, Patent Document 6 mentions that epoxy resin is not prone to elastic deformation and is brittle, and describes that in order to make the adhesive layer exhibit toughness, a liquid or semi-solid resin or a resin containing a rubber component is used in combination. good. However, if a liquid or semi-solid resin or a resin containing a rubber component is used together, the brittleness will be improved and the toughness will be improved. However, the friction coefficient and stickiness will increase, so in reality, it is predicted that the bonding piece will be inserted into the stator core. The resistance is high and cannot be inserted quickly. In addition, resins containing rubber components such as butadiene rubber, acrylic rubber, and styrene-butadiene elastomer described in Patent Document 6 are prone to deterioration at high temperatures. Therefore, if these resins are used together, the heat resistance may be reduced. , it is not possible to obtain high shear bonding strength during heating. Furthermore, when these resins are used together, the toughness of the adhesive layer is impaired. Therefore, when the adhesive layer is a single layer or a thin base material is laminated, the possibility of bending when inserted into a narrow gap is high.

Patent Document 7 discloses a curable resin composition, which is characterized in that the expandable particles expand due to heat during curing, causing the volume of the adhesive to increase and filling the gaps in the adherend. However, the curable resin composition contains (B) epoxy resin and (A) film-forming resin as essential components. A suitable example of the (A) component is a thermoplastic resin. When an elastomer is selected, it is different from the above. Similarly, heat resistance is reduced, so there is a high possibility that high shear bonding strength cannot be obtained. In addition, when the curable resin composition of Patent Document 7 is formed into a sheet-like film, the friction coefficient or tackiness is high, and the toughness is low, so it is not suitable for use in inserting into a narrow gap.

Although Patent Documents 5 to 7 all describe the adhesive layer, the adhesiveness or expansion function of the adhesive layer or the adhesive, they do not mention the problem of heat dissipation. [Prior technical literature] [Patent Document]

[Patent document 1] Japanese Patent Application Publication No. 2011-244596 [Patent Document 2] Japanese Patent Application Publication No. 2019-022276 [Patent document 3] Japanese Patent Application Publication No. 2015-035888 [Patent Document 4] Japanese Patent Application Publication No. 2021-100353 [Patent Document 5] Japanese Patent Publication No. 2021-525296 [Patent Document 6] Japanese Patent Application Publication No. 2015-151401 [Patent Document 7] Japanese Patent No. 6909967

[Problem to be solved by the invention]

The problem to be solved by the present invention is to provide a resin composition which, when forming an adhesive resin layer, has low friction coefficient or tackiness, high toughness, high heat dissipation and high shear bonding strength when heated, and Provided are an adhesive resin composition, an adhesive resin layer formed from the adhesive resin composition, and an adhesive sheet having the adhesive resin layer. [Ways to solve problems]

The inventors of the present invention conducted intensive examinations in order to solve the above-mentioned problems, and as a result, they came up with the following invention, solved all the above-mentioned problems, and completed the present invention. That is, one aspect of the present invention relates to a resin composition, which is characterized in that it contains an epoxy resin, a hardener, a foaming agent, and a filler. The shape of the filler is scale-like, plate-like, needle-like, or fiber-like. Or dendritic, the content of the aforementioned filler is 12 mass% or more and 80 mass% or less when the entire resin composition excluding the solvent is taken as 100 mass%. In addition, according to another aspect of the present invention, there are provided an adhesive resin composition including the above-mentioned resin composition, an adhesive resin layer formed from the composition, and an adhesive sheet provided with the adhesive resin layer. In addition, according to another aspect of the present invention, there is provided a rotating electrical machine, characterized in that the above-mentioned adhesive resin composition or adhesive sheet is used for fixing between the stator core and coils of the rotating electrical machine and for fixing between coils. , and at least one fixed group selected between the rotor core and the magnet of the rotating electrical machine. [Effects of the invention]

According to the present invention, a resin composition can be provided which, when forming an adhesive resin layer, has low friction coefficient or tackiness, high toughness, heat dissipation and high shear bonding strength when heated, and provides an adhesive composition. An adhesive resin composition, an adhesive resin layer formed from the adhesive resin composition, and an adhesive sheet having the adhesive resin layer. The resin composition of the present invention may reduce the friction coefficient or stickiness because the filler will expose part of the surface of the adhesive resin layer after formation. In addition, since the reinforcing effect of the above-mentioned filler can be obtained, even when no elastomer or liquid epoxy resin is used or a small amount is used, the toughness of the formed adhesive resin layer is high and brittleness can be eliminated. In addition, many fillers such as talc and mica have excellent heat resistance and have higher thermal conductivity than epoxy resin, so they can provide heat dissipation properties to the adhesive resin layer. Furthermore, the resin composition of the present invention does not necessarily require the use of a liquid or semi-solid resin or a resin containing a rubber component (thermoplastic resin and/or elastomer). Therefore, the heat resistance is not reduced and the reinforcing effect of the filler is achieved. , thus forming an adhesive resin layer with high shear bonding strength when heated.

＜Resin composition＞ The resin composition of the present invention is characterized by: containing epoxy resin, hardener, foaming agent and filler. The shape of the aforementioned filler is scale-like, plate-like, needle-like, fibrous or dendritic. The content of the aforementioned filler is, When the entire resin composition excluding the solvent is taken as 100% by mass, it is 12% by mass or more and 80% by mass or less.

[Epoxy resin] The epoxy resin used in the resin composition of the present invention is not particularly limited, and examples thereof include bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenol novolac glycidyl ether, phenol novolac glycidyl amine, phenol Phenolic glycidyl ester, brominated bisphenol A glycidyl ether, alicyclic epoxy resin, etc. These epoxy resins can be used individually by 1 type or in combination of 2 or more types. In particular, a polyfunctional epoxy resin containing at least one type of bisphenol A-type epoxy resin and phenol novolac glycidyl ether is preferred. The amount of the epoxy resin is preferably 10 mass% or more and 87 mass% or less, preferably 20 mass% or more and 80 mass% or less, especially preferably, relative to the total solid content of the resin composition (the total resin composition excluding the solvent). It is 30 mass % or more and 70 mass % or less. In addition, the number average molecular weight (Mn) of the epoxy resin, measured by GPC and converted to standard polystyrene, is generally 100 or more and 60,000 or less, preferably 100 or more and 30,000 or less, preferably 300 or more and 20,000 or less. The best value is above 500 and below 10,000. The epoxy equivalent of the epoxy resin is generally from 50g/eqg/eq to 30,000g/eq, preferably from 100g/eq to 10,000g/eq, and preferably from 150g/eq to 5,000g/eq. In addition, from the viewpoint of suppressing adhesion, it is better that the epoxy resin is not liquid at normal temperature (23℃), it is better that it is semi-solid or solid at normal temperature (23℃), and it is better that it is semi-solid or solid at normal temperature (23℃). ) is better if it is solid. The resin composition of the present invention may also contain resin components other than epoxy resin (elastomer, thermoplastic resin, etc.). From the viewpoint of heat resistance or adhesiveness, it is best to contain as little resin components other than epoxy resin as possible, especially Elastomers and thermoplastic resins are preferred, or resin components other than epoxy resin may not be included, and thermoplastic resins are particularly preferred. The content of resin components other than the epoxy resin in the resin composition of the present invention is preferably 50 parts by mass or less, more preferably 45 parts by mass or less, and more preferably 41 parts by mass or less based on 100 parts by mass of the epoxy resin. , can also be 0 parts by mass. Examples of elastomers with resin components other than epoxy resin include thermosetting elastomers such as urethane resin, silicone resin, and fluororesin. Thermoplastic resins other than epoxy resins include polystyrene resins, olefin resins, polyvinyl chloride resins, polyester resins, polyamide resins, and phenoxy resins, and also include these resins. Thermoplastic elastomer.

[hardener] The resin composition of the present invention contains a curing agent in order to harden the resin. Examples of the hardening agent include aliphatic polyamines such as diethylenetriamine, triethylenetetramine, and m-phenylenediamine, and aromatic polyamines such as diaminodiphenylmethane, m-phenylenediamine, and diaminodiphenylthione. , alicyclic amines, ketimines, polyamide amines, amine adducts and other amines, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride and other alicyclic acid anhydrides, trimellitic anhydride , Anhydrides such as pyrolite anhydride and benzophenone tetracarboxylic acid, phenolic resins such as soluble phenolic phenolic resin, phenolic phenolic resin, imidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2 -Phenyl-4-methyl-5-hydroxymethylimidazole, 2-methylimidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole, 2-isopropylimidazole, 2-phenyl Imidazole compounds such as imidazole and carboxylates of these imidazoles, and potential epoxy resin hardeners such as dicyandiamine or its derivatives, organic acid hydrazides, and boron trifluoride-amine complexes. These hardeners can be used individually by 1 type or in combination of 2 or more types. In particular, it is preferable to include at least one selected from the group consisting of dicyandiamine, phenol novolac resin, acid anhydride, aromatic polyamine, aliphatic polyamine, polyaminoamide and imidazole compound, from the viewpoint of storage stability. Among them, it is preferable to include dicyandiamide. The content of the hardener is preferably such that the hardener equivalent number (calculated value) of the hardener and the epoxy equivalent number (calculated value) of the resin are approximately equal. For example, when the hardener is a phenolic resin, the hydroxyl equivalent is the hardener equivalent, which is the number of hydroxyl equivalents calculated from the hydroxyl equivalents of the phenolic resin in the resin composition relative to the number of epoxy equivalents calculated from the epoxy equivalents of the resin. The ratio becomes around 1.0 to decide. The ratio of the hardener equivalent number to the epoxy equivalent number can be set to 0.2 or more and 3.0 or less, preferably 0.5 or more and 2.0 or less, preferably 0.8 or more and 1.2 or less. In addition, in the case of dicyandiamine, it is based on the ratio of the number of active hydrogen equivalents calculated from the active hydrogen equivalents of the amine group and imine group of dicyandiamine (21 g/eq) to the aforementioned number of epoxy equivalents. calculate.

[Foaming agent] The resin composition of the present invention contains a foaming agent for foaming the formed adhesive resin layer. Foaming agents include, for example, Inorganic foaming agents such as ammonium carbonate, ammonium bicarbonate, ammonium nitrite, ammonium borohydride, and azides; Fluorinated alkanes such as trichloromonofluoromethane, azo compounds such as azobisisobutyronitrile, hydrazine compounds such as p-toluenesulfonyl hydrazine, and amidurea compounds such as p-toluenesulfonyl acylcarbamide, Triazole compounds such as 5-morpholino-1,2,3,4-thitriazole, N-nitroso compounds such as N,N-dinitrosoterephthalamide and other organic foaming agents ; Thermal expandable microcapsules are formed by microencapsulating a thermal expansion agent made of hydrocarbon compounds. These are thermosensitive foaming agents that start foaming above a given temperature. Such a temperature-sensitive foaming agent can be used individually by 1 type or in combination of 2 or more types. In particular, thermally expandable microcapsules are preferable from the viewpoint of not hindering the hardening of the epoxy resin and reducing adverse effects on the physical properties of the epoxy resin. As such heat-expandable microcapsules, microcapsules obtained by surrounding a liquid low-boiling point hydrocarbon with a shell of a thermoplastic resin are suitably used. The content of the foaming agent is not particularly limited, but is preferably 0.5 to 30 parts by mass, preferably 2 to 20 parts by mass, relative to 100 parts by mass of the total of the epoxy resin and the optional elastomer component. Preferably, it is not less than 4 parts by mass and not more than 15 parts by mass. The size of the foaming agent (non-foamed state) may be appropriately selected according to the use of the resin composition. Specifically, the mass average particle diameter may be 3 μm or more and 50 μm or less, preferably 5 μm or more and 40 μm or less. The foaming agent can be used after adjusting its particle size distribution. To adjust the particle size distribution, the larger particles contained in the foaming agent used can be classified and removed by a centrifugal type wind classifier, a dry classifier, a sieving machine, etc.

[Filler] The resin composition of the present invention contains filler. The shape of the filler is preferably scale-like, plate-like, needle-like, fibrous or dendritic (including dendritic). Fillers of such shapes may be used alone or two or more types may be used in combination. Types of fillers are preferably inorganic fillers, examples of which include talc, mica, silica, alumina, kaolin, sericite, calcium carbonate, glass fragments, wollastonite, sepiolite, hydrotalcite, montmorillonite, processed Mineral fiber (Processed Mineral Fiber, PMF), gypsum fiber, potassium titanate, phosphate fiber, magnesium oxysulfate (MOS), hyonite, dawsonite, acicular calcium carbonate, glass fiber, carbon fiber , silicon carbide, silicon nitride, boron nitride, aluminum nitride, aluminum borate, zinc oxide, copper, nickel, and magnesium oxide, at least one scaly, plate-shaped, needle-shaped, selected from the group of these fillers Fibrous or dendritic (including dendritic) inorganic fillers are preferred. These fillers can be used individually by 1 type or in combination of 2 or more types. In addition, Magnesium Oxysulfate (MOS) is an inorganic fiber formed from alkaline magnesium sulfate (MgSO ₄ ･5Mg(OH) ₂ ･3H ₂ O). It is manufactured by Ube Materials Co., Ltd. under the trade name "MOS-HIGE". Company sales. The content of the filler, when the entire resin composition excluding the solvent is taken as 100% by mass, is 12% by mass or more and 80% by mass or less, preferably 13% by mass or more and 55% by mass or less, and most preferably 14% by mass or more and 40% by mass. %the following. The aspect ratio of the filler is preferably from 1.5 to 80, preferably from 2 to 60, and most preferably from 3 to 40. The aspect ratio of the filler is defined by measuring 50 major axis lengths and minor axis lengths of the filler through observation with a scanning electron microscope (JSM-IT500 manufactured by JEOL Ltd.), and dividing the average of the major axis lengths by The value obtained by averaging the minor axis lengths.

[hardening accelerator] From the viewpoint of curability, it is preferable that the resin composition of the present invention further contains a curing accelerator. Examples of the hardening accelerator include imidazole compounds, phosphines, and phosphonium salts. Particularly when a phenol-based, acid anhydride, dicyandiamide, or other hardening agent other than the imidazole-based hardening agent is selected, a part of the imidazole compound in the hardening agent also functions as a hardening accelerator. A hardening accelerator may be used individually by 1 type or in combination of 2 or more types. In particular, it is preferable to use dicyandiamide as a hardener and to combine an imidazole compound as a hardening accelerator. The content of the hardening accelerator is not particularly limited. It is preferably from 0.1 to 1.0 parts by mass, preferably from 0.2 to 0.8 parts by mass, and most preferably from 0.3 parts by mass to 100 parts by mass of the epoxy resin. 0.6 parts by mass or less.

The resin composition of the present invention may also contain antioxidants such as phenol-based antioxidants and sulfur-based antioxidants, silane coupling agents such as epoxide-modified alkoxysilane, and viscosity adjusters such as fumed silica, as necessary. To identify additives such as pigments or dyes. The resin composition of the present invention can be prepared by mixing and kneading the above-mentioned additional ingredients (and further using a solvent if necessary). Mixing and kneading can be performed using a usual mixer, ball mill, planetary mixer, paint conditioner, three-roller mill, etc., or a combination of these can be performed. A solvent may also be added to the resin composition of the present invention in order to adjust the viscosity. Specific examples of the solvent include aromatic solvents such as toluene and xylene; aliphatic solvents such as hexane, octane, and isoparaffin; ketone solvents such as methyl ethyl ketone and methyl isobutyl ketone; ethyl acetate Ester solvents such as ester and isobutyl acetate; ether solvents such as diisopropyl ether and 1,4-dioxane. When forming an adhesive resin layer on a base material, for example, a roller coater or a reverse coater is used to coat the resin composition on the base material, and the method is heated and dried as necessary. An adhesive sheet with an adhesive resin layer on the base material. The adhesive resin layer can be formed by coating one layer or two or more layers on at least one side of the base material.

Uses of the resin composition of the present invention (uses of adhesive resin compositions and adhesive resin layers) The resin composition of the present invention, in addition to being used as an adhesive resin composition for bonding purposes, can also be used as a sealing material to fill narrow gaps existing in articles, a coating material to protect the surface of articles, and a component by injecting parts It is used as a potting material for circuits and hardening to provide electrical insulation. The resin composition of the present invention is suitable for use as an adhesive resin composition, which is used to form an adhesive resin layer that exhibits adhesiveness after being heated and foamed. In addition, the adhesive resin layer of the present invention can be used for sealing, fixing between the stator core and the coil of the motor, and fixing between the rotor core and the magnet of the motor, etc.

[thickness] The thickness (μm) of the adhesive resin layer formed from the resin composition (adhesive resin composition) of the present invention is not particularly limited, but is preferably 15 to 500 μm, preferably 20 μm or more and 200 μm or less, particularly preferably 30 μm. Above 100μm and below. When the thickness of the adhesive resin layer exceeds 500 μm, it may become difficult to insert into a narrow gap. In addition, when the thickness is less than 15 μm, the required characteristics such as shear bonding strength may not be obtained.

[Adhesive sheet] The adhesive resin layer formed from the resin composition (adhesive resin composition) of the present invention is preferably processed into a sheet in advance to form an adhesive sheet. The adhesive sheet can be used as a single layer or in layers. An adhesive sheet that combines two or more layers to form mutually different surfaces. In particular, a base material having a supporting adhesive resin layer is preferred. The thickness of the entire adhesive sheet is preferably not less than 30 μm and not more than 500 μm, preferably not less than 40 μm and not more than 400 μm, particularly preferably not less than 50 μm and not more than 300 μm.

[Substrate] The type of base material is not particularly limited, and examples thereof include resin films, nonwoven fabrics and/or woven fabrics, metal foil, felt, paper, and the like. In particular, from the viewpoints of insulation, resin adhesion, thickness selectivity, tensile strength, cost, etc., it is optimal to use a resin film, nonwoven fabric and/or woven fabric as the base material. Specific examples of the resin film include polyester-based resins such as polyethylene terephthalate (PET), polybutylene terephthalate, polyethylene naphthalate (PEN), and aromatic polyester; Polycarbonate; polyarylate; polyurethane; polyamide resins such as polyamide and polyetheramide; polyamides such as polyimide, polyetherimide and polyamideimine Imine-based resins; polystyrene-based resins such as polystyrene and polyether sulfide; polyetherketone-based resins such as polyetherketone and polyetheretherketone; polyphenylene sulfide (PPS); modified polyphenylene ether. Two or more types of resin films may be used together. In particular, polyphenylene sulfide (PPS), polyethylene naphthalate (PEN), polyimide, and polyetheretherketone are preferred. In addition, in order to improve the adhesion of the adhesive layer, the film substrate can also be subjected to surface treatment, such as surface roughening treatment using sandblasting or solvent treatment, corona discharge treatment, chromic acid treatment, Flame treatment, hot air treatment, ozone and ultraviolet irradiation treatment, etc. Specific examples of nonwoven fabrics and woven fabrics include rayon, cotton, aramid, polyphenylene sulfide (PPS), glass, polyester, polyethylene, polypropylene, and the like. In particular, aramid, polyphenylene sulfide (PPS), and glass are preferred. The base material can be one layer or two or more layers laminated. The laminated substrates may be of the same material, or may be a combination of different materials. The total thickness of the base material is preferably 4 μm or more and 400 μm or less, preferably 9 μm or more and 200 μm or less, particularly preferably 12 μm or more and 100 μm or less.

[Use of adhesive sheet] The adhesive sheet of the present invention is suitable for use in electrical insulation, sealing, insulation or fixing between the stator core and coils of rotating electrical machines such as motors or generators, phase-to-phase insulation or fixing between coils, and rotor core and rotating electrical machines. Fixing between magnets, etc. The following uses examples of the adhesive sheet or adhesive resin composition of the present invention, taking the case of a motor as an example. FIG. 3 is a top view of the motor 10 schematically composed of the stator 20 and the rotor 30 . The stator 20 has a stator core 21 formed into a cylindrical shape by 24 divided cores 22 arranged in the circumferential direction, and a coil composed of a conductive wire wound around a slot 23 formed in the stator core 21 . In addition, the rotor 30 has a rotor core 31 in which the rotating shaft 40 is fitted in the center, and through-holes 32 evenly arranged on the peripheral portion of the rotor core 31 . Eight permanent magnets 33 are inserted and fixed in the through-hole so that the magnetic field lines are directed in the diameter direction and the direction of the magnetic pole is reversed for every other magnet. 50 is an outer ring. FIG. 4 shows a state in which the coil 25 is fixed to the slot 23 formed in the stator core 21 (segmented core 22). 4(A) is a schematic diagram illustrating the fixing method using the adhesive sheet 24 related to the present invention when the coil 25 is inserted into the slot 23. FIG. 4(B) shows the heating after the coil 25 is inserted into the slot 23. The adhesive resin layer 24a of the adhesive sheet is foamed to bury and fix the gap between the wall surface of the slot and the coil. At this time, the wire 25a constituting the coil 25 will be bonded by the adhesive 25b. The adhesive sheet 24 forms an adhesive resin layer 24a on both sides of the base material 24b. Since the adhesive resin layer of the present invention has low friction coefficient and tackiness, the adhesive sheet before heating and foaming is inserted into a narrow gap. The resistance is small and the coil is easy to insert. In addition, FIG. 5 shows a state in which the permanent magnet 33 is inserted into the through hole 32 of the rotor core 31 and fixed with the adhesive sheet 34 related to the present invention. The adhesive sheet 34 is attached to the permanent magnet 33 . In the same figure, one adhesive piece is attached with the same length as the long side of the permanent magnet 33. However, multiple adhesive pieces can also be attached in the long side, or can be divided into multiple places in the width direction. To attach. In this way, the permanent magnet 33 with the adhesive sheet 34 attached is inserted into the through hole 32 and then heated to foam the foaming agent inside, thereby fixing the permanent magnet 33 in the through hole 32 . [Example]

The present invention is further described below through examples, but the present invention is not limited thereto. In the following description, "parts" means "parts by mass".

<Preparation of resin composition and adhesive resin composition> Epoxy resins E1 to E5, elastomers R1 and R2, hardeners H1 to H3, hardening accelerators A1 and A2, foaming agents X1 to X3, fillers F1 to F10, and viscosity adjusters used in the examples and comparative examples T is disclosed in Table 1 to Table 7 below.

[Table 1] Epoxy resin Brand (trade name) Features Softening point(℃) Epoxy equivalent (g/eq) E1 EOCN104S manufactured by Nippon Chemical Co., Ltd. p-cresol novolak type multifunctional 92 218 E2 jER157S70 manufactured by Mitsubishi Chemical Corporation Special phenolic type multifunctional 70 210 E3 NC3000H manufactured by Nippon Chemical Co., Ltd. Phenolic polyfunctional containing biphenyl structure 70 290 E4 VG3101L made by Printec multifunctional 61 210 E5 EPR.21 made by ADEKA Co., Ltd. Rubber modification Liquid (25,000mPa･s/25℃) 200

[Table 2] Elastomer Brand (trade name) Features R1 Desmocoll 540/4 made by Covestro Urethane resin molecular weight 222,300 R2 jER1256 manufactured by Mitsubishi Chemical Corporation Phenoxy resin epoxy equivalent weight 8,000g/eq

[table 3] Hardener Brand (trade name) Features H1 MEHC7800H made by Meiwa Kasei Co., Ltd. Phenolic resin softening point 87℃ hydroxyl equivalent 178g/eq H2 MEHC7403H made by Meiwa Kasei Co., Ltd. Phenolic resin softening point 99℃ hydroxyl equivalent 136g/eq H3 DICY7 manufactured by Mitsubishi Chemical Corporation The average particle size of dicyandiamide is 3μm

[Table 4] hardening accelerator Brand (trade name) Features A1 2PHZ-PW manufactured by Shikoku Kasei Co., Ltd. Imidazole compound, powder A2 2MAOK-PW manufactured by Shikoku Kasei Co., Ltd. Imidazole compound, powder

[table 5] Foaming agent Brand (trade name) Features Particle size (μm) Maximum expansion temperature (℃) X1 FN100SSD manufactured by Matsumoto Oil & Fat Pharmaceutical Co., Ltd. Thermal expansion microcapsule type 6～11 145～155 X2 FN100SD manufactured by Matsumoto Oil & Fat Pharmaceutical Co., Ltd. Thermal expansion microcapsule type 10～20 150～160 X3 EM306 made by Sekisui Chemical Co., Ltd. Thermal expansion microcapsule type 20～30 170～185

[Table 6] filler aspect ratio Brand (trade name) Kind shape F1 14 Micro Ace P3 made by Japan Talc Corporation talc scaly F2 27 Seraph 1003 made by Kinsei Matek Co., Ltd. Alumina plate-shaped F3 33 Tismo D manufactured by Otsuka Chemical Co., Ltd. Potassium titanate needle-shaped F4 16 SH1250 made by Kinsei Matek Co., Ltd. wollastonite needle-shaped F5 8.3 EFDE5031 made by Central Glass Fiber Co., Ltd. Alkali-free glass ground fiber fibrous F6 4.5 EFH5031 made by Central Glass Fiber Co., Ltd. Alkali-free glass ground fiber fibrous F7 4.5 EFH5001 made by Central Glass Fiber Co., Ltd. Alkali-free glass ground fiber fibrous F8 4.5 K223HM manufactured by Mitsubishi Chemical Corporation Pitch based ground fiber fibrous F9 6.6 FCC115 made by Futian Metal Foil Powder Co., Ltd. electrolytic copper powder dendritic F10 1.2 Pyroxuma 5301K manufactured by Kyowa Chemical Co., Ltd. magnesium oxide spherical

[Table 7] Viscosity adjuster Brand (trade name) Kind T Aerosil 300 manufactured by Evonik Corporation fumed silica

The details of the blending of the resin compositions used in the Examples and Comparative Examples are shown in Tables 8 and 9 below. Methyl ethyl ketone was added to the solvent so that it would become a predetermined concentration.

[Table 8] Material Formula (mass parts) 1 2 3 4 5 6 7 8 9 10 11 12 E1 30 30 100 30 100 100 100 100 30 30 30 100 E2 30 30 30 30 30 30 E3 30 30 30 30 30 30 E4 10 10 10 10 10 10 E5 R1 twenty four 39 11 R2 H1 H2 57 57 57 57 57 H3 9.1 9.6 9.6 9.6 9.6 9.6 9.6 A1 0.4 0.4 0.4 0.3 0.3 0.4 0.4 0.4 0.3 A2 0.4 0.8 0.4 X1 63 6.3 X2 18 X3 6.7 6.6 13 6.6 6.6 8.0 11 6.3 6.6 F1 34 F2 80 F3 26 F4 80 F5 56 56 56 58 80 F6 80 F7 80 F8 56 F9 F10 T 1.7 2.6 2.6 2.6 25 3.1 3.1 2.6 Concentration(%) 55 55 63 55 75 75 60 70 70 70 70 75

[Table 9] Material Formula (mass parts) 13 14 15 16 17 18 19 20 twenty one twenty two twenty three twenty four E1 30 83 83 83 83 30 30 30 30 30 30 E2 30 7 7 7 30 30 30 30 30 30 E3 30 7 7 100 7 30 30 30 30 30 30 E4 10 3 3 3 10 10 10 10 10 10 E5 18 R1 39 40 41 60 40 39 twenty four twenty four twenty four twenty four twenty four R2 300 H1 77 81 83 81 81 H2 51 57 H3 9.1 9.1 9.1 9.1 9.1 A1 0.4 0.4 0.4 0.4 1.6 0.4 0.4 0.4 0.4 0.4 0.4 0.4 A2 X1 13 twenty one 16 16 16 X2 18 X3 27 6.7 6.7 6.7 6.7 6.7 F1 66 66 120 17 25 F2 F3 F4 F5 34 F6 F7 F8 F9 58 F10 33 80 34 T Concentration(%) 55 55 55 55 50 57 55 55 55 55 55 55

Base materials B1 to B9 used in Examples and Comparative Examples are shown in Table 10 below.

[Table 10] base material material Thickness(μm) Brand (trade name) B1 PPS film 100 Torelina 3030 manufactured by Toray Corporation B2 PPS film 25 Torelina 3030 manufactured by Toray Corporation B3 Manila hemp nonwoven fabric twenty three MM8.3g made by Miki Specialty Paper Co., Ltd. B4 Glass fabric 33 WPA03T106BZ manufactured by Nittobo Co., Ltd. B5 Glass fabric 50 KS1090J made by Nittobo Co., Ltd. B6 PEN film 75 Q51 made by Toyobo Co., Ltd. B7 PPS film 75 Torelina 3030 manufactured by Toray Corporation B8 Polyarylamine paper 76.2 DuPont Teijin Corporation #410 B9 PI film 12.5 Made by Toray DuPont Co., Ltd. 50H

＜Preparation of adhesive resin layer＞ Each resin composition liquid ( Formulas 1 to 24), placed in a thermostat (model PHH-201 manufactured by ESPEC), and heated for 3 minutes at a set temperature of 70°C and an air volume setting of 3. Then, further heated at 100°C for 3 minutes in the same thermostat to obtain Adhesive resin layers 1 to 25. The thickness after drying of each adhesive resin layer of each formula (the thickness of the resin composition layer after drying) is shown in Table 11.

[Table 11] adhesive resin layer formula Thickness of the dried resin composition layer (μm) Adhesive resin layer 1 Recipe 1 45 Adhesive resin layer 2 Recipe 2 50 Adhesive resin layer 3 Recipe 3 55 Adhesive resin layer 4 Recipe 4 50 Adhesive resin layer 5 Recipe 5 50 Adhesive resin layer 6 Recipe 6 50 Adhesive resin layer 7 Recipe 7 50 Adhesive resin layer 8 Recipe 8 90 Adhesive resin layer 9 Recipe 9 45 Adhesive resin layer 10 Recipe 10 60 Adhesive resin layer 11 Recipe 11 60 Adhesive resin layer 12 Recipe 12 50 Adhesive resin layer 13 Recipe 13 50 Adhesive resin layer 14 Recipe 1 30 Adhesive resin layer 15 Recipe 14 50 Adhesive resin layer 16 Recipe 15 50 Adhesive resin layer 17 Recipe 16 50 Adhesive resin layer 18 Recipe 17 60 Adhesive resin layer 19 Recipe 18 50 Adhesive resin layer 20 Recipe 19 60 Adhesive resin layer 21 Recipe 20 45 Adhesive resin layer 22 Recipe 21 45 Adhesive resin layer 23 Recipe 22 45 Adhesive resin layer 24 Recipe 23 45 Adhesive resin layer 25 Recipe 24 45

＜Preparation of adhesive sheet＞ Prepare two pieces each of adhesive resin layers 1 to 7 and 9 to 24, and laminate the surface of the adhesive resin layer opposite to the side of the release film with a laminator (Leon13DX manufactured by Lami Corporation, set temperature 110 ℃, set speed 3) and laminate both sides of each base material (B1 to B9) (if there is no base material, the adhesive resin layers are mutually bonded) to produce each of the adhesive sheets 1 to 7 and 9 to 26. The adhesive resin layer 8 is formed by laminating a release film on one side to form an adhesive sheet 8 . The material composition of each adhesive sheet is shown in Table 12.

[Table 12] Adhesive sheet adhesive resin layer base material Example/Comparative Example Adhesive sheet 1 1 B1 Example 1 Adhesive sheet 2 2 B2 Example 2 Adhesive sheet 3 3 B3 Example 3 Adhesive sheet 4 4 B2 Example 4 Adhesive sheet 5 5 B4 Example 5 Adhesive sheet 6 6 B4 Example 6 Adhesive sheet 7 7 B2 Example 7 Adhesive sheet 8 8 without Example 8 Adhesive sheet 9 9 B5 Example 9 Adhesive sheet 10 10 without Example 10 Adhesive sheet 11 11 without Example 11 Adhesive sheet 12 12 B4 Example 12 Adhesive sheet 13 13 B1 Example 13 Adhesive sheet 14 14 B9 Example 14 Adhesive sheet 15 15 B6 Example 15 Adhesive sheet 16 1 B8 Example 16 Adhesive sheet 17 twenty one B1 Example 17 Adhesive sheet 18 25 B1 Example 18 Adhesive sheet 19 16 B6 Comparative example 1 Adhesive sheet 20 17 B1 Comparative example 2 Adhesive sheet 21 18 B7 Comparative example 3 Adhesive sheet 22 19 B6 Comparative example 4 Adhesive sheet 23 20 B2 Comparative example 5 Adhesive sheet 24 twenty two B1 Comparative example 6 Adhesive sheet 25 twenty three B1 Comparative example 7 Adhesive sheet 26 twenty four B1 Comparative example 8

Preparation of test pieces for rigidity evaluation Each resin composition liquid was applied to the heavy release surface of a release film (manufactured by Oji F-Tex Co., Ltd., trade name "25RLW07 (1/2)") that had been surface-treated with a polysilicone release agent using a roll coater. (Recipes 1, 20 to 23), placed in a thermostat (model PHH-201 manufactured by ESPEC), heated at a set temperature of 70°C and an air volume setting of 3 for 3 minutes. Then, it was further heated at 100° C. for 3 minutes in the same thermostat to obtain adhesive resin layers C1t to C6t (the thickness of the adhesive resin layer after drying was 45 μm). Prepare two adhesive resin layers C1t to C6t each, and laminate the surfaces of the adhesive resin layers opposite to one side of the release film using a laminator to obtain adhesive resin layers C1u to C6u (adhesive resin layers C1u to C6u). The thickness of the contact resin layer is 90μm). Prepare two adhesive resin layers C1u to C6u each, peel off the release film on one side respectively, and laminate the surfaces of the adhesive resin layers opposite to one side of the release film using a laminator to obtain Adhesive resin layers C1 to C6. The thickness of each adhesive resin layer of each formula after lamination is shown in Table 13.

[Table 13] adhesive resin layer formula Thickness of adhesive resin layer (μm) Example/Comparative Example Adhesive resin layer C1 Recipe 1 180 Example 19 Adhesive resin layer C2 Recipe 20 180 Example 20 Adhesive resin layer C3 Recipe 24 180 Example 21 Adhesive resin layer C4 Recipe 21 180 Comparative example 9 Adhesive resin layer C5 Recipe 22 180 Comparative example 10 Adhesive resin layer C6 Recipe 23 180 Comparative example 11

＜Evaluation of friction coefficient＞ According to JIS K7125: 1999 "Plastics - Films and Sheets - Friction Coefficient Test Method", the STROGRAPH manufactured by Toyo Seiki Co., Ltd. was used to measure the lamination detachment of the adhesive sheets of the Examples and Comparative Examples prepared as above under the following conditions. The static friction coefficient between the adhesive resin layer surface on one side of the mold film and the aluminum plate A1050P. (condition) ･Load unit capacity: 5kg ･Stretching speed: 100mm/min ･Slipper: 200g ･Standing time: 10 seconds ･Contact area between the adhesive sheet and the aluminum plate: 63mm square, ･Gas environment: temperature 23℃, 50%Rh The measured friction coefficient is evaluated based on the following criteria. 「◎」：The friction coefficient is less than 2. "〇": The friction coefficient is 2 or more but less than 5. "×": The friction coefficient is 5 or more.

＜Tackiness＞ In a gas environment with a temperature of 23°C and a humidity of 50% Rh, sprinkle 0.1g of 20-30mesh sea sand manufactured by Wako Pure Chemical Industries, Ltd. on the surface of the sheet, press the sea sand onto the sheet with a pressure of 0.1MPa, and then Turn the sheet 180° so that the side sprinkled with sea sand faces down. Then, the surface of the sheet was visually observed and evaluated based on the following criteria. "○": Sea sand is not attached. "×": Sea sand is attached.

＜Evaluation of rupture (Evaluation of brittleness)＞ In an air environment with a temperature of 23°C and a humidity of 50% Rh, the adhesive resin layer provided with the release film was directly placed on a commercially available float laminated with the release film in such a manner that the release film was in contact with the glass plate. On the type flat glass, observe whether the adhesive resin layer is broken when it is cut with a utility knife (Ltd-03 manufactured by OLFA Co., Ltd.) at a speed of 100mm/second and an angle of 40°. "◎": No cracks. "○": Powdery debris is generated from the incision and cracking occurs. "×": Cracked and the resin piece fell off.

＜Rigidity (evaluation of toughness)＞ In the form of an adhesive sheet, the base material has a large influence, so the toughness of the adhesive resin layer is evaluated. The resistance when the adhesive resin layer is bent is measured. Specifically, the test was performed in accordance with JIS P8125 "Paper and paperboard - Stiffness test method - (Taber stiffness test method)", and the bending moment was calculated according to the following formula. Bending moment (gf･C)=(scale reading)×38.0(mm)/(measured test piece width: mm).

＜Shear adhesive strength during heating＞ According to the tensile shear adhesive strength test method described in JIS Z 1541 "Super strong double-sided adhesive tape", the shear strength of the foamed adhesive sheet as shown in Figure 1 was measured. cut bonding strength. An SPCC board (manufactured by Nisshin Steel Co., Ltd., brand name SPCC-SB NCB, 1.0 mm thick, 12×100 mm) was used as the adherend. The sample attachment area is set to 10×10mm, the foaming and hardening conditions are set to 180°C, 10 minutes, and the tensile speed is set to 50mm/minute. First, as shown in Figure 1(A), the adhesive sheet 1 before foaming is placed on the SPCC board 2, and another SPCC board 2 is further placed with two gauges (0.34mm) 3 separated. However, only Example 14 uses a gauge of 0.20 mm. Next, as shown in FIG. 1(B) , the adhesive sheet 1 is foamed and hardened, and the foamed adhesive sheet 1 is subjected to a tensile shear adhesive force test (160° C.). The shear bonding strength is expressed by dividing the measured value (N) by the sample area (100mm ² ) before foaming (MPa). The obtained bonding strength was evaluated based on the following criteria. ◎: When the "shear bonding strength during heating" exceeds 2.0MPa 〇: When the "shear bonding strength during heating" exceeds 1.0MPa and is less than 2.0MPa △: When the "shear bonding strength during heating" exceeds 0.5 MPa and below 1.0MPa ×: When "shear bonding strength during heating" is below 0.5MPa

＜Thermal conductivity (evaluation of heat dissipation)＞ Thermal conductivity measuring device TCM1001 manufactured by Rhesca Co., Ltd. was used to measure the thermal conductivity of each test piece in the thickness direction in accordance with JIS H7903 (unidirectional heat flow steady state method) as shown in Figure 2. The standard rod body uses an upper rod body 5 with a heating block (70° C.) and a lower rod body 6 with a cooling block (0° C.). A 20 mm × 18 mm adhesive sheet (adhesive resin layer 1A is formed on both sides of the base material 1B) is placed in the gap between the copper block 4 sandwiched with a 0.34 mm gauge (not shown), and the temperature is maintained at 180°C. Heat for 10 minutes to prepare a thermal conductivity measurement test piece that has been foamed and hardened. After the gap gauge is removed from the test piece, the test piece is sandwiched between the upper rod 5 and the lower rod 6 to allow heat to be conducted in the thickness direction of the test piece for measurement. The evaluation results of each test other than rigidity are shown in Table 14, and the evaluation results of rigidity are shown in Table 15.

[Table 14] Table 14-1 Example 1 2 3 4 5 6 7 8 9 10 Friction coefficient (evaluation of surface sliding properties) ○ ○ ◎ ○ ◎ ◎ ○ ○ ◎ ○ Stickiness (evaluation of surface slipability) ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ Fragility (assessment of brittleness) ○ ○ ○ ○ ○ ○ ◎ ◎ ○ ○ Shear bond strength when heated (evaluation of bonding force) ◎ ○ ◎ ○ ◎ ◎ ○ ○ ◎ ◎ Thermal conductivity (evaluation of heat dissipation) 0.13 - - - - - - - - - Table 14-2 Example 11 12 13 14 15 16 17 18 Friction coefficient (evaluation of surface sliding properties) ○ ◎ ○ ○ ○ ○ ○ ○ Stickiness (evaluation of surface slipability) ○ ○ ○ ○ ○ ○ ○ ○ Fragility (assessment of brittleness) ○ ○ ○ ○ ○ ○ ◎ ○ Shear bond strength when heated (evaluation of bonding force) ◎ ○ ○ ○ ◎ ○ ◎ ◎ Thermal conductivity (evaluation of heat dissipation) - 0.4 0.28 - - - - - Table 14-3 Comparative example 1 2 3 4 5 6 7 8 Friction coefficient (evaluation of surface sliding properties) × × ◎ × ○ × × × Stickiness (evaluation of surface slipability) × ○ ○ ○ ○ ○ ○ ○ Fragility (assessment of brittleness) ◎ ◎ ○ × × ○ ○ ○ Shear bond strength when heated (evaluation of bonding force) △ × × △ △ ○ ○ ◎ Thermal conductivity (evaluation of heat dissipation) - - - - - 0.08 - -

Comparative Example 1: Rubber modified liquid epoxy resin mixture, no filler Comparative Example 2: Elastomer mixing Adding a large amount of urethane resin Comparative Example 3: Elastomer mixing, adding a large amount of phenoxy resin Comparative Example 4: No filler Comparative Example 5: Using spherical filler Comparative Example 6: No filler Comparative Example 7: Using spherical filler Comparative Example 8: Adding a small amount of scaly filler

[Table 15] Example Comparative example 19 20 twenty one 9 10 11 Rigidity (evaluation of toughness) [gf･cm] 19 15 14 2 2 6

(Effects of the embodiment) As shown in Table 14, the adhesive sheets of Examples 1 to 18 have low friction coefficient and tackiness. Therefore, when the adhesive sheets before heating and foaming are inserted into a narrow gap, the resistance is small and the rupture (evaluation of brittleness) The evaluation is good, so it can be said that it is not easy to break when cutting or bending. In addition, the heat-foamed adhesive resin layer has high shear bonding strength during heating, so the bonding reliability to the adherend is high, and the thermal conductivity (evaluation of heat dissipation) is large, so the heat-foamed adhesive resin layer The adhesive resin layer can be said to have excellent heat dissipation properties. As shown in Table 15, the adhesive resin layers of Examples 19 to 21 have high rigidity (evaluation of toughness). Therefore, it can be said that even when there is no base material, the adhesive resin layers can be inserted into a narrow gap. Not easy to bend. In addition, it is suggested that when the adhesive resin layer is provided on the surface of a base material (as in Examples 1 to 18), the toughness of the base material is added to form an adhesive sheet that is less likely to bend.

(Effects of comparative example) Comparative Example 1, which contains rubber-modified liquid epoxy resin and does not contain fillers, has high friction coefficient and tackiness. Therefore, when inserting the adhesive sheet before heating and foaming into a narrow gap, the resistance is great and it can be said to be difficult to insert. Comparative Examples 4 and 6 without filler, or Comparative Example 8 with a small amount of filler also have high friction coefficients, so it is expected that the same malfunction will occur. Comparative Example 4 without filler had poor crackability evaluation results and could be said to be brittle, probably because it did not have the reinforcing effect of the adhesive resin layer before heating and foaming. The adhesive resin layers of Comparative Examples 9 to 11, which contain no filler, add spherical filler, or add a small amount of filler, have low rigidity values and therefore have weak toughness and poor usability before heat-foaming. In addition, when the adhesive resin layer is provided on the surface of the base material (such as the cases of Comparative Examples 4, 6, 7, and 8), the effect of reinforcing the toughness of the base material alone is insufficient, so it is explained that this will become Adhesive patch with poor insertability. Specifically, there may be cases where the adhesive sheet gets clogged on the production line when being transported during the process, or the adhesive sheet cannot maintain its shape even if it is formed into the slot and is damaged, or when the formed adhesive sheet is inserted into the slot of the stator. Concern about buckling and clogging in the slot. Comparative Example 2, which uses a large amount of elastomer together, and Comparative Example 3, which uses a large amount of phenoxy resin as the elastomer, can be said to be bonded because the adhesive resin layer after heating and foaming has low shear bonding strength when heated. Poor reliability. Comparative Example 6 without filler was found to have poor heat dissipation due to low thermal conductivity. [Industrial availability]

In addition to bonding purposes, the resin composition of the present invention can also be used as a sealing material that fills narrow gaps in articles and a coating material that protects the surface of articles. In addition, depending on the choice of filler, by injecting it into parts or circuits and hardening it, it can be used as a potting material that imparts electrical insulation, heat insulation, conductivity, electromagnetic wave shielding properties, and low dielectric properties. In terms of suitable usage, it can be used to form an adhesive resin layer that exhibits adhesiveness after being heated and foamed. The adhesive resin of the present invention and the adhesive resin layer formed from the adhesive resin can be used for joining, sealing, shockproofing, soundproofing, fixing between the stator core and coils of the motor, and fixing between coils of different materials. Fixing, and fixing between the rotor core and magnet of the motor, etc. In addition, depending on the selection of fillers, it can also be used for heat dissipation, thermal insulation, conductivity, electromagnetic wave shielding, low dielectric constant, etc. The adhesive sheet of the present invention is suitable for joining, sealing, shockproofing, and soundproofing different materials, fixing the stator core and the coils of the motor, fixing the coils, and fixing the rotor core of the motor and the magnets, etc. In addition, depending on the selection of fillers and base materials, it can also be used for heat dissipation, thermal insulation, electrical insulation, conductivity, electromagnetic wave shielding, low dielectric constant, etc.

1: Adhesive sheet 1A: Adhesive resin layer 1B:Substrate 2:SPCC board 3: Gap gauge 4: Copper block 5: Upper rod body 6:Lower rod body 10: Motor 20:Stator 21:Rotor core 22: Split the core 23:Slot 24: Adhesive sheet 25: coil 30:Rotor 31:Rotor core 32:Through hole 33:Permanent magnet 34: Adhesive sheet

Figure 1 (A) and (B) are diagrams illustrating the testing method of shear bonding strength during heating. FIG. 2 is a diagram illustrating the structure of a jig for thermal conductivity (evaluation of heat dissipation). 3 is a schematic plan view of the stator and rotor of the rotating electrical machine (motor) to which the present invention is applied. FIGS. 4(A) and 4(B) are schematic diagrams illustrating a state in which a coil is inserted into a stator core (divided core). 5(A) and (B) are schematic diagrams illustrating the manner in which permanent magnets are inserted into the rotor core.

Claims (15)

A resin composition characterized by: containing epoxy resin, hardener, foaming agent and filler, The shape of the filler is scale-like, plate-like, needle-like, fibrous or dendritic. The content of the filler is 12 mass% or more and 80 mass% or less when the entire resin composition excluding the solvent is taken as 100 mass%. Such as the resin composition of claim 1, wherein the filler is made from talc, mica, silica, alumina, kaolin, sericite, calcium carbonate, glass fragments, wollastonite, sepiolite, hydrotalcite, montmorillonite, etc. Destone, Processed Mineral Fiber (PMF), gypsum fiber, potassium titanate, phosphate fiber, Magnesium Oxysulfate (MOS), hyonite, dawsonite, acicular calcium carbonate, At least one inorganic filler selected from the group consisting of glass fiber, carbon fiber, silicon carbide, silicon nitride, boron nitride, aluminum nitride, aluminum borate, zinc oxide, copper, nickel, and magnesium oxide. The resin composition of claim 1, wherein the foaming agent is thermally expandable microcapsules. The resin composition of claim 1, wherein the foaming agent is contained in an amount of 0.5 to 30 parts by mass based on 100 parts by mass of the total of the epoxy resin and the optional elastomer component. The resin composition of claim 1, wherein the epoxy resin includes a multifunctional epoxy resin. The resin composition of claim 1, wherein the hardener is selected from the group consisting of dicyanodiamine, phenol novolac resin, acid anhydride, aromatic polyamine, aliphatic polyamine, polyaminoamide, and imidazole compound. At least one of the group selections. The resin composition of Claim 1, wherein the hardener is contained in an amount such that a ratio of the number of hardener equivalents to the number of epoxy equivalents of the epoxy resin is 0.2 or more and 3.0 or less. The resin composition according to claim 1, further comprising a hardening accelerator, and the hardening accelerator is at least one selected from the group consisting of imidazole compounds, phosphines, and phosphonium salts. The resin composition of claim 8, wherein the content of the hardening accelerator is 0.1 to 1.0 parts by mass relative to 100 parts by mass of the epoxy resin. An adhesive resin composition comprising the resin composition according to any one of claims 1 to 9. An adhesive resin layer formed of the adhesive resin composition of claim 10. An adhesive sheet having an adhesive resin layer as claimed in claim 11. The adhesive sheet of claim 12, wherein the adhesive sheet has a base material that supports the adhesive resin layer, and the base material is at least selected from the group consisting of resin film, non-woven fabric, woven fabric and paper. One. The adhesive sheet of claim 12, wherein the adhesive sheet is used for a group formed by fixing the stator core of the rotating electrical machine and the coils, fixing the coils, and fixing the rotor core of the rotating electrical machine and the magnets. At least one use of group selection. A rotating electrical machine characterized by using the adhesive resin composition according to claim 10 or the adhesive sheet according to claim 12 for fixing between the stator core and coils of the rotating electrical machine, fixing between coils, and At least one type of fixation selected from the group formed by fixation between the rotor core and the magnet of the rotating electrical machine.