TW202347187A - Information processing device, inference device, machine learning device, information processing method, inference method, and machine learning method - Google Patents

Abstract

An information processing device (5) comprises: an information acquisition unit (500) that acquires substrate processing fluid supply information including substrate processing fluid supply state information which indicates the state of supply of a substrate processing fluid that is supplied from a substrate processing fluid supply unit (222, 242a, 245a), in processing of a substrate (W) which is performed by a substrate processing device (2); and a state prediction unit (501) that predicts substrate processing fluid supply position information corresponding to the substrate processing fluid supply information by inputting the substrate processing fluid supply information to a learning model which has learned, by machine learning, correlations between substrate processing fluid supply information and substrate processing fluid supply position information, said substrate processing fluid supply position information indicating the supply position of the fluid that is supplied by the substrate processing fluid supply unit when the substrate processing device operates.

Description

Information processing device, inference device, machine learning device, information processing method, inference method, and machine learning method

The present invention relates to an information processing device, an inference device, a machine learning device, an information processing method, an inference method, and a machine learning method.

A substrate processing apparatus that performs various processes on substrates such as semiconductor wafers, and a substrate processing apparatus that performs chemical mechanical polishing (CMP: Chemical Mechanical Polishing) processing is known. For example, the substrate processing apparatus rotates a polishing table with a polishing pad and supplies polishing liquid (slurry) on the polishing pad from a liquid supply nozzle, and presses the substrate against the polishing pad with a polishing head called a top ring. Chemically and mechanically polish the substrate. Then, in order to remove foreign matter such as grinding dust attached to the polished substrate, a substrate cleaning fluid is supplied to the polished substrate and brought into contact with a cleaning tool for friction cleaning, and the substrate is further dried. After a series of processes are completed, the fluid is transferred to the next substrate.

When the above series of processes are repeated, the moving position of the nozzle for ejecting the fluid on the substrate will deviate, and the supply position of the fluid will also deviate. As a result, it is difficult to supply the liquid required for processing the substrate to the optimal position. In the past, there have been disclosed techniques for appropriately supplying polishing slurry to the wafer by adjusting the position of the front end of the supply nozzle relative to the polishing pad. (For example, refer to Patent Document 1). [Prior technical literature] [Patent Document]

[Patent Document 1] Japanese Patent Application Publication No. 2007-059938

(Invent the problem you want to solve)

The technology described in Patent Document 1 is to adjust the supply position of the polishing slurry by appropriately moving the front end of the supply nozzle according to the supply amount of the polishing slurry and the position of the wafer.

On the other hand, when the substrate processing fluid is supplied to an appropriate position, the operating status of the fluid supply flow rate, the fluid supply pressure, the opening of the fluid supply valve, the pressure on the primary side of the fluid supply valve, etc., affects the supply position of the substrate processing fluid. Important factors, however, are complex and interacting with the substrate processing fluid supply location. Therefore, it is difficult to accurately analyze the impact of each operating state on the supply position of the substrate processing fluid.

In view of the above problems, the object of the present invention is to provide an information processing device, an inference device, a machine learning device, an information processing method, an inference method, and a machine learning method that can supply a substrate processing fluid to an appropriate position according to the supply state of the substrate processing fluid. . (a means of solving problems)

In order to achieve the above object, an information processing device according to one aspect of the present invention is provided with: The information acquisition unit acquires the substrate processing shown in the substrate processing performed by the substrate processing apparatus provided with one or a plurality of substrate processing fluid supply units for supplying processing fluid to the substrate supplied from the substrate processing fluid supply unit. The substrate processing fluid supply status information of the fluid supply status is the substrate processing fluid supply information; and The state prediction unit learns the substrate processing fluid supply information through machine learning and the substrate processing fluid supply position information indicating the supply position of the fluid supplied by the substrate processing fluid supply unit when the substrate processing apparatus operates. In the learning model of the correlation, the substrate processing fluid supply information obtained by the information acquisition unit is input to predict the substrate processing fluid supply position information for the substrate processing fluid supply information. (The effect of invention)

When the information processing apparatus according to one aspect of the present invention is adopted, the substrate processing fluid supply information including the substrate processing fluid supply status information is input into the learning model to predict the substrate processing fluid supply position information for the substrate processing fluid supply information. , therefore, the substrate processing fluid supply position can be appropriately predicted according to the substrate processing fluid supply status of the substrate processing apparatus.

Problems, structures, and effects other than those described above will become apparent from the modes for carrying out the invention described below.

Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. The following is a schematic representation of the necessary range in the description for achieving the object of the present invention. This part of the description of the present invention mainly describes the necessary range, and omits the description in accordance with the conventional technology. (First implementation form)

FIG. 1 is an overall structural diagram showing an example of the substrate processing system 1. The substrate processing system 1 of this embodiment includes a chemical mechanical polishing process for flatly polishing the surface of a semiconductor wafer or other substrate (hereinafter referred to as "wafer") W by pressing it against a polishing pad. (Hereinafter, referred to as "polishing process"); cleaning process of cleaning the surface of the wafer W by contacting the polished wafer W with a cleaning tool; and drying process of drying the cleaned wafer W surface by a drying tool, etc. It functions as a series of substrate processing systems. In addition, cleaning treatment and drying treatment constitute processing treatment.

The main components of the substrate processing system 1 include: a substrate processing device 2, a database device 3, a machine learning device 4, an information processing device 5, and a user terminal device 6. Each of the devices 2 to 6 is composed of, for example, a general-purpose or special-purpose computer (see FIG. 8 described later), and is connected to a wired or wireless network 7, and can transmit and receive various data to each other (part of which is shown with a dotted arrow in FIG. 1 transmission and reception of data). In addition, the number of each of the devices 2 to 6 and the connection structure of the network 7 are not limited to the example in FIG. 1 and may be appropriately changed.

The substrate processing device 2 is composed of a plurality of units and is a device that performs a series of substrate processing on one or a plurality of wafers W, such as loading, polishing, cleaning, drying, film thickness measurement, and unloading. At this time, the substrate processing device 2 refers to the device setting information 265 composed of a plurality of device parameters set for each unit, and the substrate processing plan information 266 that determines the operation status of the polishing process, the cleaning process, the drying process, etc., and controls Actions of each unit.

The substrate processing apparatus 2 transmits various reports R to the database apparatus 3, the user terminal apparatus 6, etc. according to the operation of each unit. The various reports R include, for example, process information identifying the target wafer W when performing substrate processing, device status information indicating the status of each unit when performing each processing, event information detected by the substrate processing device 2, user (operation personnel, production managers, maintenance managers, etc.) to the operation information of the substrate processing device 2, etc.

The database device 3 manages: production history information 30 regarding the history of substrate processing using the substrate processing fluid supply unit for production; and testing of substrate processing fluid supply using the substrate processing fluid supply unit for testing (hereinafter (called "Substrate Processing Fluid Supply Test") is a device for recording substrate processing fluid supply test information 31. In addition, in addition to the above, the database device 3 can also store the device setting information 265 and the substrate processing plan information 266. At this time, the substrate processing device 2 can also refer to this information. In addition, the substrate processing fluid includes at least one of a polishing fluid in a polishing process, a cleaning fluid in a cleaning process, and a drying fluid in a drying process. Therefore, the substrate processing fluid supply test includes at least one of a grinding process test, a cleaning process test, and a drying process test.

The database device 3 receives various reports R from the substrate processing device 2 at any time and registers them in the production history information 30 when the substrate processing device 2 performs substrate processing using the substrate processing fluid supply unit for production. A report R on substrate processing is stored in 30 .

When the substrate processing device 2 performs a substrate processing fluid supply test using the test substrate processing fluid supply unit, the database device 3 receives various reports R (including at least device status information) from the substrate processing device 2 at any time, and registers them in the substrate processing fluid. The test information 31 is supplied and registered by correlating the test results of the substrate processing fluid supply test, and the report R and the test results on the substrate processing fluid supply test are stored in the substrate processing fluid supply test information 31 . The substrate processing fluid supply test can also be performed by the substrate processing device 2 for production, or by a test substrate processing fluid supply test device (not shown) that can reproduce the same supply of substrate processing fluid as the substrate processing device 2 conduct.

In the substrate processing fluid supply unit for testing and the substrate processing fluid supply test device, conditions for the substrate processing fluid supply unit are provided for measuring, for example: the flow rate of the substrate processing fluid supplied from the substrate processing fluid supply unit, the flow rate of the substrate processing fluid supplied from the substrate processing fluid supply unit, and the flow rate of the substrate processing fluid supply unit. Various substrate processing fluid supplies include the pressure of the substrate processing fluid supplied from the processing fluid supply unit, the state of the substrate processing fluid supply valve that adjusts the flow rate of the substrate processing fluid, and the primary side pressure of the substrate processing fluid supply valve that adjusts the flow rate of the substrate processing fluid. A state measuring device (not shown) is used, and the measurement value of the substrate processing fluid supply state measuring device is registered in the substrate processing fluid supply test information 31 as a test result.

The machine learning device 4 operates as the main body of the learning phase of machine learning. For example, it obtains a part of the substrate processing fluid supply test information 31 from the database device 3 as the first learning data 11A, and generates information processing through machine learning. The first learning model 10A used by the device 5 . The first learning model 10A that has been learned is provided to the information processing device 5 via the network 7, a recording medium, and the like.

The information processing device 5 operates as the main body of the inference phase of machine learning, uses the first learning model 10A generated by the machine learning device 4, and performs the processing by the substrate processing device 2 using the substrate processing fluid supply unit for this production. When supplying the substrate processing fluid, the substrate processing fluid supply position is predicted, and the substrate processing fluid supply position information of the prediction result is transmitted to the database device 3, the user terminal device 6, and the like. The information processing device 5 may predict the timing of supplying the substrate processing fluid position information after supplying the substrate processing fluid (post-post prediction processing), during supplying the substrate processing fluid (real-time prediction processing), or while supplying the substrate processing fluid. before fluid (pre-predictive processing).

The user terminal device 6 is a terminal device used by the user, and may be a fixed device or a portable device. The user terminal device 6 accepts various input operations via a display screen of an application, a web browser, etc., and displays various information (for example, notification events, substrate processing fluid supply position information, production history information 30, substrate processing fluid, etc.) via the display screen. Provide test information 31, etc.). (Substrate processing device 2)

FIG. 2 is a top view showing an example of the substrate processing apparatus 2. The substrate processing apparatus 2 includes a loading/unloading unit 21, a polishing unit 22, a substrate transport unit 23, a processing unit 24, a film thickness measurement unit 25, and a control unit 26 inside a frame 20 that is generally rectangular in plan view. composition. The loading/unloading unit 21 and the polishing unit 22, the substrate transport unit 23 and the processing unit 24 are partitioned by a first partition wall 200A, and the substrate transport unit 23 and the processing unit 24 are partitioned by a second partition wall 200B. (Load/unload unit)

The loading/unloading unit 21 is provided with: first to fourth front loading portions 210A to 210D for loading a wafer cassette (FOUP, etc.) capable of accommodating a plurality of wafers W in the vertical direction; The transfer robot 211 moves up and down in the storage direction (up and down direction) of the wafer W; and the transfer robot 211 is moved along the arrangement direction of the first to fourth front loading sections 210A to 210D (the short side direction of the rack 20 ). The horizontal movement mechanism part 212.

The transfer robot 211 is configured to handle the wafer cassettes loaded on the first to fourth front loading units 210A to 210D, the substrate transfer unit 23 (specifically, the elevator 232 to be described later), and the processing unit 24 (specifically, It is configured to provide access to the first and second drying sections 24E, 24F) and the film thickness measuring unit 25, which will be described later, and is provided with upper and lower arms (not shown) for transferring the wafer W between them. . The lower arm is used to transfer the wafer W before processing, and the upper arm is used to transfer the wafer W after processing. When transferring the wafer W to the substrate transfer unit 23 and the processing unit 24 , a shutter (not shown) provided in the first partition wall 200A is opened and closed. (grinding unit)

The polishing unit 22 includes first to fourth polishing parts 22A to 22D that respectively perform polishing processing (planarization) of the wafer W. The first to fourth polishing parts 22A to 22D are arranged along the length direction of the frame 20 .

FIG. 3 is a perspective view showing an example of the first to fourth polishing parts 22A to 22D. The first to fourth polishing parts 22A to 22D have the same basic structure and function.

The first to fourth polishing sections 22A to 22D respectively include: a polishing table 220 that rotatably supports a polishing pad 2200 having a polishing surface; and a polishing pad that holds the wafer W and presses the wafer W onto the polishing table 220 2200 for grinding the top ring (polishing head) 221; the grinding fluid supply nozzle 222 that supplies grinding fluid to the grinding pad 2200; rotatably supports the dressing disc 2230, and makes the dressing disc 2230 contact the polishing surface of the polishing pad 2200 to condition the polishing pad 2200's dresser 223; and an atomizer 224 that sprays cleaning fluid on the polishing pad 2200.

The polishing table 220 includes a rotational movement mechanism part 220b that is supported by a polishing table shaft 220a and drives the polishing table 220 to rotate around its axis; and a temperature control mechanism part 220c that adjusts the surface temperature of the polishing pad 2200.

The top ring 221 is provided with: a rotational movement mechanism portion 221c that is supported by a top ring shaft 221a that can move in the vertical direction and drives the top ring 221 to rotate around its axis; and a vertical movement mechanism that moves the top ring 221 in the vertical direction. part 221d; and a swing moving mechanism part 221e that forms the support shaft 221b as a center of rotation and rotates (swings) the top ring 221.

The grinding fluid supply nozzle 222 is provided with: a rocking movement mechanism part 222b that is supported by the support shaft 222a and makes the support shaft 222a a rotation center to rotate the grinding fluid supply nozzle 222; a flow rate adjustment part 222c that adjusts the flow rate of the grinding fluid; and The temperature control mechanism part 222d adjusts the temperature of the grinding fluid. The grinding fluid system may be grinding liquid (slurry) or pure water. Furthermore, it may also contain a chemical solution, or a dispersant may be added to the grinding liquid. The polishing fluid supply nozzle 222 constitutes a substrate processing fluid supply unit.

The dresser 223 is provided with: a rotational movement mechanism portion 223c that is supported by a dresser shaft 223a that can move in the vertical direction and drives the dresser 223 to rotate around its axis; and a vertical movement mechanism that moves the dresser 223 in the vertical direction. part 223d; and a swing movement mechanism part 223e that forms the support shaft 223b into a center of rotation to rotate the dresser 223.

The atomizer 224 includes a swing movement mechanism part 224b that is supported by the support shaft 224a and makes the support shaft 224a form a rotation center to rotate the atomizer 224; and a flow rate adjustment part 224c that adjusts the flow rate of the cleaning fluid. The cleaning fluid system is a mixed fluid or liquid (for example, pure water) of a liquid (for example, pure water) and a gas (for example, nitrogen).

The wafer W is adsorbed and held under the top ring 221, and after moving to a designated polishing position on the polishing table 220, the top ring 221 presses the polishing surface of the polishing pad 2200 to which the polishing fluid is supplied from the polishing fluid supply nozzle 222. Grind. (Substrate transfer unit)

As shown in FIG. 2 , the substrate transfer unit 23 includes first and second linear conveyors 230A and 230B that can move horizontally along the arrangement direction of the first to fourth polishing parts 22A to 22D (the longitudinal direction of the frame 20 ). ; a swing conveyor 231 disposed between the first and second linear conveyors 230A, 230B; an elevator 232 disposed on the loading/unloading unit 21 side; and a temporary placing table 233 for the wafer W disposed on the processing unit 24 side .

The first linear conveyor 230A is arranged adjacent to the first and second grinding parts 22A and 22B, and is located at four conveying positions (first to fourth conveying positions TP1 to TP1 in order from the loading/unloading unit 21 side). TP4) A mechanism for transporting wafer W between TP4). The second transfer position TP2 is a position for transferring the wafer W to the first polishing unit 22A, and the third transfer position TP3 is a position for transferring the wafer W to the second polishing unit 22B.

The second linear conveyor 230B is arranged adjacent to the third and fourth polishing parts 22C and 22D, and is connected to three transfer positions (the fifth to seventh transfer positions TP5 to TP7 in order from the loading/unloading unit 21 side). ) is a mechanism for transporting wafer W between The sixth transfer position TP6 is a position for transferring the wafer W to the third polishing unit 22C, and the seventh transfer position TP7 is a position for transferring the wafer W to the fourth polishing unit 22D.

The swing conveyor 231 is arranged adjacent to the fourth and fifth transfer positions TP4 and TP5, and has an arm movable between the fourth and fifth transfer positions TP4 and TP5. The swing conveyor 231 is a mechanism that transfers the wafer W between the first and second linear conveyors 230A and 230B and temporarily places the wafer W on the temporary placement table 233 . The elevator 232 is a mechanism that is disposed adjacent to the first transfer position TP1 and transfers the wafer W to the transfer robot 211 of the loading/unloading unit 21 . When transferring the wafer W, the shutter (not shown) provided in the first partition wall 200A is opened and closed. (processing unit)

As shown in FIG. 2 , the processing unit 24 is a substrate cleaning device using a roller sponge 2400, and is equipped with first and second roller sponge cleaning parts 24A and 24B arranged on the upper and lower levels; and is a substrate cleaning device using a pen-type sponge 2401. It is provided with first and second pen-shaped sponge cleaning parts 24C and 24D arranged on the upper and lower levels; as a substrate drying device for drying the cleaned wafer W, it is equipped with the first and second drying parts 24E arranged on the upper and lower levels. , 24F; and equipped with first and second transport parts 24G and 24H for transporting the wafer W. In addition, the number and arrangement of the roller sponge cleaning parts 24A and 24B, the pen sponge cleaning parts 24C and 24D, the drying parts 24E and 24F, and the conveying parts 24G and 24H are not limited to the example in FIG. 2 and may be changed appropriately. In addition, the roller sponge cleaning parts 24A and 24B and the pen sponge cleaning parts 24C and 24D constitute a cleaning unit, and the drying parts 24E and 24F constitute a drying unit.

The respective parts 24A to 24H of the processing unit 24 are arranged in a divided state along the first and second linear conveyors 230A and 230B, for example, in the first and second roller sponge cleaning parts 24A and 24B, and the first conveyor in sequence. part 24G, the first and second pen-type sponge cleaning parts 24C and 24D, the second conveying part 24H, and the first and second drying parts 24E and 24F (in the order of moving away from the loading/unloading unit 21). The processing unit 24 sequentially performs a cleaning process on the polished wafer W: through one of the first and second roller sponge cleaning parts 24A and 24B; through the first and second pen-type sponge cleaning parts A secondary cleaning process in one of 24C and 24D; and a drying process in one of the first and second drying parts 24E and 24F.

The roller sponge 2400 and the pen sponge 2401 are made of synthetic resin such as PVA, nylon, etc., and have a porous structure. The roller sponge 2400 and the pen sponge 2401 function as cleaning tools for friction cleaning the wafer W, and are replaceably installed in the first and second roller sponge cleaning parts 24A, 24B, and the first and second pen sponges, respectively. Type sponge cleaning parts 24C, 24D.

The first conveyance unit 24G is provided with a first conveyance robot 246A that can move in the up-and-down direction. The first transfer robot 246A is configured to be able to access the temporary placement table 233 of the substrate transfer unit 23, the first and second roller sponge cleaning parts 24A and 24B, and the first and second pen type sponge cleaning parts 24C and 24D, and There are two upper and lower arms for transferring the wafer W between them. For example, the lower arm is used to transfer the wafer W before cleaning, and the upper arm is used to transfer the wafer W after cleaning. When transferring the wafer W to the temporary stage 233, the shutter (not shown) provided in the second partition wall 200B is opened and closed.

The second conveyance unit 24H is provided with a second conveyance robot 246B that can move in the up-and-down direction. The second transfer robot 246B is configured to be able to access the first and second pen-shaped sponge cleaning units 24C and 24D and the first and second drying units 24E and 24F, and is equipped for transferring the wafer W therebetween. arm.

FIG. 4 is a perspective view showing an example of the first and second roller sponge cleaning parts 24A and 24B. The first and second roller sponge cleaning parts 24A and 24B have the same basic structure and function. In the example of FIG. 4 , the first and second roller sponge cleaning units 24A and 24B have a pair of roller sponges 2400 arranged up and down so as to sandwich the surface to be cleaned (front and back) of the wafer W.

The first and second roller sponge cleaning parts 24A and 24B each include a substrate holding part 241 that holds the wafer W; a cleaning fluid supply part 242 that supplies a substrate cleaning fluid to the wafer W; and a roller sponge 2400 that is rotatably supported and used. The roller sponge 2400 contacts the wafer W to clean the substrate cleaning part 240 of the wafer W; the cleaning tool cleaning part 243 of the roller sponge 2400 is cleaned (self-cleaning) with a cleaning tool cleaning fluid; and the inside of the rack 20 for cleaning is measured. Space state environment detector 244.

The substrate holding portion 241 includes a substrate holding mechanism portion 241 a that holds a plurality of side edge portions of the wafer W; and a substrate rotating mechanism that rotates the wafer W around a third rotation axis perpendicular to the surface to be cleaned of the wafer W. Section 241b. In the example of FIG. 4 , the substrate holding mechanism part 241 a has two driven rollers, and at least one driven roller is configured to be movable in the holding direction or the separation direction with respect to the side edge of the wafer W. The substrate rotation mechanism part 241b is composed of two driving rollers. In addition, the substrate holding part 241 may be a substrate holding mechanism part 241a composed of a plurality of driven rollers, and a substrate rotating mechanism part 241b composed of at least one driving roller.

The cleaning fluid supply unit 242 includes a cleaning fluid supply nozzle 242a that supplies a substrate cleaning fluid to the surface of the wafer W to be cleaned; a swing movement mechanism unit 242b that rotates the cleaning fluid supply nozzle 242a; and a cleaning fluid supply nozzle 242a that moves the cleaning fluid supply nozzle 242a up and down. The vertical movement mechanism part 242c; the flow rate adjustment part 242d that adjusts the flow rate and pressure of the substrate cleaning fluid; and the temperature adjustment mechanism part 242e that adjusts the temperature of the substrate cleaning fluid. The cleaning fluid supply nozzle 242a constitutes a substrate processing fluid supply unit. The substrate cleaning fluid can also be one of pure water (rinsing liquid) and chemical liquid. The cleaning fluid supply nozzle 242a is shown in FIG. 4 , and a nozzle for pure water and a nozzle for chemical liquid can also be provided respectively. In addition, the substrate cleaning fluid can also be a liquid, a two-fluid mixture of liquid and gas, or a solid such as dry ice.

The substrate cleaning unit 240 is provided with a cleaning tool rotating mechanism unit 240a that rotates the roller sponge 2400 around a first rotation axis parallel to the surface to be cleaned of the wafer W; in order to change the height of the pair of roller sponges 2400 and the distance between them , to move at least one of the pair of roller sponges 2400 in the up and down direction, the upper and lower moving mechanism part 240b; and the linear moving mechanism part 240c to make the pair of roller sponges 2400 linearly move in the horizontal direction. The vertical movement mechanism part 240b and the linear movement mechanism part 240c function as a cleaning tool moving mechanism part that moves the relative position between the roller sponge 2400 and the surface of the wafer W to be cleaned.

The cleaning tool cleaning part 243 is arranged in a position that does not interfere with the wafer W, and has: a cleaning tool cleaning tank 243a that can store and discharge the cleaning tool cleaning fluid; a cleaning tool that is accommodated in the cleaning tool cleaning tank 243a and presses the roller sponge 2400 The cleaning plate 243b; the flow regulating part 243c that regulates the flow rate and pressure of the cleaning tool cleaning fluid supplied to the cleaning tool cleaning tank 243a; and the flow regulating part 243c that circulates inside the roller sponge 2400 and regulates the external cleaning tool cleaning fluid discharged from the outer peripheral surface of the roller sponge 2400. The flow rate and pressure flow regulating part 243d. The cleaning fluid for cleaning tools can also be one of pure water (rinsing fluid) and chemical liquid.

The environment detector 244 includes, for example, a temperature detector 244a and a humidity detector 244b. In addition, the environment detector 244 may also be equipped with a camera (image detector) that can photograph the surface of the wafer W and the roller sponge 2400 during or before and after the cleaning process.

In the primary cleaning process of the first and second roller sponge cleaning units 24A and 24B, the wafer W is rotated by the substrate rotating mechanism unit 241b while being held by the substrate holding mechanism unit 241a. Then, in a state where the substrate cleaning fluid is supplied from the cleaning fluid supply nozzle 242a to the surface to be cleaned of the wafer W, the roller sponge 2400 rotates around the axis by the cleaning tool rotation mechanism part 240a, and interacts with the wafer W. The surface to be cleaned is in sliding contact to clean the wafer W. Then, the substrate cleaning part 240 moves the roller sponge 2400 to the cleaning tool cleaning tank 243a, for example, rotates the roller sponge 2400, or presses the cleaning tool cleaning plate 243b, and supplies the cleaning tool cleaning fluid to the roller through the flow adjustment part 243d. Sponge 2400 is used to clean the roller sponge 2400.

FIG. 5 is a perspective view showing an example of the first and second pen-type sponge cleaning parts 24C and 24D. The first and second pen-shaped sponge cleaning parts 24C and 24D have the same basic structure and function.

The first and second pen-type sponge cleaning parts 24C and 24D each include a substrate holding part 241 that holds the wafer W; a cleaning fluid supply part 242 that supplies a substrate cleaning fluid to the wafer W; and a pen-type sponge 2401 that is rotatably supported. And the pen-shaped sponge 2401 is brought into contact with the wafer W to clean the substrate cleaning part 240 of the wafer W; the cleaning tool cleaning part 243 of the pen-shaped sponge 2401 is cleaned (self-cleaning) with a cleaning tool cleaning fluid; and the machine for performing the cleaning process is measured. Environment detector 244 for the internal space status of the rack 20 . Hereinafter, the differences between the pen-type sponge cleaning parts 24C and 24D and the roller sponge cleaning parts 24A and 24B will be mainly explained.

The substrate holding portion 241 includes: a substrate holding mechanism portion 241c that holds a plurality of side edge portions of the wafer W; and a substrate rotating mechanism that rotates the wafer W around a third rotation axis perpendicular to the surface to be cleaned of the wafer W. Section 241d. In the example of FIG. 5 , the substrate holding mechanism part 241 c is composed of two driven rollers, and at least one driven roller is movable in the holding direction or the separation direction with respect to the side edge of the wafer W. The substrate rotating mechanism part 241d series has 2 driving rollers. In addition, the substrate holding part 241 may be a substrate holding mechanism part 241c composed of a plurality of driven rollers, and a substrate rotating mechanism part 241d composed of at least one driving roller.

The cleaning fluid supply part 242 is configured similarly to FIG. 4 and includes a cleaning fluid supply nozzle 242a, a swing movement mechanism part 242b, a vertical movement mechanism part 242c, a flow rate adjustment part 242d, and a temperature control mechanism part 242e. The cleaning fluid supply nozzle 242a constitutes a substrate processing fluid supply unit.

The substrate cleaning unit 240 is provided with: a cleaning tool rotation mechanism unit 240d that rotates the pen-type sponge 2401 around a second rotation axis perpendicular to the surface to be cleaned of the wafer W; and an up-and-down movement mechanism unit that moves the pen-type sponge 2401 in the up-and-down direction. 240e; and a swing movement mechanism part 240f that rotates the pen-shaped sponge 2401 in the horizontal direction. The vertical movement mechanism part 240e and the swing movement mechanism part 240f function as a cleaning tool movement mechanism part that moves the relative position of the pen sponge 2401 and the surface of the wafer W to be cleaned.

The cleaning tool cleaning part 243 is arranged in a position that does not interfere with the wafer W, and has: a cleaning tool cleaning tank 243e that can store and discharge the cleaning tool cleaning fluid; it is accommodated in the cleaning tool cleaning tank 243e and presses the pen-shaped sponge 2401 for cleaning. Tool cleaning plate 243f; a flow regulating portion 243g that regulates the flow rate and pressure of the cleaning tool cleaning fluid supplied to the cleaning tool cleaning tank 243e; and circulates inside the pen-type sponge 2401 to adjust the flow rate discharged from the outer surface of the pen-type sponge 2401. The flow rate adjustment part 243h of the flow rate and pressure of the cleaning fluid of the cleaning tool.

The environment detector 244 includes, for example, a temperature detector 244a and a humidity detector 244b. In addition, the environment detector 244 may also be equipped with a camera (image detector) that can photograph the surface of the wafer W and the pen sponge 2401 during or before and after the cleaning process.

In the secondary cleaning process of the first and second pen-type sponge cleaning units 24C and 24D, the wafer W is rotated by the substrate rotating mechanism unit 241d while being held by the substrate holding mechanism unit 241c. Then, in a state where the substrate cleaning fluid is supplied from the cleaning fluid supply nozzle 242a to the surface to be cleaned of the wafer W, the pen-shaped sponge 2401 rotates around the axis by the cleaning tool rotation mechanism part 240d, and interacts with the wafer W. The surface to be cleaned of W is in sliding contact to clean the wafer W. Then, the substrate cleaning part 240 moves the pen-shaped sponge 2401 to the cleaning tool cleaning tank 243e, for example, rotates the pen-shaped sponge 2401 or presses the cleaning tool cleaning plate 243f, and supplies the cleaning tool cleaning fluid through the flow regulating part 243h. to the pen-type sponge 2401 to clean the pen-type sponge 2401.

FIG. 6 is a perspective view showing an example of the first and second drying sections 24E and 24F. The first and second drying sections 24E and 24F have the same basic structure and function.

The first and second drying sections 24E and 24F each include a substrate holding section 241 that holds the wafer W; a drying fluid supply section 245 that supplies a substrate drying fluid to the wafer W; and a measurement and drying process inside the rack 20 . Space state environment detector 244.

The substrate holding portion 241 includes a substrate holding mechanism portion 241e that holds a plurality of side edge portions of the wafer W; and a substrate rotating mechanism that rotates the wafer W around a third rotation axis perpendicular to the surface of the wafer W to be cleaned. Part 241g. The substrate holding mechanism part 241e is provided such that one end of the up-and-down moving mechanism part 241f is rotated around a horizontal axis, and the other end is formed into a chuck that can contact and separate from the peripheral edge of the wafer W. Wait for the grip. The substrate holding mechanism part 241e constitutes an umbrella mechanism in which the holding part comes into contact with the wafer W or moves in the separation direction as the vertical movement mechanism part 241f moves in the vertical direction. In addition, the holding portion may also be composed of rollers.

The drying fluid supply unit 245 includes a drying fluid supply nozzle 245a that supplies a substrate drying fluid to the surface of the wafer W to be cleaned; a vertical movement mechanism unit 245b that moves the drying fluid supply nozzle 245a in the vertical direction; and a vertical movement mechanism unit 245b that moves the drying fluid supply nozzle 245a in the vertical direction. The rocking movement mechanism part 245c rotates in the horizontal direction; the flow rate adjustment part 245d adjusts the flow rate and pressure of the substrate drying fluid; and the temperature adjustment mechanism part 245e adjusts the temperature of the substrate drying fluid. The drying fluid supply nozzle 245a constitutes a substrate processing fluid supply unit. The vertical movement mechanism part 245b and the swing movement mechanism part 245c function as a dry fluid supply nozzle moving mechanism part that moves the relative position of the dry fluid supply nozzle 245a and the surface of the wafer W to be cleaned.

The substrate drying fluid is, for example, IPA vapor and pure water (rinsing liquid). The drying fluid supply nozzle 245a is shown in FIG. 6 . A nozzle for IPA vapor and a nozzle for pure water may also be provided separately. In addition, the substrate drying fluid can also be a liquid, a two-fluid mixture of liquid and gas, or a solid such as dry ice.

The environment detector 244 includes, for example, a temperature detector 244a and a humidity detector 244b. In addition, the environment detector 244 may be equipped with a camera (image detector) that can photograph the surface of the wafer W during the drying process or before and after the drying process.

In the drying process performed by the first and second drying units 24E and 24F, the wafer W is rotated by the substrate rotating mechanism unit 241g while being held by the substrate holding mechanism unit 241e. Then, while the substrate drying fluid is supplied from the drying fluid supply nozzle 245a to the surface to be cleaned of the wafer W, the drying fluid supply nozzle 245a moves to the side edge side (radially outer side) of the wafer W. Then, the wafer W is rotated at high speed by the substrate rotation mechanism unit 241d, thereby drying the wafer W.

In addition, FIGS. 4 to 6 omit the substrate holding mechanism portions 241a, 241c, and 241e, the substrate rotation mechanism portions 241b, 241d, and 241g, the vertical movement mechanism portions 240b, 240e, 241f, 242b, and 245b, the linear movement mechanism portion 240c, and the swing mechanism portion. The specific structure of the moving mechanism parts 240f, 242c, 245c and the cleaning tool rotation mechanism parts 240a and 240d is, for example, a module for generating driving force by appropriately combining a motor, an air cylinder, etc.; a linear guide rail, a ball screw, and a gear. , belts, couplers, bearings and other driving force transmission mechanisms; and linear detectors, encoder detectors, limit detectors, torque detectors and other detectors.

In addition, Figures 4 to 6 omit the specific structure of the flow adjustment portions 243c, 243d, 243g, 243h, and 245d. However, for example, they are modules for regulating fluids by appropriately combining pumps, valves, regulators, etc.; and It is composed of flow detector, pressure detector, liquid level detector and other detectors. Figures 4 to 6 omit the specific structure of the temperature control mechanism portions 242d and 245e. However, for example, a module for adjusting the temperature (contact or non-contact) such as a heater and a heat exchanger is appropriately combined; and temperature detection. It is composed of detectors such as detectors and current detectors. (Film thickness measurement unit)

The film thickness measuring unit 25 is a measuring device for measuring the film thickness of the wafer W before or after the polishing process, and is composed of, for example, an optical film thickness measuring device, an eddy current type film thickness measuring device, etc. . The transfer of wafer W to each film thickness measurement module is performed by a transfer robot 211 . (Substrate processing fluid supply valve)

FIG. 7 is a diagram showing the arrangement of the substrate processing fluid supply valve in the substrate processing fluid supply system. In addition, the tank, pump, motor, etc. are omitted in FIG. 7 .

The grinding fluid supply system 27 supplies grinding fluid from the grinding fluid supply source 270 to the grinding fluid supply nozzle 222 . In the polishing fluid supply system 27, one first polishing fluid supply valve 271 is arranged upstream of all substrate processing apparatuses 2 downstream of one polishing fluid supply source 270, and one second polishing fluid supply valve 272 is arranged A third polishing fluid supply valve 273 is disposed upstream of all polishing fluid supply nozzles 222 downstream of one polishing unit 22 and upstream of all polishing units 22 downstream of one substrate processing apparatus 2 .

In the polishing fluid supply system 27 , the polishing fluid is supplied from the polishing fluid supply source 270 to one or a plurality of substrate processing apparatuses 2 through the first polishing fluid supply valve 271 , and is supplied to one or more substrate processing apparatuses 2 through the second polishing fluid supply valve 272 . Or a plurality of grinding units 22 are supplied to one or a plurality of grinding fluid nozzles 222 through the third grinding fluid supply valve 273, and are discharged from the grinding fluid nozzles 222.

The cleaning fluid supply system 28 supplies cleaning fluid from the cleaning fluid supply source 280 to the cleaning fluid supply nozzle 242a. In the cleaning fluid supply system 28, one first cleaning fluid supply valve 281 is arranged upstream of all substrate processing apparatuses 2 downstream of one cleaning fluid supply source 280, and one second cleaning fluid supply valve 282 is arranged downstream of one cleaning fluid supply source 280. A third cleaning fluid supply valve 283 is disposed between all cleaning fluid supply nozzles 242a downstream of one cleaning unit 24A to 24D and upstream of all cleaning units 24A to 24D of one substrate processing apparatus 2 . upstream.

In the cleaning fluid supply system 28, the cleaning fluid is supplied from the cleaning fluid supply source 280 to one or a plurality of substrate processing apparatuses 2 through the first cleaning fluid supply valve 281, and is supplied to one or more substrate processing apparatuses 2 through the second cleaning fluid supply valve 282. The plurality of cleaning units 24A to 24D are supplied to one or a plurality of cleaning fluid supply nozzles 242a through the third cleaning fluid supply valve 283, and are discharged from the cleaning fluid nozzle 242a.

The drying fluid supply system 29 supplies drying fluid from the drying fluid supply source 290 to the drying fluid supply nozzle 245a. In the drying fluid supply system 29, one first drying fluid supply valve 291 is arranged upstream of all substrate processing apparatuses 2 downstream of one drying fluid supply source 290, and one second drying fluid supply valve 292 is arranged. A third drying fluid supply valve 293 is disposed in all drying fluid supply nozzles 245a downstream of one drying unit 24E, 24F and upstream of all drying units 24E and 24F downstream of one substrate processing apparatus 2. Upstream.

In the drying fluid supply system 29, the drying fluid is supplied from the drying fluid supply source 290 to one or a plurality of substrate processing apparatuses 2 through the first drying fluid supply valve 291, and is supplied to one or a plurality of substrate processing apparatuses 2 through the second drying fluid supply valve 292. The drying units 24E and 24F are supplied to one or a plurality of drying fluid supply nozzles 245a through the third drying fluid supply valve 293, and are discharged from the drying fluid nozzles 245a. (control unit)

FIG. 8 is a block diagram showing an example of the substrate processing apparatus 2. The control unit 26 is electrically connected to each unit 21 to 25, and functions as a control unit that collectively controls each unit 21 to 25. The following description takes the control system (module, detector, sequencer) of the processing unit 24 as an example. However, since the basic structures and functions of the other units 21 to 23 and 25 are also the same, the description is omitted.

The processing unit 24 is provided with: each sub-unit provided in the processing unit 24 (for example, the first and second roller sponge cleaning parts 24A and 24B, the first and second pen-type sponge cleaning parts 24C and 24D, the first and second roller sponge cleaning parts 24C and 24D, etc.). the two drying parts 24E, 24F, the first and second conveying parts 24G, 24H, etc.), and become the plurality of modules 2471~247r that are the control objects; they are respectively arranged in the plurality of modules 2471~247r, and detect and control each module 2471 A plurality of detectors 2481~248s that provide the data (detection values) required by ~247r; and a sequencer 249 that controls the actions of each module 2471~247r based on the detection values of each detector 2481~248s.

The detectors 2481 to 248s of the processing unit 24 include, for example, detection of the supply of the substrate processing fluid to the wafer W from the cleaning fluid supply nozzle 242a or the drying fluid supply nozzle 245a in the substrate processing fluid supply system shown in FIG. 7 a detector for flow rate; and a detector for detecting the supply pressure of the substrate processing fluid supplied from the cleaning fluid supply nozzle 242a or the drying fluid supply nozzle 245a to the wafer W; supplying the fluid to the cleaning fluid supply nozzle 242a or the drying fluid supply nozzle 245a The supply system includes a detector that detects the status of the cleaning fluid supply valves 281 to 283 or the drying fluid supply valves 291 to 293 that adjust the flow rate of the substrate processing fluid connected upstream of the cleaning fluid supply nozzle 242a or the drying fluid supply nozzle 245a. ; The supply system that supplies fluid to the cleaning fluid supply nozzle 242a or the drying fluid supply nozzle 245a includes a cleaning fluid supply valve 281 that adjusts the flow rate of the substrate processing fluid connected upstream of the cleaning fluid supply nozzle 242a or the drying fluid supply nozzle 245a. ~283 or a primary side pressure detector of the dry fluid supply valves 291~293, etc.

The control unit 26 includes a control unit 260, a communication unit 261, an input unit 262, an output unit 263, and a storage unit 264. The control unit 26 is composed of, for example, a general-purpose or special-purpose computer (see FIG. 9 to be described later).

The communication unit 261 is connected to the network 7 and functions as a communication interface for transmitting and receiving various data. The input unit 262 accepts various input operations, and the output unit 263 outputs various information via a display screen, signal tower lighting, and buzzer sound, and functions as a user interface.

The memory unit 264 stores various programs (operating system (OS), application programs, web browsers, etc.) and data (device setting information 265, substrate processing plan information 266, etc.) used when the substrate processing device 2 operates. The device setting information 265 and the substrate processing solution information 266 are data editable by the user through the display screen.

The control unit 260 acquires the plurality of detectors 2181 to 218q, 2281 to 228s, 2381 to 238u, and 2481～ via the plurality of sequencers 219, 229, 239, 249, and 259 (hereinafter referred to as "sequencer group"). 248w, 2581~258y (hereinafter, referred to as "detector group"), and by using a plurality of modules 2171~217p, 2271~227r, 2371~237t, 2471~247v, 2571~257x (hereinafter, referred to as "Module Group") cooperates with the actions to perform a series of substrate processing such as loading, grinding, cleaning, drying, film thickness measurement, and unloading. (Hardware composition of each device)

FIG. 9 is a hardware configuration diagram showing an example of a computer 900. The control unit 26 of the substrate processing device 2, the database device 3, the machine learning device 4, the information processing device 5, and the user terminal device 6 are each configured by a general-purpose or special-purpose computer 900.

As shown in Figure 9, the computer 900 has the following main components: a bus 910, a processor 912, a memory 914, an input device 916, an output device 917, a display device 918, a storage device 920, and a communication I/F (interface) unit. 922. External device I/F unit 924, I/O (input and output) device I/F unit 926, and media input and output unit 928. In addition, the above-mentioned components may be appropriately omitted depending on the purpose of using the computer 900 .

The processor 912 consists of one or a plurality of arithmetic processing devices (CPU (Central Processing Unit), MPU (Micro-processing unit), DSP (Digital Signal Processor)) , GPU (Graphics Processing Unit), etc.) and operates as a control unit that oversees the entire computer 900 . The memory 914 stores various data and programs 930, and is composed of, for example, a volatile memory (DRAM, SRAM, etc.) that functions as a main memory, a non-volatile memory (ROM), a flash memory, etc.

The input device 916 is composed of, for example, a keyboard, a mouse, a numeric keypad, an electronic pen, etc., and functions as an input unit. The output device 917 is composed of, for example, a voice (sound) output device, a vibration device, or the like, and functions as an output unit. The display device 918 is composed of, for example, a liquid crystal display, an organic EL display, electronic paper, a projector, etc., and functions as a display unit. The input device 916 and the display device 918 such as a touch panel display may also be formed integrally. The storage device 920 is composed of, for example, an HDD, an SSD (Solid State Drive), or the like, and functions as a memory unit. The storage device 920 stores various data required for the execution of the operating system and the program 930.

The communication I/F unit 922 is connected to a network 940 such as the Internet and a corporate network through wired or wireless connections (it may also be the same as the network 7 in FIG. 1 ), and functions with other computers according to designated communication specifications. The function of the communication department that transmits and receives data between. The external device I/F unit 924 is connected to external devices 950 such as cameras, printers, scanners, and readers/writers via wires or wirelessly, and transmits and receives data with the external devices 950 according to designated communication specifications. functions of the Communications Department. The I/O device I/F portion 926 is connected to the I/O device 960 of various detectors, actuators, etc., and functions between the I/O device 960 and the I/O device 960, such as detecting signals from the detectors and communicating with the actuators. The function of the communication unit is to control the transmission and reception of various signals and data such as signals. The media input/output unit 928 is composed of a drive device such as a digital disc drive (DVD drive) or a compact disc drive (CD drive), and reads and writes data from a medium (non-volatile storage medium) 970 such as a DVD or CD.

In the computer 900 having the above structure, the processor 912 calls the program 930 stored in the storage device 920 to the memory 914 for execution, and controls various parts of the computer 900 through the bus 910 . In addition, the program 930 can also be stored in the memory 914 instead of the storage device 920 . The program 930 may also be recorded in the media 970 in an installable file format or an executable file format, and provided to the computer 900 through the media input and output unit 928 . The program 930 can also be provided to the computer 900 via the communication I/F unit 922 and by downloading via the network 940. In addition, the computer 900 may also use hardware such as FPGA (Programmable Gate Array) or ASIC (Special Application Integrated Circuit) to implement various functions implemented by the processor 912 executing the program 930.

The computer 900 is, for example, any form of electronic device including a fixed computer or a portable computer. The computer 900 can also be a client computer, a server computer or a cloud computer. The computer 900 can also be applied to devices other than each device 2 to 6. (Production history information 30)

FIG. 10 is a data structure diagram showing an example of production history information 30 managed by the database device 3 . The production history information 30 is a table registered as a table that classifies the reports R obtained when processing the substrate used for this production, and includes, for example: a wafer history table 300 for each wafer W; and a table including polishing processing and processing. The substrate processing fluid supply history table 301 is the device status information in which the substrate processing fluid is being supplied. In addition, the substrate processing fluid supply history table 301 includes a substrate processing fluid supply history table regarding device status information in supplying the substrate processing fluid. In addition, in addition to the above, the production history information 30 also includes an event history table regarding event information, an operation history table regarding operation information, etc., but detailed explanations are omitted.

In each record of the wafer history table 300, for example, the wafer ID, cassette number, lot number, start time and end time of each process, usage unit ID, etc. are registered. In addition, FIG. 10 illustrates the grinding process, the cleaning process, and the drying process, but other processes are also registered in the same manner.

In each record of the substrate processing fluid supply history table 301, for example, the following are registered: wafer ID; supply flow rate information of the substrate processing fluid supplied from the substrate processing fluid supply units 222, 242a, and 245a; Supply pressure information of the substrate processing fluid supplied by 245a; status information of the opening degrees of the substrate processing fluid supply valves 271 to 273, 281 to 283, 291 to 293 that adjust the flow rate of the substrate processing fluid; and adjustment of the flow rate of the substrate processing fluid. Primary side pressure information of substrate processing fluid supply valves 271 to 273, 281 to 283, 291 to 293, etc.

The substrate processing fluid supply flow rate information is information showing the flow rate of the substrate processing fluid supplied from the substrate processing fluid supply units 222, 242a, and 245a during the fluid supply process. The substrate processing fluid supply flow rate information measures the substrate processing fluid supplied to the wafer W from the polishing fluid supply nozzle 222 during the polishing process, the cleaning fluid supply nozzle 242a during the cleaning process, or the drying fluid supply nozzle 245a during the drying process. The detection value of the detector supplying flow, etc.

The substrate processing fluid supply pressure information is information showing the pressure of the substrate processing fluid supplied from the substrate processing fluid supply units 222, 242a, and 245a during the fluid supply process. The substrate processing fluid supply pressure information measures the substrate processing fluid supplied to the wafer W from the polishing fluid supply nozzle 222 during the polishing process, the cleaning fluid supply nozzle 242a during the cleaning process, or the drying fluid supply nozzle 245a during the drying process. The detection value of the supply pressure detector, etc.

The substrate processing fluid supply valve status information is information showing the status of the substrate processing fluid supply valves 271 to 273, 281 to 283, and 291 to 293 that adjust the flow rate of the substrate processing fluid. The substrate processing fluid supply valve status information is measured in a substrate processing fluid supply system that supplies fluid to the polishing fluid supply nozzle 222, the cleaning fluid supply nozzle 242a, or the drying fluid supply nozzle 245a. The measurement is connected to the polishing fluid supply nozzle 222 and the cleaning fluid supply. Upstream of the nozzle 242a or the dry fluid supply nozzle 245a, one of the detectors for the status of the polishing fluid supply valves 271 to 273, the cleaning fluid supply valves 281 to 283, or the dry fluid supply valves 291 to 293 to adjust the flow rate of the substrate processing fluid. Detection values, etc.

The substrate processing fluid supply valve status information includes, for example, substrate processing fluid supply valve opening status information indicating the openings of the substrate processing fluid supply valves 271 to 273, 281 to 283, and 291 to 293; and substrate processing fluid supply valve opening status information indicating the substrate processing fluid supply valves 271 to 273. , at least one of the on-off state information of the substrate processing supply valve in the on-off (open-off) state of 281 to 283 and 291 to 293.

The substrate processing fluid supply valve primary side pressure information displays information on the primary side pressure of the substrate processing fluid supply valves 271 to 273, 281 to 283, and 291 to 293 that adjust the flow rate of the substrate processing fluid. The primary side pressure information of the substrate processing fluid supply valve is measured in the substrate processing fluid supply system that supplies fluid to the polishing fluid supply nozzle 222, the cleaning fluid supply nozzle 242a, or the drying fluid supply nozzle 245a. Detectors for the primary side pressure of the polishing fluid supply valves 271 to 273, the cleaning fluid supply valves 281 to 283, or the drying fluid supply valves 291 to 293 upstream of the fluid supply nozzle 242a or the dry fluid supply nozzle 245a to adjust the flow rate of the substrate processing fluid The detection value, etc.

By referring to the substrate processing fluid supply history table 301, the time series data of each detector (or the time series data of each module) can be extracted as the supply of substrate processing fluid to the wafer W identified by the wafer ID. The device status of the substrate processing device 2. (Substrate processing fluid supply test information 31)

FIG. 11 is a data structure diagram showing an example of substrate processing fluid supply test information 31 managed by the database device 3 . The substrate processing fluid supply test information 31 is configured to classify and register the report R and test results obtained when the substrate processing fluid supply test is performed using the substrate processing fluid supply units 222, 242a, 245a for testing and the substrate processing fluid supply test device. Substrate processing fluid supply test table 310.

Each record in the substrate processing fluid supply test table 310 includes, for example, the registration test ID, substrate processing fluid supply flow rate information, substrate processing fluid supply pressure information, substrate processing fluid supply valve status information, substrate processing fluid supply valve primary side pressure information, and test results. Information, etc. The substrate processing fluid supply flow information, substrate processing fluid supply pressure information, substrate processing fluid supply valve status information, and substrate processing fluid supply valve primary side pressure information of the substrate processing fluid supply test table 310 are displayed in the substrate processing fluid supply test. Since the data structure of the information on the status of each part is the same as that of the substrate processing fluid supply history table 301, detailed description is omitted.

The test result information is information showing the substrate processing fluid supply position when supplying the substrate processing fluid in the substrate processing fluid supply test. The test result information is the measurement value sampled at specified time intervals by the substrate processing fluid supply position measurement equipment using the substrate processing fluid supply unit and the substrate processing fluid supply test device used for testing. The test result information shown in Figure 11 includes the measurement of the substrate processing fluid supply position at each time t1, t2, ..., ...tm, ..., tn during the substrate processing fluid supply period from the start to the end of the substrate processing fluid supply. Value TR1.

To measure the substrate processing fluid supply position, for example, on a virtual polishing table or a virtual wafer with preset coordinates, the fluid is supplied from the substrate processing fluid supply part for testing and the dropped position is measured. In addition, the reference position can also be determined in advance to measure the degree of change from the reference position.

The substrate processing fluid supply unit may be any of a vertical drip type in which the substrate processing fluid falls in a vertical direction, a horizontal injection type in which the substrate processing fluid is ejected in a horizontal direction, or an angle-adjusted injection type in which the substrate processing fluid is ejected by adjusting the angle.

In addition, the test result information as mentioned above can also be based on the measurement result of the substrate processing fluid supply position measurement device, or can also be based on the camera mounted on an optical microscope or a scanning electron microscope (SEM). The substrate processing fluid supply position is photographed at designated time intervals, the image processing results of each of the captured images are processed, and the experimental analysis results are analyzed by the experimenter. In addition, the test result information may be collected by continuously performing one substrate processing fluid supply test from the start to the end of the substrate processing fluid supply, or it may be repeatedly performed by gradually extending the specified time from the start of the substrate processing fluid supply to the end. The substrate processing fluid supply test that reaches the specified time is collected through multiple substrate processing fluid supply tests.

By referring to the substrate processing fluid supply test table 310, in the substrate processing fluid supply test identified by the test ID, it is possible to extract the time showing the substrate processing fluid supply position when the substrate processing fluid supply unit for testing is used to perform the fluid supply process. Sequence data (or time series data for each module), and time series data showing the status of the substrate processing fluid supply unit used for testing at that time. (Mechanical learning device 4)

FIG. 12 is a block diagram showing an example of the machine learning device 4 of the first embodiment. The machine learning device 4 includes a control unit 40 , a communication unit 41 , a learning data storage unit 42 , and a learned model storage unit 43 .

The control unit 40 functions as the learning data acquisition unit 400 and the machine learning unit 401. The communication unit 41 is connected to external devices (for example, the substrate processing device 2 , the database device 3 , the information processing device 5 , the user terminal device 6 , a substrate processing fluid supply test device (not shown), etc.) via the network 7 , which functions as a communication interface for transmitting and receiving various data.

The learning data acquisition unit 400 is connected to an external device via the communication unit 41 and the network 7, and acquires the first learning data composed of substrate processing fluid supply information as input data, and substrate processing fluid supply position information as output data. Information 11A. The first learning data 11A is used to contain teacher data (training data), inspection data and test data for teachers to learn. In addition, the substrate processing fluid supply position information is used as data with answer labels in the teacher's study.

The learning material storage unit 42 is a database that stores the first learning materials 11A acquired by the learning material acquisition unit 400 in a plurality of groups. In addition, the specific structure of the database constituting the learning material storage unit 42 may be appropriately designed.

The machine learning unit 401 performs machine learning using the plurality of sets of first learning materials 11A stored in the learning data storage unit 42 . That is, the machine learning unit 401 inputs the first learning data 11A into the first learning model 10A as a plurality of sets, and causes the first learning model 10A to learn the substrate processing fluid supply information included in the first learning data 11A and The substrate processes the correlation of the fluid supply position information and generates the first learning model 10A upon completion of learning.

The learned model storage unit 43 is a database that stores the learned first learning model 10A (specifically, the adjusted weighted parameter group) generated by the machine learning unit 401 . The learned first learning model 10A stored in the learned model storage unit 43 is provided to the real system (for example, the information processing device 5 ) via the network 7 , a recording medium, and the like. In addition, FIG. 12 shows the learning data storage unit 42 and the learning completed model storage unit 43 as separate storage units. However, these may be configured as a single storage unit.

In addition, the number of the first learning models 10A stored in the learning completed model storage unit 43 is not limited to one, for example, the mechanical learning method, the type of the substrate processing fluid supply units 222, 242a, and 245a, and the substrate processing fluid supply units 222 and 242a. , the structural differences of 245a, the types of data included in the substrate processing fluid supply information, the types of data included in the substrate processing fluid supply position information, etc., and multiple learning models with different conditions can also be memorized. In this case, a plurality of types of learning materials each having a data structure corresponding to a plurality of learning models with different conditions may be stored in the learning material storage unit 42 .

FIG. 13 is an example diagram showing the first learning model 10A and the first learning material 11A. The first learning data 11A used for machine learning of the first learning model 10A is composed of substrate processing fluid supply information and substrate processing fluid supply position information. The first learning model 10A and the first learning material 11A of this embodiment prepare at least the roller sponge cleaning parts 24A and 24B corresponding to the use of the roller sponge 2400, and the pen-type sponge cleaning parts 24C and 24C corresponding to the use of the pen-type sponge 2401. 24D and the three types corresponding to the drying sections 24E and 24F. However, since the basic data structure is the same, they will be described together below.

The substrate processing fluid supply information constituting the first learning data 11A includes: substrate processing fluid supply flow rate information indicating the flow rate of the substrate processing fluid supplied from the substrate processing fluid supply units 222, 242a, and 245a; and substrate processing fluid supply flow information indicating the flow rate of the substrate processing fluid supply unit 245a. Substrate processing fluid supply pressure information of the pressure of the substrate processing fluid supplied by 222, 242a, and 245a.

The substrate processing fluid supply flow rate information included in the substrate processing fluid supply information is information indicating the flow rate of the substrate processing fluid supplied from the substrate processing fluid supply units 222, 242a, and 245a in supplying the substrate processing fluid. The substrate processing fluid supply flow information may be the substrate processing supplied to the wafer W from the polishing fluid supply nozzle 222 in the polishing process, the cleaning fluid supply nozzle 242a in the cleaning process, or the drying fluid supply nozzle 245a in the drying process. Fluid supply flow rate.

The substrate processing fluid supply pressure information included in the substrate processing fluid supply information is information indicating the pressure of the substrate processing fluid supplied from the substrate processing fluid supply units 222, 242a, and 245a in supplying the substrate processing fluid. The substrate processing fluid supply pressure information may be the substrate processing fluid supplied to the wafer W from the polishing fluid supply nozzle 222 in the polishing process, the cleaning fluid supply nozzle 242a in the cleaning process, or the drying fluid supply nozzle 245a in the drying process. supply pressure.

The substrate processing fluid supply valve status information included in the substrate processing fluid supply information is information showing the status of the substrate processing fluid supply valves 271 to 273, 281 to 283, and 291 to 293 that adjust the flow rate of the substrate processing fluid. The substrate processing fluid supply valve status information may be connected to the polishing fluid supply nozzle 222, the cleaning fluid supply nozzle 242a, or the drying fluid supply nozzle 245a in the substrate processing fluid supply system. The status of the polishing fluid supply valves 271 to 273, the cleaning fluid supply valves 281 to 283, or the drying fluid supply valves 291 to 293 upstream of the nozzle 242a or the dry fluid supply nozzle 245a to adjust the flow rate of the substrate processing fluid.

In addition, the substrate processing fluid supply valve status information may be, for example, substrate processing fluid supply valve opening status information that displays the openings of the substrate processing fluid supply valves 271 to 273, 281 to 283, and 291 to 293; and substrate processing fluid supply valve display. At least one of the on-off status information of the substrate processing supply valves 271 to 273, 281 to 283, and 291 to 293 is provided.

The substrate processing fluid supply valve primary side pressure information included in the substrate processing fluid supply information is information indicating the primary side pressure of the substrate processing fluid supply valves 271 to 273, 281 to 283, and 291 to 293 that adjust the flow rate of the substrate processing fluid. The substrate processing fluid supply valve primary side pressure information can be obtained from the substrate processing fluid supply system that supplies fluid to the cleaning fluid supply nozzle 242a or the drying fluid supply nozzle 245a, which is connected upstream of the cleaning fluid supply nozzle 242a or the drying fluid supply nozzle 245a. The primary side pressure of the cleaning fluid supply valves 281 to 283 or the drying fluid supply valves 291 to 293 adjusts the flow rate of the substrate processing fluid.

In addition, the substrate processing fluid supply information may further include in-device environment information indicating the spatial environment in which the substrate processing fluid is supplied. The in-device environment information included in the substrate processing fluid supply information includes the environment information formed by the rack 20 At least one of the temperature and humidity of the internal space. In addition, the substrate processing fluid supply information may further include processing effect information showing the effect of supplying the substrate processing fluid. The processing effect information included in the substrate processing fluid supply information may include, for example, replacement of the substrate processing fluid supply units 222, 242a, and 245a. Then, at least one of the cumulative number of used wafers W and the cumulative usage time when supplying the substrate processing fluid using the substrate processing fluid supply units 222, 242a, and 245a.

The substrate processing fluid supply position information constituting the first learning data 11A shows the supply positions of the fluid supplied from the substrate processing fluid supply units 222, 242a, and 245a when the substrate processing apparatus 2 operates according to the operation state displayed by the substrate processing fluid supply information. information.

The learning data acquisition unit 400 acquires the first learning data 11A by referring to the substrate processing fluid supply test information 31 and accepting the user's input operation through the user terminal device 6 if necessary. For example, the learning data acquisition unit 400 refers to the substrate processing fluid supply test table 310 of the substrate processing fluid supply test information 31 to obtain the substrate processing fluid supply flow rate information and the substrate processing when performing the substrate processing fluid supply test identified by the test ID. The fluid supply pressure information, the substrate processing fluid supply valve status information, and the substrate processing fluid supply valve primary side pressure information are used as the substrate processing fluid supply information.

In addition, this embodiment describes the case where the substrate processing fluid supply information is obtained as time-series data of the detector group as shown in FIG. 13. However, it may be appropriately changed depending on the configuration of the substrate processing fluid supply units 222, 242a, and 245a. . In addition, the substrate processing fluid supply information can also use the command value of the module, can also use parameters converted from the detection value of the detector or the command value of the module, or can also use the detection value of a plurality of detectors. parameters. Furthermore, the substrate processing fluid supply information may be obtained as time series data for the entire supply period of the substrate processing fluid, may be obtained as time series data for a target period that is part of the supply period of the substrate processing fluid, or may be obtained as time series data for the entire supply period of the substrate processing fluid. To obtain the time data of a specific object time. As described above, when changing the definition of the substrate processing fluid supply information, it is only necessary to appropriately change the data structure of the input data in the first learning model 10A and the first learning data 11A.

In addition, the learning data acquisition unit 400 obtains test result information (substrate processing fluid supply) when a substrate processing fluid supply test identified with the same test ID is performed by referring to the substrate processing fluid supply test table 310 of the substrate processing fluid supply test information 31 The time series data of the position measuring device (Fig. 11)) serves as the substrate processing fluid supply position information for the above substrate processing fluid supply information. When the substrate processing fluid supply position measuring device is a measuring device capable of measuring the surface properties of the substrate processing fluid supply parts 222, 242a, and 245a, the learning data acquisition unit 400 obtains the surface properties measurement value as the substrate processing fluid supply position. information.

In addition, this embodiment describes the case where the substrate processing fluid supply position information is as shown in FIG. 13 , but it may also include supplying fluid from the substrate processing fluid supply unit for testing to a virtual polishing table with preset coordinates or Virtual wafer positioner. In addition, the substrate processing fluid supply position information can also be calculated by adding the measurement value of the substrate processing fluid supply position measuring device into a specified calculation formula. Furthermore, when the substrate processing fluid supply information is obtained as time series data for the entire substrate processing fluid supply period or as time series data for a target period that is a part of the substrate processing fluid supply period, the substrate processing fluid supply position information may also be obtained as the entire substrate processing fluid supply period. It can be obtained as time series data of the substrate processing fluid supply period or time series data of the target period. It can also be obtained as time data of the substrate processing fluid supply end time or time data of the target time. In addition, when the substrate processing fluid supply information is acquired as time data at a specific target time, for example, the substrate processing fluid supply position information may also be acquired as time data at the specific target time. As described above, when changing the definition of the substrate processing fluid supply position information, it is only necessary to appropriately change the data structure of the output data in the first learning model 10A and the first learning data 11A.

The first learning model 10A is constructed using a neural network, for example, and includes an input layer 100, an intermediate layer 101, and an output layer 102. Synapses (not shown) connecting each neuron are laid between each layer, and each synapse corresponds to a weighted value. The weighted parameter group composed of the weights of each synapse is adjusted through machine learning.

The input layer 100 has a number of neurons corresponding to the substrate processing fluid supply information as input data, and each value of the substrate processing fluid supply information is input to each neuron. The output layer 102 has a number of neurons corresponding to the substrate processing fluid supply position information as output data, and a prediction result (inference result) of the substrate processing fluid supply position information on the substrate processing fluid supply information is output as the output data.

Then, the error is obtained by comparing the value of each neuron output to the output layer as the inference result with the value of the teacher data corresponding to each output data included in the learning material, and the method is implemented to reduce the error. Adjust the processing corresponding to the weight of each synapse (backward pass).

When the above-mentioned series of processes are repeated a specified number of times, or when the specified learning end condition is satisfied such that the above-mentioned error is smaller than the allowable value, the mechanical learning is ended, and a neural network model that has completed learning is generated (corresponding to the ownership of each synapse value). (machine learning method)

FIG. 14 is a flowchart showing an example of the machine learning method implemented by the machine learning device 4.

First, in step S100 , the learning data acquisition unit 400 acquires a desired number of first learning data 11A from the substrate processing fluid supply test information 31 and the like, and stores the acquired first learning data 11A in the learning data memory. Part 42 serves as a preliminary preparation for starting machine learning. The number of first learning materials 11A to be prepared at this time may be set in consideration of the inference accuracy required for the finally obtained first learning model 10A.

Next, in step S110, the machine learning unit 401 prepares the first learning model 10A before learning in order to start machine learning. The first learning model 10A before learning prepared at this time is composed of a neural network-like model, and the weights of each synapse are set to initial values.

Next, in step S120 , the machine learning unit 401 randomly obtains, for example, one set of first learning materials 11A from the plurality of sets of first learning models 10A stored in the learning data storage unit 42 .

Next, in step S130 , the machine learning unit 401 inputs the substrate processing fluid supply information (input data) included in one set of first learning data 11A into the prepared input of the first learning model 10A before learning (or during learning). Layer 100. As a result, the substrate processing fluid supply position information (output data) is output from the output layer 102 of the first learning model 10A as the inference result. However, the output data is generated by the first learning model 10A before learning (or during learning). By. Therefore, the state before learning (or during learning) is the output data output as the inference result, and displays information different from the substrate processing fluid supply position information (answer label) included in the first learning data 11A.

Next, in step S140, the machine learning unit 401 compares the substrate processing fluid supply position information (answer label) included in the set of first learning data 11A acquired in step S120 with the inference from the output layer in step S130. The substrate processing fluid output as a result supplies position information (output data), and machine learning is performed by performing processing (backward pass) that adjusts the weight of each synapse. Thereby, the machine learning unit 401 causes the first learning model 10A to learn the correlation between the substrate processing fluid supply information and the substrate processing fluid supply position information.

Next, in step S150 , the machine learning unit 401 uses, for example, the error function between the substrate processing fluid supply position information (answer label) included in the first learning data 11A and the state information (output data) output as the inference result. The evaluation value; and the remaining number of unlearned first learning materials 11A stored in the learning material storage unit 42 are used to determine whether the specified learning end condition is satisfied.

In step S150, when the mechanical learning unit 401 determines that the learning end condition is not satisfied and continues mechanical learning (No in step S150), it returns to step S120 and uses the unlearned first learning model 10A. One learning material 11A performs the steps S120 to S140 a plurality of times. In addition, in step S150 , when the machine learning unit 401 determines that the learning end condition is satisfied and ends the machine learning (Yes in step S150 ), the process proceeds to step S160 .

Then, in step S160 , the machine learning unit 401 stores the learned first learning model 10A (the adjusted weighted parameter group) generated by adjusting the weights corresponding to each synapse in the learned model memory unit. 43, and ends the series of machine learning methods shown in Figure 14. In the mechanical learning method, step S100 corresponds to the learning data storage process, steps S110 to S150 correspond to the machine learning process, and step S160 corresponds to the learning completion model storage process.

As described above, when the machine learning device 4 and the machine learning method of this embodiment are used, it is possible to provide information including substrate processing fluid supply flow rate information, substrate processing fluid supply pressure information, substrate processing fluid supply valve status information, and substrate processing fluid supply information. Prediction (inference) of the substrate processing fluid supply information based on the valve primary side pressure information is the first learning model 10A of the substrate processing fluid supply position information showing the supply position of the substrate processing fluid. (Information processing device 5)

FIG. 15 is a block diagram showing an example of the information processing device 5 of the first embodiment. FIG. 16 is a functional explanatory diagram showing an example of the information processing device 5 of the first embodiment. The information processing device 5 includes a control unit 50 , a communication unit 51 , and a learned model storage unit 52 .

The control unit 50 functions as an information acquisition unit 500, a state prediction unit 501, and an output processing unit 502. The communication unit 51 is connected to external devices (for example, the substrate processing device 2, the database device 3, the machine learning device 4, the user terminal device 6, etc.) via the network 7, and functions as a communication interface for transmitting and receiving various data. Function.

The information acquisition unit 500 is connected to an external device via the communication unit 51 and the network 7, and acquires substrate processing fluid supply flow information, substrate processing fluid supply pressure information, substrate processing fluid supply valve status information, and substrate processing fluid supply valve primary side pressure. The information substrate processing fluid supplies the information.

For example, when performing "post prediction processing" of substrate processing fluid supply position information on the wafer W that has been supplied with the substrate processing fluid, the information acquisition unit 500 refers to the substrate processing fluid supply history table of the production history information 30 301. Obtain the substrate processing fluid supply flow rate information, the substrate processing fluid supply pressure information, the substrate processing fluid supply valve status information, and the substrate processing fluid supply valve primary side pressure information when supplying the substrate processing fluid to the wafer W as the substrate. Process fluid supply information.

When "real-time prediction processing" of substrate processing fluid supply position information is performed on the wafer W during which the substrate processing fluid is being supplied, the information acquisition unit 500 receives the information at any time from the substrate processing apparatus 2 that supplies the substrate processing fluid. Regarding the report R of the device status information, the substrate processing fluid supply flow rate information, substrate processing fluid supply pressure information, substrate processing fluid supply valve status information, and substrate processing information during the supply of the substrate processing fluid to the wafer W can be obtained at any time The fluid supply valve primary side pressure information is used as the substrate to process the fluid supply information.

When performing "advance prediction processing" of substrate processing fluid supply position information on the wafer W before the substrate processing fluid is supplied, the information acquisition unit 500 receives the substrate processing plan from the substrate processing apparatus 2 scheduled to supply the substrate processing fluid. information 266, and by simulating the device status information when the substrate processing device 2 operates according to the substrate processing plan information 266, the substrate processing fluid supply flow rate information and the substrate processing fluid supply when supplying the substrate processing fluid to the wafer W are obtained. The pressure information, the substrate processing fluid supply valve status information, and the substrate processing fluid supply valve primary side pressure information are used as the substrate processing fluid supply information.

As described above, the state prediction unit 501 inputs the substrate processing fluid supply information acquired by the information acquisition unit 500 as input data into the first learning model 10A, thereby predicting and displaying the substrate processing fluid supply information displayed by the substrate processing apparatus 2 The substrate processing fluid supply position information of the status of the substrate processing fluid supply units 222, 242a, and 245a when the substrate processing fluid supply units 222, 242a, and 245a are operating.

The learned model storage unit 52 is a database that stores the learned first learning model 10A used by the state prediction unit 501 . In addition, the number of the first learning model 10A stored in the learning completed model storage unit 52 is not limited to one. For example, the method of mechanical learning, the types of the substrate processing fluid supply units 222, 242a, and 245a, the substrate processing fluid supply unit 222, Due to the structural differences between 242a and 245a, the types of data included in the substrate processing fluid supply information, the types of data included in the substrate processing fluid supply position information, etc., multiple learning completion models with different conditions can also be memorized and selectively used. The learning completion model memory unit 52 can also be replaced by the memory unit of an external computer (for example, a server computer or a cloud computer). In this case, the state prediction unit 501 only needs to access the external computer.

The output processing unit 502 performs output processing for outputting the substrate processing fluid supply position information generated by the state prediction unit 501 . For example, the output processing unit 502 may also transmit the substrate processing fluid supply position information to the user terminal device 6, and display a display screen based on the substrate processing fluid supply position information on the user terminal device 6, or may use The substrate processing fluid supply position information is transmitted to the database device 3 , and the substrate processing fluid supply position information is registered in the production history information 30 . (Information processing method)

FIG. 17 is a flowchart showing an example of the information processing method implemented by the information processing device 5 . The following is a description of an operation example when the user operates the user terminal device 6 to perform "post prediction processing" of the substrate processing fluid supply position information on a specific wafer W.

First, in step S200 , when the user inputs the wafer ID of the wafer W to be identified as a prediction target into the user terminal device 6 , the user terminal device 6 transmits the wafer ID to the information processing device 5 .

Next, in step S210, the information acquisition unit 500 of the information processing device 5 receives the wafer ID transmitted in step S200. In step S211, the information acquisition unit 500 refers to the fluid supply history table 301 of the production history information 30 using the wafer ID received in step S210, and obtains the fluid supply to the wafer W identified by the wafer ID. Substrate processing fluid supply information during processing.

Next, in step S220, the state prediction unit 501 inputs the substrate processing fluid supply information acquired in step S211 into the first learning model 10A as input data, and generates substrate processing fluid supply position information for the substrate processing fluid supply information. As output data, the substrate processing fluid supply position is predicted.

Next, in step S230 , the output processing unit 502 transmits the substrate processing fluid supply position information generated in step S220 to the user terminal device 6 as an output process. In addition, in addition to the user terminal device 6 , the transmission object of the substrate processing fluid supply position information may also be the database device 3 or instead of the user terminal device 6 .

Next, in step S240, when the user terminal device 6 receives the substrate processing fluid supply position information transmitted in step S230 in response to the transmission process in step S200, it displays the substrate processing fluid supply position information based on the substrate processing fluid supply position information. The user can recognize the substrate processing fluid supply position information through the screen. In the above information processing method, steps S210 and S211 are equivalent to the information acquisition process, step S220 is equivalent to the state prediction process, and step S230 is equivalent to the output processing process.

As mentioned above, when the information processing device 5 and the information processing method of this embodiment are used, the fluid supply process includes the substrate processing fluid supply flow rate information, the substrate processing fluid supply pressure information, and the substrate processing fluid supply valve status information. , and the substrate processing fluid supply valve primary side pressure information is input into the first learning model 10A to predict the substrate processing fluid supply position information for the substrate processing fluid supply information. Therefore, the processing fluid supply can be appropriately predicted according to the operating state of the substrate processing device 2 Location. (Second implementation form)

The difference between the second embodiment and the first embodiment is that the substrate processing fluid supply position information is substrate processing fluid supply part position and direction information that displays the fluid discharge positions and fluid discharge directions of the substrate processing fluid supply parts 222, 242a, and 245a. . Hereinafter, the differences between the machine learning device 4a and the information processing device 5a of the second embodiment and the first embodiment will be mainly explained.

FIG. 18 is a block diagram showing an example of the machine learning device 4a according to the second embodiment. FIG. 19 is an example diagram showing the second learning model 10B and the second learning material 11B. The second learning data 11B is used for machine learning of the second learning model 10B.

The substrate processing fluid supply position information constituting the second learning data 11B is substrate processing fluid supply part position and direction information showing the positions and directions of the substrate processing fluid supply parts 222, 242a, and 245a. The positions and directions of the substrate processing fluid supply parts 222, 242a, and 245a are defined, for example, by the three-dimensional positions and three-dimensional directions of the substrate processing fluid supply parts 222, 242a, and 245a. In addition, since the substrate processing fluid supply information constituting the second learning data 11B is the same as that in the first embodiment, description thereof is omitted.

When measuring the supply position and direction of the substrate processing fluid, for example, in a virtual space with preset three-dimensional coordinates, the fluid is supplied from a substrate processing fluid supply part such as a nozzle for testing, and the drop on the virtual polishing table is measured. Or the supply position and supply direction of the optimal position of the virtual wafer can be used. The supply position and supply direction of the substrate processing fluid can be measured by measuring the discharge position and discharge direction of the fluid. The discharge direction may be expressed in terms of a three-dimensional angle or the like as the direction of the center line of the discharge port.

In addition, for example, the position where the cross section of the discharge port intersects the center line can be used as the reference position, and the direction of the center line of the discharge port can be used as the reference direction to measure the degree of change in the three-dimensional direction from the reference position and the reference direction.

The substrate processing fluid supply unit may be any of a vertical drip type in which the substrate processing fluid falls in a vertical direction, a horizontal injection type in which the substrate processing fluid is ejected in a horizontal direction, or an angle-adjusted injection type in which the angle is adjusted to eject the substrate processing fluid.

The learning data acquisition unit 400 acquires the second learning data 11B by referring to the substrate processing fluid supply test information 31 and accepting the user's input operation through the user terminal device 6 if necessary. In the substrate processing fluid supply test information 31, for example, when a substrate processing fluid supply unit for testing is used to repeatedly perform a substrate processing fluid supply process as a substrate processing fluid supply test, the discharge ports of the substrate processing fluid supply units 222, 242a, and 245a are registered. The discharge position and discharge direction are used as test result information. Then, the learning data acquisition unit 400 acquires the substrate processing fluid supply by acquiring the test result information when the substrate processing fluid supply test identified by the test ID is performed from the substrate processing fluid supply test table 310 of the substrate processing fluid supply test information 31 Location information.

The machine learning unit 401 inputs a plurality of sets of second learning data 11B into the second learning model 10B, and causes the second learning model 10B to learn the substrate processing fluid supply information and substrate processing fluid supply included in the second learning data 11B. The correlation relationship of the location information is generated to generate a second learning model 10B that has completed learning.

FIG. 20 is a block diagram showing an example of the information processing device 5a functioning as the information processing device 5a of the second embodiment. FIG. 21 is a functional explanatory diagram showing an example of the information processing device 5a according to the second embodiment.

The information acquisition unit 500 acquires the substrate processing fluid including substrate processing fluid supply flow rate information, substrate processing fluid supply pressure information, substrate processing fluid supply valve status information, and substrate processing fluid supply valve primary side pressure information in the same manner as in the first embodiment. Provide information.

As described above, the state prediction unit 501 inputs the substrate processing fluid supply information acquired by the information acquisition unit 500 as input data into the second learning model 10B, thereby predicting the state of the substrate processing apparatus 2 displayed based on the substrate processing fluid supply information. The three-dimensional positions and three-dimensional directions of the substrate processing fluid supply units 222, 242a, and 245a when operating in the operating state serve as the substrate processing fluid supply position and direction information.

As mentioned above, when the information processing device 5a and the information processing method of this embodiment are used, the substrate processing fluid supply process includes the substrate processing fluid supply flow rate information, the substrate processing fluid supply pressure information, and the substrate processing fluid supply valve. The substrate processing fluid supply information of the status information and the substrate processing fluid supply valve primary side pressure information are input to the second learning model 10B to predict the substrate processing fluid supply position and direction information for the substrate processing fluid supply information, so that the substrate processing fluid supply information can be determined according to the substrate processing device 2, the position and direction of the discharge ports of the substrate processing fluid supply parts 222, 242a, and 245a can be appropriately predicted. (Other implementation forms)

The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the gist of the present invention. All of these are included in the technical thinking of the present invention.

The above embodiment illustrates that the database device 3, the machine learning device 4 and the information processing device 5 are each composed of different devices. However, these three devices may also be composed of a single device, or any two of these three devices may be used. A device consists of a single device. In addition, at least one of the machine learning device 4 and the information processing device 5 can also be inserted into the control unit 26 of the substrate processing device 2 or the user terminal device 6 .

The above embodiment describes the substrate processing apparatus 2 as having each of the units 21 to 25. However, the substrate processing apparatus 2 only needs to have the function of supplying the polishing fluid to the wafer W during the polishing process of the polishing unit 22; the processing unit At least one of the function of supplying the cleaning fluid to the wafer W during the cleaning process of 24 and the function of supplying the processing fluid to the wafer W during the drying process of the processing unit 24 is sufficient, and the other units may be omitted.

The above embodiment illustrates the case where the learning model for realizing machine learning by the machine learning unit 401 is a neural network, but other machine learning models may also be used. Other machine learning models include, for example: tree models such as decision trees and regression trees, integrated learning such as bagging and boosting, recurrent neural networks, stacked neural networks, LSTM, etc. Multivariate analysis of clustering types such as neural network type (including deep learning), hierarchical clustering (Clustering), non-hierarchical clustering, k neighbor method, k mean method, etc., principal component analysis, factor analysis, logistic regression, etc. , support vector machine, etc.

The test result information of the above embodiment is displayed on the substrate processing fluid supply position information when the substrate processing fluid is supplied in the substrate processing fluid supply test using a virtual polishing table or a virtual wafer in the test device, but it can also be used as a display Information on the state when the substrate processing fluid is actually supplied to the wafer W is continuously obtained using the actual polishing unit 22 and the processing unit 24 equipped with detectors for detecting the states of the substrate processing fluid supply units 222, 242a, and 245a. The test result information that continues to be obtained continues to be learned through the machine learning device 4.

In addition, in the grinding unit 22 and the processing unit 24 that are not equipped with detectors, the test result information can also be determined by humans at the substrate processing fluid supply position, and the data can be tagged so that it can be continuously obtained.

Furthermore, the actual grinding unit 22 and the processing unit 24 can also be used to upload the continuously acquired information to the cloud. After mechanical learning from the cloud, the learned model is deployed to the substrate processing device 2 . In addition, the processing method may be learned in the substrate processing apparatus 2 without uploading to the cloud. (Machine learning programs and information processing programs)

Each component of the machine learning device 4 of the present invention can also be in the form of a program (machine learning program) that causes the computer 900 to function; and a program (machine learning program) that causes the computer 900 to execute each process included in the machine learning method. supply. In addition, each component of the information processing device 5 of the present invention can also be used for a program (information processing program) that causes the computer 900 to function; and a program (information processing program) for causing the computer 900 to execute each process of the information processing method of the above embodiment. information processing program). (Inference device, inference method and inference program)

The present invention is not limited to the information processing device 5 (information processing method or information processing program) of the above-described embodiment, but can also be used as an inference device (inference method or inference program) for inferring substrate processing fluid supply position information. Provided in the form of. At this time, the inference device (inference method or inference program) includes: a memory, and a processor, where the processor can be a person who executes a series of processes. This so-called series of processes includes: information acquisition processing (information acquisition process) for acquiring substrate processing fluid supply information; acquisition of substrate processing fluid supply information through the information acquisition processing; and inference display that the substrate processing fluid supply information is used by the substrate processing device 2 An inference process (inference process) for the substrate processing fluid supply position information of the substrate processing fluid supply position when the substrate processing fluid supply state is displayed and operated.

By providing it in the form of an inference device (inference method or inference program), it can be applied to various devices more easily than when the information processing device 5 is installed. Those skilled in the art can of course understand that when the inference device (inference method or inference program) infers the substrate processing fluid supply position information, the learning generated by the machine learning device 4 and the machine learning method of the above embodiment can also be used. model to apply the inference method implemented by the state prediction unit 501. [Industrial availability]

The present invention can be used in information processing devices, inference devices, machine learning devices, information processing methods, inference methods, and machine learning methods.

1:Substrate processing system 2:Substrate processing device 3: Database installation 4:4a: Machine learning device 5:5a:Information processing device 6: User terminal device 7:Internet 10A: First learning model 10B: Second learning model 11A: First learning materials 11B: Second study materials 20:Rack 21:Loading/unloading unit 22:Grinding unit 22A～22D: First to fourth grinding sections 23:Substrate transfer unit 24: Processing unit 24A, 24B: The first and second roller sponge cleaning parts 24C, 24D: The first and second pen-type sponge cleaning parts 24E, 24F: The first and second drying sections 24G, 24H: First and second transport departments 25: Film thickness measurement unit 26:Control unit 30:Production history information 31:Substrate processing fluid supply test information 40:Control Department 41:Ministry of Communications 42: Learning materials memory department 43: Learning to complete the model memory department 50:Control Department 51: Ministry of Communications 52: Learning to complete the model memory department 100:Input layer 101:Middle layer 102:Output layer 200A: First dividing wall 200B: Second dividing wall 210A～210D: The first to fourth front loading parts 211:Transport robot 212: Horizontal moving mechanism department 220:Grinding table 220a: Grinding table shaft 220b: Rotary movement mechanism department 220c: Temperature regulating mechanism department 221:Top ring 221a:Top ring shaft 221b: Support shaft 221c: Rotary movement mechanism department 221d: Up and down movement mechanism part 221e: Shake movement mechanism department 222: Polishing fluid supply nozzle (substrate processing fluid supply part) 222a: Support shaft 222b: Shaking moving mechanism part 222c: Flow adjustment part 222d: Temperature regulating mechanism department 223: Dresser 223a: Dresser shaft 223b:Support shaft 223c: Rotary movement mechanism part 223d: Up and down movement mechanism part 223e: Shake movement mechanism department 224:Atomizer 224a: Support shaft 224b: Shaking moving mechanism part 224c: Flow adjustment part 230A, 230B: first and second linear conveyor 231:Swing conveyor 232: Lift 233: temporarily released 240:Substrate cleaning department 240a: Cleaning tool rotating mechanism part 240b: Up and down movement mechanism part 240c:Linear moving mechanism department 241:Substrate holding part 241a:Substrate holding mechanism part 241b:Substrate rotation mechanism part 241c:Substrate holding mechanism part 241d:Substrate rotation mechanism part 241e:Substrate holding mechanism part 241f: Up and down movement mechanism part 241g:Substrate rotating mechanism part 242: Cleaning fluid supply unit (substrate processing fluid supply unit) 242a: Cleaning fluid supply nozzle 242b: Shaking moving mechanism part 242c: Flow adjustment part 242d: Temperature regulating mechanism department 243: Cleaning tool cleaning department 243a: Cleaning tool cleaning tank 243b: Cleaning tool cleaning plate 243c: Flow adjustment part 243d: Flow adjustment department 243e: Cleaning tool cleaning tank 243f: Cleaning tool cleaning plate 243g: Flow adjustment part 244:Environment detector 244a: Temperature detector 244b: Humidity detector 245: Drying fluid supply unit (substrate processing fluid supply unit) 245a: Drying fluid supply nozzle 245b: Up and down movement mechanism part 245c: Shaking moving mechanism part 245d: Flow adjustment part 245e: Temperature regulating mechanism department 246A:The first transport robot 246B: Second transfer robot 2471～247r:Module 2481～248s: Detector 260:Control Department 261: Ministry of Communications 262:Input part 263:Output Department 264:Memory Department 265:Device setting information 266:Substrate processing solution information 219:229:239:249:259:Sequencer 271～273: Grinding fluid supply valve 281～283: Cleaning fluid supply valve 291～293: Drying fluid supply valve 2181～218q:2281～228s:2381～238u:2481～248w:2581～258y: detector 2171～217p:2271～227r:2371～237t:2471～247v:2571～257x:module 300:Wafer history 301:Substrate processing fluid supply history 310: Substrate Processing Fluid Supply Test Chart 400: Learning materials acquisition department 401: Machine Learning Department 500:Information Acquisition Department 501: Status prediction department 502: Output processing department 900:Computer 910:Bus 912: Processor 914:Memory 916:Input device 917:Output device 918:Display device 920:Storage device 922: Communication I/F (Interface) Department 924: External device I/F part 926: I/O (input and output) device I/F section 928:Media input and output department 930:Program 940:Internet 950:External device 960:I/O device 970:Media 2200: Polishing pad 2230:Trimming disk 2400:Roller sponge 2401: Pen type sponge TP1～TP7: 1st to 7th transfer position W:wafer

FIG. 1 is an overall structural diagram showing an example of the substrate processing system 1. FIG. 2 is a top view showing an example of the substrate processing apparatus 2. FIG. 3 is a perspective view showing an example of the first to fourth polishing parts 22A to 22D. FIG. 4 is a perspective view showing an example of the first and second roller sponge cleaning parts 24A and 24B. FIG. 5 is a perspective view showing an example of the first and second pen-type sponge cleaning parts 24C and 24D. FIG. 6 is a perspective view showing an example of the first and second drying sections 24E and 24F. FIG. 7 is a diagram showing the arrangement of the substrate processing fluid supply valve in the substrate processing fluid supply system. FIG. 8 is a block diagram showing an example of the substrate processing apparatus 2. FIG. 9 is a hardware configuration diagram showing an example of a computer 900. FIG. 10 is a data structure diagram showing an example of production history information 30 managed by the database device 3 . FIG. 11 is a data structure diagram showing an example of the processing test information 31 managed by the database device 3. FIG. 12 is a block diagram showing an example of the machine learning device 4 of the first embodiment. FIG. 13 is an example diagram showing the first learning model 10A and the first learning material 11A. FIG. 14 is a flowchart showing an example of the machine learning method implemented by the machine learning device 4. FIG. 15 is a block diagram showing an example of the information processing device 5 of the first embodiment. FIG. 16 is a functional explanatory diagram showing an example of the information processing device 5 of the first embodiment. FIG. 17 is a flowchart showing an example of the information processing method implemented by the information processing device 5 . FIG. 18 is a block diagram showing an example of the machine learning device 4a according to the second embodiment. FIG. 19 is an example diagram showing the second learning model 10B and the second learning material 11B. FIG. 20 is a block diagram showing an example of the information processing device 5a functioning as the information processing device 5a of the second embodiment. FIG. 21 is a functional explanatory diagram showing an example of the information processing device 5a according to the second embodiment.

5:Information processing device

10A: First learning model

500:Information Acquisition Department

501: Status prediction department

Claims (15)

An information processing device having: The information acquisition unit acquires the substrate processing shown in the substrate processing performed by the substrate processing apparatus provided with one or a plurality of substrate processing fluid supply units for supplying processing fluid to the substrate supplied from the substrate processing fluid supply unit. The substrate processing fluid supply status information of the fluid supply status is the substrate processing fluid supply information; and The state prediction unit learns the substrate processing fluid supply information through machine learning and the substrate processing fluid supply position information indicating the supply position of the fluid supplied by the substrate processing fluid supply unit when the substrate processing apparatus operates. In the learning model of the correlation, the substrate processing fluid supply information obtained by the information acquisition unit is input to predict the substrate processing fluid supply position information for the substrate processing fluid supply information. The information processing device of claim 1, wherein the substrate processing fluid supply status information included in the substrate processing fluid supply information includes at least one of the following: Substrate processing fluid supply flow rate information showing the supply flow rate of the substrate processing fluid before it is supplied from the substrate processing fluid supply part to the substrate; and The substrate processing fluid supply pressure information displays the supply pressure of the substrate processing fluid before it is supplied from the substrate processing fluid supply unit to the substrate. The information processing device of claim 1 or 2, wherein the substrate processing fluid supply information further includes substrate processing fluid supply valve status information, which is connected to the substrate processing system in a supply system that supplies fluid to the substrate processing fluid supply unit. Upstream of the fluid supply unit, the state of the substrate processing fluid supply valve that adjusts the flow rate of the substrate processing fluid is obtained. The information processing device of claim 3, wherein the substrate processing fluid supply valve status information includes at least one of the following: Substrate processing fluid supply valve opening status information, which displays the opening of the aforementioned substrate processing fluid supply valve; and The substrate processing fluid supply valve on-off status information displays the on-off status of the substrate processing fluid supply valve. The information processing device of claim 1, wherein the substrate processing fluid supply information further includes substrate processing fluid supply valve primary side pressure information, which is connected to the substrate processing system in a supply system that supplies fluid to the substrate processing fluid supply unit. Upstream of the fluid supply part, the primary side pressure of the substrate processing fluid supply valve that adjusts the flow rate of the substrate processing fluid is obtained. The information processing device of claim 3, wherein the substrate processing device has one or a plurality of units, each of which has one or a plurality of the substrate processing fluid supply parts, In the supply system for supplying fluid to the substrate processing fluid supply unit, the substrate processing fluid supply valve is provided upstream of all the substrate processing fluid supply units in one unit. The information processing apparatus according to claim 3, wherein in the supply system for supplying fluid to the substrate processing fluid supply unit, the substrate processing fluid supply valve is provided upstream of all the units in the substrate processing apparatus. The information processing device of claim 3, wherein in a substrate processing system equipped with one or a plurality of the aforementioned substrate processing devices, In the supply system for supplying fluid to the substrate processing fluid supply unit, the substrate processing fluid supply valve is provided upstream of one of all the substrate processing devices in the substrate processing system. The information processing device of claim 1, wherein the substrate processing fluid supply position information includes at least one of the following: position information set on the coordinates of the aforementioned substrate, and Information on the degree of change of the preset reference position. The information processing device of claim 1, wherein the substrate processing fluid supply position information includes substrate processing fluid supply part position and direction information, which indicates the fluid discharge position and fluid discharge direction of the substrate processing fluid supply part. An inference device having: a memory, and a processor, The above-mentioned processor is in an operating state when a substrate processing apparatus having one or a plurality of substrate processing fluid supply units for supplying processing fluid to a substrate is in operation, and executes: Information acquisition processing for acquiring substrate processing fluid supply status information including a supply status of the substrate processing fluid supplied from the substrate processing fluid supply unit; and An inference process that, when the substrate processing fluid supply information is obtained through the information acquisition process, infers that the substrate processing apparatus displays the supply state of the substrate processing fluid by using the substrate processing fluid supply information to process the substrate processing fluid. The substrate processing fluid supply position information of the supply position of the fluid supplied by the supply unit. A machine learning device having: A learning data storage unit that stores a plurality of sets of learning data that are processed by a substrate processing apparatus having a substrate processing fluid supply unit that supplies a substrate cleaning fluid to the substrate, including Substrate processing fluid supply information indicating the supply status of the substrate processing fluid supplied from the substrate processing fluid supply unit; and displaying the substrate processing fluid supply information displayed by the substrate processing apparatus using the substrate processing fluid supply information. The substrate processing fluid supply position information of the supply position of the fluid supplied by the aforementioned substrate processing fluid supply unit during processing is configured in the supply state; A mechanical learning unit that causes the learning model to learn the correlation between the substrate processing fluid supply information and the substrate processing fluid supply position information by inputting a plurality of sets of the learning data into the learning model; and The learning completion model memory unit memorizes the aforementioned learning model that learned the aforementioned correlation through the aforementioned mechanical learning unit. An information processing method that has: The information acquisition step is to acquire information indicating the substrate processing fluid supplied from the substrate processing fluid supply unit during processing of the substrate by a substrate processing apparatus having a substrate processing fluid supply unit that supplies a substrate cleaning fluid to the substrate. substrate processing fluid supply information of supply status of substrate processing fluid supply status information; and The state prediction process is performed by learning the substrate processing fluid supply information through machine learning and displaying the substrate processing fluid supply state using the substrate processing fluid supply information with the substrate processing apparatus while processing the substrate. In the learning model of the correlation between the supply position of the fluid supplied by the processing fluid supply unit and the substrate processing fluid supply position information, the substrate processing fluid supply information acquired in the above information acquisition step is input to predict the supply of the substrate processing fluid. Information about substrate processing fluid supply location information. An inference method that is executed by an inference device having: a memory and a processor, The aforementioned processor executes: The information acquisition step is to acquire information indicating the substrate processing fluid supplied from the substrate processing fluid supply unit during processing of the substrate by a substrate processing apparatus having a substrate processing fluid supply unit that supplies a substrate cleaning fluid to the substrate. substrate processing fluid supply information of supply status of substrate processing fluid supply status information; and An inference step in which, when the substrate processing fluid supply information is obtained through the information acquisition step, the substrate processing fluid is inferred and displayed when the substrate processing fluid supply information is displayed by the substrate processing fluid supply information, and the substrate processing fluid is processed. The substrate processing fluid supply position information of the supply position of the fluid supplied by the supply unit. A machine learning method that has: The learning data storage step is to store a plurality of sets of learning data in a learning data storage unit, and the learning data is performed by a substrate processing device having a cleaning fluid supply unit that supplies a substrate cleaning fluid to the substrate. In the processing of the substrate, the substrate processing fluid supply information includes substrate processing fluid supply status information indicating the supply status of the substrate processing fluid supplied from the substrate processing fluid supply unit; and displaying the substrate processing fluid supply information displayed by the substrate processing device. It is composed of substrate processing fluid supply position information of a supply position of the fluid supplied by the substrate processing fluid supply unit during processing in the supply state of the substrate processing fluid; A mechanical learning process that causes the learning model to learn the correlation between the substrate processing fluid supply information and the substrate processing fluid supply position information by inputting a plurality of sets of the learning data into the learning model; and The learning completion model memory process memorizes the learning model that has learned the aforementioned correlation through the aforementioned mechanical learning process in the learning completion model memory unit.