TW202347587A - Method and apparatus for separating adhesive tape - Google Patents

Abstract

The invention provides an adhesive tape stripping method and an adhesive tape stripping device, which can prevent deformation or breakage of a workpiece and can strip an adhesive tape adhered to the workpiece with high precision. The adhesive tape peeling device is provided with: a holding table (3) on which a wafer (W) is placed; and a peeling mechanism (7) that places a peeling member (37) on the surface of the protective tape (PT), and that peels the protective tape (PT) from one end side of the wafer (W) toward the other end side by pulling the protective tape (PT) in a state in which the protective tape (PT) is folded back by the peeling member (37). The peeling member (37) includes a flat surface (45) abutting against a surface of the protective tape (PT) and a first fold-back corner portion (47) provided at one end portion of the flat surface (45) and folding back the protective tape (PT) and peeling the protective tape (PT) from the wafer (W), and the first fold-back corner portion (47) is configured such that an angle (L1) at which the protective tape (PT) is folded back is an acute angle when the protective tape (PT) is peeled off from the wafer (W).

Description

Adhesive tape peeling method and adhesive tape peeling device

The present invention relates to an adhesive tape peeling method and an adhesive tape peeling device, which are used to peel off an adhesive tape adhered to a workpiece such as a semiconductor wafer (hereinafter, appropriately referred to as "wafer").

After the circuit pattern formation process is performed on the surface of the wafer, a back grinding process is performed, which is a process of uniformly grinding the entire back surface of the wafer to make it thin. Before performing the back grinding process, in order to protect the circuit, a protective adhesive tape (protective tape) is affixed to the surface of the wafer. After the wafer is thinned, the protective tape is peeled off in order to perform various processes such as dicing processes.

As a conventional method for peeling a protective tape from a wafer, a peeling adhesive tape (peeling tape) is adhered to the surface of the protective tape using an adhesion roller after backside grinding. In addition, there is a peeling method (see, for example, Patent Document 1) in which the peeling tape adhered to the protective tape is peeled off while being folded back with a sharp edge member, thereby integrating the peeling tape and the protective tape. Self-wafer peeling. [Prior technical literature] [Patent Document]

Patent Document 1: Japanese Patent Application Publication No. 2002-124494

[Problem to be solved by the invention]

However, in the case of conventional examples having such a configuration, there are the following problems.

The conventional structure has the following problem: when a sharp blade-like member is used to peel off the protective tape from the wafer, a part of the adhesive material contained in the protective tape remains on the surface of the wafer from which the protective tape has been peeled off. If there is adhesive material remaining on the wafer surface, the adhesive material will have a negative impact on the performance of the wafer. In addition, there may be the following problem: when a blade-shaped member is used to peel off the protective tape from the wafer, strain or cracking may occur in the wafer at the portion where the blade-shaped member contacts the protective tape.

The present invention was made in view of the above situation, and its object is to provide an adhesive tape peeling method and an adhesive tape peeling device that can prevent the workpiece from deforming or breaking, and can peel off the adhesive tape adhered to the workpiece with high precision. [Means used to solve problems]

In order to achieve the aforementioned object, the present invention adopts the following configuration. That is, the adhesive tape peeling method of the present invention is an adhesive tape peeling method for peeling off the adhesive tape adhered to the workpiece from the aforementioned workpiece, and is characterized by having: The workpiece holding process involves placing the aforementioned workpiece on the holding member; and In the peeling process, the peeling member is placed on the surface of the adhesive tape, and the adhesive tape is pulled in a state where the adhesive tape is folded back by the peeling member, and the adhesive tape is moved from one end side of the workpiece to the other end side. peel off; The peeling member has a flat surface and a first folded corner portion. The flat surface is in contact with or close to the surface of the adhesive tape during the peeling process. The first folded corner portion is provided on the flat surface. One end of the surface and the aforementioned adhesive tape is folded back and peeled off from the aforementioned workpiece, The first folded corner portion is configured such that the angle at which the adhesive tape is turned back becomes an acute angle when the adhesive tape is peeled off from the workpiece.

(Function and effect) According to this configuration, when peeling off the adhesive tape stuck to the workpiece from the workpiece, the peeling member having the flat surface and the first folded portion is used. That is, the peeling member is placed on the surface of the adhesive tape so that the flat surface is in contact with or close to the surface of the adhesive tape, and the adhesive tape is turned back at an acute angle using the first folding corner portion to peel off the workpiece. This configuration prevents the angle of return from becoming too large when the adhesive tape is peeled off, thereby preventing the base material or adhesive material of the adhesive tape from breaking and causing fragments of the adhesive material or the like to contaminate the workpiece. In addition, by setting the angle of return when peeling off the adhesive tape to be smaller, the peeling force acting on the workpiece when peeling off the adhesive tape from the workpiece can be reduced. This can avoid deformation or cracking of the workpiece caused by excessive peeling force.

In addition, since the flat surface is brought into contact with or close to the surface of the adhesive tape during the peeling process, the peeling member can disperse the force acting on the workpiece through the relatively wide flat surface. This can more reliably avoid deformation or cracking of the workpiece due to excessive force acting on the workpiece during the peeling process.

Furthermore, in the aforementioned invention, the peeling member has a heater that heats the adhesive tape. During the peeling process, the peeling member turns back the adhesive tape heated by the heater to peel the adhesive tape from the workpiece. .

(Function and effect) According to this configuration, the peeling member includes a heater that heats the adhesive tape, and folds back the adhesive tape heated by the heater to peel the adhesive tape from the workpiece. Since the adhesive tape is heated, the base material or adhesive material of the adhesive tape is softened, so that the adhesive tape can be folded back easily. Thereby, peeling failure of the adhesive tape during the peeling process can be prevented.

Furthermore, in the above invention, it is preferable that the peeling member has a second folding corner portion for folding back the adhesive tape peeled off from the workpiece by turning back the first folding portion. , and is guided from the first end side of the wafer toward the other side.

(Operation and Effect) According to this configuration, the peeling member has the first folded portion and the second folded portion. Furthermore, the adhesive tape peeled off from the workpiece while being folded at an acute angle by the first folding portion is further folded again by the second folding portion and guided from one end side of the wafer toward the other side. In this case, since the adhesive tape peeled off from the workpiece is quickly guided in the direction of separation from the workpiece by the second turning portion, it is possible to more reliably avoid the situation where the adhesive material of the peeled off adhesive tape contaminates the workpiece.

Furthermore, in the above invention, it is preferable that the peeling member further has a sharp blade-shaped portion and is configured to be switchable between a first posture and a second posture, the first posture being one of the blade-shaped portion and the flat surface. The flat surface can be in contact with or approach the surface of the adhesive tape. The second posture is an attitude in which the blade-shaped portion and the blade-shaped portion of the flat surface can be in contact with or approach the surface of the adhesive tape. The peeling process is to make the flat surface contact or approach the surface of the adhesive tape when the peeling member adopts the first posture, and the folding angle of the adhesive tape becomes an acute angle through the first folding angle. The adhesive tape is pulled while the adhesive tape is folded back, thereby peeling off the adhesive tape from the workpiece, and when the peeling member adopts the second posture, the blade-shaped portion is brought into contact with the surface of the adhesive tape. Connect or approach, and pull the adhesive tape in a state where the adhesive tape is folded back by the blade-shaped portion so that the folding angle of the adhesive tape becomes an obtuse angle, thereby peeling off the adhesive tape from the workpiece.

(Operation and Effect) According to this configuration, the peeling member has a flat surface and a sharp blade-shaped portion, and is configured to be switchable between the first posture and the second posture. When the peeling member takes the first posture, the flat surface is brought into contact or close to the surface of the adhesive tape during the peeling process. Therefore, the force acting on the workpiece by the self-peeling member can be dispersed through the relatively wide flat surface. The adhesive tape peels off the workpiece. Therefore, deformation or cracking of the workpiece can be prevented. When the peeling member takes the second posture, since the adhesive tape is folded back in a state where the sharp blade-shaped portion is in contact with or close to the surface of the adhesive tape, the peeling force acting on the adhesive tape can be increased. Therefore, even when the adhesive force of the adhesive tape is high, the adhesive tape can be peeled off from the workpiece more reliably. In this way, a peeling process corresponding to the conditions of the workpiece and the adhesive tape can be performed by a simple operation of switching the posture of the peeling member. Therefore, the complexity of the device can be avoided, and the adhesive tape can be peeled off from the workpiece with high precision.

Furthermore, in the above invention, it is preferable that the workpiece holding process is to place the workpiece on a holding member, and to hold an outer peripheral portion of the workpiece over the entire surface of the workpiece by the holding member.

(Operation/Effect) According to this configuration, the outer peripheral portion of the workpiece is held over the entire surface of the workpiece by the holding member. In this case, even when a wafer with a particularly thin central portion or a wafer with circuits formed on the front and back surfaces of the central portion is used as a workpiece, it is possible to adhere the workpiece without causing damage to the workpiece. With stripping.

Furthermore, in the above invention, it is preferable that in the peeling process, the peeling member is in a state in which the peeling member is in contact with the adhesive tape when peeling off the adhesive tape adhered to the outer peripheral portion of the workpiece. The adhesive tape is folded back, and when the adhesive tape adhered to other than the outer peripheral portion of the workpiece is peeled off, the peeling member is controlled in such a manner that the peeling member folds back the adhesive tape in a state where the peeling member is close to the adhesive tape. the height of.

(Function and effect) According to this configuration, when peeling off the adhesive tape adhered to the outer peripheral portion of the workpiece, the peeling member is turned back and peeled off while the peeling member is in contact with the adhesive tape. In this case, since the workpiece can be maintained more stably, deformation or damage of the workpiece when the adhesive tape is peeled off can be avoided. In addition, when peeling off the adhesive tape adhered to other than the outer peripheral part of the workpiece, the adhesive tape is folded back and peeled off by the peeling member in a state where the peeling member is brought close to the adhesive tape. In this case, since the peeling member can be prevented from exerting an excessive force on the workpiece, even when a workpiece with a thin and fragile central portion is used, deformation or cracking of the workpiece can be more reliably avoided.

Furthermore, in the above invention, it is preferable that the peeling member is a polygonal columnar member having a plurality of planes extending in a predetermined direction and a plurality of corners having different angles, and is configured to be able to rotate around an axis in the predetermined direction. Rotate, by rotating the peeling member around the axis in the predetermined direction, switching the planes among the plurality of planes that are in contact with the surface of the adhesive tape, and switching the planes among the plurality of corners to peel the adhesive tape from the workpiece Then fold back the corners of the aforementioned adhesive tape.

(Function and effect) According to this configuration, the peeling member is a polygonal columnar member rotatable around an axis in a predetermined direction, and has a plurality of flat surfaces extending in the predetermined direction and a plurality of corner portions with different angles. That is, by rotating the peeling member around an axis in a predetermined direction, the plane in contact with the surface of the adhesive tape among the plurality of planes is switched. By switching the plane that contacts the surface of the adhesive tape, the corner portion that contacts the adhesive tape and folds the adhesive tape is also switched. Since the angles of each corner are different, the peeling angle of the adhesive tape can be appropriately changed by switching the corner at which the adhesive tape is folded. In this way, through the simple operation of rotating the peeling member, the peeling angle can be appropriately changed according to the conditions of the workpiece and the adhesive tape to perform the peeling process. Therefore, the complexity of the device can be avoided, and the adhesive tape can be peeled off from the workpiece with high precision. .

Furthermore, in the aforementioned invention, it is preferable to include a peeling tape attaching process in which the peeling tape is adhered to the surface of the adhesive tape in a peeling direction that separates the adhesive tape from the workpiece. In the direction of peeling, the peeling process is to place the peeling member on the surface of the peeling tape that is pasted on the adhesive tape, and to pull the peeling in a state where the adhesive tape to which the peeling tape is attached is folded back by the peeling member. The adhesive tape and the peeling tape are integrally peeled from the workpiece.

(Function and effect) According to this configuration, the release tape is adhered to the surface of the adhesive tape. Then, the peeling member is placed on the surface of the peeling tape, and the peeling tape is pulled while the adhesive tape to which the peeling tape is attached is folded back by the peeling member, whereby the adhesive tape and the peeling tape are integrally peeled off from the workpiece. By using the peeling tape, the adhesive tape can be peeled off from the workpiece while maintaining the adhesive tape more stably. Thereby, peeling failure of the adhesive tape during the peeling process can be prevented.

Furthermore, in the aforementioned invention, it is preferable that the peeling member is formed with a recessed portion having a depth corresponding to the thickness of the adhesive tape on the flat surface, and in the peeling process, the peeling tape is preferably fitted into the recessed portion. The peeling member is placed on the surface of the peeling tape pasted on the adhesive tape in this state, and the peeling member pulls the peeling tape in a state where the adhesive tape pasted with the peeling tape is folded back. The adhesive tape and the peeling tape are integrally peeled from the workpiece.

(Function, Effect) According to this configuration, a recessed portion having a depth corresponding to the thickness of the adhesive tape is formed on the flat surface of the peeling member. Therefore, when the release member is placed on the surface of the adhesive tape to which the release tape is adhered, the release tape fits into the recessed portion. Accordingly, even when a thick release tape is used, it is possible to avoid a situation where the adhesiveness between the flat surface of the release member and the adhesive tape is reduced due to the thickness of the release tape. Thereby, the adhesion between the flat surface and the adhesive tape during the peeling process can be improved, and the position of the workpiece can be more stably maintained by the peeling member.

In order to achieve the aforementioned object, the present invention may also adopt the following configuration. That is, the adhesive tape peeling device of the present invention is used to peel the adhesive tape adhered to the workpiece from the aforementioned workpiece, and is characterized by having: A workpiece holding part that holds the aforementioned workpiece; and A peeling mechanism that places a peeling member on the surface of the adhesive tape and pulls the adhesive tape in a state where the adhesive tape is folded back by the peeling member, thereby pulling the adhesive tape from one end of the workpiece toward the other end. side peel; and The peeling member has a flat surface and a first folded corner portion. The flat surface is in contact with or close to the surface of the adhesive tape. The first folded corner portion is provided at one end of the flat surface. The aforementioned adhesive tape is folded back and peeled off from the aforementioned workpiece, and The first folded corner portion is configured such that the angle at which the adhesive tape is turned back becomes an acute angle when the adhesive tape is peeled off from the workpiece.

(Function and effect) According to this configuration, when peeling off the adhesive tape stuck to the workpiece from the workpiece, the peeling member having the flat surface and the first folded portion is used. That is, the peeling member is placed on the surface of the adhesive tape so that the flat surface is in contact with or close to the surface of the adhesive tape, and the adhesive tape is turned back at an acute angle using the first folding corner portion to peel off the workpiece. That is, since the angle of return when peeling off the adhesive tape is prevented from becoming too large, it is possible to avoid a situation where the base material or adhesive material of the adhesive tape is broken and fragments of the adhesive material or the like contaminate the workpiece. In addition, by setting the angle of return when peeling off the adhesive tape to be smaller, the peeling force acting on the workpiece when peeling off the adhesive tape from the workpiece can be reduced. This can avoid deformation or cracking of the workpiece caused by excessive peeling force. [Effects of the invention]

According to the adhesive tape peeling method and the adhesive tape peeling device of the present invention, when peeling the adhesive tape adhered to the workpiece from the workpiece, a peeling member having a flat surface and a first folded portion is used. That is, the peeling member is placed on the surface of the adhesive tape, the flat surface is brought into contact or close to the surface of the adhesive tape, and the adhesive tape is folded back at an acute angle at the first folding corner to peel off the workpiece. That is, since the angle of return when peeling off the adhesive tape is prevented from becoming too large, it is possible to avoid a situation where the base material or adhesive material of the adhesive tape is broken and fragments of the adhesive material or the like contaminate the workpiece. In addition, by setting the angle of return when peeling off the adhesive tape to be smaller, the peeling force acting on the workpiece when peeling off the adhesive tape from the workpiece can be reduced. This prevents deformation or cracking of the workpiece and allows the adhesive tape attached to the workpiece to be peeled off with high precision.

[Form used to implement the invention] [Example 1]

Hereinafter, Embodiment 1 of the present invention will be described with reference to the drawings. In the adhesive tape peeling device 1 of Example 1, the protective tape PT adhered to the surface of the semiconductor wafer W (hereinafter referred to as "wafer W") is peeled off from the wafer W. In Example 1, the entire back surface of the wafer W is in a flat state and is uniformly polished. The protective tape PT is an adhesive tape for circuit protection and corresponds to the adhesive tape of this embodiment. Wafer W corresponds to the workpiece of this embodiment.

As shown in FIG. 4 , the protective tape PT used in this embodiment has a strip-shaped structure in which a non-adhesive base material Ta and an adhesive adhesive material Tb are laminated.

Examples of the material constituting the base material Ta include polyolefin, polyethylene, ethylene-vinyl acetate copolymer, polyester, polyimide, polyurethane, vinyl chloride, and polyethylene terephthalate. ester, polybutylene terephthalate, polyethylene naphthalate, polyvinylidene chloride, polyethylene methacrylate copolymer, polypropylene, terephthalate methacrylate, polyamide imide , polyurethane elastomer, etc. Furthermore, a material obtained by combining a plurality of the above-mentioned materials may be used as the base material Ta. In addition, the base material Ta may be a single layer or may have a structure in which a plurality of layers are laminated.

The adhesive material Tb is made of a material that ensures the function of maintaining the state in which the protective tape PT is adhered to the wafer W. An example of the material constituting the adhesive material Tb includes an acrylate copolymer. The adhesive material Tb may be a single layer or may be composed of multiple layers.

＜Explanation of overall composition＞ Here, the overall structure of the adhesive tape peeling device 1 of Example 1 is demonstrated. FIG. 1 is a front view showing the basic structure of the adhesive tape peeling device 1 according to the first embodiment. In addition, in the following description, as shown in FIG. 1 and FIG. 2 etc., the longitudinal direction of the adhesive tape peeling device 1 is called the left-right direction (x direction), and the horizontal direction (y direction) orthogonal thereto is called Fore and aft direction. In addition, let the up and down direction be the z direction.

As shown in FIGS. 1 and 2 , the adhesive tape peeling device 1 has a holding base 3 , a tape supply part 5 , a peeling mechanism 7 , and a tape recovery part 9 .

The holding table 3 places and holds the wafer W. As an example, it is a metal flat suction cup type table having the same shape as the wafer W and a size or larger. A preferred structure of the holding table 39 is such that the entire back surface of the wafer W is sucked and held by suction holes provided on the surface and a suction device provided inside.

As shown in FIG. 1 , the holding base 3 is supported on a movable base 11 , and the movable base 11 is supported so as to be slidable in the x direction along a pair of left and right rails 10 arranged horizontally in the x direction. The movable table 11 is configured to be screw-feed driven by a screw shaft 13 driven forward and backward by a pulse motor 12 . That is, the holding base 3 is configured to reciprocate along the rail 10 in the x direction.

The tape supply unit 5 guides the peeling tape Ts fed from the original roller toward the peeling mechanism 7 . As shown in FIG. 9 and others, the width of the peeling tape Ts is configured to be smaller than the length R2 of the wafer W in the y direction.

The peeling mechanism 7 has a lifting unit 23 , an attachment roller 25 , and a peeling unit 27 . The lifting unit 23 moves the peeling unit 27 up and down. The sticking roller 25 is configured to be raised and lowered by a raising and lowering member (not shown). The adhesion roller 25 is configured to roll on the surface of the protective tape PT and adhere the peeling tape Ts fed from the tape supply unit 5 to the surface of the protective tape PT. The peeling unit 27 pulls the peeling tape Ts adhered to the protective tape PT, thereby integrally peeling the protective tape PT and the peeling tape Ts from the wafer W.

As shown in FIGS. 1 and 2 , the lifting unit 23 includes a vertical frame 28 and a support frame 29 . The vertical frame 28 is a pair of front and rear frames erected on the base of the adhesive tape peeling device 1 . The support frame 29 is a frame extending in the y direction, and is spanned and fixed to a pair of vertical frames 28 at the front and rear. An example of the structure of the support frame 29 is an aluminum drawn material.

A box-shaped base 30 is connected to the front and rear center portions of the support frame 29 . A pair of front and rear longitudinal rails 31 are arranged on the base 30 . In addition, the elevating platform 32 is supported on the base 30 via the vertical rail 31 so as to be capable of elevating and sliding. The lifting platform 32 is lifted and lowered by a ball shaft driven by a motor 33 . The peeling unit 27 is installed on the lifting platform 32 and moves up and down by the movement of the lifting platform 32 .

The lifting platform 32 is configured in a hollow frame shape that penetrates up and down. The peeling unit 27 is connected to the inner lower portion of the side plates 34 provided at the front and rear of the lifting platform 32 . A support frame 35 extending in the y direction is fixed across each of the pair of front and rear side plates 34 . A peeling member 37 is attached to the center of the support frame 35 . The structure of the peeling member 37 will be described later.

A guide roller 39 is rotatably supported on the side plate 34 of the peeling unit 27 . The guide roller 39 is a roller extending in the y direction, and is configured such that the length of the guide roller 39 in the y direction is larger than the width of the peeling tape Ts and shorter than the length R2 of the wafer W in the y direction. The guide roller 39 guides the peeling tape Ts sent out from the tape supply part 5 toward the peeling member 37 .

A guide roller 40 , a nip roller 41 and a tension roller 42 are arranged above the peeling unit 27 . The guide roller 40 is rotatably supported by a shaft. The guide roller 40 winds the peeling tape Ts wound through the peeling member 37 and guides it toward the bag collecting part 9 . The tension roller 42 is rotatably provided on the support arm 43 and is swingably disposed across the support arm 43 . The tension roller 42 applies appropriate tension to the wound and guided release tape Ts.

The tape recovery unit 9 winds and recovers the peeling tape Ts sent out from the peeling mechanism 7 .

The adhesive tape peeling device 1 includes a control unit 51 . As an example, the control unit 51 includes a central processing unit (CPU) and performs overall control of each part of the adhesive tape peeling device 1 . The control unit 51 adjusts the positions of the peeling member 37 and the holding table 3 by coordinating the rotations of the pulse motor 12 and the motor 33 , and controls the movement of a lifting member (not shown) to adjust the position of the attachment roller 25 .

＜Structure of peeling member＞ Here, the structure of the peeling member 37 is demonstrated. FIG. 3( a ) is a longitudinal sectional view of the peeling member 37 , and FIG. 3( b ) is a perspective view of the peeling member 37 .

The peeling member 37 is a columnar member extending entirely in the y direction, and has a flat surface 45 , a first folded corner 47 , a first guide surface 48 , a second folded corner 49 and a second guide surface 50 .

The flat surface 45 is provided on the lower surface of the peeling member 37 and extends along the xy plane. That is, the peeling member 37 is lowered relative to the wafer W placed on the holding table 3 so that the flat surface 45 comes into contact with the surface of the protective tape PT adhered to the wafer W.

Referring to FIGS. 2 and 3( b ), the flat surface 45 is configured such that the length D1 in the x direction is 1/10 or more of the length R1 of the wafer W in the x direction. In addition, the flat surface 45 is configured such that the length D2 in the y direction is longer than the length R2 of the wafer W in the y direction. By adjusting the length D1 and the length D2 according to these conditions to expand the area of the flat surface 45, the wafer W can be stably held when the protective tape PT is peeled off.

The first folded corner portion 47 is provided on the front end side of the flat surface 45 and on one end side of the first guide surface 48 . By pulling the protective tape PT upward with the flat surface 45 in contact with the protective tape PT, the protective tape PT is folded back at the first folding corner 47 and peeled off from the wafer W.

The first folded corner portion 47 is configured such that the peeling angle L1 of the protective tape PT becomes an acute angle. As will be described later, the peeling angle L1 is between the direction P1 in which the protective tape PT that is attached to the wafer W extends, and the direction P2 in which the protective tape PT peeled off from the wafer W is guided by the first guide surface 48 . Angle correspondence. A specific example of setting the peeling angle L1 to an acute angle is the angle A1 of the first folded corner 47 when viewed from the front in Embodiment 1, that is, the angle between the flat surface 45 and the first guide surface 48 It is formed in such a way that it becomes an obtuse angle.

In addition, the front end side of the peeling member 37 corresponds to the right side in FIG. 1, FIG. 3(a), etc. In other words, the front end side of the peeling member 37 refers to the side from the peeling end position Ce of the protective tape PT shown in FIG. 2 to the peeling start position Cs of the protective tape PT.

In this embodiment, the first guide surface 48 is provided below the front end side of the peeling member 37 . The first guide surface 48 guides the protective tape PT peeled off from the wafer W after being folded back by the first folded corner portion 47 toward the direction P2.

In this embodiment, the second folded corner portion 49 is provided on the front end side of the peeling member 37 . The second folded corner portion 49 folds back the protective tape PT guided by the first guide surface 48 and guides it toward the base end side of the peeling member 37 . That is, the second folded corner portion 49 is configured such that the protective tape PT is turned back and the protective tape PT is reversed. By inverting the protective tape PT, the protective tape PT changes from the state where the adhesive material Tb is located on the lower side of the base material Ta to the state where the adhesive material Tb is located on the upper side of the base material Ta.

In this embodiment, the second guide surface 50 is provided on the upper surface of the peeling member 37 . The second guide surface 50 guides the protective tape PT that is folded back again by the second folded corner portion 49 toward the direction P3. The angles of the first folded corner portion 47 and the second folded corner portion 49 are adjusted so that the angle L2 between the direction P3 and the direction P1 becomes an obtuse angle. That is, as shown in FIG. 3( b ) and the like, the direction P3 is a direction toward the left in the x direction and is opposite to the direction P1 , which is a direction toward the right in the x direction. In Embodiment 1, when the sum of the angle A1 of the first folded corner portion 47 and the angle A2 of the second folded corner portion 49 in front view is less than 270°, the angle L2 between the direction P1 and the direction P3 is Obtuse angle.

＜Outline of action＞ Here, the basic operation of the adhesive tape peeling device 1 of Example 1 will be described. 5(a) is a flow chart illustrating a series of processes for peeling off the protective tape PT from the wafer W using the adhesive tape peeling device 1 of Embodiment 1.

Step S1 (holding of workpiece) When a command is issued to peel off the protective tape PT from the wafer W, the wafer W with the protective tape PT adhered to its surface is transported above the holding table 3 by a transfer robot (not shown). As an example, the transfer robot transfers the wafer W by adsorbing the surface side of the wafer W. The transfer robot then descends to place the wafer W on the holding table 3 . When the wafer W is placed on the holding table 3, the suction device is activated, and as shown in FIG. 6, the holding table 3 suction-holds the entire back surface of the wafer W.

Step S2 (Attaching the peel-off tape) After the wafer W is held on the holding table 3 , the operation of affixing the peeling tape Ts to the protective tape PT on the wafer W is started. That is, as shown in FIG. 7 , the adhesion roller 25 is lowered to a predetermined adhesion height. Then, as the holding base 3 moves in the x direction, the holding base 3 and the attachment roller 25 relatively move in the x direction. As a result, as shown in FIG. 8 , the attaching roller 25 rolls along the upper surface of the wafer W and attaches the release tape Ts to the surface of the protective tape PT from one end side to the other end side of the protective tape PT. The top view of the state where the release tape Ts is adhered to the surface of the protective tape PT is shown in Figure 9.

Step S3 (Removal of protective tape) After the release tape Ts is adhered to the surface of the protective tape PT, the action of peeling off the protective tape PT is started. First, the attachment roller 25 rises and returns to the initial position shown in FIG. 1 , and the holding table 3 is moved in the x direction to adjust the position of the peeling unit 27 to above the peeling start position Cs of the protective tape PT. Then, as shown in FIG. 10 , the peeling unit 27 is lowered, and the peeling member 37 is placed on the protective tape PT on the wafer W. At this time, the flat surface 45 of the peeling member 37 is in contact with the protective tape PT.

After the flat surface 45 is brought into contact with the surface of the protective tape PT, the holding base 3 is moved to the right in the x direction. By the movement of the holding base 3, as shown in FIG. 11, the peeling member 37 moves relatively to the peeling direction Vp with respect to the holding base 3 while maintaining the height. The peeling direction Vp is the direction in which the protective tape PT is peeled off, and is the direction from the peeling start position Cs toward the peeling end position Ce. In Example 1, as shown in FIG. 11 and others, the peeling direction Vp corresponds to the left direction of the x direction.

The relative position of the peeling member 37 with respect to the holding base 3 moves in the peeling direction Vp, and the tape recovery part 9 is operated to wind the peeling tape Ts. By winding the peeling tape Ts, the peeling tape Ts wound around the peeling member 37 is pulled in the direction indicated by the symbol Q, as shown in FIG. 13 and others. By pulling the peeling tape Ts, the protective tape PT and the peeling tape Ts are integrally peeled off from the surface of the wafer W while folding the peeling tape Ts by the peeling member 37 .

In Example 1, the protective tape PT is peeled off from the surface of the wafer W while being folded back twice using the first folding corner portion 47 and the second folding corner portion 49 provided in the peeling member 37 . That is, first, as shown in FIG. 11 , with the flat surface 45 in contact with the surface of the protective tape PT, the peeling tape Ts is pulled in the direction indicated by the symbol Q, thereby sticking it to the peeling start position of the wafer W. The protective tape PT (protective tape PTa) of the Cs portion is pulled upward with the first folded corner portion 47 as a fulcrum. As a result, the protective tape PTa is peeled off from the surface of the wafer W.

When the protective tape PT is peeled off from the wafer W in step S3, the peeling member 37 maintains the height of the peeling member 37 by slightly pressing the wafer W through the operation of the lifting unit 23. Therefore, the displacement of the wafer W caused by the peeling force for peeling off the protective tape PT is quickly suppressed by the flat surface 45 of the peeling member 37 . Therefore, it is possible to reliably prevent the peeling accuracy of the protective tape PT from being reduced due to the displacement of the wafer W.

The protective tape PTa peeled off from the wafer W is guided toward the direction P2 by the first guide surface 48 of the peeling member 37 . That is, by performing the first folding process through the first folding corner 47 , the extending direction of the protective tape PTa is changed from the horizontal right direction indicated by the symbol P1 to the oblique upper right direction indicated by the symbol P2 .

In Embodiment 1, the angle at which the protective tape PT is folded back by the first folding corner 47 means that the peeling angle L1 of the protective tape PT is an acute angle. That is, by reducing the peeling angle L1, the peeling force acting on the protective tape PT when peeling the protective tape PT from the wafer W can be reduced. Thereby, when the protective tape PT is peeled off from the wafer W, it is possible to avoid excessive peeling force acting on the protective tape PT, causing the base material Ta or the adhesive material Tb to break, and to prevent the scattered fragments of the adhesive material Tb from contaminating the wafer. W surface. In addition, since the peeling angle is reduced to reduce the peeling force, it is possible to avoid deformation or cracking of the wafer W caused by excessive peeling force acting on the wafer W through the protective tape PT.

The protective tape PTa peeled off from the wafer W is guided from the first folded corner portion 47 toward the second folded corner portion 49 by the first guide surface 48 . Then, as shown in FIG. 12 , the protective tape PTa is further folded by the second folded corner portion 49 . The protective tape PTa that has been folded back again is guided toward the direction P3 by the second guide surface 50 .

In this way, by performing the second folding process through the second folding corner portion 49 , the extending direction of the protective tape PTa is changed from the oblique upper right direction indicated by symbol P2 to the oblique upper left direction indicated by symbol P3 . That is, by performing the folding process twice, the direction in which the protective tape PT extends is quickly reversed from the right direction in plan view, that is, the P1 direction, to the left direction in the plan view, that is, the P3 direction. The angle at which the protective tape PT is folded back by the second folding corner 49 is indicated by symbol L3.

When the protective tape PT is reversed, the layer of the adhesive material Tb faces upward, and the protective tape PT is also conveyed in the direction of being quickly separated from the wafer W in the x direction. Therefore, dust and the like can be more reliably prevented from falling from the layer of the adhesive material Tb of the protective tape PT and contaminating the surface of the wafer W.

The protective tape PTa guided in the direction P3 by the second guide surface 50 is guided downstream by the peeling tape Ts via the guide roller 40 . Then, while continuing the movement of the holding table 3 and the winding operation of the peeling tape Ts, the peeling member 37 is moved in the peeling direction Vp relative to the wafer W, and the peeling tape Ts is pulled in the direction Q, whereby the peeling member 37 is adhered to the peeling tape Ts. The protective tape PT of the portion of the wafer W other than the start position Cs is also peeled off from the wafer W.

That is, the protective tape PT is peeled off from the wafer W after being folded back by the first folded corner portion 47 of the peeling member 37 . Then, the protective tape PT peeled off from the wafer W is folded back again via the first guide surface 48 and the second folding corner 49 , and is transported in the reversal direction P3 along the second guide surface 50 . Therefore, as shown in FIG. 13 , the protective tape PT is gradually peeled off from the wafer W in the peeling direction Vp starting from the peeling start position Cs. Then, the protective tape PT is peeled off from the entire surface of the wafer W by moving the peeling member 37 to the peeling end position Ce.

Step S4 (recovery of protective tape) When the protective tape PT is completely peeled off from the surface of the wafer W, the peeling tape Ts is further wound to recover the protective tape PT. That is, as shown in FIG. 14 , the protective tape PT peeled off from the wafer W is wound in the direction indicated by the symbol Q and transported downstream of the peeling member 37 together with the peeling tape Ts. Then, the protective tape PT is conveyed to the tape recovery part 9 via the guide roller 40 , the nip roller 41 , and the tension roller 42 . The tape recovery part 9 recovers the protective tape PT by winding the peeling tape Ts and the protective tape PT around the recovery shaft cylinder.

Step S5 (recovery of workpieces) Synchronized with the action of recovering the protective tape PT, the action of recovering the workpiece starts. That is, the holding table 3 stops the operation of the suction device to release the suction of the wafer W. Then, the transfer robot suction-holds the surface of the wafer W and detaches it from the holding table 3 , and stores the wafer W in a wafer collection cassette (not shown).

In the above, after one round of operation of the adhesive tape peeling device 1 of Embodiment 1 is completed, the same operation is repeated until the predetermined number of pieces is reached.

<Effects of the structure of Embodiment 1> According to the adhesive tape peeling device 1 of the first embodiment, the protective tape PT is peeled off using the peeling member 37 provided with the first folded corner portion 47 . That is, after the wafer W is held by the holding table 3 , the peeling member 37 is brought into contact with the surface of the protective tape PT. Then, the protective tape PT is pulled and peeled off from the wafer W while folding back the protective tape PT at the first folded corner portion 47 of the peeling member 37 . At this time, the angle of the first folded corner portion 47 is adjusted so that the angle at which the protective tape PT is folded back by the first folded corner portion 47 , that is, the peeling angle L1 becomes an acute angle.

In a conventional adhesive tape peeling device, as shown in FIG. 15 , a blade-shaped member Ed having a sharp blade-shaped portion Sh at the front end is used to peel the protective tape PT from the wafer W. That is, after holding the wafer W on the holding table TL, the release tape Ts is adhered to the protective tape PT. Then, the blade-shaped portion of the blade-shaped member Ed is brought into contact with the protective tape PT, and the protective tape PT is folded back at the blade-shaped portion to be peeled off from the wafer W. In such a conventional device, as shown in FIG. 15 , there may be the following problem: impurities FL remain on the surface of the wafer W after the protective tape PT is peeled off, which may adversely affect the performance of the wafer.

As a result of repeated studies on the problems of such conventional adhesive tape peeling devices, the following conclusions have been obtained. That is, the impurity FL contains a large amount of material of the adhesive material Tb contained in the protective tape. That is, when the protective tape PT is peeled off from the wafer W in the conventional apparatus, fragments of the adhesive material Tb may be scattered and remain on the surface of the wafer W.

In addition, when the protective tape PT is peeled off using the blade-shaped member Ed, the protective tape PT is largely folded back once at the blade-shaped portion to invert the protective tape PT from the direction P1 to the direction P4, and the protective tape PT is removed from the wafer W. Strip. That is, when the protective tape PT is peeled off using the blade-shaped member Ed, the peeling angle L4 of the protective tape PT becomes an obtuse angle. That is, the peeling angle L4, which is the angle at which the protective tape PT is folded back from the direction P1 toward the direction P4, becomes an angle exceeding 90°.

According to this situation, as shown in FIG. 16 , since the peeling angle L4 is large, the stress acting on the protective tape PT increases accordingly. Therefore, when the protective tape PT is peeled off from the wafer W, a part of the protective tape PT is broken (see reference numeral). Br). It is considered that a part of the adhesive tape Tb is scattered and adheres to the surface of the wafer W as an impurity FL, which is caused by the breakage Br of the protective tape PT. In addition, because a part of the protective tape PT is broken, a part of the adhesive material Tb or the base material Ta is not peeled off from the wafer W and remains, and this residue may also cause the impurity FL.

And when using the blade-shaped member Ed, the sharp blade-shaped part Sh is made to contact the protective tape PT, and the protective tape PT is pulled upward together with the peeling tape Ts, and the protective tape PT is peeled off. Therefore, when the protective tape PT is peeled off from the wafer W, in order to suppress the peeling force acting upward, the blade-shaped member Ed acts downward on the wafer in a very narrow area where the blade-shaped portion Sh is in contact. Force Pm. That is, in the conventional structure using the blade-shaped member Ed, since the magnitude of the force Pm acting per unit area is large, there may be a problem that defects such as cracks or strains may easily occur in the wafer W due to the force Pm. In addition, if the peeling angle L4 becomes larger, the stress per unit area acting on the wafer W when the protective tape PT is peeled off increases, so that defects in the wafer W are more likely to occur.

Therefore, in the adhesive tape peeling device 1 of Embodiment 1, the protective tape PT is peeled from the wafer W using the peeling member 37 having the flat surface 45 and the first folded corner portion 47 . That is, in a state where the flat surface 45 provided on the peeling member 37 is in contact with the protective tape PT, the protective tape PT is folded back at an acute angle at the first folded corner portion 47 to be peeled off from the wafer W. In the structure of Example 1, since the peeling angle L1 of the protective tape PT is an acute angle and is a small angle, the stress acting on the protective tape PT when peeling the protective tape PT from the wafer W can be reduced. This prevents the protective tape PT from being cracked, thereby preventing the surface of the wafer W from being contaminated by the scattering of the adhesive material Tb and the remaining part of the protective tape PT. Thereby, it can be avoided that impurities FL are generated on the surface of the wafer W after the protective tape PT is peeled off, thereby affecting the performance of the wafer W.

In addition, by reducing the peeling angle L1 to less than 90°, the magnitude of the stress acting on the unit area of the wafer W when peeling off the protective tape PT is also reduced. Therefore, it is possible to avoid deformation or cracking of the wafer W due to excessive peeling force. Furthermore, since the peeling member 37 peels off the protective tape PT with the flat surface 45 in contact with the protective tape PT, the downward force Pm that suppresses the peeling force is dispersed by the flat surface 45 in a relatively wide range. That is, since the magnitude of the stress acting on the wafer W per unit area can be reduced, defects such as deformation or cracking of the wafer W can be avoided.

When the peeling member 37 of Example 1 is used, when the protective tape PT is pulled together with the peeling tape Ts, the flat surface 45 comes into contact with the protective tape PT. Therefore, the force Pm acting downward from the peeling member 37 on the wafer W is dispersed in a relatively wide range in contact with the flat surface 45 . Thereby, as shown in FIG. 17 , since the magnitude of the force Pm acting per unit area can be reduced, strain or cracking of the wafer W can be more reliably avoided.

In addition, the peeling member 37 of Example 1 uses the first folding corner 47 and the second folding corner 49 to fold the protective tape PT a plurality of times to peel the protective tape PT from the wafer W. In this case, when peeling the protective tape PT from the wafer W, the angle of the folded protective tape PT can be suppressed to be small, that is, the peeling angle L1 of the protective tape PT formed by the first folded corner portion 47, while further The protective tape PT is reversed by the peeling member 37 by folding it back at the second folding corner portion 49 .

By reducing the peeling angle L1, even when the rigidity of the protective tape PT is high, damage to the protective tape PT can be prevented, and the protective tape PT can be folded back along the surface of the peeling member 37 with higher accuracy. Furthermore, by folding back the protective tape PT a plurality of times, the protective tape PT can be reversed and transported toward the tape recovery unit 9 while keeping each folding angle small. That is, the stress acting on the protective tape PT in each folding process can be suppressed, and the protective tape PT can be reversed reliably and quickly.

When the protective tape PT is folded back using only the first folding corner 47, as shown in FIG. 18, after the protective tape PT is peeled off from the wafer W with the peeling angle L1 being an acute angle, the protective tape PT does not reverse. After being transported in the direction P2, it is guided toward the tape recovery unit 9 . That is, the protective tape PT is conveyed above the wafer W with the adhesive material Tb facing downward. In this case, dust Mp and the like may fall from the layer of the adhesive material Tb to the surface of the wafer W, causing the fallen matter to contaminate the wafer W.

To solve this problem, in the structure of Embodiment 1, after the protective tape PT is folded back at an acute angle by the first folding corner 47, the protective tape PT is folded back in the reverse direction using the second folding corner 49. By inverting the protective tape PT, the adhesive material Tb of the protective tape PT quickly becomes upward. In addition, the protective tape PT peeled off from the wafer W is quickly transported away from the wafer W. This can prevent the surface of the wafer W from being contaminated by fragments of the adhesive material Tb of the protective tape PT. [Example 2]

Next, Example 2 of the present invention will be described. In addition, the common components in Embodiment 1 and 2 are given the same reference numerals, and detailed descriptions are omitted. The adhesive tape peeling device 1 of Example 1 is configured to peel the protective tape PT from the wafer W using the peeling tape Ts. On the other hand, the adhesive tape peeling device 1A of Example 2 peels the protective tape PT from the surface of the wafer W without using the peeling tape Ts. That is, in the second embodiment, the tape supply unit 5 , the tape recovery unit 9 , the attachment roller 25 , the guide roller 39 , the guide roller 40 , etc. included in the structure of the adhesive tape peeling device 1 of the first embodiment may be omitted for peeling. The composition of operations with Ts.

As shown in FIG. 19 , the adhesive tape peeling device 1A of Example 2 omits the tape supply part 5 and the tape recovery part 9 , and adds a second peeling unit 53 to the peeling mechanism 7 .

The second peeling unit 53 peels off the portion of the protective tape PT that is adhered to the peeling start position Cs of the wafer W. In other words, the second peeling unit 53 is used to peel the end of the protective tape PT on the side of the peeling start position Cs.

FIG. 20( a ) is a front view of the second peeling unit 53 , and FIG. 20( b ) is a perspective view of the second peeling unit 53 . The second peeling unit 53 includes a first lifting shaft 55, a motor 56, a vertical wall 57, a first holding member 58, a second holding member 59, a second lifting shaft 60, a motor 61, and the like.

The first lifting shaft 55 extends downward from a left and right movable table (not shown), and is configured to move the entire second peeling unit 53 upward and downward by forward and reverse rotational driving of the motor 56 . The left and right movable table system is configured to reciprocate in the x direction along a rail or the like. That is, by horizontal movement of the left and right movable table, the second peeling unit 53 can reciprocate in the x direction.

The vertical wall 57 is connected to the lower end of the first lifting shaft 55 and has a longitudinally arranged track 63 . The first holding member 58 is connected to the lower end of the vertical wall 57 and is a blade-shaped member with a tapered front end extending horizontally in the peeling direction Vp. That is, the first holding member 58 has a sharp blade-shaped front end portion 65 . The first holding member 58 is used to perform non-adhesive processing such as fluorine processing.

The second holding member 59 is connected to the vertical wall 57 via the rail 63 and is configured to move up and down along the rail 63 . The second holding member 59 is a plate-shaped member extending in the peeling direction Vp like the first holding member 58 . The first holding member 58 and the second holding member 59 respectively extend to substantially the same position in the x direction. The second holding member 59 is supported by the second lifting shaft 60 . The second lifting shaft 60 is configured to move the second holding member 59 up and down by forward and reverse rotational driving of the motor 61 .

The second holding member 59 can cooperate with the first holding member 58 to hold the protrusion PS by moving up and down along the rail 63 . The first holding member 58 and the second holding member 59 are each made of a hard material such as metal or resin.

As will be described later, the front end portion 65 of the first holding member 58 is punctured into the adhesive interface K between the wafer W and the protective tape PT, so that a part of the peripheral portion of the protective tape PT is peeled off from the wafer W, forming a shape formed by the third The peeling part Pa of the part held by the two peeling units 53. Then, the second holding member 59 moves up and down along the rail 63 and cooperates with the first holding member 58 to hold the peeling part Pa. That is, the first holding member 58 and the second holding member 59 function as a pair of holding members that hold the peeling part Pa. Furthermore, the front end portion 65 has a wide plate shape extending in the y direction, but may also have a needle shape in which the front end becomes sharper toward the peeling direction Vp.

As shown in FIG. 20(a) , in the second peeling unit 53, it is preferable that the shape of the lower surface 59A of the second holding member 59 is embedded in the shape of the upper surface 58A of the first holding member 58 including the front end portion 65. composed in a combined manner. By setting the shape in which the upper surface 58A of the first holding member 58 and the lower surface 59A of the second holding member 59 are fitted, the protective tape PT can be held in a more stable state by the first holding member 58 and the second holding member 59 .

Next, a series of operations for peeling off the protective tape PT from the wafer W using the adhesive tape peeling device 1A of Example 2 will be described. 5( b ) is a flow chart illustrating a series of processes for peeling off the protective tape PT from the wafer W using the adhesive tape peeling device 1A of Embodiment 2.

Step S1 (holding of workpiece) The process of step S1 in Embodiment 2 is the same as that in Embodiment 1. That is, the wafer W is placed on the holding table 3 by a transfer robot (not shown). After the wafer W is placed on the holding table 3, the suction device is actuated, and the holding table 3 suction-holds the entire back surface of the wafer W.

Step S2 (peeling off the end of the protective tape) In Embodiment 2, if the holding table 3 holds the entire back surface of the wafer W, the process of using the second peeling unit 53 to peel the end of the protective tape PT from the wafer W starts. That is, the control unit 51 controls the left and right movable stages and the motor 56 to appropriately move the second peeling unit 53 in the horizontal direction and the up-down direction.

As a result of the control by the control unit 51, as shown in FIG. 21, the second peeling unit 53 moves from the standby position shown by the dotted line to the operating position shown by the solid line. The operating position of the second peeling unit 53 is defined as follows: the height of the front end 65 of the first holding member 58 is the same as the adhesive interface K between the wafer W and the protective tape PT, and the front end 65 is located at the peeling start position Cs Near the outside of the annular convex portion Ka. Furthermore, information on the height of the holding surface of the holding table 3 and the thickness of the wafer W and the protective tape PT is input to the control unit 51 . Therefore, the control unit 51 can calculate the correct height of the adhesive interface K in advance.

After the second peeling unit 53 moves to the operating position, as shown in FIG. 22 , the control unit 51 controls the left and right movable stages to move the second peeling unit 53 horizontally in the peeling direction Vp. By this control, the sharp blade-shaped tip portion 65 penetrates into the adhesive interface K between the wafer W and the protective tape PT.

After the front end portion 65 penetrates the adhesive interface K, the control portion 51 further moves the second peeling unit 53 horizontally in the peeling direction Vp. Along with this horizontal movement, the sharp front end portion 65 continues to enter the peeling direction Vp along the adhesion interface K, and a part of the peripheral portion of the protective tape PT is gradually peeled off from the wafer W by the front end portion 65 . As a result, the peeling portion Pa is formed at the peripheral edge portion of the protective tape PT peeled off from the wafer W. At this time, the lower surface (adhesion surface) of the peeling portion Pa peeled from the wafer W is supported by the upper surface 58A of the first holding member 58 .

When the peeling part Pa is formed, the peeling part Pa is held while the first holding member 58 supports the lower surface of the peeling part Pa. That is, as shown in FIG. 23 , the control unit 51 controls the motor 61 to lower the second holding member 59 while maintaining the state in which the first holding member 58 enters the adhesive interface K. By this control, the second holding member 59 is lowered from the initial position shown in FIG. 22 and the like toward the holding position shown in FIG. 23 .

By descending toward the holding position, the second holding member 59 comes into contact with the surface (non-adhesive surface) of the peeling part Pa and presses the peeling part Pa downward. Along with this pressing, the peeling part Pa is stably held by the first holding member 58 and the second holding member 59 . In this way, the end of the protective tape PT on the side of the peeling start position Cs is peeled off from the wafer W by the second peeling unit 53, forming the peeling portion Pa.

Step S3 (peeling off the entire protective tape) After the peeling part Pa is formed, a process of peeling off the entire protective tape PT from the wafer W using the peeling unit 27 and the second peeling unit 53 is started. First, the holding table 3 is moved in the x direction, and the position of the peeling unit 27 is adjusted so that the peeling member 37 and the second peeling unit 53 come closer to each other in plan view. Then, as shown in FIG. 24 , the peeling unit 27 is lowered and the flat surface 45 of the peeling member 37 is brought into contact with the protective tape PT. At this time, the peeling member 37 is opposed to the first holding member 58 and the second holding member 59 that hold the peeling part Pa.

After the flat surface 45 is brought into contact with the surface of the protective tape PT, as shown in FIG. 25 , the second peeling unit 53 is raised while holding the protective tape PT at the peeling part Pa. By raising the second peeling unit 53 while holding the protective tape PT, the protective tape PT is pulled in the direction S away from the wafer W.

At this time, the flat surface 45 of the peeling member 37 is in contact with the protective tape PT. Therefore, with the first folded corner portion 47 disposed on the front end side of the flat surface 45 as a fulcrum, the protective tape PT inside the peeling portion Pa is pulled in the direction S away from the wafer W and peeled off from the surface of the wafer W. The protective tape PT peeled off from the wafer W comes into contact with the first guide surface 48 of the peeling member 37 and is guided in the direction P2 by the first guide surface 48 . That is, by performing the first folding process through the first folding corner 47 , the extending direction of the protective tape PT is changed from the horizontal right direction indicated by the symbol P1 to the oblique upper right direction indicated by the symbol P2 .

When the protective tape PT is peeled off from the wafer W, the peeling member 37 slightly presses the wafer W due to the operation of the lifting unit 23 . Therefore, the displacement of the wafer W caused by the peeling force for peeling off the protective tape PT is quickly suppressed by the flat surface 45 of the peeling member 37 . This can reliably prevent the peeling accuracy of the protective tape PT from being reduced due to the displacement of the wafer W.

In Embodiment 2, as in Embodiment 1, the angle at which the protective tape PT is folded back by the first folding corner 47 , that is, the peeling angle L1 of the protective tape PT is an acute angle. That is, by reducing the peeling angle L1, the peeling force acting on the protective tape PT when peeling the protective tape PT from the wafer W can be reduced. Thereby, when the protective tape PT is peeled off from the wafer W, it is possible to avoid excessive peeling force acting on the protective tape PT and causing the base material Ta or the adhesive material Tb to break.

After the second peeling unit 53 is raised to bring the protective tape PT into contact with the first guide surface 48 , as shown in FIG. 26 , the second peeling unit 53 is moved in the upper left direction and wound around above the peeling member 37 . By moving the second peeling unit 53 upwards of the peeling member 37 , the protective tape PT guided in the direction P2 by the first guide surface 48 is folded back again at the second folding corner 49 and connected with the second guide surface 49 . The leading surface 50 is brought into contact and guided toward the direction P3. By performing the folding process twice, the extending direction of the protective tape PT is reversed from the P1 direction, which is the right direction in the plan view, to the P3 direction, which is the left direction in the plan view.

After the protective tape PT is brought into contact with the second guide surface 50 , as indicated by symbol Vs in FIG. 27 , the holding base 3 is moved to the right while the second peeling unit 53 is further moved in the upper left direction. That is, the relative position of the peeling unit 27 with respect to the wafer W is displaced in the peeling direction Vp. At this time, the speed at which the peeling unit 27 is displaced in the peeling direction Vp and the speed at which the second peeling unit 53 is moved are adjusted so that the protective tape PT held by the second peeling unit 53 does not loosen. Through the displacement of the peeling unit 27 and the movement of the second peeling unit 53, the protective tape PT is gradually peeled off from the wafer W, as shown in FIG. 28, and then the entire protective tape PT is peeled off from the wafer W.

Step S4 (recovery of protective tape) After the protective tape PT is completely peeled off from the surface of the wafer W, the protective tape PT is recovered. As an example, after the second peeling unit 53 is moved above the tape collection box (not shown), the second holding member 59 is raised from the holding position toward the initial position. As the second holding member 59 rises, the holding of the protective tape PT by the first holding member 58 and the second holding member 59 is released. As a result, the protective tape PT is separated from the second peeling unit 53 and falls to the tape recovery box to be recovered.

Step S5 (recovery of workpieces) Synchronized with the action of recovering the protective tape PT, the action of recovering the workpiece starts. That is, the holding table 3 stops the suction device to release the suction of the wafer W. Then, the transfer robot suction-holds the surface of the wafer W to separate it from the holding table 3, and stores the wafer W in a wafer collection cassette (not shown).

In Embodiment 2, by providing the second peeling unit 53, the protective tape PT can be peeled off from the wafer W without using the peeling tape Ts. That is, with the flat surface 45 of the peeling member 37 in contact with the protective tape PT, the protective tape PT is held and pulled by the second peeling unit 53 to peel the protective tape PT from the wafer W. In this Embodiment 2, since it is not necessary to peel off the tape Ts, mechanisms such as the tape supply part 5 and the tape recovery part 9 can be omitted. Therefore, the adhesive tape peeling device 1A can be further simplified.

In addition, in Example 2, like Example 1, since the protective tape PT is peeled off using the peeling member 37 having the first folded corner portion 47, the same effect as in Example 1 can be achieved without using the peeling tape Ts. That is, since the protective tape PT is folded back at an acute angle at the first folded corner portion 47 and peeled off from the wafer W, the peeling angle L1 can be reduced. Thereby, since the peeling force acting on the protective tape PT and the wafer W can be reduced, contamination of the wafer W caused by breakage of the protective tape PT can be avoided, and cracks on the wafer W can also be avoided. bad.

In addition, the peeling member 37 has a flat surface 45, and folds back the protective tape PT in a state where the flat surface 45 is in contact with the surface of the protective tape PT to peel off the protective tape PT. That is, since the wide flat surface 45 is in contact with the protective tape PT and suppresses the displacement of the wafer W from above, it is possible to avoid the decrease in peeling accuracy of the protective tape PT due to the displacement of the wafer W. In addition, since the force exerted by the peeling member 37 on the wafer W via the protective tape PT is dispersed by the wide flat surface 45, defects such as deformation or cracking of the wafer W can be avoided.

Furthermore, the embodiments disclosed in this specification are illustrative in all respects and are not intended to be limiting. The scope of the present invention is shown not by the description of the above-mentioned embodiments but by the claimed scope, and includes all changes (modifications) within the meaning and range equivalent to the claimed scope. As an example, the present invention can be modified as follows.

(1) In each embodiment, the wafer W whose entire back surface is uniformly polished is used as a workpiece and the entire back surface of the workpiece is adsorbed and held by the holding table 3. However, the invention is not limited thereto. That is, the protective tape PT may be peeled off while retaining only the rear outer peripheral portion of the entire surface of the workpiece.

As shown in FIGS. 29(a) to 29(c) , the wafer WA according to the modified example was back-polished in a state where a protective tape PT for circuit protection was attached to the surface on which the circuit pattern was formed. The back surface of the wafer WA is polished (back surface grinding) so that an outer peripheral portion of approximately 3 mm remains in the radial direction. That is, a structure is used in which the flat recessed portion He is formed on the back surface and the annular convex portion Ka remains along the outer periphery.

As an example, the polishing depth d in the flat recess He is several hundred μm, and the wafer thickness J of the flat recess He is 30 μm to 50 μm. Therefore, the annular convex portion Ka formed on the outer periphery of the back surface functions as an annular rib that increases the rigidity of the wafer WA to suppress bending deformation of the wafer WA during transportation or other processing processes. In addition, the inner corner part of the annular convex part Ka is shown using the symbol Kf.

As shown in FIG. 30 , the holding base 3A according to the modified example is provided with a cylindrical recessed portion 15 on the upper surface of the central portion. The diameter of the recessed portion 15 in plan view is configured to be slightly smaller than the diameter of the flat recessed portion He of the wafer WA.

Vacuum suction holes 17 are arranged in an annular shape on the upper surface of the outer peripheral portion of the holding base 3A in a portion where the recessed portion 15 is not formed in the holding base 3A. The vacuum adsorption hole 17 is connected with the vacuum device 18 . The diameter of the vacuum suction hole 17 is adjusted so as to face the annular convex portion Ka of the wafer WA when the wafer WA is placed on the holding table 3A. Therefore, by activating the vacuum device 18 to perform vacuum suction, the holding table 3A suctions and holds the annular convex portion Ka of the wafer WA through the vacuum suction holes 17 . That is, the holding table 3A is configured to hold only the outer peripheral portion of the wafer WA on the entire surface of the wafer WA.

A gas supply hole 19 and a small hole 20 are formed on the bottom surface of the recess 15 . The gas supply hole 19 is in communication with the gas supply part 21 that supplies gas to the recess 15 . A valve (not shown) is arranged in the small hole 20, and by opening the valve, the air inside the recessed portion 15 is allowed to flow out to the outside with appropriate resistance. With the wafer WA placed on the holding table 3A, the gas is supplied from the gas supply part 21 to the recessed part 15, thereby pressurizing the space S formed between the wafer WA and the holding table 3A to a pressure slightly higher than the atmospheric pressure. the established air pressure.

In the modified example provided with the holding table 3A, the processes of steps S1 and S5 are different from those of the respective embodiments. First, in step S1 of the modified example, when a command is issued to peel off the protective tape PT from the wafer WA, the wafer WA with the back surface polished and the protective tape PT adhered to the surface is moved towards the wafer WA by a transfer robot (not shown). It is conveyed above the holding table 3A. As an example, the transport robot transports the wafer WA by adsorbing the surface side of the annular convex portion Ka of the wafer WA (the surface outer peripheral portion of the wafer W).

The transfer robot places the wafer WA on the holding table 3A so that the vacuum suction hole 17 provided on the surface of the holding table 3A faces the annular convex portion Ka of the wafer WA. When the wafer WA is placed on the holding table 3A, the vacuum device 18 is operated to perform vacuum suction. By vacuum suction, the holding table 3A sucks and holds the annular convex portion Ka of the wafer WA through the vacuum suction holes 17 . The state in which the outer peripheral portion of the wafer WA is adsorbed and held by the holding table 3A is as shown in FIG. 30 .

When the holding table 3A adsorbs and holds the wafer WA, the gas is supplied from the gas supply part 21 to the space S formed between the recess 15 of the holding table 3A and the wafer WA. Gas is supplied through the gas supply hole 19 to pressurize the space S to a predetermined air pressure slightly higher than atmospheric pressure. By pressurizing the space S, the wafer WA can be prevented from deforming so as to sag downward. The wafer WA is held by the holding table 3A and the space S is pressurized, thereby completing step S1 of the modified example. The process from step S2 to step S4 is the same as that in each embodiment, so detailed description is omitted.

When step S5 of the modified example is started, the holding table 3A stops the operation of the vacuum device 18 to release the vacuum suction of the wafer WA. Then, the transfer robot adsorbs and holds the outer peripheral portion of the surface of the wafer WA, detaches the wafer WA from the holding table 3A, and stores the wafer WA in a wafer collection cassette (not shown).

In addition, step S3 of the modified example using the holding table 3A and the wafer WA is not limited to the configuration in which the height of the peeling member 37 is made constant and the height of the peeling member 37 is made to move in the peeling direction Vp, as in each embodiment. That is, in step S3, the height of the peeling member 37 may be changed according to the position of the wafer WA from which the protective tape PT is peeled, and the position of the peeling member 37 relative to the wafer W may be moved toward the peeling direction Vp.

Specifically, when peeling off the protective tape PT adhered to the outer peripheral portion of the wafer WA, as shown in FIG. 31 , the peeling member 37 is adjusted to a relatively low position indicated by symbol H1 to peel off the protective tape PT. The member 37 moves in the peeling direction Vp, folds back the protective tape PT, and peels it off. On the other hand, when peeling off the protective tape PT adhered to the portion other than the outer peripheral portion of the wafer WA, the peeling member 37 is adjusted to a relatively high position indicated by symbol H2. It moves in the peeling direction Vp, folds back the protective tape PT, and peels it off.

As an example, when the height of the peeling member 37 is H1, the flat surface 45 of the peeling member 37 is in contact with the protective tape PT. On the other hand, when the height of the peeling member 37 is H2, the flat surface 45 is in a state close to the protective tape PT, and a gap 73 is formed between the flat surface 45 and the protective tape PT. Furthermore, for convenience of explanation, the gap 73 is exaggerated in FIG. 31 . The height of the gap 73 in the z direction is adjusted to such a small distance that the flat surface 45 can quickly suppress the positional deviation of the wafer WA.

When peeling off the protective tape PT adhered to the outer peripheral portion of the wafer WA, the peeling member 37 is located above the annular convex portion Ka of the wafer WA. Since the annular convex portion Ka has a thickness and high rigidity, even when the peeling member 37 is lowered to a relatively low position and comes into contact with the annular convex portion Ka of the wafer WA, or when the peeling member 37 faces the Even when the pressing force acts on the annular convex portion Ka, the wafer WA is less affected by the descent of the peeling member 37 . Therefore, by setting the height of the peeling member 37 low, the protective tape PT can be peeled off while suppressing the vibration of the wafer WA more reliably.

When peeling off the protective tape PT adhered to the outer peripheral portion of the wafer WA, that is, the central portion of the wafer WA, the peeling member 37 is located above the flat recessed portion He of the wafer WA. Since the flat recessed portion He is a thin portion with low rigidity, if the flat surface 45 comes into contact with the flat recessed portion He, the pressing force may act on the flat recessed portion He, causing deformation or other defects in the wafer WA. Therefore, by setting the height of the peeling member 37 high to form a slight gap 73 , it is possible to more reliably avoid a defective situation on the wafer WA, and to suppress the displacement of the wafer WA when the protective tape PT is peeled off.

Furthermore, the holding table 3A that holds only the outer peripheral portion of the wafer is also effective when a wafer with components mounted on both the front and back surfaces is used as a workpiece. If the entire back surface of a wafer with components mounted on the front and back surfaces is held, the holding platform may come into contact with the components mounted in the center of the back surface, which may affect the function of the components. Therefore, by holding the peripheral portion of the back surface on which no components are mounted on the back surface using the holding table 3A, it is possible to peel the protective tape PT from the wafer while avoiding adverse effects on the components.

(2) In each embodiment, the structure in which the flat surface 45 comes into contact with the surface of the protective tape PT when the peeling member 37 is placed on the surface of the protective tape PT in step S3 has been described as an example, but it may also be used. It is a structure in which the flat surface 45 is close to the surface of the protective tape PT. That is, when the peeling member 37 is lowered and placed on the surface of the protective tape PT, the height of the peeling member 37 is adjusted so that a slight gap is formed between the flat surface 45 and the protective tape PT. Then, while maintaining the state where the flat surface 45 is close to the surface of the protective tape PT, the protective tape PT is folded back at the first folded corner 47 to be peeled off from the wafer W.

In a modified example in which the protective tape PT is folded back and peeled off while the flat surfaces 45 are brought close to each other in this way, by setting the height of the peeling member 37 high to form a minute gap, it is possible to reliably avoid the problem caused by the flat surface 45 Excessive pushing force is exerted on the wafer W, causing the wafer W to be cracked or otherwise undesirable. On the other hand, since the gap formed between the flat surface 45 and the protective tape PT is a very small distance, even if the wafer W is displaced, the displacement is quickly suppressed by the approaching flat surface 45 . Thereby, the occurrence of deformation or cracking of the wafer W can be avoided, and the displacement of the wafer W when the protective tape PT is peeled off can be suppressed.

(3) In the above-described embodiments and modifications, the peeling member 37 may be switched to a first state in which the flat surface 45 is in contact with the protective tape PT, and in which a sharp blade-shaped portion is in contact with the protective tape PT. The composition of the second state with PT. As an example of a structure for switching a plurality of postures, as shown in FIG. 32(a) , the peeling member 37 further includes a blade-shaped portion 70 and a rotation shaft 71 extending in the y direction. The blade portion 70 is a sharp corner portion and is configured to form an acute angle when viewed from the front. The rotation shaft 71 is embedded in the peeling member 37 and is configured to be rotatable about an axis in the y direction. That is, by the rotation of the rotation shaft 71, the peeling member 37 rotates around the axis in the y direction. Furthermore, by rotating the rotating shaft 71, the peeling member 37 can switch between the first state shown in Fig. 32(a) and the second state shown in Fig. 32(b).

In the first state shown in FIG. 32(a) , the peeling member 37 takes an attitude with the flat surface 45 facing downward (first attitude). When the peeling member 37 takes the first posture, by placing the peeling member 37 on the protective tape PT in step S3, as shown in FIGS. 11 to 12 etc., the flat surface 45 comes into contact with the protective tape PT to suppress crystallization. Displacement of circle W. In addition, since the peeling angle L1 of the protective tape PT becomes an acute angle by the first folding corner portion 47 and is folded back at a smaller angle, contamination of the wafer W by fragments of the protective tape PT can be prevented.

On the other hand, in the second state shown in FIG. 32(b) , the peeling member 37 takes a posture with the blade-shaped portion 70 facing downward (second posture). When the peeling member 37 takes the second posture, by placing the peeling member 37 on the protective tape PT in step S3, as shown in FIG. 33, the blade-shaped portion 70 comes into contact with the protective tape PT. By pulling the peeling tape Ts with the blade 70 in contact with the protective tape PT, the protective tape PT is peeled off from the wafer W by being folded back by the blade 70 .

The peeled protective tape PT is reversely guided in the direction P5 according to the angle of the blade portion 70 . That is, the direction in which the protective tape PT extends is reversed from the direction P1 toward the direction P5. Since the blade-shaped portion 70 has a sharp structure like a conventional blade-shaped member, the angle between the direction P1 and the direction P5, that is, the peeling angle L5 becomes large. In addition, the sharp blade portion 70 acts on a peeling force in a narrow range of the protective tape PT. Thereby, by using the sharp blade-shaped portion 70, a strong peeling force can be exerted on the protective tape PT. Therefore, even when a material with strong adhesive force is used as the adhesive material Tb of the protective tape PT, it is possible to reliably peel off the protective tape PT. The protective tape PT is peeled off from the wafer W.

When the adhesive force of the protective tape PT is high, or when the protective tape PT is made of a material that is difficult to break, the peeling member 37 is switched to the second posture to peel off the protective tape PT. That is, the sharp blade portion 70 is brought into contact with a narrow range of the protective tape PT, so that a strong peeling force acts on the protective tape PT.

On the other hand, when the rigidity of the protective tape PT is high, or when the protective tape PT is made of a material that is easily broken, the peeling member 37 is switched to the first posture to peel off the protective tape PT. That is, the flat surface 45 is brought into contact with the wide range of the protective tape PT, and the protective tape PT is folded back at a small peeling angle L1 to be peeled off from the wafer W while suppressing the displacement of the wafer W. Thereby, the posture of the peeling member 37 can be switched according to the structure of holding the wafer W or the conditions of the protective tape PT, and the highly versatile adhesive tape peeling device 1 can be realized.

(4) In each of the above-described embodiments and modifications, as shown in FIG. 34 , the peeling member 37 may have a built-in heater 69 . By operating the heater 69 with the flat surface 45 in contact with or approaching the protective tape PT, the protective tape PT is heated by the heater 69 and softened. Therefore, even when the rigidity of the protective tape PT is high, the protective tape PT can be softened by the heater 69, so that the protective tape PT can be folded back and peeled off from the wafer W with high precision.

(5) In the above-described embodiments and modifications, the shape of the peeling member 37 having the flat surface 45 is not limited to having the first folding corner portion 47 that folds back the protective tape PT at an acute angle, and the shape of the peeling member 37 that turns the protective tape PT back at an acute angle. The second folded corner portion 49 is composed of two corner portions that are folded back in a rotating manner. As an example, the protective member 37 is provided with only the first folding corner portion 47 for folding the protective tape PT at an acute angle, and the protective tape PT is folded once. In addition, the peeling member 37 may have two or more corners in addition to the first folding corner 47 that folds back the protective tape PT at an acute angle. The first folding corner 47 and the plurality of corners can be used to fold the protective tape PT back at an acute angle. The protective tape PT was folded back three times or more and peeled off from the wafer W.

(6) In each of the above-described embodiments and modifications, as shown in FIG. 35 , the recessed portion 67 may be formed on the flat surface 45 of the peeling member 37 . FIG. 35 is a left side view of the peeling member 37. The recessed portion 67 extends along the direction in which the release tape Ts is adhered to the protective tape PT (x direction in each embodiment). The depth Rs and width Gs of the recessed portion 67 are set according to the thickness and width of the release tape Ts. That is, the recessed portion 67 is configured so that the peeling tape Ts can be fitted. Preferably, the depth Rs and width Gs of the recess 67 are slightly larger than the thickness and width of the peeling tape Ts.

When the peeling tape Ts is thick and rigid, if the peeling member 37 without the recessed portion 67 is placed on the protective tape PT to which the peeling tape Ts is adhered, as shown in FIG. 36 , although the flat surface 45 and The peeling tape Ts is in contact but the flat surface 45 cannot fully contact the protective tape PT with high precision.

Therefore, by forming the recess 67 in the flat surface 45 of the peeling member 37 with a size corresponding to the thickness of the peeling tape Ts, the flat surface of the peeling member 37 can be brought into contact with the protective tape PT with high precision. That is, as shown in FIG. 37 , when the peeling member 37 having the recessed portion 67 is placed on the protective tape PT to which the peeling tape Ts is adhered, the peeling tape Ts is fitted into the recessed portion 67 . Therefore, the entire flat surface 45 in the portion where the concave portion 67 is not formed is in contact with the protective tape PT with high accuracy. Therefore, even when the peeling tape Ts is thick and rigid, the position of the wafer W can be maintained with higher accuracy by the flat surface 45 .

(7) In each of the foregoing embodiments and modifications, the protective tape PT for circuit protection has been explained as an example of the adhesive tape to be peeled off. However, the adhesive tape to be peeled off is not limited to the protective tape. Adhesive tapes used for other purposes, such as cutting tapes, can be peeled off.

(8) In each embodiment, the workpiece is not limited to the semiconductor wafer, and various semiconductor components such as substrates and panels can be used as the workpiece. In addition, the shape of the workpiece may be a rectangular shape, a polygonal shape, a substantially circular shape, or the like, in addition to a circular shape.

(9) In each of the above-described embodiments and modifications, the peeling member 37 may have a plurality of flat surfaces and corners, and may be configured to switch the flat surfaces and corners that are in contact with the protective tape PT by rotation. As an example of the structure of the flat surface and the corner portion that are in contact with the protective tape PT by rotation switching, as shown in FIG. 38(a) , the peeling member 37 has four flat surfaces 79, 80, 81, and 82 extending in the y direction. and 4 corners 83, 84, 85 and 86. That is, in the modification of (7), the peeling member 37 is a quadrangular prism-shaped member extending in the y direction.

In addition, the peeling member 37 has a rotation axis 87 extending in the y direction, and is configured to be rotatable about the axis in the y direction. By rotating the peeling member 37 about the axis in the y direction, the downward plane on the peeling member 37 can be switched. Figure 38(a) shows the state with the flat surface 79 facing downward. In this state, by placing the peeling member 37 on the protective tape PT, the flat surface 79 among the flat surfaces 79 to 82 comes into contact with the protective tape PT. FIG. 38(b) shows the state where the flat surface 81 faces downward. In this state, by placing the peeling member 37 on the protective tape PT, the flat surface 81 among the flat surfaces 79 to 82 comes into contact with the protective tape PT.

The corner portion 83 is provided on one end side of the flat surface 79. When the flat surface 79 comes into contact with the protective tape PT, the corner portion 83 functions as a corner portion for folding back the protective tape PT in step S3. The corner portion 84 is provided on one end side of the flat surface 80. When the flat surface 80 is in contact with the protective tape PT, the corner portion 84 functions as a corner portion for folding back the protective tape PT in step S3. The corner portion 85 is provided on one end side of the flat surface 81. When the flat surface 81 is in contact with the protective tape PT, the corner portion 85 functions as a corner portion for folding back the protective tape PT in step S3. The corner portion 86 is provided on one end side of the flat surface 82. When the flat surface 82 comes into contact with the protective tape PT, the corner portion 83 functions as a corner portion for folding back the protective tape PT in step S3.

The respective angles of the corner portions 83 to 86 are configured to be different from each other. In this modification, the corner 83 is an obtuse angle, the corners 84 and 85 are acute angles, and the corner 86 is a right angle. In addition, the angle of the corner portion 84 when viewed from the front is configured to be smaller than the angle of the corner portion 85 when viewed from the front.

In step S3, as shown in FIG. 38(a) , the peeling member 37 is lowered with the flat surface 79 facing downward and placed on the protective tape PT. Thereby, the flat surface 79 among the flat surfaces 79 to 82 is connected to the protective tape PT. Abut. Furthermore, the corner portion 83 among the corner portions 83 to 86 functions as a folding corner portion for folding back the protective tape PT. That is, as shown in FIG. 38(c) , by pulling the peeling tape Ts, the protective tape PT is folded back at the corner 83 and is peeled off from the wafer W. Since the angle of the corner portion 83 is an obtuse angle, when the corner portion 83 functions as a folded corner portion, the angle at which the protective tape PT is folded when peeling off, that is, the peeling angle L6 is an obtuse angle.

On the other hand, in step S3, as shown in FIG. 38(b) , the peeling member 37 is lowered with the flat surface 81 facing downward and placed on the protective tape PT. Thereby, the flat surface 81 among the flat surfaces 79 to 82 is Connect with protective tape PT. Furthermore, the corner portion 85 among the corner portions 83 to 86 functions as a folding corner portion for folding back the protective tape PT. That is, as shown in FIG. 38(d) , by pulling the peeling tape Ts, the protective tape PT is folded back at the corner 85 and is peeled off from the wafer W. Since the angle of the corner portion 85 is an acute angle, when the corner portion 85 functions as a folded corner portion, the peeling angle L7 of the protective tape PT becomes an acute angle.

In this way, by rotating the peeling member 37 and switching the plane and the corner portion in contact with the protective tape PT, the angle at which the protective tape PT is folded back and peeled can be appropriately changed in step S3. In other words, by switching the corner portion in contact with the protective tape PT, the peeling angle of the protective tape PT in step S3 can be changed.

In addition, the peeling member 37 is not limited to a quadrangular prism-shaped member having four flat surfaces and corners, and may be a polygonal prism-shaped member, such as a hexagonal prism shape, for example. As an example, when the peeling member 37 is in the shape of a hexagonal prism, by switching the corner portion that functions as a folding corner portion for folding back the protective tape PT among the six corner portions each having a different angle when viewed from the front, the protective tape PT can be folded back. The peeling angle of the protective tape PT in step S3 is changed to six stages. That is, by forming the peeling member 37 into a rotatable polygonal columnar shape, the peeling angle of the protective tape PT can be changed in a plurality of stages without preparing a plurality of peeling members 37 .

1: Adhesive tape peeling device 3: Holding platform 5: With supply department 7: Divestment organization 9: Bring recycling department 10: Orbit 11: Movable table 12:Pulse motor 13:Screw shaft 15: concave part 17: Vacuum adsorption hole 18: Vacuum device 19:Gas supply hole 20: small hole 21:Gas supply department 23:Lifting unit 25: Attached roller 27: Stripping unit 28: Vertical frame 29: Support frame 30:Abutment 31:Longitudinal rail 32: Lifting platform 33: Motor 34:Side panel 35: Support frame 37: Strip components 39: Guide roller 40: Guide roller 41: Clamping roller 42: Tension roller 43:Support arm 45:Flat surface 47: First turning corner 48: First guide surface 49:Second return corner 50:Second guide surface 51:Control Department 53: Second stripping unit 55:First lifting shaft 56: Motor 57:Longitudinal wall 58:First control component 59: Second control component 60: Second lifting shaft 61: Motor 63: Orbit 65: Front end Ce: peeling end position Cs: peeling start position He: flat concave part Ka: annular convex part PT: protective tape Ts: peeling tape Vp: peeling direction W: Wafer (workpiece)

Figure 1 is a front view of the adhesive tape peeling device of Embodiment 1. FIG. 2 is a plan view showing the schematic structure of the main part of the adhesive tape peeling device of Embodiment 1. FIG. 3 is a longitudinal sectional view showing the structure of the peeling member of Example 1, FIG. 3(a) is a front view of the peeling member, and FIG. 3(b) is a perspective view of the peeling member. 4 is a cross-sectional view showing the structure of the protective tape of Example 1. Figure 5 is a flow chart showing the operation of the adhesive tape peeling device of each embodiment. Figure 5(a) is a flow chart of the adhesive tape peeling device of Embodiment 1. Figure 5(b) is a flow chart of the adhesive tape peeling device of Embodiment 2. flow chart. FIG. 6 is a front view illustrating step S1 of Embodiment 1. FIG. 7 is a front view illustrating step S2 of Embodiment 1. FIG. 8 is a front view illustrating step S2 of Embodiment 1. FIG. 9 is a top view illustrating step S2 of Embodiment 1. FIG. 10 is a front view illustrating step S3 of Embodiment 1. FIG. 11 is a front view illustrating step S3 of Embodiment 1. FIG. 12 is a front view illustrating step S3 of Embodiment 1. FIG. 13 is a top view illustrating step S3 in Embodiment 1. FIG. 14 is a front view illustrating step S4 of Embodiment 1. FIG. 15 is a diagram showing the structure of peeling off the protective tape using a conventional blade-shaped member and its problems. FIG. 16 is a diagram showing the structure of peeling off the protective tape using a conventional blade-shaped member and its problems. Fig. 17 is a front view showing the effects of Embodiment 1. Fig. 18 is a front view showing the structure of a comparative example. Figure 19 is a front view of the adhesive tape peeling device of Embodiment 2. 20 is a diagram showing the structure of the second peeling unit of Example 2, FIG. 20(a) is a front view of the second peeling unit, and FIG. 20(b) is a perspective view of the second peeling unit. FIG. 21 is a front view illustrating step S2 of Embodiment 2. FIG. 22 is a front view illustrating step S2 of Embodiment 2. Fig. 23 is a front view illustrating step S2 of Embodiment 2. Fig. 24 is a front view illustrating step S3 of Embodiment 2. FIG. 25 is a front view illustrating step S3 of Embodiment 2. Fig. 26 is a front view illustrating step S3 of Embodiment 2. Fig. 27 is a front view illustrating step S3 of Embodiment 2. Fig. 28 is a front view illustrating step S3 of Embodiment 2. FIG. 29 is a diagram showing the structure of a semiconductor wafer according to a modified example. FIG. 29(a) is a partially cutaway perspective view of the semiconductor wafer. FIG. 29(b) is a perspective view of the back side of the semiconductor wafer. FIG. 29(c) This is a partial longitudinal cross-sectional view of a semiconductor wafer. FIG. 30 is a longitudinal cross-sectional view showing a state in which a wafer is placed on a holding stage according to a modified example. FIG. 31 is a diagram showing a state in which the height of the peeling member is adjusted in a modified example. 32 is a view showing a peeling member according to a modified example, FIG. 32(a) is a front view showing the peeling member in the first state, and FIG. 32(b) is a front view showing the peeling member switched to the second state. 33 is a front view showing a state in which the protective tape is peeled off using the peeling member switched to the second state in the modified example. Fig. 34 is a front view showing a peeling member according to a modified example. Fig. 35 is a left side view showing a peeling member according to a modified example. Fig. 36 is a left side view showing a state in which the protective tape is peeled off using a peeling member without a concave portion. Fig. 37 is a left side view showing a state in which the protective tape is peeled off using a peeling member having a concave portion. Fig. 38 is a diagram illustrating a modified example. Fig. 38(a) is a front view showing the peeling member in the initial state. Fig. 38(b) is a front view showing the state switched to a downward plane. Fig. 38(c) is FIG. 38(d) is a front view showing a state in which the protective tape is peeled off using the peeling member in the initial state. FIG. 38(d) is a front view showing the state in which the protective tape is peeled off using the peeling member switched to a downward plane.

3: Holding platform

45:Flat surface

47: First turning corner

48: First guide surface

L1: peeling angle

P1,P2: direction

PT: protective tape

PTa: protective tape

Q: Direction

Ts: peeling tape

Vp: peeling direction

W:wafer

Claims (10)

An adhesive tape peeling method for peeling off an adhesive tape adhered to a workpiece from the aforementioned workpiece, and is characterized in that it has: The workpiece holding process involves placing the aforementioned workpiece on the holding member; and In the peeling process, the peeling member is placed on the surface of the adhesive tape, and the adhesive tape is pulled in a state where the adhesive tape is folded back by the peeling member, and the adhesive tape is moved from one end side of the workpiece to the other end side. peel off; The peeling member has a flat surface and a first folded corner portion. The flat surface is in contact with or close to the surface of the adhesive tape during the peeling process. The first folded corner portion is provided on the flat surface. One end of the surface and the aforementioned adhesive tape is folded back and peeled off from the aforementioned workpiece, The first folded corner portion is configured such that the angle at which the adhesive tape is turned back becomes an acute angle when the adhesive tape is peeled off from the workpiece. The adhesive tape peeling method of claim 1, wherein the peeling member has a heater for heating the adhesive tape, In the peeling process, the peeling member folds back the adhesive tape heated by the heater to peel the adhesive tape from the workpiece. The adhesive tape peeling method of claim 1 or 2, wherein the peeling member has a second folded corner, The second folding corner portion is used to fold back the adhesive tape peeled off from the workpiece by turning back the first folding corner portion, and guide it from the front one end side of the workpiece toward the other side. The adhesive tape peeling method of claim 1 or 2, wherein the peeling member further has a sharp blade, and It is configured to be switchable between a first posture in which the flat surface of the blade-shaped portion and the flat surface can contact or approach the surface of the adhesive tape, and a second posture in which the flat surface is in contact with or close to the surface of the adhesive tape. The blade-shaped portion and the flat surface can be in contact with or approach the surface of the adhesive tape. The peeling process is to adhere the flat surface to the adhesive tape when the peeling member adopts the first posture. The surface of the tape is in contact or close to each other, and the adhesive tape is pulled in a state where the adhesive tape is folded back through the first folded corner such that the folding angle of the adhesive tape becomes an acute angle, thereby causing the adhesive tape to separate from the workpiece. Peeling involves bringing the blade-shaped portion into contact with or approaching the surface of the adhesive tape when the peeling member takes the second posture, and the blade-shaped portion separates the adhesive tape such that the folding angle of the adhesive tape becomes an obtuse angle. The adhesive tape is pulled while the adhesive tape is folded, whereby the adhesive tape is peeled off from the workpiece. The adhesive tape peeling method according to claim 1 or 2, wherein the workpiece holding process is such that the workpiece is placed on a holding member, and an outer peripheral portion of the entire surface of the workpiece is held by the holding member. The adhesive tape peeling method of claim 5, wherein during the aforementioned peeling process, When the adhesive tape adhered to the outer peripheral part of the workpiece is peeled off, the peeling member is in a state of contact with the adhesive tape, and the adhesive tape is folded back by the peeling member, and is adhered to other than the outer peripheral part of the workpiece. When the adhesive tape is peeled off, the height of the peeling member is controlled by folding back the adhesive tape while the peeling member is close to the adhesive tape. The adhesive tape peeling method of claim 1 or 2, wherein the peeling member is a polygonal columnar member having a plurality of planes extending along a predetermined direction and a plurality of corners with different angles, and is configured to be able to rotate around the aforementioned predetermined direction. The axis rotates, By the peeling member rotating about the axis in the predetermined direction, the plane among the plurality of planes that is in contact with or close to the surface of the adhesive tape is switched, and the plane among the plurality of corners is switched to peel the adhesive tape from the workpiece. Then fold back the corners of the aforementioned adhesive tape. For example, the adhesive tape peeling method of claim 1 or 2 includes a peeling tape attaching process, and the peeling tape attaching process is to stick the peeling tape to the surface of the aforementioned adhesive tape along the peeling direction, and the peeling direction is to remove the aforementioned adhesive tape from itself. The direction of the aforementioned workpiece peeling, In the peeling process, a peeling member is placed on the surface of the peeling tape that is adhered to the adhesive tape, and the peeling member pulls the peeling tape in a state where the adhesive tape to which the peeling tape is attached is folded back. The adhesive tape and the peeling tape are integrally peeled from the workpiece. The adhesive tape peeling method of claim 8, wherein the peeling member is formed with a recessed portion on the flat surface with a depth corresponding to the thickness of the adhesive tape, In the aforementioned peeling process, a peeling member is placed on the surface of the peeling tape before being pasted on the adhesive tape in a state where the peeling tape is fitted into the recessed portion, and the peeling tape is adhered by the peeling member. By pulling the peeling tape while the adhesive tape is folded, the adhesive tape and the peeling tape are integrally peeled off from the workpiece. An adhesive tape peeling device is used to peel the adhesive tape adhered to the workpiece from the aforementioned workpiece, and is characterized by having: The workpiece holding part holds the aforementioned workpiece; and The peeling mechanism places a peeling member on the surface of the adhesive tape, and pulls the adhesive tape in a state where the adhesive tape is folded back by the peeling member, thereby pulling the adhesive tape from one end of the workpiece toward the other end. side peel; The peeling member has a flat surface and a first folded corner portion. The flat surface is in contact with or close to the surface of the adhesive tape. The first folded corner portion is provided at one end of the flat surface. The aforementioned adhesive tape is folded back and peeled off from the aforementioned workpiece, The first folded corner portion is configured such that the angle at which the adhesive tape is turned back becomes an acute angle when the adhesive tape is peeled off from the workpiece.