TW202345480A - Method for improving organic semiconductor laser device, program, computer and organic semiconductor laser device - Google Patents

Method for improving organic semiconductor laser device, program, computer and organic semiconductor laser device Download PDF

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TW202345480A
TW202345480A TW112102547A TW112102547A TW202345480A TW 202345480 A TW202345480 A TW 202345480A TW 112102547 A TW112102547 A TW 112102547A TW 112102547 A TW112102547 A TW 112102547A TW 202345480 A TW202345480 A TW 202345480A
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periodic structure
aforementioned
organic semiconductor
short
semiconductor laser
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TW112102547A
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安達千波矢
朴弦奭
法蒂瑪 班傑科
小松龍太郎
藤原隆
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國立大學法人九州大學
日商考拉科技股份有限公司
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/30Structure or shape of the active region; Materials used for the active region
    • H01S5/36Structure or shape of the active region; Materials used for the active region comprising organic materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/10Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/12Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers
    • H01S5/1206Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers having a non constant or multiplicity of periods
    • H01S5/1215Multiplicity of periods
    • H01S5/1218Multiplicity of periods in superstructured configuration, e.g. more than one period in an alternate sequence
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/0014Measuring characteristics or properties thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/04Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
    • H01S5/041Optical pumping

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)

Abstract

An organic semiconductor laser device with a supercell structure composed of a first short-pitch periodic structure with length WS1, a long-pitch periodic structure with length WL and a second short-pitch periodic structure with length WS2 is improved by lengthening (WS1 + WS2), shortening WL, lengthening (WS1 + WL + WS2), or repeating the supercell structure.

Description

用於改善有機半導體雷射裝置的方法、程式、電腦及有機半導體雷射裝置Method, program, computer and organic semiconductor laser device for improving organic semiconductor laser device

本發明係有關一種用於改善有機半導體雷射裝置的方法。The present invention relates to a method for improving an organic semiconductor laser device.

在將被稱為“結構光”之已知的光圖樣投影到物體上的2D及3D成像(例如,生物特徵量測鑑別)等以往的感測技術中,使用具有繞射光學元件(DOE)之雷射光源。DOE被專門設計成將單波束雷射分離為多點狀光束以覆蓋大視野、線狀或其他幾何形狀的光。DOE為由透鏡和波導組成的大體積元件。因此,使用DOE會限制該等光學感測系統的小型化和積體密度,並且會增加成本。因此,要求開發一種不使用DOE就能夠分離雷射光束之雷射裝置。 另一方面,近年來,開發了一種作為增益介質存在巨大潛力之有機半導體。有機半導體雷射(OSL)藉由雷射閾值相對低的藍色到近紅外區域的廣範圍的分子設計,提供寬光學增益和精細的波長調諧,因此是一種極佳的裝置。 1-3然而,現有的注入型雷射如有機半導體雷射二極體(OSLD)仍處於非常早期的階段,因此需要從材料及裝置結構兩方面入手進行廣泛的開發。有機裝置的關鍵問題之一為膜厚限制。為了在有機層中實現有效的載子注入和傳輸,需要使用幾百納米的薄膜結構。因此,需要設計一種適於薄膜型OSLD之最佳光共振器結構。 光共振器由於可以對光進行約束、放大及輸出耦合,因此在改善有機層性能方面起到主要作用。例如有法布立-培若干涉儀 4、分布式布拉格反射器(DBR)等包括垂直共振腔面射型雷射(VCSEL) 5及分布式回饋(DFB) 6結構之幾種共振器。在該等共振器中,DFB共振器為有機層的有力候選項。 7-9在傳統的無機半導體雷射中已使用一階DFB共振器來實現平面指向性回饋及雷射發射。 10此外,二階DFB共振器由於其表面發射亦為很好的候選項。此外,亦報道有組合了一階及二階共振器之混合階DFB共振器。由於混合階DFB共振器組合了一階(強橫向回饋)和二階DFB共振器(作為表面發射萃取一部分光)的優點,表面發射雷射可以以低閾值實現。 11該種DFB結構雖提供相對低的雷射閾值,但在發射角度分布的控制方面存在關鍵問題。例如,人臉辨識及飛行時間(ToF)技術要求很多高密度雷射光束點以使感測器可檢測出幾何形狀並以高解析度重建3D空間(非專利文獻1)。 12然而,該種角度間隙會限制其應用,這是因為反射到物體上的光束有限而惡化感測解析度。同樣地,這對於各種顯示應用來說同樣極其重要。同時,現有的密度閾值必須藉由合適的DFB結構設計來大幅降低,這是因為有機增益材料通常在高功率光和電激發下均脆弱。尤其,對於電驅動OSLD來講,單重態-三重態湮滅(STA)及三重態-三重態湮滅(TTA)等各種湮滅過程是不可避免的,這是因為基於公認的自旋統計之電幫浦中產生大量的三重態亦即生成形成比為1:3的單重態與三重態,長壽命的三重態會導致輻射性單重態的強烈淬滅(非專利文獻2)。 13因此,藉由優化DFB結構來降低閾值以抑制該等湮滅是非常需要的。 非專利文獻 In previous sensing technologies such as 2D and 3D imaging (e.g., biometric measurement and identification) that project a known light pattern called "structured light" onto an object, diffractive optical elements (DOE) are used The laser light source. DOE is specifically designed to separate a single laser beam into multiple spot beams to cover a large field of view, linear or other geometric shapes of light. DOE is a large volume element composed of lenses and waveguides. Therefore, using DOE will limit the miniaturization and volume density of such optical sensing systems and increase costs. Therefore, there is a need to develop a laser device that can separate laser beams without using DOE. On the other hand, in recent years, an organic semiconductor has been developed that has great potential as a gain medium. Organic semiconductor lasers (OSLs) are excellent devices because they provide wide optical gain and fine wavelength tuning through a wide range of molecular designs from blue to near-infrared regions with relatively low laser thresholds. 1-3 However, existing injection lasers such as organic semiconductor laser diodes (OSLD) are still in a very early stage, and therefore require extensive development from both materials and device structures. One of the key issues in organic devices is film thickness limitation. To achieve efficient carrier injection and transport in organic layers, thin film structures of several hundred nanometers are required. Therefore, it is necessary to design an optimal optical resonator structure suitable for thin film OSLD. Optical resonators play a major role in improving the performance of organic layers because they can confine, amplify and output coupling light. For example, there are several resonators including Fabry-Perreault interferometer 4 , distributed Bragg reflector (DBR), including vertical cavity surface emitting laser (VCSEL) 5 and distributed feedback (DFB) 6 structures. Among such resonators, DFB resonators are strong candidates for organic layers. 7-9 First-order DFB resonators have been used in traditional inorganic semiconductor lasers to achieve planar directivity feedback and laser emission. 10 In addition, second-order DFB resonators are also good candidates due to their surface emission. In addition, hybrid-order DFB resonators that combine first-order and second-order resonators have also been reported. Since hybrid-order DFB resonators combine the advantages of first-order (strong transverse feedback) and second-order DFB resonators (extracting part of the light as surface emission), surface-emitting lasers can be realized with low thresholds. 11 Although this DFB structure provides a relatively low laser threshold, there are key issues in the control of emission angle distribution. For example, face recognition and time-of-flight (ToF) technology require many high-density laser beam points so that the sensor can detect geometric shapes and reconstruct 3D space with high resolution (Non-Patent Document 1). 12 However, this angular gap limits its application because the limited amount of light beam reflected onto the object deteriorates the sensing resolution. Again, this is extremely important for a variety of display applications. At the same time, the existing density threshold must be significantly reduced through appropriate DFB structural design, because organic gain materials are usually fragile under high-power optical and electrical excitation. In particular, for electrically driven OSLD, various annihilation processes such as singlet-triplet annihilation (STA) and triplet-triplet annihilation (TTA) are inevitable. This is because the electric pump based on the recognized spin statistics A large number of triplet states are generated, that is, a singlet state and a triplet state with a formation ratio of 1:3 are generated. The long-lived triplet state will cause strong quenching of the radioactive singlet state (Non-patent Document 2). 13 Therefore, it is highly desirable to lower the threshold by optimizing the DFB structure to suppress these annihilations. non-patent literature

[非專利文獻1] S. Zhou, and S. Xiao, HCIS 8, 1-27(2018) [非專利文獻2] C. Gӓrtner, C. Karnutsch, U. Lemmer, and C. Pflumm, J. Appl. Phys. 101, 023107(2007) [Non-patent document 1] S. Zhou, and S. Xiao, HCIS 8, 1-27 (2018) [Non-patent document 2] C. Gårtner, C. Karnutsch, U. Lemmer, and C. Pflumm, J. Appl. Phys. 101, 023107 (2007)

鑑於該種情況,本發明人等進行了深入研究,其目的在於提供一種顯示出低雷射閾值的有機半導體雷射裝置。本發明人等進一步進行了深入研究,其目的在於提供一種不使用DOE等附加光學系統就能夠發射分離雷射光束之有機雷射裝置。 為了實現目的而進行深入研究之結果,本發明人等發現,藉由在光共振器結構中配置具有第一及第二短節距週期性結構以及長節距週期性結構之兩個以上超晶胞結構,並且在各週期性結構的與晶格槽正交之方向上控制長度,可以降低雷射閾值。此外,本發明人等亦發現,藉由在週期性結構的與晶格槽正交之方向上控制長度,可實現繞射角之間的角差窄的分離雷射光束。本發明鑑於相關見解而提出,並藉由以下構成實現。 In view of this situation, the present inventors have conducted in-depth research with the aim of providing an organic semiconductor laser device exhibiting a low laser threshold. The inventors of the present invention have conducted further in-depth research, with the aim of providing an organic laser device capable of emitting a separated laser beam without using an additional optical system such as a DOE. As a result of in-depth research to achieve the purpose, the present inventors found that by arranging two or more supercrystals having first and second short-pitch periodic structures and a long-pitch periodic structure in an optical resonator structure, Cell structure, and controlling the length of each periodic structure in the direction orthogonal to the lattice groove can reduce the laser threshold. In addition, the present inventors also found that by controlling the length of the periodic structure in the direction orthogonal to the lattice grooves, it is possible to achieve split laser beams with a narrow angle difference between the diffraction angles. The present invention is proposed in view of the relevant knowledge and is implemented by the following configuration.

[1]一種用於改善有機半導體雷射裝置的方法,上述有機半導體雷射裝置包括光共振器結構和由有機半導體構成之光放大層,其中 上述光共振器結構具有至少一個超晶胞結構,上述超晶胞結構具有第一短節距週期性結構、長節距週期性結構及第二短節距週期性結構, 上述第一短節距週期性結構與上述長節距週期性結構的一端部相鄰配置,且上述第二短節距週期性結構與上述長節距週期性結構的另一端部相鄰配置, (i)上述第一短節距週期性結構的與晶格槽正交之方向、(ii)上述長節距週期性結構的與晶格槽正交之方向及(iii)上述第二短節距週期性結構的與晶格槽正交之方向中的至少2個在一條直線上, 上述方法包括下述中的至少一個: (1)加長(WS1+WS2)、 (2)縮短WL、 (3)加長(WS1+WL+WS2)及 (4)重複上述超晶胞結構, 其中WS1表示在上述第一短節距週期性結構的與晶格槽正交之方向上的長度,WS2表示在上述第二短節距週期性結構的與晶格槽正交之方向上的長度,WL表示在上述長節距週期性結構的與晶格槽正交之方向上的長度。 [2]如[1]所述之方法,其實施(1)。 [3]如[1]所述之方法,其實施(2)。 [4]如[1]所述之方法,其實施(3)。 [5]如[1]所述之方法,其實施(4)。 [6]如[1]所述之方法,其實施(1)及(2)。 [7]如[1]所述之方法,其實施(1)及(3)。 [8]如[1]所述之方法,其實施(2)及(3)。 [9]如[1]所述之方法,其實施(1)、(2)及(3)。 [10]如[6]至[9]之任一項所述之方法,其進一步實施(4)。 [11]如[1]至[10]之任一項所述之方法,其將(WS1+WS2)/WL調整為4以上,例如為10以上、50以上、90以上、150以上、800以上。 [12]如[1]至[11]之任一項所述之方法,其將(WS1+WS2)調整為1μm以上,例如為4μm以上、10μm以上、40μm以上、200μm以上。 [13]如[1]至[12]之任一項所述之方法,其將WL調整為10μm以下,例如為2μm以下、0.6μm以下。 [14]如[1]至[13]之任一項所述之方法,其將(WS1+WL+WS2)調整為2μm以上,例如為5μm以上、20μm以上、50μm以上、250μm以上。 [15]如[1]至[14]之任一項所述之方法,其滿足WS1=WS2。 [16]如[1]至[15]之任一項所述之方法,其中 (i)上述第一短節距週期性結構的與晶格槽正交之方向、(ii)上述長節距週期性結構的與晶格槽正交之方向及(iii)上述第二短節距週期性結構的與晶格槽正交之方向全部在一條直線上。 [17]如[1]至[16]之任一項所述之方法,其中 上述第一短節距週期性結構與上述長節距週期性結構的一端部接觸,且上述第二短節距週期性結構與長節距週期性結構的另一端部接觸。 [18]如[1]至[17]之任一項所述之方法,其中 上述週期性結構包括由脊部和槽構成之光柵。 [19]如[1]至[18]之任一項所述之方法,其中 上述第一短節距週期性結構及上述第二短節距週期性結構為一階光柵,上述長節距週期性結構為二階光柵。 [20]如[1]至[19]之任一項所述之方法,其中 上述方法用於降低雷射閾值。 [21]如[1]至[19]之任一項所述之方法,其中 上述方法用於收窄雷射發射的繞射角。 [22]如[1]至[19]之任一項所述之方法,其中 上述方法用於降低雷射閾值並收窄雷射發射的繞射角。 [23]如[1]至[22]之任一項所述之方法,其中 上述方法用於設計有機半導體雷射裝置。 [24]如[1]至[23]之任一項所述之方法,其中 上述方法用於評價有機半導體雷射裝置。 [25]如[1]至[24]之任一項所述之方法,其中 上述方法用於製造有機半導體雷射裝置。 [26]一種程式,其用於實施[1]至[25]之任一項所述之方法。 [27]一種電腦,其用於實施[1]至[25]之任一項所述之方法。 [28]一種有機半導體雷射裝置,其藉由[1]至[25]所述之方法製造。 [29]一種有機半導體雷射裝置,其包括光共振器結構和由有機半導體構成之光放大層,其中, 上述光共振器結構具有至少一個超晶胞結構,上述超晶胞結構具有第一短節距週期性結構、長節距週期性結構及第二短節距週期性結構, 上述第一短節距週期性結構與上述長節距週期性結構的一端部相鄰配置,且上述第二短節距週期性結構與上述長節距週期性結構的另一端部相鄰配置, (i)上述第一短節距週期性結構的與晶格槽正交之方向、(ii)上述長節距週期性結構的與晶格槽正交之方向及(iii)與上述第二短節距週期性結構的晶格槽正交之方向中的至少2個在一條直線上, 上述有機半導體雷射裝置具有的(WS1+WS2)、縮短的WL、加長的(WS1+WL+WS2)及2個以上超晶胞結構中的至少一個,其中WS1表示在上述第一短節距週期性結構的與晶格槽正交之方向上的長度,WS2表示在上述第二短節距週期性結構的與晶格槽正交之方向上的長度,WL表示在上述長節距週期性結構的與晶格槽正交之方向上的長度。 [30]如[28]或[29]所述之有機半導體雷射裝置,其中 上述光共振器結構具有以2個以上超晶胞結構的與晶格槽正交之方向在一條直線上的方式配置之2個以上超晶胞結構。 [31]如[30]所述之有機半導體雷射裝置,其中 上述2個以上超晶胞結構的WS1、WL及WS2相同。 [32]如[30]所述之有機半導體雷射裝置,其中 上述2個以上超晶胞結構的與晶格槽正交之方向上的長度是隨機的。 [33]如[30]至[32]之任一項所述之有機半導體雷射裝置,其中 上述光共振器結構具有10個以上超晶胞結構。 [34]如[28]至[33]之任一項所述之有機半導體雷射裝置,其中 上述第一短節距週期性結構、上述長節距週期性結構及上述第二短節距週期性結構具有深度未達75nm的槽,例如為20~70nm。 [35]如[28]至[34]之任一項所述之有機半導體雷射裝置,其中 上述前述第一短節距週期性結構、上述長節距週期性結構及上述第二短節距週期性結構具有分布式回饋(DFB)結構。 [36]如[35]所述之有機半導體雷射裝置,其中 各分布式回饋(DFB)結構選自包括一階DFB結構、二階DFB結構、三階DFB結構及更高階DFB結構之群組中。 [37]如[28]至[36]之任一項所述之有機半導體雷射裝置,其中 上述第一短節距週期性結構、上述長節距週期性結構及上述第二短節距週期性結構由絕緣材料構成。 [38]如[28]至[37]之任一項所述之有機半導體雷射裝置,其中 上述第一短節距週期性結構、上述長節距週期性結構及上述第二短節距週期性結構具有在絕緣基板上由絕緣材料構成之週期性排列的脊部。 [39]如[38]所述之有機半導體雷射裝置,其中 上述脊部及上述絕緣基板由不同的絕緣材料構成。 [40]如[38]所述之有機半導體雷射裝置,其中 上述脊部由二氧化矽構成,上述絕緣基板由玻璃基板構成。 [41]如[38]至[40]之任一項所述之有機半導體雷射裝置,其中 上述絕緣基板的表面露出於槽的底部。 [42]如[28]至[41]之任一項所述之有機半導體雷射裝置,其在上述光共振器結構的表面進一步具有有機層。 [43]如[42]所述之有機半導體雷射裝置,其在與上述光共振器結構相對之上述有機層上進一步包含透明保護層。 [44]如[42]或[43]所述之有機半導體雷射裝置,其從與上述光共振器結構相對之上述有機層一側發射雷射光束。 [45]如[43]所述之有機半導體雷射裝置,其從與上述透明保護層相對之上述有機層一側發射雷射光束。 [46]如[28]至[45]之任一項所述之有機半導體雷射裝置,其發射具有不同繞射角之2種以上繞射光。 [47]如[46]所述之有機半導體雷射裝置,其中 在上述2種以上繞射光中,發射角度最接近的繞射光的繞射角之間的角差為8°以下,例如為7°以下及6°以下。 [48]如[28]至[47]之任一項所述之有機半導體雷射裝置,其中 上述有機層包含具有至少一個二苯乙烯單元之有機化合物。 [49]如[28]至[48]之任一項所述之有機半導體雷射裝置,其中 上述有機層包含4,4'-雙[(N-咔唑)苯乙烯基]聯苯(BSBCz)。 [50]如[28]至[49]之任一項所述之有機半導體雷射裝置,其中 上述有機層的厚度為80~350nm,例如為100~300nm、150~250nm。 [51]一種選自包括生物感測器、結構光照射裝置、光學感測裝置及人臉辨識裝置之群組中之裝置,其包括[28]至[50]之任一項所述之有機半導體雷射裝置。 [1] A method for improving an organic semiconductor laser device including an optical resonator structure and a light amplification layer composed of an organic semiconductor, wherein The above-mentioned optical resonator structure has at least one supercell structure, and the above-mentioned supercell structure has a first short-pitch periodic structure, a long-pitch periodic structure and a second short-pitch periodic structure, The first short-pitch periodic structure is disposed adjacent to one end of the long-pitch periodic structure, and the second short-pitch periodic structure is disposed adjacent to the other end of the long-pitch periodic structure, (i) the direction orthogonal to the lattice grooves of the above-mentioned first short-pitch periodic structure, (ii) the direction orthogonal to the lattice grooves of the above-mentioned long-pitch periodic structure, and (iii) the above-mentioned second short section On a straight line from at least two of the directions orthogonal to the lattice grooves of the periodic structure, The above method includes at least one of the following: (1) Extended (WS1+WS2), (2) Shorten WL, (3) Extended (WS1+WL+WS2) and (4) Repeat the above supercell structure, WS1 represents the length of the first short-pitch periodic structure in the direction orthogonal to the lattice grooves, and WS2 represents the length of the second short-pitch periodic structure in the direction orthogonal to the lattice grooves. , WL represents the length in the direction orthogonal to the lattice groove of the above-mentioned long-pitch periodic structure. [2] The method described in [1], implementing (1). [3] The method described in [1], and its implementation (2). [4] The method described in [1], and its implementation (3). [5] The method described in [1], and its implementation (4). [6] The method described in [1], which implements (1) and (2). [7] The method described in [1], which implements (1) and (3). [8] The method described in [1], which implements (2) and (3). [9] The method described in [1], which implements (1), (2) and (3). [10] The method according to any one of [6] to [9], further implementing (4). [11] The method according to any one of [1] to [10], which adjusts (WS1+WS2)/WL to 4 or more, for example, 10 or more, 50 or more, 90 or more, 150 or more, or 800 or more . [12] The method according to any one of [1] to [11], which adjusts (WS1 + WS2) to 1 μm or more, for example, 4 μm or more, 10 μm or more, 40 μm or more, or 200 μm or more. [13] The method according to any one of [1] to [12], which adjusts WL to 10 μm or less, for example, 2 μm or less, or 0.6 μm or less. [14] The method according to any one of [1] to [13], which adjusts (WS1+WL+WS2) to 2 μm or more, for example, 5 μm or more, 20 μm or more, 50 μm or more, or 250 μm or more. [15] The method described in any one of [1] to [14], which satisfies WS1=WS2. [16] The method according to any one of [1] to [15], wherein (i) the direction orthogonal to the lattice grooves of the above-mentioned first short-pitch periodic structure, (ii) the direction orthogonal to the lattice grooves of the above-mentioned long-pitch periodic structure, and (iii) the above-mentioned second short section The directions orthogonal to the lattice grooves of the periodic structure are all on a straight line. [17] The method according to any one of [1] to [16], wherein The first short-pitch periodic structure is in contact with one end of the long-pitch periodic structure, and the second short-pitch periodic structure is in contact with the other end of the long-pitch periodic structure. [18] The method according to any one of [1] to [17], wherein The periodic structure includes a grating composed of ridges and grooves. [19] The method as described in any one of [1] to [18], wherein The first short-pitch periodic structure and the second short-pitch periodic structure are first-order gratings, and the long-pitch periodic structure is a second-order grating. [20] The method according to any one of [1] to [19], wherein The above method is used to reduce the laser threshold. [21] The method according to any one of [1] to [19], wherein The above method is used to narrow the diffraction angle of laser emission. [22] The method as described in any one of [1] to [19], wherein The above method is used to reduce the laser threshold and narrow the diffraction angle of laser emission. [23] The method according to any one of [1] to [22], wherein The above method is used to design organic semiconductor laser devices. [24] The method according to any one of [1] to [23], wherein The above method is used to evaluate organic semiconductor laser devices. [25] The method according to any one of [1] to [24], wherein The above method is used to manufacture organic semiconductor laser devices. [26] A program for implementing the method described in any one of [1] to [25]. [27] A computer for implementing the method described in any one of [1] to [25]. [28] An organic semiconductor laser device manufactured by the method described in [1] to [25]. [29] An organic semiconductor laser device, which includes an optical resonator structure and a light amplification layer composed of an organic semiconductor, wherein, The above-mentioned optical resonator structure has at least one supercell structure, and the above-mentioned supercell structure has a first short-pitch periodic structure, a long-pitch periodic structure and a second short-pitch periodic structure, The first short-pitch periodic structure is disposed adjacent to one end of the long-pitch periodic structure, and the second short-pitch periodic structure is disposed adjacent to the other end of the long-pitch periodic structure, (i) the direction orthogonal to the lattice grooves of the above-mentioned first short-pitch periodic structure, (ii) the direction orthogonal to the lattice grooves of the above-mentioned long-pitch periodic structure, and (iii) the direction orthogonal to the above-mentioned second short-pitch periodic structure. At least two of the directions orthogonal to the lattice grooves of the pitch periodic structure are on a straight line, The above-mentioned organic semiconductor laser device has at least one of (WS1+WS2), shortened WL, elongated (WS1+WL+WS2) and two or more supercell structures, wherein WS1 represents the first short pitch The length of the periodic structure in the direction orthogonal to the lattice grooves, WS2 represents the length of the second short-pitch periodic structure in the direction orthogonal to the lattice grooves, and WL represents the length of the above-mentioned long-pitch periodic structure. The length of the structure in the direction orthogonal to the lattice grooves. [30] The organic semiconductor laser device as described in [28] or [29], wherein The above-mentioned optical resonator structure has two or more supercell structures arranged in such a way that directions orthogonal to the lattice grooves of the two or more supercell structures are aligned in a straight line. [31] The organic semiconductor laser device as described in [30], wherein WS1, WL and WS2 of the above two or more supercell structures are the same. [32] The organic semiconductor laser device as described in [30], wherein The lengths of the above two or more supercell structures in the direction orthogonal to the lattice grooves are random. [33] The organic semiconductor laser device according to any one of [30] to [32], wherein The above-mentioned optical resonator structure has more than 10 supercell structures. [34] The organic semiconductor laser device according to any one of [28] to [33], wherein The above-mentioned first short-pitch periodic structure, the above-mentioned long-pitch periodic structure and the above-mentioned second short-pitch periodic structure have grooves with a depth less than 75 nm, for example, 20-70 nm. [35] The organic semiconductor laser device according to any one of [28] to [34], wherein The above-mentioned first short-pitch periodic structure, the above-mentioned long-pitch periodic structure and the above-mentioned second short-pitch periodic structure have a distributed feedback (DFB) structure. [36] The organic semiconductor laser device as described in [35], wherein Each distributed feedback (DFB) structure is selected from the group consisting of first-order DFB structures, second-order DFB structures, third-order DFB structures and higher-order DFB structures. [37] The organic semiconductor laser device according to any one of [28] to [36], wherein The above-mentioned first short-pitch periodic structure, the above-mentioned long-pitch periodic structure and the above-mentioned second short-pitch periodic structure are made of insulating materials. [38] The organic semiconductor laser device according to any one of [28] to [37], wherein The above-mentioned first short-pitch periodic structure, the above-mentioned long-pitch periodic structure and the above-mentioned second short-pitch periodic structure have periodically arranged ridges made of insulating material on the insulating substrate. [39] The organic semiconductor laser device as described in [38], wherein The ridge portion and the insulating substrate are made of different insulating materials. [40] The organic semiconductor laser device as described in [38], wherein The ridge portion is made of silicon dioxide, and the insulating substrate is made of a glass substrate. [41] The organic semiconductor laser device according to any one of [38] to [40], wherein The surface of the insulating substrate is exposed at the bottom of the groove. [42] The organic semiconductor laser device according to any one of [28] to [41], further having an organic layer on the surface of the optical resonator structure. [43] The organic semiconductor laser device according to [42], further comprising a transparent protective layer on the organic layer opposite to the optical resonator structure. [44] The organic semiconductor laser device according to [42] or [43], which emits a laser beam from the side of the organic layer opposite to the optical resonator structure. [45] The organic semiconductor laser device according to [43], which emits a laser beam from the side of the organic layer opposite to the transparent protective layer. [46] The organic semiconductor laser device according to any one of [28] to [45], which emits two or more types of diffracted light with different diffraction angles. [47] The organic semiconductor laser device as described in [46], wherein Among the two or more types of diffracted light, the angle difference between the diffraction angles of the diffracted light with the closest emission angle is 8° or less, for example, 7° or less or 6° or less. [48] The organic semiconductor laser device according to any one of [28] to [47], wherein The above-mentioned organic layer contains an organic compound having at least one stilbene unit. [49] The organic semiconductor laser device according to any one of [28] to [48], wherein The above-mentioned organic layer contains 4,4'-bis[(N-carbazole)styryl]biphenyl (BSBCz). [50] The organic semiconductor laser device according to any one of [28] to [49], wherein The thickness of the organic layer is 80 to 350 nm, for example, 100 to 300 nm or 150 to 250 nm. [51] A device selected from the group including a biosensor, a structured light illumination device, an optical sensing device and a face recognition device, which includes the organic compound described in any one of [28] to [50] Semiconductor laser device.

全有機平台和OLED技術的兼容性、不同雷射顏色的單片整合以及與電致發光裝置及其他有機裝置的整合會減少基於感測器及光學感測器系統之結構光的尺寸。Compatibility of all-organic platforms and OLED technologies, monolithic integration of different laser colors, and integration with electroluminescent devices and other organic devices will reduce the size of structured light-based sensors and optical sensor systems.

以下,對本發明的內容進行詳細說明。參考本發明的代表性實施形態及具體例對本發明的構成要素進行說明,但本發明並不限定於該等實施形態及實施例。在本說明書中,以“X~Y”表示之數值範圍表示將數值X及Y分別作為最小值及最大值而包括之範圍。The contents of the present invention will be described in detail below. The constituent elements of the present invention will be described with reference to representative embodiments and specific examples of the present invention, but the present invention is not limited to these embodiments and examples. In this specification, the numerical range represented by “X to Y” represents a range including the numerical values X and Y as the minimum value and the maximum value, respectively.

用於改善有機半導體雷射裝置的方法 本發明的方法為一種用於改善有機半導體雷射裝置的方法,上述有機半導體雷射裝置包括光共振器結構和由有機半導體構成之光放大層,其中 上述光共振器結構具有至少一個超晶胞結構,上述超晶胞結構具有第一短節距週期性結構、長節距週期性結構及第二短節距週期性結構, 上述第一短節距週期性結構與上述長節距週期性結構的一端部相鄰配置,且上述第二短節距週期性結構與上述長節距週期性結構的另一端部相鄰配置, (i)上述第一短節距週期性結構的與晶格槽正交之方向、(ii)上述長節距週期性結構的與晶格槽正交之方向及(iii)上述第二短節距週期性結構的與晶格槽正交之方向中的至少2個在一條直線上, 上述方法包括下述中的至少一個: (1)加長(WS1+WS2)、 (2)縮短WL、 (3)加長(WS1+WL+WS2)及 (4)重複上述超晶胞結構, 其中WS1表示在上述第一短節距週期性結構的與晶格槽正交之方向上的長度,WS2表示在上述第二短節距週期性結構的與晶格槽正交之方向上的長度,WL表示在與上述長節距週期性結構的晶格槽正交之方向上的長度。 本發明的方法用於改善有機半導體雷射裝置的性能。在本發明的一實施形態中,該方法用於降低雷射閾值。在本發明的另一實施形態中,該方法用於收窄雷射發射的繞射角。在本發明的一實施形態中,該方法用於降低雷射閾值並收窄雷射發射的繞射角。此處提及的“雷射發射的繞射角”表示在具有不同繞射角之2種以上繞射光束中發射角度最接近的2個繞射光束的繞射角之間的角差。雷射發射的繞射角越窄,雷射光束分離越多,並且作為用於檢測3D幾何形狀之結構化照明裝置更有用。 在本發明中,“第一短節距週期性結構”、“長節距週期性結構”及“第二短節距週期性結構”中的“週期性結構”表示一種複數個晶格槽以固定節距並列排列之結構。以下,將相鄰晶格槽之間的凸部稱為“脊部”。週期性結構可以為複數個隆起部及複數個光柵槽以固定節距交替排列之光柵。 在本發明中,“第一短節距週期性結構”、“長節距週期性結構”及“第二短節距週期性結構”中的“節距”表示相鄰晶格槽的側面之間的距離。在每個超晶胞結構中,“長節距週期性結構”為節距長於“第一短節距週期性結構”及“第二短節距週期性結構”之週期性結構。 關於本發明中使用的有機半導體雷射裝置的說明中,可以參考以上“有機半導體雷射裝置”段落中的說明。 Method for improving organic semiconductor laser device The method of the present invention is a method for improving an organic semiconductor laser device. The above-mentioned organic semiconductor laser device includes an optical resonator structure and a light amplification layer composed of an organic semiconductor, wherein The above-mentioned optical resonator structure has at least one supercell structure, and the above-mentioned supercell structure has a first short-pitch periodic structure, a long-pitch periodic structure and a second short-pitch periodic structure, The first short-pitch periodic structure is disposed adjacent to one end of the long-pitch periodic structure, and the second short-pitch periodic structure is disposed adjacent to the other end of the long-pitch periodic structure, (i) the direction orthogonal to the lattice grooves of the above-mentioned first short-pitch periodic structure, (ii) the direction orthogonal to the lattice grooves of the above-mentioned long-pitch periodic structure, and (iii) the above-mentioned second short section On a straight line from at least two of the directions orthogonal to the lattice grooves of the periodic structure, The above method includes at least one of the following: (1) Extended (WS1+WS2), (2) Shorten WL, (3) Extended (WS1+WL+WS2) and (4) Repeat the above supercell structure, WS1 represents the length of the first short-pitch periodic structure in the direction orthogonal to the lattice grooves, and WS2 represents the length of the second short-pitch periodic structure in the direction orthogonal to the lattice grooves. , WL represents the length in the direction orthogonal to the lattice grooves of the long-pitch periodic structure. The method of the invention is used to improve the performance of organic semiconductor laser devices. In one embodiment of the invention, the method is used to reduce the laser threshold. In another embodiment of the invention, the method is used to narrow the diffraction angle of the laser emission. In an embodiment of the invention, the method is used to lower the laser threshold and narrow the diffraction angle of the laser emission. The "diffraction angle of laser emission" mentioned here means the angular difference between the diffraction angles of two diffraction beams with the closest emission angles among two or more diffraction beams with different diffraction angles. The narrower the diffraction angle of the laser emission, the more the laser beam is separated and more useful as a structured illumination device for detecting 3D geometries. In the present invention, the "periodic structure" in the "first short-pitch periodic structure", "long-pitch periodic structure" and "second short-pitch periodic structure" means a plurality of lattice grooves with A structure arranged side by side at a fixed pitch. Hereinafter, the convex portions between adjacent lattice grooves are referred to as “ridge portions”. The periodic structure may be a grating in which a plurality of ridges and a plurality of grating grooves are alternately arranged at a fixed pitch. In the present invention, the "pitch" in "first short-pitch periodic structure", "long-pitch periodic structure" and "second short-pitch periodic structure" means the distance between the side surfaces of adjacent lattice grooves. distance between. In each supercell structure, the "long-pitch periodic structure" is a periodic structure with a pitch longer than that of the "first short-pitch periodic structure" and the "second short-pitch periodic structure". Regarding the description of the organic semiconductor laser device used in the present invention, reference may be made to the description in the paragraph "Organic Semiconductor Laser Device" above.

圖1示出具有3個以上超晶胞結構之光共振器結構10作為用於本發明之光共振器結構的示例。然而,能夠用於本發明之光共振器結構不應解釋為限於示例。圖1中,“FSP”表示第一短節距週期性結構,“LP”表示長節距週期性結構,“SSP”表示第二短節距週期性結構。在光共振器結構10中,相鄰晶格槽1a與1b的側面之間的距離Λ1對應於前述第一短節距週期性結構FSP的節距,相鄰晶格槽3a與3b的側面之間的距離ΛL對應於長節距週期性結構LP的節距,相鄰晶格槽2a與2b的側面之間的距離Λ2對應於第二短節距週期性結構SSP的節距。在光共振器結構10中,箭頭x所指的方向為與晶格槽正交之方向,第一短節距結構FSP在x方向上的長度對應於WS1,長節距結構LP在x方向上的長度對應於WL,第二短節距結構在x方向上的長度對應於WS2。FIG. 1 shows an optical resonator structure 10 having more than three supercell structures as an example of the optical resonator structure used in the present invention. However, the optical resonator structures that can be used in the present invention should not be construed as limited to the examples. In Figure 1, "FSP" represents the first short-pitch periodic structure, "LP" represents the long-pitch periodic structure, and "SSP" represents the second short-pitch periodic structure. In the optical resonator structure 10, the distance Λ1 between the side surfaces of adjacent lattice grooves 1a and 1b corresponds to the pitch of the aforementioned first short-pitch periodic structure FSP, and the distance Λ1 between the side surfaces of adjacent lattice grooves 3a and 3b The distance ΛL between them corresponds to the pitch of the long-pitch periodic structure LP, and the distance Λ2 between the side surfaces of adjacent lattice grooves 2a and 2b corresponds to the pitch of the second short-pitch periodic structure SSP. In the optical resonator structure 10, the direction pointed by the arrow x is the direction orthogonal to the lattice groove, the length of the first short pitch structure FSP in the x direction corresponds to WS1, and the length of the long pitch structure LP in the x direction The length of corresponds to WL, and the length of the second short pitch structure in the x direction corresponds to WS2.

在每個超晶胞結構中,第一短節距週期性結構與長節距週期性結構的一端部相鄰配置,且第二短節距週期性結構與長節距週期性結構的另一端部相鄰配置。第一短節距週期性結構可以與長節距週期性結構的一端部接觸,且第二短節距週期性結構與長節距週期性結構的另一端部接觸, 在每個超晶胞結構中,(i)第一短節距週期性結構的與晶格槽正交之方向、(ii)長節距週期性結構的與晶格槽正交之方向及(iii)第二短節距週期性結構的與晶格槽正交之方向中的至少2個在一條直線上。位於一條直線上的方向可以為(i)及(ii),(i)及(iii),(ii)及(iii),(i)、(ii)及(iii)。(i)、(ii)及(iii)全部可以在一條直線上。 In each supercell structure, the first short-pitch periodic structure is arranged adjacent to one end of the long-pitch periodic structure, and the second short-pitch periodic structure is adjacent to the other end of the long-pitch periodic structure. adjacent configuration. The first short pitch periodic structure may be in contact with one end of the long pitch periodic structure, and the second short pitch periodic structure is in contact with the other end of the long pitch periodic structure, In each supercell structure, (i) the direction orthogonal to the lattice grooves of the first short-pitch periodic structure, (ii) the direction orthogonal to the lattice grooves of the long-pitch periodic structure, and ( iii) At least two of the directions orthogonal to the lattice grooves of the second short-pitch periodic structure are on a straight line. The directions on a straight line may be (i) and (ii), (i) and (iii), (ii) and (iii), (i), (ii) and (iii). (i), (ii) and (iii) can all be on a straight line.

在每個超晶胞結構中,第一短節距週期性結構及第二短節距週期性結構的節距可以彼此相同,亦可以互不相同,例如為相同。長度WS1及WS2可以彼此相同,亦可以互不相同,例如為相同。在本發明的一實施形態中,第一短節距結構及第二短節距結構的節距可以相同,第一短節距結構及第二短節距結構滿足W1=W2。In each supercell structure, the pitches of the first short-pitch periodic structure and the second short-pitch periodic structure may be the same as each other, or may be different from each other, for example, they may be the same. The lengths WS1 and WS2 may be the same as each other, or may be different from each other, for example, they may be the same. In an embodiment of the present invention, the pitches of the first short pitch structure and the second short pitch structure may be the same, and the first short pitch structure and the second short pitch structure satisfy W1=W2.

本發明的方法包括以上(1)至(4)中的至少一個步驟。在本發明的方法中實施的步驟可以為(1)至(4)中的一部分,或者可以為(1)至(4)全部。本發明的方法的實施形態包括以下(A)至(I)。 (A)包括實施(1)之步驟之方法。 (B)包括實施(2)之步驟之方法。 (C)包括實施(3)之步驟之方法。 (D)包括實施(4)之步驟之方法。 (E)包括實施(1)及(2)之步驟之方法。 (F)包括實施(1)及(3)之步驟之方法。 (G)包括實施(2)及(3)之步驟之方法。 (H)包括實施(1)、(2)及(3)之步驟之方法。 (I)在(A)至(H)之任意實施形態中,該方法包括進一步實施(4)之步驟。 The method of the present invention includes at least one of the steps (1) to (4) above. The steps implemented in the method of the present invention may be part of (1) to (4), or may be all of (1) to (4). Embodiments of the method of the present invention include the following (A) to (I). (A) Includes methods for carrying out the steps of (1). (B) Includes methods for carrying out the steps of (2). (C) Includes methods for implementing the steps of (3). (D) Includes methods for implementing the steps of (4). (E) Includes methods for performing the steps of (1) and (2). (F) Includes methods for carrying out the steps of (1) and (3). (G) Includes methods for performing the steps of (2) and (3). (H) Includes methods of performing the steps of (1), (2), and (3). (I) In any embodiment of (A) to (H), the method includes further performing the step of (4).

在本發明的方法中,將(WS1+WS2)/WL調整為例如4以上、10以上、50以上、90以上、150以上及800以上。 在本發明的方法中,將(WS1+WS2)調整為例如1μm以上、4μm以上、10μm以上、40μm以上及200μm以上。 在本發明的方法中,將WL調整為例如10μm以下、2μm以下及0.6μm以下。 在本發明的方法中,(WS1+WL+WS2)例如為2μm以上、5μm以上、20μm以上、50μm以上及250μm以上。 在本發明的方法中,光共振器結構中的超晶胞結構的數量例如為4以上、6以上、8以上及10以上。 In the method of the present invention, (WS1+WS2)/WL is adjusted to, for example, 4 or more, 10 or more, 50 or more, 90 or more, 150 or more, and 800 or more. In the method of the present invention, (WS1+WS2) is adjusted to, for example, 1 μm or more, 4 μm or more, 10 μm or more, 40 μm or more, and 200 μm or more. In the method of the present invention, WL is adjusted to, for example, 10 μm or less, 2 μm or less, or 0.6 μm or less. In the method of the present invention, (WS1+WL+WS2) is, for example, 2 μm or more, 5 μm or more, 20 μm or more, 50 μm or more, and 250 μm or more. In the method of the present invention, the number of supercell structures in the optical resonator structure is, for example, 4 or more, 6 or more, 8 or more, and 10 or more.

在本發明的方法中,第一短節距週期性結構、長節距週期性結構及第二短節距週期性結構的節距可以設定為滿足由以下說明的式(I)表示之布拉格條件。在本發明的一實施形態中,第一短節距週期性結構及第二短節距週期性結構為一階光柵,其中m在式(I)分別為1,長節距週期性結構為二階光柵,其中m在式(I)2。In the method of the present invention, the pitches of the first short-pitch periodic structure, the long-pitch periodic structure, and the second short-pitch periodic structure can be set to satisfy the Bragg condition expressed by the following formula (I) . In an embodiment of the present invention, the first short-pitch periodic structure and the second short-pitch periodic structure are first-order gratings, where m is respectively 1 in formula (I), and the long-pitch periodic structure is a second-order grating. grating, where m is in equation (I) 2.

用於設計、評價及製造有機半導體雷射裝置之方法 本發明的方法的實施形態包括用於設計有機半導體雷射裝置的方法、用於評價有機半導體雷射裝置的方法及用於製造有機半導體雷射裝置的方法。 在用於設計有機半導體雷射裝置的方法中,藉由實施上述(1)至(4)中的至少一個,能夠設計一種可期待雷射閾值低且雷射發射的繞射角窄之有機半導體雷射裝置。 在用於評價有機半導體雷射裝置的方法中,藉由對滿足(1′)(WS1+WS2)更長、(2′)WL更短、(3′)(WS1+WL+WS2)更長及(4′)超晶胞結構的數量多中的至少一個條件之有機半導體裝置進行更高的評價,能夠在2個以上有機半導體雷射裝置中選擇一種雷射閾值低且雷射發射的繞射角窄之有機半導體裝置。 在用於製造有機半導體雷射裝置的方法中,藉由實施上述(1)至(4)中的至少一個,能夠製造一種雷射閾值低且雷射發射的繞射角窄之有機半導體雷射裝置。 關於本發明的方法中使用的說明及條件,可以參考以上“用於改善有機半導體雷射裝置的方法”段落中的說明。 Methods for designing, evaluating and manufacturing organic semiconductor laser devices Embodiments of the method of the present invention include a method for designing an organic semiconductor laser device, a method for evaluating an organic semiconductor laser device, and a method for manufacturing an organic semiconductor laser device. In a method for designing an organic semiconductor laser device, by implementing at least one of the above (1) to (4), it is possible to design an organic semiconductor that is expected to have a low laser threshold and a narrow diffraction angle of laser emission. Laser device. In the method for evaluating organic semiconductor laser devices, by satisfying (1′) (WS1+WS2) longer, (2′) WL shorter, (3′) (WS1+WL+WS2) longer and (4′) organic semiconductor devices with at least one of the conditions of a large number of supercell structures can be evaluated at a higher level, and a surrounding device with a low laser threshold and laser emission can be selected among two or more organic semiconductor laser devices. Organic semiconductor device with narrow emission angle. In the method for manufacturing an organic semiconductor laser device, by implementing at least one of the above (1) to (4), an organic semiconductor laser with a low laser threshold and a narrow diffraction angle of laser emission can be manufactured device. Regarding the description and conditions used in the method of the present invention, reference can be made to the description in the paragraph "Method for improving organic semiconductor laser device" above.

程式 本發明的程式為用於實施本發明的方法之程式。亦即,本發明的程式為一種用於使電腦實施本發明的方法中的各步驟之程式。關於本發明的方法的說明,可以參考以上“用於改善有機半導體雷射裝置的方法”及“用於設計、評價及製造有機半導體雷射裝置之方法”段落中的說明。 本發明的程式可以存儲在電腦可讀取的記錄媒體。記錄媒體的例子包括磁記錄媒體、光學記錄媒體及半導體記憶體。記錄媒體的具體例包括軟性磁碟、硬碟、光碟、磁光碟、CD-ROM(唯讀記憶體)、CD-R、DVD-ROM、磁帶、非揮發性記憶卡、ROM、EEPROM及矽碟。 program The routines of the invention are routines for carrying out the methods of the invention. That is, the program of the present invention is a program for causing a computer to implement each step of the method of the present invention. For descriptions of the method of the present invention, reference may be made to the descriptions in the paragraphs "Method for Improving Organic Semiconductor Laser Device" and "Method for Designing, Evaluating, and Manufacturing Organic Semiconductor Laser Device" above. The program of the present invention can be stored in a computer-readable recording medium. Examples of recording media include magnetic recording media, optical recording media, and semiconductor memories. Specific examples of recording media include floppy disks, hard disks, optical disks, magneto-optical disks, CD-ROM (read-only memory), CD-R, DVD-ROM, magnetic tapes, non-volatile memory cards, ROM, EEPROM and silicon disks .

電腦 本發明的電腦為用於實施本發明的方法之電腦。亦即,本發明的電腦為包括用於實施本發明的方法中的各步驟之手段之電腦。關於本發明的方法的說明,可以參考以上“用於改善有機半導體雷射裝置的方法”及“用於設計、評價及製造有機半導體雷射裝置之方法”段落中的說明。 本發明的電腦可具備的手段的例子包括用於計算上述(1′)及(3′)中的公式之計算手段、用於根據(1′)及(3′)中的計算值和(2′)及(4′)中的數值,在裝置中選擇適於上述(1′)至(4′)之有機半導體雷射裝置之篩選手段。 computer The computer of the present invention is a computer used to implement the method of the present invention. That is, the computer of the present invention is a computer including means for executing each step in the method of the present invention. For descriptions of the method of the present invention, reference may be made to the descriptions in the paragraphs "Method for Improving Organic Semiconductor Laser Device" and "Method for Designing, Evaluating, and Manufacturing Organic Semiconductor Laser Device" above. Examples of means that the computer of the present invention may have include calculation means for calculating the formulas in (1') and (3') above, calculation means for calculating values based on (1') and (3') and (2 ′) and (4′), select a screening method suitable for the organic semiconductor laser device of the above (1′) to (4′) in the device.

有機半導體雷射裝置 本發明的有機半導體雷射裝置為包括光共振器結構和由有機半導體構成之光放大層之有機半導體雷射裝置,其中, 上述光共振器結構具有至少一個超晶胞結構,上述超晶胞結構具有第一短節距週期性結構、長節距週期性結構及第二短節距週期性結構, 上述第一短節距週期性結構與上述長節距週期性結構的一端部相鄰配置,且上述第二短節距週期性結構與上述長節距週期性結構的另一端部相鄰配置, (i)上述第一短節距週期性結構的與晶格槽正交之方向、(ii)上述長節距週期性結構的與晶格槽正交之方向及(iii)上述第二短節距週期性結構的與晶格槽正交之方向中的至少2個在一條直線上, 上述有機半導體雷射裝置具有加長的(WS1+WS2)、縮短的WL、加長的(WS1+WL+WS2)及2個以上超晶胞結構中的至少一個,其中WS1表示在上述第一短節距週期性結構的與晶格槽正交之方向上的長度,WS2表示在上述第二短節距週期性結構的與晶格槽正交之方向上的長度,WL表示在上述長節距週期性結構的與晶格槽正交之方向上的長度。 關於第一短節距週期性結構、長節距週期性結構及第二短節距結構、例示性範圍(WS1+WS2)、WL、(WS1+WS2)/WL及(WS1+WL+WS2)的說明,可以參考以上“用於改善有機半導體雷射裝置的方法”段落中的說明。 Organic semiconductor laser device The organic semiconductor laser device of the present invention is an organic semiconductor laser device including an optical resonator structure and a light amplification layer composed of an organic semiconductor, wherein, The above-mentioned optical resonator structure has at least one supercell structure, and the above-mentioned supercell structure has a first short-pitch periodic structure, a long-pitch periodic structure and a second short-pitch periodic structure, The first short-pitch periodic structure is disposed adjacent to one end of the long-pitch periodic structure, and the second short-pitch periodic structure is disposed adjacent to the other end of the long-pitch periodic structure, (i) the direction orthogonal to the lattice grooves of the above-mentioned first short-pitch periodic structure, (ii) the direction orthogonal to the lattice grooves of the above-mentioned long-pitch periodic structure, and (iii) the above-mentioned second short section On a straight line from at least two of the directions orthogonal to the lattice grooves of the periodic structure, The above-mentioned organic semiconductor laser device has at least one of elongated (WS1+WS2), shortened WL, elongated (WS1+WL+WS2) and two or more supercell structures, where WS1 is represented by the above-mentioned first short section The length from the periodic structure in the direction orthogonal to the lattice groove, WS2 represents the length of the second short-pitch periodic structure in the direction orthogonal to the lattice groove, WL represents the length in the above-mentioned long pitch period The length of the linear structure in the direction orthogonal to the lattice grooves. Regarding the first short-pitch periodic structure, the long-pitch periodic structure, and the second short-pitch structure, exemplary ranges (WS1+WS2), WL, (WS1+WS2)/WL, and (WS1+WL+WS2) For description, reference may be made to the description in the paragraph "Method for Improving Organic Semiconductor Laser Device" above.

本發明的有機半導體雷射裝置可以為光幫浦有機半導體雷射裝置,或者可以為電幫浦有機半導體雷射裝置(有機半導體雷射二極體)。光幫浦有機半導體雷射裝置具有光共振器結構及光放大層。電幫浦有機半導體雷射裝置具有電極對、光共振器結構、至少包含光放大層之有機層。 電幫浦有機半導體雷射裝置的構件和層在後面進行說明。有關光共振器結構及光放大層的說明亦可以適用於光幫浦有機半導體雷射裝置的光共振器結構及光放大層。 The organic semiconductor laser device of the present invention may be an optically pumped organic semiconductor laser device, or may be an electrically pumped organic semiconductor laser device (organic semiconductor laser diode). The optical pump organic semiconductor laser device has an optical resonator structure and an optical amplification layer. The electrically pumped organic semiconductor laser device has an electrode pair, an optical resonator structure, and an organic layer including at least a light amplification layer. The components and layers of the electrically pumped organic semiconductor laser device will be described later. The description of the optical resonator structure and the optical amplification layer can also be applied to the optical resonator structure and the optical amplification layer of the optical pump organic semiconductor laser device.

電極 本發明的電幫浦有機半導體雷射裝置具有電極對。為了光輸出,一電極可以是透明的。電極可以根據其功函數等適當地選擇本領域中通常使用的電極材料。電極材料包括Ag、Al、Au、Cu及ITO等,但並不限於此。 electrode The electrically pumped organic semiconductor laser device of the present invention has an electrode pair. For light output, one electrode can be transparent. The electrode can be appropriately selected from electrode materials commonly used in the field according to its work function and the like. Electrode materials include Ag, Al, Au, Cu, ITO, etc., but are not limited thereto.

光共振器結構 光共振器結構具有上述2個以上超晶胞結構。光共振器結構中的超晶胞結構的數量例如為4以上、6以上、8以上及10以上。 光共振器結構可以具有以2個以上超晶胞結構的與晶格槽正交之方向在一條直線上的方式配置之2個以上超晶胞結構。在本發明的一實施形態中,2個以上超晶胞結構的WS1、WL及WS2相同。在本發明的一實施形態中,2個以上超晶胞結構的與晶格槽正交之方向上的長度是隨機的。將能夠用於本發明的實施形態之具有隨機超晶胞長度之光共振器結構的一例示於圖2。圖2所示之光共振器結構具有在與晶格槽正交之方向上的長度不同的3種超晶胞結構SC1、SC2、SC3,3種超晶胞結構的配置是隨機的。其中,3種超晶胞結構的長度由下述式表示。 WL 1=30Λ 1+6Λ 2+30Λ 1WL 2=20Λ 1+5Λ 2+20Λ 1WL 3=8Λ 1+3Λ 2+8Λ 1其中,WL 1、WL 2及WL 3為3種超晶胞結構在與晶格槽正交之方向上的各長度,Λ 1為第一短節距週期性結構的節距,Λ 2為第二短節距週期性結構的節距。 圖3表示藉由從具有圖2所示之光共振器結構之雷射裝置發射之雷射的遠場圖樣的模擬獲得之雷射發射的角度依賴性。各晶胞的超晶胞長度不同(隨機超晶胞長度)時會導致超晶胞沒有週期性,這會導致雷射僅以0度的單一角度出現。該有機半導體雷射裝置能夠用作以單一角度發射相同波長的雷射陣列。 Optical resonator structure The optical resonator structure has the above-mentioned two or more supercell structures. The number of supercell structures in the optical resonator structure is, for example, 4 or more, 6 or more, 8 or more, and 10 or more. The optical resonator structure may have two or more supercell structures arranged in a straight line with directions orthogonal to the lattice grooves of the two or more supercell structures. In one embodiment of the present invention, WS1, WL, and WS2 of two or more supercell structures are the same. In an embodiment of the present invention, the lengths of two or more supercell structures in a direction orthogonal to the lattice grooves are random. An example of an optical resonator structure having a random supercell length that can be used in an embodiment of the present invention is shown in FIG. 2 . The optical resonator structure shown in Figure 2 has three supercell structures SC1, SC2, and SC3 with different lengths in the direction orthogonal to the lattice grooves. The configurations of the three supercell structures are random. Among them, the lengths of the three supercell structures are represented by the following formulas. WL 1 =30Λ 1 +6Λ 2 +30Λ 1 WL 2 =20Λ 1 +5Λ 2 +20Λ 1 WL 3 =8Λ 1 +3Λ 2 +8Λ 1Among them, WL 1 , WL 2 and WL 3 are three kinds of supercell structures For each length in the direction orthogonal to the lattice groove, Λ 1 is the pitch of the first short-pitch periodic structure, and Λ 2 is the pitch of the second short-pitch periodic structure. FIG. 3 shows the angular dependence of laser emission obtained by simulation of the far-field pattern of laser emitted from a laser device having the optical resonator structure shown in FIG. 2 . When the supercell lengths of each unit cell are different (random supercell length), the supercell will not have periodicity, which will cause the laser to only appear at a single angle of 0 degrees. The organic semiconductor laser device can be used as a laser array emitting the same wavelength at a single angle.

超晶胞結構的第一短節距週期性結構、長節距週期性結構及第二短節距週期性結構分別具有深度未達75nm的槽,例如為20~70nm。 在本發明的一實施形態中,第一短節距週期性結構、長節距週期性結構及第二短節距週期性結構具有分布式回饋(DFB)結構。DFB結構為設計成滿足式(I)的布拉格條件之繞射光柵結構。 mλ Bragg=2n effΛ                               (I) 其中,m為繞射階數,λ Bragg為布拉格共振波長,n eff為波導的有效折射率,Λ為光柵週期(節距)。 第一短節距週期性結構、長節距週期性結構及第二短節距週期性結構的DFB結構可以選自包括一階DFB結構、二階DFB結構、三階DFB結構及更高階DFB結構之群組中。然而,在每個超晶胞結構中,長節距週期性結構的DFB結構的階數大於第一短節距週期性結構及第二短節距週期性結構的DFB結構的階數。 The first short-pitch periodic structure, the long-pitch periodic structure and the second short-pitch periodic structure of the supercell structure respectively have grooves with a depth less than 75 nm, for example, 20-70 nm. In an embodiment of the present invention, the first short-pitch periodic structure, the long-pitch periodic structure and the second short-pitch periodic structure have a distributed feedback (DFB) structure. The DFB structure is a diffraction grating structure designed to satisfy the Bragg condition of formula (I). mλ Bragg =2n eff Λ (I) where m is the diffraction order, λ Bragg is the Bragg resonance wavelength, n eff is the effective refractive index of the waveguide, and Λ is the grating period (pitch). The DFB structures of the first short-pitch periodic structure, the long-pitch periodic structure and the second short-pitch periodic structure may be selected from the group consisting of first-order DFB structures, second-order DFB structures, third-order DFB structures and higher-order DFB structures. in the group. However, in each supercell structure, the order of the DFB structure of the long-pitch periodic structure is greater than the order of the DFB structures of the first short-pitch periodic structure and the second short-pitch periodic structure.

第一短節距週期性結構、長節距週期性結構及第二短節距週期性結構可以由絕緣材料構成。絕緣材料的具體例包括玻璃、二氧化矽及塑膠。 在本發明的一實施形態中,第一短節距週期性結構、長節距週期性結構及第二短節距週期性結構通常由絕緣材料形成。 在本發明的一實施形態中,第一短節距週期性結構、長節距週期性結構及第二短節距週期性結構具有在絕緣基板上由絕緣材料構成之週期性排列的脊部。在該情況下,脊部及絕緣基板可以由不同的絕緣材料構成。例如,脊部可以由二氧化矽構成,絕緣基板可以由玻璃基板構成。在具有絕緣基板上週期性排列的脊部之週期性結構中,絕緣基板的表面可以露出於槽(相鄰脊部之間)的底部。脊部的高度範圍可以參考上述晶格槽的深度範圍。 The first short-pitch periodic structure, the long-pitch periodic structure and the second short-pitch periodic structure may be composed of insulating materials. Specific examples of insulating materials include glass, silicon dioxide and plastic. In an embodiment of the present invention, the first short-pitch periodic structure, the long-pitch periodic structure and the second short-pitch periodic structure are generally formed of insulating materials. In an embodiment of the invention, the first short-pitch periodic structure, the long-pitch periodic structure and the second short-pitch periodic structure have periodically arranged ridges made of insulating material on the insulating substrate. In this case, the ridge and the insulating substrate may be composed of different insulating materials. For example, the ridges may be composed of silicon dioxide and the insulating substrate may be composed of a glass substrate. In a periodic structure with periodically arranged ridges on an insulating substrate, the surface of the insulating substrate may be exposed at the bottom of the grooves (between adjacent ridges). The height range of the ridge may refer to the depth range of the lattice grooves mentioned above.

有機層 有機層至少包含由有機半導體構成之光放大層。有機層可以設置於光共振器結構的表面。 organic layer The organic layer at least includes a light amplification layer composed of an organic semiconductor. The organic layer can be disposed on the surface of the optical resonator structure.

有機層中的光放大層 在光放大層中使用的有機半導體可以為由選自包括碳原子、氫原子、氮原子、氧原子、硫原子、磷原及硼原子之群組中之一種以上原子構成之化合物。該等化合物的例子包括由選自包括碳原子、氫原子及氮原子之群組中之一種以上原子構成之化合物。 光放大層至少包含顯示出雷射活性之有機半導體。此處提及的“顯示出雷射活性之有機半導體”表示藉由從外部提供能量能夠引發雷射振盪之有機半導體。以下,將“顯示出雷射活性之有機半導體”稱為“雷射活性材料”。 雷射活性材料的一例為具有至少一個二苯乙烯單元之化合物,雷射活性材料的另一例為具有至少一個二苯乙烯單元及至少一個咔唑單元之化合物。二苯乙烯單元及咔唑單元可以被烷基等取代基取代,亦可以未經取代。有機半導體化合物可以為不具有重複單元之非聚合物。該化合物的分子量可以為1000以下,例如可以為750以下。雷射活性材料的具體例包括4,4'-雙[(N-咔唑)苯乙烯基]聯苯(BSBCz)(化學結構示於圖4(d))。光放大層可以包含2種以上雷射活性材料。例如,光放大層僅包含1種雷射活性材料。 光放大層可以僅包含雷射活性材料,或者亦可以包含雷射活性材料以外的其他有機半導體。其他有機半導體的例子為作為主體材料的有機半導體。所使用的主體材料可以為激發單重態能量及激發三重態能量中的至少一個高於雷射活性材料之有機化合物。其結果,可以將在雷射活性材料中產生之單重態激發及三重態激發控制在雷射活性材料的分子內,由此降低雷射閾值。然而,存在即使單重態激發和三重態激發未充分受限,雷射性能仍得到改善的情況,因此在本發明中可以沒有特別限制地使用能夠改善雷射性能之主體材料。主體材料能夠適當地選自已知的主體材料及具有高玻璃轉移溫度之有機半導體。 在使用主體材料的情況下,在光放大層中雷射活性材料的量例如為0.1重量%以上、1重量%以上、50重量%以下、20重量%以下及10重量%以下。 在光共振器結構的作用下,藉由雷射活性材料產生之受激發射光發射到外部作為雷射光。在本發明的一實施形態中,來源於雷射活性材料之雷射光藉由光共振器結構的超晶胞結構繞射且作為繞射光發射到外部。此時,發射自有機半導體雷射裝置之光可以包括發射自主體材料之光。來源於雷射活性材料之光可以為主成分。 Light amplifying layer in organic layer The organic semiconductor used in the light amplifying layer may be a compound composed of one or more atoms selected from the group consisting of carbon atoms, hydrogen atoms, nitrogen atoms, oxygen atoms, sulfur atoms, phosphorus atoms, and boron atoms. Examples of such compounds include compounds composed of one or more atoms selected from the group consisting of carbon atoms, hydrogen atoms, and nitrogen atoms. The light amplification layer at least contains an organic semiconductor showing laser activity. The "organic semiconductor exhibiting laser activity" mentioned here means an organic semiconductor capable of inducing laser oscillation by supplying energy from the outside. Hereinafter, the "organic semiconductor exhibiting laser activity" will be referred to as a "laser active material". One example of the laser active material is a compound having at least one stilbene unit, and another example of the laser active material is a compound having at least one stilbene unit and at least one carbazole unit. The stilbene unit and the carbazole unit may be substituted by a substituent such as an alkyl group, or may be unsubstituted. The organic semiconductor compound may be a non-polymer having no repeating units. The molecular weight of the compound may be 1,000 or less, for example, 750 or less. Specific examples of laser active materials include 4,4'-bis[(N-carbazole)styryl]biphenyl (BSBCz) (the chemical structure is shown in Figure 4(d)). The light amplification layer may contain more than two types of laser active materials. For example, the light amplification layer contains only 1 laser active material. The light amplification layer may only include laser active materials, or may include other organic semiconductors other than laser active materials. Other examples of organic semiconductors are organic semiconductors as host materials. The host material used may be an organic compound with at least one of the excited singlet energy and the excited triplet energy higher than that of the laser active material. As a result, the singlet state excitation and triplet state excitation generated in the laser active material can be controlled within the molecules of the laser active material, thereby lowering the laser threshold. However, there are cases where the laser performance is improved even if the singlet excitation and the triplet excitation are not sufficiently restricted, so a host material capable of improving the laser performance can be used in the present invention without particular limitation. The host material can be suitably selected from known host materials and organic semiconductors with high glass transition temperatures. When a host material is used, the amount of the laser active material in the light amplification layer is, for example, 0.1% by weight or more, 1% by weight or more, 50% by weight or less, 20% by weight or less, and 10% by weight or less. Under the action of the optical resonator structure, the stimulated emission light generated by the laser active material is emitted to the outside as laser light. In an embodiment of the present invention, the laser light originating from the laser active material is diffracted by the supercell structure of the optical resonator structure and is emitted to the outside as diffracted light. At this time, the light emitted from the organic semiconductor laser device may include light emitted from the host material. Light derived from laser-active materials can be the main component.

有機層中的其他層 有機層可以僅由光放大層形成,或者亦可以具有光放大層以外的一個以上有機層。有機層的例子包括電子注入層、電洞注入層。 有機層的異質界面的數量越少,電幫浦有機半導體雷射裝置的性能傾向於越好,因此,有機層的數量例如為3以下、2以下、1以下。在電幫浦有機半導體雷射裝置具有2個以上有機層時,例如光放大層的厚度大於有機層的總厚度的50%,例如大於60%及大於70%。電幫浦有機半導體雷射裝置具有2個以上有機層時,有機層的總厚度例如可以為100nm以上、120nm以上或170nm以上,並且可以為370nm以下、320nm以下或270nm以下。電子注入層及電洞注入層的折射率可以小於光放大層的折射率。 在配置電子注入層時,可以在電子注入層中添加促進電子注入到光放大層之物質。在配置電洞注入層時,可以在電洞注入層中添加促進電洞注入到光放大層之物質。該等物質可以為有機化合物或無機物質。例如,用於電子注入層的無機物質例如包括Cs等鹼金屬,且其在包含有機化合物之電子注入層中的濃度例如可以為1重量%以上、5重量%以上或10重量%以上,並且可以為40重量%以下或30重量%以下。電子注入層的厚度例如可以為3nm以上、10nm以上或30nm以上,並且可以為100nm以下、80nm以下或60nm以下。 有機層的光放大層及其他層的成膜方法並沒有特別限制,有機層的每個層可以藉由乾法及濕法中的任意方法製造。 包括放大層在內之有機層的總厚度例如為80~350nm、100~300nm及150~250nm。 Other layers in the organic layer The organic layer may be formed of only the light amplification layer, or may have one or more organic layers other than the light amplification layer. Examples of organic layers include electron injection layers and hole injection layers. The smaller the number of heterointerfaces of the organic layer, the better the performance of the electrically pumped organic semiconductor laser device. Therefore, the number of organic layers is, for example, 3 or less, 2 or less, or 1 or less. When the electrically pumped organic semiconductor laser device has more than two organic layers, for example, the thickness of the light amplification layer is greater than 50% of the total thickness of the organic layers, such as greater than 60% and greater than 70%. When the electrically pumped organic semiconductor laser device has two or more organic layers, the total thickness of the organic layers may be, for example, more than 100 nm, more than 120 nm, or more than 170 nm, and may be less than 370 nm, less than 320 nm, or less than 270 nm. The refractive index of the electron injection layer and the hole injection layer may be smaller than the refractive index of the light amplification layer. When configuring the electron injection layer, a substance that promotes electron injection into the light amplification layer may be added to the electron injection layer. When configuring the hole injection layer, a substance that promotes hole injection into the light amplification layer can be added to the hole injection layer. Such substances may be organic compounds or inorganic substances. For example, the inorganic substance used for the electron injection layer includes, for example, an alkali metal such as Cs, and its concentration in the electron injection layer containing an organic compound may be, for example, 1% by weight or more, 5% by weight or more, or 10% by weight or more, and may 40% by weight or less or 30% by weight or less. The thickness of the electron injection layer may be, for example, 3 nm or more, 10 nm or more, or 30 nm or more, and may be 100 nm or less, 80 nm or less, or 60 nm or less. The method of forming the light amplification layer and other layers of the organic layer is not particularly limited, and each of the organic layers can be produced by any method of dry method or wet method. The total thickness of the organic layer including the amplification layer is, for example, 80-350 nm, 100-300 nm, and 150-250 nm.

其他層 本發明的有機半導體雷射裝置可以僅由光共振器結構及有機半導體層構成,或者亦可以進一步包含其他層。其他層包括透明保護層。將透明保護層設置在與光共振器結構相對之有機層一側。透明保護層具有保護有機層的功能。 透明保護層可以由實質上透明的材料形成。用於透明保護層的材料的例子包括含氟樹脂及藍寶石玻璃。在塗布於有機層表面的含氟樹脂上積層藍寶石玻璃而成之積層體(含氟樹脂/藍寶石玻璃)可用作透明保護層。作為市售樹脂,例如,可以使用CYTOP(AGC Chemicals)。 other layers The organic semiconductor laser device of the present invention may only consist of an optical resonator structure and an organic semiconductor layer, or may further include other layers. Other layers include a transparent protective layer. A transparent protective layer is disposed on the side of the organic layer opposite to the optical resonator structure. The transparent protective layer has the function of protecting the organic layer. The transparent protective layer may be formed of a substantially transparent material. Examples of materials used for the transparent protective layer include fluorine-containing resin and sapphire glass. A laminate (fluorine-containing resin/sapphire glass) in which sapphire glass is laminated on fluorine-containing resin coated on the surface of the organic layer can be used as a transparent protective layer. As a commercially available resin, for example, CYTOP (AGC Chemicals) can be used.

在本發明的有機半導體雷射裝置中,雷射光束可以從與有機層相對之光共振器結構一側發射,或者可以從與有機層相對之透明保護層一側發射。 由於本發明的有機半導體雷射裝置包括具有加長的(WS1+WS2)、縮短的WL、加長的(WS1+WL+WS2)及2個以上超晶胞結構中的至少一個之光共振器結構,因此顯示出低雷射閾值。此外,在本發明的一實施形態中,有機半導體雷射裝置發射繞射光束的繞射角之間的角差窄的分離雷射光束。因此,有機半導體雷射裝置能夠有效地用作檢測3D幾何形狀之結構光照射裝置。在該種情況下,在具有不同繞射角之2種以上繞射光束中發射角度最接近的2個繞射光束的繞射角之間的角差為8°以下,例如為7°以下及6°以下。 In the organic semiconductor laser device of the present invention, the laser beam may be emitted from the side of the optical resonator structure opposite to the organic layer, or may be emitted from the side of the transparent protective layer opposite to the organic layer. Since the organic semiconductor laser device of the present invention includes an optical resonator structure having at least one of elongated (WS1+WS2), shortened WL, elongated (WS1+WL+WS2) and two or more supercell structures, Therefore exhibits low laser threshold. Furthermore, in one embodiment of the present invention, the organic semiconductor laser device emits split laser beams with a narrow angular difference between the diffraction angles of the diffracted beams. Therefore, the organic semiconductor laser device can be effectively used as a structured light illumination device for detecting 3D geometric shapes. In this case, the angle difference between the diffraction angles of the two diffraction beams with the closest emission angles among the two or more diffraction beams with different diffraction angles is 8° or less, for example, 7° or less and below 6°.

有機半導體雷射裝置的用途 如上所述,本發明的有機半導體雷射裝置顯示出低振盪閾值及窄雷射發射的繞射角。因此,本發明的有機半導體雷射裝置可用作檢測3D幾何形狀之結構光照射裝置,且能夠有效地用於生物感測器、結構光照射裝置、光學感測裝置及人臉辨識裝置。 Applications of organic semiconductor laser devices As described above, the organic semiconductor laser device of the present invention exhibits a low oscillation threshold and a narrow diffraction angle of laser emission. Therefore, the organic semiconductor laser device of the present invention can be used as a structured light irradiation device for detecting 3D geometric shapes, and can be effectively used in biological sensors, structured light irradiation devices, optical sensing devices and face recognition devices.

關於本發明的進一步詳細說明 以下,對本發明進行進一步詳細的說明。 在雷射裝置中控制雷射發射角對於光感測及顯示等諸多光電子及光子應用來講是必須的。在本說明書中,對具有有機增益介質之一維抽樣分布式回饋(1D-DFB)共振器中的雷射光束的光繞射圖樣進行了研究。光柵由具有一階光柵圍繞二階光柵之混合階抽樣光柵之重複的超晶胞構成。實驗結果顯示雷射光束的繞射角根據超晶胞結構而相當多樣化。在實驗和理論方面證實了雷射光束的繞射角(θ)的間隔與超晶胞的長度成反比。藉由調整超晶胞長度及一階及二階區域的長度,在不同的電弧發射模式下間隔θ從0.1°被調整為43°。隨著θ的降低亦即更長的一階區域,可獲得顯著的雷射閾值降低,其結果,使用~3.5ns長脈衝寬度激發源時的最小雷射閾值為2.5±0.1μJ/cm 2Further detailed description of the present invention The present invention will be described in further detail below. Controlling the laser emission angle in laser devices is necessary for many optoelectronic and photonic applications such as light sensing and display. In this specification, the optical diffraction pattern of a laser beam in a one-dimensional sampled distributed feedback (1D-DFB) resonator with organic gain medium is studied. The grating is composed of a supercell with repetitions of mixed-order sampling gratings surrounding a second-order grating. Experimental results show that the diffraction angle of the laser beam is quite diverse depending on the supercell structure. It has been experimentally and theoretically confirmed that the distance between the diffraction angles (θ) of the laser beam is inversely proportional to the length of the supercell. By adjusting the length of the supercell and the lengths of the first- and second-order regions, the spacing θ is adjusted from 0.1° to 43° under different arc emission modes. As θ decreases, i.e. longer the first-order region, a significant reduction in laser threshold is obtained, resulting in a minimum laser threshold of 2.5 ± 0.1 μJ/cm 2 using a ~3.5 ns long pulse width excitation source.

以下,參考工作實施例,對本發明的特徵進行更具體的說明。 在本工作中,對具有有機增益層之一維(1D)-抽樣DFB共振器中的光繞射圖樣及雷射閾值進行了研究。在最近的具有混合階DFB結構之OSLD(有機半導體雷射二極體)中,發現光以不同的角度繞射並且繞射光束之間的每個角度為10°(在本說明書的餘下內容中,將繞射光束之間的角度稱為“繞射角”)。在各10°繞射角下特定電弧會增強雷射發射圖樣 14。超晶胞的長度與繞射角之間的關係從理論上來講已成立,但實驗證明及潛在影響如降低雷射閾值尚未得到充分的研究。尤其,針對有機層,尚未進行用於獲得更高解析度之繞射角控制。因此,設計並製造了超晶胞長度及一階及二階區域長度不同的各種混合階抽樣DFB結構以解決該角度問題並降低雷射閾值。 Hereinafter, the features of the present invention will be described in more detail with reference to working examples. In this work, the optical diffraction pattern and laser threshold in a one-dimensional (1D)-sampled DFB resonator with an organic gain layer are studied. In recent OSLDs (organic semiconductor laser diodes) with mixed-order DFB structures, it was found that light is diffracted at different angles and each angle between the diffracted beams is 10° (in the remainder of this specification , the angle between the diffracted beams is called the "diffraction angle"). Certain arcs enhance the laser emission pattern at each 10° diffraction angle14. The relationship between the length of the supercell and the diffraction angle is theoretically established, but the experimental proof and potential effects such as lowering the laser threshold have not been fully studied. In particular, for the organic layer, diffraction angle control for obtaining higher resolution has not yet been performed. Therefore, various mixed-order sampling DFB structures with different supercell lengths and first- and second-order region lengths were designed and fabricated to solve this angle problem and reduce the laser threshold.

[實施例1] 光柵設計 在本發明中使用的DFB結構由重複的超晶胞構成,該超晶胞具有混合階光柵,亦即二階光柵的兩側由一階光柵夾住(圖4)。一階DFB區域的長度在1,632nm~27,200nm之間變化。作為有機增益介質,使用6wt%-BSBCz:CBP的客體:主體系統,這是因為其會提供最佳雷射舉動。 15亦利用傅立葉成像光譜以量測所發射的雷射光束的繞射角。DFB共振器中,光回饋是因向前及向後傳播波之間的耦合而產生的。 16該耦合對於滿足以下布拉格條件之具體波長來說是最大的。 mλ Bragg=2n effΛ                               (1) 其中,m為繞射階數,λ Bragg為布拉格共振波長,n eff為波導的有效折射率,Λ為光柵週期。在二階光柵的情況下,m等於2,在一階光柵的情況下,m等於1。此外,藉由以下夫朗和斐繞射定律說明基於超晶胞的光繞射。 nλ 0SC∙sinθ m(2) 其中,n為繞射階數,λ 0為布拉格波長附近的雷射發射,Λ SC為超晶胞長度,θ m為繞射角。根據該式,繞射角與超晶胞長度成反比。在DFB共振器設計中,所選擇的布拉格波長為465nm,BSBCz:CBP膜的放大自發射(ASE)光譜的峰波長在465nm處存在一個峰(圖11)。 DFB共振器由重複的超晶胞構成。各超晶胞藉由1個二階光柵圍繞2個一階光柵來構成。一階及二階DFB光柵的週期分別為136及272nm(圖4(a))。週期性長度藉由以相同的裝置結構(例如,總厚度及增益介質)對具有不同週期性長度之標準二階DFB裝置進行測試來確定,獲得了顯示出最低光學閾值之最佳候選項(圖12(b))。然後,藉由將二階週期性長度除以2,自動得出一階週期。經驗有效折射率的特徵為1.71。然後,構成了各超晶胞中的比例為4:12、4:36及4:200(二階:一階)、二階週期數同樣為4(深藍色)的混合階DFB(圖4(b))。作為第一候選項,將比例4:12的結構用於第一OSLD結構,並確定使用該結構作為參考。其他候選項的一階長度大於比例4:12的結構,這表明藉由增加一階區域來加長了超晶胞長度。如圖4(b)所示,超晶胞的具體長度在比例4:12時為2,720nm,4:36時為5,984nm,4:200時為28,288nm。 [Example 1] Grating design The DFB structure used in the present invention is composed of a repeated supercell having a mixed-order grating, that is, a second-order grating is sandwiched on both sides by a first-order grating (Fig. 4). The length of the first-order DFB region varies between 1,632nm and 27,200nm. As the organic gain medium, a guest:host system of 6wt%-BSBCz:CBP was used because it provides optimal laser behavior. 15 Fourier imaging spectroscopy is also used to measure the diffraction angle of the emitted laser beam. In a DFB resonator, optical feedback occurs due to the coupling between forward and backward propagating waves. 16This coupling is maximum for a specific wavelength that satisfies the following Bragg conditions. mλ Bragg =2n eff Λ (1) Among them, m is the diffraction order, λ Bragg is the Bragg resonance wavelength, n eff is the effective refractive index of the waveguide, and Λ is the grating period. In the case of second-order gratings, m is equal to 2, and in the case of first-order gratings, m is equal to 1. In addition, the light diffraction based on the supercell is explained by the following Fraunhofer diffraction law. nλ 0SC ∙sinθ m (2) Among them, n is the diffraction order, λ 0 is the laser emission near the Bragg wavelength, Λ SC is the length of the supercell, and θ m is the diffraction angle. According to this formula, the diffraction angle is inversely proportional to the length of the supercell. In the DFB resonator design, the selected Bragg wavelength is 465 nm, and the peak wavelength of the amplified self-emission (ASE) spectrum of the BSBCz:CBP film has a peak at 465 nm (Figure 11). DFB resonators are constructed from repeating supercells. Each supercell is composed of one second-order grating surrounding two first-order gratings. The periods of the first-order and second-order DFB gratings are 136 and 272 nm respectively (Figure 4(a)). The periodicity length was determined by testing standard second-order DFB devices with different periodicity lengths with the same device structure (e.g., total thickness and gain medium), and the best candidate showing the lowest optical threshold was obtained (Figure 12 (b)). Then, by dividing the length of the second-order periodicity by 2, the first-order period is automatically obtained. The empirical effective refractive index is characterized as 1.71. Then, a mixed-order DFB with the ratios of 4:12, 4:36 and 4:200 (second order: first order) and the same second-order period number 4 (dark blue) in each supercell is formed (Figure 4(b) ). As a first candidate, a structure with a ratio of 4:12 was used for the first OSLD structure and it was determined to use this structure as a reference. The first-order lengths of other candidates are larger than those of the 4:12 ratio structure, suggesting that the supercell length is lengthened by increasing the first-order area. As shown in Figure 4(b), the specific lengths of the supercell are 2,720 nm at the ratio of 4:12, 5,984 nm at 4:36, and 28,288 nm at 4:200.

裝置製造 製造有機半導體雷射(OSL)裝置時,在覆蓋了70nm厚度的濺射SiO 2之玻璃基板上製備了混合階DFB。首先,依次使用丙酮和沸騰異丙醇,藉由超音波處理進行了清洗。溶劑清洗之後,實施了15分鐘的UV臭氧處理。為了使SiO 2表面具有疏水性,將六甲基二矽氮烷(HDMS)以4000rpm旋塗15秒之後在120℃下退火2分鐘。然後,將藉由以1:2的比例混合ZEP-520A及ZEP-520A-7(ZEON)來製備之光主劑溶液以4,500rpm旋塗了30秒。然後在基板頂部以300rpm旋塗15秒並在180℃下退火4分鐘。所獲得之抗蝕劑層的厚度為50nm。最後,將靜電耗散材料Espacer(Showa Denko K.K.)以1500rpm旋塗30秒,並在80℃下退火4分鐘。然後,使用電子束微影系統ELS-G100(Elionix)在基板上繪製了DFB光柵圖樣。晶片面積為1×1mm 2。電子束曝光之後,在室溫下、二甲苯光溶劑中對光柵圖樣進行了1分鐘顯影。然後,藉由反應離子蝕刻機RIE-10NR(SAMCO)對波紋狀抗蝕劑層進行了蝕刻。在此,首先在流量30sccm及功率70W的條件下,施加了CHF 3氣體5分鐘。之後,將抗蝕劑層的其餘部分使用O 2氣體,在流量70sccm及功率100W的條件下,清洗了1分鐘。所獲得之光柵的高度預計為69±5nm。將藉由掃描電子顯微鏡(JSM-7900F,JEOL)觀察到的光柵表面示於圖13。接著,在玻璃/SiO 2光柵的頂部,藉由作為客體的6wt%-BSBCz與作為主體的CBP的熱共蒸發來製造了厚度200nm的活性層,並在真空下儲存裝置24小時以對塗布於裝置頂部作為保護層之CYTOP層進行硬化。將OSL結構示意圖示於圖4(c)。 Device Fabrication During the fabrication of organic semiconductor laser (OSL) devices, mixed-stage DFBs were prepared on glass substrates covered with sputtered SiO 2 with a thickness of 70 nm. First, cleaning was performed by ultrasonic treatment using acetone and boiling isopropyl alcohol in sequence. After solvent cleaning, UV ozone treatment was performed for 15 minutes. In order to make the SiO2 surface hydrophobic, hexamethyldisilazane (HDMS) was spin-coated at 4000 rpm for 15 s and then annealed at 120 °C for 2 min. Then, the light base agent solution prepared by mixing ZEP-520A and ZEP-520A-7 (ZEON) in a ratio of 1:2 was spin-coated at 4,500 rpm for 30 seconds. It was then spin-coated on top of the substrate at 300 rpm for 15 seconds and annealed at 180 °C for 4 minutes. The thickness of the resist layer obtained was 50 nm. Finally, the static dissipative material Espacer (Showa Denko KK) was spin-coated at 1500 rpm for 30 s and annealed at 80 °C for 4 min. Then, the DFB grating pattern was drawn on the substrate using an electron beam lithography system ELS-G100 (Elionix). The wafer area is 1×1mm 2 . After electron beam exposure, the grating pattern was developed in xylene photosolvent for 1 minute at room temperature. Then, the corrugated resist layer was etched by a reactive ion etching machine RIE-10NR (SAMCO). Here, CHF 3 gas was first applied for 5 minutes under the conditions of flow rate 30 sccm and power 70 W. After that, the remaining part of the resist layer was cleaned using O 2 gas at a flow rate of 70 sccm and a power of 100 W for 1 minute. The height of the obtained grating is expected to be 69 ± 5 nm. The grating surface observed by a scanning electron microscope (JSM-7900F, JEOL) is shown in Figure 13. Next, an active layer with a thickness of 200 nm was fabricated on the top of the glass/ SiO grating by thermal co-evaporation of 6wt%-BSBCz as the guest and CBP as the host, and the device was stored under vacuum for 24 hours to coat on The CYTOP layer, which acts as a protective layer on top of the device, is hardened. The schematic diagram of the OSL structure is shown in Figure 4(c).

結果及討論 OSL的雷射性能在幫浦波長為337nm及脈衝寬度為~3.5ns的來源於氮氣雷射NL100(thinkSRS Inc.)之脈衝光幫浦中進行了確認。幫浦光束面積為~2.0×10 -3cm 2(圖10)。OSL從藍寶石蓋玻片的上部沿垂直於基板表面的方向(0°)發射,並且在0°下利用多通道光譜儀(Hamamatsu製PMA-50)從玻璃基板側記錄光發射圖樣(圖7)。 Results and Discussion The laser performance of OSL was confirmed on a pulsed light pump derived from nitrogen laser NL100 (thinkSRS Inc.) with a pump wavelength of 337nm and a pulse width of ~3.5ns. The pump beam area is ~2.0×10 -3 cm 2 (Fig. 10). OSL was emitted from the upper part of the sapphire cover glass in the direction perpendicular to the substrate surface (0°), and the light emission pattern was recorded from the glass substrate side using a multi-channel spectrometer (PMA-50 manufactured by Hamamatsu) at 0° (Fig. 7).

發射繞射角量測 首先,進行角度依賴性發射亦即DFB OSL的光子能帶圖以確定3個光柵設計的夫朗和斐繞射。利用傅立葉成像光譜系統量測了光子能帶圖(圖8)。該量測系統具有物鏡及傅立葉透鏡,能夠收集在-23°~23°的角度θ範圍內的複數個繞射階數。該實驗裝置的詳細內容在輔助材料中進行了說明。使用氮氣雷射NL100用於激發,並使用偏光器分開TE與TM模式。將比例為4:12、4:36及4:200的混合階抽樣DFB的光子能帶圖示於圖5。該等光子能帶圖顯示最佳耦合波長(布拉格波長)如何隨角度變化,繪製出以特定角度交叉之複數個能帶。在僅具有1個二階光柵之簡單結構的情況下,發現僅2個能帶以0°彼此交叉,這在先前的研究中已得到良好的證實。 17圖5(a)至圖5(c)示出比例為4:12、4:36及4:200(所對應的超晶胞週期分別為2,720nm、5,984nm及28,288nm)的OSL的光子能帶。該等光譜顯示出來源於光子能帶結構之特徵性光譜及角度收窄。高於閾值時,對應於繞射雷射光束,發生向垂直於光柵的方向的角度收窄。平行於光柵的方向上的光束形狀為扇形。 18如圖5(a)至圖5(c)所示,在雷射閾值附近,3個OSL的光子能帶圖清晰地顯示出以不同的等距角交叉之複數個能帶。在-20°<θ<+20°的角度範圍內,觀察到光子能帶以不同的波長及等距角交叉。因此,在OSL中出現附加光子能帶是因為產生夫朗和斐繞射之二階週期性亦即超晶胞週期的附加(將單一週期結構的光子能帶的一例示於圖15)。2個繞射光束之間的角度滿足夫朗和斐定律(Eq.2),在每個光子能帶的交叉處會出現一個光子阻帶。在該光子能隙的帶緣發生雷射振盪,這是因為如先前文獻中所記載,帶緣處存在高品質因子。 19可以觀察到2個雷射光束之間的角度與超晶胞長度成反比如夫朗和斐定律所預測(Eq.2)。表1(No.4、5及6)示出關於不同結構中的繞射雷射光束,利用夫朗和斐定律(Eq.2)之量測角度與計算角度之間存在優異的一致性。 Emission Diffraction Angle Measurement First, the photon band diagram of the angle-dependent emission, that is, DFB OSL, was performed to determine the Fraunhofer diffraction of the three grating designs. The photon energy band diagram was measured using a Fourier imaging spectroscopy system (Figure 8). The measurement system has an objective lens and a Fourier lens, which can collect multiple diffraction orders within the angle θ range of -23° to 23°. Details of the experimental setup are described in the supporting material. A nitrogen laser NL100 was used for excitation, and a polarizer was used to separate TE and TM modes. The photon band diagrams of mixed-order sampling DFBs with ratios of 4:12, 4:36 and 4:200 are shown in Figure 5. These photon band diagrams show how the optimal coupling wavelength (the Bragg wavelength) changes with angle, plotting multiple bands that intersect at specific angles. In the case of a simple structure with only 1 second-order grating, only 2 energy bands were found to cross each other at 0°, which has been well confirmed in previous studies. 17 Figure 5(a) to Figure 5(c) show the photons of OSL with ratios of 4:12, 4:36 and 4:200 (the corresponding supercell periods are 2,720nm, 5,984nm and 28,288nm respectively) Can bring. The spectra show characteristic spectral and angular narrowing derived from the photon band structure. Above the threshold, an angular narrowing in the direction perpendicular to the grating occurs corresponding to the diffracted laser beam. The beam shape in the direction parallel to the grating is fan-shaped. 18 As shown in Figure 5(a) to Figure 5(c), near the laser threshold, the photon energy band diagrams of the three OSLs clearly show multiple energy bands crossing at different equidistant angles. In the angle range of -20°<θ<+20°, the photon energy bands are observed to cross at different wavelengths and equidistant angles. Therefore, the appearance of additional photon energy bands in OSL is due to the addition of the second-order periodicity of Fraunhofer diffraction, that is, the period of the supercell (an example of the photon energy band of a single periodic structure is shown in Figure 15). The angle between the two diffracted beams satisfies Fraunhofer's law (Eq.2), and a photon stop band will appear at the intersection of each photon energy band. Laser oscillations occur at the band edge of this photonic bandgap because of the presence of a high quality factor at the band edge, as previously documented in the literature. 19 It can be observed that the angle between the two laser beams is inversely related to the length of the supercell as predicted by Franchise and Feil's law (Eq. 2). Table 1 (No. 4, 5 and 6) shows that there is excellent agreement between measured angles and calculated angles using Fraunhofer's law (Eq. 2) for diffracted laser beams in different structures.

1.平均繞射階數的彙總準備了系統性改變一階及二階DFB的週期數之9個不同的OSL裝置。 No. 一階DFB的週期數 二階DFB的週期數 超晶胞長度(μm) 二階:一階比例 θ calc.(°) θ exp.(°) 1 3 1 0.680 4:12 43.1 43.2 2 9 1 1.496 4:36 18.1 19.9 3 50 1 7.072 4:200 3.8 4.2 4 12 4 2.720 4:12 9.8 10.8 5 36 4 5.984 4:36 4.5 4.9 6 200 4 28.288 4:200 0.9 1.0 7 108 36 24.480 4:12 1.1 1.3 8 324 36 53.856 4:36 0.5 0.5 9 1800 36 254.592 4:200 0.1 0.1 Table 1. Summary of average diffraction orders. Nine different OSL devices were prepared that systematically varied the number of periods of the first- and second-order DFBs. No. Number of cycles of first-order DFB Number of cycles of second-order DFB Supercell length (μm) Second order: first order ratio θ calc. (°) θ exp. (°) 1 3 1 0.680 4:12 43.1 43.2 2 9 1 1.496 4:36 18.1 19.9 3 50 1 7.072 4:200 3.8 4.2 4 12 4 2.720 4:12 9.8 10.8 5 36 4 5.984 4:36 4.5 4.9 6 200 4 28.288 4:200 0.9 1.0 7 108 36 24.480 4:12 1.1 1.3 8 324 36 53.856 4:36 0.5 0.5 9 1800 36 254.592 4:200 0.1 0.1

[實施例2] 藉由維持比例4:12、4:36及4:200,在具有不同的一階DFB週期之各超晶胞中使用二階DFB(1週期及36週期)來進一步製造了混合階抽樣DFB。將繞射的實驗角度及計算角度示於表1(No.1、2、3(1週期)及7、8、9(36週期)),將光子能帶圖示於圖16及圖17。在表1中,藉由加長超晶胞長度,每次比較時可觀察到繞射角度變窄的傾向,並且在No.9.的情況下其收斂至最小值0.1°。在此,由超晶胞長度及一階及二階DFB區域的長度控制繞射角。作為一例,表1所示之比例1:3、1:9及1:50(No.1、2及3)表示具有極大繞射角之高分離遠場發射(圖16)。另一方面,表1所示之比例36:108、36:324及36:1800(No.7、8及9)表示具有極低繞射角之高度局域化遠場發射(圖17)。 [Example 2] Mixed-order sampled DFBs were further fabricated using second-order DFBs (1 period and 36 periods) in each supercell with different first-order DFB periods by maintaining the ratios 4:12, 4:36, and 4:200. The experimental angles and calculated angles of diffraction are shown in Table 1 (No. 1, 2, 3 (1 period) and 7, 8, 9 (36 periods)), and the photon energy band diagrams are shown in Figures 16 and 17. In Table 1, by lengthening the supercell length, a tendency for the diffraction angle to become narrower can be observed in each comparison, and in the case of No. 9. it converges to the minimum value of 0.1°. Here, the diffraction angle is controlled by the length of the supercell and the lengths of the first- and second-order DFB regions. As an example, the ratios 1:3, 1:9 and 1:50 (No. 1, 2 and 3) shown in Table 1 represent highly separated far-field emissions with extremely large diffraction angles (Figure 16). On the other hand, the ratios 36:108, 36:324, and 36:1800 (No. 7, 8, and 9) shown in Table 1 represent highly localized far-field emission with extremely low diffraction angles (Fig. 17).

OSL雷射閾值量測 根據光子能帶圖量測,確定了比例4:12、4:36及4:200(No.4、5及6)在高解析度及廣角雷射方面為最佳候選項。因此,使用0°量測系統進行了雷射閾值量測。雷射閾值根據所量測的OSL的輸入-輸出光功率特徵來確定。圖6(a)、圖6(b)及圖6(c)表示使用了一階及二階的比例不同的混合階抽樣DFB共振器之OSL的低於閾值及高於閾值的發射光譜。低於閾值時,針對比例4:12、4:36及4:200之光子阻帶寬度分別為約2.86、3.89及4.60nm。光子阻帶的中心位於465nm,3個OSL的光子阻帶中心均相同。圖6(d)示出雷射閾值及光子阻帶寬度的變化作為3種不同比例的一階區域的長度的函數。一階光柵的長度增加時,可以觀察到雷射閾值的降低及阻帶寬度的增加。因此,具有比例為4:200的混合階抽樣DFB共振器之OSL顯示出比4:12比例(21.4±1.1μJ/cm 2)低8倍的閾值(2.5±0.1μJ/cm 2)及更寬的阻帶。使用了~3.5ns的相對長的脈衝寬度激發源。雷射閾值的該等降低被認為是因為由加長的一階光柵長度引起之平面光回饋的增強。光回饋量藉由利用耦合常數定量之向後的布拉格散射的強度確定。該耦合常數與阻帶寬度成正比,並利用Kogelnik及Shank提出的耦合理論進行說明。 16在阻帶的一側邊緣,雷射能夠振盪且阻帶的寬度為回饋強度的量度。因此,雷射閾值的降低能夠藉由增強耦合效果亦即藉由加長一階長度加大耦合常數來實現。 低於閾值時,發射光譜顯示出可由布拉格傾角賦予之附加特徵。在比例4:12及4:36的OSL的發射中清晰地觀察到了該等特徵。比例為4:12的OSL在450nm處觀察到了特徵。比例為4:36的OSL在451、458、473及481nm處觀察到了特徵。然而,在比例為4:200的OSL的情況下,不知何故光譜在460nm處顯示出非常微弱的特徵,但由於在發射光譜中存在雜訊,因此很難分辨該特徵。圖6(a)及圖6(b)中的在不同波長下比例為4:12及4:36之OSL的0°發射中觀察到的附加特徵亦在圖5中的光子能帶圖中觀察到。將0°角軸處的發射光譜示於光子能帶圖的右側。在比例為4:12的OSL的情況下,能帶在435nm、461nm及503nm這3個波長處交叉。在後兩個波長處,在0°發射光譜中亦觀察到了傾角,這是由於該等傾角與發射光譜的重疊。在比例為4:36的OSL的情況下,能帶在447、461、478及498nm這4個波長處交叉,並且在0°發射光譜中亦觀察到了傾角,這是由於該等傾角與發射光譜的重疊。對於比例4:200,由於光子能帶交叉的複數個點,光子能帶圖具有大量傾角。該等傾角構成因光子能帶以不同的波長以外還以不同的角度交叉而產生之成附加特徵。附加傾角的雷射閾值高於滿足布拉格條件之主要阻帶,這僅僅是因為增益材料BSBCz摻雜膜在布拉格波長附近具有最高增益,並且可用振盪波長與該波長差距越大,增益越低。又,考慮到繞射角的傾向,DFB的超晶胞長度變得更長時,可以期待實現更低的繞射角及閾值。綜上所述,為了獲得低閾值,一階DFB區域需要增加,二階DFB區域需要具有最佳週期數,然後需要藉由控制超晶胞的長度來控制繞射角。 OSL laser threshold measurement Based on photon band diagram measurement, ratios 4:12, 4:36 and 4:200 (No. 4, 5 and 6) were determined to be the best candidates for high-resolution and wide-angle lasers item. Therefore, the laser threshold measurement was performed using a 0° measurement system. The laser threshold is determined based on the measured input-output optical power characteristics of the OSL. Figure 6(a), Figure 6(b) and Figure 6(c) show the below-threshold and above-threshold emission spectra of OSL using mixed-order sampling DFB resonators with different ratios of first-order and second-order. Below the threshold, the photon stopband widths for ratios 4:12, 4:36, and 4:200 are approximately 2.86, 3.89, and 4.60 nm, respectively. The center of the photon stop band is located at 465nm, and the photon stop band centers of the three OSLs are all the same. Figure 6(d) shows the changes in laser threshold and photon stopband width as a function of the length of the first-order region in three different proportions. As the length of the first-order grating increases, a decrease in the laser threshold and an increase in the stopband width can be observed. Therefore, the OSL with a mixed-order sampled DFB resonator with a ratio of 4:200 shows a threshold 8 times lower (2.5±0.1μJ/ cm2 ) and wider than the 4:12 ratio (21.4±1.1μJ/ cm2 ). stop band. A relatively long pulse width excitation source of ~3.5 ns was used. This reduction in laser threshold is believed to be due to the enhancement of planar light feedback caused by the lengthened first-order grating length. The amount of light return is determined by quantifying the intensity of backward Bragg scattering using a coupling constant. The coupling constant is proportional to the stopband width and is explained using the coupling theory proposed by Kogelnik and Shank. 16 At one edge of the stopband, the laser is able to oscillate and the width of the stopband is a measure of the strength of the feedback. Therefore, the reduction of the laser threshold can be achieved by enhancing the coupling effect, that is, by increasing the coupling constant by lengthening the first-order length. Below the threshold, the emission spectrum shows additional features that can be imparted by the Bragg tilt. These features are clearly observed in the emissions from OSL at scales 4:12 and 4:36. Features were observed at 450nm for OSL with a ratio of 4:12. OSL with a ratio of 4:36 has features observed at 451, 458, 473 and 481nm. However, in the case of OSL with a ratio of 4:200, somehow the spectrum shows a very faint feature at 460nm, but it is difficult to resolve this feature due to the presence of noise in the emission spectrum. Additional features observed in the 0° emission of OSLs with ratios 4:12 and 4:36 at different wavelengths in Figures 6(a) and 6(b) are also observed in the photon band diagram in Figure 5 arrive. The emission spectrum at the 0° angular axis is shown on the right side of the photon band diagram. In the case of OSL with a ratio of 4:12, the energy bands cross at three wavelengths: 435nm, 461nm, and 503nm. At the latter two wavelengths, a tilt angle is also observed in the 0° emission spectrum, which is due to the overlap of these tilt angles with the emission spectrum. In the case of OSL with a ratio of 4:36, the energy bands cross at 4 wavelengths: 447, 461, 478 and 498 nm, and tilt angles are also observed in the 0° emission spectrum. This is due to the fact that these tilt angles are consistent with the emission spectrum. of overlap. For scale 4:200, the photon band diagram has a large amount of tilt due to the complex number of points where the photon bands intersect. These tilt angles constitute additional features resulting from photon energy bands crossing at different angles in addition to different wavelengths. The laser threshold of the additional tilt angle is higher than the main stop band that satisfies the Bragg condition. This is simply because the gain material BSBCz doped film has the highest gain near the Bragg wavelength, and the greater the difference between the available oscillation wavelength and this wavelength, the lower the gain. In addition, taking into account the tendency of the diffraction angle, when the supercell length of the DFB becomes longer, it can be expected to achieve lower diffraction angles and thresholds. In summary, in order to obtain a low threshold, the first-order DFB area needs to be increased, the second-order DFB area needs to have an optimal number of periods, and then the diffraction angle needs to be controlled by controlling the length of the supercell.

結論 設計並研究了抽樣混合階DFB OSL以控制基於夫朗和斐定律之有機層的繞射角及閾值。首先,藉由改變抽樣混合階DFB的二階與一階的比例來控制超晶胞長度。總計製造並測試了9個不同結構的DFB。根據角度依賴性發射量測結果,將雷射繞射角從0.1°調整為43°。該舉動遵循夫朗和斐定律(繞射角與超晶胞長度成反比),並且實驗繞射角與計算繞射角顯示出良好的一致性。在9個DFB中,比例為4:12、4:36及4:200的結構顯示出最寬的角度範圍及低繞射角發射。因此,選擇以4:12、4:36及4:200比例抽樣的混合階DFB來進一步量測光幫浦雷射閾值。一階DFB區域增加時,雷射閾值降低2.5±0.1μJ/cm 2。0°發射光譜顯示具有更長一階區域之超晶胞長度越長,光子能隙(亦即阻帶)越寬,這表明橫向回饋越強。該結果在如何以更低的閾值,並且在不使用大體積繞射光學元件的條件下控制OSL/OSLD的發射繞射角方面提供了有用的訊息,由此可用於多種應用,例如生物感測器、基於2D及3D結構光之人臉辨識技術及ToF系統。 Conclusion A sampled mixed-order DFB OSL was designed and studied to control the diffraction angle and threshold of the organic layer based on Fraunhofer's law. First, the supercell length is controlled by changing the ratio of the second order to the first order of the sampling mixed order DFB. A total of 9 DFBs with different structures were fabricated and tested. Based on the angle-dependent emission measurement results, the laser diffraction angle was adjusted from 0.1° to 43°. This action follows Fraunhofer's law (diffraction angle is inversely proportional to supercell length), and the experimental and calculated diffraction angles show good agreement. Among the 9 DFBs, structures with ratios of 4:12, 4:36 and 4:200 show the widest angular range and low diffraction angle emission. Therefore, mixed-order DFBs sampled at 4:12, 4:36, and 4:200 ratios were selected to further measure the optical pump laser threshold. When the first-order DFB area increases, the laser threshold decreases by 2.5±0.1μJ/cm 2 . The 0° emission spectrum shows that the longer the length of the supercell with the longer first-order region, the wider the photon energy gap (ie, the stop band), which indicates stronger lateral feedback. This result provides useful information on how to control the emission diffraction angle of OSL/OSLD with a lower threshold and without using bulky diffractive optical elements, which can be used in a variety of applications, such as biosensing. device, face recognition technology and ToF system based on 2D and 3D structured light.

輔助材料 1 部分:量測系統的建構及裝置的準備 a )雷射性能量測系統建構在此項工作中,建構了兩種量測系統亦即單角度量測系統及傅立葉成像光譜系統。設計前者以藉由來源於DFB雷射裝置之垂直方向(0°)發射光來量測光學閾值及雷射光譜。幫浦雷射源為氮氣雷射NL100(thinkSRS Inc.,337nm的波長及3.5ns的脈衝寬度)或Nd:YAG雷射(355nm的波長及0.9ns的脈衝寬度)。使用3種濃度可調的ND濾波器以精細地控制幫浦源並描繪光閾值圖。藉由孔徑濾波粗幫浦光以繪製清晰的圓形光束形狀。最後,將355nm截止濾波器放置於試樣後面及PMA50檢測器的前面以切斷干擾檢測發射自裝置的光之光源。 相對於此,設計後者以收集及擷取廣角依賴性光致發光(PL)圖像。幫浦雷射源與具有單角度量測系統之氮氣雷射NL100相同。首先,幫浦光截取為圓形並使用透鏡以控制源光束的尺寸。然後,放置物鏡、傅立葉透鏡及鏡筒透鏡以收集來自DFB裝置之色散寬的發射並將其傳輸到光譜儀Shamrock500i(Andor Technology)。設置UV截止濾波器來切斷氮氣幫浦雷射,最後設置偏光器以濾波為0°或90°的輸出雷射。在本發明中,偏光器基本上設置成0°濾波,在圖像中去除了強度非常弱的第二次90°偏光。在獲取設定中,適用了0.2秒的曝光時間。 Supporting materials Part 1 : Construction of measurement system and preparation of equipment ( a ) Construction of laser performance measurement system In this work, two measurement systems were constructed, namely a single-angle measurement system and a Fourier imaging spectroscopy system. . The former is designed to measure the optical threshold and laser spectrum by emitting light in the vertical direction (0°) from the DFB laser device. The pump laser source is nitrogen laser NL100 (thinkSRS Inc., wavelength of 337nm and pulse width of 3.5ns) or Nd:YAG laser (wavelength of 355nm and pulse width of 0.9ns). Use 3 ND filters with adjustable density to finely control pump sources and map light thresholds. Filter the coarsely pumped light through the aperture to draw a clear, circular beam shape. Finally, a 355nm cutoff filter was placed behind the sample and in front of the PMA50 detector to cut off light sources that would interfere with detection of light emitted from the device. In contrast, the latter is designed to collect and capture wide-angle-dependent photoluminescence (PL) images. The pump laser source is the same as the nitrogen laser NL100 with a single angle measurement system. First, the pump light is intercepted into a circle and a lens is used to control the size of the source beam. Then, the objective lens, Fourier lens and tube lens were placed to collect the widely dispersion emission from the DFB device and transmit it to the spectrometer Shamrock500i (Andor Technology). Set the UV cut filter to cut off the nitrogen pump laser, and finally set the polarizer to filter the output laser to 0° or 90°. In the present invention, the polarizer is basically set to 0° filtering, which removes the very weak second 90° polarization in the image. In the acquisition settings, an exposure time of 0.2 seconds was applied.

b )幫浦雷射源輪廓試樣位置上的幫浦源的光束形狀藉由WinCamD-LCM CCD相機(Opto Science,inc.)擷取以確定DFB中的幫浦區域。在本發明中,量測了氮氣雷射及Nd:YAG雷射的尺寸。下圖示出頂視及對角視圖像,在頂視圖中標註了x及y軸2個輪廓。藉由高斯擬合來近似各輪廓,並將13.5%峰作為標準確定輪廓寬度。兩種雷射源均具有橢圓形光束形狀,且每個軸被控制為不超過1000nm(為此工作設計的DFB尺寸的寬度)。 ( b ) Pump laser source profile. The beam shape of the pump source at the sample position is captured by a WinCamD-LCM CCD camera (Opto Science, inc.) to determine the pump area in the DFB. In the present invention, the sizes of nitrogen laser and Nd:YAG laser were measured. The figure below shows the top view and diagonal view images. In the top view, the x and y axes are marked with two outlines. Each profile was approximated by Gaussian fitting, and the profile width was determined using the 13.5% peak as a standard. Both laser sources have elliptical beam shapes, and each axis is controlled to not exceed 1000nm (the width of the DFB size designed for this work).

c 6wt%BSBCz:CBP 薄膜的吸收、 PL ASE為了獲得一致的光學性能,藉由熱共蒸發系統製造了薄膜。在該過程中涉及的參數有膜厚、紫外可見吸收(Abs)光譜、光致發光(PL)光譜、放大自發射(ASE)光譜及光致發光量子產率(PLQY)。首先,藉由Dektak XT stylus輪廓儀(BRUKER)量測之膜厚為202±2nm。在推定摻雜比例時,使用了ASE光譜的峰波長,這是因為波長會根據主體材料及客體材料的分子量發生移位。其次,分別藉由LAMDA950(PerkinElmer)及FluoroMax-4(Horiba)記錄了Abs光譜及PL光譜(圖11)。第三,6wt%的推定ASE波長為465nm,該參數藉由PMA50(Hamamatsu Photonics)進行了量測。最後,膜的PLQY藉由Quantaurus-QY(Hamamatsu Photonics)量測,其在330nm的激發波長處為93%。 ( c ) Absorption, PL and ASE of 6wt% BSBCz:CBP film. In order to obtain consistent optical properties, the film was fabricated by a thermal co-evaporation system. The parameters involved in this process include film thickness, UV-visible absorption (Abs) spectrum, photoluminescence (PL) spectrum, amplified self-emission (ASE) spectrum and photoluminescence quantum yield (PLQY). First, the film thickness measured by Dektak XT stylus profiler (BRUKER) was 202±2nm. When estimating the doping ratio, the peak wavelength of the ASE spectrum is used because the wavelength shifts depending on the molecular weight of the host material and guest material. Secondly, the Abs spectrum and PL spectrum were recorded by LAMDA950 (PerkinElmer) and FluoroMax-4 (Horiba) respectively (Figure 11). Third, the estimated ASE wavelength of 6wt% is 465nm, and this parameter was measured by PMA50 (Hamamatsu Photonics). Finally, the PLQY of the film was measured by Quantaurus-QY (Hamamatsu Photonics) and was 93% at an excitation wavelength of 330 nm.

d )混合階 DFB 共振器的週期優化對於簡單的比較,僅使用了二階DFB以優化光柵的週期性長度。選擇了5個二階週期長度為260nm、264nm、272nm、276nm及280nm的候選項。所有候選項的工作週期均為0.5。為了確定最佳者,製造了在DFB上蒸鍍了BSBCz:CBP(6wt%,200nm厚度)膜之所有二階DFB裝置並量測了該等的雷射光譜及閾值。在該實驗中使用了Nd:YAG雷射幫浦源。圖12(a)示出具有各候選DFB之裝置的雷射光譜及不具有DFB之BSBCz:CBP膜的ASE光譜。相較於SE光譜具有7.20nm的寬FWHM,該等5個雷射光譜均顯示出0.14~0.16nm的極窄的半高寬(FWHM)。在候選項中,預期二階週期長度(Λ)為272nm的裝置會顯示出最低的光學閾值,這是因為其與ASE光譜的重疊最大,這表明在DFB共振器中獲得了最佳增益效果。藉由圖12(b)所示之雷射閾值的量測及比較驗證了該意見。因此,本發明中的抽樣混合階DFB的超晶胞長度根據經優化的週期性長度亦即272nm的二階及136nm的一階來確定。 ( d ) Periodic optimization of mixed-order DFB resonator For simple comparison, only second-order DFB is used to optimize the periodic length of the grating. Five candidates with second-order period lengths of 260nm, 264nm, 272nm, 276nm and 280nm were selected. All candidates have a duty cycle of 0.5. In order to determine the best one, all second-order DFB devices with a BSBCz:CBP (6wt%, 200nm thickness) film evaporated on the DFB were fabricated and their laser spectra and thresholds were measured. In this experiment, an Nd:YAG laser pump source was used. Figure 12(a) shows the laser spectrum of the device with each candidate DFB and the ASE spectrum of the BSBCz:CBP film without DFB. Compared with the SE spectrum which has a wide FWHM of 7.20nm, these five laser spectra all show an extremely narrow full width at half maximum (FWHM) of 0.14~0.16nm. Among the candidates, the device with a second-order period length (Λ) of 272 nm is expected to show the lowest optical threshold due to its largest overlap with the ASE spectrum, indicating that the best gain effect is obtained in the DFB resonator. This opinion is verified through the measurement and comparison of the laser threshold shown in Figure 12(b). Therefore, the supercell length of the sampled mixed-order DFB in the present invention is determined based on the optimized periodicity length, that is, the second order of 272 nm and the first order of 136 nm.

e DFB 結構的 SEM 圖像為了比較結構性差異,一階及二階的週期性長度分別固定為136nm及272nm。然後,藉由掃描電子顯微(SEM)拍攝了3個不同結構,該等具有不同的超晶胞長度且在各超晶胞中的二階光柵具有相同的4週期。進行60秒的40mA功率金濺射以提高SiO 2光柵表面的傳導性。圖13(a、b、c)分別示出比例為1:3、1:9及1:50的抽樣混合階光柵的幾何形狀。在同一天,以相同的條件製造了在說明書最後部分中提及的附加抽樣混合階DFB(1週期及36週期二階DFB區域、以及不同的比例(1:3、1:9及1:50))。 ( e ) SEM image of the DFB structure . In order to compare the structural differences, the first-order and second-order periodic lengths are fixed at 136 nm and 272 nm, respectively. Then, three different structures with different supercell lengths and the same 4-period second-order grating in each supercell were photographed by scanning electron microscopy (SEM). Gold sputtering at 40 mA power for 60 seconds was performed to improve the conductivity of the SiO grating surface. Figure 13 (a, b, c) shows the geometric shapes of sampled mixed-order gratings with ratios of 1:3, 1:9 and 1:50 respectively. On the same day, the additional sampling mixed order DFB mentioned in the last part of the specification (1-cycle and 36-cycle second-order DFB regions, and different ratios (1:3, 1:9 and 1:50) were manufactured under the same conditions ).

2 部分:主要實驗的詳細內容 a 發射光譜量測藉由具有Hamamatsu Photonics發行的PMA軟體之單角度量測系統(圖7)記錄了每個輸出發射。用於收集資料的軟體設定參數包括2個因數:200ms的曝光時間及每幀取平均5次。在第一階段,試樣位置上的幫浦雷射光束尺寸如1(b)部分所示進行擷取及量測確定。然後,藉由橢圓面積的式計算cm 2單位的光束面積。然後,將試樣放置於光束尺寸擷取位置的右側,實施了波長功率(計數)量測。在量測過程中,藉由逐步切換ND濾波器的濃度來升高幫浦雷射功率直至輸出功率達到峰飽和。然後,記錄了使用獨立濃度的ND濾波器擷取之每個幀。最後,將試樣置換為奈米焦耳計(Ophir Photonics)以記錄所有使用的幫浦功率(μJ單位)。 在接下來的步驟中,每個擷取資料收集並匯總以表現雷射閾值(圖14)。圖中包括3個因數:激發強度(x軸)、歸一化發射強度(y軸)及FWHM(第二個y軸)。首先,每個激發強度點由式下述式S1表示。 I exc = (S1) 其中,幫浦功率(μJ)為E,計算出的幫浦光束面積(cm 2)為A,吸收係數為c。係數c由1-10 -Abs表示,其中“Abs”係指先前藉由LAMDA950(PerkinElmer)量測之增益膜的吸收度。具體的Abs參數表示幫浦雷射源的激發波長,亦即在氮氣雷射源(NL100,thinkSRS Inc.)的情況下為337nm,在Nd:YAG雷射源(maker)情況下為355nm。此外,藉由計數發射功率來匯總歸一化發射強度。最後,將FWHM標註於y軸右側。所有圖均以雙對數圖尺表示,並將由基於歸一化發射強度趨勢之2個近似直線形成之單一交叉點定義為雷射閾值點。為了驗證閾值的重現性,製造了各DFB結構(4週期二階DFB區域、以及1:3、1:9及1:50的比例)的3個試樣,並在相同條件下同時測試了該等的雷射裝置。 Part 2 : Details of the main experiments ( a ) emission spectrum measurements Each output emission was recorded using a single-angle measurement system (Fig. 7) with PMA software published by Hamamatsu Photonics. The software setting parameters used to collect data include 2 factors: an exposure time of 200ms and averaging 5 times per frame. In the first stage, the size of the pump laser beam at the specimen position is captured and measured as shown in part 1(b). Then, calculate the beam area in cm 2 units by using the formula for the area of an ellipse. Then, the sample was placed on the right side of the beam size acquisition position, and the wavelength power (count) was measured. During the measurement process, the pump laser power is increased by gradually switching the concentration of the ND filter until the output power reaches peak saturation. Each frame captured using an independent density ND filter was then recorded. Finally, the specimen was replaced with a nanojoule meter (Ophir Photonics) to record all pump powers used (in μJ units). In the next step, each acquisition data is collected and aggregated to represent the laser threshold (Figure 14). The figure includes three factors: excitation intensity (x-axis), normalized emission intensity (y-axis), and FWHM (second y-axis). First, each excitation intensity point is expressed by the following formula S1. I exc = (S1) Among them, the pump power (μJ) is E, the calculated pump beam area (cm 2 ) is A, and the absorption coefficient is c. The coefficient c is represented by 1-10 -Abs , where "Abs" refers to the absorbance of the gain film previously measured by LAMDA950 (PerkinElmer). The specific Abs parameter represents the excitation wavelength of the pump laser source, which is 337nm in the case of nitrogen laser source (NL100, thinkSRS Inc.) and 355nm in the case of Nd:YAG laser source (maker). In addition, the normalized emission intensity is summarized by counting the emission power. Finally, label the FWHM on the right side of the y-axis. All graphs are expressed on a logarithmic scale, and the single intersection point formed by 2 approximate straight lines based on the normalized emission intensity trend is defined as the laser threshold point. In order to verify the reproducibility of the threshold, three samples of each DFB structure (4-cycle second-order DFB region, and ratios of 1:3, 1:9 and 1:50) were manufactured and tested simultaneously under the same conditions. Laser devices etc.

2 .具有4週期二階DFB及不同比例之抽樣混合階DFB的閾值的彙總 光柵比例 第一次試驗 E th(μJ/cm 2 第二次試驗 E th(μJ/cm 2 第三次試驗 E th(μJ/cm 2 誤差 ±(μJ/cm 2 1:3 22.5 22.5 19.3 1.1 1:9 7.6 9.5 8.8 0.6 1:50 2.4 2.8 2.4 0.1 Table 2. Summary of thresholds for 4-period second - order DFBs and sampled mixed-order DFBs with different proportions Raster scale First test E th (μJ/cm 2 ) Second test E th (μJ/cm 2 ) The third test E th (μJ/cm 2 ) Error ±(μJ/cm 2 ) 1:3 22.5 22.5 19.3 1.1 1:9 7.6 9.5 8.8 0.6 1:50 2.4 2.8 2.4 0.1

3 .具有4週期二階DFB及不同比例之抽樣混合階DFB的FWHM的彙總 光柵比例 第一次試驗 FWHM(nm) 第二次試驗 FWHM(nm) 第三次試驗 FWHM(nm) 誤差 ±(nm) 1:3 0.16 0.15 0.16 0 1:9 0.14 0.15 0.15 0 1:50 0.15 0.15 0.15 0 Table 3. Summary of FWHM with 4-period second - order DFB and sampled mixed-order DFB with different proportions Raster scale First trial FWHM (nm) Second trial FWHM (nm) Third test FWHM (nm) Error±(nm) 1:3 0.16 0.15 0.16 0 1:9 0.14 0.15 0.15 0 1:50 0.15 0.15 0.15 0

b )在各超晶胞中僅具有 1 36 個二階光柵之抽樣混合階 DFB 雷射的傅立葉成像光譜除了使用具有4週期二階DFB區域及不同比例之混合階DFB值主要實驗以外,亦製造了具有1週期及36週期二階DFB區域及不同比例(1:3、1:9及1:50)之DFB OSL來確定了特徵。圖15及圖16示出光子能帶圖、以及理論及實驗繞射角。圖15(a)及圖15(b)的上述閾值中的第二個峰(紅虛線區域)為雜訊。製造並量測了二階DFB OSL以進行比較。圖15示出OSL的光子能帶圖。 [產業上之可利用性] ( b ) Fourier imaging spectra of sampled mixed-order DFB lasers with only 1 or 36 second-order gratings in each supercell . In addition to the main experiments using 4-period second-order DFB regions and different ratios of mixed-order DFB values, we also made The characteristics of DFB OSL with 1-period and 36-period second-order DFB regions and different ratios (1:3, 1:9 and 1:50) were determined. Figures 15 and 16 show photon energy band diagrams, as well as theoretical and experimental diffraction angles. The second peak (red dotted line area) in the above threshold value in Figure 15(a) and Figure 15(b) is noise. A second-order DFB OSL was fabricated and measured for comparison. Figure 15 shows the photon band diagram of OSL. [Industrial availability]

藉由利用本發明的方法,能夠降低有機半導體雷射裝置的雷射閾值,收窄有機半導體雷射裝置的雷射發射的繞射角。因此,藉由本發明的方法得到改善之有機半導體能夠有效地用作檢測三維形狀之結構光照射裝置。因此,本發明具有很高的工業應用性。 [參考] By utilizing the method of the present invention, the laser threshold of the organic semiconductor laser device can be reduced and the diffraction angle of the laser emission of the organic semiconductor laser device can be narrowed. Therefore, the organic semiconductor improved by the method of the present invention can be effectively used as a structured light irradiation device for detecting three-dimensional shapes. Therefore, the present invention has high industrial applicability. [refer to]

1: I. D. W. Samuel, and G. A. Turnbull, Chem. Rev. 107, 1272-1295(2007)。 2: Y. Jiang, Y. Liu, X. Liu, H. Lin, K. Gao, W. Lai, and W. Huang, Chem. Soc. Rev. 49, 5885-5944(2020)。 3: Y. Jiang, K. F. Li, K. Gao, H. Lin, H. L. Tam, Y. Liu, Y. Shu, K. Wong, W. Lai, K. W. Cheah, and W. Huang, Angew. Chem. Int. Ed. 60, 10007-10015(2021)。 4: M. Vaughan, The Fabry-Perot interferometer: history, theory, practice and applications, edited by M. Vaughan(Routledge, New York, 2017)。 5: J. L. Jewell, J. P. Harbison, A. Scherer, Y. H. Lee, and L. T. Florez, IEEE J. Quantum Electron 27, 1332-1346(1991)。 6: S. Wang, IEEE J. Quantum Electron 10, 413-427(1974)。 7: C. Karnutsch, C. Gýrtner, V. Haug, U. Lemmer, T. Farrell, B. S. Nehls, U. Scherf, J. Wang, T. Weimann, G. Heliotis, C. Pflumm, J. C. Demello, and D. D. C. Bradley, Appl. Phys. Lett. 89, 201108(2006)。 8: A. S. D. Sandanayaka, T. Matsushima, F. Bencheikh, K. Yoshida, M. Inoue, T. Fujihara, K. Goushi, J. C. Ribierre, and C. Adachi, Sci. Adv. 3, e1602570(2017)。 9: C. A. M. Senevirathne, A. S. D. Sandanayaka, B. S. B. Karunathilaka, T. Fujihara, F. Bencheikh, C. Qin, K. Goushi, T. Matsushima, and C. Adachi, ACS Photonics 8, 1324-1334(2021)。 10: G. Morthier, and P. Vankwikelberge, Handbook of distributed feedback laser diodes Artech House, New York, 2013)。 11: C. Karnutsch, C. Pflumm, G. Heliotis, J. C. Demello, D. D. C. Bradley, J. Wang, T. Weimann, V. Haug, C. Gӓrtner, and U. Lemmer, Appl. Phys. Lett. 90, 131104(2007)。 12: S. Zhou, and S. Xiao, HCIS 8, 1-27(2018)。 13: C. Gӓrtner, C. Karnutsch, U. Lemmer, and C. Pflumm, J. Appl. Phys. 101, 023107(2007)。 14: A. S. D. Sandanayaka, T. Matsushima, F. Bencheikh, S. Terakawa, W. J. Potscavage Jr, C. Qin, T. Fujihara, K. Goushi, J. C. Ribierre, and C. Adachi, Appl. Phys. Express 12, 061010(2019)。 15: T. Aimono, Y. Kawamura, K. Goushi, H. Yamamoto, H. Sasabe, and C. Adachi, Appl. Phys. Lett. 86, 071110(2005)。 16: H. Kogelnik, and C. V. Shank, J. Appl. Phys. 43, 2327-2335(1972)。 17: G. A. Turnbull, P. Andrew, M. J. Jory, W. L. Barnes, and I. D. W. Samuel, Phys. Rev. B 64, 125122(2001)。 18: P. Zhou, L. Niu, A. Hayat, F. Cao, T. Zhai, and X. Zhang, Polymers 11, 258(2019)。 19: Y. Liang, P. Chao, K. Sakai, S. Iwahashi, and S. Noda, Phys. Rev. B 84, 195119(2011)。 1 : IDW Samuel, and GA Turnbull, Chem. Rev. 107 , 1272-1295 (2007). 2 : Y. Jiang, Y. Liu, X. Liu, H. Lin, K. Gao, W. Lai, and W. Huang, Chem. Soc. Rev. 49 , 5885-5944 (2020). 3 : Y. Jiang, KF Li, K. Gao, H. Lin, HL Tam, Y. Liu, Y. Shu, K. Wong, W. Lai, KW Cheah, and W. Huang, Angew. Chem. Int. Ed. 60 , 10007-10015 (2021). 4 : M. Vaughan, The Fabry-Perot interferometer: history, theory, practice and applications , edited by M. Vaughan (Routledge, New York, 2017). 5 : JL Jewell, JP Harbison, A. Scherer, YH Lee, and LT Florez, IEEE J. Quantum Electron 27 , 1332-1346 (1991). 6 : S. Wang, IEEE J. Quantum Electron 10 , 413-427 (1974). 7 : C. Karnutsch, C. Gýrtner, V. Haug, U. Lemmer, T. Farrell, BS Nehls, U. Scherf, J. Wang, T. Weimann, G. Heliotis, C. Pflumm, JC Demello, and DDC Bradley, Appl. Phys. Lett. 89 , 201108 (2006). 8 : ASD Sandanayaka, T. Matsushima, F. Bencheikh, K. Yoshida, M. Inoue, T. Fujihara, K. Goushi, JC Ribierre, and C. Adachi, Sci. Adv. 3 , e1602570 (2017). 9 : CAM Senevirathne, ASD Sandanayaka, BSB Karunathilaka, T. Fujihara, F. Bencheikh, C. Qin, K. Goushi, T. Matsushima, and C. Adachi, ACS Photonics 8 , 1324-1334 (2021). 10 : G. Morthier, and P. Vankwikelberge, Handbook of distributed feedback laser diodes ( Artech House, New York, 2013). 11 : C. Karnutsch, C. Pflumm, G. Heliotis, JC Demello, DDC Bradley, J. Wang, T. Weimann, V. Haug, C. Gårtner, and U. Lemmer, Appl. Phys. Lett. 90 , 131104 (2007). 12 : S. Zhou, and S. Xiao, HCIS 8 , 1-27 (2018). 13 : C. Gårtner, C. Karnutsch, U. Lemmer, and C. Pflumm, J. Appl. Phys. 101 , 023107 (2007). 14 : ASD Sandanayaka, T. Matsushima, F. Bencheikh, S. Terakawa, WJ Potscavage Jr, C. Qin, T. Fujihara, K. Goushi, JC Ribierre, and C. Adachi, Appl. Phys. Express 12 , 061010 ( 2019). 15 : T. Aimono, Y. Kawamura, K. Goushi, H. Yamamoto, H. Sasabe, and C. Adachi, Appl. Phys. Lett. 86 , 071110 (2005). 16 : H. Kogelnik, and CV Shank, J. Appl. Phys. 43 , 2327-2335 (1972). 17 : GA Turnbull, P. Andrew, MJ Jory, WL Barnes, and IDW Samuel, Phys. Rev. B 64 , 125122 (2001). 18 : P. Zhou, L. Niu, A. Hayat, F. Cao, T. Zhai, and X. Zhang, Polymers 11 , 258 (2019). 19 : Y. Liang, P. Chao, K. Sakai, S. Iwahashi, and S. Noda, Phys. Rev. B 84 , 195119 (2011).

1a:晶格槽 1b:晶格槽 2a:晶格槽 2b:晶格槽 3a:晶格槽 3b:晶格槽 10:光共振器結構 FSP:第一短節距週期性結構 LP:長節距週期性結構 SC1:超晶胞結構 SC2:超晶胞結構 SC3:超晶胞結構 SSP:第二短節距週期性結構 WL 1:超晶胞結構的長度 WL 2:超晶胞結構的長度 WL 3:超晶胞結構的長度 WS1:第一短節距結構FSP在x方向上的長度 WS2:第二短節距結構在x方向上的長度 WL:長節距結構LP在x方向上的長度 Λ1:相鄰晶格槽1a與1b的側面之間的距離 Λ2:相鄰晶格槽2a與2b的側面之間的距離 ΛL:相鄰晶格槽3a與3b的側面之間的距離 1a: Lattice groove 1b: Lattice groove 2a: Lattice groove 2b: Lattice groove 3a: Lattice groove 3b: Lattice groove 10: Optical resonator structure FSP: First short pitch periodic structure LP: Long pitch Periodic structure SC1: Super cell structure SC2: Super cell structure SC3: Super cell structure SSP: Second short pitch periodic structure WL 1 : The length of the super cell structure WL 2 : The length of the super cell structure WL 3 : The length of the supercell structure WS1: The length of the first short-pitch structure FSP in the x direction WS2: The length of the second short-pitch structure FSP in the x direction WL: The length of the long-pitch structure LP in the x direction Length Λ1: the distance between the side surfaces of adjacent lattice grooves 1a and 1b Λ2: the distance between the side surfaces of adjacent lattice grooves 2a and 2b ΛL: the distance between the side surfaces of adjacent lattice grooves 3a and 3b

圖1係表示用於本發明之光共振器結構的示例之示意性俯視圖。 圖2係表示具有3個以上不同長度的超晶胞結構之光共振器結構之示意性俯視圖。 圖3係具有圖2所示之光共振器結構之雷射二極體的雷射發射的角度依賴性的模擬結果。 圖4(a)係在混合階DFB中二階與一階抽樣光柵的比例為4:12之掃描電子顯微(SEM)圖像,圖4(b)係在混合階DFB中二階與一階抽樣光柵的比例為4:12、4:36及4:200之示意性俯視圖(Λ SC對應1個超晶胞長度,其為1個二階與2個一階抽樣光柵之和),圖4(c)用CYTOP及藍寶石玻璃蓋封裝之有機半導體雷射(OSL)裝置的橫截面圖,圖4(d)係作為增益介質的4,4’-雙[(N-咔唑)苯乙烯基]聯苯(BSBCz)的結構式、以及作為主體的4,4’-二(N-咔唑基)聯苯(CBP)。 圖5(a)至圖5(c)係具有二階DFB(4週期)之混合階DFB裝置中比例為(a)4:12、(b)4:36及(c)4:200(二階:一階)的光子能帶圖(彩色圖像)、θ=0°處的PL光譜(右側)及遠場發射圖樣(下側)。 圖6(a)至圖6(c)係混合階抽樣DFB裝置(No.4、5及6示於表1)中以0°發射採樣時的比例為(a)4:12、(b)4:36及(c)4:200的PL(黑色)及雷射(紅色)光譜,圖6(d)係表示取決於超晶胞中的一階週期數之阻帶寬度及雷射閾值。 圖7係單角度量測系統的示意圖。 圖8係傅立葉成像光譜系統的示意圖。 圖9係表示NL100氮氣雷射的光束形狀之圖像。 圖10係表示Nd:YAG雷射的光束形狀之圖像。 圖11係表示BSBCz:CBP(6wt%)膜的紫外可見吸收(藍線)、光致發光(紅線)及放大自發射(黑色虛線)的光譜之圖。 圖12(a)及圖12(b)係表示以(a)雷射光譜及(b)雷射閾值進行比較之5個二階週期長度的雷射性能。 圖13(a)至圖13(c)係具有4週期二階DFB區域之抽樣混合階DFB的比例為(a)1:3、(b)1:9及(c)1:50的掃描電子顯微(SEM)圖像。 圖14(a)至圖14(c)係具有4週期的二階DFB區域之抽樣混合階DFB的比例為(a)1:3(3次試驗)、(b)1:9(3次試驗)及(c)1:50(3次試驗)的雷射閾值彙總。 圖15係非抽樣二階DFB OSL的光子能帶圖。 圖16(a)至圖16(c)係1週期二階DFB區域及不同比例(a)1:3、(b)1:9及(c)1:50的光子能帶圖及其0°裁剪光致發光光譜(右側)及遠場發射圖樣(下側)。 圖17(a)至圖17(c)係36週期二階DFB區域及不同比例(a)1:3、(b)1:9及(c)1:50的光子能帶圖及其0°裁剪光致發光光譜(右側)及遠場發射圖樣(下側)。 FIG. 1 is a schematic plan view showing an example of an optical resonator structure used in the present invention. FIG. 2 is a schematic top view showing an optical resonator structure having more than three supercell structures of different lengths. FIG. 3 is a simulation result of the angle dependence of laser emission of a laser diode having the optical resonator structure shown in FIG. 2 . Figure 4(a) is a scanning electron microscopy (SEM) image of the second-order and first-order sampling gratings in the mixed-order DFB with a ratio of 4:12. Figure 4(b) is the second-order and first-order sampling in the mixed-order DFB. Schematic top view of gratings with ratios of 4:12, 4:36 and 4:200 (Λ SC corresponds to the length of one supercell, which is the sum of one second-order and two first-order sampling gratings), Figure 4 (c ) Cross-sectional view of an organic semiconductor laser (OSL) device encapsulated with CYTOP and a sapphire glass cover. Figure 4(d) shows the 4,4'-bis[(N-carbazole)styrene] linkage as the gain medium. The structural formula of benzene (BSBCz), and 4,4'-bis(N-carbazolyl)biphenyl (CBP) as the main body. Figure 5(a) to Figure 5(c) are mixed-stage DFB devices with second-order DFB (4 cycles). The ratios are (a) 4:12, (b) 4:36 and (c) 4:200 (second-order: First-order) photon band diagram (color image), PL spectrum at θ = 0° (right), and far-field emission pattern (lower side). Figure 6 (a) to Figure 6 (c) are mixed-stage sampling DFB devices (No. 4, 5 and 6 are shown in Table 1). The ratios when sampling is emitted at 0° are (a) 4:12, (b) PL (black) and laser (red) spectra at 4:36 and (c) 4:200. Figure 6(d) shows the stop band width and laser threshold depending on the number of first-order periods in the supercell. Figure 7 is a schematic diagram of a single-angle measurement system. Figure 8 is a schematic diagram of the Fourier imaging spectroscopy system. Figure 9 is an image showing the beam shape of the NL100 nitrogen laser. Figure 10 is an image showing the beam shape of Nd:YAG laser. Figure 11 is a graph showing the UV-visible absorption (blue line), photoluminescence (red line) and amplified self-emission (black dotted line) spectra of the BSBCz:CBP (6wt%) film. Figure 12(a) and Figure 12(b) show the laser performance of five second-order period lengths compared with (a) laser spectrum and (b) laser threshold. Figure 13(a) to Figure 13(c) are scanning electron displays of a 4-period second-order DFB region with sampling mixed-order DFB ratios of (a) 1:3, (b) 1:9 and (c) 1:50. Micro (SEM) image. Figure 14(a) to Figure 14(c) are the second-order DFB area with 4 periods. The ratio of sampled mixed-order DFB is (a) 1:3 (3 tests), (b) 1:9 (3 tests) and (c) summary of laser thresholds at 1:50 (3 trials). Figure 15 is the photon band diagram of the unsampled second-order DFB OSL. Figure 16(a) to Figure 16(c) are the photon energy band diagrams of the 1-period second-order DFB region and different ratios (a) 1:3, (b) 1:9 and (c) 1:50 and their 0° cropping Photoluminescence spectrum (right) and far-field emission pattern (lower). Figure 17(a) to Figure 17(c) are the photon energy band diagrams of the 36-period second-order DFB region and different ratios (a) 1:3, (b) 1:9 and (c) 1:50 and their 0° cropping Photoluminescence spectrum (right) and far-field emission pattern (lower).

1a:晶格槽 1a:Lattice groove

1b:晶格槽 1b:Lattice groove

2a:晶格槽 2a:Lattice groove

2b:晶格槽 2b:Lattice groove

3a:晶格槽 3a:Lattice groove

3b:晶格槽 3b:Lattice groove

10:光共振器結構 10: Optical resonator structure

FSP:第一短節距週期性結構 FSP: First Short Pitch Periodic Structure

LP:長節距週期性結構 LP: Long pitch periodic structure

SSP:第二短節距週期性結構 SSP: Second Short Pitch Periodic Structure

WS1:第一短節距結構FSP在x方向上的長度 WS1: The length of the first short pitch structure FSP in the x direction

WS2:第二短節距結構在x方向上的長度 WS2: The length of the second short pitch structure in the x direction

WL:長節距結構LP在x方向上的長度 WL: The length of the long pitch structure LP in the x direction

Λ1:相鄰晶格槽1a與1b的側面之間的距離 Λ1: The distance between the side surfaces of adjacent lattice grooves 1a and 1b

Λ2:相鄰晶格槽2a與2b的側面之間的距離 Λ2: The distance between the side surfaces of adjacent lattice grooves 2a and 2b

ΛL:相鄰晶格槽3a與3b的側面之間的距離 ΛL: the distance between the side surfaces of adjacent lattice grooves 3a and 3b

Claims (51)

一種用於改善有機半導體雷射裝置的方法,前述有機半導體雷射裝置包括光共振器結構和由有機半導體構成之光放大層,其中 前述光共振器結構具有至少一個超晶胞結構,前述超晶胞結構具有第一短節距週期性結構、長節距週期性結構及第二短節距週期性結構, 前述第一短節距週期性結構與前述長節距週期性結構的一端部相鄰配置,且前述第二短節距週期性結構與前述長節距週期性結構的另一端部相鄰配置, (i)前述第一短節距週期性結構的與晶格槽正交之方向、(ii)前述長節距週期性結構的與晶格槽正交之方向及(iii)前述第二短節距週期性結構的與晶格槽正交之方向中的至少2個在一條直線上, 前述方法包括下述中的至少一個: (1)加長(WS1+WS2)、 (2)縮短WL、 (3)加長(WS1+WL+WS2)及 (4)重複前述超晶胞結構, 其中WS1表示在前述第一短節距週期性結構的與晶格槽正交之方向上的長度,WS2表示在前述第二短節距週期性結構的與晶格槽正交之方向上的長度,WL表示在前述長節距週期性結構的與晶格槽正交之方向上的長度。 A method for improving an organic semiconductor laser device. The aforementioned organic semiconductor laser device includes an optical resonator structure and a light amplification layer composed of an organic semiconductor, wherein The aforementioned optical resonator structure has at least one supercell structure, and the aforementioned supercell structure has a first short-pitch periodic structure, a long-pitch periodic structure, and a second short-pitch periodic structure, The first short-pitch periodic structure is arranged adjacent to one end of the long-pitch periodic structure, and the second short-pitch periodic structure is arranged adjacent to the other end of the long-pitch periodic structure, (i) the direction orthogonal to the lattice grooves of the aforementioned first short-pitch periodic structure, (ii) the direction orthogonal to the lattice grooves of the aforementioned long-pitch periodic structure, and (iii) the aforementioned second short section. On a straight line from at least two of the directions orthogonal to the lattice grooves of the periodic structure, The aforementioned methods include at least one of the following: (1) Extended (WS1+WS2), (2) Shorten WL, (3) Extended (WS1+WL+WS2) and (4) Repeat the aforementioned supercell structure, WS1 represents the length of the first short-pitch periodic structure in the direction orthogonal to the lattice groove, and WS2 represents the length of the second short-pitch periodic structure in the direction orthogonal to the lattice groove. , WL represents the length in the direction orthogonal to the lattice groove of the aforementioned long-pitch periodic structure. 如請求項1之方法,其實施(1)。For example, the method of claim 1 is implemented in (1). 如請求項1之方法,其實施(2)。For example, the method of claim 1 is implemented in (2). 如請求項1之方法,其實施(3)。For example, the method of claim 1 is implemented in (3). 如請求項1之方法,其實施(4)。For example, the method of claim 1 is implemented in (4). 如請求項1之方法,其實施(1)及(2)。For example, the method of claim 1 implements (1) and (2). 如請求項1之方法,其實施(1)及(3)。For example, the method of claim 1 implements (1) and (3). 如請求項1之方法,其實施(2)及(3)。For example, the method of claim 1 implements (2) and (3). 如請求項1之方法,其實施(1)、(2)及(3)。For example, the method of claim 1 implements (1), (2) and (3). 如請求項6之方法,其進一步實施(4)。As in claim 6, the method is further implemented in (4). 如請求項1之方法,其將(WS1+WS2)/WL調整為4以上。For example, the method of request item 1 is to adjust (WS1+WS2)/WL to 4 or more. 如請求項1之方法,其將(WS1+WS2)調整為1μm以上。For example, the method of claim 1 adjusts (WS1+WS2) to 1 μm or more. 如請求項1之方法,其將WL調整為10μm以下。Like the method of claim 1, WL is adjusted to 10 μm or less. 如請求項1之方法,其將(WS1+WL+WS2)調整為2μm以上。Like the method of claim 1, adjust (WS1+WL+WS2) to 2 μm or more. 如請求項1之方法,其滿足WS1=WS2。For example, the method of request item 1 satisfies WS1=WS2. 如請求項1之方法,其中 (i)前述第一短節距週期性結構的與晶格槽正交之方向、(ii)前述長節距週期性結構的與晶格槽正交之方向及(iii)前述第二短節距週期性結構的與晶格槽正交之方向全部在一條直線上。 Such as the method of request item 1, where (i) the direction orthogonal to the lattice grooves of the aforementioned first short-pitch periodic structure, (ii) the direction orthogonal to the lattice grooves of the aforementioned long-pitch periodic structure, and (iii) the aforementioned second short section. The directions orthogonal to the lattice grooves of the periodic structure are all on a straight line. 如請求項1之方法,其中前述第一短節距週期性結構與前述長節距週期性結構的一端部接觸,且前述第二短節距週期性結構與前述長節距週期性結構的另一端部接觸。The method of claim 1, wherein the first short-pitch periodic structure is in contact with one end of the long-pitch periodic structure, and the second short-pitch periodic structure is in contact with the other end of the long-pitch periodic structure. One end is in contact. 如請求項1之方法,其中 前述週期性結構包括由脊部和槽構成之光柵。 Such as the method of request item 1, where The aforementioned periodic structures include gratings composed of ridges and grooves. 如請求項18之方法,其中 前述第一短節距週期性結構及前述第二短節距週期性結構為一階光柵,前述長節距週期性結構為二階光柵。 Such as the method of request item 18, where The aforementioned first short-pitch periodic structure and the aforementioned second short-pitch periodic structure are first-order gratings, and the aforementioned long-pitch periodic structure is a second-order grating. 如請求項1之方法,其中 前述方法用於降低雷射閾值。 Such as the method of request item 1, where The aforementioned method is used to reduce the laser threshold. 如請求項1之方法,其中 前述方法用於收窄雷射發射的繞射角。 Such as the method of request item 1, where The aforementioned method is used to narrow the diffraction angle of laser emission. 如請求項1之方法,其中 前述方法用於降低雷射閾值並收窄雷射發射的繞射角。 Such as the method of request item 1, where The aforementioned method is used to reduce the laser threshold and narrow the diffraction angle of laser emission. 如請求項1之方法,其中 前述方法用於設計有機半導體雷射裝置。 Such as the method of request item 1, where The aforementioned method is used to design organic semiconductor laser devices. 如請求項1之方法,其中 前述方法用於評價有機半導體雷射裝置。 Such as the method of request item 1, where The aforementioned method is used to evaluate organic semiconductor laser devices. 如請求項1之方法,其中 前述方法用於製造有機半導體雷射裝置。 Such as the method of request item 1, where The aforementioned method is used to manufacture organic semiconductor laser devices. 一種程式,其用於實施請求項1之方法。A program for implementing the method of claim 1. 一種電腦,其用於實施請求項1之方法。A computer used to implement the method of claim 1. 一種有機半導體雷射裝置,其藉由請求項25之方法製造。An organic semiconductor laser device manufactured by the method of claim 25. 一種有機半導體雷射裝置,其包括光共振器結構和由有機半導體構成之光放大層,其中 前述光共振器結構具有至少一個超晶胞結構,前述超晶胞結構具有第一短節距週期性結構、長節距週期性結構及第二短節距週期性結構, 前述第一短節距週期性結構與前述長節距週期性結構的一端部相鄰配置,且前述第二短節距週期性結構與前述長節距週期性結構的另一端部相鄰配置, (i)前述第一短節距週期性結構的與晶格槽正交之方向、(ii)前述長節距週期性結構的與晶格槽正交之方向及(iii)前述第二短節距週期性結構的與晶格槽正交之方向中的至少2個在一條直線上, 前述有機半導體雷射裝置具有加長的(WS1+WS2)、縮短的WL、加長的(WS1+WL+WS2)及2個以上超晶胞結構中的至少一個,其中WS1表示在前述第一短節距週期性結構的與晶格槽正交之方向上的長度,WS2表示在前述第二短節距週期性結構的與晶格槽正交之方向上的長度,WL表示在前述長節距週期性結構的與晶格槽正交之方向上的長度。 An organic semiconductor laser device, which includes an optical resonator structure and a light amplification layer composed of organic semiconductors, wherein The aforementioned optical resonator structure has at least one supercell structure, and the aforementioned supercell structure has a first short-pitch periodic structure, a long-pitch periodic structure, and a second short-pitch periodic structure, The first short-pitch periodic structure is arranged adjacent to one end of the long-pitch periodic structure, and the second short-pitch periodic structure is arranged adjacent to the other end of the long-pitch periodic structure, (i) the direction orthogonal to the lattice grooves of the aforementioned first short-pitch periodic structure, (ii) the direction orthogonal to the lattice grooves of the aforementioned long-pitch periodic structure, and (iii) the aforementioned second short section. On a straight line from at least two of the directions orthogonal to the lattice grooves of the periodic structure, The aforementioned organic semiconductor laser device has at least one of elongated (WS1+WS2), shortened WL, elongated (WS1+WL+WS2) and two or more supercell structures, where WS1 is represented by the aforementioned first short section. The length of the periodic structure in the direction orthogonal to the lattice grooves, WS2 represents the length of the second short-pitch periodic structure in the direction orthogonal to the lattice grooves, and WL represents the length of the periodic structure in the direction orthogonal to the lattice grooves. The length of the linear structure in the direction orthogonal to the lattice grooves. 如請求項28之有機半導體雷射裝置,其中 前述光共振器結構具有以2個以上超晶胞結構的與晶格槽正交之方向在一條直線上的方式配置之2個以上超晶胞結構。 The organic semiconductor laser device of claim 28, wherein The aforementioned optical resonator structure has two or more supercell structures arranged in such a way that directions orthogonal to the lattice grooves of the two or more supercell structures are aligned in a straight line. 如請求項30之有機半導體雷射裝置,其中 前述2個以上超晶胞結構的WS1、WL及WS2相同。 The organic semiconductor laser device of claim 30, wherein WS1, WL and WS2 of the above two or more supercell structures are the same. 如請求項30之有機半導體雷射裝置,其中 前述2個以上超晶胞結構的與晶格槽正交之方向上的長度是隨機的。 The organic semiconductor laser device of claim 30, wherein The lengths of the above two or more supercell structures in the direction orthogonal to the lattice grooves are random. 如請求項30之有機半導體雷射裝置,其中 前述光共振器結構具有10個以上的超晶胞結構。 The organic semiconductor laser device of claim 30, wherein The aforementioned optical resonator structure has more than 10 supercell structures. 如請求項28之有機半導體雷射裝置,其中 前述第一短節距週期性結構、前述長節距週期性結構及前述第二短節距週期性結構具有深度未達75nm的槽。 The organic semiconductor laser device of claim 28, wherein The aforementioned first short-pitch periodic structure, the aforementioned long-pitch periodic structure, and the aforementioned second short-pitch periodic structure have grooves with a depth less than 75 nm. 如請求項28之有機半導體雷射裝置,其中 前述第一短節距週期性結構、前述長節距週期性結構及前述第二短節距週期性結構具有分布式回饋(DFB)結構。 The organic semiconductor laser device of claim 28, wherein The aforementioned first short pitch periodic structure, the aforementioned long pitch periodic structure and the aforementioned second short pitch periodic structure have a distributed feedback (DFB) structure. 如請求項35之有機半導體雷射裝置,其中 各分布式回饋(DFB)結構選自包括一階DFB結構、二階DFB結構、三階DFB結構及更高階DFB結構之群組中。 The organic semiconductor laser device of claim 35, wherein Each distributed feedback (DFB) structure is selected from the group consisting of first-order DFB structures, second-order DFB structures, third-order DFB structures and higher-order DFB structures. 如請求項28之有機半導體雷射裝置,其中 前述第一短節距週期性結構、前述長節距週期性結構及前述第二短節距週期性結構由絕緣材料構成。 The organic semiconductor laser device of claim 28, wherein The aforementioned first short-pitch periodic structure, the aforementioned long-pitch periodic structure and the aforementioned second short-pitch periodic structure are made of insulating materials. 如請求項28之有機半導體雷射裝置,其中 前述第一短節距週期性結構、前述長節距週期性結構及前述第二短節距週期性結構具有在絕緣基板上由絕緣材料構成之週期性排列的脊部。 The organic semiconductor laser device of claim 28, wherein The aforementioned first short-pitch periodic structure, the aforementioned long-pitch periodic structure, and the aforementioned second short-pitch periodic structure have periodically arranged ridge portions made of an insulating material on an insulating substrate. 如請求項38之有機半導體雷射裝置,其中 前述脊部及前述絕緣基板由不同的絕緣材料構成。 The organic semiconductor laser device of claim 38, wherein The ridge portion and the insulating substrate are made of different insulating materials. 如請求項38之有機半導體雷射裝置,其中 前述脊部由二氧化矽構成,前述絕緣基板由玻璃基板構成。 The organic semiconductor laser device of claim 38, wherein The ridge portion is made of silicon dioxide, and the insulating substrate is made of a glass substrate. 如請求項38之有機半導體雷射裝置,其中 前述絕緣基板的表面露出於槽的底部。 The organic semiconductor laser device of claim 38, wherein The surface of the insulating substrate is exposed at the bottom of the groove. 如請求項28之有機半導體雷射裝置,其在前述光共振器結構的表面進一步具有有機層。The organic semiconductor laser device of claim 28 further has an organic layer on the surface of the aforementioned optical resonator structure. 如請求項42之有機半導體雷射裝置,其在與前述光共振器結構相對之前述有機層一側進一步包含透明保護層。The organic semiconductor laser device of claim 42 further includes a transparent protective layer on the side of the organic layer opposite to the optical resonator structure. 如請求項42之有機半導體雷射裝置,其從與前述光共振器結構相對之前述有機層一側發射雷射光束。As claimed in claim 42, the organic semiconductor laser device emits a laser beam from the side of the organic layer opposite to the optical resonator structure. 如請求項43之有機半導體雷射裝置,其從與前述透明保護層相對之前述有機層一側發射雷射光束。As claimed in claim 43, the organic semiconductor laser device emits a laser beam from the side of the organic layer opposite to the transparent protective layer. 如請求項28之有機半導體雷射裝置,其發射具有不同繞射角之2種以上繞射光。For example, the organic semiconductor laser device of claim 28 emits more than two types of diffracted light with different diffraction angles. 如請求項46之有機半導體雷射裝置,其中 在前述2種以上繞射光中,發射角度最接近的繞射光的繞射角之間的角差為8°以下。 The organic semiconductor laser device of claim 46, wherein Among the two or more types of diffracted light, the angle difference between the diffraction angles of the diffracted light with the closest emission angle is 8° or less. 如請求項28之有機半導體雷射裝置,其中 前述有機層包含具有至少一個二苯乙烯單元之有機化合物。 The organic semiconductor laser device of claim 28, wherein The aforementioned organic layer contains an organic compound having at least one stilbene unit. 如請求項28之有機半導體雷射裝置,其中 前述有機層包含4,4'-雙[(N-咔唑)苯乙烯基]聯苯(BSBCz)。 The organic semiconductor laser device of claim 28, wherein The aforementioned organic layer contains 4,4'-bis[(N-carbazole)styryl]biphenyl (BSBCz). 如請求項28之有機半導體雷射裝置,其中 前述有機層的厚度為80~350nm。 The organic semiconductor laser device of claim 28, wherein The thickness of the aforementioned organic layer is 80 to 350 nm. 一種選自包括生物感測器、結構光照射裝置、光學感測裝置及人臉辨識裝置之群組中之裝置,其包括請求項28之有機半導體雷射裝置。A device selected from the group consisting of biosensors, structured light illumination devices, optical sensing devices and face recognition devices, which includes the organic semiconductor laser device of claim 28.
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