TW202347082A - Electronic device - Google Patents
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- TW202347082A TW202347082A TW111118426A TW111118426A TW202347082A TW 202347082 A TW202347082 A TW 202347082A TW 111118426 A TW111118426 A TW 111118426A TW 111118426 A TW111118426 A TW 111118426A TW 202347082 A TW202347082 A TW 202347082A
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- 230000017525 heat dissipation Effects 0.000 claims description 44
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Abstract
Description
本發明是有關於一種電子裝置,且特別是有關於一種具備高散熱效率的電子裝置。The present invention relates to an electronic device, and in particular, to an electronic device with high heat dissipation efficiency.
現有的筆記型電腦,其包括主機及顯示機體,顯示機體為樞接於主體,且適於切換為閉合狀態以縮小體積或是切換為展開狀態,將顯示機體展開於主機。由於現有的筆記型電腦朝薄型化發展,因此筆記型電腦內部的散熱空間也隨之縮小,現今的改善方案是在主機外圍設置連通內部的散熱開口,然而部份散熱開口會被顯示機體所阻擋,造成部份熱空氣的回流而導致散熱效率的下滑。Existing notebook computers include a host computer and a display body. The display body is pivotally connected to the main body and is adapted to be switched to a closed state to reduce the size or to an expanded state to deploy the display body on the host computer. As existing notebook computers are becoming thinner, the heat dissipation space inside the notebook computer has also been reduced. The current improvement plan is to set up heat dissipation openings on the periphery of the host that connect to the inside. However, some of the heat dissipation openings will be blocked by the display body. , causing the backflow of some hot air and resulting in a decline in heat dissipation efficiency.
此外,現有筆記型電腦在展開狀態下,其主機仍與水平面貼齊,此不利於散熱,因此發展出高散熱效率的筆記型電腦即成為重要的發展目標。In addition, when an existing notebook computer is in an unfolded state, its main body is still flush with the horizontal surface, which is not conducive to heat dissipation. Therefore, developing a notebook computer with high heat dissipation efficiency has become an important development goal.
本發明提供一種電子裝置,在展開狀態下,能抬升電子裝置相對於平面的高度且電子裝置的機體將形成散熱孔,藉此提升電子裝置的散熱效率。The present invention provides an electronic device that, in an unfolded state, can raise the height of the electronic device relative to a plane and form heat dissipation holes on the body of the electronic device, thereby improving the heat dissipation efficiency of the electronic device.
本發明的電子裝置,包括一第一機體、一第二機體、一樞軸模組、一蓋體以及一支撐板。第一機體具有一內部空間及一出風口,出風口連通內部空間。第二機體可轉動地連接第一機體。樞軸模組具有一第一端及一第二端。第一端樞接於第一機體且第二端連接於第二機體。蓋體可滑動地配置於第二機體。支撐板可轉動地連接蓋體且可滑動地連接樞軸模組。當第一機體與第二機體相互展開時,支撐板沿著樞軸模組移動以突出於第一機體,且支撐板帶動蓋體沿著第二機體移動以形成一散熱孔。The electronic device of the present invention includes a first body, a second body, a pivot module, a cover and a support plate. The first body has an internal space and an air outlet, and the air outlet is connected to the internal space. The second body is rotatably connected to the first body. The pivot module has a first end and a second end. The first end is pivotally connected to the first body and the second end is connected to the second body. The cover is slidably disposed on the second body. The support plate is rotatably connected to the cover and slidably connected to the pivot module. When the first body and the second body unfold each other, the support plate moves along the pivot module to protrude from the first body, and the support plate drives the cover to move along the second body to form a heat dissipation hole.
在本發明的一實施例中,上述的樞軸模組具有一滑槽,支撐板具有一滑動柱,滑動柱穿設於滑槽且適於沿著滑槽中往復移動,以改變蓋體與支撐板之間的一第一夾角。In one embodiment of the present invention, the above-mentioned pivot module has a slide groove, and the support plate has a sliding column. The sliding column penetrates the slide groove and is suitable for reciprocating along the slide groove to change the relationship between the cover and the cover. A first included angle between the support plates.
在本發明的一實施例中,上述的樞軸模組具有一轉軸、一主齒輪、一第一從動齒輪以及一第二從動齒輪,轉軸樞接於第一機體,主齒輪固設於轉軸,第一從動齒輪樞接於樞軸模組中且嚙合於主齒輪,第二從動齒輪嚙合於第一從動齒輪且靠近樞軸模組的第二端。In one embodiment of the present invention, the above-mentioned pivot module has a rotating shaft, a main gear, a first driven gear and a second driven gear. The rotating shaft is pivotally connected to the first body, and the main gear is fixed on On the rotating shaft, the first driven gear is pivotally connected in the pivot module and meshes with the main gear, and the second driven gear meshes with the first driven gear and is close to the second end of the pivot module.
在本發明的一實施例中,還包括一齒條,配置在樞軸模組中且齒條的一端固接滑動柱,第二從動齒輪嚙合齒條的另一端,齒條的延伸方向平行於滑槽的延伸方向。In one embodiment of the present invention, a rack is also included, which is arranged in the pivot module and one end of the rack is fixed to the sliding column. The second driven gear meshes with the other end of the rack, and the extending direction of the rack is parallel. in the extending direction of the chute.
在本發明的一實施例中,當第二機體帶動樞軸模組的第一端相對第一機體旋轉時,主齒輪固定不動,第一從動齒輪朝第一旋轉方向轉動,第二從動齒輪朝相反於第一旋轉方向的一第二旋轉方向轉動,以帶動齒條及滑動柱沿著滑槽朝向第二機體移動。In an embodiment of the present invention, when the second body drives the first end of the pivot module to rotate relative to the first body, the main gear is stationary, the first driven gear rotates in the first rotation direction, and the second driven gear rotates in the first rotation direction. The gear rotates in a second rotation direction opposite to the first rotation direction to drive the rack and the sliding column to move along the chute toward the second body.
在本發明的一實施例中,更包括一彈性層,位在第一機體與第二機體之間,彈性層的一第一側連接於蓋體的一邊緣,彈性層的一第二側連接於出風口的一出口邊緣。In an embodiment of the present invention, it further includes an elastic layer located between the first body and the second body. A first side of the elastic layer is connected to an edge of the cover, and a second side of the elastic layer is connected to At the edge of an outlet of the air outlet.
在本發明的一實施例中,當第一機體與第二機體相互展開時,蓋體帶動彈性層的第一側於散熱孔中移動,以收縮彈性層並釋放彈力,使得出風口與散熱孔相互連通。In an embodiment of the present invention, when the first body and the second body unfold each other, the cover drives the first side of the elastic layer to move in the heat dissipation hole to shrink the elastic layer and release the elastic force, so that the air outlet and the heat dissipation hole are interconnected.
在本發明的一實施例中,當第一機體與第二機體相互閉合時,蓋體收納於第二機體並帶動彈性層的第一側於散熱孔中移動,以拉伸彈性層並蓄積彈力,使得支撐板覆蓋第一機體及第二機體的後端。In one embodiment of the invention, when the first body and the second body are closed to each other, the cover is received in the second body and drives the first side of the elastic layer to move in the heat dissipation hole to stretch the elastic layer and accumulate elastic force. , so that the support plate covers the rear ends of the first body and the second body.
在本發明的一實施例中,上述的第二機體具有一滑軌,蓋體可滑動地配置於滑軌而適於相對第二機體移動,以密合第二機體或形成散熱孔。In one embodiment of the present invention, the above-mentioned second body has a slide rail, and the cover is slidably disposed on the slide rail and is adapted to move relative to the second body to closely fit the second body or form a heat dissipation hole.
在本發明的一實施例中,在展開狀態下,第一機體與第二機體之間具有一第二夾角,且第二夾角的角度與第一夾角的角度成反比,支撐板與第一機體之間存在一間距。In an embodiment of the present invention, in the unfolded state, there is a second included angle between the first body and the second body, and the angle of the second included angle is inversely proportional to the angle of the first included angle, and the support plate and the first body There is a gap between them.
在本發明的一實施例中,上述的蓋體具有第一轉動部,支撐板具有一第二轉動部,第一轉動部與第二轉動部相互樞接。In an embodiment of the present invention, the above-mentioned cover has a first rotating part, the support plate has a second rotating part, and the first rotating part and the second rotating part are pivotally connected to each other.
基於上述,本發明的電子裝置,在第一機體與第二機體透過樞軸模組相互展開時,支撐板將沿著樞軸模組移動以突出於第一機體,用以抬升第一機體相對於平面的高度,使得環境中的空氣可分佈在第一機體與平面之間,同時支撐板也同步帶動蓋體沿著第二機體移動,使得第二機體形成散熱孔,連通於第一機體的內部空間,則第一機體中的熱空氣可經由出風口及散熱孔而流動至環境中,以達成散熱功效。Based on the above, in the electronic device of the present invention, when the first body and the second body are unfolded to each other through the pivot module, the support plate will move along the pivot module to protrude from the first body to lift the first body relative to the first body. The height of the plane allows the air in the environment to be distributed between the first body and the plane. At the same time, the support plate also drives the cover to move along the second body simultaneously, so that the second body forms a heat dissipation hole connected to the first body. In the internal space, the hot air in the first body can flow to the environment through the air outlet and the heat dissipation hole to achieve the heat dissipation effect.
進一步而言,散熱孔尺寸與抬升高度取決於第一機體與第二機體之間的角度變化,故本發明的電子裝置具備動態調整散熱孔及抬升高度的功效,此適用於各類使用情境的需求。Furthermore, the size and elevation of the heat dissipation holes depend on the angle change between the first body and the second body. Therefore, the electronic device of the present invention has the function of dynamically adjusting the heat dissipation holes and the elevation, which is suitable for various usage scenarios. need.
圖1A是本發明一實施例的電子裝置的折疊狀態立體示意圖。圖1B是圖1A的電子裝置的立體剖面示意圖。圖1C是圖1A的電子裝置的展開狀態立體示意圖。圖1D是圖1C的電子裝置的立體剖面示意圖。圖1E是圖1A的電子裝置另一角度的部份放大立體示意圖。圖1F是圖1C的電子裝置另一角度的部份放大立體示意圖。1A is a perspective view of an electronic device in a folded state according to an embodiment of the present invention. FIG. 1B is a schematic perspective cross-sectional view of the electronic device of FIG. 1A . FIG. 1C is a schematic perspective view of the electronic device in FIG. 1A in an unfolded state. FIG. 1D is a schematic perspective cross-sectional view of the electronic device of FIG. 1C . FIG. 1E is a partially enlarged perspective view of the electronic device of FIG. 1A from another angle. FIG. 1F is a partially enlarged perspective view of the electronic device of FIG. 1C from another angle.
參考圖1A及圖1C,本發明的電子裝置100例如是筆記型電腦。電子裝置100適於切換為折疊狀態或展開狀態,在電子裝置100切換為折疊狀態後,適於縮減整體體積尺寸而利於收納及攜帶,在電子裝置100切換為展開狀態後,使顯示螢幕展開於主機,使用者透過鍵盤機體輸入指令、編輯文字或編寫程式,且顯示機體輸出相應的影音資訊。Referring to FIG. 1A and FIG. 1C , the
參考圖1A至圖1D,電子裝置100包括一第一機體110、一第二機體120、一樞軸模組130、一蓋體140以及一支撐板150。Referring to FIGS. 1A to 1D , the
第一機體110為主機且具有一內部空間IS及一出風口OT,出風口OT連通內部空間IS,其中內部空間IS用於安裝中央處理器、硬碟、記憶體、顯示晶片以及主機板等相關電子零件。第二機體120為顯示螢幕且可轉動地連接第一機體110,其中第二機體120亦可採用觸控面板,故具備觸控及顯示功能。The
圖2A至圖2C是圖1A電子裝置於展開過程的剖面動作示意圖。2A to 2C are schematic cross-sectional views of the electronic device in FIG. 1A during the unfolding process.
參考圖1E、圖1F及圖2A,樞軸模組130具有一第一端E1及相對於第一端E1的一第二端E2。第一端E1樞接於第一機體110且第二端E2連接於第二機體120。Referring to FIGS. 1E , 1F and 2A , the
參考圖1A、圖1B及圖1D,蓋體140可滑動地配置於第二機體120的後端中央處。支撐板150可轉動地連接蓋體140且可滑動地連接樞軸模組130。參考圖2A至圖2C,當第一機體110與第二機體120相互展開時,支撐板150沿著樞軸模組130移動以突出於第一機體110,且支撐板150帶動蓋體140沿著第二機體120移動以形成一散熱孔121。Referring to FIGS. 1A , 1B and 1D , the
參考圖1B及圖1D,第二機體120具有一滑軌122,蓋體140可滑動地配置於第二機體120的滑軌122而適於相對第二機體120移動,以密合第二機體120或形成散熱孔121,即蓋體140是沿著滑軌122移動。1B and 1D, the
參考圖1E、圖1F及圖2A至圖2C,樞軸模組130具有一滑槽SG,支撐板150具有一滑動柱151。滑動柱151穿設於滑槽SG且適於沿著滑槽SG中往復移動,以改變蓋體140與支撐板150之間的一第一夾角A1。Referring to FIGS. 1E, 1F and 2A to 2C, the
參考圖1D至圖1F,蓋體140具有第一轉動部141,支撐板150具有一第二轉動部152,第一轉動部141與第二轉動部152相互樞接,因此蓋體140與支撐板150以第一轉動部141及第二轉動部152為中心相對樞轉。1D to 1F, the
參考圖1A、圖1B及圖2A,在折疊狀態下,第一機體110與第二機體120相互平行且交疊,樞軸模組130的第二端E2位在第一端E1上方,支撐板150在水平方向PD上覆蓋第一機體110的出風口OT、第二機體120及樞軸模組130,以達成美化外觀的功效。Referring to Figures 1A, 1B and 2A, in the folded state, the
參考圖2B及圖2C,在展開狀態下,第一機體110與第二機體120之間具有一第二夾角A2,且第二夾角A2的角度與第一夾角A1的角度成反比,即第一機體110與第二機體120之間的第二夾角A2越大,蓋體140與支撐板150之間的第一夾角A1越小,反之亦然。同時,樞軸模組130帶動支撐板150突伸於第一機體110的底部,支撐板150與第一機體110之間存在一間距D。參考圖2A至圖2B,當第二夾角A2為90度時,間距D為最大。Referring to FIG. 2B and FIG. 2C , in the unfolded state, there is a second included angle A2 between the
進一步而言,參考圖2A至圖2C,在圖2B所示的展開狀態下,第一機體110與第二機體120之間的第二夾角A2為90度且蓋體140與支撐板150之間的一第一夾角A1約為36度,散熱孔121對位於出風口OT。在圖2C所示的展開狀態下,第一機體110與第二機體120之間的一第二夾角A2大於130度且蓋體140與支撐板150之間的第一夾角A1約為17.4度,散熱孔121部份位在出風口OT的下方。本實施例的角度皆可依設計所需而調整,本案不加以限制。Further, referring to FIGS. 2A to 2C , in the unfolded state shown in FIG. 2B , the second included angle A2 between the
進一步而言,參考圖2B及圖2C,散熱孔121連通第一機體110的內部空間IS及出風口OT,因此內部空間IS中的熱空氣HA自出風口OT流動至散熱孔121,且環境中的冷空氣CA自散熱孔121及出風口OT流入內部空間IS,達成熱交換的功效,藉此提升第一機體110的內部空間IS中的散熱效率。此外支撐板150與第一機體110之間存在間距D,以此抬升第一機體110相對於平面的高度,使得環境中的冷空氣CA亦可分佈在第一機體110的底部,藉此提升第一機體110底部的散熱效率。Further, referring to FIG. 2B and FIG. 2C , the
圖3A是圖1A的電子裝置的折疊狀態部份元件透視圖。圖3B是圖1C的電子裝置的展開狀態部份元件透視圖。圖4A至圖4C是圖1A的電子裝置於展開過程中的樞軸模組、背蓋及支撐板的動作示意圖。FIG. 3A is a perspective view of some components of the electronic device of FIG. 1A in a folded state. FIG. 3B is a perspective view of some components of the electronic device of FIG. 1C in an unfolded state. 4A to 4C are schematic diagrams of the movement of the pivot module, the back cover and the support plate of the electronic device in FIG. 1A during the unfolding process.
參考圖3A、圖3B及圖4A,樞軸模組130具有一轉軸131、一主齒輪132、一第一從動齒輪133、一第二從動齒輪134、一第一支架135以及一第二支架136。轉軸131樞接於第一機體110以及樞軸模組130的外殼H,主齒輪132固設於轉軸131的一側且位於樞軸模組130的外殼H內,第一從動齒輪133樞接於樞軸模組130的外殼H中且嚙合於主齒輪132,第二從動齒輪134嚙合於第一從動齒輪133且靠近樞軸模組130的第二端E2。第一支架135成形在轉軸131相對於主齒輪132的另一側且第一支架135連接第一機體110。第二支架136連接第二機體120且隨著樞軸模組130的外殼H產生轉動。Referring to Figures 3A, 3B and 4A, the
電子裝置100更包括一齒條160,配置在樞軸模組130的外殼H中且齒條160的一端固接支撐板150的滑動柱151,第二從動齒輪134嚙合齒條160的另一端,齒條160的延伸方向平行於滑槽SG的延伸方向。The
參考圖4A至圖4C,當第二機體120展開於第一機體110時,第二機體120透過第二支架136帶動樞軸模組130的第一端E1相對第一機體110旋轉,樞軸模組130的外殼H以轉軸131為中心樞轉,主齒輪132為固定不動,第一從動齒輪133受到外殼H的帶動而沿著主齒輪132朝第一旋轉方向T1轉動,第二從動齒輪134受到第一從動齒輪133帶動而朝相反於第一旋轉方向T1的一第二旋轉方向T2轉動,同時,第二從動齒輪134藉以帶動齒條160及滑動柱151沿著滑槽SG朝向第二機體120移動(見圖3B)。Referring to FIGS. 4A to 4C , when the
參考圖4C至圖4A,反之,當第二機體120折疊於第一機體110時,第二機體120透過第二支架136帶動樞軸模組130的第一端E1相對第一機體110旋轉,樞軸模組130的外殼H以轉軸131為中心樞轉,主齒輪132為固定不動,第一從動齒輪133受到外殼H的帶動而沿著主齒輪132朝第二旋轉方向T2轉動,第二從動齒輪134受到第一從動齒輪133帶動而朝第一旋轉方向T1轉動,同時,第二從動齒輪134藉以帶動齒條160及滑動柱151沿著滑槽SG逐漸遠離第二機體120(見圖3A)。Referring to FIGS. 4C to 4A , on the contrary, when the
參考圖2A至圖2C,電子裝置100更包括一彈性層170,位在第一機體110與第二機體120之間。彈性層170的一第一側S1連接於蓋體140的一邊緣,彈性層170的一第二側S2連接於第一機體110的出風口OT的一出口邊緣。補充而言,彈性層170適於輔助帶動蓋體140沿著第二機體120的滑軌122滑動。Referring to FIGS. 2A to 2C , the
參考圖2B及圖2C,當第一機體110與第二機體120相互展開時,蓋體140帶動彈性層170的第一側S1於散熱孔121中移動,以收縮彈性層170並釋放彈力,使得出風口OT與散熱孔121相互連通。參考圖2A,當第一機體110與第二機體120相互閉合時,蓋體140收納於第二機體120的散熱孔121中並帶動彈性層170的第一側S1於散熱孔121中移動,以拉伸彈性層170並蓄積彈力,使得支撐板150覆蓋第一機體110及第二機體120的後端。Referring to FIG. 2B and FIG. 2C , when the
綜上所述,本發明的電子裝置,在第一機體與第二機體透過樞軸模組相互展開時,支撐板將沿著樞軸模組移動以突出於第一機體,用以抬升第一機體相對於平面的高度,使得環境中的空氣可分佈在第一機體與平面之間,同時支撐板也同步帶動蓋體沿著第二機體移動,使得第二機體形成散熱孔,連通於第一機體的內部空間,則第一機體中的熱空氣可經由風口及散熱孔而流動至環境中,以達成散熱功效。To sum up, in the electronic device of the present invention, when the first body and the second body are unfolded to each other through the pivot module, the support plate will move along the pivot module to protrude from the first body to lift the first body. The height of the body relative to the plane allows the air in the environment to be distributed between the first body and the plane. At the same time, the support plate also synchronously drives the cover to move along the second body, so that the second body forms a heat dissipation hole and is connected to the first body. In the internal space of the body, the hot air in the first body can flow to the environment through the air vents and heat dissipation holes to achieve the heat dissipation effect.
進一步而言,散熱孔尺寸與抬升高度取決於第一機體與第二機體之間的角度變化,故本發明的電子裝置具備動態調整散熱孔及抬升高度的功效,此適用於各類使用情境的需求。Furthermore, the size and elevation of the heat dissipation holes depend on the angle change between the first body and the second body. Therefore, the electronic device of the present invention has the function of dynamically adjusting the heat dissipation holes and the elevation height, which is suitable for various usage scenarios. need.
100:電子裝置 110:第一機體 120:第二機體 121:散熱孔 122:滑軌 130:樞軸模組 131:轉軸 132:主齒輪 133:第一從動齒輪 134:第二從動齒輪 135:第一支架 136:第二支架 140:蓋體 141:第一轉動部 150:支撐板 151:滑動柱 152:第二轉動部 160:齒條 170:彈性層 D:間距 H:外殼 A1:第一角度 A2:第二角度 CA:冷空氣 E1:第一端 E2:第二端 HA:熱空氣 IS:內部空間 OT:出風口 PD:水平方向 S1:第一側 S2:第二側 SG:滑槽 T1:第一旋轉方向 T2:第二旋轉方向 100: Electronic devices 110:First body 120:Second body 121:Heat dissipation hole 122:Slide rail 130:Pivot Module 131:Rotating axis 132:Main gear 133:First driven gear 134:Second driven gear 135:First bracket 136:Second bracket 140: Cover 141:First rotating part 150:Support plate 151:Sliding column 152:Second rotating part 160:Rack 170: elastic layer D: spacing H: Shell A1: first angle A2: Second angle CA: cold air E1: first end E2: Second end HA: hot air IS: internal space OT: air outlet PD: horizontal direction S1: first side S2: Second side SG: chute T1: first rotation direction T2: Second rotation direction
圖1A是本發明一實施例的電子裝置的折疊狀態立體示意圖。 圖1B是圖1A的電子裝置的立體剖面示意圖。 圖1C是圖1A的電子裝置的展開狀態立體示意圖。 圖1D是圖1C的電子裝置的立體剖面示意圖。 圖1E是圖1A的電子裝置另一角度的部份放大立體示意圖。 圖1F是圖1C的電子裝置另一角度的部份放大立體示意圖。 圖2A至圖2C是圖1A電子裝置於展開過程的剖面動作示意圖。 圖3A是圖1A的電子裝置的折疊狀態部份元件透視圖。 圖3B是圖1C的電子裝置的展開狀態部份元件透視圖。 圖4A至圖4C是圖1A的電子裝置於展開過程中的樞軸模組、背蓋及支撐板的動作示意圖。 1A is a perspective view of an electronic device in a folded state according to an embodiment of the present invention. FIG. 1B is a schematic perspective cross-sectional view of the electronic device of FIG. 1A . FIG. 1C is a schematic perspective view of the electronic device in FIG. 1A in an unfolded state. FIG. 1D is a schematic perspective cross-sectional view of the electronic device of FIG. 1C . FIG. 1E is a partially enlarged perspective view of the electronic device of FIG. 1A from another angle. FIG. 1F is a partially enlarged perspective view of the electronic device of FIG. 1C from another angle. 2A to 2C are schematic cross-sectional views of the electronic device in FIG. 1A during the unfolding process. FIG. 3A is a perspective view of some components of the electronic device of FIG. 1A in a folded state. FIG. 3B is a perspective view of some components of the electronic device of FIG. 1C in an unfolded state. 4A to 4C are schematic diagrams of the movement of the pivot module, the back cover and the support plate of the electronic device in FIG. 1A during the unfolding process.
100:電子裝置 100: Electronic devices
110:第一機體 110:First body
120:第二機體 120:Second body
121:散熱孔 121:Heat dissipation hole
140:蓋體 140: Cover
150:支撐板 150:Support plate
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JPH0713660A (en) * | 1993-06-21 | 1995-01-17 | Toshiba Corp | Portable electronic equipment |
US6243261B1 (en) * | 1996-08-23 | 2001-06-05 | Speculative Incorporated | Thermally efficient computer incorporating deploying CPU module |
TW365412U (en) * | 1998-01-15 | 1999-07-21 | Acer Inc | Notebook computer^s heat dissipation cover which can be opened automatically |
CN101881990B (en) * | 2009-05-06 | 2014-01-15 | 鸿富锦精密工业(深圳)有限公司 | Notebook computer and bracket thereof |
TWI746242B (en) * | 2020-11-03 | 2021-11-11 | 宏碁股份有限公司 | Notebook computer |
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