TW202340290A - Polymer, polymer solution, photosensitive resin composition and cured product - Google Patents

Polymer, polymer solution, photosensitive resin composition and cured product Download PDF

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TW202340290A
TW202340290A TW112102234A TW112102234A TW202340290A TW 202340290 A TW202340290 A TW 202340290A TW 112102234 A TW112102234 A TW 112102234A TW 112102234 A TW112102234 A TW 112102234A TW 202340290 A TW202340290 A TW 202340290A
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polymer
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carbon atoms
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田邊潤壱
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日商住友電木股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/38Polymerisation using regulators, e.g. chain terminating agents, e.g. telomerisation
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/46Polymerisation initiated by wave energy or particle radiation
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/04Anhydrides, e.g. cyclic anhydrides
    • C08F222/06Maleic anhydride
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10Esters
    • C08F222/12Esters of phenols or saturated alcohols
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10Esters
    • C08F222/26Esters of unsaturated alcohols
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F232/00Copolymers of cyclic compounds containing no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F232/00Copolymers of cyclic compounds containing no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system
    • C08F232/08Copolymers of cyclic compounds containing no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system having condensed rings
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/12Polymers provided for in subclasses C08C or C08F
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00Chemical modification by after-treatment
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/20Filters
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable

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  • Chemical & Material Sciences (AREA)
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  • Medicinal Chemistry (AREA)
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  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Materials For Photolithography (AREA)
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  • Macromonomer-Based Addition Polymer (AREA)
  • Liquid Crystal (AREA)

Abstract

A polymer including a structural unit represented by formula (NB), a structural unit represented by formula (AD), and at least one structural unit selected from among structural units represented by formula (1-2) and structural units represented by formula (1-3). In formula (NB), R1, R2, R3, and R4 are each independently a hydrogen atom or a C1-C30 organic group, a1 is 0, 1, or 2, and R13 and R14 are each independently a hydrogen atom or a C1-C3 alkyl group. In formula (AD), R11 and R12 are each independently a C1-C12, linear or branched alkyl group. In formula (1-2), Rp is a group having two or more (meth)acryloyl groups and R22 is a hydrogen atom or a C1-C3 organic group. In formula (1-3), Rs is a group having one (meth)acryloyl group and R22 is a hydrogen atom or a C1-C3 organic group.

Description

聚合物、聚合物溶液、感光性樹脂組成物及硬化物Polymers, polymer solutions, photosensitive resin compositions and hardened products

本發明係關於一種聚合物、含有該聚合物之聚合物溶液、含有該聚合物溶液之感光性樹脂組成物及該感光性樹脂組成物的硬化物。The present invention relates to a polymer, a polymer solution containing the polymer, a photosensitive resin composition containing the polymer solution, and a cured product of the photosensitive resin composition.

液晶顯示裝置或固體攝像元件通常具備濾色器或黑色矩陣、間隙物(例如,感光間隙物(photospacer)、著色間隙物、黑色間隙物)、隔壁材料(例如,透明堤、黑堤)。濾色器、黑色矩陣、間隙物、隔壁材料成為在基板上形成有著色圖案或保護膜等結構物之構成。作為該等結構物中的著色圖案或保護膜的形成方法,使用感光性樹脂組成物藉由光刻形成之方法成為主流。關於感光性樹脂組成物,一直以來進行有各種研究,例如,在專利文獻1中記載有一種感光性樹脂組成物,其含有鹼溶性樹脂、聚合性化合物以及光聚合起始劑,該鹼溶性樹脂至少在側鏈中含有具有酸性基之基及兩種以上的彼此不同的聚合性不飽和基。又,在專利文獻1的實施例中記載有如下:合成甲基丙烯酸/甲基丙烯酸烯丙酯/環氧丙基加成體作為鹼溶性樹脂,並使用其來製備感光性樹脂組成物。 [先前技術文獻] [專利文獻] A liquid crystal display device or a solid-state imaging element usually includes a color filter or a black matrix, a spacer (for example, a photospacer, a colored spacer, a black spacer), and a partition material (for example, a transparent bank or a black bank). The color filter, the black matrix, the spacer, and the partition material are composed of structures such as colored patterns or protective films formed on the substrate. As a method of forming colored patterns or protective films in these structures, photolithography using a photosensitive resin composition has become a mainstream method. Various studies have been conducted on photosensitive resin compositions. For example, Patent Document 1 describes a photosensitive resin composition containing an alkali-soluble resin, a polymerizable compound, and a photopolymerization initiator. The alkali-soluble resin It contains a group having an acidic group and two or more mutually different polymerizable unsaturated groups at least in the side chain. Moreover, the Example of Patent Document 1 describes that a methacrylic acid/allyl methacrylate/epoxypropyl adduct is synthesized as an alkali-soluble resin and is used to prepare a photosensitive resin composition. [Prior technical literature] [Patent Document]

〔專利文獻1〕國際公開第2012/147706號[Patent Document 1] International Publication No. 2012/147706

[發明所欲解決之課題][Problem to be solved by the invention]

用於形成濾色器、黑色矩陣、間隙物或隔壁材料之感光性樹脂組成物中使用具備藉由光引起聚合反應而硬化之性質之樹脂。濾色器、黑色矩陣、間隙物或隔壁材料藉由利用曝光、顯影對感光性樹脂組成物進行圖案化之後使其硬化來製作。在感光性樹脂組成物中,「高靈敏度化」亦被認為是一個普遍的課題,但隨著顯示裝置或攝像裝置的複雜化或普及等而要求更高水準的高靈敏度化。感光性樹脂組成物的靈敏度愈高,則曝光所需要之時間愈短,從而能夠提高生產性。又,要求感光性樹脂組成物在使用鹼性顯影液之顯影處理中具備優異的加工性。另外,對感光性樹脂組成物的硬化物要求具備高透明性。 而且,尤其在感光性樹脂組成物中含有色素、顏料之情況,在曝光時,與圖案的上表面相比,光難以到達圖案的底面,藉由曝光之硬化變得不充分,顯影時可能會產生圖案底面側部溶解之現象。此時,在顯影後的硬化時,若因熱而圖案熔融,則能夠填補圖案底面側部的溶解部分,因此對感光性樹脂組成物的硬化物要求低軟化點或熔點。 [解決課題之技術手段] The photosensitive resin composition used to form a color filter, a black matrix, a spacer, or a partition material uses a resin that has the property of being hardened by a polymerization reaction caused by light. Color filters, black matrices, spacers, or partition materials are produced by patterning a photosensitive resin composition by exposure and development and then hardening the composition. In photosensitive resin compositions, "higher sensitivity" is also considered to be a common issue, but as display devices and imaging devices become more complex or more popular, higher levels of high sensitivity are required. The higher the sensitivity of the photosensitive resin composition, the shorter the time required for exposure, thereby improving productivity. In addition, the photosensitive resin composition is required to have excellent processability during development using an alkaline developer. In addition, the cured product of the photosensitive resin composition is required to have high transparency. Furthermore, especially when the photosensitive resin composition contains dyes and pigments, during exposure, it is difficult for light to reach the bottom surface of the pattern compared to the upper surface of the pattern, and the curing by exposure becomes insufficient, which may result in problems during development. This causes the bottom side of the pattern to dissolve. In this case, when the pattern is melted by heat during curing after development, the melted portion on the bottom side of the pattern can be filled. Therefore, the cured product of the photosensitive resin composition is required to have a low softening point or melting point. [Technical means to solve the problem]

本發明的發明人等發現藉由改良感光性樹脂組成物中所使用之聚合物或該組成物的摻合,可得到具有低軟化點、熔點,因此光刻處理中之加工性或圖案形成性優異,並且以良好的平衡具備靈敏度、鹼溶解性及耐熱黃變性之樹脂硬化物,從而完成了本發明。The inventors of the present invention have found that by improving the polymer used in the photosensitive resin composition or blending the composition, it is possible to obtain a photosensitive resin composition having a low softening point and melting point, thereby improving processability or pattern formation in photolithography processing. The present invention was completed by creating a resin cured product that is excellent and has sensitivity, alkali solubility, and heat yellowing resistance in a good balance.

根據本發明,可提供一種以下所示之聚合物、聚合物溶液、感光性樹脂組成物及硬化物。 [1]一種聚合物,其含有: 式(NB)所表示之結構單元; 式(AD)所表示之結構單元;及 選自式(1-2)所表示之結構單元及式(1-3)所表示之結構單元中之至少1個結構單元,其中, 通式(NB)中,R 1、R 2、R 3及R 4分別獨立地為氫原子或碳數1~30的有機基,a 1為0、1或2, 式(AD)中,R 11及R 12分別獨立地為碳數1~12的直鏈或支鏈的烷基,R 13及R 14分別獨立地為氫原子或碳數1~3的烷基, 式(1-2)中,R p為具有2個以上的(甲基)丙烯醯基之基,R 22為氫原子或碳數1~3的有機基, 式(1-3)中,R s為具有1個(甲基)丙烯醯基之基,R 22為氫原子或碳數1~3的有機基。 [2]如項目[1]之聚合物,其進一步含有式(1-1)所表示之結構單元, 式(1-1)中, R 21為氫原子或碳數1~3的有機基, Z為含有1個以上的(甲基)丙烯醯基之基, Q為氫原子或經取代或未經取代之碳數1~6的烷基, X表示氧原子或經取代或未經取代之碳數1~4的伸烷基, 當Q為前述烷基且X為前述伸烷基時,Q與X可以縮合而形成環式基。 [3]如項目[1]或[2]之聚合物,其進一步含有式(1-4)所表示之結構單元, 式(1-4)中, R 22為氫原子或碳數1~3的有機基。 [4]如項目[1]至[3]中任一項之聚合物,其進一步含有選自式(1)所表示之結構單元和式(2)所表示之結構單元中之至少1個, 式(1)中,R p為具有2個以上的(甲基)丙烯醯基之基,R 21及R 22分別獨立地為氫原子或碳數1~3的有機基, 式(2)中,R s為具有1個(甲基)丙烯醯基之基,R 21及R 22分別獨立地為氫原子或碳數1~3的有機基。 [5]如項目[1]至[4]中任一項之聚合物,其進一步含有式(3)所表示之結構單元, 式(3)中,R 21及R 22分別獨立地為氫原子或碳數1~3的有機基。 [6]如項目[2]之聚合物,其進一步含有選自式(8)所表示之結構單元和式(9)所表示之結構單元中之至少1個, 式(8)中, Z為含有1個以上的(甲基)丙烯醯基之基, Q為氫原子或經取代或未經取代之碳數1~6的烷基, X表示氧原子或經取代或未經取代之碳數1~4的伸烷基, 當Q為前述烷基且X為前述伸烷基時,Q與X可以縮合而形成環式基, R p為具有2個以上的(甲基)丙烯醯基之基, R 21及R 22為氫原子或碳數1~3的有機基, 式(9)中, Z為含有1個以上的(甲基)丙烯醯基之基, Q為氫原子或經取代或未經取代之碳數1~6的烷基, X表示氧原子或經取代或未經取代之碳數1~4的伸烷基, 當Q為前述烷基且X為前述伸烷基時,Q與X可以縮合而形成環式基, R s為具有1個(甲基)丙烯醯基之基, R 21及R 22為氫原子或碳數1~3的有機基。 [7]如項目[2]之聚合物,其進一步含有式(5)所表示之結構單元, 式(5)中, Z為含有1個以上的(甲基)丙烯醯基之基, Q為氫原子或經取代或未經取代之碳數1~6的烷基, X表示氧原子或經取代或未經取代之碳數1~4的伸烷基, 當Q為前述烷基且X為前述伸烷基時,Q與X可以縮合而形成環式基, R 21及R 22為氫原子或碳數1~3的有機基。 [8]如項目[2]之聚合物,其進一步含有式(6)所表示之結構單元, 式(6)中, Z為含有1個以上的(甲基)丙烯醯基之基, Q為氫原子或經取代或未經取代之碳數1~6的烷基, X表示氧原子或經取代或未經取代之碳數1~4的伸烷基, 當Q為前述烷基且X為前述伸烷基時,Q與X可以縮合而形成環式基, R 21及R 22為氫原子或碳數1~3的有機基。 [9]如項目[1]至[8]中任一項之聚合物,其進一步含有式(MA)所表示之結構單元, 式(MA)中,R 21及R 22分別獨立地為氫原子或碳數1~3的有機基。 [10]如項目[1]至[9]中任一項之聚合物,其中, 該聚合物含有前述式(1-2)所表示之結構單元, 前述式(1-2)中的R p為選自式(1b)所表示之基、式(1c)所表示之基及式(1d)所表示之基中之至少1個, 式(1b)中, k為2或3, R為氫原子或甲基,複數個R可以相同亦可以不同, X 1為單鍵、碳數1~6的伸烷基或-Z-X-所表示之基(Z為-O-或-OCO-,X為碳數1~6的伸烷基),存在複數個之X 1可以相同亦可以不同, X 1’為單鍵、碳數1~6的伸烷基或-X’-Z’-所表示之基(X’為碳數1~6的伸烷基,Z’為-O-或-COO-), X 2為碳數1~12的(k+1)價的有機基, 式(1c)中, k、R、X 1及X 2分別與上述通式(1b)中之R、k、X 1及X 2同義,複數個R彼此可以相同亦可以不同,複數個X 1彼此可以相同亦可以不同, X 3為單鍵或碳數1~6的2價的有機基, X 4及X 5分別獨立地為單鍵或碳數1~6的2價的有機基, X 6為碳數1~6的2價的有機基, 式(1d)中, n為2~5的整數, R獨立地為氫原子或甲基。 [11]如項目[1]至[10]中任一項之聚合物,其中, 該聚合物含有前述式(1-3)所表示之結構單元, 前述式(1-3)中的R s為式(2a)所表示之基, 式(2a)中,X 10為2價的有機基,R為氫原子或甲基。 [12]如項目[1]至[11]中任一項之聚合物,其進一步含有式(MI)所表示之結構單元, 式(MI)中, R 31為氫原子或碳數1~30的有機基, R 32及R 33分別獨立地為氫原子或碳數1~3的有機基。 [13]如項目[1]至[11]中任一項之聚合物,其中, 該聚合物具有式(P3)所表示之結構, 式(P3)中, n為1~6的整數, p、q及r表示n個[ ]內的每一個聚合物鏈中所含之結構單元A、B及C的莫耳含有率, p、q及r在n個[ ]內的每一個聚合物鏈中可以相同亦可以不同, p+q+r=1,p為0以上,q為0以上,r為0以上, 若將該聚合物中所含有之各結構單元A、B及C的莫耳含有率分別設為p t、q t及r t,則p t+q t+r t=1,p t大於0,q t大於0,r t大於0, X為氫原子或碳數1~30的有機基, Y為衍生自單官能或2官能以上的含硫醇基化合物之碳數1~30的1~6價的有機基, A表示前述式(NB)所表示之結構單元, B含有選自前述式(1-2)所表示之結構單元及前述式(1-3)所表示之結構單元中之至少1個結構單元, C表示前述式(AD)所表示之結構單元, 存在複數個之A彼此、B彼此、C彼此可以相同亦可以不同。 [14]如項目[12]之聚合物,其具有式(P4)所表示之結構, 式(P4)中, n為1~6的整數, p、q、r及s表示n個[ ]內的每一個聚合物鏈中所含之結構單元A、B、C及D的莫耳含有率, p、q、r及s在n個[ ]內的每一個聚合物鏈中可以相同亦可以不同, p+q+r+s=1,p為0以上,q為0以上,r為0以上,s為0以上, 若將該聚合物中所含有之各結構單元A、B、C及D的莫耳含有率分別設為p t、q t、r t及s t,則p t+q t+r t+s t=1,p t大於0,q t大於0,r t大於0,s t大於0, X為氫原子或碳數1~30的有機基, Y為衍生自單官能或2官能以上的含硫醇基化合物之碳數1~30的1~6價的有機基, A表示前述式(NB)所表示之結構單元, B含有選自前述式(1-2)所表示之結構單元及前述式(1-3)所表示之結構單元中之至少1個結構單元, C表示前述式(AD)所表示之結構單元, D表示前述式(MI)所表示之結構單元, 存在複數個之A彼此、B彼此、C彼此、D彼此可以相同亦可以不同。 [15]如項目[1]至[14]中任一項之聚合物,其中, 該聚合物的重量平均分子量為2,000以上且2,0000以下。 [16]一種聚合物溶液,其含有項目[1]至[15]中任一項之聚合物。 [17]如項目[16]之聚合物溶液,其進一步含有多官能(甲基)丙烯酸化合物或單官能(甲基)丙烯酸化合物或該等的組合。 [18]如項目[16]之聚合物溶液,其用於濾色器、黑色矩陣、間隙物或隔壁材料的形成。 [19]一種感光性樹脂組成物,其含有: 項目[1]至[15]中任一項之聚合物;及 光自由基聚合起始劑。 [20]一種硬化物,其由項目[19]之感光性樹脂組成物形成。 [21]一種聚合物,其含有: 式(NB)所表示之結構單元; 式(AD)所表示之結構單元;及 式(MA)所表示之結構單元,其中, 通式(NB)中,R 1、R 2、R 3及R 4分別獨立地為氫原子或碳數1~30的有機基,a 1為0、1或2, 式(MA)中,R 21及R 22分別獨立地為氫原子或碳數1~3的有機基, 式(AD)中,R 11及R 12分別獨立地為碳數1~12的直鏈或支鏈的烷基,R 13及R 14分別獨立地為氫原子或碳數1~3的烷基。 [22]如項目[21]之聚合物,其進一步含有式(MI)所表示之結構單元, 式(MI)中, R 31為氫原子或碳數1~30的有機基, R 32及R 33分別獨立地為氫原子或碳數1~3的有機基。 [23]如項目[21]之聚合物,其中, 該聚合物具有式(P3')所表示之結構, 式(P3')中, n為1~6的整數, p、q'及r表示n個[ ]內的每一個聚合物鏈中所含之結構單元A、B'及C的莫耳含有率, p、q'及r在n個[ ]內的每一個聚合物鏈中可以相同亦可以不同, p+q'+r=1,p為0以上,q'為0以上,r為0以上, 若將該聚合物中所含有之各結構單元A、B及C的莫耳含有率分別設為p t、q t'及r t,則p t+q t'+r t=1,p t大於0,q t'大於0,r t大於0, X為氫原子或碳數1~30的有機基, Y為衍生自單官能或2官能以上的含硫醇基化合物之碳數1~30的1~6價的有機基, A表示前述式(NB)所表示之結構單元, B'表示前述式(MA)所表示之結構單元, C表示前述式(AD)所表示之結構單元, 存在複數個之A彼此、B'彼此、C彼此可以相同亦可以不同。 [24]如項目[22]之聚合物,其中, 該聚合物具有式(P4')所表示之結構, 式(P4')中, n為1~6的整數, p、q'、r及s表示n個[ ]內的每一個聚合物鏈中所含之結構單元A、B'、C及D的莫耳含有率, p、q'、r及s在n個[ ]內的每一個聚合物鏈中可以相同亦可以不同, p+q'+r+s=1,p為0以上,q'為0以上,r為0以上,s為0以上, 若將該聚合物中所含有之各結構單元A、B、C及D的莫耳含有率分別設為p t、q t'、r t及s t,則p t+q t'+r t+s t=1,p t大於0,q t'大於0,r t大於0,s t大於0, X為氫原子或碳數1~30的有機基, Y為衍生自單官能或2官能以上的含硫醇基化合物之碳數1~30的1~6價的有機基, A表示前述式(NB)所表示之結構單元, B'表示前述式(MA)所表示之結構單元, C表示前述式(AD)所表示之結構單元, D表示前述式(MI)所表示之結構單元, 存在複數個之A彼此、B'彼此、C彼此、D彼此可以相同亦可以不同。 [25]如項目[20]之聚合物,其中, 該聚合物的軟化點為60℃以上且130℃以下。 [發明之效果] According to the present invention, a polymer, a polymer solution, a photosensitive resin composition, and a cured product shown below can be provided. [1] A polymer containing: a structural unit represented by formula (NB); a structural unit represented by formula (AD); and a structural unit selected from the group consisting of formula (1-2) and formula (1-3) ) at least 1 structural unit among the structural units represented by , wherein, In the general formula (NB), R 1 , R 2 , R 3 and R 4 are each independently a hydrogen atom or an organic group having 1 to 30 carbon atoms, a 1 is 0, 1 or 2, In the formula (AD), R 11 and R 12 are each independently a linear or branched alkyl group having 1 to 12 carbon atoms, and R 13 and R 14 are each independently a hydrogen atom or an alkyl group having 1 to 3 carbon atoms. , In formula (1-2), R p is a group having two or more (meth)acrylyl groups, R 22 is a hydrogen atom or an organic group having 1 to 3 carbon atoms, In formula (1-3), R s is a group having one (meth)acrylyl group, and R 22 is a hydrogen atom or an organic group having 1 to 3 carbon atoms. [2] The polymer of item [1], which further contains a structural unit represented by formula (1-1), In the formula (1-1), R 21 is a hydrogen atom or an organic group having 1 to 3 carbon atoms, Z is a group containing one or more (meth)acrylyl groups, Q is a hydrogen atom or a substituted or unsubstituted group. Substituted alkyl group having 1 to 6 carbon atoms, X represents an oxygen atom or a substituted or unsubstituted alkyl group having 1 to 4 carbon atoms. When Q is the aforementioned alkyl group and X is the aforementioned alkylene group, Q and X may condense to form a cyclic group. [3] The polymer of item [1] or [2], which further contains structural units represented by formula (1-4), In formula (1-4), R 22 is a hydrogen atom or an organic group having 1 to 3 carbon atoms. [4] The polymer according to any one of items [1] to [3], which further contains at least one selected from the structural unit represented by formula (1) and the structural unit represented by formula (2), In formula (1), R p is a group having two or more (meth)acrylyl groups, R 21 and R 22 are each independently a hydrogen atom or an organic group having 1 to 3 carbon atoms, In formula (2), R s is a group having one (meth)acrylyl group, and R 21 and R 22 are each independently a hydrogen atom or an organic group having 1 to 3 carbon atoms. [5] The polymer according to any one of items [1] to [4], which further contains a structural unit represented by formula (3), In formula (3), R 21 and R 22 are each independently a hydrogen atom or an organic group having 1 to 3 carbon atoms. [6] The polymer of item [2], which further contains at least one selected from the structural unit represented by formula (8) and the structural unit represented by formula (9), In formula (8), Z is a group containing one or more (meth)acrylyl groups, Q is a hydrogen atom or a substituted or unsubstituted alkyl group having 1 to 6 carbon atoms, and X represents an oxygen atom or A substituted or unsubstituted alkylene group having 1 to 4 carbon atoms. When Q is the aforementioned alkyl group and X is the aforementioned alkylene group, Q and (meth)acrylyl group, R 21 and R 22 are hydrogen atoms or organic groups with 1 to 3 carbon atoms, In formula (9), Z is a group containing one or more (meth)acrylyl groups, Q is a hydrogen atom or a substituted or unsubstituted alkyl group having 1 to 6 carbon atoms, and X represents an oxygen atom or an alkyl group having 1 to 6 carbon atoms. A substituted or unsubstituted alkylene group with 1 to 4 carbon atoms. When Q is the aforementioned alkyl group and X is the aforementioned alkylene group, Q and group) acrylic group, R 21 and R 22 are hydrogen atoms or organic groups having 1 to 3 carbon atoms. [7] The polymer of item [2], which further contains a structural unit represented by formula (5), In formula (5), Z is a group containing one or more (meth)acrylyl groups, Q is a hydrogen atom or a substituted or unsubstituted alkyl group having 1 to 6 carbon atoms, and X represents an oxygen atom or Substituted or unsubstituted alkylene group having 1 to 4 carbon atoms. When Q is the aforementioned alkyl group and X is the aforementioned alkylene group, Q and X may be condensed to form a cyclic group. R 21 and R 22 are hydrogen atoms. Or an organic group having 1 to 3 carbon atoms. [8] The polymer of item [2], which further contains a structural unit represented by formula (6), In formula (6), Z is a group containing one or more (meth)acrylyl groups, Q is a hydrogen atom or a substituted or unsubstituted alkyl group having 1 to 6 carbon atoms, and X represents an oxygen atom or Substituted or unsubstituted alkylene group having 1 to 4 carbon atoms. When Q is the aforementioned alkyl group and X is the aforementioned alkylene group, Q and X may be condensed to form a cyclic group. R 21 and R 22 are hydrogen atoms. Or an organic group having 1 to 3 carbon atoms. [9] The polymer according to any one of items [1] to [8], which further contains a structural unit represented by formula (MA), In the formula (MA), R 21 and R 22 are each independently a hydrogen atom or an organic group having 1 to 3 carbon atoms. [10] The polymer according to any one of items [1] to [9], wherein the polymer contains a structural unit represented by the aforementioned formula (1-2), and R p in the aforementioned formula (1-2) is at least one selected from the group consisting of the group represented by formula (1b), the group represented by formula (1c) and the group represented by formula (1d), In formula (1b), k is 2 or 3, R is a hydrogen atom or a methyl group, and the plurality of R may be the same or different. X 1 is a single bond, an alkylene group with 1 to 6 carbon atoms, or -ZX-. (Z is -O- or -OCO- , Alkylene group or a group represented by -X'-Z'- (X' is an alkylene group with 1 to 6 carbon atoms, Z' is -O- or -COO-), X 2 is an alkylene group with 1 to 12 carbon atoms The organic radical with (k+1) valence, In formula (1c), k , R, X 1 and X 2 are respectively synonymous with R, k, X 1 and They may be the same or different from each other. X 3 is a single bond or a divalent organic group having 1 to 6 carbon atoms. X 4 and X 5 are each independently a single bond or a divalent organic group having 1 to 6 carbon atoms. 6 is a divalent organic group having 1 to 6 carbon atoms, In formula (1d), n is an integer of 2 to 5, and R is independently a hydrogen atom or a methyl group. [11] The polymer according to any one of items [1] to [10], wherein the polymer contains a structural unit represented by the aforementioned formula (1-3), and R s in the aforementioned formula (1-3) is the basis expressed by formula (2a), In formula (2a), X 10 is a divalent organic group, and R is a hydrogen atom or a methyl group. [12] The polymer according to any one of items [1] to [11], which further contains a structural unit represented by formula (MI), In the formula (MI), R 31 is a hydrogen atom or an organic group having 1 to 30 carbon atoms, and R 32 and R 33 are each independently a hydrogen atom or an organic group having 1 to 3 carbon atoms. [13] The polymer according to any one of items [1] to [11], wherein the polymer has a structure represented by formula (P3), In formula (P3), n is an integer from 1 to 6, p, q and r represent the molar content of structural units A, B and C contained in each polymer chain within n [ ], p, q and r can be the same or different in each polymer chain within n [ ], p+q+r=1, p is 0 or more, q is 0 or more, r is 0 or more, if the polymer The molar content of each structural unit A, B and C contained in is set to p t , q t and r t respectively, then p t +q t +r t =1, p t is greater than 0, q t is greater than 0 , r t is greater than 0, X is a hydrogen atom or an organic group with 1 to 30 carbon atoms, Y is a 1-6 valent organic group with 1 to 30 carbon atoms derived from a monofunctional or difunctional or higher-functional thiol group-containing compound. , A represents the structural unit represented by the aforementioned formula (NB), and B contains at least one structural unit selected from the structural unit represented by the aforementioned formula (1-2) and the structural unit represented by the aforementioned formula (1-3). , C represents the structural unit represented by the aforementioned formula (AD), and there are a plurality of A's, B's, and C's which may be the same or different. [14] For example, the polymer of item [12] has a structure represented by formula (P4), In formula (P4), n is an integer from 1 to 6, p, q, r and s represent the molar content of structural units A, B, C and D contained in each polymer chain within n [ ] rate, p, q, r and s can be the same or different in each polymer chain within n [ ], p+q+r+s=1, p is 0 or more, q is 0 or more, r is 0 or more, s is 0 or more, if the molar content of each structural unit A, B, C and D contained in the polymer is respectively p t , q t , r t and s t , then p t +q t +r t +s t =1, p t is greater than 0, q t is greater than 0, r t is greater than 0, s t is greater than 0, X is a hydrogen atom or an organic group with 1 to 30 carbon atoms, Y is derived from A 1- to 6-valent organic group having a carbon number of 1 to 30 in a monofunctional or bifunctional or higher-functional thiol group-containing compound, A represents a structural unit represented by the aforementioned formula (NB), and B contains a member selected from the group consisting of the aforementioned formula (1-2 ) and at least one structural unit represented by the aforementioned formula (1-3), C represents the structural unit represented by the aforementioned formula (AD), D represents the structural unit represented by the aforementioned formula (MI) As for the structural unit, there are a plurality of A's, B's, C's and D's which may be the same or different. [15] The polymer according to any one of items [1] to [14], wherein the weight average molecular weight of the polymer is 2,000 or more and 20,000 or less. [16] A polymer solution containing the polymer of any one of items [1] to [15]. [17] The polymer solution of item [16], which further contains a multifunctional (meth)acrylic acid compound or a monofunctional (meth)acrylic acid compound or a combination thereof. [18] The polymer solution of item [16], which is used for the formation of color filters, black matrices, spacers or partition materials. [19] A photosensitive resin composition containing: the polymer according to any one of items [1] to [15]; and a photoradical polymerization initiator. [20] A hardened product formed from the photosensitive resin composition of item [19]. [21] A polymer containing: a structural unit represented by formula (NB); a structural unit represented by formula (AD); and a structural unit represented by formula (MA), wherein, In the general formula (NB), R 1 , R 2 , R 3 and R 4 are each independently a hydrogen atom or an organic group having 1 to 30 carbon atoms, a 1 is 0, 1 or 2, In formula (MA), R 21 and R 22 are each independently a hydrogen atom or an organic group having 1 to 3 carbon atoms, In the formula (AD), R 11 and R 12 are each independently a linear or branched alkyl group having 1 to 12 carbon atoms, and R 13 and R 14 are each independently a hydrogen atom or an alkyl group having 1 to 3 carbon atoms. . [22] The polymer of item [21], which further contains a structural unit represented by formula (MI), In the formula (MI), R 31 is a hydrogen atom or an organic group having 1 to 30 carbon atoms, and R 32 and R 33 are each independently a hydrogen atom or an organic group having 1 to 3 carbon atoms. [23] The polymer of item [21], wherein the polymer has a structure represented by formula (P3'), In formula (P3'), n is an integer from 1 to 6, p, q' and r represent the molar content of structural units A, B' and C contained in each polymer chain within n [ ] , p, q' and r can be the same or different in each polymer chain within n [ ], p+q'+r=1, p is 0 or more, q' is 0 or more, r is 0 or more , if the molar content of each structural unit A, B and C contained in the polymer is set to p t , q t ' and r t respectively, then p t +q t '+r t =1, p t is greater than 0, qt ' is greater than 0, rt is greater than 0, 30 is an organic group of 1 to 6 valence, A represents the structural unit represented by the aforementioned formula (NB), B' represents the structural unit represented by the aforementioned formula (MA), C represents the structural unit represented by the aforementioned formula (AD), There are a plurality of A's, B''s, and C's, which may be the same or different. [24] The polymer of item [22], wherein the polymer has a structure represented by formula (P4'), In formula (P4'), n is an integer from 1 to 6, p, q', r and s represent the structural units A, B', C and D contained in each polymer chain within n [ ]. Molar content, p, q', r and s can be the same or different in each polymer chain within n [ ], p+q'+r+s=1, p is 0 or more, q' is 0 or more, r is 0 or more, s is 0 or more, if the molar content of each structural unit A, B, C and D contained in the polymer is respectively set to p t , q t ', r t and s t , then p t +q t '+r t +s t =1, p t is greater than 0, q t ' is greater than 0, r t is greater than 0, s t is greater than 0, X is a hydrogen atom or the carbon number is 1~ 30 organic group, Y is a 1-6 valent organic group with 1 to 30 carbon atoms derived from a monofunctional or bifunctional or higher-functional thiol group-containing compound, A represents the structural unit represented by the aforementioned formula (NB), B ' represents the structural unit represented by the aforementioned formula (MA), C represents the structural unit represented by the aforementioned formula (AD), D represents the structural unit represented by the aforementioned formula (MI), and there are a plurality of A, B', and C and D may be the same or different from each other. [25] The polymer of item [20], wherein the softening point of the polymer is 60°C or more and 130°C or less. [Effects of the invention]

根據本發明,可提供一種軟化點或熔點低,因此硬化後的圖案形成性優異,並且具有高鹼溶解性,因此顯影性優異,並且黃色化減少,因此具有高耐熱變色性之作為用於在感光性樹脂組成物中使用之樹脂材料之聚合物。According to the present invention, it is possible to provide a product that has a low softening point or melting point and therefore is excellent in pattern formation after hardening, has high alkali solubility so that it is excellent in developability, and has reduced yellowing and therefore has high heat discoloration resistance for use in A polymer of resin material used in photosensitive resin compositions.

以下,針對本發明的實施形態進行說明。再者,在所有圖式中,對相同的構成要素標註相同符號,並適當地省略說明。又,所有的圖式僅用於說明。圖式中的各構件的形狀或尺寸比等不一定與現實的物品對應。本說明書中,數值範圍的說明中之「a~b」此一標記只要沒有特別指定,則意指「a以上且b以下」。例如,「5~90%」意指「5%以上且90%以下」。Hereinafter, embodiments of the present invention will be described. In addition, in all the drawings, the same components are denoted by the same symbols, and descriptions thereof are appropriately omitted. Also, all figures are for illustration only. The shape, size ratio, etc. of each member in the drawings do not necessarily correspond to the actual product. In this specification, the symbols "a to b" in the description of numerical ranges mean "a or more and b or less" unless otherwise specified. For example, "5 to 90%" means "more than 5% and less than 90%".

本說明書中之基(原子團)的標記中,未標有經取代或未經取代之標記係包含不具有取代基者和具有取代基者此兩者。例如,「烷基」係不僅包含不具有取代基之烷基(未經取代之烷基),亦包含具有取代基之烷基(經取代之烷基)。Among the symbols for groups (atomic groups) in this specification, symbols that do not indicate substituted or unsubstituted include both those that do not have a substituent and those that have a substituent. For example, "alkyl" includes not only alkyl groups without substituents (unsubstituted alkyl groups) but also alkyl groups with substituents (substituted alkyl groups).

本說明書中之「(甲基)丙烯酸」這一標記係表示包含丙烯酸和甲基丙烯酸此兩者之概念。針對「(甲基)丙烯酸酯」等類似的標記亦相同。 尤其,本說明書中之「(甲基)丙烯醯基」係表示包含-C(=O)-CH=CH 2所表示之丙烯醯基和-C(=O)-C(CH 3)=CH 2所表示之甲基丙烯醯基之概念。 The symbol "(meth)acrylic acid" in this specification represents a concept that includes both acrylic acid and methacrylic acid. The same applies to "(meth)acrylate" and other similar marks. In particular, "(meth)acrylyl" in this specification means an acrylyl group represented by -C(=O)-CH= CH2 and -C(=O)-C( CH3 )=CH The concept of methacrylyl group represented by 2 .

[聚合物P] 針對本發明的聚合物(本說明書中,稱之為「聚合物P」)進行說明。只要沒有特別指定,則在所有的實施形態中相同的結構式所表示之結構單元或化合物具有共同的定義,較佳的態樣亦相同。 [Polymer P] The polymer of the present invention (referred to as "polymer P" in this specification) will be described. Unless otherwise specified, the structural units or compounds represented by the same structural formula in all embodiments have the same definition, and the preferred embodiments are also the same.

<第一實施形態> (聚合物P(I)) 按照第一實施形態之本發明的聚合物(本說明書中,稱之為「聚合物P(I)」)含有式(NB)所表示之結構單元;式(AD)所表示之結構單元;以及選自式(1-2)所表示之結構單元及式(1-3)所表示之結構單元中之至少1個結構單元。 <First Embodiment> (Polymer P(I)) The polymer of the present invention according to the first embodiment (referred to as "polymer P(I)" in this specification) contains a structural unit represented by formula (NB); a structural unit represented by formula (AD); and At least one structural unit is selected from the structural units represented by formula (1-2) and the structural units represented by formula (1-3).

通式(NB)中,R 1、R 2、R 3及R 4分別獨立地為氫原子或碳數1~30的有機基,a 1為0、1或2, In the general formula (NB), R 1 , R 2 , R 3 and R 4 are each independently a hydrogen atom or an organic group having 1 to 30 carbon atoms, a 1 is 0, 1 or 2,

式(AD)中,R 11及R 12分別獨立地為碳數1~12的直鏈或支鏈的烷基,R 13及R 14分別獨立地為氫原子或碳數1~3的烷基。 In the formula (AD), R 11 and R 12 are each independently a linear or branched alkyl group having 1 to 12 carbon atoms, and R 13 and R 14 are each independently a hydrogen atom or an alkyl group having 1 to 3 carbon atoms. .

式(1-2)中,R p為具有2個以上的(甲基)丙烯醯基之基,R 22為氫原子或碳數1~3的有機基。 In formula (1-2), R p is a group having two or more (meth)acrylyl groups, and R 22 is a hydrogen atom or an organic group having 1 to 3 carbon atoms.

式(1-3)中,R s為具有1個(甲基)丙烯醯基之基,R 22為氫原子或碳數1~3的有機基。 In formula (1-3), R s is a group having one (meth)acrylyl group, and R 22 is a hydrogen atom or an organic group having 1 to 3 carbon atoms.

本實施形態的聚合物P(I)具有來自於式(NB)所表示之降莰烯之結構單元。來自於降莰烯單體之結構單元在化學上牢固。因此,含有其作為結構單元之聚合物P(I)在供於加熱處理時失重小,且穩定。The polymer P(I) of this embodiment has a structural unit derived from norbornene represented by formula (NB). The structural units derived from the norbornene monomer are chemically strong. Therefore, the polymer P(I) containing this as a structural unit loses little weight when subjected to heat treatment and is stable.

又,本實施形態的聚合物P(I)具有來自於式(AD)所示的不飽和羧酸二烷基酯的結構單元。藉由在聚合物P(I)中導入來自於不飽和羧酸二烷基酯之結構單元(AD),不會伴隨靈敏度、鹼溶解性及耐熱黃變性的變化而能夠降低聚合物P(I)的軟化點或熔點。藉此,具有來自於不飽和羧酸二烷基酯之結構單元(AD)之聚合物P(I)在硬化時容易因熱而熔融,光刻處理中之加工性及圖案形成性優異。因此,為了製造用於在要求耐熱性之液晶顯示裝置或固體攝像元件中使用之薄膜或濾波器,能夠適合使用含有聚合物P(I)之感光性樹脂組成物。Moreover, the polymer P(I) of this embodiment has a structural unit derived from the unsaturated carboxylic acid dialkyl ester represented by Formula (AD). By introducing a structural unit (AD) derived from an unsaturated carboxylic acid dialkyl ester into the polymer P(I), the polymer P(I) can be reduced without causing changes in sensitivity, alkali solubility, and heat-resistant yellowing. ) softening point or melting point. Thereby, the polymer P(I) having the structural unit (AD) derived from the unsaturated dialkyl carboxylate is easily melted by heat when cured, and has excellent processability and pattern formation properties in photolithography processing. Therefore, in order to produce a film or a filter for use in a liquid crystal display device or a solid-state imaging element that requires heat resistance, a photosensitive resin composition containing polymer P(I) can be suitably used.

式(AD)所表示之來自於不飽和羧酸二烷基酯之結構單元中,-C(=O)-O-R 11基與-C(=O)-O-R 12基的立體配置不受限定,可以為順式型亦可以為反式型。更具體而言,如下述聚合物P(I)的製造方法中所記載,式(AD)所表示之來自於不飽和羧酸二烷基酯之結構單元可以為來自於順式型的不飽和二羧酸二烷基酯之結構,亦可以為來自於反式型的不飽和二羧酸二烷基酯之結構。 In the structural unit derived from unsaturated carboxylic acid dialkyl ester represented by formula (AD), the stereoconfiguration of -C(=O)-OR 11 group and -C(=O)-OR 12 group is not limited, It can be cis type or trans type. More specifically, as described in the following method for producing polymer P(I), the structural unit derived from unsaturated carboxylic acid dialkyl ester represented by formula (AD) may be derived from cis-type unsaturated The structure of the dialkyl dicarboxylate may also be derived from the structure of the trans-type unsaturated dialkyl dicarboxylate.

又,本實施形態的聚合物P(I)含有式(1-2)所表示之結構單元及/或式(1-3)所表示之結構單元。換言之,聚合物P(I)含有式(1-2)所表示之結構單元及式(1-3)所表示之結構單元中的任一者或兩者。藉此,含有聚合物P(I)之感光性樹脂組成物在供於光刻處理時具有優異的靈敏度。認為這是由於,藉由式(1-2)或式(1-3)所表示之結構單元中所含有之(甲基)丙烯醯基來促進硬化反應(聚合反應)。Moreover, the polymer P(I) of this embodiment contains the structural unit represented by formula (1-2) and/or the structural unit represented by formula (1-3). In other words, polymer P(I) contains any one or both of the structural unit represented by formula (1-2) and the structural unit represented by formula (1-3). Thereby, the photosensitive resin composition containing polymer P(I) has excellent sensitivity when subjected to photolithography processing. This is considered to be because the (meth)acrylyl group contained in the structural unit represented by Formula (1-2) or Formula (1-3) accelerates the hardening reaction (polymerization reaction).

構成聚合物P(I)之上述式(NB)所示的結構單元中,作為可構成R 1~R 4之碳數1~30的有機基,可以列舉飽和或不飽和的直鏈狀、支鏈狀或環狀的碳數1~30的烴基、烷氧基及雜環基以及羧基等。作為烴基,例如可以列舉烷基、烯基、炔基、亞烷基、芳基、芳烷基、烷芳基及環烷基等。 Among the structural units represented by the above formula (NB) constituting the polymer P (I), examples of organic groups having 1 to 30 carbon atoms constituting R 1 to R 4 include saturated or unsaturated linear and branched ones. Chain or cyclic hydrocarbon groups having 1 to 30 carbon atoms, alkoxy groups, heterocyclic groups, carboxyl groups, etc. Examples of the hydrocarbon group include an alkyl group, an alkenyl group, an alkynyl group, an alkylene group, an aryl group, an aralkyl group, an alkaryl group, a cycloalkyl group, and the like.

作為烷基,例如可以列舉甲基、乙基、正丙基、異丙基、正丁基、異丁基、二級丁基、三級丁基、戊基、新戊基、己基、庚基、辛基、壬基及癸基等。Examples of the alkyl group include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, secondary butyl, tertiary butyl, pentyl, neopentyl, hexyl, and heptyl. , octyl, nonyl and decyl, etc.

作為烯基,例如可以列舉烯丙基、戊烯基、乙烯基等。 作為炔基,例如可以列舉乙炔基等。 作為亞烷基,例如可以列舉亞甲基(methylidene)、亞乙基(ethylidene)等。 作為芳基,例如可以列舉甲苯基、二甲苯基、苯基、萘基、蒽基(anthracenyl group)。 Examples of the alkenyl group include allyl, pentenyl, vinyl, and the like. Examples of the alkynyl group include an ethynyl group and the like. Examples of the alkylene group include methylene (methylidene), ethylene (ethylidene), and the like. Examples of the aryl group include tolyl, xylyl, phenyl, naphthyl, and anthracenyl groups.

作為芳烷基,例如可以列舉苄基、苯乙基等。 作為烷芳基,例如可以列舉甲苯基、二甲苯基等。 作為環烷基,例如可以列舉金剛烷基(adamantyl)、環戊基、環己基、環辛基等。 作為烷氧基,例如可以列舉甲氧基、乙氧基、正丙氧基、異丙氧基、正丁氧基、二級丁氧基、異丁氧基、三級丁氧基、正戊氧基、新戊氧基、正己氧基等。 作為雜環基,例如可以列舉環氧基、氧環丁基(oxetanyl group)等。 Examples of the aralkyl group include benzyl group, phenethyl group, and the like. Examples of the alkylaryl group include tolyl group, xylyl group, and the like. Examples of the cycloalkyl group include adamantyl, cyclopentyl, cyclohexyl, cyclooctyl, and the like. Examples of the alkoxy group include methoxy, ethoxy, n-propoxy, isopropoxy, n-butoxy, secondary butoxy, isobutoxy, tertiary butoxy, and n-pentoxy. Oxygen, neopentyloxy, n-hexyloxy, etc. Examples of the heterocyclic group include an epoxy group, an oxetanyl group, and the like.

作為式(NB)所表示之結構單元中之R 1、R 2、R 3及R 4,較佳為氫原子或烷基,更佳為氫原子。 再者,R 1、R 2、R 3及R 4的碳數1~30的有機基中的氫原子可以被任意的原子團取代。例如,可以被氟原子、羥基、羧基等取代。更具體而言,作為R 1、R 2、R 3及R 4的碳數1~30的有機基,可以選擇氟化烷基等。 式(NB)所表示之結構單元中,a 1較佳為0或1,更佳為0。 R 1 , R 2 , R 3 and R 4 in the structural unit represented by formula (NB) are preferably a hydrogen atom or an alkyl group, more preferably a hydrogen atom. In addition, the hydrogen atom in the organic group having 1 to 30 carbon atoms in R 1 , R 2 , R 3 and R 4 may be substituted with any atomic group. For example, it may be substituted by a fluorine atom, a hydroxyl group, a carboxyl group, etc. More specifically, as the organic group having 1 to 30 carbon atoms in R 1 , R 2 , R 3 and R 4 , a fluorinated alkyl group or the like can be selected. In the structural unit represented by formula (NB), a 1 is preferably 0 or 1, more preferably 0.

構成聚合物P(I)之所有結構單元中的式(NB)所表示之結構單元的比例較佳為25~75莫耳%,更佳為30~65莫耳%,進而較佳為35~60莫耳%。The proportion of the structural units represented by the formula (NB) among all the structural units constituting the polymer P (I) is preferably 25 to 75 mol%, more preferably 30 to 65 mol%, and still more preferably 35 to 35 mol%. 60 mol%.

構成聚合物P(I)之上述式(AD)所表示之結構單元中,R 11及R 12分別獨立地為碳數1~12的直鏈或支鏈的烷基。 作為可構成式(AD)的結構單元中的R 11及R 12之碳數1~12的直鏈或支鏈的烷基,例如可以列舉甲基、乙基、正丙、異丙基、正丁基、異丁基、二級丁基、三級丁基、戊基、新戊基、己基、乙基己基、庚基、辛基、壬基、癸基、十一烷基、十二烷基等。其中,R 11及R 12較佳為碳數1~12的直鏈或支鏈的烷基,因為所獲得之聚合物P(I)不會損害耐熱黃色性而具有低軟化點或低熔點。 構成聚合物P(I)之上述式(AD)所表示之結構單元中,R 13及R 14分別獨立地為氫原子或碳數1~3的烷基。作為碳數1~3的烷基,可以列舉甲基、乙基、正丙、異丙基。從反應性的觀點而言,R 13及R 14較佳為氫原子。 In the structural unit represented by the above formula (AD) constituting the polymer P (I), R 11 and R 12 are each independently a linear or branched alkyl group having 1 to 12 carbon atoms. Examples of linear or branched alkyl groups having 1 to 12 carbon atoms as R11 and R12 in the structural unit of formula (AD) include methyl, ethyl, n-propyl, isopropyl, n- Butyl, isobutyl, secondary butyl, tertiary butyl, pentyl, neopentyl, hexyl, ethylhexyl, heptyl, octyl, nonyl, decyl, undecyl, dodecyl Key et al. Among them, R 11 and R 12 are preferably linear or branched alkyl groups having 1 to 12 carbon atoms, because the obtained polymer P (I) does not impair the heat-resistant yellowness and has a low softening point or low melting point. In the structural unit represented by the above formula (AD) constituting the polymer P (I), R 13 and R 14 are each independently a hydrogen atom or an alkyl group having 1 to 3 carbon atoms. Examples of the alkyl group having 1 to 3 carbon atoms include methyl, ethyl, n-propyl, and isopropyl. From the viewpoint of reactivity, R 13 and R 14 are preferably hydrogen atoms.

構成聚合物P(I)之所有結構單元中的式(AD)所表示之結構單元的比例較佳為2~30莫耳%,更佳為3~28莫耳%,進而較佳為5~25莫耳%。藉由將聚合物P(I)中的式(AD)所表示之結構單元的比例設在上述範圍,能夠獲得具有低軟化點或低熔點,並且靈敏度、鹼溶解性及耐熱變色性的平衡以高度的水準得到改善之聚合物P(I)。The proportion of the structural units represented by the formula (AD) among all the structural units constituting the polymer P (I) is preferably 2 to 30 mol%, more preferably 3 to 28 mol%, and still more preferably 5 to 5 mol%. 25 mol%. By setting the ratio of the structural units represented by the formula (AD) in the polymer P (I) within the above range, it is possible to obtain a polymer having a low softening point or a low melting point and a balance of sensitivity, alkali solubility, and heat discoloration resistance. The level of polymer P(I) has been improved.

聚合物P(I)含有式(1-2)所表示之含有2個以上的(甲基)丙烯醯基(-C(=O)-CH=CH 2)之結構單元或式(1-3)所表示之含有1個(甲基)丙烯醯基之結構單元或該等的組合。藉由含有這樣的結構單元,聚合物P(I)具有曝光處理中之更優異的靈敏度。認為這是由於,藉由式(1-2)或式(1-3)所表示之結構單元中所含有之(甲基)丙烯醯基來促進硬化反應(聚合反應)。 Polymer P (I) contains a structural unit represented by formula (1-2) containing two or more (meth)acrylyl groups (-C (=O)-CH=CH 2 ) or formula (1-3 ) represents a structural unit containing one (meth)acrylyl group or a combination thereof. By containing such structural units, the polymer P(I) has more excellent sensitivity in exposure processing. This is considered to be because the (meth)acrylyl group contained in the structural unit represented by Formula (1-2) or Formula (1-3) accelerates the hardening reaction (polymerization reaction).

式(1-2)或式(1-3)中,作為可構成R 22之碳數1~3的有機基,可以列舉甲基、乙基、正丙及異丙基。R 21及R 22均較佳為氫原子。 In the formula (1-2) or the formula (1-3), examples of the organic group having 1 to 3 carbon atoms that can constitute R 22 include a methyl group, an ethyl group, an n-propyl group, and an isopropyl group. Both R 21 and R 22 are preferably hydrogen atoms.

式(1-2)所表示之結構單元中,R p為含有2個以上的(甲基)丙烯醯基之基,較佳為含有2~9個(甲基)丙烯醯基之基,更佳為含有3~6個(甲基)丙烯醯基之基。藉由最佳設定R p所含有之(甲基)丙烯醯基的數量,能夠進一步提高含有其之聚合物P(I)在曝光處理中之靈敏度。又,容易更高度地兼顧聚合物P(I)的靈敏度和鹼溶解性。另外,能夠改善聚合物P(I)的耐熱性。 In the structural unit represented by formula (1-2), R p is a group containing two or more (meth)acrylyl groups, preferably a group containing 2 to 9 (meth)acrylyl groups, and more preferably Preferably, it is a group containing 3 to 6 (meth)acrylyl groups. By optimally setting the number of (meth)acrylyl groups contained in R p , the sensitivity of the polymer P(I) containing it in the exposure process can be further improved. In addition, it is easy to achieve a higher degree of balance between the sensitivity and alkali solubility of the polymer P(I). In addition, the heat resistance of polymer P(I) can be improved.

式(1-2)中之R p較佳為式(1b)所表示之基、式(1c)所表示之基或式(1d)所表示之基,含有選自該等中之至少一種。藉由為此種基,具有容易獲得上述各種效果之傾向。 R p in formula (1-2) is preferably a group represented by formula (1b), a group represented by formula (1c), or a group represented by formula (1d), and contains at least one selected from these. By using such a base, the above-mentioned various effects tend to be easily obtained.

式(1b)中, k為2或3, R為氫原子或甲基,複數個R可以相同亦可以不同, X 1為單鍵、碳數1~6的伸烷基或-Z-X-所表示之基(Z為-O-或-OCO-,X為碳數1~6的伸烷基),存在複數個之X 1可以相同亦可以不同, X 1’為單鍵、碳數1~6的伸烷基或-X’-Z’-所表示之基(X’為碳數1~6的伸烷基,Z’為-O-或-COO-), X 2為碳數1~12的k+1價的有機基。 從進一步提高靈敏度(聚合的容易性)等而言,R較佳為氫原子。 k可以為2,亦可以為3,但從進一步提高原料的獲得容易性或靈敏度之觀點而言,較佳為3。 In formula (1b), k is 2 or 3, R is a hydrogen atom or a methyl group, and the plurality of R may be the same or different. X 1 is a single bond, an alkylene group with 1 to 6 carbon atoms, or -ZX-. (Z is -O- or -OCO- , Alkylene group or a group represented by -X'-Z'- (X' is an alkylene group with 1 to 6 carbon atoms, Z' is -O- or -COO-), X 2 is an alkylene group with 1 to 12 carbon atoms An organic radical with k+1 valence. From the viewpoint of further improving sensitivity (ease of polymerization), etc., R is preferably a hydrogen atom. k may be 2 or 3, but from the viewpoint of further improving the ease of acquisition of raw materials or sensitivity, 3 is preferred.

當X 1為碳數1~6的伸烷基時,伸烷基可以為直鏈狀亦可以為支鏈狀。 當X 1為碳數1~6的伸烷基時,X 1較佳為直鏈狀伸烷基,更佳為碳數1~3的直鏈狀伸烷基,進而較佳為-CH 2-(亞甲基)。 When X 1 is an alkylene group having 1 to 6 carbon atoms, the alkylene group may be linear or branched. When X 1 is an alkylene group having 1 to 6 carbon atoms, X 1 is preferably a linear alkylene group, more preferably a linear alkylene group having 1 to 3 carbon atoms, and further preferably -CH 2 - (methylene).

當X 1為-Z-X-所表示之基(Z為-O-或-OCO-,X為碳數1~6的伸烷基)時的X的碳數1~6的伸烷基可以為直鏈狀亦可以為支鏈狀。 X的碳數1~6的伸烷基較佳為直鏈狀伸烷基,更佳為碳數1~3的直鏈狀伸烷基,進而較佳為-CH 2-CH 2-(伸乙基)或-CH 2-CH(CH 3)-。 When X 1 is a group represented by -ZX- (Z is -O- or -OCO-, and X is an alkylene group with 1 to 6 carbon atoms), the alkylene group with 1 to 6 carbon atoms in The chain shape may also be a branched chain shape. The alkylene group having 1 to 6 carbon atoms in ethyl) or -CH 2 -CH (CH 3 )-.

當X 1’為碳數1~6的伸烷基時,針對其具體態樣,與X 1相同。 當X 1’為-X’-Z’-所表示之基時,針對X’的具體態樣,與上述X相同。 When X 1 ' is an alkylene group having 1 to 6 carbon atoms, its specific aspect is the same as X 1 . When X 1 ' is the base represented by -X'-Z'-, the specific aspect of X' is the same as the above-mentioned X.

作為X 2的碳數1~12的(k+1)價的有機基,可以列舉從任意的有機化合物中去除(k+1)個氫原子而成之任意的基。作為此處的「任意的有機化合物」,係例如分子量300以下、較佳為200以下、更佳為100以下的有機化合物。 X 2例如為從碳數1~12(較佳為碳數1~6)的直鏈狀或支鏈狀烴中去除(k+1)個氫原子而成之基。更佳為從碳數1~3的直鏈狀烴中去除(k+1)個氫原子而成之基。再者,此處的烴可以含有氧原子(例如,醚鍵或羥基等)。又,烴較佳為飽和烴。 作為另一態樣,X 2可以為含有環狀結構之基。作為含有環狀結構之基,可以列舉含有脂環結構之基、含有雜環結構(例如,異三聚氰酸結構)之基等。 Examples of the (k+1)-valent organic group having 1 to 12 carbon atoms in X 2 include any group obtained by removing (k+1) hydrogen atoms from any organic compound. The "arbitrary organic compound" here is, for example, an organic compound with a molecular weight of 300 or less, preferably 200 or less, and more preferably 100 or less. X 2 is, for example, a group obtained by removing (k+1) hydrogen atoms from a linear or branched hydrocarbon having 1 to 12 carbon atoms (preferably 1 to 6 carbon atoms). More preferably, it is a group obtained by removing (k+1) hydrogen atoms from a linear hydrocarbon having 1 to 3 carbon atoms. Furthermore, the hydrocarbons here may contain oxygen atoms (for example, ether bonds or hydroxyl groups, etc.). Furthermore, the hydrocarbon is preferably a saturated hydrocarbon. As another aspect, X 2 may be a group containing a cyclic structure. Examples of the group containing a cyclic structure include a group containing an alicyclic structure, a group containing a heterocyclic structure (for example, an isocyanuric acid structure), and the like.

式(1c)中, k、R、X 1及X 2分別與上述通式(1b)中之R、k、X 1及X 2同義,複數個R彼此可以相同亦可以不同,複數個X 1彼此可以相同亦可以不同, X 3為碳數1~6的2價的有機基, X 4及X 5分別獨立地為單鍵或碳數1~6的2價的有機基, X 6為碳數1~6的2價的有機基。 In formula (1c), k , R, X 1 and X 2 are respectively synonymous with R, k, X 1 and They may be the same or different from each other. X 3 is a divalent organic group having 1 to 6 carbon atoms. X 4 and X 5 are each independently a single bond or a divalent organic group having 1 to 6 carbon atoms. X 6 is carbon A divalent organic group with numbers 1 to 6.

針對R、k、X 1及X 2的具體態樣、較佳態樣等,與在式(1b)中說明者相同。 作為X 3及X 6的碳數1~6的2價的有機基,例如可以列舉從碳數1~6的直鏈狀或支鏈狀烴中去除2個氫原子而成之基。再者,此處的烴可以含有氧原子(例如,醚鍵或羥基等)。又,烴較佳為飽和烴。 作為X 4及X 5的碳數1~6的2價的有機基,可以列舉直鏈狀或支鏈狀伸烷基。直鏈狀或支鏈狀伸烷基的碳數較佳為1~3。 The specific aspects, preferred aspects, etc. of R, k, X 1 and X 2 are the same as those explained in the formula (1b). Examples of the divalent organic group having 1 to 6 carbon atoms in X 3 and X 6 include a group obtained by removing two hydrogen atoms from a linear or branched hydrocarbon having 1 to 6 carbon atoms. Furthermore, the hydrocarbons here may contain oxygen atoms (for example, ether bonds or hydroxyl groups, etc.). Furthermore, the hydrocarbon is preferably a saturated hydrocarbon. Examples of the divalent organic groups having 1 to 6 carbon atoms in X 4 and X 5 include linear or branched alkylene groups. The carbon number of the linear or branched alkylene group is preferably 1 to 3.

式(1d)中,n為2~5的整數,較佳為2或3。 針對R的具體態樣、較佳態樣等,與在式(1b)中說明者相同。 In formula (1d), n is an integer from 2 to 5, preferably 2 or 3. The specific aspects, preferred aspects, etc. of R are the same as those explained in formula (1b).

當聚合物P(I)含有式(1-2)所表示之結構單元時,聚合物P(I)的所有結構單元中的式(1-2)所表示之結構單元的比例較佳為3~40莫耳%,更佳為3~30莫耳%。When the polymer P (I) contains the structural unit represented by the formula (1-2), the proportion of the structural unit represented by the formula (1-2) among all the structural units of the polymer P (I) is preferably 3 ~40 mol%, more preferably 3 ~ 30 mol%.

可構成聚合物P(I)之式(1-3)所表示之結構單元中,R S為僅含有1個(甲基)丙烯醯基之基。尤其,在通常的感光性樹脂組成物的設計中,當欲提高靈敏度而提高了硬化性時,硬化過度進行而顯影性趨於變差,另一方面,當欲改善顯影性時,硬化趨於變得不充分,因此聚合物P(I)較佳為含有式(1-2)所表示之結構單元及式(1-3)所表示之結構單元中的任一者或兩者,藉此,能夠以良好的平衡兼顧靈敏度和顯影性這兩者。 Among the structural units represented by the formula (1-3) that can constitute the polymer P (I), R S is a group containing only one (meth)acrylyl group. In particular, in the design of ordinary photosensitive resin compositions, when curing properties are increased in order to increase sensitivity, curing proceeds excessively and the developability tends to deteriorate. On the other hand, when developability is improved in attempts to improve the curing properties, curing tends to becomes insufficient, so the polymer P(I) preferably contains either or both of the structural unit represented by formula (1-2) and the structural unit represented by formula (1-3), whereby , which can achieve both sensitivity and developability in a good balance.

R S例如為以下式(2a)所表示之基。 R S is, for example, a group represented by the following formula (2a).

式(2a)中,X 10為2價的有機基,R為氫原子或甲基。X 10的總碳數較佳為1~30,更佳為1~20,進而較佳為1~10。 作為X 10的2價的有機基,例如較佳為伸烷基。作為該伸烷基中的一部分-CH 2-可以為醚基(-O-)。伸烷基可以為直鏈狀亦可以為支鏈狀,但更佳為直鏈狀。 In formula (2a), X 10 is a divalent organic group, and R is a hydrogen atom or a methyl group. The total number of carbon atoms in X 10 is preferably 1 to 30, more preferably 1 to 20, and still more preferably 1 to 10. As the divalent organic group of X 10 , for example, an alkylene group is preferred. As part of the alkylene group -CH 2 - may be an ether group (-O-). The alkylene group may be linear or branched, but is preferably linear.

作為X 10的2價的有機基,更佳為總碳數3~6的直鏈狀伸烷基。藉由適當地選擇X 10的碳數(X 10的鏈長),式(2)所表示之結構單元容易進一步參與交聯反應,能夠提高靈敏度。 As the divalent organic group of X 10 , a linear alkylene group having a total carbon number of 3 to 6 is more preferred. By appropriately selecting the carbon number of X 10 (the chain length of

X 10的2價的有機基(例如伸烷基)可以被任意的取代基取代。作為取代基,可以列舉烷基、芳基、烷氧基、芳氧基等。 又,X 10的2價的有機基亦可以為伸烷基以外的任意的基。例如,可以為將選自伸烷基、伸環烷基(cycloalkylene)、伸芳基(arylene)、醚基、羰基、羧基等中之一種或兩種以上的基連結而構成之2價的基。 The divalent organic group (eg, alkylene group) of X 10 may be substituted by any substituent. Examples of the substituent include an alkyl group, an aryl group, an alkoxy group, an aryloxy group, and the like. Furthermore, the divalent organic group of X 10 may be any group other than an alkylene group. For example, it may be a divalent group formed by linking one or two or more groups selected from an alkylene group, a cycloalkylene group, an arylene group, an ether group, a carbonyl group, a carboxyl group, and the like. .

當聚合物P(I)含有式(1-3)所表示之結構單元時,聚合物P(I)的所有結構單元中的式(1-3)所表示之結構單元的比例較佳為5~30莫耳%,更佳為10~20莫耳%。When the polymer P (I) contains the structural unit represented by the formula (1-3), the proportion of the structural unit represented by the formula (1-3) among all the structural units of the polymer P (I) is preferably 5 ~30 mol%, more preferably 10 ~ 20 mol%.

又,當聚合物P(I)含有式(1-2)所表示之結構單元和式(1-3)所表示之結構單元這兩者時,聚合物P(I)中的式(1-2)所表示之結構單元與式(1-3)所表示之結構單元的合計比例以構成聚合物P(I)之所有結構單元為基準,較佳為5~40莫耳%,更佳為10~35莫耳%,進而較佳為15~30莫耳%。Moreover, when the polymer P(I) contains both the structural unit represented by the formula (1-2) and the structural unit represented by the formula (1-3), the formula (1- in the polymer P(I) 2) The total proportion of the structural units represented and the structural units represented by formula (1-3) is based on all the structural units constituting the polymer P (I), preferably 5 to 40 mol%, more preferably 10 to 35 mol%, more preferably 15 to 30 mol%.

本實施形態的聚合物P(I)除了含有上述結構單元以外,亦可以含有式(1-1)所表示之結構單元。The polymer P(I) of this embodiment may contain a structural unit represented by formula (1-1) in addition to the above-mentioned structural units.

式(1-1)所表示之結構單元中, R 21為氫原子或碳數1~3的有機基。 R D為含有1個以上的(甲基)丙烯醯基之基。 Q為氫原子或經取代或未經取代之碳數1~6的烷基。作為該烷基,例如可以列舉甲基、乙基、正丙基、異丙基、正丁基、異丁基、二級丁基、三級丁基、戊基、己基。作為經取代之碳數1~6的烷基的取代基,可以列舉鹵素原子、羥基、羧基、胺基、氰基、巰基等。 X表示氧原子、經取代或未經取代之碳數1~4的伸烷基。作為構成X之伸烷基,可以列舉亞甲基、伸乙基、伸丙基、伸丁基。作為經取代之碳數1~4的伸烷基的取代基,可以列舉鹵素原子、羥基、羧基、胺基、氰基、巰基等。 當Q為前述烷基且X為前述伸烷基時,Q的烷基與X的伸烷基中的任一碳原子可以鍵結而形成環。作為環結構,可以列舉環丙烷環、環丁烷環、環戊烷環、環己烷環、十氫萘環、苯環、萘環等。 式(1-1)中,可以較佳為使用X為碳數1~4的伸烷基且Z為(甲基)丙烯醯氧基的態樣或X為氧原子且Z為(甲基)丙烯醯基的態樣。 In the structural unit represented by formula (1-1), R 21 is a hydrogen atom or an organic group having 1 to 3 carbon atoms. RD is a group containing one or more (meth)acrylyl groups. Q is a hydrogen atom or a substituted or unsubstituted alkyl group having 1 to 6 carbon atoms. Examples of the alkyl group include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, secondary butyl, tertiary butyl, pentyl, and hexyl. Examples of the substituent of the substituted alkyl group having 1 to 6 carbon atoms include a halogen atom, a hydroxyl group, a carboxyl group, an amino group, a cyano group, a mercapto group, and the like. X represents an oxygen atom and a substituted or unsubstituted alkylene group having 1 to 4 carbon atoms. Examples of the alkylene group constituting X include methylene, ethylene, propylene, and butylene. Examples of the substituent of the substituted alkylene group having 1 to 4 carbon atoms include a halogen atom, a hydroxyl group, a carboxyl group, an amino group, a cyano group, a mercapto group, and the like. When Q is the aforementioned alkyl group and X is the aforementioned alkylene group, any carbon atom in the alkyl group of Q and the alkylene group of X may be bonded to form a ring. Examples of the ring structure include a cyclopropane ring, a cyclobutane ring, a cyclopentane ring, a cyclohexane ring, a decalin ring, a benzene ring, a naphthalene ring, and the like. In formula (1-1), it is preferable to use an aspect in which X is an alkylene group having 1 to 4 carbon atoms and Z is a (meth)acryloxy group, or X is an oxygen atom and Z is (methyl) The form of acrylic group.

更詳細而言,式(1-1)中,可以較佳使用X為碳數1~4的伸烷基且Z為下述式(1a)所表示之(甲基)丙烯醯氧基的態樣或X為氧原子且Z為丙烯醯基(-C(=O)-CH=CH 2)或甲基丙烯醯基(-C(=O)-C(CH 3)=CH 2)的態樣。 More specifically, in the formula (1-1), a state in which X is an alkylene group having 1 to 4 carbon atoms and Z is a (meth)acryloxy group represented by the following formula (1a) can be preferably used. Or X is an oxygen atom and Z is an acrylyl group (-C (=O)-CH=CH 2 ) or a methacrylyl group (-C (=O)-C (CH 3 ) =CH 2 ) Like.

式(1a)中,R為氫原子或甲基。In formula (1a), R is a hydrogen atom or a methyl group.

當聚合物P(I)含有式(1-1)所表示之結構單元時,聚合物P(I)的所有結構單元中的式(1-1)所表示之結構單元的比例較佳為0.5~20莫耳%,更佳為1~15莫耳%。When the polymer P (I) contains the structural unit represented by the formula (1-1), the proportion of the structural unit represented by the formula (1-1) among all the structural units of the polymer P (I) is preferably 0.5. ~20 mol%, more preferably 1 ~ 15 mol%.

聚合物P(I)可以含有式(1-4)所表示之結構單元。Polymer P(I) may contain structural units represented by formula (1-4).

式(1-4)中,R 22為氫原子或碳數1~3的有機基。 In formula (1-4), R 22 is a hydrogen atom or an organic group having 1 to 3 carbon atoms.

當聚合物P(I)含有式(1-1)的結構單元和式(1-4)的結構單元時,聚合物P(I)具有(甲基)丙烯醯基(式(1-1)中的「-Z」基)和作為式(1-4)而表示之羧基這兩者。該(甲基)丙烯醯基含有聚合性碳-碳雙鍵。如此,聚合物P(I)藉由聚合性基和羧基存在於同一聚合物分子內,能夠將雙鍵當量和酸值設計成比較大的值。再者,在(甲基)丙烯酸樹脂等其他樹脂中,難以提高聚合性基和羧基這兩者的含量。聚合物P藉由具有這樣的結構,能夠以高水準兼顧靈敏度和顯影性。When the polymer P (I) contains the structural unit of the formula (1-1) and the structural unit of the formula (1-4), the polymer P (I) has a (meth)acrylyl group (formula (1-1) "-Z" group in) and the carboxyl group represented by formula (1-4). This (meth)acrylyl group contains a polymerizable carbon-carbon double bond. In this way, since the polymerizable group and the carboxyl group of the polymer P(I) exist in the same polymer molecule, the double bond equivalent and the acid value can be designed to be relatively large. Furthermore, in other resins such as (meth)acrylic resin, it is difficult to increase the contents of both polymerizable groups and carboxyl groups. By having such a structure, polymer P can achieve both sensitivity and developability at a high level.

聚合物P(I)可以含有選自式(1)所表示之結構單元及式(2)所表示之結構單元中之至少1個。The polymer P(I) may contain at least one selected from the structural unit represented by formula (1) and the structural unit represented by formula (2).

式(1)及式(2)中,R p及R s以及R 21及R 22與上述式(1-1)、式(1-2)及式(1-4)中者同義。 In Formula (1) and Formula (2), R p and R s and R 21 and R 22 are synonymous with those in the above-mentioned Formula (1-1), Formula (1-2) and Formula (1-4).

當聚合物P(I)含有式(1)所表示之結構單元時,聚合物P的所有結構單元中的式(1)所表示之結構單元的比例較佳為0.5~25莫耳%,更佳為1~18莫耳%。When the polymer P (I) contains the structural unit represented by the formula (1), the proportion of the structural unit represented by the formula (1) among all the structural units of the polymer P is preferably 0.5 to 25 mol%, more preferably Preferably, it is 1 to 18 mol%.

當聚合物P(I)含有式(2)所表示之結構單元時,聚合物P的所有結構單元中的式(2)所表示之結構單元的比例較佳為0.5~35莫耳%,更佳為2~25莫耳%。When the polymer P (I) contains the structural unit represented by the formula (2), the proportion of the structural unit represented by the formula (2) among all the structural units of the polymer P is preferably 0.5 to 35 mol%, more preferably Preferably, it is 2 to 25 mol%.

本實施形態的聚合物P(I)除了含有上述結構單元以外,亦可以含有式(3)所表示之結構單元。聚合物P(I)藉由含有式(3)所表示之結構單元而具有高鹼溶解性。其結果,含有聚合物P(I)之感光性樹脂組成物在供於將鹼水溶液用作顯影液之光刻時具有優異的顯影性。聚合物P(I)的所有結構單元中的式(3)所表示之結構單元的比例較佳為1~10莫耳%,更佳為2~7莫耳%。The polymer P(I) of this embodiment may contain the structural unit represented by Formula (3) in addition to the above-mentioned structural units. Polymer P(I) has high alkali solubility by containing the structural unit represented by formula (3). As a result, the photosensitive resin composition containing the polymer P(I) has excellent developability when used for photolithography using an alkali aqueous solution as a developer. The proportion of the structural units represented by the formula (3) among all the structural units of the polymer P (I) is preferably 1 to 10 mol%, more preferably 2 to 7 mol%.

式(3)中,R 21及R 22分別獨立地為氫原子或碳數1~3的有機基。 In formula (3), R 21 and R 22 are each independently a hydrogen atom or an organic group having 1 to 3 carbon atoms.

聚合物P可以含有式(8)所表示之結構單元及式(9)所表示之結構單元中的至少1個。在此,式(8)的結構單元為由式(1-1)所表示之結構單元及式(1-2)所表示之結構單元構成之結構單元,式(9)的結構單元為由式(1-1)所表示之結構單元及式(1-3)所表示之結構單元構成之結構單元。The polymer P may contain at least one of the structural unit represented by formula (8) and the structural unit represented by formula (9). Here, the structural unit of formula (8) is a structural unit composed of the structural unit represented by formula (1-1) and the structural unit represented by formula (1-2), and the structural unit of formula (9) is composed of the formula A structural unit composed of the structural unit represented by (1-1) and the structural unit represented by formula (1-3).

式(8)中,Q、X、Z與式(1-1)同義,R p與式(1-2)同義。 式(9)中,Z、Q、X與式(1-1)同義,R S與式(1-3)同義。 In formula (8), Q, X, Z are synonymous with formula (1-1), and R p is synonymous with formula (1-2). In formula (9), Z, Q, and X are synonymous with formula (1-1), and R S is synonymous with formula (1-3).

當聚合物P(I)含有式(8)所表示之結構單元時,聚合物P(I)的所有結構單元中的式(8)所表示之結構單元的比例較佳為0.25~17莫耳%,更佳為0.5~12莫耳%。 當聚合物P(I)含有式(9)所表示之結構單元時,聚合物P(I)的所有結構單元中的式(9)所表示之結構單元的比例較佳為0.25~17莫耳%,更佳為0.5~12莫耳%。 When the polymer P (I) contains the structural unit represented by the formula (8), the proportion of the structural unit represented by the formula (8) among all the structural units of the polymer P (I) is preferably 0.25 to 17 moles. %, more preferably 0.5~12 mol%. When the polymer P (I) contains the structural unit represented by the formula (9), the proportion of the structural unit represented by the formula (9) among all the structural units of the polymer P (I) is preferably 0.25 to 17 moles. %, more preferably 0.5~12 mol%.

聚合物P(I)可以含有由式(1-1)所表示之結構單元和式(1-4)所表示之結構單元構成之下述式(5)所表示之結構單元。藉由含有該結構單元,能夠以更良好的平衡兼顧靈敏度和顯影性這兩者。The polymer P(I) may contain a structural unit represented by the following formula (5) consisting of a structural unit represented by the formula (1-1) and a structural unit represented by the formula (1-4). By including this structural unit, it is possible to achieve both sensitivity and developability in a better balance.

式(5)中,Z、X、Q與式(1-1)及式(1-4)同義。 當聚合物P(I)含有式(5)所表示之結構單元時,聚合物P(I)的所有結構單元中的式(5)所表示之結構單元的比例較佳為1~12莫耳%,更佳為1~9莫耳%。 In formula (5), Z, X, and Q are synonymous with formula (1-1) and formula (1-4). When the polymer P (I) contains the structural unit represented by the formula (5), the proportion of the structural unit represented by the formula (5) among all the structural units of the polymer P (I) is preferably 1 to 12 moles. %, more preferably 1 to 9 mol%.

從本發明的效果的觀點而言,聚合物P(I)可以進一步含有由式(1-1)所表示之2個結構單元構成之下述式(6)所表示之結構單元。藉由含有該結構單元,能夠進一步改善靈敏度。From the viewpoint of the effects of the present invention, the polymer P (I) may further contain a structural unit represented by the following formula (6) consisting of two structural units represented by the formula (1-1). By including this structural unit, the sensitivity can be further improved.

式(6)中,Z、X、Q與式(1-1)及式(1-4)同義。存在複數個之Z彼此、存在複數個之Q彼此、存在複數個之X彼此可以相同亦可以不同。In formula (6), Z, X, and Q are synonymous with formula (1-1) and formula (1-4). There are a plurality of Zs, a plurality of Qs, and a plurality of Xs, which may be the same or different.

當聚合物P(I)含有式(6)所表示之結構單元時,聚合物P(I)的所有結構單元中的式(6)所表示之結構單元的比例較佳為1~10莫耳%,更佳為1~8莫耳%。When the polymer P (I) contains the structural unit represented by the formula (6), the proportion of the structural unit represented by the formula (6) among all the structural units of the polymer P (I) is preferably 1 to 10 moles. %, more preferably 1 to 8 mol%.

本實施形態的聚合物P(I)除了含有上述結構單元以外,亦可以含有式(MA)所表示之結構單元。式(MA)所表示之結構單元藉由鹼顯影液開環而產生2個羧基。因此,聚合物P(I)具備優異的顯影性。當聚合物P(I)含有式(MA)所表示之結構單元時,聚合物P(I)的所有結構單元中的式(MA)所表示之結構單元較佳為3~40莫耳%,更佳為10~30莫耳%。The polymer P(I) of this embodiment may contain a structural unit represented by formula (MA) in addition to the above-mentioned structural units. The structural unit represented by formula (MA) is ring-opened by an alkali developer to generate two carboxyl groups. Therefore, polymer P(I) has excellent developability. When the polymer P (I) contains the structural unit represented by the formula (MA), the structural unit represented by the formula (MA) in all the structural units of the polymer P (I) is preferably 3 to 40 mol%, More preferably, it is 10-30 mol%.

式(MA)中,R 21及R 22分別獨立地為氫原子或碳數1~3的有機基。 In the formula (MA), R 21 and R 22 are each independently a hydrogen atom or an organic group having 1 to 3 carbon atoms.

在一實施形態中,聚合物P(I)除了含有上述結構單元以外,亦可以含有式(MI)所表示之結構單元。In one embodiment, the polymer P (I) may contain, in addition to the above-mentioned structural units, a structural unit represented by the formula (MI).

式(MI)中,R 31為氫原子或碳數1~30的有機基,R 32及R 33分別獨立地為氫原子或碳數1~3的有機基。 式(MI)所表示之結構單元中,作為可構成R 32及R 33之碳數1~3的有機基,可以列舉甲基、乙基、正丙基及異丙基。R 32及R 33較佳為氫原子。 作為可構成式(MI)中的R 31之碳數1~30的有機基,可以列舉飽和或不飽和的直鏈狀、支鏈狀或環狀的碳數1~30的烴基、烷氧基及雜環基以及羧基等。作為烴基,例如可以列舉烷基、烯基、炔基、亞烷基、芳基、芳烷基、烷芳基及環烷基等。R 31較佳為碳數1~25的烴基,更佳為碳數1~20的烴基,進而較佳為碳數1~15的烴基。 In the formula (MI), R 31 is a hydrogen atom or an organic group having 1 to 30 carbon atoms, and R 32 and R 33 are each independently a hydrogen atom or an organic group having 1 to 3 carbon atoms. In the structural unit represented by the formula (MI), examples of the organic group having 1 to 3 carbon atoms that can constitute R 32 and R 33 include a methyl group, an ethyl group, an n-propyl group, and an isopropyl group. R 32 and R 33 are preferably hydrogen atoms. Examples of the organic group having 1 to 30 carbon atoms that can constitute R 31 in formula (MI) include saturated or unsaturated linear, branched, or cyclic hydrocarbon groups and alkoxy groups having 1 to 30 carbon atoms. And heterocyclic groups and carboxyl groups, etc. Examples of the hydrocarbon group include an alkyl group, an alkenyl group, an alkynyl group, an alkylene group, an aryl group, an aralkyl group, an alkaryl group, a cycloalkyl group, and the like. R 31 is preferably a hydrocarbon group having 1 to 25 carbon atoms, more preferably a hydrocarbon group having 1 to 20 carbon atoms, even more preferably a hydrocarbon group having 1 to 15 carbon atoms.

作為烷基,例如可以列舉甲基、乙基、正丙基、異丙基、正丁基、異丁基、二級丁基、三級丁基、戊基、新戊基、己基、庚基、辛基、壬基及癸基等。Examples of the alkyl group include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, secondary butyl, tertiary butyl, pentyl, neopentyl, hexyl, and heptyl. , octyl, nonyl and decyl, etc.

作為烯基,例如可以列舉烯丙基、戊烯基、乙烯基等。 作為炔基,例如可以列舉乙炔基等。 作為亞烷基,例如可以列舉亞甲基、亞乙基等。 作為芳基,例如可以列舉甲苯基、二甲苯基、苯基、萘基、蒽基。 Examples of the alkenyl group include allyl, pentenyl, vinyl, and the like. Examples of the alkynyl group include an ethynyl group and the like. Examples of the alkylene group include methylene, ethylene, and the like. Examples of the aryl group include tolyl, xylyl, phenyl, naphthyl, and anthracenyl.

作為芳烷基,例如可以列舉苄基、苯乙基等。 作為烷芳基,例如可以列舉甲苯基、二甲苯基等。 作為環烷基,例如可以列舉金剛烷基、環戊基、環己基、環辛基等。 作為烷氧基,例如可以列舉甲氧基、乙氧基、正丙氧基、異丙氧基、正丁氧基、二級丁氧基、異丁氧基、三級丁氧基、正戊氧基、新戊氧基、正己氧基等。 作為雜環基,例如可以列舉環氧基、氧環丁基等。 Examples of the aralkyl group include benzyl group, phenethyl group, and the like. Examples of the alkylaryl group include tolyl group, xylyl group, and the like. Examples of the cycloalkyl group include adamantyl, cyclopentyl, cyclohexyl, cyclooctyl, and the like. Examples of the alkoxy group include methoxy, ethoxy, n-propoxy, isopropoxy, n-butoxy, secondary butoxy, isobutoxy, tertiary butoxy, and n-pentoxy. Oxygen, neopentyloxy, n-hexyloxy, etc. Examples of the heterocyclic group include an epoxy group, an oxycyclobutyl group, and the like.

作為式(MI)所表示之結構單元中之R 31,較佳為氫原子、烷基、芳基或芳烷基。 藉由適當地選擇式(MI)所表示之結構單元中的R 31、R 32及R 33,尤其選擇R 31,能夠調整所獲得之聚合物P(I)的鹼溶性。例如,藉由將R 31設為氫原子,能夠提高所獲得之聚合物P(I)的鹼溶解性。又,藉由將R 31設為烷基、環烷基或芳基,能夠抑制所獲得之聚合物P(I)的鹼溶解性。式(MI)所表示之結構單元中的該等取代基能夠根據聚合物P(I)的用途中所期望之鹼溶解性而選擇。 再者,R 31的碳數1~30的有機基中的氫原子可以被任意的原子團取代。例如,可以被氟原子、羥基、羧基等取代。更具體而言,可以將R 31設為碳數1~30的有機基並選擇氟化烷基等。 R 31 in the structural unit represented by formula (MI) is preferably a hydrogen atom, an alkyl group, an aryl group or an aralkyl group. By appropriately selecting R 31 , R 32 and R 33 in the structural unit represented by formula (MI), especially selecting R 31 , the alkali solubility of the obtained polymer P (I) can be adjusted. For example, by setting R 31 as a hydrogen atom, the alkali solubility of the obtained polymer P(I) can be improved. Moreover, by setting R 31 as an alkyl group, a cycloalkyl group, or an aryl group, the alkali solubility of the obtained polymer P (I) can be suppressed. The substituents in the structural unit represented by the formula (MI) can be selected according to the desired alkali solubility in the use of the polymer P (I). In addition, the hydrogen atom in the organic group having 1 to 30 carbon atoms in R 31 may be substituted with any atomic group. For example, it may be substituted by a fluorine atom, a hydroxyl group, a carboxyl group, etc. More specifically, R 31 may be an organic group having 1 to 30 carbon atoms, and a fluorinated alkyl group or the like may be selected.

當聚合物P(I)含有式(MI)所表示之結構單元時,構成聚合物P(I)之所有結構單元中的式(MI)所表示之結構單元的比例較佳為1~30莫耳%,更佳為1.5~28莫耳%,進而較佳為2~25莫耳%。藉由將聚合物P(I)中的式(MI)所表示之結構單元的比例設在上述範圍,能夠以高度的水準改善聚合物P(I)的靈敏度、鹼溶解性及耐熱變色性的平衡。When the polymer P (I) contains the structural unit represented by the formula (MI), the proportion of the structural unit represented by the formula (MI) among all the structural units constituting the polymer P (I) is preferably 1 to 30 mol. mol%, more preferably 1.5 to 28 mol%, further preferably 2 to 25 mol%. By setting the proportion of the structural unit represented by the formula (MI) in the polymer P (I) within the above range, the sensitivity, alkali solubility and heat discoloration resistance of the polymer P (I) can be improved to a high level. balance.

聚合物P(I)的重量平均分子量Mw例如為2,000~20,000。聚合物P(I)的重量平均分子量Mw較佳為2,500~15,000,更佳為3,000~10,000。藉由適當地調整重量平均分子量,能夠調整靈敏度或對鹼顯影液之溶解性。 又,本實施形態的聚合物P(I)的分散度(重量平均分子量Mw/數平均分子量Mn)較佳為1.0~5.0,更佳為1.0~4.0,進而較佳為1.0~3.0。藉由適當地調整分散度,能夠使聚合物P的物性變得均質,因此為較佳。再者,該等值能夠藉由將聚苯乙烯用作標準物質之凝膠滲透層析(GPC)測量來求出。 The weight average molecular weight Mw of the polymer P(I) is, for example, 2,000 to 20,000. The weight average molecular weight Mw of the polymer P(I) is preferably 2,500 to 15,000, more preferably 3,000 to 10,000. By appropriately adjusting the weight average molecular weight, the sensitivity or the solubility to an alkali developer can be adjusted. Moreover, the dispersion degree (weight average molecular weight Mw/number average molecular weight Mn) of the polymer P(I) of this embodiment is preferably 1.0 to 5.0, more preferably 1.0 to 4.0, and still more preferably 1.0 to 3.0. By appropriately adjusting the degree of dispersion, the physical properties of the polymer P can be made uniform, so this is preferable. Furthermore, these equivalent values can be determined by gel permeation chromatography (GPC) measurement using polystyrene as a standard material.

聚合物P(I)的玻璃轉移溫度較佳為100~250℃,更佳為120~230℃。當主要含有式(NB)的結構單元時,具有玻璃轉移溫度趨於變高,另一方面,當含有式(AD)所表示之結構單元時,玻璃轉移溫度趨於變低。本實施形態的聚合物P藉由含有式(NB)的結構單元及式(AD)所表示之結構單元而具有較佳的玻璃轉移溫度。這在製造液晶顯示裝置或固體攝像元件時形成於基板上之圖案能夠穩定存在之觀點上為較佳。再者,玻璃轉移溫度例如能夠藉由示差熱分析(differential thermal analysis:DTA)來求出。The glass transition temperature of the polymer P(I) is preferably 100 to 250°C, more preferably 120 to 230°C. When it mainly contains the structural unit represented by the formula (NB), the glass transition temperature tends to be high. On the other hand, when it contains the structural unit represented by the formula (AD), the glass transition temperature tends to be low. The polymer P of this embodiment has a preferable glass transition temperature by containing the structural unit represented by formula (NB) and the structural unit represented by formula (AD). This is preferable from the viewpoint that the pattern formed on the substrate can stably exist when manufacturing a liquid crystal display device or a solid-state imaging element. In addition, the glass transition temperature can be calculated|required by differential thermal analysis (differential thermal analysis: DTA), for example.

聚合物P(I)的酸值為70mgKOH/g以上且150mgKOH/g以下,較佳為80mgKOH/g以上且140mgKOH/g以下。又,聚合物P1的雙鍵當量為100g/mol以上且900g/mol以下,較佳為200g/mol以上且850g/mol以下,更佳為200g/mol以上且800g/mol以下。 藉由聚合物P(I)的酸值為70mgKOH/g以上,能夠獲得良好的顯影性。又,藉由雙鍵當量為900g/mol以下,能夠提高含有聚合物P(I)之感光性樹脂組成物的靈敏度。 The acid value of the polymer P(I) is 70 mgKOH/g or more and 150 mgKOH/g or less, preferably 80 mgKOH/g or more and 140 mgKOH/g or less. Moreover, the double bond equivalent of polymer P1 is 100g/mol or more and 900g/mol or less, Preferably it is 200g/mol or more and 850g/mol or less, More preferably, it is 200g/mol or more and 800g/mol or less. When the acid value of the polymer P(I) is 70 mgKOH/g or more, good developability can be obtained. In addition, when the double bond equivalent is 900 g/mol or less, the sensitivity of the photosensitive resin composition containing the polymer P(I) can be improved.

再者,若聚合物P(I)的酸值過大,則在鹼顯影液中顯影之時,具有曝光部分容易溶解而導致光硬化中所需要的曝光量變多,或者圖案形狀變得不充分之虞。因此,在本實施形態中,將酸值的上限值設為150mgKOH/g。 又,若聚合物P(I)的雙鍵當量過小(亦即,若聚合物中的雙鍵的密度過大),則在鹼顯影液中顯影之時,具有未曝光部或低曝光部變得不易溶解之傾向,在顯影時經常會產生殘膜。又,若雙鍵當量過小,則藉由交聯而分子量過度增大,具有溶解性過度下降等之虞。因此,在本實施形態中,將雙鍵當量的下限值設為100g/mol。 Furthermore, if the acid value of the polymer P(I) is too high, the exposed portion will be easily dissolved during development in an alkali developer, resulting in an increase in the amount of exposure required for photocuring, or an insufficient pattern shape. Yu. Therefore, in this embodiment, the upper limit of the acid value is set to 150 mgKOH/g. Furthermore, if the double bond equivalent of the polymer P(I) is too small (that is, if the density of double bonds in the polymer is too high), during development in an alkali developer, there will be unexposed areas or low-exposed areas. It tends to be difficult to dissolve and often produces residual film during development. In addition, if the double bond equivalent is too small, the molecular weight may be excessively increased by cross-linking and the solubility may be excessively decreased. Therefore, in this embodiment, the lower limit of the double bond equivalent is set to 100 g/mol.

本實施形態的聚合物P(I)藉由具備上述構成,能夠將其鹼溶解速度設為20nm/s以上,較佳為設為100nm/s以上,更佳為150nm/s以上,特佳為200nm/s以上。上限值不受特別限定,例如可以為2000nm/s以下。若鹼溶解速度過快,則顯影後的圖案有時不會成為如設計那樣的形狀。再者,在本申請說明書中,鹼溶解速度為在以下的條件下測量時之值。(鹼溶解速度的測量方法)使聚合物P(I)溶解於丙二醇單甲醚乙酸酯(PGMEA)而製作固體成分濃度30質量%的溶液。接著,將所獲得之聚合物溶液旋塗於晶圓上,並使PGMEA乾燥,於溫度100℃預烘烤(pre back)2分鐘,藉此製作膜厚2μm±0.2的樹脂膜。將該樹脂膜連同晶圓一起浸漬於溫度23℃的2.0質量%碳酸鈉水溶液中。目視觀察浸漬之晶圓,測量樹脂膜溶解而看不到干涉模樣為止之時間,將浸漬前的膜厚(2μm±0.2)除以該時間,藉此算出鹼溶解速度(μm/秒)。By having the above-mentioned structure, the polymer P(I) of this embodiment can have an alkali dissolution rate of 20 nm/s or more, preferably 100 nm/s or more, more preferably 150 nm/s or more, particularly preferably 200nm/s and above. The upper limit is not particularly limited, but may be 2000 nm/s or less, for example. If the alkali dissolution rate is too fast, the developed pattern may not have the designed shape. In addition, in this specification, the alkali dissolution rate is the value measured under the following conditions. (Measurement method of alkali dissolution rate) Polymer P(I) was dissolved in propylene glycol monomethyl ether acetate (PGMEA) to prepare a solution with a solid content concentration of 30% by mass. Next, the obtained polymer solution was spin-coated on the wafer, and the PGMEA was dried and pre-baked at 100°C for 2 minutes to produce a resin film with a film thickness of 2 μm ± 0.2. The resin film and the wafer were immersed in a 2.0 mass% sodium carbonate aqueous solution at a temperature of 23°C. Visually observe the immersed wafer, measure the time until the resin film dissolves and no interference pattern is visible, and divide the film thickness before immersion (2 μm ± 0.2) by the time to calculate the alkali dissolution rate (μm/second).

藉由調整聚合物P(I)的酸值及/或雙鍵當量,能夠以更高一層的水準兼顧靈敏度和顯影性。By adjusting the acid value and/or double bond equivalent of polymer P(I), it is possible to achieve both sensitivity and developability at a higher level.

聚合物P(I)的酸值及雙鍵當量能夠藉由光譜測量等求出。例如,能夠藉由如下程序求出(更具體而言,可以參閱實施例)。 (1)從聚合物的 1H-NMR圖譜求出與羧基的氫原子或聚合性碳-碳雙鍵附近的氫原子對應之峰的面積(積分值)。 (2)針對(1)中所求出之面積,從來自於標準物質之峰的面積求出羧基的量及碳-碳雙鍵的量。 (3)將(2)中所求出之羧基的量換算為酸值(mgKOH/g)。又,將(2)中所求出之聚合性碳-碳雙鍵的量換算為雙鍵當量(g/mol)。 The acid value and double bond equivalent of polymer P(I) can be determined by spectral measurement or the like. For example, it can be obtained by the following procedure (for more details, please refer to the embodiment). (1) From the 1 H-NMR spectrum of the polymer, determine the area (integrated value) of the peak corresponding to the hydrogen atom of the carboxyl group or the hydrogen atom near the polymerizable carbon-carbon double bond. (2) For the area calculated in (1), determine the amount of carboxyl groups and the amount of carbon-carbon double bonds from the area of the peak derived from the standard material. (3) Convert the amount of carboxyl groups calculated in (2) into acid value (mgKOH/g). Furthermore, the amount of polymerizable carbon-carbon double bonds calculated in (2) is converted into double bond equivalent (g/mol).

聚合物P(I)的酸值及雙鍵當量能夠藉由適當地設計被導入到聚合物P(I)中之結構單元的比率、尤其是式(1)或式(2)所表示之結構單元中所含有之(甲基)丙烯醯基所具有之聚合性碳-碳雙鍵的數量來調整為所期望之值。The acid value and double bond equivalent of polymer P(I) can be appropriately designed by designing the ratio of structural units introduced into polymer P(I), especially the structure represented by formula (1) or formula (2). The number of polymerizable carbon-carbon double bonds contained in the (meth)acrylyl group contained in the unit is adjusted to the desired value.

本實施形態的聚合物P(I)中所含有之各結構單元的含量(比率)能夠根據合成聚合物時的原料的投入量(莫耳量)、合成後殘存之原料的量、各種光譜的峰面積(例如, 1H-NMR的峰面積)等來推算/算出。 The content (ratio) of each structural unit contained in the polymer P(I) of this embodiment can be determined according to the input amount (molar amount) of raw materials when synthesizing the polymer, the amount of raw materials remaining after synthesis, and various spectral The peak area (for example, the peak area of 1 H-NMR), etc. is estimated/calculated.

本實施形態的聚合物P(I)藉由含有式(AD)所表示之結構單元而具有110℃以下的低軟化點。聚合物P(I)的軟化點較佳為100℃以下,更佳為90℃以下。又,本實施形態的聚合物P(I)藉由含有式(AD)所表示之結構單元而具有130℃以下的低熔點。聚合物P(I)的熔點較佳為120℃以下,更佳為110℃以下。 再者,在本申請說明書中,聚合物的軟化點、熔點為在以下的條件下測量時之值。 (軟化點的測量方法) 將測量對象的聚合物0.1~1.0mg放入鋁製樣品盤中,在氮環境下使用示差熱分析裝置(Hitachi High-Tech Science Corporation製造,「EXSTAR TMA/SS6100」)測量了軟化點。測量模式為壓縮、荷重設為30mN,在30℃至200℃的範圍以3℃/分鐘的升溫速度進行了升溫。若試樣因升溫而軟化,則試樣發生變形,被檢測為移位量(μm),低溫側的無移位的直線部分的延長或移位速度的最小部分的切線與移位速度的最大部分的切線的交點設為軟化點。 (熔點的測量方法) 將測量對象的聚合物1~2mg放入鋁製樣品盤中,在氮環境下使用示差熱分析裝置(Hitachi High-Technologies Corporation製造,「STA7200RV」)一邊觀察圖像,一邊從30℃以10℃/分鐘的升溫速度進行了升溫。目視確認試樣開始熔融之溫度,將其作為熔點。 The polymer P(I) of this embodiment has a low softening point of 110°C or less by containing the structural unit represented by formula (AD). The softening point of the polymer P(I) is preferably 100°C or lower, more preferably 90°C or lower. Moreover, the polymer P(I) of this embodiment has a low melting point of 130°C or less by containing the structural unit represented by formula (AD). The melting point of the polymer P(I) is preferably 120°C or lower, more preferably 110°C or lower. In addition, in this specification, the softening point and melting point of a polymer are the values measured under the following conditions. (Measurement method of softening point) 0.1 to 1.0 mg of the polymer to be measured was placed in an aluminum sample pan, and the softening point was measured using a differential thermal analysis device ("EXSTAR TMA/SS6100" manufactured by Hitachi High-Tech Science Corporation) in a nitrogen environment. The measurement mode was compression, the load was set to 30 mN, and the temperature was raised at a heating rate of 3°C/min in the range of 30°C to 200°C. If the sample softens due to temperature rise, the sample deforms, which is detected as the displacement amount (μm), the extension of the straight line portion without displacement on the low temperature side or the tangent line of the minimum portion of the displacement speed and the maximum displacement speed. The intersection point of the tangent lines of the parts is set as the softening point. (Measuring method of melting point) 1 to 2 mg of the polymer to be measured was placed in an aluminum sample pan, and a differential thermal analysis device (manufactured by Hitachi High-Technologies Corporation, "STA7200RV") was used in a nitrogen environment to observe the image from 30°C to 10°C. /min heating rate was carried out. The temperature at which the sample begins to melt is visually confirmed and used as the melting point.

(聚合物P(I)的製造方法) 聚合物P(I)能夠藉由任意的方法來製造(合成)。代表性地,聚合物P(I)能夠藉由以下的步驟aI、步驟aII及步驟aIII來製造。 再者,在以下的聚合物P(I)的製造方法的說明中,為了方便起見,針對所獲得之聚合物P(I)為含有式(NB)所表示之結構單元;式(1-2)所表示之結構單元及/或式(1-3)所表示之結構單元;式(AD)所表示之結構單元之聚合物的情況進行記載。可依據聚合物P(I)的目標結構來選擇原料單體。 當聚合物P(I)含有式(MI)所表示之結構單元時,在步驟aI中,使用式(IMm)所表示之原料單體即可。 步驟aI:準備含有式(NB)所表示之結構單元;式(AD)所表示之結構單元;及式(MA)所表示之結構單元之原料聚合物之步驟; 步驟aII:使步驟aI中所獲得之原料聚合物與具有羥基及2個以上的(甲基)丙烯醯基之化合物(多官能(甲基)丙烯酸化合物)及/或具有羥基及1個(甲基)丙烯醯基之化合物(單官能(甲基)丙烯酸化合物)在鹼性觸媒的存在下進行反應而製備含有式(NB)所表示之結構單元;式(AD)所表示之結構單元;以及式(1)所表示之結構單元及/或式(2)所表示之結構單元且根據情況進一步含有式(MA)所表示之結構單元之聚合物P(I)(有時稱為「聚合物前驅物(a)」)之步驟。在此,式(1)所表示之結構單元為含有式(1-2)的結構之結構單元,式(2)的結構單元為含有式(1-3)的結構之結構單元。 (Method for manufacturing polymer P(I)) Polymer P(I) can be produced (synthesized) by any method. Typically, polymer P(I) can be produced by the following steps aI, step aII, and step aIII. Furthermore, in the following description of the manufacturing method of polymer P(I), for the sake of convenience, the obtained polymer P(I) contains the structural unit represented by formula (NB); formula (1- 2) The structural unit represented and/or the structural unit represented by formula (1-3); the polymer of the structural unit represented by formula (AD) is described. The raw material monomers can be selected according to the target structure of the polymer P(I). When the polymer P (I) contains the structural unit represented by the formula (MI), in step aI, the raw material monomer represented by the formula (IMm) can be used. Step aI: The step of preparing a raw material polymer containing the structural unit represented by formula (NB); the structural unit represented by formula (AD); and the structural unit represented by formula (MA); Step aII: The raw material polymer obtained in step aI is mixed with a compound having a hydroxyl group and two or more (meth)acrylyl groups (a polyfunctional (meth)acrylic acid compound) and/or a compound having a hydroxyl group and one (meth)acrylic acid group. A) acrylyl compound (monofunctional (meth)acrylic acid compound) is reacted in the presence of an alkaline catalyst to prepare a structural unit represented by formula (NB); a structural unit represented by formula (AD); And a polymer P(I) having a structural unit represented by formula (1) and/or a structural unit represented by formula (2), and optionally further containing a structural unit represented by formula (MA) (sometimes referred to as "polymerization" Precursor (a)") steps. Here, the structural unit represented by formula (1) is a structural unit containing the structure of formula (1-2), and the structural unit represented by formula (2) is a structural unit containing the structure of formula (1-3).

在步驟aII中,當使用多官能(甲基)丙烯酸化合物和單官能(甲基)丙烯酸化合物這兩者時,較佳為,首先使多官能(甲基)丙烯酸化合物與步驟aI中所獲得之原料聚合物進行反應,並使單官能(甲基)丙烯酸化合物與所獲得之反應混合物進行反應。In step aII, when both a polyfunctional (meth)acrylic compound and a monofunctional (meth)acrylic compound are used, it is preferred that the polyfunctional (meth)acrylic compound is first mixed with the polyfunctional (meth)acrylic compound obtained in step aI. The raw material polymer is reacted, and the monofunctional (meth)acrylic acid compound is reacted with the obtained reaction mixture.

當聚合物P(I)進一步含有式(3)所表示之結構單元時,實施以下的步驟aIII-i。 步驟aIII-i:在步驟aII中製備含有式(NB)所表示之結構單元;式(AD)所表示之結構單元;式(1)所表示之結構單元及/或式(2)所表示之結構單元;及式(MA)所表示之結構單元之聚合物前驅物(a)(相當於上述步驟aII中之聚合物P(I)),其後,對該聚合物前驅物(a)在鹼觸媒的存在下用水進行處理而獲得含有式(NB)所表示之結構單元;式(AD)所表示之結構單元;式(1)所表示之結構單元及/或式(2)所表示之結構單元;式(3)所表示之結構單元;及式(MA)所表示之結構單元之聚合物聚合物P(I)(有時稱為「聚合物前驅物(b)」)之步驟。 When the polymer P(I) further contains a structural unit represented by formula (3), the following step aIII-i is performed. Step aIII-i: In step aII, prepare a product containing the structural unit represented by formula (NB); the structural unit represented by formula (AD); the structural unit represented by formula (1) and/or the structural unit represented by formula (2) Structural unit; and the polymer precursor (a) of the structural unit represented by formula (MA) (equivalent to the polymer P (I) in the above step aII), and then, the polymer precursor (a) is Treating with water in the presence of an alkali catalyst obtains a structural unit represented by formula (NB); a structural unit represented by formula (AD); a structural unit represented by formula (1) and/or a structural unit represented by formula (2) The structural unit of the polymer P(I) (sometimes referred to as the "polymer precursor (b)"); the structural unit represented by the formula (3); and the structural unit represented by the formula (MA). .

當聚合物P(I)進一步含有式(1-1)所表示之結構單元時,實施以下的步驟aIII-ii。 步驟aIII-ii:製備在步驟aII中所獲得之含有式(NB)所表示之結構單元;式(AD)所表示之結構單元;式(1)所表示之結構單元及/或式(2)所表示之結構單元;及式(MA)所表示之結構單元之聚合物前驅物(a)(相當於上述步驟aII中之聚合物P(I)),使該聚合物前驅物(a)在觸媒的存在下與含有環氧基之(甲基)丙烯酸化合物進行反應而製備含有式(NB)所表示之結構單元;式(AD)所表示之結構單元;式(1)所表示之結構單元及/或式(2)所表示之結構單元;式(1-1)所表示之結構單元及式(MA)所表示之結構單元之聚合物P(I)之步驟。在此,經由步驟aII、緊接著的步驟aIII-ii而獲得之聚合物P(I)可能含有式(8)及/或式(9)所表示之結構單元。 When the polymer P(I) further contains a structural unit represented by formula (1-1), the following step aIII-ii is performed. Step aIII-ii: Prepare the structural unit obtained in step aII containing the structural unit represented by formula (NB); the structural unit represented by formula (AD); the structural unit represented by formula (1) and/or formula (2) The structural unit represented by the formula (MA); and the polymer precursor (a) of the structural unit represented by the formula (MA) (equivalent to the polymer P (I) in the above step aII), so that the polymer precursor (a) is React with a (meth)acrylic acid compound containing an epoxy group in the presence of a catalyst to prepare a structural unit represented by formula (NB); a structural unit represented by formula (AD); a structure represented by formula (1) Units and/or structural units represented by formula (2); polymer P(I) of structural units represented by formula (1-1) and structural units represented by formula (MA). Here, the polymer P(I) obtained through step aII and the subsequent step aIII-ii may contain structural units represented by formula (8) and/or formula (9).

步驟aIII-i和步驟aIII-ii可以實施其中任一者。當實施兩者時,較佳為在步驟aIII-i之後實施步驟aIII-ii。當在步驟aIII-i之後實施步驟aIII-ii時,該步驟aIII-ii成為使步驟aIII-i中所獲得之聚合物前驅物(b)在觸媒的存在下與含有環氧基之(甲基)丙烯酸化合物進行反應而製備可能含有式(8)及/或式(9)所表示之結構單元、式(5)所表示之結構單元及式(6)所表示之結構單元之聚合物P(I)之步驟。Either step aIII-i and step aIII-ii may be implemented. When both are implemented, it is preferred to implement step aIII-ii after step aIII-i. When step aIII-ii is implemented after step aIII-i, step aIII-ii is to make the polymer precursor (b) obtained in step aIII-i react with (methane) containing an epoxy group in the presence of a catalyst. base) acrylic compound to react to prepare a polymer P that may contain structural units represented by formula (8) and/or formula (9), structural units represented by formula (5) and structural units represented by formula (6) (I) Steps.

在步驟aII中,當使用多官能(甲基)丙烯酸化合物和單官能(甲基)丙烯酸化合物這兩者時,較佳為,首先使多官能(甲基)丙烯酸化合物與步驟aI中所獲得之原料聚合物進行反應,並使單官能(甲基)丙烯酸化合物與所獲得之反應混合物進行反應。In step aII, when both a polyfunctional (meth)acrylic compound and a monofunctional (meth)acrylic compound are used, it is preferred that the polyfunctional (meth)acrylic compound is first mixed with the polyfunctional (meth)acrylic compound obtained in step aI. The raw material polymer is reacted, and the monofunctional (meth)acrylic acid compound is reacted with the obtained reaction mixture.

以下,對各步驟進行說明。 (步驟aI) 步驟aI中之準備含有式(NB)所表示之結構單元、式(AD)所表示之結構單元及式(MA)所表示之結構單元之原料聚合物之步驟能夠藉由使含有式(NBm)所表示之單體、式(ADm)所表示之單體及式(MAm)所表示之單體之單體組成物聚合(加成聚合)來實施。在此,式(NBm)中之R 1、R 2、R 3及R 4以及a 1的定義與式(NB)者相同。又,式(ADm)中之R 11及R 12的定義與式(AD)中者相同。又,式(MAm)中之R 21及R 22的定義與式(MA)中者相同。 再者,當聚合物P(I)含有式(MI)所表示之結構單元時,使用式(IMm)所表示之原料單體。在此,式(MIm)中之R 31、R 32及R 33的定義與式(MI)中者相同。 Each step is explained below. (Step aI) The step of preparing a raw material polymer containing a structural unit represented by formula (NB), a structural unit represented by formula (AD) and a structural unit represented by formula (MA) in step aI can be achieved by making It is carried out by polymerizing (addition polymerization) a monomer composition of a monomer represented by formula (NBm), a monomer represented by formula (ADm), and a monomer represented by formula (MAm). Here, the definitions of R 1 , R 2 , R 3 , R 4 and a 1 in the formula (NBm) are the same as those in the formula (NB). In addition, the definitions of R 11 and R 12 in the formula (ADm) are the same as those in the formula (AD). In addition, the definitions of R 21 and R 22 in the formula (MAm) are the same as those in the formula (MA). Furthermore, when the polymer P (I) contains the structural unit represented by the formula (MI), the raw material monomer represented by the formula (IMm) is used. Here, the definitions of R 31 , R 32 and R 33 in the formula (MIm) are the same as those in the formula (MI).

作為式(NBm)所表示之單體,例如可以列舉降莰烯、雙環[2.2.1]-庚-2-烯(慣用名:2-降莰烯)、5-甲基-2-降莰烯、5-乙基-2-降莰烯、5-丁基-2-降莰烯、5-己基-2-降莰烯、5-癸基-2-降莰烯、5-烯丙基-2-降莰烯、5-(2-丙烯基)-2-降莰烯、5-(1-甲基-4-戊烯基)-2-降莰烯、5-乙炔基-2-降莰烯、5-苄基-2-降莰烯、5-苯乙基-2-降莰烯、2-乙醯基-5-降莰烯、5-降莰烯-2-羧酸甲酯、5-降莰烯-2,3-二羧酸酐等。在進行聚合時,式(NBm)所表示之單體可以僅使用一種,亦可以組合使用兩種以上。Examples of the monomer represented by the formula (NBm) include norbornene, bicyclo[2.2.1]-hept-2-ene (common name: 2-norbornene), and 5-methyl-2-norbornene. Alkene, 5-ethyl-2-norbornene, 5-butyl-2-norbornene, 5-hexyl-2-norbornene, 5-decyl-2-norbornene, 5-allyl -2-Norbornene, 5-(2-propenyl)-2-norbornene, 5-(1-methyl-4-pentenyl)-2-norbornene, 5-ethynyl-2- Norbornene, 5-benzyl-2-norbornene, 5-phenylethyl-2-norbornene, 2-acetyl-5-norbornene, 5-norbornene-2-carboxylic acid methyl Ester, 5-norbornene-2,3-dicarboxylic anhydride, etc. During polymerization, only one type of monomer represented by formula (NBm) may be used, or two or more types may be used in combination.

在作為式(ADm)所表示之單體之不飽和二羧酸二烷基酯中,與雙鍵有關之立體配置可以為順式型或反式型中的任一種,可以為反式型的式(t-ADm)所表示之單體或順式型的式(c-ADm)所表示之單體中的任一種。作為式(t-ADm)所表示之單體的具體例,可以列舉反丁烯二酸二丁酯、反丁烯二酸二乙酯、反丁烯二酸雙(2-乙基己酯)、反丁烯二酸二甲酯等,作為式(c-ADm)所表示之單體的例子,可以列舉順丁烯二酸二丁酯、順丁烯二酸二乙酯、順丁烯二酸雙(2-乙基己酯)、順丁烯二酸二甲酯等。In the unsaturated dicarboxylic acid dialkyl ester which is the monomer represented by the formula (ADm), the stereoconfiguration with respect to the double bond may be either a cis type or a trans type, and may be a trans type. Any of the monomer represented by the formula (t-ADm) or the monomer represented by the cis-type formula (c-ADm). Specific examples of the monomer represented by the formula (t-ADm) include dibutyl fumarate, diethyl fumarate, and bis(2-ethylhexyl fumarate). , dimethyl fumarate, etc. Examples of the monomer represented by the formula (c-ADm) include dibutyl maleate, diethyl maleate, and maleic acid. Acid bis(2-ethylhexyl), dimethyl maleate, etc.

針對聚合方法,不受限定,但較佳為使用自由基聚合起始劑之自由基聚合。作為聚合起始劑,例如能夠使用偶氮化合物、有機過氧化物等。 作為偶氮化合物,具體而言,可以列舉偶氮雙異丁腈(AIBN)、2,2’-偶氮雙(2-甲基丙酸)二甲酯、1,1’-偶氮雙(環己烷甲腈)(ABCN)等。 作為有機過氧化物,例如可以列舉過氧化氫、二(三級丁基)過氧化物(DTBP)、過氧化苯甲醯(benzoyl peroxide,BPO)及甲基乙基酮過氧化物(MEKP)等。 針對聚合起始劑,可以僅使用一種,亦可以組合使用兩種以上。 The polymerization method is not limited, but radical polymerization using a radical polymerization initiator is preferred. As the polymerization initiator, for example, azo compounds, organic peroxides, etc. can be used. Specific examples of azo compounds include azobisisobutyronitrile (AIBN), 2,2'-azobis(2-methylpropionate)dimethyl ester, and 1,1'-azobis( Cyclohexanecarbonitrile) (ABCN), etc. Examples of organic peroxides include hydrogen peroxide, di(tertiary butyl) peroxide (DTBP), benzoyl peroxide (BPO), and methyl ethyl ketone peroxide (MEKP). wait. As for the polymerization initiator, only one type may be used, or two or more types may be used in combination.

作為聚合反應中所使用之溶劑,例如能夠使用二乙醚、四氫呋喃、甲苯、甲基乙基酮等有機溶劑。聚合溶劑可以為單獨溶劑,亦可以為混合溶劑。As the solvent used in the polymerization reaction, organic solvents such as diethyl ether, tetrahydrofuran, toluene, and methyl ethyl ketone can be used. The polymerization solvent may be a single solvent or a mixed solvent.

原料聚合物的合成藉由將式(NBm)所表示之單體、式(ADm)所表示之單體、式(MAm)所表示之單體及聚合起始劑溶解於溶劑中並將其投入反應容器中,其後加熱而進行加成聚合來實施。加熱溫度例如為50~80℃,加熱時間例如為5~20小時。 投入反應容器時之式(NBm)所表示之單體與式(ADm)所表示之單體和式(MAm)所表示之單體的合計量的莫耳比(ADm+MAm)較佳為(NBm):(ADm+MAm)=0.5:1~1:0.5。從控制分子結構之觀點而言,莫耳比較佳為0.5:0.8~0.7:0.5。式(ADm)所表示之單體與式(MAm)所表示之單體的莫耳比較佳為(ADm):(MAm)=0.5:9.5~8:2,更佳為1:9~7:4。 藉由這樣的步驟,能夠獲得「原料聚合物」。 再者,原料聚合物可以為無規共聚物、交替共聚物、嵌段共聚物、週期共聚物等中的任一種。典型為無規共聚物或交替共聚物。再者,通常已知順丁烯二酸酐為交替共聚性強的單體。 The raw material polymer is synthesized by dissolving the monomer represented by the formula (NBm), the monomer represented by the formula (ADm), the monomer represented by the formula (MAm) and the polymerization initiator in a solvent and adding them The reaction vessel is then heated to perform addition polymerization. The heating temperature is, for example, 50 to 80°C, and the heating time is, for example, 5 to 20 hours. The molar ratio (ADm+MAm) of the total amount of the monomer represented by the formula (NBm) and the monomer represented by the formula (ADm) and the monomer represented by the formula (MAm) when put into the reaction vessel is preferably (ADm+MAm). NBm): (ADm+MAm)=0.5:1~1:0.5. From the viewpoint of controlling the molecular structure, the molar ratio is preferably 0.5:0.8 to 0.7:0.5. The molar ratio between the monomer represented by the formula (ADm) and the monomer represented by the formula (MAm) is preferably (ADm): (MAm) = 0.5:9.5~8:2, more preferably 1:9~7: 4. Through such steps, the "raw material polymer" can be obtained. Furthermore, the base polymer may be any of random copolymers, alternating copolymers, block copolymers, periodic copolymers, and the like. Typically random copolymers or alternating copolymers. Furthermore, maleic anhydride is generally known to be a monomer with strong alternating copolymerizability.

再者,在合成原料聚合物之後,可以進行去除未反應單體、低聚物、殘存之聚合起始劑等低分子量成分之步驟。 具體而言,將含有所合成之原料聚合物和低分子量成分之有機相進行濃縮,其後與四氫呋喃(THF)等有機溶劑進行混合而獲得溶液。然後,將該溶液與甲醇、2-丙醇、1-丁醇等貧溶劑進行混合而使單體沉澱。濾取該沉澱物並進行乾燥,藉此能夠提高原料聚合物的純度。 Furthermore, after the raw material polymer is synthesized, a step of removing low molecular weight components such as unreacted monomers, oligomers, and remaining polymerization initiators may be performed. Specifically, the organic phase containing the synthesized raw material polymer and low molecular weight components is concentrated, and then mixed with an organic solvent such as tetrahydrofuran (THF) to obtain a solution. Then, this solution is mixed with a poor solvent such as methanol, 2-propanol, and 1-butanol to precipitate the monomer. The purity of the raw material polymer can be improved by filtering out the precipitate and drying it.

(步驟aII) 在步驟aII中,藉由使步驟aI中所獲得之原料聚合物與多官能(甲基)丙烯酸化合物及/或單官能(甲基)丙烯酸化合物在鹼性觸媒的存在下進行反應而使原料聚合物中所含有之式(MA)所表示之結構單元的一部分開環來形成式(1)所表示之結構單元及/或式(2)所表示之結構單元,從而獲得含有式(NB)所表示之結構單元、式(AD)所表示之結構單元以及式(1)所表示之結構單元及/或式(2)所表示之結構單元且根據情況含有式(MA)所表示之結構單元之聚合物前驅物。在此獲得之聚合物前驅物能夠用作本實施形態的聚合物P(I),為了方便說明,稱為「聚合物前驅物(a)」。 (Step aII) In step aII, the raw material polymer obtained in step aI is reacted with a polyfunctional (meth)acrylic acid compound and/or a monofunctional (meth)acrylic acid compound in the presence of an alkaline catalyst. A part of the structural unit represented by the formula (MA) contained in the polymer is ring-opened to form the structural unit represented by the formula (1) and/or the structural unit represented by the formula (2), thereby obtaining a polymer containing the formula (NB). The structural unit represented, the structural unit represented by formula (AD) and the structural unit represented by formula (1) and/or the structural unit represented by formula (2) and, if applicable, the structural unit represented by formula (MA) of polymer precursors. The polymer precursor obtained here can be used as the polymer P(I) of this embodiment, and is called "polymer precursor (a)" for convenience of explanation.

更具體而言,首先準備將原料聚合物溶解於適當的有機溶劑而成之溶液。作為有機溶劑,可以使用甲基乙基酮(MEK)、丙二醇單甲醚乙酸酯(PGMEA)、二甲基乙醯胺(DMAc)、N-甲基吡咯啶酮(NMP)、四氫呋喃(THF)等單獨溶劑或混合溶劑,但並不僅限於該等,能夠使用有機化合物或高分子的合成中使用之各種有機溶劑。More specifically, first, a solution in which the raw material polymer is dissolved in an appropriate organic solvent is prepared. As organic solvents, methyl ethyl ketone (MEK), propylene glycol monomethyl ether acetate (PGMEA), dimethyl acetamide (DMAc), N-methylpyrrolidone (NMP), tetrahydrofuran (THF) can be used ) and other single solvents or mixed solvents, but are not limited to these, and various organic solvents used in the synthesis of organic compounds or polymers can be used.

當獲得含有式(NB)所表示之結構單元、式(AD)所表示之結構單元以及式(1)所表示之結構單元及式(2)所表示之結構單元這兩者之聚合物前驅物時,接著,在上述溶液中加入多官能(甲基)丙烯酸化合物。進而加入鹼性觸媒。然後,適當地混合溶液而使其成為均勻的溶液,獲得至少含有式(NB)的結構單元、式(AD)的結構單元及式(1)的結構單元之聚合物前驅物(步驟aII-i)。When a polymer precursor containing both the structural unit represented by formula (NB), the structural unit represented by formula (AD), the structural unit represented by formula (1) and the structural unit represented by formula (2) is obtained When, next, add a polyfunctional (meth)acrylic acid compound to the above solution. Then add alkaline catalyst. Then, the solution is mixed appropriately to make it a uniform solution, and a polymer precursor containing at least the structural unit of formula (NB), the structural unit of formula (AD), and the structural unit of formula (1) is obtained (step aII-i ).

作為在此可以使用之多官能(甲基)丙烯酸單體,例如可以列舉通式(1b-m)所表示之化合物、通式(1c-m)所表示之化合物及通式(1d-m)所表示之化合物。式(1b-m)中之k、R、X 1、X 1’及X 2的定義及具體態樣與上述式(1b)中者相同。又,式(1c-m)中之k、R、X 1、X 2、X 3、X 4、X 5及X 6的定義及具體態樣與上述式(1c)中者相同。式(1d-m)中之n及R與上述式(1d)中者相同。 Examples of polyfunctional (meth)acrylic monomers that can be used here include compounds represented by general formula (1b-m), compounds represented by general formula (1c-m), and general formula (1d-m). the compound represented. The definitions and specific aspects of k, R, X 1 , X 1 ' and X 2 in the formula (1b-m) are the same as those in the above formula (1b). In addition, the definitions and specific aspects of k , R, X 1 , X 2 , X 3 , n and R in the formula (1d-m) are the same as those in the above formula (1d).

接著,使單官能(甲基)丙烯酸化合物在鹼性觸媒的存在下與步驟aII-i中所獲得之聚合物進行反應,藉此能夠獲得含有式(NB)的結構單元、式(AD)的結構單元、式(1)的結構單元及式(2)的結構單元之聚合物前驅物(步驟aII-ii)。Next, the monofunctional (meth)acrylic acid compound is reacted with the polymer obtained in step aII-i in the presence of an alkaline catalyst, thereby obtaining a structural unit containing formula (NB), formula (AD) The structural unit of formula (1) and the polymer precursor of the structural unit of formula (2) (step aII-ii).

作為鹼性觸媒,可以適當地使用在有機合成的領域中公知的胺化合物或含氮雜環化合物等。例如,可以將三乙胺、吡啶、二甲基胺基吡啶等胺化合物或含氮雜環化合物用作觸媒。鹼性觸媒的使用量例如相對於原料聚合物100質量份,可以設為10~60質量份左右。再者,需注意,若過度使用鹼性觸媒,則中和中所需要之酸的量增多,純化有可能變得繁瑣等。As the alkaline catalyst, amine compounds or nitrogen-containing heterocyclic compounds known in the field of organic synthesis can be appropriately used. For example, amine compounds such as triethylamine, pyridine, and dimethylaminopyridine or nitrogen-containing heterocyclic compounds can be used as the catalyst. The usage amount of the alkaline catalyst can be about 10 to 60 parts by mass relative to 100 parts by mass of the raw material polymer. Furthermore, it should be noted that if an alkaline catalyst is used excessively, the amount of acid required for neutralization will increase, and purification may become complicated.

藉由將上述溶液較佳於60~80℃加熱3~9小時左右來進行原料聚合物中所含有之通式(MA)的結構單元的開環/式(1)的結構單元的形成。The ring opening of the structural unit of the general formula (MA) contained in the base polymer and the formation of the structural unit of the formula (1) are performed by heating the above solution at preferably 60 to 80° C. for about 3 to 9 hours.

再者,例如,在上述加熱的中途,將具有羥基之單官能(甲基)丙烯酸化合物追加添加到反應體系中,藉此進行原料聚合物中所含有之式(MA)的結構單元的開環/式(2)的結構單元的形成,從而生成具有式(2)所表示之結構單元之聚合物P(I)。Furthermore, for example, during the above-mentioned heating, a monofunctional (meth)acrylic acid compound having a hydroxyl group is additionally added to the reaction system, whereby the structural unit of the formula (MA) contained in the raw material polymer is ring-opened. /The formation of the structural unit of formula (2), thereby producing the polymer P(I) having the structural unit represented by formula (2).

從反應的立體阻礙等觀點而言,與具有羥基之多官能(甲基)丙烯酸化合物相比,具有羥基之單官能(甲基)丙烯酸化合物趨於容易與原料聚合物進行反應。因此,當製備具有式(2)的結構單元之聚合物前驅物時,並不將具有羥基之單官能(甲基)丙烯酸化合物從最初開始就投入反應體系中,而較佳為追加添加到反應體系中。 作為具有羥基之單官能(甲基)丙烯酸化合物,例如可以列舉以下式(2a-m)所表示之化合物。 式(2a-m)中,針對X 10及R的定義,與式(2a)中者相同。 From the viewpoint of steric hindrance of reaction, etc., a monofunctional (meth)acrylic compound having a hydroxyl group tends to react with the raw material polymer more easily than a polyfunctional (meth)acrylic acid compound having a hydroxyl group. Therefore, when preparing a polymer precursor having a structural unit of formula (2), the monofunctional (meth)acrylic acid compound having a hydroxyl group is not put into the reaction system from the beginning, but is preferably added to the reaction system. in the system. Examples of the monofunctional (meth)acrylic compound having a hydroxyl group include compounds represented by the following formula (2a-m). In formula (2a-m), the definitions of X 10 and R are the same as those in formula (2a).

作為式(2a-m)所表示之化合物的具體例,可以列舉(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸4-羥基丁酯、1,4-環己烷二甲醇單(甲基)丙烯酸酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸2-羥基丁酯、(甲基)丙烯酸2-羥基-3-苯氧基丙酯、2-(甲基)丙烯醯氧乙基-2-羥基乙基-鄰苯二甲酸等。Specific examples of the compound represented by formula (2a-m) include 2-hydroxyethyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, and 1,4-cyclohexanedimethanol mono(meth)acrylate. Meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 2-hydroxy-3-phenoxypropyl (meth)acrylate, 2-(methyl)acrylate ) Acryloxyethyl-2-hydroxyethyl-phthalic acid, etc.

當獲得含有式(NB)所表示之結構單元、式(AD)所表示之結構單元以及式(1)所表示之結構單元及式(2)所表示之結構單元中的任一者之聚合物前驅物時,在步驟(I)之後僅實施步驟aII-i、步驟aII-ii中的任一者即可。When a polymer containing any one of the structural unit represented by formula (NB), the structural unit represented by formula (AD), the structural unit represented by formula (1) and the structural unit represented by formula (2) is obtained In the case of a precursor, only step aII-i or step aII-ii may be performed after step (I).

(步驟aIII-i) 當實施步驟aIII-i時,利用將步驟aII中所獲得之聚合物前驅物在鹼性觸媒的存在下用水進行處理之步驟。藉由步驟aIII,步驟aII中所獲得之聚合物前驅物中所含有之式(MA)所表示之結構單元開環而形成式(3)所表示之結構單元,從而能夠製造含有式(NB)所表示之結構單元;式(AD)所表示之結構單元;式(1)所表示之結構單元及/或式(2)所表示之結構單元;以及式(3)所表示之結構單元之聚合物P(I)。當式(MA)所表示之結構單元的一部分開環且式(MA)的結構單元的一部分未開環而殘留時,聚合物P(I)進一步含有式(MA)所表示之結構單元。 (Step aIII-i) When implementing step aIII-i, the polymer precursor obtained in step aII is treated with water in the presence of an alkaline catalyst. By ring-opening the structural unit represented by formula (MA) contained in the polymer precursor obtained in step aII to form the structural unit represented by formula (3), it is possible to produce a polymer containing formula (NB) The structural unit represented by formula (AD); the structural unit represented by formula (1) and/or the structural unit represented by formula (2); and the aggregation of the structural unit represented by formula (3) Object P(I). When a part of the structural unit represented by formula (MA) is ring-opened and a part of the structural unit represented by formula (MA) remains without ring-opening, the polymer P(I) further contains a structural unit represented by formula (MA).

作為步驟aIII-i中所使用之鹼性觸媒,可以列舉三乙胺、吡啶、二甲基胺基吡啶等胺化合物或含氮雜環化合物。Examples of the alkaline catalyst used in step aIII-i include amine compounds such as triethylamine, pyridine, and dimethylaminopyridine or nitrogen-containing heterocyclic compounds.

在步驟aIII-i中,在含有步驟(II)中所獲得之聚合物前驅物之反應體系中添加水,並將所獲得之反應溶液較佳在60~80℃加熱0.25~6小時左右,藉此該聚合物中所含有之式(MA)的結構單元開環而生成式(3)所表示之結構單元。鹼性觸媒能夠直接使用殘存於步驟aII中所獲得之反應體系中之觸媒。因此,關於步驟aIII-i,較佳為不對步驟aII中所獲得之反應混合物進行任何後處理而在原位(in situ)藉由將水追加添加到該反應混合物中來實施。In step aIII-i, water is added to the reaction system containing the polymer precursor obtained in step (II), and the obtained reaction solution is preferably heated at 60 to 80°C for about 0.25 to 6 hours. The structural unit of formula (MA) contained in the polymer is ring-opened to generate the structural unit represented by formula (3). The alkaline catalyst can be directly used as the catalyst remaining in the reaction system obtained in step aII. Therefore, regarding step aIII-i, it is preferable to perform it in situ by additionally adding water to the reaction mixture without performing any post-treatment on the reaction mixture obtained in step aII.

藉由以上的步驟能夠獲得本實施形態的聚合物P(I),但從本發明的效果的觀點而言,為了去除所期望之聚合物以外的不需要的成分等,亦可以適當地進一步進行以下的步驟。The polymer P(I) of this embodiment can be obtained through the above steps. However, from the viewpoint of the effects of the present invention, in order to remove unnecessary components other than the desired polymer, it may be further performed appropriately. Follow the steps below.

首先,用分液漏斗將在上述中用有機溶劑稀釋且加入了酸(例如甲酸等)之反應溶液劇烈攪拌至少3分鐘。將其靜置30分鐘以上,分離為有機相和水相,並去除水相。以該方式獲得聚合物的有機溶液。First, the reaction solution diluted with an organic solvent and added with an acid (such as formic acid, etc.) is vigorously stirred for at least 3 minutes using a separatory funnel. Let it stand for more than 30 minutes, separate into organic phase and aqueous phase, and remove the aqueous phase. In this way an organic solution of the polymer is obtained.

使用再沉澱法或液液萃取法,對所獲得之聚合物P(I)的有機溶液進行純化。在再沉澱法中,將所獲得之聚合物P(I)的有機溶液加入到過量的甲苯或水中,使聚合物再沉澱。又,進而用甲苯或水將藉由再沉澱而獲得之聚合物粉末洗淨多次。 另外,為了去除甲酸或鹼性觸媒,反覆進行多次(1~3次左右)用離子交換水對所獲得之聚合物粉末進行洗淨之操作。 將用離子交換水洗淨後的聚合物粉末例如在30~60℃乾燥16小時以上,藉此能夠獲得高純度的聚合物。 在液液萃取法中,將水加入到所獲得之聚合物P(I)的有機溶液中,用分液漏斗劇烈地攪拌至少3分鐘。將其靜置30分鐘以上,分離為有機相和水相,並去除水相。進而,在去除水相後的聚合物的有機溶液中加入水,用分液漏斗劇烈地攪拌至少3分鐘。將其靜置30分鐘以上,分離為有機相和水相,並去除水相。以該方式獲得聚合物的有機溶液。根據需要,可以進一步進行添加水和去除水相之步驟。 將所獲得之聚合物P(I)的有機溶液利用旋轉蒸發器在減壓下進行加熱而使其濃縮之後,反覆進行加入最終溶劑(PGMEA等)並稀釋之操作,藉此能夠獲得溶解於最終溶劑中之聚合物溶液。而且,溶劑置換後,可以進一步藉由再沉澱法進行純化。 The obtained organic solution of polymer P(I) is purified using a reprecipitation method or a liquid-liquid extraction method. In the reprecipitation method, the obtained organic solution of polymer P(I) is added to excess toluene or water to reprecipitate the polymer. Furthermore, the polymer powder obtained by reprecipitating was washed several times with toluene or water. In addition, in order to remove formic acid or alkaline catalyst, the operation of washing the obtained polymer powder with ion-exchange water is repeated multiple times (about 1 to 3 times). A high-purity polymer can be obtained by drying the polymer powder washed with ion-exchange water at, for example, 30 to 60° C. for 16 hours or more. In the liquid-liquid extraction method, water is added to the obtained organic solution of polymer P(I), and the mixture is vigorously stirred for at least 3 minutes using a separatory funnel. Let it stand for more than 30 minutes, separate into organic phase and aqueous phase, and remove the aqueous phase. Furthermore, water was added to the organic solution of the polymer from which the water phase was removed, and the mixture was vigorously stirred for at least 3 minutes using a separatory funnel. Let it stand for more than 30 minutes, separate into organic phase and aqueous phase, and remove the aqueous phase. In this way an organic solution of the polymer is obtained. If necessary, further steps of adding water and removing the water phase can be performed. The obtained organic solution of polymer P (I) is heated under reduced pressure using a rotary evaporator to concentrate, and then the final solvent (PGMEA, etc.) is added and diluted repeatedly to obtain a solution dissolved in the final solution. Polymer solution in solvent. Moreover, after solvent replacement, further purification can be performed by reprecipitation.

又,聚合物溶液可以含有合成聚合物P(I)時所使用之多官能(甲基)丙烯酸化合物及/或單官能(甲基)丙烯酸化合物。當聚合物溶液含有這些(甲基)丙烯酸化合物時,較佳為凝膠滲透層析(GPC)圖譜中之來自於多官能(甲基)丙烯酸化合物之峰面積相對於聚合物P的峰面積成為3~50%之量、尤其成為5~48%之量,並且較佳為來自於單官能(甲基)丙烯酸化合物之峰面積相對於聚合物P的峰面積成為1~50%之量、尤其成為2~35%之量。藉此,含有該聚合物溶液之感光性樹脂組成物具有良好的鹼溶性,並且具有光刻中之良好的靈敏度。Moreover, the polymer solution may contain the polyfunctional (meth)acrylic compound and/or the monofunctional (meth)acrylic compound used when synthesizing the polymer P(I). When the polymer solution contains these (meth)acrylic acid compounds, it is preferable that the peak area derived from the polyfunctional (meth)acrylic acid compound relative to the peak area of the polymer P in the gel permeation chromatography (GPC) spectrum becomes An amount of 3 to 50%, especially an amount of 5 to 48%, and preferably an amount in which the peak area derived from the monofunctional (meth)acrylic compound is 1 to 50% of the peak area of the polymer P, especially It becomes 2~35%. Thereby, the photosensitive resin composition containing the polymer solution has good alkali solubility and has good sensitivity in photolithography.

(步驟aIII-ii) 在步驟aIII-ii中,藉由使步驟aII中所獲得之聚合物(聚合物前驅物(a))或步驟aIII-i中所獲得之聚合物(聚合物前驅物(b))在觸媒的存在下與含有環氧基之(甲基)丙烯酸化合物進行反應而利用聚合物前驅物(a)或(b)的羧基與上述含有環氧基之(甲基)丙烯酸化合物的環氧基的反應形成式(1-1)所表示之結構單元,從而能夠製造含有式(NB)所表示之結構單元;式(AD)所表示之結構單元;式(1)所表示之結構單元及/或式(2)所表示之結構單元;以及式(1-1)所表示之結構單元之聚合物P(I)。當式(MA)所表示之結構單元的一部分開環且式(MA)的結構單元的一部分未開環而殘留時,聚合物P(I)進一步含有式(MA)所表示之結構單元。 (Step aIII-ii) In step aIII-ii, by allowing the polymer (polymer precursor (a)) obtained in step aII or the polymer (polymer precursor (b)) obtained in step aIII-i to react in the catalyst The carboxyl group of the polymer precursor (a) or (b) is reacted with the epoxy group-containing (meth)acrylic acid compound in the presence of the epoxy group-containing (meth)acrylic acid compound to utilize the epoxy group The reaction forms the structural unit represented by formula (1-1), thereby enabling the manufacture to contain the structural unit represented by formula (NB); the structural unit represented by formula (AD); the structural unit represented by formula (1) and/or The structural unit represented by formula (2); and the polymer P(I) of the structural unit represented by formula (1-1). When a part of the structural unit represented by formula (MA) is ring-opened and a part of the structural unit represented by formula (MA) remains without ring-opening, the polymer P(I) further contains a structural unit represented by formula (MA).

步驟aIII-ii較佳為藉由在含有步驟aIII-i中所獲得之聚合物前驅物(b)之反應體系中追加添加含有環氧基之(甲基)丙烯酸化合物來實施。Step aIII-ii is preferably implemented by additionally adding an epoxy group-containing (meth)acrylic acid compound to the reaction system containing the polymer precursor (b) obtained in step aIII-i.

聚合物前驅物(a)或(b)與含有環氧基之(甲基)丙烯酸化合物的反應在鹼性觸媒的存在下進行。鹼性觸媒能夠直接使用殘存於步驟aII中所獲得之反應體系中之觸媒。因此,關於步驟aIII-ii,較佳為不從含有步驟aII中所獲得之聚合物前驅物之反應混合物中分離聚合物前驅物並進行純化或者不對該混合物中所含有之鹼性觸媒進行中和,而在原位藉由在含有步驟aII中所獲得之聚合物前驅物之反應混合物中追加添加含有環氧基之(甲基)丙烯酸化合物來實施。The reaction between the polymer precursor (a) or (b) and the (meth)acrylic acid compound containing an epoxy group is carried out in the presence of an alkaline catalyst. The alkaline catalyst can be directly used as the catalyst remaining in the reaction system obtained in step aII. Therefore, regarding step aIII-ii, it is preferable not to separate and purify the polymer precursor from the reaction mixture containing the polymer precursor obtained in step aII or not to neutralize the alkaline catalyst contained in the mixture. And, it is implemented in situ by additionally adding an epoxy group-containing (meth)acrylic acid compound to the reaction mixture containing the polymer precursor obtained in step aII.

具體而言,藉由將在含有聚合物前驅物之反應混合物中追加添加含有環氧基之(甲基)丙烯酸化合物而獲得之反應溶液較佳在60~80℃加熱1~9小時左右,利用聚合物前驅物的羧基與含有環氧基之(甲基)丙烯酸化合物的環氧基的反應形成式(1-1)所表示之結構單元,從而生成聚合物P(I)。Specifically, the reaction solution obtained by additionally adding an epoxy group-containing (meth)acrylic compound to the reaction mixture containing the polymer precursor is preferably heated at 60 to 80° C. for about 1 to 9 hours. The reaction between the carboxyl group of the polymer precursor and the epoxy group of the (meth)acrylic compound containing an epoxy group forms a structural unit represented by the formula (1-1), thereby producing polymer P(I).

作為含有環氧基之(甲基)丙烯酸化合物,可以列舉甲基丙烯酸環氧丙酯(GMA)、丙烯酸4-羥基丁酯環氧丙基醚(4HBAGE)、丙烯酸3,4-環氧環己基甲酯、甲基丙烯酸3,4-環氧環己基甲酯、丙烯酸環氧丙酯等,可以使用選自其中之一種或兩種以上。Examples of the (meth)acrylic compound containing an epoxy group include glycidyl methacrylate (GMA), 4-hydroxybutyl acrylate glycidyl ether (4HBAGE), and 3,4-epoxycyclohexyl acrylate. Methyl ester, 3,4-epoxycyclohexylmethyl methacrylate, glycidyl acrylate, etc., one or two or more selected from these can be used.

含有環氧基之(甲基)丙烯酸化合物的添加量相對於聚合物前驅物的羧基1莫耳,較佳為0.1~3.0莫耳。The added amount of the (meth)acrylic compound containing an epoxy group is preferably 0.1 to 3.0 mol relative to 1 mol of the carboxyl group of the polymer precursor.

當聚合物P(I)為經由聚合物前驅物(a)而獲得之聚合物時,聚合物P(I)含有式(AD)所表示之結構單元;式(8)所表示之結構單元;式(9)所表示之結構單元;式(1)所表示之結構單元;式(2)所表示之結構單元。When the polymer P (I) is a polymer obtained through the polymer precursor (a), the polymer P (I) contains the structural unit represented by formula (AD); the structural unit represented by formula (8); The structural unit represented by formula (9); the structural unit represented by formula (1); the structural unit represented by formula (2).

當聚合物P(I)為經由聚合物前驅物(b)而獲得之聚合物時,聚合物P含有式(AD)所表示之結構單元;式(8)所表示之結構單元;式(9)所表示之結構單元;式(5)所表示之結構單元;式(6)所表示之結構單元;式(1)所表示之結構單元;式(2)所表示之結構單元;式(3)所表示之結構單元及式(MA)所表示之結構單元。When the polymer P (I) is a polymer obtained through the polymer precursor (b), the polymer P contains the structural unit represented by the formula (AD); the structural unit represented by the formula (8); the formula (9) ); the structural unit represented by formula (5); the structural unit represented by formula (6); the structural unit represented by formula (1); the structural unit represented by formula (2); the structural unit represented by formula (3) ) and the structural unit represented by formula (MA).

在步驟aIII-ii之後,為了去除所期望之聚合物P(I)以外的不需要的成分等,較佳為適當地進一步進行以下的步驟。After step aIII-ii, in order to remove unnecessary components other than the desired polymer P(I), it is preferred to further perform the following steps appropriately.

首先,用分液漏斗將在上述中用有機溶劑稀釋且加入了酸(例如,甲酸、檸檬酸等)之反應溶液劇烈地攪拌至少3分鐘。將其靜置30分鐘以上,分離為有機相和水相,並去除水相。以該方式獲得聚合物P(I)的有機溶液。First, the reaction solution diluted with an organic solvent and added with an acid (for example, formic acid, citric acid, etc.) is vigorously stirred for at least 3 minutes using a separatory funnel. Let it stand for more than 30 minutes, separate into organic phase and aqueous phase, and remove the aqueous phase. In this way an organic solution of polymer P(I) is obtained.

在所獲得之聚合物P(I)的有機溶液中加入過量的甲苯而使聚合物P(I)再沉澱。又,將藉由再沉澱而獲得之聚合物粉末用甲苯進一步洗淨複數次(例如,2次)。 另外,為了去除酸或鹼性觸媒,反覆進行複數次(例如,3次)用離子交換水對所獲得之聚合物粉末進行洗淨之操作。 將用離子交換水洗淨後的聚合物粉末例如在30~60℃乾燥16小時以上,藉此能夠獲得高純度的本實施形態的聚合物P(I)。 An excess amount of toluene was added to the obtained organic solution of polymer P(I) to reprecipitate polymer P(I). Moreover, the polymer powder obtained by reprecipitation is further washed several times (for example, twice) with toluene. In addition, in order to remove the acid or alkaline catalyst, the operation of washing the obtained polymer powder with ion-exchanged water is repeated several times (for example, three times). By drying the polymer powder washed with ion-exchange water at, for example, 30 to 60° C. for 16 hours or more, the highly pure polymer P(I) of this embodiment can be obtained.

<第二實施形態> (聚合物P(II)) 本發明的第二實施形態中之聚合物(本說明書中,稱之為「聚合物P(II)」)含有(NB)所表示之結構單元;式(AD)所表示之結構單元;以及選自式(1-2)所表示之結構單元及上述式(1-3)所表示之結構單元中之至少1個結構單元,並且具有式(P3)所表示之結構。聚合物P(II)具有在式(P3)中表示為「Y」之衍生自單官能或2官能以上的含硫醇基化合物之碳數1~30的1~6價的有機基上鍵結有典型地由結構單元A、結構單元B及結構單元C構成之聚合物鏈之結構。該衍生自單官能或2官能以上的含硫醇基化合物之碳數1~30的1~6價的有機基代表性地為含有1~6個硫醚基之碳數1~30的有機基。 <Second Embodiment> (Polymer P(II)) The polymer in the second embodiment of the present invention (referred to as "polymer P(II)" in this specification) contains a structural unit represented by (NB); a structural unit represented by formula (AD); and optionally At least one structural unit from the structural unit represented by formula (1-2) and the structural unit represented by formula (1-3) above, and has a structure represented by formula (P3). The polymer P (II) has a 1 to 6-valent organic group having a carbon number of 1 to 30 derived from a monofunctional or bifunctional or higher-functional thiol group-containing compound represented by "Y" in the formula (P3). There is a structure of a polymer chain typically composed of structural unit A, structural unit B and structural unit C. The 1-6 valent organic group having 1 to 30 carbon atoms derived from a monofunctional or bifunctional or higher-functional thiol group-containing compound is typically an organic group with 1 to 30 carbon atoms containing 1 to 6 thioether groups. .

式(P3)中, n為1~6的整數, p、q及r表示n個[ ]內的每一個聚合物鏈中所含之結構單元A、B及C的莫耳含有率, p、q及r在n個[ ]內的每一個聚合物鏈中可以相同亦可以不同, p+q+r=1,p為0以上,q為0以上,r為0以上, 若將該聚合物中所含有之各結構單元A、B及C的莫耳含有率分別設為p t、q t及r t,則p t+q t+r t=1, p t大於0,較佳為0.25~0.75,更佳為0.3~0.65,更佳為0.35~0.60, q t大於0,較佳為0.10~0.6,更佳為0.2~0.50,更佳為0.25~0.45, r t大於0,較佳為0.03~0.3,更佳為0.04~0.28,特佳為0.05~0.25。 X為氫原子或碳數1~30的有機基。 Y為衍生自單官能或2官能以上的含硫醇基化合物之碳數1~30的1~6價的有機基。 A為式(NB)所表示之結構單元。 B含有選自式(1-2)所表示之結構單元及式(1-3)所表示之結構單元中之至少1個結構單元。 C表示式(AD)所表示之結構單元。 存在複數個之A彼此、B彼此、C彼此可以相同亦可以不同。 In formula (P3), n is an integer from 1 to 6, p, q and r represent the molar content of structural units A, B and C contained in each polymer chain within n [ ], p, q and r can be the same or different in each polymer chain within n [ ], p+q+r=1, p is 0 or more, q is 0 or more, r is 0 or more, if the polymer The molar content of each structural unit A, B and C contained in is set to p t , q t and r t respectively, then p t +q t +r t =1, p t is greater than 0, preferably 0.25 ~0.75, more preferably 0.3~0.65, more preferably 0.35~0.60, q t is greater than 0, preferably 0.10~0.6, more preferably 0.2~0.50, more preferably 0.25~0.45, r t is greater than 0, preferably It is 0.03~0.3, more preferably 0.04~0.28, particularly preferably 0.05~0.25. X is a hydrogen atom or an organic group having 1 to 30 carbon atoms. Y is a 1-6 valent organic group having 1 to 30 carbon atoms derived from a monofunctional or bifunctional or higher-functional thiol group-containing compound. A is the structural unit represented by formula (NB). B contains at least one structural unit selected from the structural unit represented by formula (1-2) and the structural unit represented by formula (1-3). C represents the structural unit represented by formula (AD). There are a plurality of A's, B's and C's which may be the same or different.

在一實施形態中,聚合物P(II)可以進一步含有式(MI)所表示之結構單元,在該情況下,具有式(P4)所表示之結構。In one embodiment, the polymer P (II) may further contain a structural unit represented by the formula (MI), and in this case, has a structure represented by the formula (P4).

式(P4)中, n、X、Y、A、B、C與上述式(P3)中者同義。 p、q、r及s表示n個[ ]內的每一個聚合物鏈中所含之結構單元A、B、C及D的莫耳含有率, p、q、r及s在n個[ ]內的每一個聚合物鏈中可以相同亦可以不同, p+q+r+s=1,p為0以上,q為0以上,r為0以上,s為0以上, 若將該聚合物中所含有之各結構單元A、B、C及D的莫耳含有率分別設為p t、q t、r t及s t,則p t+q t+r t+s t=1,p t大於0,q t大於0,r t大於0,s t大於0, p t大於0,較佳為0.25~0.75,更佳為0.3~0.65,更佳為0.35~0.60。 q t大於0,較佳為0.10~0.6,更佳為0.2~0.50,更佳為0.25~0.45。 r t大於0,較佳為0.03~0.3,更佳為0.04~0.28,特佳為0.05~0.25。 s t大於0,較佳為0.01~0.3,更佳為0.015~0.28,特佳為0.02~0.25。 D表示式(MI)所表示之結構單元。 存在複數個之A彼此、B彼此、C彼此、D彼此可以相同亦可以不同。 In the formula (P4), n, X, Y, A, B, and C are synonymous with those in the above formula (P3). p, q, r and s represent the molar content of structural units A, B, C and D contained in each polymer chain within n [ ], p, q, r and s are in n [ ] Each polymer chain in can be the same or different, p+q+r+s=1, p is 0 or more, q is 0 or more, r is 0 or more, s is 0 or more, if the polymer is The molar content of each structural unit A, B, C and D is set to p t , q t , r t and s t respectively, then p t +q t +r t +s t =1, p t Greater than 0, q t is greater than 0, r t is greater than 0, s t is greater than 0, p t is greater than 0, preferably 0.25 to 0.75, more preferably 0.3 to 0.65, more preferably 0.35 to 0.60. q t is greater than 0, preferably 0.10 to 0.6, more preferably 0.2 to 0.50, more preferably 0.25 to 0.45. r t is greater than 0, preferably 0.03 to 0.3, more preferably 0.04 to 0.28, and particularly preferably 0.05 to 0.25. s t is greater than 0, preferably 0.01 to 0.3, more preferably 0.015 to 0.28, and particularly preferably 0.02 to 0.25. D represents the structural unit represented by formula (MI). There are a plurality of A's, B's, C's and D's which may be the same or different.

式(P3)或式(P4)所表示之聚合物P(II)可以含有上述式(1-1)所表示之結構單元作為結構單元B。 式(P3)或式(P4)所表示之聚合物P(II)可以含有上述式(1-4)所表示之結構單元作為結構單元B。 式(P3)或式(P4)所表示之聚合物P(II)可以含有選自上述式(1)所表示之結構單元及式(2)所表示之結構單元中之至少1個作為結構單元B。 式(P3)或式(P4)所表示之聚合物P(II)可以含有上述式(3)所表示之結構單元作為結構單元B。 式(P3)或式(P4)所表示之聚合物P(II)可以含有選自上述式(8)所表示之結構單元及式(9)所表示之結構單元中之至少1個作為結構單元B。 式(P3)或式(P4)所表示之聚合物P(II)可以含有上述式(5)所表示之結構單元作為結構單元B。 式(P3)或式(P4)所表示之聚合物P(II)可以含有上述式(6)所表示之結構單元作為結構單元B。 式(P3)或式(P4)所表示之聚合物P(II)可以含有上述式(MA)所表示之結構單元作為結構單元B。 The polymer P(II) represented by the formula (P3) or the formula (P4) may contain the structural unit represented by the above formula (1-1) as the structural unit B. The polymer P(II) represented by the formula (P3) or the formula (P4) may contain the structural unit represented by the above formula (1-4) as the structural unit B. The polymer P (II) represented by the formula (P3) or the formula (P4) may contain at least one selected from the structural unit represented by the above formula (1) and the structural unit represented by the formula (2) as a structural unit. B. The polymer P(II) represented by the formula (P3) or the formula (P4) may contain the structural unit represented by the above formula (3) as the structural unit B. The polymer P(II) represented by the formula (P3) or the formula (P4) may contain at least one selected from the structural unit represented by the above-mentioned formula (8) and the structural unit represented by the formula (9) as a structural unit. B. The polymer P(II) represented by the formula (P3) or the formula (P4) may contain the structural unit represented by the above formula (5) as the structural unit B. The polymer P(II) represented by the formula (P3) or the formula (P4) may contain the structural unit represented by the above formula (6) as the structural unit B. The polymer P(II) represented by the formula (P3) or the formula (P4) may contain the structural unit represented by the above formula (MA) as the structural unit B.

式(P3)或式(P4)中,X為氫原子或碳數1~30的有機基。碳數1~30的有機基與可構成上述式(NB)中之R 1之碳數1~30的有機基相同。 In formula (P3) or formula (P4), X is a hydrogen atom or an organic group having 1 to 30 carbon atoms. The organic group having 1 to 30 carbon atoms is the same as the organic group having 1 to 30 carbon atoms that can constitute R 1 in the above formula (NB).

式(P3)或式(P4)中,Y為衍生自單官能或2官能以上的含硫醇基化合物之碳數1~30的1~6價的有機基(本說明書中,稱之為「有機基(i)」)。在本實施形態中,酸值為官能基數量(硫醇基的數量)。亦即,單官能或2官能以上的含硫醇基化合物含有1個或2個以上的硫醇基,有機基(i)介隔衍生自該硫醇基之1~6個硫醚基而與[ ]n內的結構單元及[ ]m內的結構單元鍵結。有機基(i)亦可以具有不參與與[ ]n內的結構單元及[ ]m內的結構單元的鍵結之硫醇基,聚合物P(I)能夠以(n+m)的數量(鍵結數量)為1~6個的各個樹脂的混合物的形式獲得。 碳數1~30的有機基(i)為單官能或2官能以上,較佳為2官能以上,更佳為3官能以上。上限值不受特別限定,但為6官能以下。 從本發明的效果的觀點而言,碳數1~30的有機基(i)的價數例如為1~6價,較佳為2~6價,更佳為3~6價。 In formula (P3) or formula (P4), Y is a 1-6 valent organic group having 1 to 30 carbon atoms derived from a monofunctional or bifunctional or higher-functional thiol group-containing compound (herein referred to as " Organic base (i)"). In this embodiment, the acid value is the number of functional groups (the number of thiol groups). That is, the monofunctional or bifunctional or higher-functional thiol group-containing compound contains one or more thiol groups, and the organic group (i) is separated from 1 to 6 thioether groups derived from the thiol group. The structural units in [ ]n and the structural units in [ ]m are bonded. The organic group (i) may also have a thiol group that does not participate in the bonding with the structural units in [ ]n and the structural units in [ ]m. The polymer P (I) can be in the number of (n+m) ( The number of bonds) is obtained as a mixture of individual resins ranging from 1 to 6. The organic group (i) having 1 to 30 carbon atoms is monofunctional or bifunctional or higher, preferably bifunctional or higher, more preferably trifunctional or higher. The upper limit is not particularly limited, but is 6 functional or less. From the viewpoint of the effect of the present invention, the valence of the organic group (i) having 1 to 30 carbon atoms is, for example, 1 to 6 valences, preferably 2 to 6 valences, and more preferably 3 to 6 valences.

碳數1~30的1~6價的有機基(i)可以含有選自O、N、S、P及Si中之一種以上的原子。作為碳數1~30的1~6價的有機基(i),例如可以列舉具有1~6個硫醚基(-S-*(*為連接鍵))之烷基、烯基、炔基、亞烷基、芳基、芳烷基、烷芳基、環烷基、烷氧基及雜環基。The 1- to 6-valent organic group (i) having 1 to 30 carbon atoms may contain one or more atoms selected from O, N, S, P, and Si. Examples of the 1 to 6-valent organic group (i) having 1 to 30 carbon atoms include an alkyl group, an alkenyl group, and an alkynyl group having 1 to 6 thioether groups (-S-* (* represents a bond)). , alkylene, aryl, aralkyl, alkaryl, cycloalkyl, alkoxy and heterocyclyl.

作為烷基,例如可以列舉甲基、乙基、正丙基、異丙基、正丁基、異丁基、二級丁基、三級丁基、戊基、新戊基、己基、庚基、辛基、壬基及癸基。作為烯基,例如可以列舉烯丙基、戊烯基及乙烯基。Examples of the alkyl group include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, secondary butyl, tertiary butyl, pentyl, neopentyl, hexyl, and heptyl. , octyl, nonyl and decyl. Examples of the alkenyl group include allyl, pentenyl and vinyl.

作為炔基,可以列舉乙炔基。 作為亞烷基,例如可以列舉亞甲基及亞乙基。作為芳基,例如可以列舉甲苯基、二甲苯基、苯基、萘基及蒽基。 作為芳烷基,例如可以列舉苄基及苯乙基。 作為烷芳基,例如可以列舉甲苯基、二甲苯基。 Examples of the alkynyl group include an ethynyl group. Examples of the alkylene group include methylene and ethylene. Examples of the aryl group include tolyl, xylyl, phenyl, naphthyl and anthracenyl. Examples of the aralkyl group include benzyl group and phenethyl group. Examples of the alkaryl group include tolyl group and xylyl group.

作為環烷基,例如可以列舉金剛烷基、環戊基、環己基及環辛基。 作為烷氧基,例如可以列舉甲氧基、乙氧基、正丙氧基、異丙氧基、正丁氧基、二級丁氧基、異丁氧基、三級丁氧基、正戊氧基、新戊氧基及正己氧基。 作為雜環基,例如可以列舉環氧基及氧環丁基。 Examples of the cycloalkyl group include adamantyl, cyclopentyl, cyclohexyl and cyclooctyl. Examples of the alkoxy group include methoxy, ethoxy, n-propoxy, isopropoxy, n-butoxy, secondary butoxy, isobutoxy, tertiary butoxy, and n-pentoxy. Oxygen, neopentyloxy and n-hexyloxy. Examples of the heterocyclic group include an epoxy group and an oxycyclobutyl group.

作為式(P3)或式(P4)中的可衍生Y之單官能或2官能以上的含硫醇基化合物,可以列舉下述化學式(s-1)~(s-21)所表示之化合物。亦即,聚合物P(II)含有衍生自以下為代表之單官能或2官能以上的含硫醇基化合物之碳數1~30的1~6價的有機基(i)。Examples of the monofunctional or bifunctional or higher-functional thiol group-containing compound from which Y can be derived in Formula (P3) or Formula (P4) include compounds represented by the following chemical formulas (s-1) to (s-21). That is, the polymer P (II) contains a 1- to 6-valent organic group (i) having a carbon number of 1 to 30 derived from a monofunctional or bifunctional or higher-functional thiol group-containing compound represented by the following.

單官能或2官能以上的含硫醇基化合物可以單獨使用一種,亦可以混合使用兩種以上。其中,在對其他單體之反應性優異的觀點上,較佳為在一個分子中具有3~6個硫醇基之3~6官能(3~6價)的含硫醇基化合物。 在本實施形態中,在前述化學式(s-1)~(s-21)所表示之化合物之中,單官能或2官能以上的前述含硫醇基化合物更佳為含有化學式(s-1)~(s-3)、(s-5)及(s-8)~(s-10)所表示之化合物,尤其更佳為含有化學式(s-1)~(s-3)、(s-5)及(s-9)所表示之化合物。 碳數1~30的1~6價的有機基(i)在末端具有衍生自該等含硫醇基化合物的硫醇基之硫醚基(-S-*(*為連接鍵)),且介隔硫醚基與[ ]n內的結構單元及[ ]m內的結構單元鍵結。前述有機基(i)亦可以具有不參與與[ ]n內的結構單元及[ ]m內的結構單元之鍵結之硫醇基。 One type of monofunctional or two or more functional thiol group-containing compounds may be used alone, or two or more types may be mixed and used. Among them, a 3- to 6-functional (3- to 6-valent) thiol group-containing compound having 3 to 6 thiol groups in one molecule is preferred from the viewpoint of excellent reactivity with other monomers. In this embodiment, among the compounds represented by the aforementioned chemical formulas (s-1) to (s-21), the monofunctional or bifunctional or higher-mentioned thiol group-containing compound more preferably contains the chemical formula (s-1) The compounds represented by ~(s-3), (s-5) and (s-8) ~ (s-10) are particularly preferably compounds containing chemical formulas (s-1) ~ (s-3), (s- 5) and the compound represented by (s-9). The 1 to 6-valent organic group (i) having 1 to 30 carbon atoms has a thioether group (-S-* (* is a connecting bond)) derived from the thiol group of the thiol group-containing compound at the terminal, and The thioether group is bonded to the structural unit in [ ]n and the structural unit in [ ]m. The aforementioned organic group (i) may also have a thiol group that does not participate in the bonding with the structural unit in [ ]n and the structural unit in [ ]m.

當本實施形態的聚合物P(II)具有式(P3)所表示之結構且使用上述式(s-2)所表示之4官能(4價)的含硫醇基化合物作為單官能或2官能以上的含硫醇基化合物來獲得聚合物P(II)時,聚合物P(II)可具有如以下的式(I)所表示之結構。When the polymer P (II) of this embodiment has a structure represented by formula (P3) and a tetrafunctional (tetravalent) thiol group-containing compound represented by the above formula (s-2) is used as a monofunctional or bifunctional When polymer P(II) is obtained from the above thiol group-containing compound, polymer P(II) may have a structure represented by the following formula (I).

式(I)中,A、B、C、X、p、q及r與式(P3)中者同義。其中,式(I)中,為了說明而將4個[ ]內的每一個聚合物鏈的p、q及r分別記載為p 1~p 4、q 1~q 4、r 1~r 4。 式(I)中,p 1~p 4、q 1~q 4、r 1~r 4在4個[ ]內的每一個聚合物鏈中可以相同亦可以不同,且p 1+q 1+r 1=1、p 2+q 2+r 2=1、p 3+q 3+r 3=1、p 4+q 4+r 4=1。 若將式(I)所表示之聚合物中所含有之各結構單元A、B及C的莫耳含有率分別設為p t、q t及r t,則p t=p 1+p 2+p 3+p 4、q t=q 1+q 2+q 3+q 4、r t=r 1+r 2+r 3+r 4In formula (I), A, B, C, X, p, q and r are synonymous with those in formula (P3). In formula (I), for the sake of explanation, p, q and r of each polymer chain within four [ ] are respectively described as p 1 to p 4 , q 1 to q 4 , r 1 to r 4 . In formula (I), p 1 to p 4 , q 1 to q 4 , r 1 to r 4 may be the same or different in each of the four polymer chains [ ], and p 1 +q 1 +r 1 =1, p 2 +q 2 +r 2 =1, p 3 +q 3 +r 3 =1, p 4 +q 4 +r 4 =1. If the molar content of each structural unit A, B and C contained in the polymer represented by formula (I) is p t , q t and r t respectively, then p t =p 1 +p 2 + p 3 +p 4 , q t =q 1 +q 2 +q 3 +q 4 , r t =r 1 +r 2 +r 3 +r 4 .

式(I)中,A、B及C的鍵結順序不受特別限定,A、B及C中的任一個可以與硫醚基鍵結。又,通式(I)中,示出了介隔衍生自化學式(s-2)所表示之化合物的4個巰基之硫醚基而與4個[ ]內的結構單元鍵結之例子,但亦可以為在衍生自4個巰基之硫醚基上鍵結有1~3個[ ]內的結構單元且在剩餘的硫醚基上鍵結有與[ ]內的結構單元不同的有機基之結構。在本實施形態中,聚合物P能夠以含有至少一種鍵結有1~4個[ ]內的結構之化合物之混合物的形式獲得。In formula (I), the bonding order of A, B, and C is not particularly limited, and any one of A, B, and C may be bonded to a thioether group. Furthermore, in the general formula (I), there is shown an example in which a thioether group derived from four mercapto groups of the compound represented by the chemical formula (s-2) is bonded to a structural unit within four [ ]. However, It may also be one in which 1 to 3 structural units in [ ] are bonded to the thioether group derived from four mercapto groups, and the remaining thioether group is bonded to an organic group different from the structural units in [ ]. structure. In this embodiment, the polymer P can be obtained as a mixture containing at least one compound having a structure within 1 to 4 [ ] bonded thereto.

聚合物P(II)的重量平均分子量Mw、分散度(重量平均分子量Mw/數平均分子量Mn)、玻璃轉移溫度、軟化點、熔點、酸值、雙鍵當量及鹼溶解速度等物性與上述聚合物P(I)的物性相同。The physical properties such as weight average molecular weight Mw, dispersion (weight average molecular weight Mw/number average molecular weight Mn), glass transition temperature, softening point, melting point, acid value, double bond equivalent and alkali dissolution rate of polymer P(II) are related to the above polymerization The physical properties of object P(I) are the same.

(聚合物P(II)的製造方法) 聚合物(A)能夠藉由任意的方法來製造(合成)。代表性地,聚合物P(II)能夠藉由以下的步驟bI、步驟bII及步驟bIII來製造。 再者,在以下的聚合物P(II)的製造方法的說明中,為了方便起見,針對所獲得之聚合物P(I)為含有式(NB)所表示之結構單元;式(1-2)所表示之結構單元及/或式(1-3)所表示之結構單元;式(AD)所表示之結構單元之聚合物的情況進行記載。可依據聚合物P(II)的目標結構來選擇原料單體。 當聚合物P(II)含有式(MI)所表示之結構單元時,在步驟bI中,使用式(IMm)所表示之原料單體即可。 步驟bI:準備含有式(NB)所表示之結構單元、式(AD)所表示之結構單元、式(MA)所表示之結構單元及碳數1~30的1~6價的有機基(i)之原料聚合物之步驟; 步驟bII-i:使步驟bI中所獲得之原料聚合物與具有羥基及2個以上的(甲基)丙烯醯基之化合物(多官能(甲基)丙烯酸化合物)及/或具有羥基及1個(甲基)丙烯醯基之化合物(單官能(甲基)丙烯酸化合物)在鹼性觸媒的存在下進行反應而製備含有式(NB)所表示之結構單元、式(AD)所表示之結構單元、碳數1~30的1~6價的有機基(i)以及式(1)所表示之結構單元及/或式(2)所表示之結構單元且根據情況進一步含有式(MA)所表示之結構單元之第一聚合物前驅物(IIa)之步驟。 (Production method of polymer P(II)) Polymer (A) can be produced (synthesized) by any method. Typically, polymer P(II) can be produced by the following steps bI, step bII, and step bIII. Furthermore, in the following description of the manufacturing method of polymer P(II), for the sake of convenience, the obtained polymer P(I) contains the structural unit represented by formula (NB); formula (1- 2) The structural unit represented and/or the structural unit represented by formula (1-3); the polymer of the structural unit represented by formula (AD) is described. The raw material monomers can be selected according to the target structure of the polymer P(II). When the polymer P (II) contains the structural unit represented by the formula (MI), in step bI, the raw material monomer represented by the formula (IMm) can be used. Step bI: Prepare an organic group (i) containing a structural unit represented by the formula (NB), a structural unit represented by the formula (AD), a structural unit represented by the formula (MA), and a 1- to 6-valent organic group having 1 to 30 carbon atoms. ) steps of raw material polymer; Step bII-i: The raw material polymer obtained in step bI is mixed with a compound having a hydroxyl group and two or more (meth)acrylyl groups (a polyfunctional (meth)acrylic acid compound) and/or a compound having a hydroxyl group and one or more (meth)acrylyl groups. A (meth)acrylyl compound (monofunctional (meth)acrylic acid compound) is reacted in the presence of an alkaline catalyst to prepare a structure containing a structural unit represented by formula (NB) and a structure represented by formula (AD) unit, a 1- to 6-valent organic group (i) having 1 to 30 carbon atoms, a structural unit represented by formula (1) and/or a structural unit represented by formula (2), and optionally further containing a structural unit represented by formula (MA) The step of representing the first polymer precursor (IIa) of the structural unit.

當聚合物P(II)進一步含有式(3)所表示之結構單元時,實施以下的步驟bIII-i。 步驟bIII-i:在步驟bII中,製備含有式(NB)所表示之結構單元、式(AD)所表示之結構單元、式(1)所表示之結構單元及/或式(2)所表示之結構單元及式(MA)所表示之結構單元之聚合物前驅物(相當於上述步驟bII中之聚合物P(II)),其後,將該聚合物前驅物在鹼觸媒的存在下用水進行處理而獲得聚合物P(II)之步驟。 When the polymer P(II) further contains the structural unit represented by formula (3), the following step bIII-i is performed. Step bIII-i: In step bII, prepare a product containing the structural unit represented by formula (NB), the structural unit represented by formula (AD), the structural unit represented by formula (1) and/or the structural unit represented by formula (2) The polymer precursor of the structural unit and the structural unit represented by formula (MA) (equivalent to the polymer P (II) in the above step bII), and then the polymer precursor is heated in the presence of an alkali catalyst A step of treating with water to obtain polymer P(II).

在步驟bII中,當使用多官能(甲基)丙烯酸化合物和單官能(甲基)丙烯酸化合物這兩者時,較佳為,首先使多官能(甲基)丙烯酸化合物與步驟bI中所獲得之原料聚合物進行反應,並使單官能(甲基)丙烯酸化合物與所獲得之反應混合物進行反應。In step bII, when both a multifunctional (meth)acrylic compound and a monofunctional (meth)acrylic compound are used, it is preferred that the multifunctional (meth)acrylic compound is first mixed with the compound obtained in step bI. The raw material polymer is reacted, and the monofunctional (meth)acrylic acid compound is reacted with the obtained reaction mixture.

當聚合物P(II)進一步含有式(1-1)所表示之結構單元時,實施以下的步驟bIII-ii。 步驟bIII-ii:製備在步驟bII中所獲得之式(NB)所表示之結構單元、式(AD)所表示之結構單元、式(1)所表示之結構單元及/或式(2)所表示之結構單元及式(MA)所表示之結構單元之聚合物前驅物(相當於上述步驟bII中之聚合物P(II)),使該聚合物前驅物在觸媒的存在下與含有環氧基之(甲基)丙烯酸化合物進行反應而製備聚合物P(II)之步驟。 When the polymer P(II) further contains a structural unit represented by formula (1-1), the following step bIII-ii is performed. Step bIII-ii: Prepare the structural unit represented by formula (NB), the structural unit represented by formula (AD), the structural unit represented by formula (1) and/or the structural unit represented by formula (2) obtained in step bII The polymer precursor of the structural unit represented by the structural unit represented by the formula (MA) (equivalent to the polymer P (II) in the above step bII), so that the polymer precursor reacts with the polymer precursor containing the ring in the presence of a catalyst. A step of preparing polymer P(II) by reacting an oxy(meth)acrylic acid compound.

步驟bIII-i和步驟bIII-ii可以實施其中任一者。當實施兩者時,較佳為在步驟bIII-i之後實施步驟bIII-ii。Either of step bIII-i and step bIII-ii may be implemented. When both are implemented, it is preferred to implement step bIII-ii after step bIII-i.

以下,針對各步驟進行說明。 (步驟bI) 步驟bI中之準備含有式(NB)所表示之結構單元、式(AD)所表示之結構單元、式(MA)所表示之結構單元及碳數1~30的1~6價的有機基(i)之原料聚合物之步驟能夠藉由使含有式(NBm)所表示之單體、式(ADm)所表示之單體及式(MAm)所表示之單體之單體組成物在單官能或2官能以上的含硫醇基化合物的存在下聚合(加成聚合)來實施。 Each step is explained below. (step bI) The preparation in step bI contains a structural unit represented by the formula (NB), a structural unit represented by the formula (AD), a structural unit represented by the formula (MA) and a 1-6 valent organic group having 1 to 30 carbon atoms ( The step of the raw material polymer of i) can be performed by making the monomer composition containing the monomer represented by the formula (NBm), the monomer represented by the formula (ADm) and the monomer represented by the formula (MAm) in the monofunctional Or polymerization (addition polymerization) is carried out in the presence of a bifunctional or higher-functional thiol group-containing compound.

作為單官能或2官能以上的含硫醇基化合物,可以列舉前述化學式(s-1)~(s-21)所表示之化合物,但並不限定於該等。單官能或2官能以上的含硫醇基化合物可以單獨使用一種,亦可以混合使用兩種以上。 步驟bI的具體條件與第一實施形態的聚合物P(I)的製造方法中之步驟aI相同。 Examples of the monofunctional or bifunctional or higher-functional thiol group-containing compound include compounds represented by the aforementioned chemical formulas (s-1) to (s-21), but are not limited thereto. One type of monofunctional or two or more functional thiol group-containing compounds may be used alone, or two or more types may be mixed and used. The specific conditions of step bI are the same as step aI in the method for producing polymer P(I) according to the first embodiment.

(步驟bII) 步驟bII可以適用與第一實施形態的聚合物P(I)的製造方法中之步驟aII相同的條件。 (Step bII) The same conditions as those of step aII in the method for producing polymer P(I) according to the first embodiment can be applied to step bII.

(步驟bIII-i) 步驟bIII-i可以適用與第一實施形態的聚合物P(I)的製造方法中之步驟aIII-i相同的條件。 (步驟bIII-i) 步驟bIII-ii可以適用與第一實施形態的聚合物P(I)的製造方法中之步驟aIII-ii相同的條件。 (Step bIII-i) The same conditions as those of step aIII-i in the method for producing polymer P(I) according to the first embodiment can be applied to step bIII-i. (Step bIII-i) The same conditions as those of step aIII-ii in the method for producing polymer P(I) according to the first embodiment can be applied to step bIII-ii.

<第三實施形態> (聚合物P(III)) 第三實施形態中之聚合物P(以下,稱為「聚合物P(III)」)含有式(NB)所表示之結構單元、式(AD)所表示之結構單元及式(MA)所表示之結構單元。 <Third Embodiment> (Polymer P(III)) The polymer P (hereinafter, referred to as "polymer P (III)") in the third embodiment contains a structural unit represented by formula (NB), a structural unit represented by formula (AD), and a structural unit represented by formula (MA). the structural unit.

通式(NB)中,R 1、R 2、R 3及R 4分別獨立地為氫原子或碳數1~30的有機基,a 1為0、1或2, In the general formula (NB), R 1 , R 2 , R 3 and R 4 are each independently a hydrogen atom or an organic group having 1 to 30 carbon atoms, a 1 is 0, 1 or 2,

式(MA)中,R 21及R 22分別獨立地為氫原子或碳數1~3的有機基。 In the formula (MA), R 21 and R 22 are each independently a hydrogen atom or an organic group having 1 to 3 carbon atoms.

式(AD)中,R 11及R 12分別獨立地為碳數1~12的直鏈或支鏈的烷基,-C(=O)-O-R 11基與-C(=O)-O-R 12基的立體配置不受限定,可以為來自於順式型的不飽和二羧酸二烷基酯之結構,亦可以為來自於反式型的不飽和二羧酸二烷基酯之結構,R 13及R 14分別獨立地為氫原子或碳數1~3的烷基。R 11及R 12的碳數愈多,聚合物P(III)的軟化點及熔點具有變得愈低之傾向。 In the formula (AD), R 11 and R 12 are each independently a linear or branched chain alkyl group having 1 to 12 carbon atoms, and -C (=O) -OR 11 group and -C (=O) -OR 12 R 13 and R 14 are each independently a hydrogen atom or an alkyl group having 1 to 3 carbon atoms. The greater the number of carbon atoms in R 11 and R 12 , the lower the softening point and melting point of polymer P(III) tend to be.

聚合物P(III)為第一實施形態中之聚合物P(I)的製造中使用之原料聚合物,並且是在上述步驟aI的步驟中獲得之聚合物。The polymer P(III) is the raw material polymer used for producing the polymer P(I) in the first embodiment, and is the polymer obtained in the step aI described above.

聚合物P(III)藉由含有式(AD)所表示之結構單元而具有130℃以下的低軟化點。聚合物P(III)的軟化點較佳為125℃以下,更佳為120℃以下。又,聚合物P(III)藉由含有式(AD)所表示之結構單元而具有160℃以下的低熔點。聚合物P(III)的熔點較佳為155℃以下,更佳為150℃以下。Polymer P(III) has a low softening point of 130° C. or lower by containing a structural unit represented by formula (AD). The softening point of the polymer P(III) is preferably 125°C or lower, more preferably 120°C or lower. In addition, the polymer P (III) has a low melting point of 160° C. or less by containing the structural unit represented by the formula (AD). The melting point of the polymer P(III) is preferably 155°C or lower, more preferably 150°C or lower.

聚合物P(III)的重量平均分子量Mw例如為1,000~5,000。聚合物P(III)的重量平均分子量Mw較佳為1,000~4,500。藉由適當地調整重量平均分子量,能夠調整由該聚合物P(III)獲得之聚合物P(I)的重量平均分子量,其結果,能夠將聚合物P(III)的靈敏度或對鹼顯影液之溶解性調整為所期望之程度。 又,聚合物P(III)的分散度(重量平均分子量Mw/數平均分子量Mn)較佳為1.0~5.0,更佳為1.0~4.0,進而較佳為1.0~3.0。 The weight average molecular weight Mw of the polymer P(III) is, for example, 1,000 to 5,000. The weight average molecular weight Mw of the polymer P(III) is preferably 1,000 to 4,500. By appropriately adjusting the weight average molecular weight, the weight average molecular weight of the polymer P(I) obtained from the polymer P(III) can be adjusted. As a result, the sensitivity of the polymer P(III) or the resistance to an alkali developer can be improved. The solubility is adjusted to the desired level. Furthermore, the dispersion degree (weight average molecular weight Mw/number average molecular weight Mn) of the polymer P (III) is preferably 1.0 to 5.0, more preferably 1.0 to 4.0, and still more preferably 1.0 to 3.0.

<第四實施形態> (聚合物P(IV)) 本發明的第四實施形態中之聚合物(本說明書中,稱之為「聚合物P(IV)」)具有式(NB)所表示之結構單元、式(MA)所表示之結構單元及式(AD)所表示之結構單元,並且具有式(P3')所表示之結構。聚合物P(IV)具有在式(P3')中表示為「Y」之衍生自單官能或2官能以上的含硫醇基化合物之碳數1~30的1~6價的有機基上鍵結有典型地由結構單元A、結構單元B及結構單元C構成之聚合物鏈之結構。該衍生自單官能或2官能以上的含硫醇基化合物之碳數1~30的1~6價的有機基代表性地為含有1~6個硫醚基之碳數1~30的有機基。 <Fourth Embodiment> (Polymer P(IV)) The polymer in the fourth embodiment of the present invention (referred to as "polymer P(IV)" in this specification) has a structural unit represented by formula (NB), a structural unit represented by formula (MA) and a formula The structural unit represented by (AD) and has the structure represented by formula (P3'). Polymer P (IV) has a 1- to 6-valent organic group bond with a carbon number of 1 to 30 derived from a monofunctional or bifunctional or higher-functional thiol group-containing compound represented by "Y" in the formula (P3') The knot has a structure of a polymer chain typically composed of structural units A, B and C. The 1-6 valent organic group having 1 to 30 carbon atoms derived from a monofunctional or bifunctional or higher-functional thiol group-containing compound is typically an organic group with 1 to 30 carbon atoms containing 1 to 6 thioether groups. .

式(P3')中, n為1~6的整數, p、q'及r表示n個[ ]內的每一個聚合物鏈中所含之結構單元A、B'及C的莫耳含有率, p、q'及r在n個[ ]內的每一個聚合物鏈中可以相同亦可以不同, p+q'+r=1,p為0以上,q'為0以上,r為0以上, 若將該聚合物中所含有之各結構單元A、B及C的莫耳含有率分別設為p t、q t'及r t,則p t+q t+r t=1, p t大於0,較佳為0.25~0.75,更佳為0.3~0.65,更佳為0.35~0.6, q t'大於0,較佳為0.25~0.75,更佳為0.3~0.65,更佳為0.35~0.60, r t大於0,較佳為0.05~0.70,更佳為0.06~0.65,更佳為0.07~0.60, Y為衍生自單官能或2官能以上的含硫醇基化合物之碳數1~30的1~6價的有機基, A表示式(NB)所表示之結構單元, B'表示式(MA)所表示之結構單元, C表示式(AD)所表示之結構單元, 存在複數個之A彼此、B'彼此、C彼此可以相同亦可以不同。 In formula (P3'), n is an integer from 1 to 6, p, q' and r represent the molar content of structural units A, B' and C contained in each polymer chain within n [ ] , p, q' and r can be the same or different in each polymer chain within n [ ], p+q'+r=1, p is 0 or more, q' is 0 or more, r is 0 or more , if the molar content of each structural unit A, B and C contained in the polymer is set to p t , q t ' and r t respectively, then p t +q t +r t =1, p t is greater than 0, preferably 0.25~0.75, more preferably 0.3~0.65, more preferably 0.35~0.6, qt ' is greater than 0, preferably 0.25~0.75, more preferably 0.3~0.65, more preferably 0.35~0.60 , r t is greater than 0, preferably 0.05 to 0.70, more preferably 0.06 to 0.65, more preferably 0.07 to 0.60, Y is a compound with 1 to 30 carbon atoms derived from a monofunctional or bifunctional or higher-functional thiol group-containing compound. Organic groups with 1 to 6 valences, A represents the structural unit represented by formula (NB), B' represents the structural unit represented by formula (MA), C represents the structural unit represented by formula (AD), and there is a plurality of A Each other, B' each other, and C each other may be the same or different.

在一實施形態中,聚合物P(IV)可以含有式(MI)所表示之結構單元,在該情況下,具有式(P4')所表示之結構。In one embodiment, the polymer P (IV) may contain a structural unit represented by the formula (MI), and in this case, has a structure represented by the formula (P4').

式(P4')中, n、X、Y、A、B'、C與上述式(P3')中者同義。 p、q'、r及s表示n個[ ]內的每一個聚合物鏈中所含之結構單元A、B'、C及D的莫耳含有率, p、q'、r及s在n個[ ]內的每一個聚合物鏈中可以相同亦可以不同, p+q'+r+s=1,p為0以上,q'為0以上,r為0以上,s為0以上, 若將該聚合物中所含有之各結構單元A、B'、C及D的莫耳含有率分別設為p t、q t'、r t及s t,則p t+q t'+r t+s t=1,p t大於0,q t'大於0,r t大於0,s t大於0, p t大於0,較佳為0.25~0.75,更佳為0.3~0.65,更佳為0.35~0.60。 q t'大於0,較佳為0.10~0.6,更佳為0.2~0.50,更佳為0.25~0.45。 r t大於0,較佳為0.03~0.3,更佳為0.04~0.28,特佳為0.05~0.25。 s t大於0,較佳為0.01~0.3,更佳為0.015~0.28,特佳為0.02~0.25。 D表示式(MI)所表示之結構單元。 存在複數個之A彼此、B彼此、C彼此、D彼此可以相同亦可以不同。 In the formula (P4'), n, X, Y, A, B', and C are synonymous with those in the above formula (P3'). p, q', r and s represent the molar content of structural units A, B', C and D contained in each polymer chain within n [ ], p, q', r and s are in n Each polymer chain in [ ] can be the same or different, p+q'+r+s=1, p is 0 or more, q' is 0 or more, r is 0 or more, s is 0 or more, if Let the molar content of each structural unit A, B', C and D contained in the polymer be p t , q t ', rt and s t respectively, then p t +q t '+r t +s t =1, p t is greater than 0, q t ' is greater than 0, r t is greater than 0, s t is greater than 0, p t is greater than 0, preferably 0.25~0.75, more preferably 0.3~0.65, more preferably 0.35 ~0.60. q t ' is greater than 0, preferably 0.10 to 0.6, more preferably 0.2 to 0.50, more preferably 0.25 to 0.45. r t is greater than 0, preferably 0.03 to 0.3, more preferably 0.04 to 0.28, and particularly preferably 0.05 to 0.25. s t is greater than 0, preferably 0.01 to 0.3, more preferably 0.015 to 0.28, and particularly preferably 0.02 to 0.25. D represents the structural unit represented by formula (MI). There are a plurality of A's, B's, C's and D's which may be the same or different.

聚合物P(IV)為上述聚合物P(II)的製造中使用之原料聚合物,並且是在上述步驟bI的步驟中獲得之聚合物。Polymer P(IV) is the raw material polymer used in the production of the above-mentioned polymer P(II), and is the polymer obtained in the step bI above.

聚合物P(IV)的重量平均分子量Mw、分散度(重量平均分子量Mw/數平均分子量Mn)與上述聚合物P(III)的物性相同。The weight average molecular weight Mw and dispersion degree (weight average molecular weight Mw/number average molecular weight Mn) of the polymer P (IV) are the same as the physical properties of the above-mentioned polymer P (III).

[聚合物溶液] 本實施形態的聚合物溶液含有上述聚合物P(I)或聚合物P(II)。本實施形態的聚合物溶液含有聚合物P(I)或聚合物P(II),並且含有選自多官能(甲基)丙烯酸化合物及單官能(甲基)丙烯酸化合物中之至少1個。 [Polymer solution] The polymer solution of this embodiment contains the above-mentioned polymer P(I) or polymer P(II). The polymer solution of this embodiment contains polymer P(I) or polymer P(II), and contains at least one selected from the group consisting of polyfunctional (meth)acrylic compounds and monofunctional (meth)acrylic compounds.

[多官能(甲基)丙烯酸化合物] 本實施形態的聚合物溶液中可含有之多官能(甲基)丙烯酸化合物或單官能(甲基)丙烯酸化合物可以為製造聚合物P時在上述步驟aII或步驟bII中所使用之(甲基)丙烯酸化合物的未反應物,亦可以為額外添加者。 [Polyfunctional (meth)acrylic compound] The polyfunctional (meth)acrylic acid compound or the monofunctional (meth)acrylic acid compound that may be contained in the polymer solution of this embodiment may be the (methyl) compound used in the above-mentioned step aII or step bII when producing the polymer P. The unreacted product of the acrylic compound may be additionally added.

作為可摻合於聚合物溶液中之多官能(甲基)丙烯酸化合物,例如可以列舉以下的式(1b-p)所表示之化合物、式(1c-p)所表示之化合物及式(1d-p)所表示之化合物,但並不限定於該等。Examples of polyfunctional (meth)acrylic compounds that can be blended into the polymer solution include compounds represented by the following formula (1b-p), compounds represented by the formula (1c-p), and compounds represented by the formula (1d- The compounds represented by p), but are not limited to these.

式(1b-p)中之k、R、X 1、X 1’及X 2的定義及具體態樣與上述式(1b)中者相同。又,式(1c-p)中之k、R、X 1、X 2、X 3、X 4、X 5及X 6的定義及具體態樣與上述式(1c)中者相同。 The definitions and specific aspects of k, R, X 1 , X 1 ' and X 2 in the formula (1b-p) are the same as those in the above formula (1b). In addition, the definitions and specific aspects of k , R , X 1 , X 2 , X 3 ,

式(1b-p)、式(1c-p)及式(1d-p)中之Y為氫原子或(甲基)丙烯醯基或該等的組合。Y in formula (1b-p), formula (1c-p) and formula (1d-p) is a hydrogen atom or a (meth)acrylyl group or a combination thereof.

式(1b-p)、式(1c-p)及式(1d-p)中Y為氫原子的化合物可以為未反應單體(亦即,式(1b-p)、式(1c-p)及式(1d-p)所表示之化合物),亦可以額外添加。 式(1d-p)中之n為2以上的整數,較佳為2~5的整數,更佳為2~3的整數。 The compound in which Y is a hydrogen atom in formula (1b-p), formula (1c-p) and formula (1d-p) can be an unreacted monomer (that is, formula (1b-p), formula (1c-p) and compounds represented by formula (1d-p)), which can also be added additionally. n in the formula (1d-p) is an integer of 2 or more, preferably an integer of 2 to 5, more preferably an integer of 2 to 3.

當在本實施形態的聚合物溶液中與聚合物P(I)或聚合物P(II)的製造時所使用之多官能(甲基)丙烯酸化合物的未反應物另外地摻合多官能(甲基)丙烯酸化合物時,其摻合量可以以該聚合物溶液的凝膠滲透層析(GPC)圖譜中之來自於多官能(甲基)丙烯酸化合物之峰面積相對於聚合物P(I)或聚合物P(II)的峰面積較佳為成為10%以下、更佳為成為5%以下、進而較佳為成為2%以下之量摻合。When the polyfunctional (meth)acrylic compound is separately blended with the unreacted product of the polyfunctional (meth)acrylic compound used in the production of the polymer P(I) or the polymer P(II) in the polymer solution of this embodiment, When a polyfunctional (meth)acrylic compound is used, the blending amount may be based on the peak area derived from the polyfunctional (meth)acrylic compound in the gel permeation chromatography (GPC) spectrum of the polymer solution relative to the polymer P(I) or The peak area of the polymer P(II) is preferably 10% or less, more preferably 5% or less, and still more preferably 2% or less.

[單官能(甲基)丙烯酸化合物] 作為摻合於本實施形態的聚合物溶液中之單官能(甲基)丙烯酸化合物,可以列舉以下的式(2a-m)所表示之化合物。式(2am)中,針對X 10及R的定義,與式(2a)中者相同。 [Monofunctional (meth)acrylic compound] Examples of the monofunctional (meth)acrylic compound blended in the polymer solution of this embodiment include compounds represented by the following formulas (2a-m). In formula (2am), the definitions of X 10 and R are the same as those in formula (2a).

當在本實施形態的聚合物溶液中與聚合物P(I)或聚合物P(II)的製造時所使用之單官能(甲基)丙烯酸化合物的未反應物另外地摻合單官能(甲基)丙烯酸化合物時,其摻合量可以以該聚合物溶液的凝膠滲透層析(GPC)圖譜中之來自於單官能(甲基)丙烯酸化合物之峰面積相對於聚合物P(I)或聚合物P(II)的峰面積較佳為成為10%以下、更佳為成為5%以下、進而較佳為成為2%以下之量摻合。When the unreacted product of the monofunctional (meth)acrylic compound used in the production of the polymer P(I) or the polymer P(II) is separately blended with the polymer solution of the present embodiment, the monofunctional (meth)acrylic compound base) acrylic compound, its blending amount can be based on the peak area from the monofunctional (meth)acrylic compound in the gel permeation chromatography (GPC) spectrum of the polymer solution relative to the polymer P (I) or The peak area of the polymer P(II) is preferably 10% or less, more preferably 5% or less, and still more preferably 2% or less.

本實施形態的聚合物溶液典型地含有有機溶劑,並且以液體或清漆的形態提供。作為有機溶劑,可以使用酮系溶劑、酯系溶劑、醚系溶劑、醇系溶劑、內酯系溶劑、碳酸酯系溶劑等中的一種或兩種以上。The polymer solution of this embodiment typically contains an organic solvent and is provided in the form of a liquid or a varnish. As the organic solvent, one or more of ketone solvents, ester solvents, ether solvents, alcohol solvents, lactone solvents, carbonate solvents, etc. can be used.

作為有機溶劑的具體例,可以列舉丙二醇單甲醚乙酸酯、丙二醇單甲醚、γ-丁內酯、N-甲基吡咯啶酮及環己酮等。該等可以單獨使用一種,亦可以組合使用兩種以上。 有機溶劑的使用量不受特別限定,以不揮發成分的濃度例如成為10~70質量%、較佳為成為15~60質量%之量使用。 Specific examples of the organic solvent include propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether, γ-butyrolactone, N-methylpyrrolidone, cyclohexanone, and the like. One type of these may be used alone, or two or more types may be used in combination. The usage amount of the organic solvent is not particularly limited, but it is used in an amount such that the concentration of the non-volatile component becomes, for example, 10 to 70 mass %, preferably 15 to 60 mass %.

[聚合物溶液的製造] 本實施形態的聚合物溶液能夠藉由將上述成分利用公知的方法進行混合來製作。本實施形態的聚合物溶液用作以下說明之感光性樹脂組成物的樹脂材料。 [Manufacture of polymer solution] The polymer solution of this embodiment can be produced by mixing the above components by a known method. The polymer solution of this embodiment is used as the resin material of the photosensitive resin composition described below.

[感光性樹脂組成物] 本實施形態的感光性樹脂組成物含有上述聚合物P(I)或聚合物P(II)和光聚合起始劑。亦即,本實施形態的感光性樹脂組成物含有上述本實施形態的聚合物溶液和光聚合起始劑。 以下,針對各成分進行說明。 [Photosensitive resin composition] The photosensitive resin composition of this embodiment contains the above-mentioned polymer P(I) or polymer P(II) and a photopolymerization initiator. That is, the photosensitive resin composition of this embodiment contains the above-mentioned polymer solution of this embodiment and a photopolymerization initiator. Each component is explained below.

(光聚合起始劑) 作為本實施形態的感光性樹脂組成物中所使用之光聚合起始劑,可以列舉光自由基聚合起始劑。作為光自由基聚合起始劑,可以使用公知的化合物,例如可以列舉2,2-二乙氧基苯乙酮、2,2-二甲氧基-2-苯基苯乙酮、1-羥基環己基苯基酮、2-羥基-2-甲基-1-苯基丙-1-酮、1-〔4-(2-羥基乙氧基)苯基〕-2-羥基-2-甲基-1-丙-1-酮、2-羥基-1-{4-〔4-(2-羥基-2-甲基丙醯基)苄基〕苯基}-2-甲基丙-1-酮、2-甲基-1-(4-甲硫基苯基)-2-啉基丙-1-酮、2-苄基-2-二甲基胺基-1-(4-啉基苯基)-丁酮-1,2-(二甲基胺基)-2-〔(4-甲基苯基)甲基〕-1-〔4-(4-啉基)苯基〕-1-丁酮等烷基苯酮(alkylphenone)系化合物;二苯甲酮、4,4'-雙(二甲基胺基)二苯甲酮、2-羧基二苯甲酮等二苯甲酮系化合物;安息香甲醚、安息香乙醚、安息香異丙醚、安息香異丁醚等安息香系化合物;9-氧硫𠮿(thioxanthone)、2-乙基-9-氧硫𠮿、2-異丙基-9-氧硫𠮿、2-氯-9-氧硫𠮿2,4-二甲基-9-氧硫𠮿、2,4-二乙基-9-氧硫𠮿等-9-氧硫𠮿系化合物;2-(4-甲氧基苯基)-4,6-雙(三氯甲基)對稱三𠯤、2-(4-甲氧基萘基)-4,6-雙(三氯甲基)對稱三𠯤、2-(4-乙氧基萘基)-4,6-雙(三氯甲基)對稱三𠯤、2-(4-乙氧基羰基萘基)-4,6-雙(三氯甲基)對稱三𠯤等鹵甲基化三𠯤系化合物;2-三氯甲基-5-(2’-苯并呋喃基)-1,3,4-㗁二唑、2-三氯甲基-5-〔β-(2’-苯并呋喃基)乙烯基〕-1,3,4-㗁二唑、4-㗁二唑、2-三氯甲基-5-呋喃基-1,3,4-㗁二唑等鹵甲基化㗁二唑系化合物;2,2'-雙(2-氯苯基)-4,4’,5,5’-四苯基-1,2’-聯咪唑、2,2’-雙(2,4-二氯苯基)-4,4’,5,5’-四苯基-1,2’-聯咪唑、2,2’-雙(2,4,6-三氯苯基)-4,4’,5,5’-四苯基-1,2’-聯咪唑等聯咪唑系化合物;1,2-辛二酮、1-〔4-(苯硫基)-2-(O-苯甲醯肟)〕、乙酮(ethanone)、1-〔9-乙基-6-(2-甲基苯甲醯基)-9H-咔唑-3-基〕-1-(O-乙醯肟)等肟酯系化合物;雙(η5-2,4-環戊二烯-1-基)-雙(2,6-二氟-3-(1H-吡咯-1-基)-苯基)鈦等二茂鈦系化合物;對二甲基胺基安息香酸、對二乙基胺基安息香酸等安息香酸酯系化合物;9-苯基吖啶等吖啶系化合物等。光自由基聚合起始劑可以單獨使用一種,亦可以組合使用兩種以上。 光自由基聚合起始劑相對於聚合物P100質量份,例如以1~20質量份的量使用,較佳為以3~10質量份的量使用。 (Photopolymerization Initiator) Examples of the photopolymerization initiator used in the photosensitive resin composition of this embodiment include photoradical polymerization initiators. As the photoradical polymerization initiator, well-known compounds can be used, and examples thereof include 2,2-diethoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, and 1-hydroxyl acetophenone. Cyclohexyl phenyl ketone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1-[4-(2-hydroxyethoxy)phenyl]-2-hydroxy-2-methyl -1-Propan-1-one, 2-hydroxy-1-{4-[4-(2-hydroxy-2-methylpropyl)benzyl]phenyl}-2-methylpropan-1-one , 2-methyl-1-(4-methylthiophenyl)-2- Oxylinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4- Phylinophenyl)-butanone-1,2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4- Alkylphenone compounds such as pholinyl)phenyl]-1-butanone; benzophenone, 4,4'-bis(dimethylamino)benzophenone, 2-carboxydiphenyl Benzophenone compounds such as methyl ketone; benzoin compounds such as benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether and other benzoin compounds; 9-oxosulfide𠮿 (thioxanthone), 2-ethyl-9-oxanthone𠮿 , 2-isopropyl-9-oxosulfide𠮿 , 2-chloro-9-oxosulfide𠮿 2,4-Dimethyl-9-oxosulfide𠮿 , 2,4-diethyl-9-oxosulfide𠮿 Etc-9-oxysulfur𠮿 Compounds; 2-(4-methoxyphenyl)-4,6-bis(trichloromethyl)symmetric trichloromethyl, 2-(4-methoxynaphthyl)-4,6-bis(trichloromethyl) Methyl) symmetric tri𠯤, 2-(4-ethoxynaphthyl)-4,6-bis(trichloromethyl) symmetric tri𠯤, 2-(4-ethoxycarbonylnaphthyl)-4,6 - Bis (trichloromethyl) symmetric tris and other halomethylated tris compounds; 2-trichloromethyl-5-(2'-benzofuranyl)-1,3,4-diadiazole, 2-Trichloromethyl-5-[β-(2'-benzofuranyl)vinyl]-1,3,4-oxadiazole, 4-oxadiazole, 2-trichloromethyl-5- Furyl-1,3,4-ethadiazole and other halomethylated ethadiazole compounds; 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenyl -1,2'-biimidazole, 2,2'-bis(2,4-dichlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole, 2, 2'-bis(2,4,6-trichlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole and other biimidazole compounds; 1,2-octanediazole Ketone, 1-[4-(phenylthio)-2-(O-benzoyl oxime)], ethanone, 1-[9-ethyl-6-(2-methylbenzoyl oxime) )-9H-carbazol-3-yl]-1-(O-acetyl oxime) and other oxime ester compounds; bis(eta5-2,4-cyclopentadien-1-yl)-bis(2,6 - Titanium-based compounds such as difluoro-3-(1H-pyrrol-1-yl)-phenyl) titanium; benzoate compounds such as p-dimethylaminobenzoic acid and p-diethylaminobenzoic acid ; 9-phenylacridine and other acridine compounds, etc. One type of photoradical polymerization initiator may be used alone, or two or more types may be used in combination. The photoradical polymerization initiator is used in an amount of, for example, 1 to 20 parts by mass, preferably 3 to 10 parts by mass, based on 100 parts by mass of the polymer P.

本實施形態的感光性樹脂組成物藉由含有上述成分而在光刻處理中具有高靈敏度,並且具有優異的鹼溶解性。因此,感光性樹脂組成物在光刻法中具備優異的顯影性、優異的加工性。By containing the above components, the photosensitive resin composition of this embodiment has high sensitivity in photolithography processing and has excellent alkali solubility. Therefore, the photosensitive resin composition has excellent developability and excellent processability in photolithography.

(著色劑) 作為一態樣,感光性樹脂組成物可以含有著色劑。藉由含有著色劑,能夠較佳為用作液晶顯示裝置或固體攝像元件的濾色器的形成材料。作為著色劑,可以使用各種顏料或染料。 作為顏料,可以使用有機顏料或無機顏料。 (colorant) As one aspect, the photosensitive resin composition may contain a colorant. By containing a colorant, it can be suitably used as a forming material for a color filter of a liquid crystal display device or a solid-state imaging element. As the colorant, various pigments or dyes can be used. As the pigment, organic pigments or inorganic pigments can be used.

作為有機顏料,可以使用偶氮系顏料、酞青素系顏料、喹吖酮系顏料、苝系顏料、紫環酮(perinone)系顏料、異吲哚啉酮系顏料、異吲哚啉(isoindoline)系顏料、二㗁𠯤系顏料、硫靛(thioindigo)系顏料、蒽醌系顏料、喹啉黃系顏料、金屬錯合物系顏料、二酮吡咯并吡咯(diketo-pyrrolo-pyrrole)系顏料、𠮿(xanthene)系顏料、吡咯亞甲基(pyrromethene)系顏料、染料色澱系顏料等。As organic pigments, azo pigments, phthalocyanin pigments, quinacridone pigments, perylene pigments, perinone pigments, isoindolinone pigments, and isoindoline pigments can be used. ) pigments, dimethacin pigments, thioindigo pigments, anthraquinone pigments, quinoline yellow pigments, metal complex pigments, diketo-pyrrolo-pyrrole pigments ,𠮿 (xanthene) pigments, pyrromethene (pyrromethene) pigments, dye lake pigments, etc.

作為無機顏料,可以使用白色/體質顏料(氧化鈦、氧化鋅、硫化鋅、黏土、滑石、硫酸鋇、碳酸鈣等)、有色顏料(鉻黃、鎘系、鉻朱紅(chrome vermilion)、鎳鈦、鉻鈦、黃色氧化鐵、赤鐵氧化物(Bengala)、鉻酸鋅、鉛紅、群青、普魯士藍、鈷藍、鉻綠、氧化鉻、釩酸鉍等)、增亮材料顏料(珠光顏料、鋁顏料、青銅顏料等)、螢光顏料(硫化鋅、硫化鍶、鋁酸鍶等)。As inorganic pigments, white/extender pigments (titanium oxide, zinc oxide, zinc sulfide, clay, talc, barium sulfate, calcium carbonate, etc.), colored pigments (chrome yellow, cadmium series, chrome vermilion, nickel titanium) can be used , chromium titanium, yellow iron oxide, hematite oxide (Bengala), zinc chromate, lead red, ultramarine blue, Prussian blue, cobalt blue, chrome green, chromium oxide, bismuth vanadate, etc.), brightening material pigments (pearlescent pigments , aluminum pigments, bronze pigments, etc.), fluorescent pigments (zinc sulfide, strontium sulfide, strontium aluminate, etc.).

作為染料,例如可以使用日本特開2003-270428號公報或日本特開平9-171108號公報、日本特開2008-50599號公報等中所記載之公知的染料。 當感光性樹脂組成物含有著色劑時,感光性樹脂組成物可以僅含有一種著色劑,亦可以含有兩種以上。 As the dye, for example, known dyes described in Japanese Patent Application Laid-Open No. 2003-270428, Japanese Patent Application Laid-Open No. 9-171108, Japanese Patent Application Laid-Open No. 2008-50599, etc. can be used. When the photosensitive resin composition contains a colorant, the photosensitive resin composition may contain only one colorant, or may contain two or more colorants.

著色劑(尤其是顏料)根據目的或用途可以使用具有適當的平均粒徑者,當特別要求如濾色器那樣的透明性時,較佳為0.1μm以下的小的平均粒徑,此外,當需要塗料等的遮隱性時,較佳為0.5μm以上的大的平均粒徑。Colorants (especially pigments) having an appropriate average particle size can be used depending on the purpose or use. When transparency such as a color filter is particularly required, a small average particle size of 0.1 μm or less is preferred. In addition, when When hiding properties of coatings, etc. are required, a large average particle diameter of 0.5 μm or more is preferred.

著色劑根據目的或用途可以進行松脂處理、界面活性劑處理、樹脂系分散劑處理、顏料衍生物處理、氧化皮膜處理、二氧化矽塗層、蠟塗層等表面處理。The colorant can be subjected to surface treatment such as rosin treatment, surfactant treatment, resin dispersant treatment, pigment derivative treatment, oxide film treatment, silica coating, wax coating, etc., depending on the purpose or use.

當感光性樹脂組成物含有著色劑時,其量根據目的或用途適當設定即可,但從兼顧著色濃度和著色劑的分散穩定性等觀點而言,相對於感光性樹脂組成物的不揮發成分(除溶劑以外之成分)整體,較佳為3~70質量%,更佳為5~60質量%,進而較佳為10~50質量%。When the photosensitive resin composition contains a colorant, its amount can be appropriately set according to the purpose or use. However, from the viewpoint of balancing the coloring concentration and the dispersion stability of the colorant, relative to the non-volatile components of the photosensitive resin composition The total amount (components other than solvent) is preferably 3 to 70 mass %, more preferably 5 to 60 mass %, and still more preferably 10 to 50 mass %.

(界面活性劑) 本實施形態的感光性樹脂組成物可以含有界面活性劑,作為界面活性劑,較佳為非離子性界面活性劑。 (surfactant) The photosensitive resin composition of this embodiment may contain a surfactant, and the surfactant is preferably a nonionic surfactant.

藉由含有非離子性界面活性劑,將前述感光性樹脂組成物塗佈於基材上而獲得樹脂膜時的塗佈性變得良好,能夠獲得均勻厚度的塗佈膜。又,能夠防止對塗佈膜進行顯影時的殘渣或圖案浮起。By containing a nonionic surfactant, the coating property when applying the photosensitive resin composition to a base material to obtain a resin film becomes good, and a coating film with a uniform thickness can be obtained. Furthermore, it is possible to prevent residues and pattern floating during development of the coating film.

非離子性界面活性劑例如為含有氟基(例如,氟化烷基)或矽烷醇基之化合物或以矽氧烷鍵為主骨架之化合物。在本實施形態中,作為非離子性界面活性劑,更佳為使用含有氟系界面活性劑或聚矽氧系界面活性劑者,特佳為使用氟系界面活性劑。作為氟系界面活性劑,例如可以列舉DIC Corporation製造之MEGAFACE F-171、F-173、F-444、F-470、F-471、F-475、F-482、F-477、F-554、F-556及F-557、Sumitomo 3M Limited製造之Novec FC4430及FC4432等,但並不限定於該等。 作為使用界面活性劑時的界面活性劑的摻合量,相對於樹脂100質量份,較佳為0.01~10重量%。 Nonionic surfactants are, for example, compounds containing fluorine groups (eg, fluorinated alkyl groups) or silanol groups, or compounds with siloxane bonds as the main skeleton. In this embodiment, as the nonionic surfactant, one containing a fluorine-based surfactant or a polysiloxane-based surfactant is more preferably used, and a fluorine-based surfactant is particularly preferably used. Examples of fluorine-based surfactants include MEGAFACE F-171, F-173, F-444, F-470, F-471, F-475, F-482, F-477, and F-554 manufactured by DIC Corporation. , F-556 and F-557, Novec FC4430 and FC4432 manufactured by Sumitomo 3M Limited, etc., but are not limited to these. When using a surfactant, the blending amount of the surfactant is preferably 0.01 to 10% by weight based on 100 parts by mass of the resin.

(溶劑) 感光性樹脂組成物典型地可以含有溶劑。作為溶劑,可以較佳使用有機溶劑。具體而言,可以使用酮系溶劑、酯系溶劑、醚系溶劑、醇系溶劑、內酯系溶劑、碳酸酯系溶劑等中的一種或兩種以上。 (solvent) The photosensitive resin composition may typically contain a solvent. As a solvent, an organic solvent can be preferably used. Specifically, one or more of a ketone solvent, an ester solvent, an ether solvent, an alcohol solvent, a lactone solvent, a carbonate solvent, etc. can be used.

作為溶劑的例子,可以列舉丙二醇單甲醚(PGME)、丙二醇單甲醚乙酸酯(PGMEA)、乳酸乙酯、甲基異丁基甲醇(MIBC)、γ丁內酯(GBL)、N-甲基吡咯啶酮(NMP)、甲基正戊基酮(MAK)、二乙二醇單甲醚、二乙二醇二甲醚、二乙二醇甲基乙醚、環己酮或該等的混合物。 溶劑的使用量不受特別限定,以不揮發成分的濃度例如成為10~70質量%、較佳為成為15~60質量%之量使用。 Examples of the solvent include propylene glycol monomethyl ether (PGME), propylene glycol monomethyl ether acetate (PGMEA), ethyl lactate, methyl isobutyl carbinol (MIBC), gamma butyrolactone (GBL), N- Methylpyrrolidone (NMP), methyl n-amyl ketone (MAK), diethylene glycol monomethyl ether, diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, cyclohexanone or the like mixture. The usage amount of the solvent is not particularly limited, but it is used in an amount such that the concentration of the non-volatile component becomes, for example, 10 to 70 mass %, preferably 15 to 60 mass %.

(遮光劑) 本實施形態的樹脂組成物可以含有遮光劑。感光性樹脂組成物可以僅含有一種遮光劑,亦可以含有兩種以上。 (Sunscreen agent) The resin composition of this embodiment may contain a light-shielding agent. The photosensitive resin composition may contain only one type of light-blocking agent, or may contain two or more types.

當感光性樹脂組成物含有遮光劑時,其量根據目的或用途適當設定即可,但從兼顧遮光性能和遮光劑的分散穩定性等觀點而言,相對於感光性樹脂組成物的不揮發成分(除溶劑以外之成分)整體,較佳為3~70質量%,更佳為5~60質量%,進而較佳為10~50質量%。When the photosensitive resin composition contains a light-shielding agent, its amount can be appropriately set according to the purpose or use. However, from the viewpoint of balancing light-shielding performance and dispersion stability of the light-shielding agent, relative to the non-volatile components of the photosensitive resin composition The total amount (components other than solvent) is preferably 3 to 70 mass %, more preferably 5 to 60 mass %, and still more preferably 10 to 50 mass %.

(交聯劑) 本實施形態的感光性樹脂組成物可以含有交聯劑。 交聯劑只要為能夠藉由從光聚合起始劑產生之活性化學種的作用而使聚合物P交聯者(能夠與聚合物P進行化學鍵結者),則不受特別限定。 交聯劑並非僅與聚合物進行化學鍵結,亦可以在交聯劑彼此之間進行反應而形成鍵。 (cross-linking agent) The photosensitive resin composition of this embodiment may contain a crosslinking agent. The cross-linking agent is not particularly limited as long as it is one that can cross-link the polymer P by the action of active chemical species generated from the photopolymerization initiator (one that can chemically bond with the polymer P). The cross-linking agent does not only chemically bond with the polymer, but can also react with each other to form bonds.

交聯劑例如較佳為在一個分子中具有2個以上的聚合性雙鍵之多官能化合物,更佳為在一個分子中具有2個以上的(甲基)丙烯醯基之多官能(甲基)丙烯酸化合物(但是,交聯劑不對應於前述聚合物)。在均勻的硬化性、進一步提高靈敏度等觀點上,較佳為使用具有與聚合物所具有之交聯性基(聚合性雙鍵)相同種類的交聯性基之交聯劑。 交聯劑每一個分子的官能數量(聚合性雙鍵的數量)的上限沒有特別規定,例如為8以下,較佳為6以下。 The cross-linking agent is, for example, preferably a polyfunctional compound having two or more polymerizable double bonds in one molecule, and more preferably a polyfunctional (meth)acrylyl group having two or more (meth)acrylyl groups in one molecule. ) acrylic compound (however, the cross-linking agent does not correspond to the aforementioned polymer). From the viewpoint of uniform curability and further improvement in sensitivity, it is preferable to use a crosslinking agent having the same type of crosslinking group (polymerizable double bond) as the crosslinking group (polymerizable double bond) possessed by the polymer. The upper limit of the number of functions (number of polymerizable double bonds) per molecule of the cross-linking agent is not particularly defined, but is, for example, 8 or less, preferably 6 or less.

作為交聯劑,具體而言,可以列舉以下等:乙二醇二(甲基)丙烯酸酯、二乙二醇二(甲基)丙烯酸酯、聚乙二醇二(甲基)丙烯酸酯、丙二醇二(甲基)丙烯酸酯、丁二醇二(甲基)丙烯酸酯、己二醇二(甲基)丙烯酸酯、環己烷二甲醇二(甲基)丙烯酸酯、雙酚A環氧烷二(甲基)丙烯酸酯(bisphenol A alkylene oxide di(meth)acrylate)、雙酚F環氧烷二(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、二三羥甲基丙烷四(甲基)丙烯酸酯、丙三醇三(甲基)丙烯酸酯、新戊四醇四(甲基)丙烯酸酯、二新戊四醇五(甲基)丙烯酸酯、二新戊四醇六(甲基)丙烯酸酯、環氧乙烷加成三羥甲基丙烷三(甲基)丙烯酸酯、環氧乙烷加成二三羥甲基丙烷四(甲基)丙烯酸酯、環氧乙烷加成新戊四醇四(甲基)丙烯酸酯、環氧乙烷加成二新戊四醇六(甲基)丙烯酸酯、環氧丙烷加成三羥甲基丙烷三(甲基)丙烯酸酯、環氧丙烷加成二三羥甲基丙烷四(甲基)丙烯酸酯、環氧丙烷加成新戊四醇四(甲基)丙烯酸酯、環氧丙烷加成二新戊四醇六(甲基)丙烯酸酯、ε-己內酯加成三羥甲基丙烷三(甲基)丙烯酸酯、ε-己內酯加成二三羥甲基丙烷四(甲基)丙烯酸酯、ε-己內酯加成新戊四醇四(甲基)丙烯酸酯、ε-己內酯加成二新戊四醇六(甲基)丙烯酸酯等多官能(甲基)丙烯酸酯類; 乙二醇二乙烯基醚、二乙二醇二乙烯基醚、聚乙二醇二乙烯基醚、丙二醇二乙烯基醚、丁二醇二乙烯基醚、己二醇二乙烯基醚、雙酚A環氧烷二乙烯基醚、雙酚F環氧烷二乙烯基醚、三羥甲基丙烷三乙烯基醚、二三羥甲基丙烷四乙烯基醚、丙三醇三乙烯基醚、新戊四醇四乙烯基醚、二新戊四醇五乙烯基醚、二新戊四醇六乙烯基醚、環氧乙烷加成三羥甲基丙烷三乙烯基醚、環氧乙烷加成二三羥甲基丙烷四乙烯基醚、環氧乙烷加成新戊四醇四乙烯基醚、環氧乙烷加成二新戊四醇六乙烯基醚等多官能乙烯基醚類; (甲基)丙烯酸2-乙烯氧基乙酯(2-vinyloxyethyl (meth)acrylate)、(甲基)丙烯酸3-乙烯氧基丙酯、(甲基)丙烯酸1-甲基-2-乙烯氧基乙酯、(甲基)丙烯酸2-乙烯氧基丙酯、(甲基)丙烯酸4-乙烯氧基丁酯、(甲基)丙烯酸4-乙烯氧基環己酯、(甲基)丙烯酸5-乙烯氧基戊酯、(甲基)丙烯酸6-乙烯氧基己酯、(甲基)丙烯酸4-乙烯氧基甲基環己基甲酯、(甲基)丙烯酸對乙烯氧基甲基苯基甲酯、(甲基)丙烯酸2-(乙烯氧基乙氧基)乙酯、(甲基)丙烯酸2-(乙烯氧基乙氧基乙氧基乙氧基)乙酯等含有乙烯基醚基之(甲基)丙烯酸酯類; 乙二醇二烯丙基醚、二乙二醇二烯丙基醚、聚乙二醇二烯丙基醚、丙二醇二烯丙基醚、丁二醇二烯丙基醚、己二醇二烯丙基醚、雙酚A環氧烷二烯丙基醚、雙酚F環氧烷二烯丙基醚、三羥甲基丙烷三烯丙基醚、二三羥甲基丙烷四烯丙基醚、丙三醇三烯丙基醚、新戊四醇四烯丙基醚、二新戊四醇五烯丙基醚、二新戊四醇六烯丙基醚、環氧乙烷加成三羥甲基丙烷三烯丙基醚、環氧乙烷加成二三羥甲基丙烷四烯丙基醚、環氧乙烷加成新戊四醇四烯丙基醚、環氧乙烷加成二新戊四醇六烯丙基醚等多官能烯丙基醚類; (甲基)丙烯酸烯丙酯等含有烯丙基之(甲基)丙烯酸酯類; 三(丙烯醯氧乙基)三聚異氰酸酯、三(甲基丙烯醯氧乙基)三聚異氰酸酯、氧化烯加成三(丙烯醯氧乙基)三聚異氰酸酯、氧化烯加成三(甲基丙烯醯氧乙基)三聚異氰酸酯等含有多官能(甲基)丙烯醯基之三聚異氰酸酯類; 三烯丙基三聚異氰酸酯等含有多官能烯丙基之三聚異氰酸酯類; 藉由甲伸苯基二異氰酸酯、異佛酮二異氰酸酯、伸茬基二異氰酸酯等多官能異氰酸酯與(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯等含有羥基之(甲基)丙烯酸酯類的反應而獲得之多官能胺酯(甲基)丙烯酸酯類; 二乙烯基苯等多官能芳香族乙烯基類。 Specific examples of the crosslinking agent include the following: ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, and propylene glycol. Di(meth)acrylate, butylene glycol di(meth)acrylate, hexylene glycol di(meth)acrylate, cyclohexanedimethanol di(meth)acrylate, bisphenol A epoxide di (meth)acrylate (bisphenol A alkylene oxide di(meth)acrylate), bisphenol F alkylene oxide di(meth)acrylate, trimethylolpropane tri(meth)acrylate, ditrimethylol Propane tetra(meth)acrylate, glycerol tri(meth)acrylate, neopentylerythritol tetra(meth)acrylate, dineopenterythritol penta(meth)acrylate, dineopenterythritol Hexa(meth)acrylate, ethylene oxide plus trimethylolpropane tri(meth)acrylate, ethylene oxide plus ditrimethylolpropane tetra(meth)acrylate, ethylene oxide Alkane addition to neopenterythritol tetra(meth)acrylate, ethylene oxide addition to dineopenterythritol hexa(meth)acrylate, propylene oxide addition to trimethylolpropane tri(meth)acrylic acid Ester, propylene oxide added to ditrimethylolpropane tetra(meth)acrylate, propylene oxide added to neopentylerythritol tetra(meth)acrylate, propylene oxide added to dineopenterythritol hexa(meth)acrylate Meth)acrylate, ε-caprolactone added to trimethylolpropane tri(meth)acrylate, ε-caprolactone added to ditrimethylolpropane tetra(meth)acrylate, ε-hexanoic acid Polyfunctional (meth)acrylates such as lactone addition to neopenterythritol tetra(meth)acrylate and ε-caprolactone addition to dipenterythritol hexa(meth)acrylate; Ethylene glycol divinyl ether, diethylene glycol divinyl ether, polyethylene glycol divinyl ether, propylene glycol divinyl ether, butylene glycol divinyl ether, hexylene glycol divinyl ether, bisphenol A Alkylene oxide divinyl ether, Bisphenol F Alkylene oxide divinyl ether, Trimethylolpropane trivinyl ether, Ditrimethylolpropane tetravinyl ether, Glycerol trivinyl ether, New Pentaerythritol tetravinyl ether, dineopenterythritol pentavinyl ether, dineopenterythritol hexavinyl ether, ethylene oxide addition trimethylolpropane trivinyl ether, ethylene oxide addition Multifunctional vinyl ethers such as ditrimethylolpropane tetravinyl ether, ethylene oxide added to neopentyl erythritol tetravinyl ether, ethylene oxide added to dineopenterythritol hexavinyl ether; 2-vinyloxyethyl (meth)acrylate, 3-vinyloxypropyl (meth)acrylate, 1-methyl-2-vinyloxy (meth)acrylate Ethyl ester, 2-vinyloxypropyl (meth)acrylate, 4-vinyloxybutyl (meth)acrylate, 4-vinyloxycyclohexyl (meth)acrylate, 5-(meth)acrylate Ethyleneoxypentyl ester, 6-vinyloxyhexyl (meth)acrylate, 4-vinyloxymethylcyclohexylmethyl (meth)acrylate, p-ethyleneoxymethylphenylmethyl (meth)acrylate Ester, 2-(vinyloxyethoxy)ethyl (meth)acrylate, 2-(vinyloxyethoxyethoxyethoxy)ethyl (meth)acrylate, etc. containing vinyl ether groups (meth)acrylates; Ethylene glycol diallyl ether, diethylene glycol diallyl ether, polyethylene glycol diallyl ether, propylene glycol diallyl ether, butylene glycol diallyl ether, hexylene glycol diene Propyl ether, bisphenol A alkylene oxide diallyl ether, bisphenol F alkylene oxide diallyl ether, trimethylolpropane triallyl ether, ditrimethylolpropane tetraallyl ether , Glycerol triallyl ether, neopentylerythritol tetraallyl ether, dineopenterythritol pentaallyl ether, dineopenterythritol hexaallyl ether, ethylene oxide added to trihydroxy Methylpropane triallyl ether, ethylene oxide addition to ditrimethylolpropane tetraallyl ether, ethylene oxide addition to neopentaerythritol tetraallyl ether, ethylene oxide addition to di Polyfunctional allyl ethers such as neopentylerythritol hexaallyl ether; Allyl (meth)acrylate and other allyl-containing (meth)acrylates; Tris(acryloxyethyl) isocyanate, tris(methacryloyloxyethyl) isocyanate, alkylene oxide added to tris(acryloxyethyl) isocyanate, alkylene oxide added to tris(methyl) Acryloxyethyl) isocyanate and other polyisocyanates containing polyfunctional (meth)acrylyl groups; Triallyl isocyanate and other cyanuric isocyanates containing multifunctional allyl groups; By using polyfunctional isocyanates such as toxinyl diisocyanate, isophorone diisocyanate, and styryldiisocyanate, and 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, etc. Multifunctional amine ester (meth)acrylates obtained by the reaction of (meth)acrylates; Polyfunctional aromatic vinyls such as divinylbenzene.

其中,較佳為三羥甲基丙烷三(甲基)丙烯酸酯、新戊四醇三(甲基)丙烯酸酯等三官能(甲基)丙烯酸酯、新戊四醇四(甲基)丙烯酸酯、二三羥甲基丙烷四(甲基)丙烯酸酯等四官能(甲基)丙烯酸酯、二新戊四醇六(甲基)丙烯酸酯等六官能(甲基)丙烯酸酯。Among them, preferred are trifunctional (meth)acrylates such as trimethylolpropane tri(meth)acrylate, neopentylerythritol tri(meth)acrylate, and neopentylerythritol tetra(meth)acrylate. , tetrafunctional (meth)acrylates such as ditrimethylolpropane tetra(meth)acrylate, and hexafunctional (meth)acrylates such as dineopenterythritol hexa(meth)acrylate.

當感光性樹脂組成物含有交聯劑時,感光性樹脂組成物可以僅含有一種交聯劑,亦可以含有兩種以上。當感光性樹脂組成物含有交聯劑時,其量根據目的或用途適當設定即可。作為一例,交聯劑的量相對於感光性樹脂組成物100質量份,通常為30~70質量份,較佳為可以設為40~60質量份左右。When the photosensitive resin composition contains a cross-linking agent, the photosensitive resin composition may contain only one type of cross-linking agent, or may contain two or more types of cross-linking agents. When the photosensitive resin composition contains a crosslinking agent, its amount may be appropriately set according to the purpose or use. As an example, the amount of the crosslinking agent is usually 30 to 70 parts by mass, and preferably about 40 to 60 parts by mass relative to 100 parts by mass of the photosensitive resin composition.

(其他添加劑) 感光性樹脂組成物根據各種目的或要求特性可以含有填料、上述聚合物以外的黏合劑樹脂、酸產生劑、耐熱改進劑、顯影助劑、塑化劑、聚合抑制劑、紫外線吸收劑、抗氧化劑、消光劑、消泡劑、調平劑、抗靜電劑、分散劑、滑劑(slip agent)、表面改質劑、觸變劑、觸變助劑、矽烷偶合劑、多價酚化合物等成分。 (Other additives) The photosensitive resin composition may contain fillers, binder resins other than the above-mentioned polymers, acid generators, heat resistance improvers, development aids, plasticizers, polymerization inhibitors, ultraviolet absorbers, and antioxidants depending on various purposes or required characteristics. , matting agent, defoaming agent, leveling agent, antistatic agent, dispersant, slip agent, surface modifier, thixotropic agent, thixotropic additive, silane coupling agent, polyvalent phenol compound and other ingredients .

[用途] 藉由使用上述感光性樹脂組成物來形成膜,並對該膜進行曝光/顯影而形成圖案,能夠獲得帶有圖案之薄膜。該薄膜適用於濾色器或黑色矩陣等。亦即,藉由使用含有著色劑之感光性樹脂組成物來形成圖案,能夠獲得濾色器。又,藉由使用含有遮光劑之感光性樹脂組成物來形成圖案,能夠獲得黑色矩陣。然後,能夠製造具備濾色器或黑色矩陣之液晶顯示裝置或固體攝像元件。 對形成圖案之典型的程序進行說明。 [use] A patterned film can be obtained by forming a film using the photosensitive resin composition and exposing/developing the film to form a pattern. This film is suitable for color filters or black matrices, etc. That is, a color filter can be obtained by forming a pattern using a photosensitive resin composition containing a colorant. Furthermore, a black matrix can be obtained by forming a pattern using a photosensitive resin composition containing a light-shielding agent. Then, a liquid crystal display device or a solid-state imaging device including a color filter or a black matrix can be manufactured. A typical procedure for forming patterns is explained.

(感光性樹脂膜的形成) 例如,將上述感光性樹脂組成物塗佈於任意的基板上,並根據需要進行乾燥,藉此,首先獲得感光性樹脂膜。 (Formation of photosensitive resin film) For example, a photosensitive resin film is first obtained by applying the above-mentioned photosensitive resin composition on an arbitrary substrate and drying it as necessary.

塗佈組成物之基板不受特別限定。例如,可以列舉玻璃基板、矽晶圓、陶瓷基板、鋁基板、SiC晶圓、GaN晶圓、覆銅積層板等。 基板可以為未加工的基板,亦可以為表面形成有電極或元件之基板。為了提高接著性,可以進行表面處理。 The substrate on which the composition is coated is not particularly limited. Examples include glass substrates, silicon wafers, ceramic substrates, aluminum substrates, SiC wafers, GaN wafers, copper-clad laminates, and the like. The substrate may be an unprocessed substrate or a substrate with electrodes or components formed on the surface. In order to improve the adhesion, surface treatment can be performed.

感光性樹脂組成物的塗佈方法不受特別限定。能夠藉由使用旋塗器之旋塗、使用噴塗器之噴霧塗佈、浸漬、印刷、輥塗、噴墨法等來進行。The coating method of the photosensitive resin composition is not particularly limited. It can be performed by spin coating using a spin coater, spray coating using a spray coater, dipping, printing, roller coating, inkjet method, etc.

塗佈於基板上之感光性樹脂組成物的乾燥典型地藉由用加熱板、熱風、烘箱等加熱處理來進行。加熱溫度通常為80~140℃,較佳為90~120℃。又,加熱時間通常為30~600秒,較佳為30~300秒左右。Drying of the photosensitive resin composition applied on the substrate is typically performed by heat treatment using a hot plate, hot air, oven, or the like. The heating temperature is usually 80 to 140°C, preferably 90 to 120°C. Moreover, the heating time is usually 30 to 600 seconds, preferably about 30 to 300 seconds.

感光性樹脂膜的膜厚不受特別限定,根據最終欲獲得之圖案適當調整即可,通常為0.5~10μm,較佳為1~5μm。再者,膜厚能夠根據感光性樹脂組成物中的溶劑的含量或塗佈方法等來調整。The film thickness of the photosensitive resin film is not particularly limited and can be appropriately adjusted according to the final pattern to be obtained. It is usually 0.5 to 10 μm, preferably 1 to 5 μm. In addition, the film thickness can be adjusted according to the content of the solvent in the photosensitive resin composition, the coating method, etc.

(曝光) 曝光典型地藉由介隔適當的光罩將活性光線照射到感光性樹脂膜來進行。 (exposure) Exposure is typically performed by irradiating active light onto the photosensitive resin film through an appropriate mask.

作為活性光線,例如可以列舉X射線、電子束、紫外線、可見光線等。若以波長而言,則較佳為200~500nm的光。在圖案的解析度或操作性的觀點上,光源較佳為汞燈的g射線、h射線或i射線,特佳為i射線。又,亦可以將兩種以上的光線混合使用。作為曝光裝置,較佳為接觸對準器、鏡面投影對準器(mirror projection aligner)或步進機。 曝光的光量根據感光性樹脂膜中的感光劑的量等適當調整即可,例如為100~500mJ/cm 2左右。 Examples of active rays include X-rays, electron beams, ultraviolet rays, visible rays, and the like. In terms of wavelength, light of 200 to 500 nm is preferred. From the viewpoint of pattern resolution or operability, the light source is preferably g-rays, h-rays or i-rays of a mercury lamp, and particularly preferably i-rays. In addition, two or more types of light may be mixed and used. As the exposure device, a contact aligner, a mirror projection aligner or a stepper is preferred. The amount of exposure light can be appropriately adjusted according to the amount of photosensitive agent in the photosensitive resin film, and is, for example, about 100 to 500 mJ/cm 2 .

再者,在曝光之後,根據需要可以再度加熱感光性樹脂膜(曝光後加熱:Post Exposure Bake)。其溫度例如為70~150℃,較佳為90~120℃。又,時間例如為30~600秒,較佳為30~300秒。藉由進行曝光後加熱,促進從光自由基聚合起始劑產生之自由基所致之反應,進一步促進硬化反應。Furthermore, after exposure, the photosensitive resin film can be heated again if necessary (post-exposure heating: Post Exposure Bake). The temperature is, for example, 70 to 150°C, preferably 90 to 120°C. Moreover, the time is, for example, 30 to 600 seconds, preferably 30 to 300 seconds. By heating after exposure, the reaction caused by the free radicals generated from the photoradical polymerization initiator is promoted, and the hardening reaction is further promoted.

(顯影) 藉由利用適當的顯影液對經曝光之感光性樹脂膜進行顯影,能夠獲得圖案,又,能夠製造具備圖案之基板。 由於由含有本實施形態的聚合物溶液之感光性樹脂組成物構成之感光性樹脂膜對基板之密接性優異,因此在顯影步驟中可抑制圖案的剝離。 (Develop) By developing the exposed photosensitive resin film with an appropriate developer, a pattern can be obtained, and a substrate having a pattern can be manufactured. Since the photosensitive resin film composed of the photosensitive resin composition containing the polymer solution of this embodiment has excellent adhesion to the substrate, peeling of the pattern can be suppressed during the development step.

在顯影步驟中,可以使用適當的顯影液並使用例如浸漬法、旋覆浸沒法(puddle method)、旋轉噴塗法等方法來進行顯影。藉由顯影,感光性樹脂膜的曝光部(正型的情況)或未曝光部(負型的情況)被溶出去除而獲得圖案。 可以使用之顯影液不受特別限定。例如,可以使用鹼水溶液或有機溶劑。 In the development step, an appropriate developer may be used and development may be performed using a method such as a dipping method, a puddle method, a spin spray method, or the like. By development, the exposed part (in the case of positive type) or the unexposed part (in the case of negative type) of the photosensitive resin film is elute-removed, and a pattern is obtained. The developer that can be used is not particularly limited. For example, an alkali aqueous solution or an organic solvent can be used.

作為鹼水溶液,具體而言,可以列舉(i)氫氧化鈉、碳酸鈉、矽酸鈉、氨等無機鹼水溶液、(ii)乙胺、二乙胺、三乙胺、三乙醇胺等有機胺水溶液、(iii)氫氧化四甲銨、氫氧化四丁銨等四級銨鹽的水溶液等。 本實施形態的聚合物由於可調整鹼溶性且靈敏度優異,因此當使用TMAH(氫氧化四甲銨)溶液等強鹼性顯影液時,能夠將曝光、顯影後的圖案設為如設計那樣的形狀。 Specific examples of the alkali aqueous solution include (i) inorganic alkali aqueous solutions such as sodium hydroxide, sodium carbonate, sodium silicate, and ammonia, and (ii) organic amine aqueous solutions such as ethylamine, diethylamine, triethylamine, and triethanolamine. , (iii) Aqueous solutions of quaternary ammonium salts such as tetramethylammonium hydroxide and tetrabutylammonium hydroxide. Since the polymer of this embodiment can adjust its alkali solubility and has excellent sensitivity, when a strong alkaline developer such as TMAH (tetramethylammonium hydroxide) solution is used, the pattern after exposure and development can be made into a designed shape. .

作為有機溶劑,具體而言,可以列舉環戊酮等酮系溶劑、丙二醇單甲醚乙酸酯(PGMEA)或乙酸丁酯等酯系溶劑、丙二醇單甲醚等醚系溶劑等。 顯影液中例如可以添加甲醇、乙醇等水溶性有機溶劑或界面活性劑等。 Specific examples of the organic solvent include ketone solvents such as cyclopentanone, ester solvents such as propylene glycol monomethyl ether acetate (PGMEA) and butyl acetate, and ether solvents such as propylene glycol monomethyl ether. For example, water-soluble organic solvents such as methanol and ethanol or surfactants may be added to the developer.

在本實施形態中,作為顯影液,較佳為使用鹼水溶液,更佳為使用氫氧化四甲銨、碳酸鈉水溶液或氫氧化鉀水溶液。 鹼水溶液的濃度較佳為0.01~10質量%,進而較佳為0.5~5質量%。 藉由以上步驟,能夠獲得圖案/能夠製造具備圖案之基板,但在顯影之後可以進行各種處理。 In this embodiment, as the developer, an alkali aqueous solution is preferably used, and tetramethylammonium hydroxide, a sodium carbonate aqueous solution, or a potassium hydroxide aqueous solution is more preferably used. The concentration of the aqueous alkali solution is preferably 0.01 to 10% by mass, more preferably 0.5 to 5% by mass. Through the above steps, a pattern can be obtained/a substrate having a pattern can be manufactured, but various processes can be performed after development.

例如,在顯影之後,可以利用沖洗液對圖案及基板進行洗淨。作為沖洗液,例如可以列舉蒸餾水、甲醇、乙醇、異丙醇、丙二醇單甲醚等。該等可以單獨使用一種,亦可以組合使用兩種以上。For example, after development, the pattern and substrate can be cleaned with a rinse solution. Examples of the rinse liquid include distilled water, methanol, ethanol, isopropyl alcohol, propylene glycol monomethyl ether, and the like. One type of these may be used alone, or two or more types may be used in combination.

又,可以對所獲得之圖案進行加熱而使其充分硬化。加熱溫度典型為150~400℃,較佳為160~300℃,更佳為200~250℃。加熱時間不受特別限定,例如在15~300分鐘的範圍內。該加熱處理可以利用加熱板、烘箱、能夠設定溫度程式之升溫式烘箱等來進行。作為進行加熱處理時的環境氣體,可以為空氣,亦可以為氮、氬等非活性氣體。又,可以在減壓下進行加熱。 針對具備濾色器及/或黑色矩陣之液晶顯示裝置及/或固體攝像元件的結構的一例,示意性地示於圖1。再者,可以將黑色矩陣作為黑堤,以下,針對具備濾色器及黑色矩陣之液晶顯示裝置及/或固體攝像元件進行說明。 Moreover, the obtained pattern can be heated and fully hardened. The heating temperature is typically 150 to 400°C, preferably 160 to 300°C, and more preferably 200 to 250°C. The heating time is not particularly limited, but is, for example, in the range of 15 to 300 minutes. This heating treatment can be performed using a heating plate, an oven, a temperature-raising oven capable of setting a temperature program, etc. The ambient gas during the heat treatment may be air or inert gas such as nitrogen or argon. Alternatively, heating may be performed under reduced pressure. An example of the structure of a liquid crystal display device and/or a solid-state imaging element including a color filter and/or a black matrix is schematically shown in FIG. 1 . In addition, a black matrix can be used as a black bank. The following description will be made on a liquid crystal display device and/or a solid-state imaging element including a color filter and a black matrix.

在基板10上形成有黑色矩陣11和濾色器12。又,在該黑色矩陣11和濾色器12的上部設置有保護膜13及透明電極層14。A black matrix 11 and a color filter 12 are formed on the substrate 10 . Furthermore, a protective film 13 and a transparent electrode layer 14 are provided above the black matrix 11 and the color filter 12 .

基板10通常由光通過之材料構成,例如除了由玻璃構成以外,亦由聚酯、聚碳酸酯、聚烯烴、聚碸、環狀烯烴的聚合物等構成。基板10根據需要可以實施電暈放電處理、臭氧處理、藥液處理等。 基板10較佳為由玻璃構成。 黑色矩陣11例如由含有遮光劑之感光性樹脂組成物的硬化物構成。 The substrate 10 is usually made of a material through which light can pass. For example, in addition to glass, it may also be made of polyester, polycarbonate, polyolefin, polystyrene, cyclic olefin polymer, and the like. The substrate 10 may be subjected to corona discharge treatment, ozone treatment, chemical solution treatment, etc. as necessary. The substrate 10 is preferably made of glass. The black matrix 11 is made of, for example, a cured product of a photosensitive resin composition containing a light-shielding agent.

作為濾色器12,通常存在有紅色、綠色、藍色這三種顏色。濾色器12由含有與各顏色相對應之著色劑之感光性樹脂組成物的硬化物構成。As the color filter 12, there are usually three colors: red, green, and blue. The color filter 12 is composed of a cured product of a photosensitive resin composition containing a colorant corresponding to each color.

以上,針對本發明的實施形態進行了敘述,但該等為本發明的例示,亦能夠採用上述以外的各種構成。 實施例 The embodiments of the present invention have been described above. However, these are examples of the present invention, and various configurations other than those described above can also be adopted. Example

以下,利用實施例及比較例對本發明進行說明,但本發明並不限定於該等。Hereinafter, the present invention will be described using Examples and Comparative Examples, but the present invention is not limited to these.

針對實施例中的使用化合物,有時以以下縮寫或商品名表示。 ·MAN:順丁烯二酸酐 ·NB:2-降莰烯 ·FADB:反丁烯二酸二丁酯 ·FADE:反丁烯二酸二乙酯 ·FABEH:反丁烯二酸二雙(2-乙基己酯) ·MADB:順丁烯二酸二丁酯 ·PhMI:N-苯基順丁烯二醯亞胺 ·MEK:甲基乙基酮 ·GMA:甲基丙烯酸環氧丙酯 ·PEMP:新戊四醇四(3-巰基丙酸酯),上述式(s-2)的含硫醇基化合物(SC Organic Chemical Co.,Ltd.製造) ·4-HBA:丙烯酸4-羥基丁酯 ·A-TMM-3LM-N:以下兩種化合物的混合物,藉由氣相層析儀測量之混合物中的左側化合物的量為約57%(Shin-Nakamura Chemical Co.,Ltd.製造) The compounds used in the examples may be represented by the following abbreviations or trade names. ·MAN: Maleic anhydride ·NB: 2-norbornene ·FADB: dibutyl fumarate ·FADE: diethyl fumarate ·FABEH: Fumarate bis(2-ethylhexyl) ·MADB: dibutyl maleate ·PhMI: N-phenylmaleimide ·MEK: Methyl Ethyl Ketone ·GMA: Glycidyl methacrylate ·PEMP: Neopentaerythritol tetrakis (3-mercaptopropionate), a thiol group-containing compound of the above formula (s-2) (manufactured by SC Organic Chemical Co., Ltd.) ·4-HBA: 4-hydroxybutyl acrylate ·A-TMM-3LM-N: A mixture of the following two compounds, the amount of the compound on the left in the mixture measured by gas chromatography is approximately 57% (manufactured by Shin-Nakamura Chemical Co., Ltd.)

<原料聚合物的合成> (原料聚合物1的合成) 向具備攪拌機及冷卻管及滴液漏斗之反應容器內加入2-降莰烯的75%甲苯溶液602.56g(2-降莰烯換算451.92g,4.8mol)、順丁烯二酸酐(MAN,470.69g,4.8mol)及甲基乙基酮(MEK)2281.74g,並進行了攪拌/溶解。接著,藉由氮氣鼓泡去除體系內的溶氧之後升溫,在內溫達到80℃之時刻,耗時1小時添加了將2,2’-偶氮雙異丁酸二甲酯(Wako Pure Chemical Industries, Ltd.製造,商品名:V-601,44.21g,0.19mol)及PEMP(93.82g,0.19mol)溶解於MEK193.4g而成之溶液。其後,進一步在80℃反應了7小時。接著,將反應混合物冷卻至室溫。將上述中所獲得之聚合溶液滴加到甲醇3686.4g中,藉此使白色固體沉澱。將所獲得之白色固體進一步用甲醇3686.4g進行洗淨之後,在溫度120℃進行真空乾燥,藉此獲得了具備來自於2-降莰烯之結構單元和來自於順丁烯二酸酐之結構單元之聚合物(原料聚合物1)910.1g。 使用凝膠滲透層析(GPC)對所獲得之聚合物原料1進行了測量,其結果,重量平均分子量Mw為3,500,多分散性(重量平均分子量Mw)/(數平均分子量Mn)為1.62。 <Synthesis of raw material polymer> (Synthesis of raw material polymer 1) Add 602.56g of 75% toluene solution of 2-norbornene (converted to 2-norbornene, 451.92g, 4.8mol) and maleic anhydride (MAN, 470.69) into a reaction vessel equipped with a stirrer, cooling tube and dropping funnel. g, 4.8 mol) and 2281.74 g of methyl ethyl ketone (MEK), and stirred/dissolved. Next, the dissolved oxygen in the system was removed by bubbling nitrogen, and then the temperature was raised. When the internal temperature reached 80°C, 2,2'-azobisisobutyric acid dimethyl ester (Wako Pure Chemical) was added over an hour. Manufactured by Industries, Ltd., trade name: V-601, 44.21g, 0.19mol) and PEMP (93.82g, 0.19mol) dissolved in MEK193.4g. Thereafter, the reaction was further carried out at 80° C. for 7 hours. Next, the reaction mixture was cooled to room temperature. The polymerization solution obtained above was added dropwise to 3686.4 g of methanol to precipitate a white solid. The obtained white solid was further washed with 3686.4 g of methanol, and then vacuum dried at a temperature of 120° C., thereby obtaining a structural unit derived from 2-norbornene and a structural unit derived from maleic anhydride. The polymer (raw material polymer 1) 910.1g. The obtained polymer raw material 1 was measured using gel permeation chromatography (GPC). As a result, the weight average molecular weight Mw was 3,500, and the polydispersity (weight average molecular weight Mw)/(number average molecular weight Mn) was 1.62.

(原料聚合物1中所含有之硫醚結構的確認) 藉由化學式所表示之PEMP單體的 13C-NMR測量,在19.0ppm附近確認到來自於碳a之峰a,在62.0ppm附近確認到來自於碳b之峰b。 (Confirmation of the thioether structure contained in the raw material polymer 1) By 13 C-NMR measurement of the PEMP monomer represented by the chemical formula, peak a derived from carbon a was confirmed at around 19.0 ppm and around 62.0 ppm. To peak b from carbon b.

在使用PEMP來合成之原料聚合物1的 13C-NMR測量中,在62.0ppm附近確認到來自於碳b之峰b的出現。在反應溶液的GPC測量中,未觀察到PEMP單體的峰,且未殘留有未反應的PEMP,據此確認到PEMP被吸入到原料聚合物1中。 In the 13 C-NMR measurement of the raw material polymer 1 synthesized using PEMP, the appearance of peak b derived from carbon b was confirmed around 62.0 ppm. In the GPC measurement of the reaction solution, no peak of the PEMP monomer was observed, and unreacted PEMP did not remain. This confirmed that PEMP was absorbed into the raw material polymer 1.

又,在原料聚合物1的 13C-NMR測量中,沒有確認到來自於碳a之峰a,取而代之,在28ppm附近出現了與硫醚(R-S-R')相對應之峰c。該峰c的積分值為峰b的積分值的大致2倍,因此原料聚合物1具備如下所述之具有硫醚基之骨架,而硫醇基已消失。 Furthermore, in the 13 C-NMR measurement of the raw material polymer 1, the peak a derived from the carbon a was not confirmed, and instead, the peak c corresponding to the thioether (RS-R') appeared near 28 ppm. The integrated value of peak c is approximately twice the integrated value of peak b. Therefore, the base polymer 1 has a skeleton having a thioether group as described below, and the thiol group has disappeared.

13C-NMR測量的條件如下。 (試驗條件)測量樣品係向秤量之試樣中加入測量溶劑而調整濃度之後,將規定分量注入到NMR測量用試樣管來製作。 ·測量裝置:JEOL Ltd.的JNM-ECA400超傳導FT-NMR裝置 ·共振頻率:100.53MHz ·測量核: 13C ·測量法:NNE測量(反閘控去耦合法(Inverse Gate Decoupling Method)) ·脈衝寬度:3.83μsec ·脈衝重複等待時間:30s ·累計次數:4096次 ·測量溫度:室溫 ·測量溶劑:DMSO-d 6(氘化二甲基亞碸) ·試樣濃度:20%(w/v) 藉由利用燒瓶燃燒、離子層析法之元素分析來確認所獲得之聚合物中的硫量,確認到在聚合物中存在硫元素。又,在滴加甲醇之前的反應溶液的GPC測量中,亦確認到來自於PEMP之峰已消失,PEMP被吸入到原料聚合物1中。 The conditions for 13 C-NMR measurement are as follows. (Test conditions) A measurement sample is prepared by adding a measurement solvent to a weighed sample to adjust the concentration, and then injecting a prescribed amount into a sample tube for NMR measurement. ·Measurement device: JNM-ECA400 superconducting FT-NMR device of JEOL Ltd. ·Resonance frequency: 100.53MHz ·Measurement core: 13 C ·Measurement method: NNE measurement (Inverse Gate Decoupling Method) · Pulse width: 3.83μsec ·Pulse repetition waiting time: 30s ·Cumulative number of times: 4096 times ·Measurement temperature: room temperature ·Measurement solvent: DMSO-d 6 (deuterated dimethyl sulfoxide) ·Sample concentration: 20% (w /v) The amount of sulfur in the obtained polymer was confirmed by elemental analysis using flask combustion and ion chromatography, and the presence of sulfur element in the polymer was confirmed. In addition, GPC measurement of the reaction solution before methanol was added dropwise also confirmed that the peak derived from PEMP disappeared and PEMP was absorbed into the raw material polymer 1.

進行了元素分析,其結果、原料聚合物1中的硫含量為2.4wt%。Elemental analysis was performed, and the result was that the sulfur content in the raw material polymer 1 was 2.4 wt%.

(原料聚合物2的合成) 向具備攪拌機及冷卻管及滴液漏斗之反應容器內加入2-降莰烯的75%甲苯溶液602.56g(NB換算451.92g,4.8mol)、順丁烯二酸酐(MA,470.69g,4.8mol)及甲基乙基酮(MEK)2238.50g,並進行了攪拌/溶解。接著,藉由氮氣鼓泡(bubbling)去除體系內的溶氧之後升溫,在內溫達到80℃之時刻,耗時1小時添加了將2,2’-偶氮雙異丁酸二甲酯(Wako Pure Chemical Industries, Ltd.製造,商品名:V-601,44.21g,0.19mol)及新戊四醇四(3-巰基丙酸酯)(PEMP,140.73g,0.29mol)溶解於MEK189.74g而成之溶液。其後,進一步在80℃反應了7小時。接著,將反應混合物冷卻至室溫。將上述中所獲得之聚合溶液滴加到甲醇3686.4g中,藉此使白色固體沉澱。將所獲得之白色固體進一步用甲醇3686.4g進行洗淨之後,在溫度120℃進行真空乾燥,藉此獲得了具備來自於2-降莰烯之結構單元和來自於順丁烯二酸酐之結構單元之聚合物(原料聚合物2)908.1g。 使用凝膠滲透層析(GPC)對所獲得之聚合物原料2進行了測量,其結果,重量平均分子量Mw為2,700,多分散性(重量平均分子量Mw)/(數平均分子量Mn)為1.57。 (Synthesis of raw material polymer 2) Add 602.56g of 75% toluene solution of 2-norbornene (451.92g as NB, 4.8mol) and maleic anhydride (MA, 470.69g, 4.8mol) into a reaction vessel equipped with a stirrer, cooling tube and dropping funnel. ) and 2238.50g of methyl ethyl ketone (MEK), and stirred/dissolved. Next, the dissolved oxygen in the system was removed by bubbling nitrogen, and then the temperature was raised. When the internal temperature reached 80°C, 2,2'-azobisisobutyric acid dimethyl ester (dimethyl azobisisobutyrate) was added over 1 hour. Manufactured by Wako Pure Chemical Industries, Ltd., trade name: V-601, 44.21g, 0.19mol) and neopentylerythritol tetrakis(3-mercaptopropionate) (PEMP, 140.73g, 0.29mol) dissolved in MEK189.74g The resulting solution. Thereafter, the reaction was further carried out at 80° C. for 7 hours. Next, the reaction mixture was cooled to room temperature. The polymerization solution obtained above was added dropwise to 3686.4 g of methanol to precipitate a white solid. The obtained white solid was further washed with 3686.4 g of methanol, and then vacuum dried at a temperature of 120° C., thereby obtaining a structural unit derived from 2-norbornene and a structural unit derived from maleic anhydride. The polymer (raw material polymer 2) 908.1g. The obtained polymer raw material 2 was measured using gel permeation chromatography (GPC). As a result, the weight average molecular weight Mw was 2,700, and the polydispersity (weight average molecular weight Mw)/(number average molecular weight Mn) was 1.57.

藉由利用燒瓶燃燒、離子層析法之元素分析來確認所獲得之聚合物中的硫量,確認到在聚合物中存在硫元素。又,在滴加甲醇之前的反應溶液的GPC測量中,亦確認到來自於PEMP之峰已消失,PEMP被吸入到聚合物中。The amount of sulfur in the obtained polymer was confirmed by elemental analysis using flask combustion and ion chromatography, and it was confirmed that sulfur element was present in the polymer. In addition, in the GPC measurement of the reaction solution before methanol was added dropwise, it was confirmed that the peak derived from PEMP disappeared and PEMP was absorbed into the polymer.

(原料聚合物3的合成) 向具備攪拌機及冷卻管及滴液漏斗之反應容器內加入2-降莰烯的75%甲苯溶液50.21g(2-降莰烯換算為37.66g,0.400莫耳)、順丁烯二酸酐(MAN,78.45g,0.800莫耳)、反丁烯二酸二丁酯(FADB)91.32g(0.400莫耳)、甲基乙基酮(MEK)540.04g,並進行了攪拌/溶解。接著,藉由氮氣鼓泡去除體系內的溶氧之後升溫,在內溫達到80℃之時刻,耗時1小時添加了將2,2’-偶氮雙異丁酸二甲酯(Wako Pure Chemical Industries, Ltd.製造,商品名:V-601,7.37g,0.032mol)及PEMP(15.64g,0.032mol)溶解於MEK45.78g而成之溶液。其後,進一步在80℃反應了7小時。接著,將反應混合物冷卻至室溫。將上述中所獲得之聚合溶液滴加到甲醇3213.2g中,藉此使白色固體沉澱。將所獲得之白色固體進一步用甲醇803.3g進行洗淨之後,在溫度120℃進行真空乾燥,藉此獲得了具備來自於2-降莰烯之結構單元、來自於反丁烯二酸酐之結構單元及來自於順丁烯二酸酐之結構單元之聚合物(原料聚合物3)67.7g。 使用凝膠滲透層析(GPC)對所獲得之聚合物進行了測量,其結果,重量平均分子量Mw為2,300,多分散性(重量平均分子量Mw)/(數平均分子量Mn)為1.52。 (Synthesis of raw material polymer 3) Add 50.21g of 75% toluene solution of 2-norbornene (2-norbornene converted to 37.66g, 0.400 mol) and maleic anhydride (MAN) into a reaction vessel equipped with a stirrer, cooling tube and dropping funnel. , 78.45g, 0.800 mol), dibutyl fumarate (FADB) 91.32g (0.400 mol), methyl ethyl ketone (MEK) 540.04g, and stirred/dissolved. Next, the dissolved oxygen in the system was removed by bubbling nitrogen, and then the temperature was raised. When the internal temperature reached 80°C, 2,2'-azobisisobutyric acid dimethyl ester (Wako Pure Chemical) was added over an hour. Manufactured by Industries, Ltd., trade name: V-601, 7.37g, 0.032mol) and PEMP (15.64g, 0.032mol) dissolved in MEK45.78g. Thereafter, the reaction was further carried out at 80° C. for 7 hours. Next, the reaction mixture was cooled to room temperature. The polymerization solution obtained above was added dropwise to 3213.2 g of methanol to precipitate a white solid. The obtained white solid was further washed with 803.3 g of methanol, and then vacuum dried at a temperature of 120° C., thereby obtaining a structural unit derived from 2-norbornene and a structural unit derived from fumaric anhydride. and 67.7 g of a polymer (raw material polymer 3) derived from structural units of maleic anhydride. The obtained polymer was measured using gel permeation chromatography (GPC). As a result, the weight average molecular weight Mw was 2,300, and the polydispersity (weight average molecular weight Mw)/(number average molecular weight Mn) was 1.52.

藉由利用燒瓶燃燒、離子層析法之元素分析來確認所獲得之原料聚合物3中的硫量,確認到在原料聚合物3中存在硫元素。又,在滴加甲醇之前的反應溶液的GPC測量中,亦確認到來自於PEMP之峰已消失,PEMP被吸入到聚合物中。The amount of sulfur in the obtained raw material polymer 3 was confirmed by elemental analysis using flask combustion and ion chromatography, and it was confirmed that sulfur element was present in the raw material polymer 3 . In addition, in the GPC measurement of the reaction solution before methanol was added dropwise, it was confirmed that the peak derived from PEMP disappeared and PEMP was absorbed into the polymer.

(原料聚合物4的合成) 向具備攪拌機及冷卻管及滴液漏斗之反應容器內加入2-降莰烯的75%甲苯溶液112.98g(2-降莰烯換算為84.75g,0.900mol)、順丁烯二酸酐(MAN,88.25g,0.900mol)、反丁烯二酸二丁酯102.73g(0.450莫耳)及甲基乙基酮(MEK)179.12g,並進行了攪拌/溶解。接著,藉由氮氣鼓泡去除體系內的溶氧之後升溫,在內溫達到70℃之時刻,耗時1小時添加了將2,2’-偶氮雙異丁酸二甲酯(Wako Pure Chemical Industries, Ltd.製造,商品名:V-601,10.36g,0.045mol)及PEMP(32.98g,0.0675mol)溶解於MEK76.77g而成之溶液。進而,升溫至80℃,升溫後在80℃反應了7小時。接著,將反應混合物冷卻至室溫。將上述中所獲得之聚合溶液滴加到甲醇3016.2g中,藉此使白色固體沉澱。將所獲得之白色固體進一步用甲醇754.1g進行洗淨之後,在溫度120℃進行真空乾燥,藉此獲得了具備來自於2-降莰烯之結構單元和來自於順丁烯二酸酐之結構單元之聚合物(原料聚合物4)154.2g。 使用凝膠滲透層析(GPC)對所獲得之聚合物進行了測量,其結果,重量平均分子量Mw為2,800,多分散性(重量平均分子量Mw)/(數平均分子量Mn)為1.54。 (Synthesis of raw material polymer 4) Add 112.98g of 75% toluene solution of 2-norbornene (2-norbornene converted to 84.75g, 0.900mol) and maleic anhydride (MAN, 88.25g, 0.900mol), 102.73g dibutyl fumarate (0.450mol) and methyl ethyl ketone (MEK) 179.12g, and stirred/dissolved. Next, the dissolved oxygen in the system was removed by bubbling nitrogen, and then the temperature was raised. When the internal temperature reached 70°C, 2,2'-azobisisobutyric acid dimethyl ester (Wako Pure Chemical) was added over an hour. Manufactured by Industries, Ltd., trade name: V-601, 10.36g, 0.045mol) and PEMP (32.98g, 0.0675mol) dissolved in MEK76.77g. Furthermore, the temperature was raised to 80°C, and after the temperature was raised, the reaction was carried out at 80°C for 7 hours. Next, the reaction mixture was cooled to room temperature. The polymerization solution obtained above was added dropwise to 3016.2 g of methanol to precipitate a white solid. The obtained white solid was further washed with 754.1 g of methanol, and then vacuum dried at a temperature of 120° C., thereby obtaining a structural unit derived from 2-norbornene and a structural unit derived from maleic anhydride. The polymer (raw material polymer 4) 154.2g. The obtained polymer was measured using gel permeation chromatography (GPC). As a result, the weight average molecular weight Mw was 2,800, and the polydispersity (weight average molecular weight Mw)/(number average molecular weight Mn) was 1.54.

[原料聚合物4的結構分析] 在原料聚合物4的合成中,在反應開始時,以在溶劑中溶解有單體及PEMP之狀態開始,其後,進行反應而生成聚合物。分別針對反應溶液及所獲得之聚合物進行了分析,其結果,獲得了以下的結果。 [Structural analysis of raw material polymer 4] In the synthesis of the raw material polymer 4, when the reaction starts, the monomer and PEMP are dissolved in the solvent, and then the reaction proceeds to generate the polymer. The reaction solution and the obtained polymer were analyzed respectively, and the following results were obtained.

(a)反應溶液的分析 在再沉澱純化前的反應溶液的GPC測量中,未觀察到PEMP單體的峰。亦即,確認到在反應溶液中未殘存有PEMP。又,在再沉澱純化前的反應溶液的GC(氣相層析)測量中,確認到與反應前相比,反應後的反應溶液中的降莰烯單體、反丁烯二酸二丁酯單體、順丁烯二酸酐單體的峰減少,降莰烯單體、反丁烯二酸二丁酯單體及順丁烯二酸酐進行反應而形成了聚合物。 (a) Analysis of reaction solution In the GPC measurement of the reaction solution before reprecipitation purification, no peak of the PEMP monomer was observed. That is, it was confirmed that PEMP did not remain in the reaction solution. Furthermore, in the GC (gas chromatography) measurement of the reaction solution before reprecipitation purification, it was confirmed that the amount of norbornene monomer and dibutyl fumarate in the reaction solution after the reaction was lower than before the reaction. The peaks of the monomer and the maleic anhydride monomer decrease, and the norbornene monomer, the dibutyl fumarate monomer, and the maleic anhydride react to form a polymer.

(b)聚合物的分析 在再沉澱純化後的聚合物的GPC測量中,未觀察到PEMP單體、降莰烯單體、反丁烯二酸二丁酯單體及順丁烯二酸酐單體的峰。亦即,確認到在聚合物中未殘存有PEMP、降莰烯單體、反丁烯二酸二丁酯單體及順丁烯二酸酐單體。 (b) Analysis of polymers In the GPC measurement of the polymer after reprecipitation and purification, no peaks of the PEMP monomer, norbornene monomer, dibutyl fumarate monomer, and maleic anhydride monomer were observed. That is, it was confirmed that PEMP, norbornene monomer, dibutyl fumarate monomer, and maleic anhydride monomer did not remain in the polymer.

針對原料聚合物4,利用 13C-NMR算出之來自於實際被導入到原料聚合物中之各單體之結構的比率為降莰烯:反丁烯二酸二丁酯:順丁烯二酸酐=48.0%:9.0%:46.7%,實際被導入到原料聚合物中之PEMP量相對於各單體的合計量為3.4莫耳%。 Regarding the raw material polymer 4, the ratio of the structure derived from each monomer actually introduced into the raw polymer calculated by 13 C-NMR is norbornene: dibutyl fumarate: maleic anhydride =48.0%: 9.0%: 46.7%. The amount of PEMP actually introduced into the raw polymer is 3.4 mol% relative to the total amount of each monomer.

藉由利用燒瓶燃燒、離子層析法之元素分析來確認所獲得之原料聚合物4中的硫量,確認到在原料聚合物4中存在硫元素。又,在滴加甲醇之前的反應溶液的GPC測量中,亦確認到來自於PEMP之峰已消失,PEMP被吸入到聚合物中。The amount of sulfur in the obtained raw material polymer 4 was confirmed by elemental analysis using flask combustion and ion chromatography, and it was confirmed that sulfur element was present in the raw material polymer 4 . In addition, in the GPC measurement of the reaction solution before methanol was added dropwise, it was confirmed that the peak derived from PEMP disappeared and PEMP was absorbed into the polymer.

(原料聚合物4的結構的確認) 藉由 13C-NMR的積分值分析算出了原料聚合物4中之來自於PEMP之結構單元、來自於反丁烯二酸二丁酯(FADB)之結構單元(式(AD)的結構單元)、來自於順丁烯二酸酐(MAN)之結構單元(式(MA)的結構單元)及來自於降莰烯(NB)之結構(式(NB)的結構單元)的量(莫耳分率,莫耳%)。 13C-NMR圖譜示於圖2。 將 13C-NMR圖譜的化學位移如下那樣歸屬於各結構單元,並測量了對應之積分值。 ·PEPM的k(4C):62.0~64.0ppm ·FADB的烷基末端(2C):13.0~15.0ppm ·順丁烯二酸酐酯(2C)+PEMP的g(4C):170.0~174.7ppm ·順丁烯二酸酯(2C)+FADB的酯(2C):174.7~178.0ppm ·烷基鏈:20~60ppm ·DMSO:40ppm附近 ·降莰烯(7C)=烷基鏈-DMSO-PEMP(9C,h+i+j)-順丁烯二酸酐(2C)-順丁烯二酸(2C)-FADB(6C) 在此,來自於實際被導入到原料聚合物中之順丁烯二酸酐之結構比率除了包括式(MA)的結構單元以外,亦包括順丁烯二酸酐開環之順丁烯二酸的結構在內而算出。 (Confirmation of the structure of the raw material polymer 4) The structure of the structural unit derived from PEMP and dibutyl fumarate (FADB) in the raw material polymer 4 was calculated through integrated value analysis of 13 C-NMR unit (structural unit of formula (AD)), structural unit derived from maleic anhydride (MAN) (structural unit of formula (MA)) and structure derived from norbornene (NB) (formula (NB) structural unit) (Molar fraction, Mol%). The 13 C-NMR spectrum is shown in Figure 2. The chemical shifts of the 13 C-NMR spectrum were assigned to each structural unit as follows, and the corresponding integral values were measured. ·K of PEPM (4C): 62.0~64.0ppm ·Alkyl terminal of FADB (2C): 13.0~15.0ppm ·G of maleic anhydride ester (2C) + PEMP (4C): 170.0~174.7ppm ·Syn. Butenedioate (2C) + FADB ester (2C): 174.7 to 178.0ppm Alkyl chain: 20 to 60ppm DMSO: around 40ppm Norbornene (7C) = Alkyl chain-DMSO-PEMP (9C , h+i+j)-maleic anhydride (2C)-maleic acid (2C)-FADB (6C) Here, from the maleic anhydride actually introduced into the raw polymer The structural ratio is calculated including the structure of maleic acid ring-opened by maleic anhydride in addition to the structural unit of formula (MA).

(原料聚合物5的合成) 使用了反丁烯二酸二丁酯(FADB)51.73g(0.225莫耳),除此以外,以與原料聚合物4相同的方式獲得了具備來自於2-降莰烯之結構單元、來自於反丁烯二酸二丁酯之結構單元及來自於順丁烯二酸酐之結構單元之聚合物(原料聚合物5)111.5g。 使用凝膠滲透層析(GPC)對所獲得之聚合物進行了測量,其結果,重量平均分子量Mw為3,000,多分散性(重量平均分子量Mw)/(數平均分子量Mn)為1.69。 (Synthesis of raw material polymer 5) Except that 51.73 g (0.225 mol) of dibutyl fumarate (FADB) was used, in the same manner as the raw material polymer 4, a structural unit derived from 2-norbornene was obtained. 111.5 g of a polymer containing structural units of dibutyl fumarate and structural units derived from maleic anhydride (raw material polymer 5). The obtained polymer was measured using gel permeation chromatography (GPC). As a result, the weight average molecular weight Mw was 3,000, and the polydispersity (weight average molecular weight Mw)/(number average molecular weight Mn) was 1.69.

藉由利用燒瓶燃燒、離子層析法之元素分析來確認所獲得之原料聚合物5中的硫量,確認到在原料聚合物5中存在硫元素。又,在滴加甲醇之前的反應溶液的GPC測量中,亦確認到來自於PEMP之峰已消失,PEMP被吸入到聚合物中。The amount of sulfur in the obtained raw material polymer 5 was confirmed by elemental analysis using flask combustion and ion chromatography, and it was confirmed that sulfur element was present in the raw material polymer 5 . In addition, in the GPC measurement of the reaction solution before methanol was added dropwise, it was confirmed that the peak derived from PEMP disappeared and PEMP was absorbed into the polymer.

(原料聚合物6的合成) 代替反丁烯二酸二丁酯(FADB)而使用了反丁烯二酸二乙酯(FADE)77.48g(0.450莫耳),除此以外,以與原料聚合物4相同的方式獲得了具備來自於2-降莰烯之結構單元、來自於反丁烯二酸二乙酯之結構單元及來自於順丁烯二酸酐之結構單元之聚合物(原料聚合物6)148.1g。 使用凝膠滲透層析(GPC)對所獲得之聚合物進行了測量,其結果,重量平均分子量Mw為2,600,多分散性(重量平均分子量Mw)/(數平均分子量Mn)為1.52。 (Synthesis of raw material polymer 6) Except that 77.48 g (0.450 mol) of diethyl fumarate (FADE) was used instead of dibutyl fumarate (FADB), the polymer was obtained in the same manner as the raw material polymer 4. 148.1 g of a polymer containing structural units derived from 2-norbornene, structural units derived from diethyl fumarate, and structural units derived from maleic anhydride (raw material polymer 6). The obtained polymer was measured using gel permeation chromatography (GPC). As a result, the weight average molecular weight Mw was 2,600, and the polydispersity (weight average molecular weight Mw)/(number average molecular weight Mn) was 1.52.

藉由利用燒瓶燃燒、離子層析法之元素分析來確認所獲得之原料聚合物6中的硫量,確認到在原料聚合物6中存在硫元素。又,在滴加甲醇之前的反應溶液的GPC測量中,亦確認到來自於PEMP之峰已消失,PEMP被吸入到聚合物中。The amount of sulfur in the obtained raw material polymer 6 was confirmed by elemental analysis using flask combustion and ion chromatography, and it was confirmed that sulfur element was present in the raw material polymer 6 . In addition, in the GPC measurement of the reaction solution before methanol was added dropwise, it was confirmed that the peak derived from PEMP disappeared and PEMP was absorbed into the polymer.

(原料聚合物7的合成) 代替反丁烯二酸二丁酯(FADB)而使用了反丁烯二酸雙(2-乙基己酯)(FABEH)153.22g(0.450莫耳),除此以外,以與原料聚合物4相同的方式獲得了具備來自於2-降莰烯之結構單元、來自於反丁烯二酸雙(2-乙基己酯)之結構單元及來自於順丁烯二酸酐之結構單元之聚合物(原料聚合物7)169.1g。 使用凝膠滲透層析(GPC)對所獲得之聚合物進行了測量,其結果,重量平均分子量Mw為2,900,多分散性(重量平均分子量Mw)/(數平均分子量Mn)為1.59。 (Synthesis of raw material polymer 7) Instead of dibutyl fumarate (FADB), 153.22 g (0.450 mol) of bis(2-ethylhexyl) fumarate (FABEH) was used. In addition, 4 In the same manner, a polymer having structural units derived from 2-norbornene, structural units derived from bis(2-ethylhexyl fumarate), and structural units derived from maleic anhydride was obtained. (Raw material polymer 7) 169.1g. The obtained polymer was measured using gel permeation chromatography (GPC). As a result, the weight average molecular weight Mw was 2,900, and the polydispersity (weight average molecular weight Mw)/(number average molecular weight Mn) was 1.59.

藉由利用燒瓶燃燒、離子層析法之元素分析來確認所獲得之原料聚合物7中的硫量,確認到在原料聚合物7中存在硫元素。又,在滴加甲醇之前的反應溶液的GPC測量中,亦確認到來自於PEMP之峰已消失,PEMP被吸入到聚合物中。The amount of sulfur in the obtained raw material polymer 7 was confirmed by elemental analysis using flask combustion and ion chromatography, and it was confirmed that sulfur element was present in the raw material polymer 7 . In addition, in the GPC measurement of the reaction solution before methanol was added dropwise, it was confirmed that the peak derived from PEMP disappeared and PEMP was absorbed into the polymer.

(原料聚合物8的合成) 代替反丁烯二酸二丁酯(FADB)而使用了順丁烯二酸二丁酯(MADB)205.46g(0.900莫耳),除此以外,以與原料聚合物4相同的方式獲得了具備來自於2-降莰烯之結構單元、來自於順丁烯二酸二丁酯之結構單元及來自於順丁烯二酸酐之結構單元之聚合物(原料聚合物8)155.1g。 使用凝膠滲透層析(GPC)對所獲得之聚合物進行了測量,其結果,重量平均分子量Mw為2,400,多分散性(重量平均分子量Mw)/(數平均分子量Mn)為1.45。 (Synthesis of raw material polymer 8) Except that 205.46 g (0.900 mol) of dibutyl maleate (MADB) was used instead of dibutyl fumarate (FADB), a polymer having the properties of raw material polymer 4 was obtained. 155.1 g of a polymer containing structural units derived from 2-norbornene, structural units derived from dibutyl maleate, and structural units derived from maleic anhydride (raw material polymer 8). The obtained polymer was measured using gel permeation chromatography (GPC). As a result, the weight average molecular weight Mw was 2,400, and the polydispersity (weight average molecular weight Mw)/(number average molecular weight Mn) was 1.45.

藉由利用燒瓶燃燒、離子層析法之元素分析來確認所獲得之原料聚合物8中的硫量,確認到在原料聚合物8中存在硫元素。又,在滴加甲醇之前的反應溶液的GPC測量中,亦確認到來自於PEMP之峰已消失,PEMP被吸入到聚合物中。The amount of sulfur in the obtained raw material polymer 8 was confirmed by elemental analysis using flask combustion and ion chromatography, and it was confirmed that sulfur element was present in the raw material polymer 8 . In addition, in the GPC measurement of the reaction solution before methanol was added dropwise, it was confirmed that the peak derived from PEMP disappeared and PEMP was absorbed into the polymer.

(原料聚合物9的合成) 向具備攪拌機及冷卻管及滴液漏斗之反應容器內加入2-降莰烯的75%甲苯溶液112.98g(2-降莰烯換算為84.75g,0.900mol)、順丁烯二酸酐(MAN,70.60g,0.720mol)、反丁烯二酸二丁酯82.18g(0.360莫耳)及甲基乙基酮(MEK)157.78g,並進行了攪拌/溶解。接著,藉由氮氣鼓泡去除體系內的溶氧之後升溫,在內溫達到70℃之時刻,耗時1小時添加了將2,2’-偶氮雙異丁酸二甲酯(Wako Pure Chemical Industries, Ltd.製造,商品名:V-601,9.12g,0.040mol)及PEMP(19.35g,0.040mol)溶解於MEK 67.62g而成之溶液。進而,升溫至80℃,升溫後在80℃反應了7小時。接著,將反應混合物冷卻至室溫。將上述中所獲得之聚合溶液滴加到甲醇3016.2g中,藉此使白色固體沉澱。將所獲得之白色固體進一步用甲醇754.1g進行洗淨之後,在溫度120℃進行真空乾燥,藉此獲得了具備來自於2-降莰烯之結構單元和來自於順丁烯二酸酐之結構單元之聚合物(原料聚合物9)161.2g。 使用凝膠滲透層析(GPC)對所獲得之聚合物進行了測量,其結果,重量平均分子量Mw為3,100,多分散性(重量平均分子量Mw)/(數平均分子量Mn)為1.81。 (Synthesis of raw material polymer 9) Add 112.98g of 75% toluene solution of 2-norbornene (2-norbornene converted to 84.75g, 0.900mol) and maleic anhydride (MAN, 70.60g, 0.720mol), 82.18g dibutyl fumarate (0.360mol) and 157.78g methyl ethyl ketone (MEK), and stirred/dissolved. Next, the dissolved oxygen in the system was removed by bubbling nitrogen, and then the temperature was raised. When the internal temperature reached 70°C, 2,2'-azobisisobutyric acid dimethyl ester (Wako Pure Chemical) was added over an hour. Manufactured by Industries, Ltd., trade name: V-601, 9.12g, 0.040mol) and PEMP (19.35g, 0.040mol) dissolved in MEK 67.62g. Furthermore, the temperature was raised to 80°C, and after the temperature was raised, the reaction was carried out at 80°C for 7 hours. Next, the reaction mixture was cooled to room temperature. The polymerization solution obtained above was added dropwise to 3016.2 g of methanol to precipitate a white solid. The obtained white solid was further washed with 754.1 g of methanol, and then vacuum dried at a temperature of 120° C., thereby obtaining a structural unit derived from 2-norbornene and a structural unit derived from maleic anhydride. The polymer (raw material polymer 9) 161.2g. The obtained polymer was measured using gel permeation chromatography (GPC). As a result, the weight average molecular weight Mw was 3,100, and the polydispersity (weight average molecular weight Mw)/(number average molecular weight Mn) was 1.81.

(原料聚合物10的合成) 向具備攪拌機及冷卻管及滴液漏斗之反應容器內加入2-降莰烯的75%甲苯溶液251.07g(2-降莰烯換算為188.33g,2.0莫耳)、順丁烯二酸酐(MAN,88.25g,0.900莫耳)、反丁烯二酸二丁酯456.58g(2.0莫耳)、N-苯基順丁烯二醯亞胺17.32g(0.100莫耳)、甲基乙基酮(MEK)373.94g,並進行了攪拌/溶解。接著,藉由氮氣鼓泡去除體系內的溶氧之後升溫,在內溫達到70℃之時刻,耗時1小時添加了將2,2’-偶氮雙異丁酸二甲酯(Wako Pure Chemical Industries, Ltd.製造,商品名:V-601,23.38g,0.102mol)及PEMP(71.83g,0.147mol)溶解於MEK 201.35g而成之溶液。進而,升溫至80℃,升溫後在80℃反應了7小時。接著,將反應混合物冷卻至室溫。將上述中所獲得之聚合溶液滴加到2-丙醇11869.0g中,藉此使白色固體沉澱。將所獲得之白色固體進一步用2-丙醇5934.0g進行洗淨之後,在溫度120℃進行真空乾燥,藉此獲取了具備來自於2-降莰烯之結構單元、來自於反丁烯二酸二丁酯之結構單元、來自於N-苯基順丁烯二醯亞胺之結構單元及來自於順丁烯二酸酐之結構單元之聚合物(原料聚合物10)324.7g。 使用凝膠滲透層析(GPC)對所獲得之聚合物進行了測量,其結果,重量平均分子量Mw為2,600,多分散性(重量平均分子量Mw)/(數平均分子量Mn)為1.90。 (Synthesis of raw material polymer 10) Add 251.07g of 75% toluene solution of 2-norbornene (2-norbornene converted to 188.33g, 2.0 mol) and maleic anhydride (MAN) into a reaction vessel equipped with a stirrer, cooling tube and dropping funnel. , 88.25g, 0.900 mol), dibutyl fumarate 456.58g (2.0 mol), N-phenylmaleimide 17.32g (0.100 mol), methyl ethyl ketone ( MEK) 373.94g and stirred/dissolved. Next, the dissolved oxygen in the system was removed by bubbling nitrogen, and then the temperature was raised. When the internal temperature reached 70°C, 2,2'-azobisisobutyric acid dimethyl ester (Wako Pure Chemical) was added over an hour. Manufactured by Industries, Ltd., trade name: V-601, 23.38g, 0.102mol) and PEMP (71.83g, 0.147mol) dissolved in MEK 201.35g. Furthermore, the temperature was raised to 80°C, and after the temperature was raised, the reaction was carried out at 80°C for 7 hours. Next, the reaction mixture was cooled to room temperature. The polymerization solution obtained above was added dropwise to 11869.0 g of 2-propanol, thereby precipitating a white solid. The obtained white solid was further washed with 5934.0 g of 2-propanol, and then vacuum dried at a temperature of 120°C to obtain fumaric acid-derived structural units having a structural unit derived from 2-norbornene. 324.7 g of a polymer containing structural units of dibutyl ester, structural units derived from N-phenylmaleimide, and structural units derived from maleic anhydride (raw material polymer 10). The obtained polymer was measured using gel permeation chromatography (GPC). As a result, the weight average molecular weight Mw was 2,600, and the polydispersity (weight average molecular weight Mw)/(number average molecular weight Mn) was 1.90.

藉由利用燒瓶燃燒、離子層析法之元素分析來確認所獲得之原料聚合物10中的硫量,確認到在原料聚合物10中存在硫元素。又,在滴加甲醇之前的反應溶液的GPC測量中,亦確認到來自於PEMP之峰已消失,PEMP被吸入到聚合物中。The amount of sulfur in the obtained raw material polymer 10 was confirmed by elemental analysis using flask combustion and ion chromatography, and it was confirmed that sulfur element was present in the raw material polymer 10 . In addition, in the GPC measurement of the reaction solution before methanol was added dropwise, it was confirmed that the peak derived from PEMP disappeared and PEMP was absorbed into the polymer.

(原料聚合物11) 向具備攪拌機及冷卻管及滴液漏斗之反應容器內加入2-降莰烯的75%甲苯溶液188.3g(2-降莰烯換算為141.25g,1.50mol)、順丁烯二酸酐(MAN,88.25g,0.900mol)、反丁烯二酸二丁酯273.95(1.20莫耳)及甲基乙基酮(MEK)432.90g,並進行了攪拌/溶解。接著,藉由氮氣鼓泡去除體系內的溶氧之後升溫,在內溫達到80℃之時刻,耗時1小時添加了將2,2’-偶氮雙異丁酸二甲酯(Wako Pure Chemical Industries, Ltd.製造,商品名:V-601,17.08g,0.074mol)溶解於MEK 48.10g而成之溶液。進而,使其反應了7小時。接著,將反應混合物冷卻至室溫。將上述中所獲得之聚合溶液滴加到甲醇6057.0g中,藉此使白色固體沉澱。將所獲得之白色固體進一步用甲醇1652.0g進行洗淨之後,在溫度120℃進行真空乾燥,藉此獲得了具備來自於2-降莰烯之結構單元和來自於順丁烯二酸酐之結構單元之聚合物(原料聚合物11)244.1g。 使用凝膠滲透層析(GPC)對所獲得之聚合物進行了測量,其結果,重量平均分子量Mw為3,400,多分散性(重量平均分子量Mw)/(數平均分子量Mn)為1.48。 (raw polymer 11) Add 188.3g of 75% toluene solution of 2-norbornene (2-norbornene converted to 141.25g, 1.50mol) and maleic anhydride (MAN, 88.25g, 0.900mol), dibutyl fumarate 273.95 (1.20mol) and methyl ethyl ketone (MEK) 432.90g, and stirred/dissolved. Next, the dissolved oxygen in the system was removed by bubbling nitrogen, and then the temperature was raised. When the internal temperature reached 80°C, 2,2'-azobisisobutyric acid dimethyl ester (Wako Pure Chemical) was added over an hour. Industries, Ltd., trade name: V-601, 17.08g, 0.074mol) is a solution dissolved in MEK 48.10g. Furthermore, it was allowed to react for 7 hours. Next, the reaction mixture was cooled to room temperature. The polymerization solution obtained above was added dropwise to 6057.0 g of methanol to precipitate a white solid. The obtained white solid was further washed with 1,652.0 g of methanol, and then vacuum dried at a temperature of 120° C., thereby obtaining a structural unit derived from 2-norbornene and a structural unit derived from maleic anhydride. The polymer (raw material polymer 11) 244.1g. The obtained polymer was measured using gel permeation chromatography (GPC). As a result, the weight average molecular weight Mw was 3,400, and the polydispersity (weight average molecular weight Mw)/(number average molecular weight Mn) was 1.48.

針對原料聚合物3~11,藉由氣相層析(GC)測量而測量反應前後的反應溶液中的各單體量來算出各單體的消耗量,藉此算出被導入到原料聚合物中之各單體的比率。 在以下的表1中示出原料聚合物的合成中所使用之單體的投入比率、被導入到原料聚合物中之單體的比率、原料聚合物的重量平均分子量(Mw)及多分散性(Mw/Mn)。 氣相層析測量的測量條件如下所述。 ·GC裝置:GC-2030(SHIMADZU CORPORATION) ·載氣:N 2·檢測器:氫焰離子化(FID)檢測器、FID溫度:300℃ ·管柱:SH-RXi-1HT,內徑0.25、長度30m、膜厚0.25μm(Shimadzu GLC Ltd.) ·汽化室溫度:210℃ ·管柱流量:0.64mL/min ·管柱升溫條件:50℃保持5min,以20℃/min升溫至300℃,300℃保持10min For raw material polymers 3 to 11, the amount of each monomer in the reaction solution before and after the reaction was measured by gas chromatography (GC) measurement to calculate the consumption of each monomer, thereby calculating the amount introduced into the raw material polymer. The ratio of each monomer. The following Table 1 shows the input ratio of the monomers used in the synthesis of the base polymer, the ratio of the monomers introduced into the base polymer, the weight average molecular weight (Mw) and the polydispersity of the base polymer. (Mw/Mn). The measurement conditions for gas chromatography measurements are as follows. ·GC device: GC-2030 (SHIMADZU CORPORATION) ·Carrier gas: N 2 ·Detector: Hydrogen flame ionization (FID) detector, FID temperature: 300℃ ·Column: SH-RXi-1HT, inner diameter 0.25, Length 30m, film thickness 0.25μm (Shimadzu GLC Ltd.) ·Vaporization chamber temperature: 210℃ ·Column flow rate: 0.64mL/min ·Column heating conditions: 50℃ maintained for 5min, heated to 300℃ at 20℃/min, Keep at 300℃ for 10min

[表1] 表1 原料聚合物No. 原料聚合物中的PEMP量 (vs單體) 所使用之單體種類 投入單體比率 (莫耳比) 單體導入比率 (莫耳比) 重量平均分子量 (Mw) 多分散性(Mw/Mn) 軟化點 (℃) (TMA) 熔點 (℃) (Tg-DTA) 原料聚合物1 2mol% NB/MAN 50/50 - 3,500 1.62 165 225 原料聚合物2 3mol% NB/MAN 50/50 - 2,700 1.57 146 182 原料聚合物3 2mol% NB/FADB/MAN 25/25/50 50/10/40 2,300 1.52 97 121 原料聚合物4 3mol% NB/FADB/MAN 40/20/40 48/12/38 2,800 1.54 105 119 原料聚合物5 3mol% NB/FADB/MAN 40/10/40 48/9/43 3,000 1.69 110 127 原料聚合物6 3mol% NB/FADE/MAN 40/20/40 49/11/40 2,600 1.52 117 138 原料聚合物7 3mol% NB/FABEH/MAN 40/20/40 51/8/41 2,900 1.59 80 108 原料聚合物8 3mol% NB/MADB/MAN 40/40/40 53/5/42 2,400 1.45 112 132 原料聚合物9 2mol% NB/MAN/FADB 50/40/20 52/42/6 3,100 1.81 115 138 原料聚合物10 3mol% NB/MAN/FADB/PhMI 50/22.5/50/2.5 50/24/23/3 2,600 1.90 55 76 原料聚合物11 - NB/MAN/FADB 50/30/40 47/33/20 3,400 1.48 124 146 [Table 1] Table 1 Raw material polymer No. Amount of PEMP in base polymer (vs monomer) Type of monomer used Input monomer ratio (mol ratio) Monomer introduction ratio (mol ratio) Weight average molecular weight (Mw) Polydispersity (Mw/Mn) Softening point (℃) (TMA) Melting point (℃) (Tg-DTA) Raw polymer 1 2mol% NB/MAN 50/50 - 3,500 1.62 165 225 Raw polymer 2 3mol% NB/MAN 50/50 - 2,700 1.57 146 182 Raw polymer 3 2mol% NB/FADB/MAN 25/25/50 50/10/40 2,300 1.52 97 121 Raw polymer 4 3mol% NB/FADB/MAN 40/20/40 48/12/38 2,800 1.54 105 119 Raw polymer 5 3mol% NB/FADB/MAN 40/10/40 48/9/43 3,000 1.69 110 127 Raw polymer 6 3mol% NB/FADE/MAN 40/20/40 49/11/40 2,600 1.52 117 138 Raw polymer 7 3mol% NB/FABEH/MAN 40/20/40 51/8/41 2,900 1.59 80 108 Raw polymer 8 3mol% NB/MADB/MAN 40/40/40 53/5/42 2,400 1.45 112 132 Raw polymer 9 2mol% NB/MAN/FADB 50/40/20 52/42/6 3,100 1.81 115 138 Raw polymer 10 3mol% NB/MAN/FADB/PhMI 50/22.5/50/2.5 50/24/23/3 2,600 1.90 55 76 Raw polymer 11 - NB/MAN/FADB 50/30/40 47/33/20 3,400 1.48 124 146

<聚合物P的合成> 利用以下的方法製作出聚合物P。 <Synthesis of Polymer P> Polymer P was produced using the following method.

(製備例1) 製作出原料聚合物1的MA單元用單官能(甲基)丙烯酸化合物開環之聚合物P1。以下,對詳細內容進行說明。 首先,對原料聚合物1 10.00g(由原料聚合物1的投入量算出並以MA換算為0.052莫耳)加入MEK 18.44g而製作出溶解液。接著,對該溶解液加入4-HBA 9.38g(0.065莫耳),其後,加入三乙胺3.00g(0.030莫耳),並在溫度70℃反應6小時而製作出反應溶液。 將所獲得之反應溶液用MEK進行稀釋,並且用檸檬酸水溶液進行處理,藉此從反應溶液中去除了水相。其後,利用下述再沉澱法對聚合物進行了純化。 ·再沉澱法:用過量的水使聚合物再沉澱。反覆進行了2次用過量的水將藉由再沉澱而獲得之聚合物粉末進行洗淨之操作。將所獲得之反應產物在40℃乾燥了12小時。 藉由以上,獲得了原料聚合物1中的來自於順丁烯二酸酐之結構單元用4-HBA開環之聚合物P1 8.7g。 針對所獲得之聚合物P1實施GPC測量而測量了聚合物P1的重量平均分子量及多分散性。將結果示於表2。 又,藉由聚合物P1的GPC測量,確認到所使用之單官能(甲基)丙烯酸化合物的峰的消失。藉此,確認到在所獲得之聚合物P1中不含有未反應的單官能(甲基)丙烯酸化合物。 (Preparation Example 1) A polymer P1 was produced in which the MA unit of the raw material polymer 1 was ring-opened with a monofunctional (meth)acrylic acid compound. The details are explained below. First, 18.44 g of MEK was added to 10.00 g of the raw material polymer 1 (calculated from the input amount of the raw material polymer 1 and 0.052 mol in terms of MA) to prepare a solution. Next, 9.38 g (0.065 mol) of 4-HBA was added to the solution, and then 3.00 g (0.030 mol) of triethylamine was added, and the reaction was carried out at a temperature of 70° C. for 6 hours to prepare a reaction solution. The obtained reaction solution was diluted with MEK and treated with a citric acid aqueous solution, thereby removing the aqueous phase from the reaction solution. Thereafter, the polymer was purified by the reprecipitation method described below. ·Re-precipitation method: Use excess water to reprecipitate the polymer. The operation of washing the polymer powder obtained by reprecipitation with excess water was repeated twice. The reaction product obtained was dried at 40°C for 12 hours. Through the above, 8.7 g of the polymer P1 in which the structural unit derived from maleic anhydride in the raw material polymer 1 was ring-opened with 4-HBA was obtained. GPC measurement was performed on the obtained polymer P1, and the weight average molecular weight and polydispersity of the polymer P1 were measured. The results are shown in Table 2. Furthermore, GPC measurement of the polymer P1 confirmed the disappearance of the peak of the monofunctional (meth)acrylic acid compound used. This confirmed that the obtained polymer P1 did not contain unreacted monofunctional (meth)acrylic acid compound.

(製備例2) 製作出原料聚合物1的MA單元用3官能(甲基)丙烯酸化合物、單官能(甲基)丙烯酸化合物及水開環之聚合物P2。以下,對詳細內容進行說明。 首先,對原料聚合物1 60.00g(由原料聚合物1的投入量算出並以MA換算為0.312莫耳)加入MEK 99.93g而製作出溶解液。接著,對該溶解液加入A-TMM-3LM-N 77.49g,其後,加入三乙胺18.00g(0.178莫耳),並在溫度70℃反應了2小時。其後,進一步加入4-HBA 56.27g(0.390莫耳),並在溫度70℃反應4小時而製作出反應溶液。 接著,不對所獲得之反應溶液進行後處理,而向該反應溶液中添加水3.00g(0.167莫耳),並在70℃反應了2小時。 將所獲得之反應溶液用MEK進行稀釋,並且用檸檬酸水溶液進行處理,藉此從反應溶液中去除了水相。進而,藉由以下的程序進行液液萃取,接著進行了溶劑置換。 ·液液萃取:將反應溶液用MEK進行稀釋,接著加入水進行處理,藉此從反應溶液中去除水相之後,進一步進行了1次相同的操作。 ·溶劑置換:利用旋轉蒸發器將所獲得之反應混合物在減壓下且在50℃進行了溶劑的去除。確認聚合物溶液的固體成分濃度在藉由加熱乾燥式水分計之測量中成為27±2質量%,並中斷了去除溶劑之操作。其後,加入PGMEA以使固體成分濃度成為18質量%,並混合至變均勻。藉由相同的操作,進一步反覆進行了2次如下操作:在減壓下於50℃進行溶劑的去除,將固體成分濃度在藉由加熱乾燥式水分計之測量中調整為27±2質量%之後,進一步加入PGMEA以使固體成分濃度成為18質量%,並混合至變均勻。其後,進行了如下操作:去除溶劑或者加入PGMEA以使固體成分濃度成為30±3質量%,並攪拌至變均勻。藉由以上的操作,反應中所使用之溶劑被去除,溶劑被置換為PGMEA。其後,藉由以下程序進一步進行了純化。 ·用過量的甲苯使聚合物再沉澱。 ·反覆進行了2次用過量的甲苯將藉由再沉澱而獲得之聚合物粉末進行洗淨之操作。 ·進行了3次用過量的水將上述洗淨2次之後的聚合物粉末進行洗淨之操作。 ·將所獲得之反應產物在40℃乾燥了12小時。 藉由以上,製作出原料聚合物1的MA單元用3官能(甲基)丙烯酸化合物、單官能(甲基)丙烯酸化合物及水開環之聚合物P2。 針對所獲得之聚合物P2實施GPC測量而測量了聚合物P2的重量平均分子量及多分散性。將結果示於表2。 又,藉由聚合物P2的GPC測量,確認到所使用之多官能(甲基)丙烯酸化合物及單官能(甲基)丙烯酸化合物的峰的消失。藉此,確認到在所獲得之聚合物P2中既不含有未反應的多官能(甲基)丙烯酸化合物,亦不含有單官能(甲基)丙烯酸化合物。 又,藉由 13C-NMR測量,確認到聚合物P2具有來自於順丁烯二酸酐之結構單元用A-TMM-3LM-N、4-HBA及水開環之結構。 (Preparation Example 2) A polymer P2 in which the MA unit of the raw material polymer 1 was ring-opened with a trifunctional (meth)acrylic acid compound, a monofunctional (meth)acrylic acid compound and water was produced. The details are explained below. First, 99.93 g of MEK was added to 60.00 g of the raw material polymer 1 (0.312 mol calculated from the input amount of the raw material polymer 1 and converted to MA) to prepare a solution. Next, 77.49 g of A-TMM-3LM-N was added to the solution, and then 18.00 g (0.178 mol) of triethylamine was added, and the reaction was carried out at a temperature of 70° C. for 2 hours. Thereafter, 56.27 g (0.390 mol) of 4-HBA was further added, and the reaction was carried out at a temperature of 70° C. for 4 hours to prepare a reaction solution. Next, without post-processing the obtained reaction solution, 3.00 g (0.167 mol) of water was added to the reaction solution, and the reaction was carried out at 70° C. for 2 hours. The obtained reaction solution was diluted with MEK and treated with a citric acid aqueous solution, thereby removing the aqueous phase from the reaction solution. Furthermore, liquid-liquid extraction was performed by the following procedure, and then solvent replacement was performed. ·Liquid-liquid extraction: The reaction solution was diluted with MEK, and then water was added for treatment to remove the aqueous phase from the reaction solution. The same operation was further performed once. ·Solvent replacement: The solvent was removed from the obtained reaction mixture using a rotary evaporator under reduced pressure and at 50°C. It was confirmed that the solid content concentration of the polymer solution was 27±2% by mass as measured by a heating drying moisture meter, and the operation of removing the solvent was discontinued. Thereafter, PGMEA was added so that the solid content concentration became 18% by mass, and the mixture was mixed until uniform. The same operation was repeated two more times: the solvent was removed under reduced pressure at 50°C, and the solid content concentration was adjusted to 27±2 mass% by measurement with a heating drying moisture meter. , further add PGMEA so that the solid content concentration becomes 18% by mass, and mix until uniform. Thereafter, the solvent was removed or PGMEA was added so that the solid content concentration became 30±3% by mass, and the mixture was stirred until it became uniform. Through the above operation, the solvent used in the reaction was removed and the solvent was replaced with PGMEA. Thereafter, further purification was carried out by the following procedure. • The polymer was reprecipitated with excess toluene. ·The operation of washing the polymer powder obtained by reprecipitation with excess toluene was repeated twice. ·The polymer powder washed twice with excess water was washed three times. ·The reaction product obtained was dried at 40°C for 12 hours. Through the above, a polymer P2 in which the MA unit of the raw material polymer 1 was ring-opened with a trifunctional (meth)acrylic acid compound, a monofunctional (meth)acrylic acid compound and water was produced. GPC measurement was performed on the obtained polymer P2, and the weight average molecular weight and polydispersity of the polymer P2 were measured. The results are shown in Table 2. Furthermore, GPC measurement of the polymer P2 confirmed the disappearance of the peaks of the polyfunctional (meth)acrylic compound and the monofunctional (meth)acrylic compound used. This confirmed that the obtained polymer P2 contained neither an unreacted polyfunctional (meth)acrylic compound nor a monofunctional (meth)acrylic compound. Furthermore, through 13 C-NMR measurement, it was confirmed that polymer P2 has a structure in which structural units derived from maleic anhydride are ring-opened with A-TMM-3LM-N, 4-HBA and water.

(製備例3) 製作出含有使原料聚合物1的MA單元用3官能(甲基)丙烯酸化合物、單官能(甲基)丙烯酸化合物及水開環而獲得之聚合物P3之樹脂混合物(聚合物溶液P3)。以下,對詳細內容進行說明。 首先,對原料聚合物1 60.00g(由原料聚合物1的投入量算出並以MA換算為0.312莫耳)加入MEK 99.93g而製作出溶解液。接著,對該溶解液加入A-TMM-3LM-N 77.49g,其後,加入三乙胺18.00g(0.178莫耳),並在溫度70℃反應了2小時。其後,進一步加入4-HBA 56.27g(0.390莫耳),並在溫度70℃反應4小時而製作出反應溶液。 接著,不對所獲得之反應溶液進行後處理,而向該反應溶液中添加水3.00g(0.167莫耳),並在70℃反應了2小時。 將所獲得之反應溶液用MEK進行稀釋,並且用甲酸水溶液及檸檬酸水溶液進行處理,藉此從反應溶液中去除了水相。進而,藉由以下的程序進行液液萃取,接著進行了溶劑置換。 ·液液萃取:將反應溶液用MEK進行稀釋,接著加入水進行處理,藉此從反應溶液中去除水相之後,進一步進行了1次相同的操作。 ·溶劑置換:利用旋轉蒸發器將所獲得之反應混合物在減壓下且在50℃進行了溶劑的去除。確認聚合物溶液的固體成分濃度在藉由加熱乾燥式水分計之測量中成為27±2質量%,並中斷了去除溶劑之操作。其後,加入PGMEA以使固體成分濃度成為18質量%,並混合至變均勻。藉由相同的操作,進一步反覆進行了2次如下操作:在減壓下於50℃進行溶劑的去除,將固體成分濃度在藉由加熱乾燥式水分計之測量中調整為27±2質量%之後,進一步加入PGMEA以使固體成分濃度成為18質量%,並混合至變均勻。其後,進行了如下操作:去除溶劑或者加入PGMEA以使固體成分濃度成為30±3質量%,並攪拌至變均勻。藉由以上的操作,反應中所使用之溶劑被去除,溶劑被置換為PGMEA。 (Preparation Example 3) A resin mixture (polymer solution P3) containing polymer P3 obtained by ring-opening the MA unit of the raw material polymer 1 with a trifunctional (meth)acrylic acid compound, a monofunctional (meth)acrylic acid compound, and water was produced. The details are explained below. First, 99.93 g of MEK was added to 60.00 g of the raw material polymer 1 (0.312 mol calculated from the input amount of the raw material polymer 1 and converted to MA) to prepare a solution. Next, 77.49 g of A-TMM-3LM-N was added to the solution, and then 18.00 g (0.178 mol) of triethylamine was added, and the reaction was carried out at a temperature of 70° C. for 2 hours. Thereafter, 56.27 g (0.390 mol) of 4-HBA was further added, and the reaction was carried out at a temperature of 70° C. for 4 hours to prepare a reaction solution. Next, without post-processing the obtained reaction solution, 3.00 g (0.167 mol) of water was added to the reaction solution, and the reaction was carried out at 70° C. for 2 hours. The obtained reaction solution was diluted with MEK, and treated with a formic acid aqueous solution and a citric acid aqueous solution, thereby removing the aqueous phase from the reaction solution. Furthermore, liquid-liquid extraction was performed by the following procedure, and then solvent replacement was performed. ·Liquid-liquid extraction: The reaction solution was diluted with MEK, and then water was added for treatment to remove the aqueous phase from the reaction solution. The same operation was further performed once. ·Solvent replacement: The solvent was removed from the obtained reaction mixture using a rotary evaporator under reduced pressure and at 50°C. It was confirmed that the solid content concentration of the polymer solution was 27±2% by mass as measured by a heating drying moisture meter, and the operation of removing the solvent was discontinued. Thereafter, PGMEA was added so that the solid content concentration became 18% by mass, and the mixture was mixed until uniform. The same operation was repeated two more times: the solvent was removed under reduced pressure at 50°C, and the solid content concentration was adjusted to 27±2 mass% by measurement with a heating drying moisture meter. , further add PGMEA so that the solid content concentration becomes 18% by mass, and mix until uniform. Thereafter, the solvent was removed or PGMEA was added so that the solid content concentration became 30±3% by mass, and the mixture was stirred until it became uniform. Through the above operation, the solvent used in the reaction was removed and the solvent was replaced with PGMEA.

藉由以上,獲得了含有原料聚合物1中的來自於順丁烯二酸酐之結構單元用A-TMM-3LM-N、4-HBA及水開環之聚合物P3、殘存(游離)A-TMM-3LM-N及殘存(游離)4-HBA之樹脂混合物(聚合物溶液P3)。 利用凝膠滲透層析法對所獲得之聚合物溶液P3進行分析而測量了溶液中所含有之聚合物P3、游離多官能(甲基)丙烯酸化合物及游離單官能(甲基)丙烯酸化合物的量以及聚合物P3的重量平均分子量及多分散性。將結果示於表2。再者,游離(甲基)丙烯酸化合物的量係以樹脂混合物的凝膠滲透層析(GPC)圖譜中之游離(甲基)丙烯酸化合物的峰面積相對於聚合物P3的峰面積之比例(%)表示。 再者,凝膠滲透層析法的測量條件如下。 ·作為GPC測量裝置,使用了TOSOH CORPORATION的HLC-8320GPC EcoSEC。管柱溫度設定為40.0℃,泵流量設定為0.350mL/分鐘。 ·峰位置(保持時間) 聚合物P3:在20分之前檢測出之峰(與A-TMM-3LM-N和4-HBA相比,保持時間短、分子量大的峰) A-TMM-3LM-N:20.0~20.6分和20.6~21.5分的2個峰的合計 4-HBA:21.7~22.4分 ·測量條件:用示差折射率檢測器(RI檢測器)進行了分析。 Through the above, a polymer P3 containing structural units derived from maleic anhydride in the base polymer 1 ring-opened with A-TMM-3LM-N, 4-HBA and water, and remaining (free) A- was obtained. Resin mixture of TMM-3LM-N and residual (free) 4-HBA (polymer solution P3). The obtained polymer solution P3 was analyzed by gel permeation chromatography, and the amounts of the polymer P3, the free multifunctional (meth)acrylic acid compound, and the free monofunctional (meth)acrylic acid compound contained in the solution were measured. and the weight average molecular weight and polydispersity of polymer P3. The results are shown in Table 2. Furthermore, the amount of the free (meth)acrylic acid compound is based on the ratio (%) of the peak area of the free (meth)acrylic acid compound to the peak area of the polymer P3 in the gel permeation chromatography (GPC) spectrum of the resin mixture. )express. In addition, the measurement conditions of gel permeation chromatography are as follows. ・As a GPC measurement device, TOSOH CORPORATION's HLC-8320GPC EcoSEC was used. The column temperature was set to 40.0°C, and the pump flow rate was set to 0.350 mL/min. ·Peak position (hold time) Polymer P3: Peak detected 20 minutes ago (peak with shorter retention time and larger molecular weight than A-TMM-3LM-N and 4-HBA) A-TMM-3LM-N: Total of 2 peaks: 20.0 to 20.6 points and 20.6 to 21.5 points 4-HBA: 21.7~22.4 points ·Measurement conditions: Analysis was performed using a differential refractive index detector (RI detector).

(製備例4) 代替原料聚合物1而使用了原料聚合物2 60.00g(由原料聚合物2的投入量算出並以MA換算為0.312莫耳),除此以外,以與製備例3相同的方式製作出含有使原料聚合物2的MA單元用3官能(甲基)丙烯酸化合物、單官能(甲基)丙烯酸化合物及水開環而獲得之聚合物P4之樹脂混合物(聚合物溶液P4)。 (Preparation Example 4) In place of the raw polymer 1, 60.00 g of the raw polymer 2 (0.312 mol calculated from the input amount of the raw polymer 2 and converted to MA) was used in the same manner as in Preparation Example 3. A resin mixture of polymer P4 (polymer solution P4) obtained by ring-opening the MA unit of raw material polymer 2 with a trifunctional (meth)acrylic acid compound, a monofunctional (meth)acrylic acid compound and water.

在與製備例3相同的條件下,藉由凝膠滲透層析法分析所獲得之聚合物溶液P4而測量了溶液中所含有之聚合物P4、游離多官能(甲基)丙烯酸化合物及游離單官能(甲基)丙烯酸化合物的量以及聚合物P4的重量平均分子量及多分散性。將結果示於表2。再者,游離(甲基)丙烯酸化合物的量係以樹脂混合物的凝膠滲透層析(GPC)圖譜中之游離(甲基)丙烯酸化合物的峰面積相對於聚合物P4的峰面積之比例(%)表示。Under the same conditions as Preparation Example 3, the obtained polymer solution P4 was analyzed by gel permeation chromatography to measure the polymer P4, free polyfunctional (meth)acrylic acid compound and free monomer contained in the solution. The amount of functional (meth)acrylic compounds and the weight average molecular weight and polydispersity of polymer P4. The results are shown in Table 2. Furthermore, the amount of the free (meth)acrylic acid compound is based on the ratio (%) of the peak area of the free (meth)acrylic acid compound to the peak area of the polymer P4 in the gel permeation chromatography (GPC) spectrum of the resin mixture. )express.

(製備例5) 使用了116.24g的A-TMM-3LM-N,除此以外,以與製備例4相同的方式製作出含有使原料聚合物2的MA單元用3官能(甲基)丙烯酸化合物、單官能(甲基)丙烯酸化合物及水開環而獲得之聚合物P5之樹脂混合物(聚合物溶液P5)。 (Preparation Example 5) Except for using 116.24 g of A-TMM-3LM-N, in the same manner as in Preparation Example 4, a preparation containing a trifunctional (meth)acrylic acid compound, a monofunctional (meth)acrylic acid compound and a monofunctional (meth)acrylic acid compound were used as the MA unit of the raw material polymer 2. A resin mixture (polymer solution P5) of polymer P5 obtained by ring-opening of an acrylic compound and water.

在與製備例3相同的條件下,藉由凝膠滲透層析法分析所獲得之聚合物溶液P5而測量了溶液中所含有之聚合物P5、游離多官能(甲基)丙烯酸化合物及游離單官能(甲基)丙烯酸化合物的量以及聚合物P5的重量平均分子量及多分散性。將結果示於表2。再者,游離(甲基)丙烯酸化合物的量係以樹脂混合物的凝膠滲透層析(GPC)圖譜中之游離(甲基)丙烯酸化合物的峰面積相對於聚合物P5的峰面積之比例(%)表示。Under the same conditions as Preparation Example 3, the obtained polymer solution P5 was analyzed by gel permeation chromatography to measure the polymer P5, free polyfunctional (meth)acrylic acid compound and free monomer contained in the solution. The amount of functional (meth)acrylic compounds and the weight average molecular weight and polydispersity of polymer P5. The results are shown in Table 2. Furthermore, the amount of the free (meth)acrylic acid compound is based on the ratio (%) of the peak area of the free (meth)acrylic acid compound to the peak area of the polymer P5 in the gel permeation chromatography (GPC) spectrum of the resin mixture. )express.

(製備例6) 代替原料聚合物1而使用了原料聚合物4 10.00g(由根據原料聚合物4的GC測量計算之組成比算出並以MA換算之莫耳為0.034莫耳),除此以外,以與製備例1相同的方式製作出使原料聚合物4的MA單元用單官能(甲基)丙烯酸化合物開環而獲得之聚合物P6。 針對所獲得之聚合物P6實施GPC測量而測量了聚合物P6的重量平均分子量及多分散性。將結果示於表2。 又,藉由聚合物P6的GPC測量,確認到所使用之單官能(甲基)丙烯酸化合物的峰的消失。藉此,確認到在所獲得之聚合物P6中不包含未反應的單官能(甲基)丙烯酸化合物。 又,藉由 13C-NMR測量,確認到聚合物P6具有來自於順丁烯二酸酐之結構單元用4-HBA開環之結構。 (Preparation Example 6) In place of the raw polymer 1, 10.00 g of the raw polymer 4 was used (the mole calculated from the composition ratio calculated based on the GC measurement of the raw polymer 4 and converted to MA was 0.034 mol). , polymer P6 obtained by ring-opening the MA unit of the raw material polymer 4 with a monofunctional (meth)acrylic acid compound was produced in the same manner as in Preparation Example 1. GPC measurement was performed on the obtained polymer P6, and the weight average molecular weight and polydispersity of the polymer P6 were measured. The results are shown in Table 2. Furthermore, GPC measurement of polymer P6 confirmed the disappearance of the peak of the monofunctional (meth)acrylic acid compound used. Through this, it was confirmed that the unreacted monofunctional (meth)acrylic acid compound was not included in the obtained polymer P6. Furthermore, through 13 C-NMR measurement, it was confirmed that polymer P6 has a structure in which the structural unit derived from maleic anhydride is ring-opened with 4-HBA.

(製備例7) 代替原料聚合物1而使用了原料聚合物3 60.00g(由根據原料聚合物3的GC測量計算之組成比算出並以MA換算之莫耳為0.220莫耳),除此以外,以與製備例3相同的方式製作出含有使原料聚合物3的MA單元用3官能(甲基)丙烯酸化合物、單官能(甲基)丙烯酸化合物及水開環而獲得之聚合物P7之樹脂混合物(聚合物溶液P7)。 在與製備例3相同的條件下,藉由凝膠滲透層析法分析所獲得之聚合物溶液P7而測量了聚合物溶液P7中所含有之聚合物P7、游離多官能(甲基)丙烯酸化合物及游離單官能(甲基)丙烯酸化合物的量以及聚合物P11的重量平均分子量及多分散性。將結果示於表2。再者,游離(甲基)丙烯酸化合物的量係以樹脂混合物的凝膠滲透層析(GPC)圖譜中之游離(甲基)丙烯酸化合物的峰面積相對於聚合物P7的峰面積之比例(%)表示。 (Preparation Example 7) Except for using 60.00 g of the raw polymer 3 instead of the raw polymer 1 (the mole calculated from the composition ratio calculated based on the GC measurement of the raw polymer 3 and converted to MA is 0.220 mol), the same procedures as those in the Preparation Examples were used. 3. In the same manner, a resin mixture (polymer solution) containing polymer P7 obtained by ring-opening the MA unit of raw material polymer 3 with a trifunctional (meth)acrylic acid compound, a monofunctional (meth)acrylic acid compound, and water was produced. P7). Under the same conditions as Preparation Example 3, the polymer solution P7 obtained was analyzed by gel permeation chromatography to measure the polymer P7 and the free polyfunctional (meth)acrylic acid compound contained in the polymer solution P7. and the amount of free monofunctional (meth)acrylic acid compounds as well as the weight average molecular weight and polydispersity of polymer P11. The results are shown in Table 2. Furthermore, the amount of the free (meth)acrylic acid compound is based on the ratio (%) of the peak area of the free (meth)acrylic acid compound to the peak area of the polymer P7 in the gel permeation chromatography (GPC) spectrum of the resin mixture. )express.

(製備例8) 代替原料聚合物1而使用了原料聚合物4 60.00g(由根據原料聚合物4的GC測量計算之組成比算出並以MA換算之莫耳為0.204莫耳),除此以外,以與製備例2相同的方式製作出原料聚合物4的MA單元用3官能(甲基)丙烯酸化合物、單官能(甲基)丙烯酸化合物及水開環之聚合物P8。 針對所獲得之聚合物P8實施GPC測量而測量了聚合物P8的重量平均分子量及多分散性。將結果示於表2。 又,藉由聚合物P8的GPC測量,確認到所使用之多官能(甲基)丙烯酸化合物及單官能(甲基)丙烯酸化合物的峰的消失。藉此,確認到在所獲得之聚合物P8中既不含有未反應的多官能(甲基)丙烯酸化合物,亦不含有單官能(甲基)丙烯酸化合物。 又,藉由 13C-NMR測量,確認到聚合物P8具有來自於順丁烯二酸酐之結構單元用A-TMM-3LM-N、4-HBA及水開環之結構。 (Preparation Example 8) In place of the base polymer 1, 60.00 g of the base polymer 4 was used (the mole calculated from the composition ratio calculated based on the GC measurement of the base polymer 4 and converted to MA was 0.204 mol). , in the same manner as in Preparation Example 2, a polymer P8 in which the MA unit of the raw material polymer 4 was ring-opened with a trifunctional (meth)acrylic acid compound, a monofunctional (meth)acrylic acid compound and water was produced. GPC measurement was performed on the obtained polymer P8, and the weight average molecular weight and polydispersity of the polymer P8 were measured. The results are shown in Table 2. Furthermore, GPC measurement of polymer P8 confirmed the disappearance of the peaks of the polyfunctional (meth)acrylic compound and the monofunctional (meth)acrylic compound used. From this, it was confirmed that the obtained polymer P8 contained neither an unreacted polyfunctional (meth)acrylic compound nor a monofunctional (meth)acrylic compound. Furthermore, through 13 C-NMR measurement, it was confirmed that polymer P8 has a structure in which structural units derived from maleic anhydride are ring-opened with A-TMM-3LM-N, 4-HBA and water.

(製備例9) 代替原料聚合物2而使用了原料聚合物4 60.00g(由根據原料聚合物4的GC測量計算之組成比算出並以MA換算之莫耳為0.204莫耳),除此以外,以與製備例4相同的方式製作出含有使原料聚合物4的MA單元用3官能(甲基)丙烯酸化合物、單官能(甲基)丙烯酸化合物及水開環而獲得之聚合物P9之樹脂混合物(聚合物溶液P9)。 在與製備例3相同的條件下,藉由凝膠滲透層析法分析所獲得之聚合物溶液P9而測量了溶液中所含有之聚合物P9、游離多官能(甲基)丙烯酸化合物及游離單官能(甲基)丙烯酸化合物的量以及聚合物P9的重量平均分子量及多分散性。將結果示於表2。再者,游離(甲基)丙烯酸化合物的量係以樹脂混合物的凝膠滲透層析(GPC)圖譜中之游離(甲基)丙烯酸化合物的峰面積相對於聚合物P9的峰面積之比例(%)表示。 (Preparation Example 9) Except for using 60.00 g of the base polymer 4 instead of the base polymer 2 (the mole calculated from the composition ratio calculated based on the GC measurement of the base polymer 4 and converted to MA was 0.204 mol), the same procedures as those in the Preparation Examples were used. 4 In the same manner, a resin mixture (polymer solution) containing polymer P9 obtained by ring-opening the MA unit of raw material polymer 4 with a trifunctional (meth)acrylic acid compound, a monofunctional (meth)acrylic acid compound, and water was produced. P9). Under the same conditions as Preparation Example 3, the obtained polymer solution P9 was analyzed by gel permeation chromatography to measure the polymer P9, free polyfunctional (meth)acrylic acid compound and free monomer contained in the solution. The amount of functional (meth)acrylic compounds and the weight average molecular weight and polydispersity of polymer P9. The results are shown in Table 2. Furthermore, the amount of the free (meth)acrylic acid compound is based on the ratio (%) of the peak area of the free (meth)acrylic acid compound to the peak area of the polymer P9 in the gel permeation chromatography (GPC) spectrum of the resin mixture. )express.

(製備例10) 代替原料聚合物2而使用了原料聚合物4 60.00g(由根據原料聚合物4的GC測量計算之組成比算出並以MA換算之莫耳為0.204莫耳),除此以外,以與製備例5相同的方式製作出含有使原料聚合物4的MA單元用3官能(甲基)丙烯酸化合物、單官能(甲基)丙烯酸化合物及水開環而獲得之聚合物P10之樹脂混合物(聚合物溶液P10)。 在與製備例5相同的條件下,藉由凝膠滲透層析法分析所獲得之聚合物溶液P10而測量了溶液中所含有之聚合物P10、游離多官能(甲基)丙烯酸化合物及游離單官能(甲基)丙烯酸化合物的量以及聚合物P10的重量平均分子量及多分散性。將結果示於表2。再者,游離(甲基)丙烯酸化合物的量係以樹脂混合物的凝膠滲透層析(GPC)圖譜中之游離(甲基)丙烯酸化合物的峰面積相對於聚合物P10的峰面積之比例(%)表示。 (Preparation Example 10) Except for using 60.00 g of the base polymer 4 instead of the base polymer 2 (the mole calculated from the composition ratio calculated based on the GC measurement of the base polymer 4 and converted to MA was 0.204 mol), the same procedures as those in the Preparation Examples were used. 5 In the same manner, a resin mixture (polymer solution) containing polymer P10 obtained by ring-opening the MA unit of raw material polymer 4 with a trifunctional (meth)acrylic acid compound, a monofunctional (meth)acrylic acid compound, and water was produced. P10). Under the same conditions as Preparation Example 5, the obtained polymer solution P10 was analyzed by gel permeation chromatography to measure the polymer P10, free polyfunctional (meth)acrylic acid compound and free monomer contained in the solution. The amount of functional (meth)acrylic compounds and the weight average molecular weight and polydispersity of polymer P10. The results are shown in Table 2. Furthermore, the amount of the free (meth)acrylic acid compound is based on the ratio (%) of the peak area of the free (meth)acrylic acid compound to the peak area of the polymer P10 in the gel permeation chromatography (GPC) spectrum of the resin mixture. )express.

(製備例11) 代替原料聚合物3而使用了原料聚合物5 60.00g(由根據原料聚合物5的GC測量計算之組成比算出並以MA換算之莫耳為0.239莫耳),除此以外,以與製備例7相同的方式製作出含有使原料聚合物5的MA單元用3官能(甲基)丙烯酸化合物、單官能(甲基)丙烯酸化合物及水開環而獲得之聚合物P11之樹脂混合物(聚合物溶液P11)。 在與製備例3相同的條件下,藉由凝膠滲透層析法分析所獲得之聚合物溶液P11而測量了溶液中所含有之聚合物P11、游離多官能(甲基)丙烯酸化合物及游離單官能(甲基)丙烯酸化合物的量以及聚合物P11的重量平均分子量及多分散性。將結果示於表2。再者,游離(甲基)丙烯酸化合物的量係以樹脂混合物的凝膠滲透層析(GPC)圖譜中之游離(甲基)丙烯酸化合物的峰面積相對於聚合物P11的峰面積之比例(%)表示。 (Preparation Example 11) Except for using 60.00 g of the base polymer 5 instead of the base polymer 3 (the mole calculated from the composition ratio calculated based on the GC measurement of the base polymer 5 and converted to MA was 0.239 mol), the same procedures as those in the Preparation Examples were used. 7 In the same manner, a resin mixture (polymer solution) containing polymer P11 obtained by ring-opening the MA unit of raw polymer 5 with a trifunctional (meth)acrylic acid compound, a monofunctional (meth)acrylic acid compound, and water was produced. P11). Under the same conditions as Preparation Example 3, the obtained polymer solution P11 was analyzed by gel permeation chromatography to measure the polymer P11, free polyfunctional (meth)acrylic acid compound and free monomer contained in the solution. The amount of functional (meth)acrylic compounds and the weight average molecular weight and polydispersity of polymer P11. The results are shown in Table 2. Furthermore, the amount of the free (meth)acrylic acid compound is based on the ratio (%) of the peak area of the free (meth)acrylic acid compound to the peak area of the polymer P11 in the gel permeation chromatography (GPC) spectrum of the resin mixture. )express.

(製備例12) 代替原料聚合物4而使用了原料聚合物5 60.00g(由根據原料聚合物5的GC測量計算之組成比算出並以MA換算之莫耳為0.239莫耳),除此以外,以與製備例8相同的方式製作出原料聚合物5的MA單元用3官能(甲基)丙烯酸化合物、單官能(甲基)丙烯酸化合物及水開環之聚合物P12。 針對所獲得之聚合物P12實施GPC測量而測量了聚合物P12的重量平均分子量及多分散性。將結果示於表2。 又,藉由聚合物P12的GPC測量,確認到所使用之多官能(甲基)丙烯酸化合物及單官能(甲基)丙烯酸化合物的峰的消失。藉此,確認到在所獲得之聚合物P8中既不含有未反應的多官能(甲基)丙烯酸化合物,亦不含有單官能(甲基)丙烯酸化合物。 又,藉由 13C-NMR測量,確認到聚合物P12具有來自於順丁烯二酸酐之結構單元用A-TMM-3LM-N、4-HBA及水開環之結構。 (Preparation Example 12) In place of the base polymer 4, 60.00 g of the base polymer 5 was used (the mole calculated from the composition ratio calculated based on the GC measurement of the base polymer 5 and converted to MA was 0.239 mol). , in the same manner as in Preparation Example 8, a polymer P12 in which the MA unit of the raw material polymer 5 was ring-opened with a trifunctional (meth)acrylic acid compound, a monofunctional (meth)acrylic acid compound and water was produced. GPC measurement was performed on the obtained polymer P12, and the weight average molecular weight and polydispersity of the polymer P12 were measured. The results are shown in Table 2. Furthermore, GPC measurement of polymer P12 confirmed the disappearance of the peaks of the polyfunctional (meth)acrylic compound and the monofunctional (meth)acrylic compound used. From this, it was confirmed that the obtained polymer P8 contained neither an unreacted polyfunctional (meth)acrylic compound nor a monofunctional (meth)acrylic compound. Furthermore, through 13 C-NMR measurement, it was confirmed that polymer P12 has a structure in which structural units derived from maleic anhydride are ring-opened with A-TMM-3LM-N, 4-HBA and water.

(製備例13) 代替原料聚合物3而使用了原料聚合物6 60.00g(由根據原料聚合物6的GC測量計算之組成比算出並以MA換算之莫耳為0.230莫耳),除此以外,以與製備例7相同的方式製作出含有使原料聚合物6的MA單元用3官能(甲基)丙烯酸化合物、單官能(甲基)丙烯酸化合物及水開環而獲得之聚合物P13之樹脂混合物(聚合物溶液P13)。 在與製備例3相同的條件下,藉由凝膠滲透層析法分析所獲得之聚合物溶液P13而測量了溶液中所含有之聚合物P13、游離多官能(甲基)丙烯酸化合物及游離單官能(甲基)丙烯酸化合物的量以及聚合物P13的重量平均分子量及多分散性。將結果示於表2。再者,游離(甲基)丙烯酸化合物的量係以樹脂混合物的凝膠滲透層析(GPC)圖譜中之游離(甲基)丙烯酸化合物的峰面積相對於聚合物P13的峰面積之比例(%)表示。 (Preparation Example 13) Except for using 60.00 g of the raw polymer 6 instead of the raw polymer 3 (the mole calculated from the composition ratio calculated based on the GC measurement of the raw polymer 6 and converted to MA is 0.230 mol), the same procedures as those in the Preparation Examples were used. 7 In the same manner, a resin mixture (polymer solution) containing polymer P13 obtained by ring-opening the MA unit of raw material polymer 6 with a trifunctional (meth)acrylic acid compound, a monofunctional (meth)acrylic acid compound, and water was produced. P13). Under the same conditions as Preparation Example 3, the obtained polymer solution P13 was analyzed by gel permeation chromatography to measure the polymer P13, free polyfunctional (meth)acrylic acid compound and free monomer contained in the solution. The amount of functional (meth)acrylic compounds and the weight average molecular weight and polydispersity of polymer P13. The results are shown in Table 2. Furthermore, the amount of the free (meth)acrylic acid compound is based on the ratio (%) of the peak area of the free (meth)acrylic acid compound to the peak area of the polymer P13 in the gel permeation chromatography (GPC) spectrum of the resin mixture. )express.

(製備例14) 代替原料聚合物4而使用了原料聚合物6 60.00g(由根據原料聚合物6的GC測量計算之組成比算出並以MA換算之莫耳為0.230莫耳),除此以外,以與製備例8相同的方式製作出原料聚合物6的MA單元用3官能(甲基)丙烯酸化合物、單官能(甲基)丙烯酸化合物及水開環之聚合物P14。 針對所獲得之聚合物P14實施GPC測量而測量了聚合物P14的重量平均分子量及多分散性。將結果示於表2。 又,藉由聚合物P14的GPC測量,確認到所使用之多官能(甲基)丙烯酸化合物及單官能(甲基)丙烯酸化合物的峰的消失。藉此,確認到在所獲得之聚合物P8中既不含有未反應的多官能(甲基)丙烯酸化合物,亦不含有單官能(甲基)丙烯酸化合物。 又,藉由 13C-NMR測量,確認到聚合物P14具有來自於順丁烯二酸酐之結構單元用A-TMM-3LM-N、4-HBA及水開環之結構。 (Preparation Example 14) In place of the base polymer 4, 60.00 g of the base polymer 6 was used (the mole calculated from the composition ratio calculated based on the GC measurement of the base polymer 6 and converted to MA was 0.230 mol). , in the same manner as in Preparation Example 8, a polymer P14 in which the MA unit of the raw material polymer 6 was ring-opened with a trifunctional (meth)acrylic acid compound, a monofunctional (meth)acrylic acid compound and water was produced. GPC measurement was performed on the obtained polymer P14, and the weight average molecular weight and polydispersity of the polymer P14 were measured. The results are shown in Table 2. Furthermore, GPC measurement of polymer P14 confirmed the disappearance of the peaks of the polyfunctional (meth)acrylic compound and the monofunctional (meth)acrylic compound used. From this, it was confirmed that the obtained polymer P8 contained neither an unreacted polyfunctional (meth)acrylic compound nor a monofunctional (meth)acrylic compound. Furthermore, through 13 C-NMR measurement, it was confirmed that polymer P14 has a structure in which structural units derived from maleic anhydride are ring-opened with A-TMM-3LM-N, 4-HBA and water.

(製備例15) 代替原料聚合物3而使用了原料聚合物7 60.00g(由根據原料聚合物7的GC測量計算之組成比算出並以MA換算之莫耳為0.213莫耳),除此以外,以與製備例7相同的方式製作出含有使原料聚合物7的MA單元用3官能(甲基)丙烯酸化合物、單官能(甲基)丙烯酸化合物及水開環而獲得之聚合物P15之樹脂混合物(聚合物溶液P15)。 在與製備例3相同的條件下,藉由凝膠滲透層析法分析所獲得之聚合物溶液P15而測量了溶液中所含有之聚合物P15、游離多官能(甲基)丙烯酸化合物及游離單官能(甲基)丙烯酸化合物的量以及聚合物P15的重量平均分子量及多分散性。將結果示於表2。再者,游離(甲基)丙烯酸化合物的量係以樹脂混合物的凝膠滲透層析(GPC)圖譜中之游離(甲基)丙烯酸化合物的峰面積相對於聚合物P15的峰面積之比例(%)表示。 (Preparation Example 15) Except that 60.00 g of raw polymer 7 was used instead of raw polymer 3 (moles calculated from the composition ratio calculated based on GC measurement of raw polymer 7 and converted to MA was 0.213 mol), the same procedures were used as in the preparation examples. 7. In the same manner, a resin mixture (polymer solution) containing polymer P15 obtained by ring-opening the MA unit of raw material polymer 7 with a trifunctional (meth)acrylic acid compound, a monofunctional (meth)acrylic acid compound, and water was produced. P15). Under the same conditions as Preparation Example 3, the obtained polymer solution P15 was analyzed by gel permeation chromatography to measure the polymer P15, free polyfunctional (meth)acrylic acid compound and free monomer contained in the solution. The amount of functional (meth)acrylic compounds and the weight average molecular weight and polydispersity of polymer P15. The results are shown in Table 2. Furthermore, the amount of free (meth)acrylic acid compound is based on the ratio (%) of the peak area of the free (meth)acrylic acid compound to the peak area of polymer P15 in the gel permeation chromatography (GPC) spectrum of the resin mixture. )express.

(製備例16) 代替原料聚合物4而使用了原料聚合物7 60.00g(由根據原料聚合物7的GC測量計算之組成比算出並以MA換算之莫耳為0.213莫耳),除此以外,以與製備例8相同的方式製作出原料聚合物7的MA單元用3官能(甲基)丙烯酸化合物、單官能(甲基)丙烯酸化合物及水開環之聚合物P16。 針對所獲得之聚合物P16實施GPC測量而測量了聚合物P14的重量平均分子量及多分散性。將結果示於表2。 又,藉由聚合物P16的GPC測量,確認到所使用之多官能(甲基)丙烯酸化合物及單官能(甲基)丙烯酸化合物的峰的消失。藉此,確認到在所獲得之聚合物P8中既不含有未反應的多官能(甲基)丙烯酸化合物,亦不含有單官能(甲基)丙烯酸化合物。 又,藉由 13C-NMR測量,確認到聚合物P16具有來自於順丁烯二酸酐之結構單元用A-TMM-3LM-N、4-HBA及水開環之結構。 (Preparation Example 16) In place of the base polymer 4, 60.00 g of the base polymer 7 was used (the mole calculated from the composition ratio calculated based on the GC measurement of the base polymer 7 and converted to MA was 0.213 mol). , in the same manner as in Preparation Example 8, a polymer P16 in which the MA unit of the raw material polymer 7 was ring-opened with a trifunctional (meth)acrylic acid compound, a monofunctional (meth)acrylic acid compound and water was produced. GPC measurement was performed on the obtained polymer P16, and the weight average molecular weight and polydispersity of the polymer P14 were measured. The results are shown in Table 2. Furthermore, GPC measurement of polymer P16 confirmed the disappearance of the peaks of the polyfunctional (meth)acrylic compound and the monofunctional (meth)acrylic compound used. From this, it was confirmed that the obtained polymer P8 contained neither an unreacted polyfunctional (meth)acrylic compound nor a monofunctional (meth)acrylic compound. Furthermore, through 13 C-NMR measurement, it was confirmed that polymer P16 has a structure in which structural units derived from maleic anhydride are ring-opened with A-TMM-3LM-N, 4-HBA and water.

(製備例17) 代替原料聚合物3而使用了原料聚合物8 60.00g(由根據原料聚合物8的GC測量計算之組成比算出並以MA換算之莫耳為0.246莫耳),除此以外,以與製備例7相同的方式製作出含有使原料聚合物8的MA單元用3官能(甲基)丙烯酸化合物、單官能(甲基)丙烯酸化合物及水開環而獲得之聚合物P17之樹脂混合物(聚合物溶液P17)。 在與製備例3相同的條件下,藉由凝膠滲透層析法分析所獲得之聚合物溶液P17而測量了溶液中所含有之聚合物P17、游離多官能(甲基)丙烯酸化合物及游離單官能(甲基)丙烯酸化合物的量以及聚合物P17的重量平均分子量及多分散性。將結果示於表2。再者,游離(甲基)丙烯酸化合物的量係以樹脂混合物的凝膠滲透層析(GPC)圖譜中之游離(甲基)丙烯酸化合物的峰面積相對於聚合物P17的峰面積之比例(%)表示。 (Preparation Example 17) In place of the base polymer 3, 60.00 g of the base polymer 8 was used (the mole calculated from the composition ratio calculated based on the GC measurement of the base polymer 8 and converted to MA was 0.246 mol). Except for this, the same procedure as in the preparation example was used. 7. In the same manner, a resin mixture (polymer solution) containing the polymer P17 obtained by ring-opening the MA unit of the raw material polymer 8 with a trifunctional (meth)acrylic acid compound, a monofunctional (meth)acrylic acid compound, and water was produced. P17). Under the same conditions as Preparation Example 3, the obtained polymer solution P17 was analyzed by gel permeation chromatography to measure the polymer P17, free polyfunctional (meth)acrylic acid compound and free monomer contained in the solution. The amount of functional (meth)acrylic compounds and the weight average molecular weight and polydispersity of polymer P17. The results are shown in Table 2. Furthermore, the amount of the free (meth)acrylic acid compound is based on the ratio (%) of the peak area of the free (meth)acrylic acid compound to the peak area of the polymer P17 in the gel permeation chromatography (GPC) spectrum of the resin mixture. )express.

(製備例18) 代替原料聚合物4而使用了原料聚合物8 60.00g(由根據原料聚合物8的GC測量計算之組成比算出並以MA換算之莫耳為0.246莫耳),除此以外,以與製備例8相同的方式製作出原料聚合物8的MA單元用3官能(甲基)丙烯酸化合物、單官能(甲基)丙烯酸化合物及水開環之聚合物P18。 針對所獲得之聚合物P18實施GPC測量而測量了聚合物P18的重量平均分子量及多分散性。將結果示於表2。 又,藉由聚合物P18的GPC測量,確認到所使用之多官能(甲基)丙烯酸化合物及單官能(甲基)丙烯酸化合物的峰的消失。藉此,確認到在所獲得之聚合物P8中既不含有未反應的多官能(甲基)丙烯酸化合物,亦不含有單官能(甲基)丙烯酸化合物。 又,藉由 13C-NMR測量,確認到聚合物P18具有來自於順丁烯二酸酐之結構單元用A-TMM-3LM-N、4-HBA及水開環之結構。 (Preparation Example 18) In place of the base polymer 4, 60.00 g of the base polymer 8 was used (the mole calculated from the composition ratio calculated based on the GC measurement of the base polymer 8 and converted to MA was 0.246 mol). , in the same manner as in Preparation Example 8, a polymer P18 in which the MA unit of the raw material polymer 8 was ring-opened with a trifunctional (meth)acrylic acid compound, a monofunctional (meth)acrylic acid compound and water was produced. GPC measurement was performed on the obtained polymer P18, and the weight average molecular weight and polydispersity of the polymer P18 were measured. The results are shown in Table 2. Furthermore, GPC measurement of polymer P18 confirmed the disappearance of the peaks of the polyfunctional (meth)acrylic compound and the monofunctional (meth)acrylic compound used. From this, it was confirmed that the obtained polymer P8 contained neither an unreacted polyfunctional (meth)acrylic compound nor a monofunctional (meth)acrylic compound. Furthermore, through 13 C-NMR measurement, it was confirmed that polymer P18 has a structure in which structural units derived from maleic anhydride are ring-opened with A-TMM-3LM-N, 4-HBA and water.

(製備例19) 製作出含有使原料聚合物3的MA單元用3官能(甲基)丙烯酸化合物、單官能(甲基)丙烯酸化合物及水開環而獲得之聚合物P19之樹脂混合物(聚合物溶液P19)。以下,對詳細內容進行說明。 首先,對原料聚合物3 60.00g(由原料聚合物3的投入量算出並以MA換算為0.220莫耳)加入MEK 99.93g而製作出溶解液。接著,對該溶解液加入A-TMM-3LM-N 77.49g,其後,加入三乙胺18.00g(0.178莫耳),並在溫度70℃反應了2小時。其後,進一步加入4-HBA 56.27g(0.390莫耳),並在溫度70℃反應4小時而製作出反應溶液。 接著,不對所獲得之反應溶液進行後處理,而向該反應溶液中添加水3.00g(0.167莫耳),並在70℃反應了2小時。 將所獲得之反應溶液用MEK進行稀釋,並且用甲酸水溶液及檸檬酸水溶液進行處理,藉此從反應溶液中去除了水相。進而,藉由以下的程序進行液液萃取,接著進行了溶劑置換。 ·液液萃取:將反應溶液用MEK進行稀釋,接著,加入水/甲醇混合溶劑並進行處理,藉此從反應溶液中去除水相之後,進一步進行了1次相同的操作。 ·溶劑置換:利用旋轉蒸發器將所獲得之反應混合物在減壓下且在50℃進行了溶劑的去除。確認聚合物溶液的固體成分濃度在藉由加熱乾燥式水分計之測量中成為27±2質量%,並中斷了去除溶劑之操作。其後,加入PGMEA以使固體成分濃度成為18質量%,並混合至變均勻。藉由相同的操作,進一步反覆進行了2次如下操作:在減壓下於50℃進行溶劑的去除,將固體成分濃度在藉由加熱乾燥式水分計之測量中調整為27±2質量%之後,進一步加入PGMEA以使固體成分濃度成為18質量%,並混合至變均勻。其後,進行了如下操作:去除溶劑或者加入PGMEA以使固體成分濃度成為30±3質量%,並攪拌至變均勻。藉由以上的操作,反應中所使用之溶劑被去除,溶劑被置換為PGMEA。 (Preparation Example 19) A resin mixture (polymer solution P19) containing polymer P19 obtained by ring-opening the MA unit of the raw material polymer 3 with a trifunctional (meth)acrylic acid compound, a monofunctional (meth)acrylic acid compound, and water was produced. The details are explained below. First, 99.93 g of MEK was added to 60.00 g of the raw material polymer 3 (calculated from the input amount of the raw material polymer 3 and converted to 0.220 mol in terms of MA) to prepare a solution. Next, 77.49 g of A-TMM-3LM-N was added to the solution, and then 18.00 g (0.178 mol) of triethylamine was added, and the reaction was carried out at a temperature of 70° C. for 2 hours. Thereafter, 56.27 g (0.390 mol) of 4-HBA was further added, and the reaction was carried out at a temperature of 70° C. for 4 hours to prepare a reaction solution. Next, without post-processing the obtained reaction solution, 3.00 g (0.167 mol) of water was added to the reaction solution, and the reaction was carried out at 70° C. for 2 hours. The obtained reaction solution was diluted with MEK, and treated with a formic acid aqueous solution and a citric acid aqueous solution, thereby removing the aqueous phase from the reaction solution. Furthermore, liquid-liquid extraction was performed by the following procedure, and then solvent replacement was performed. ·Liquid-liquid extraction: The reaction solution was diluted with MEK, and then a water/methanol mixed solvent was added and processed to remove the aqueous phase from the reaction solution. The same operation was further performed once. ·Solvent replacement: The solvent was removed from the obtained reaction mixture using a rotary evaporator under reduced pressure and at 50°C. It was confirmed that the solid content concentration of the polymer solution was 27±2% by mass as measured by a heating drying moisture meter, and the operation of removing the solvent was discontinued. Thereafter, PGMEA was added so that the solid content concentration became 18% by mass, and the mixture was mixed until uniform. The same operation was repeated two more times: the solvent was removed under reduced pressure at 50°C, and the solid content concentration was adjusted to 27±2 mass% by measurement with a heating drying moisture meter. , further add PGMEA so that the solid content concentration becomes 18% by mass, and mix until uniform. Thereafter, the solvent was removed or PGMEA was added so that the solid content concentration became 30±3% by mass, and the mixture was stirred until it became uniform. Through the above operation, the solvent used in the reaction was removed and the solvent was replaced with PGMEA.

藉由以上,獲得了含有原料聚合物3中的來自於順丁烯二酸酐之結構單元用A-TMM-3LM-N、4-HBA及水開環之聚合物P19、殘存(游離)A-TMM-3LM-N及殘存(游離)4-HBA之樹脂混合物(聚合物溶液P19)。Through the above, the polymer P19 containing the structural units derived from maleic anhydride in the raw material polymer 3 was opened with A-TMM-3LM-N, 4-HBA and water, and the remaining (free) A- Resin mixture of TMM-3LM-N and residual (free) 4-HBA (polymer solution P19).

在與製備例3相同的條件下,藉由凝膠滲透層析法分析所獲得之聚合物溶液P19而測量了溶液中所含有之聚合物P19、游離多官能(甲基)丙烯酸化合物及游離單官能(甲基)丙烯酸化合物的量以及聚合物P19的重量平均分子量及多分散性。將結果示於表2。再者,游離(甲基)丙烯酸化合物的量係以樹脂混合物的凝膠滲透層析(GPC)圖譜中之游離(甲基)丙烯酸化合物的峰面積相對於聚合物P19的峰面積之比例(%)表示。Under the same conditions as Preparation Example 3, the obtained polymer solution P19 was analyzed by gel permeation chromatography to measure the polymer P19, free polyfunctional (meth)acrylic acid compound and free monomer contained in the solution. The amount of functional (meth)acrylic compounds and the weight average molecular weight and polydispersity of polymer P19. The results are shown in Table 2. Furthermore, the amount of the free (meth)acrylic acid compound is based on the ratio (%) of the peak area of the free (meth)acrylic acid compound to the peak area of the polymer P19 in the gel permeation chromatography (GPC) spectrum of the resin mixture. )express.

(製備例20) 製作出含有使原料聚合物6的MA單元用3官能(甲基)丙烯酸化合物及水開環而獲得之聚合物P20之樹脂混合物(聚合物溶液P20)。以下,對詳細內容進行說明。 首先,對原料聚合物6 60.00g(由原料聚合物4的投入量算出並以MA換算為0.230莫耳)加入MEK 99.93g而製作出溶解液。接著,對該溶解液加入A-TMM-3LM-N 77.49g,其後,加入三乙胺18.00g(0.178莫耳),並在溫度70℃反應了2小時。 接著,不對所獲得之反應溶液進行後處理,而向該反應溶液中添加水3.00g(0.167莫耳),並在70℃反應了2小時。 將所獲得之反應溶液用MEK進行稀釋,並且用甲酸水溶液及檸檬酸水溶液進行處理,藉此從反應溶液中去除了水相。進而,進行了與製備例3相同的液液萃取、溶劑置換。 藉此,製作出含有使原料聚合物6的MA單元用3官能(甲基)丙烯酸化合物及水開環而獲得之聚合物P20之樹脂混合物(聚合物溶液P20)。 (Preparation Example 20) A resin mixture (polymer solution P20) containing polymer P20 obtained by ring-opening the MA unit of raw material polymer 6 with a trifunctional (meth)acrylic acid compound and water was produced. The details are explained below. First, 99.93 g of MEK was added to 60.00 g of raw material polymer 6 (calculated from the input amount of raw material polymer 4 and converted to 0.230 mol in terms of MA) to prepare a solution. Next, 77.49 g of A-TMM-3LM-N was added to the solution, and then 18.00 g (0.178 mol) of triethylamine was added, and the reaction was carried out at a temperature of 70° C. for 2 hours. Next, without post-processing the obtained reaction solution, 3.00 g (0.167 mol) of water was added to the reaction solution, and the reaction was carried out at 70° C. for 2 hours. The obtained reaction solution was diluted with MEK, and treated with a formic acid aqueous solution and a citric acid aqueous solution, thereby removing the aqueous phase from the reaction solution. Furthermore, the same liquid-liquid extraction and solvent replacement as in Preparation Example 3 were performed. Thereby, a resin mixture (polymer solution P20) containing the polymer P20 obtained by ring-opening the MA unit of the raw material polymer 6 with a trifunctional (meth)acrylic acid compound and water was produced.

在與製備例3相同的條件下,藉由凝膠滲透層析法分析所獲得之聚合物溶液P20而測量了溶液中所含有之聚合物P20及游離多官能(甲基)丙烯酸化合物的量以及聚合物P20的重量平均分子量及多分散性。將結果示於表2。再者,游離(甲基)丙烯酸化合物的量係以樹脂混合物的凝膠滲透層析(GPC)圖譜中之游離(甲基)丙烯酸化合物的峰面積相對於聚合物P20的峰面積之比例(%)表示。Under the same conditions as Preparation Example 3, the obtained polymer solution P20 was analyzed by gel permeation chromatography to measure the amounts of the polymer P20 and the free polyfunctional (meth)acrylic acid compound contained in the solution. Weight average molecular weight and polydispersity of polymer P20. The results are shown in Table 2. Furthermore, the amount of free (meth)acrylic acid compound is based on the ratio (%) of the peak area of the free (meth)acrylic acid compound to the peak area of polymer P20 in the gel permeation chromatography (GPC) spectrum of the resin mixture. )express.

(製備例21) 使原料聚合物9的MA單元用單官能(甲基)丙烯酸化合物(4-HBA)開環,接著,使其與含有環氧基之(甲基)丙烯酸化合物(GMA)進行反應,從而製作出聚合物P21。以下,對詳細內容進行說明。 首先,對原料聚合物9 60g(由根據原料聚合物9的GC測量計算之組成比算出並以MA換算之莫耳為0.242莫耳)加入MEK 140.87g而製作出溶解液。接著,對該溶解液加入4-HBA 56.27g(0.390莫耳),其後,加入三乙胺18.00g(0.178莫耳),並在溫度70℃反應了6小時。其後,進一步加入GMA 26.62g(0.187莫耳),並在溫度70℃反應了4小時。 將所製作之反應溶液用MEK進行稀釋,並且用甲酸水溶液及檸檬酸水溶液進行處理,藉此從反應溶液中去除了水相。其後,利用下述再沉澱法對聚合物進行了純化。 ·再沉澱法:用過量的水使聚合物再沉澱。反覆進行了2次用過量的水將藉由再沉澱而獲得之聚合物粉末進行洗淨之操作。將所獲得之反應產物在40℃乾燥了12小時。 藉由以上,獲得了原料聚合物9中的來自於順丁烯二酸酐之結構單元用4-HBA開環並與GMA進行了反應之聚合物P21。 針對所獲得之聚合物P21實施GPC測量而測量了聚合物P21的重量平均分子量及多分散性。將結果示於表2。 又,藉由聚合物P21的GPC測量,確認到所使用之多官能(甲基)丙烯酸化合物及單官能(甲基)丙烯酸化合物的峰的消失。藉此,確認到在所獲得之聚合物P21中既不含有未反應的多官能(甲基)丙烯酸化合物,亦不含有單官能(甲基)丙烯酸化合物。 又,藉由 13C-NMR測量,確認到聚合物P21具有原料聚合物9的來自於順丁烯二酸酐之結構單元用4-HBA開環之結構及導入有GMA之結構。 (Preparation Example 21) The MA unit of the base polymer 9 was ring-opened with a monofunctional (meth)acrylic acid compound (4-HBA), and then reacted with an epoxy group-containing (meth)acrylic acid compound (GMA). reaction to produce polymer P21. The details are explained below. First, 140.87 g of MEK was added to 60 g of the raw material polymer 9 (the mole calculated from the composition ratio calculated based on the GC measurement of the raw material polymer 9 and converted to MA was 0.242 mol) to prepare a solution. Next, 56.27 g (0.390 mol) of 4-HBA was added to the solution, and then 18.00 g (0.178 mol) of triethylamine was added, and the reaction was carried out at a temperature of 70° C. for 6 hours. Thereafter, 26.62 g (0.187 mol) of GMA was further added, and the reaction was carried out at a temperature of 70° C. for 4 hours. The prepared reaction solution was diluted with MEK, and treated with a formic acid aqueous solution and a citric acid aqueous solution, thereby removing the water phase from the reaction solution. Thereafter, the polymer was purified by the reprecipitation method described below. ·Re-precipitation method: Use excess water to reprecipitate the polymer. The operation of washing the polymer powder obtained by reprecipitation with excess water was repeated twice. The reaction product obtained was dried at 40°C for 12 hours. Through the above, a polymer P21 in which the structural unit derived from maleic anhydride in the raw material polymer 9 was ring-opened with 4-HBA and reacted with GMA was obtained. GPC measurement was performed on the obtained polymer P21, and the weight average molecular weight and polydispersity of the polymer P21 were measured. The results are shown in Table 2. Furthermore, GPC measurement of polymer P21 confirmed the disappearance of the peaks of the polyfunctional (meth)acrylic compound and the monofunctional (meth)acrylic compound used. From this, it was confirmed that the obtained polymer P21 contained neither an unreacted polyfunctional (meth)acrylic compound nor a monofunctional (meth)acrylic compound. Furthermore, through 13 C-NMR measurement, it was confirmed that the polymer P21 has a structure in which the structural unit derived from maleic anhydride of the raw material polymer 9 is ring-opened with 4-HBA and has a structure in which GMA is introduced.

(製備例22) 製作出含有聚合物P22之樹脂混合物(聚合物溶液P22),該聚合物P22藉由使原料聚合物9的MA單元用單官能(甲基)丙烯酸化合物(4-HBA)開環,接著,與含有環氧基之(甲基)丙烯酸化合物(GMA)進行反應而獲得。以下,對詳細內容進行說明。 首先,對原料聚合物9 60g(由根據原料聚合物9的GC測量計算之組成比算出並以MA換算之莫耳為0.242莫耳)加入MEK 140.87g而製作出溶解液。接著,對該溶解液加入4-HBA 56.27g(0.390莫耳),其後,加入三乙胺18.00g(0.178莫耳),並在溫度70℃反應了6小時。其後,進一步加入GMA 26.62g(0.187莫耳),並在溫度70℃反應了4小時。 將所獲得之反應溶液用MEK進行稀釋,並且用甲酸水溶液及檸檬酸水溶液進行處理,藉此從反應溶液中去除了水相。進而,藉由以下的程序進行液液萃取,接著進行了溶劑置換。 ·液液萃取:將反應溶液用MEK進行稀釋,接著,加入水/甲醇混合溶劑並進行處理,藉此從反應溶液中去除水相之後,進一步進行了1次相同的操作。 ·溶劑置換:利用旋轉蒸發器將所獲得之反應混合物在減壓下且在50℃進行了溶劑的去除。確認聚合物溶液的固體成分濃度在藉由加熱乾燥式水分計之測量中成為27±2質量%,並中斷了去除溶劑之操作。其後,加入PGMEA以使固體成分濃度成為18質量%,並混合至變均勻。藉由相同的操作,進一步反覆進行了2次如下操作:在減壓下於50℃進行溶劑的去除,將固體成分濃度在藉由加熱乾燥式水分計之測量中調整為27±2質量%之後,進一步加入PGMEA以使固體成分濃度成為18質量%,並混合至變均勻。其後,進行了如下操作:去除溶劑或者加入PGMEA以使固體成分濃度成為30±3質量%,並攪拌至變均勻。藉由以上的操作,反應中所使用之溶劑被去除,溶劑被置換為PGMEA。 (Preparation Example 22) A resin mixture (polymer solution P22) containing polymer P22 was prepared by ring-opening the MA unit of the raw material polymer 9 with a monofunctional (meth)acrylic acid compound (4-HBA), and then, It is obtained by reacting a (meth)acrylic acid compound (GMA) containing an epoxy group. The details are explained below. First, 140.87 g of MEK was added to 60 g of the raw material polymer 9 (the mole calculated from the composition ratio calculated based on the GC measurement of the raw material polymer 9 and converted to MA was 0.242 mol) to prepare a solution. Next, 56.27 g (0.390 mol) of 4-HBA was added to the solution, and then 18.00 g (0.178 mol) of triethylamine was added, and the reaction was carried out at a temperature of 70° C. for 6 hours. Thereafter, 26.62 g (0.187 mol) of GMA was further added, and the reaction was carried out at a temperature of 70° C. for 4 hours. The obtained reaction solution was diluted with MEK, and treated with a formic acid aqueous solution and a citric acid aqueous solution, thereby removing the aqueous phase from the reaction solution. Furthermore, liquid-liquid extraction was performed by the following procedure, and then solvent replacement was performed. ·Liquid-liquid extraction: The reaction solution was diluted with MEK, and then a water/methanol mixed solvent was added and processed to remove the aqueous phase from the reaction solution. The same operation was further performed once. ·Solvent replacement: The solvent was removed from the obtained reaction mixture using a rotary evaporator under reduced pressure and at 50°C. It was confirmed that the solid content concentration of the polymer solution was 27±2% by mass as measured by a heating drying moisture meter, and the operation of removing the solvent was discontinued. Thereafter, PGMEA was added so that the solid content concentration became 18% by mass, and the mixture was mixed until uniform. The same operation was repeated two more times: the solvent was removed under reduced pressure at 50°C, and the solid content concentration was adjusted to 27±2 mass% by measurement with a heating drying moisture meter. , further add PGMEA so that the solid content concentration becomes 18% by mass, and mix until uniform. Thereafter, the solvent was removed or PGMEA was added so that the solid content concentration became 30±3% by mass, and the mixture was stirred until it became uniform. Through the above operation, the solvent used in the reaction was removed and the solvent was replaced with PGMEA.

藉由以上,獲得了含有使原料聚合物9中的來自於順丁烯二酸酐之結構單元用4-HBA開環並與GMA進行了反應之聚合物P22和殘存(游離)4-HBA、GMA之樹脂混合物(聚合物溶液P22)。 利用凝膠滲透層析法分析所獲得之聚合物溶液P22而測量了溶液中所含有之聚合物P22、游離單官能(甲基)丙烯酸化合物的量(4-HBA與GMA的合計量)以及聚合物P22的重量平均分子量及多分散性。將結果示於表2。再者,游離(甲基)丙烯酸化合物的量係以樹脂混合物的凝膠滲透層析(GPC)圖譜中之游離(甲基)丙烯酸化合物的峰面積相對於聚合物P22的峰面積之比例(%)表示。 再者,凝膠滲透層析法的測量條件如下。 ·作為GPC測量裝置,使用了TOSOH CORPORATION的HLC-8320GPC EcoSEC。管柱溫度設定為40.0℃,泵流量設定為0.350mL/分鐘。 ·峰位置(保持時間) 聚合物P22:在20分之前檢測出之峰(與4-HBA、GMA、A-TMM-3LM-N相比,保持時間短、分子量大的峰) A-TMM-3LM-N:21.0~21.7分 4-HBA、GMA:21.7~23.0分 ·測量條件:用示差折射率檢測器(RI檢測器)進行了分析。 Through the above, the polymer P22 containing the structural unit derived from maleic anhydride in the raw material polymer 9 was ring-opened with 4-HBA and reacted with GMA, and the remaining (free) 4-HBA and GMA were obtained. Resin mixture (polymer solution P22). The obtained polymer solution P22 was analyzed by gel permeation chromatography to measure the amount of polymer P22 contained in the solution, the amount of free monofunctional (meth)acrylic acid compounds (the total amount of 4-HBA and GMA), and the polymerization rate. The weight average molecular weight and polydispersity of substance P22. The results are shown in Table 2. Furthermore, the amount of the free (meth)acrylic acid compound is based on the ratio (%) of the peak area of the free (meth)acrylic acid compound to the peak area of the polymer P22 in the gel permeation chromatography (GPC) spectrum of the resin mixture. )express. In addition, the measurement conditions of gel permeation chromatography are as follows. ・As a GPC measurement device, TOSOH CORPORATION's HLC-8320GPC EcoSEC was used. The column temperature was set to 40.0°C, and the pump flow rate was set to 0.350 mL/min. ·Peak position (hold time) Polymer P22: Peak detected 20 minutes ago (peak with shorter retention time and larger molecular weight than 4-HBA, GMA, and A-TMM-3LM-N) A-TMM-3LM-N: 21.0~21.7 points 4-HBA, GMA: 21.7~23.0 points ·Measurement conditions: Analysis was performed using a differential refractive index detector (RI detector).

(製備例23) 使原料聚合物9的MA單元用3官能(甲基)丙烯酸化合物(A-TMM-3LM-N)及單官能(甲基)丙烯酸化合物(4-HBA)開環,接著,與含有環氧基之(甲基)丙烯酸化合物(GMA)進行反應,從而製作出聚合物P23。以下,對詳細內容進行說明。 首先,對原料聚合物9 60.00g(由根據原料聚合物9的GC測量計算之組成比算出並以MA換算為0.242莫耳)加入MEK 102.63g而製作出溶解液。接著,對該溶解液加入A-TMM-3LM-N 38.75g,其後,加入三乙胺18.00g(0.178莫耳),並在溫度70℃反應了2小時。其後,進一步加入4-HBA 33.76g(0.234莫耳),並在溫度70℃反應了4小時。其後,進一步加入GMA 19.97g(0.140莫耳),並在溫度70℃反應4小時而製作出反應溶液。 將所製作之反應溶液用MEK進行稀釋,並且用甲酸水溶液及檸檬酸水溶液進行處理,藉此從反應溶液中去除了水相。 進而,藉由以下的程序進行液液萃取,接著進行了溶劑置換。 ·液液萃取:將反應溶液用MEK進行稀釋,接著,加入水/甲醇混合溶劑並進行處理,藉此從反應溶液中去除水相之後,進一步進行了1次相同的操作。 ·溶劑置換:利用旋轉蒸發器將所獲得之反應混合物在減壓下且在50℃進行了溶劑的去除。確認聚合物溶液的固體成分濃度在藉由加熱乾燥式水分計之測量中成為27±2質量%,並中斷了去除溶劑之操作。其後,加入PGMEA以使固體成分濃度成為18質量%,並混合至變均勻。藉由相同的操作,進一步反覆進行了2次如下操作:在減壓下於50℃進行溶劑的去除,將固體成分濃度在藉由加熱乾燥式水分計之測量中調整為27±2質量%之後,進一步加入PGMEA以使固體成分濃度成為18質量%,並混合至變均勻。其後,進行了如下操作:去除溶劑或者加入PGMEA以使固體成分濃度成為30±3質量%,並攪拌至變均勻。藉由以上的操作,反應中所使用之溶劑被去除,溶劑被置換為PGMEA。其後,利用以下的再沉澱法進一步進行了純化。 ·用過量的甲苯使聚合物再沉澱。 ·反覆進行了2次用過量的甲苯將藉由再沉澱而獲得之聚合物粉末進行洗淨之操作。 ·進行了3次用過量的水將上述洗淨2次之後的聚合物粉末進行洗淨之操作。 ·將所獲得之反應產物在40℃乾燥了12小時。 (Preparation Example 23) The MA unit of the raw material polymer 9 is ring-opened with a trifunctional (meth)acrylic acid compound (A-TMM-3LM-N) and a monofunctional (meth)acrylic acid compound (4-HBA), and then, the MA unit containing an epoxy group is ring-opened. The (meth)acrylic acid compound (GMA) is reacted to produce polymer P23. The details are explained below. First, 102.63 g of MEK was added to 60.00 g of the raw material polymer 9 (0.242 mole calculated from the composition ratio calculated based on the GC measurement of the raw material polymer 9 and converted to MA) to prepare a solution. Next, 38.75 g of A-TMM-3LM-N was added to the solution, and then 18.00 g (0.178 mol) of triethylamine was added, and the reaction was carried out at a temperature of 70° C. for 2 hours. Thereafter, 33.76 g (0.234 mol) of 4-HBA was further added, and the reaction was carried out at a temperature of 70° C. for 4 hours. Thereafter, 19.97 g (0.140 mol) of GMA was further added, and the reaction was carried out at a temperature of 70° C. for 4 hours to prepare a reaction solution. The prepared reaction solution was diluted with MEK, and treated with a formic acid aqueous solution and a citric acid aqueous solution, thereby removing the water phase from the reaction solution. Furthermore, liquid-liquid extraction was performed by the following procedure, and then solvent replacement was performed. ·Liquid-liquid extraction: The reaction solution was diluted with MEK, and then a water/methanol mixed solvent was added and processed to remove the aqueous phase from the reaction solution. The same operation was further performed once. ·Solvent replacement: The solvent was removed from the obtained reaction mixture using a rotary evaporator under reduced pressure and at 50°C. It was confirmed that the solid content concentration of the polymer solution was 27±2% by mass as measured by a heating drying moisture meter, and the operation of removing the solvent was discontinued. Thereafter, PGMEA was added so that the solid content concentration became 18% by mass, and the mixture was mixed until uniform. The same operation was repeated two more times: the solvent was removed under reduced pressure at 50°C, and the solid content concentration was adjusted to 27±2 mass% by measurement with a heating drying moisture meter. , further add PGMEA so that the solid content concentration becomes 18% by mass, and mix until uniform. Thereafter, the solvent was removed or PGMEA was added so that the solid content concentration became 30±3% by mass, and the mixture was stirred until it became uniform. Through the above operation, the solvent used in the reaction was removed and the solvent was replaced with PGMEA. Thereafter, further purification was performed by the following reprecipitation method. • The polymer was reprecipitated with excess toluene. ·The operation of washing the polymer powder obtained by reprecipitation with excess toluene was repeated twice. ·The polymer powder washed twice with excess water was washed three times. ·The reaction product obtained was dried at 40°C for 12 hours.

藉由以上,獲得了使原料聚合物9中的來自於順丁烯二酸酐之結構單元用A-TMM-3LM-N及4-HBA開環並與GMA進行了反應之聚合物P23。Through the above, a polymer P23 was obtained in which the structural unit derived from maleic anhydride in the raw material polymer 9 was ring-opened with A-TMM-3LM-N and 4-HBA and reacted with GMA.

藉由聚合物P23的GPC測量,確認到所使用之多官能(甲基)丙烯酸化合物及單官能(甲基)丙烯酸化合物、含有環氧基之(甲基)丙烯酸化合物的峰的消失。藉此,確認到在所獲得之聚合物P7中均不含有未反應的(甲基)丙烯酸化合物、不具有羥基之(甲基)丙烯酸化合物、未反應的含有環氧基之(甲基)丙烯酸化合物。By GPC measurement of polymer P23, it was confirmed that the peaks of the polyfunctional (meth)acrylic compound, the monofunctional (meth)acrylic compound, and the epoxy group-containing (meth)acrylic compound used disappeared. Through this, it was confirmed that the obtained polymer P7 did not contain any unreacted (meth)acrylic acid compound, a (meth)acrylic acid compound not having a hydroxyl group, or an unreacted (meth)acrylic acid containing an epoxy group. compound.

在圖4中示出聚合物P23的 1H-NMR圖譜。除了出現圖4的聚合物P23的 1H-NMR圖譜所示之5.8-6.7ppm的與丙烯醯基(-CH=CH 2)的3H對應之峰以外,亦在由×表示之5.6-5.8ppm及6.0-6.1ppm出現了與甲基丙烯醯基(-C(CH 3)=CH 2的2H(-C(CH 3)=CH 2的CH 2)對應之峰。在聚合物P7的GPC測量中,未觀察到未反應的3官能(甲基)丙烯酸化合物(A-TMM-3LM-N)及單官能(甲基)丙烯酸化合物(4-HBA)、含有環氧基之(甲基)丙烯酸化合物(GMA)的峰,據此可知丙烯醯基及來自於GMA之甲基丙烯醯基被導入到聚合物中。 The 1 H-NMR spectrum of polymer P23 is shown in Figure 4 . In addition to the 5.8-6.7 ppm peak corresponding to 3H of the acryl group (-CH=CH 2 ) shown in the 1 H-NMR spectrum of polymer P23 in Figure 4, there is also a peak of 5.6-5.8 ppm represented by ×. And 6.0-6.1ppm, a peak corresponding to the methacrylyl group (-C(CH 3 )=2H of CH 2 (-C(CH 3 )=CH 2 of CH 2 ) appeared. GPC measurement of polymer P7 , unreacted trifunctional (meth)acrylic acid compound (A-TMM-3LM-N), monofunctional (meth)acrylic acid compound (4-HBA), and (meth)acrylic acid containing epoxy groups were not observed. The peak of the compound (GMA) shows that the acryl group and the methacryl group derived from GMA were introduced into the polymer.

又,在開環反應前後及GMA加成反應前後的反應溶液的GPC測量中,在開環前後,來自於3官能(甲基)丙烯酸化合物(A-TMM-3LM-N)、來自於單官能(甲基)丙烯酸化合物(4-HBA)之峰減少,在GMA加成反應前後,來自於GMA之峰減少,據此亦可知A-TMM-3LM-N、4-HBA及GMA被導入到聚合物中。In addition, in the GPC measurement of the reaction solution before and after the ring-opening reaction and before and after the GMA addition reaction, before and after the ring-opening reaction, it was derived from the trifunctional (meth)acrylic acid compound (A-TMM-3LM-N), The peak of the (meth)acrylic acid compound (4-HBA) decreases, and the peak derived from GMA decreases before and after the GMA addition reaction. From this, it can also be seen that A-TMM-3LM-N, 4-HBA and GMA are introduced into the polymerization among things.

又,藉由 13C-NMR測量,確認到聚合物P23具有原料聚合物9的來自於順丁烯二酸酐之結構單元用A-TMM-3LM-N及4-HBA開環之結構及導入有GMA之結構。 Furthermore, through 13 C-NMR measurement, it was confirmed that the polymer P23 has a structure in which the structural unit derived from maleic anhydride of the raw material polymer 9 was opened with A-TMM-3LM-N and 4-HBA and introduced with The structure of GMA.

(製備例24) 製作出含有聚合物P24之樹脂化合物(聚合物溶液P24),該聚合物P24藉由使原料聚合物9的MA單元用3官能(甲基)丙烯酸化合物(A-TMM-3LM-N)及單官能(甲基)丙烯酸化合物(4-HBA)開環,接著,與含有環氧基之(甲基)丙烯酸化合物(GMA)進行反應而獲得。 首先,對原料聚合物9 60.00g(由根據原料聚合物9的GC測量計算之組成比算出並以MA換算為0.242莫耳)加入MEK 102.63g而製作出溶解液。接著,對該溶解液加入A-TMM-3LM-N 38.75g,其後,加入三乙胺18.00g(0.178莫耳),並在溫度70℃反應了2小時。其後,進一步加入4-HBA 33.76g(0.234莫耳),並在溫度70℃反應了4小時。其後,進一步加入GMA 19.97g(0.140莫耳),並在溫度70℃反應4小時而製作出反應溶液。 將所製作之反應溶液用MEK進行稀釋,並且用甲酸水溶液及檸檬酸水溶液進行處理,藉此從反應溶液中去除了水相。進而,藉由以下的程序進行液液萃取,接著進行了溶劑置換。 ·液液萃取:將反應溶液用MEK進行稀釋,接著,加入水/甲醇混合溶劑並進行處理,藉此從反應溶液中去除水相之後,進一步進行了1次相同的操作。 ·溶劑置換:利用旋轉蒸發器將所獲得之反應混合物在減壓下且在50℃進行了溶劑的去除。確認聚合物溶液的固體成分濃度在藉由加熱乾燥式水分計之測量中成為27±2質量%,並中斷了去除溶劑之操作。其後,加入PGMEA以使固體成分濃度成為18質量%,並混合至變均勻。藉由相同的操作,進一步反覆進行了2次如下操作:在減壓下於50℃進行溶劑的去除,將固體成分濃度在藉由加熱乾燥式水分計之測量中調整為27±2質量%之後,進一步加入PGMEA以使固體成分濃度成為18質量%,並混合至變均勻。其後,進行了如下操作:去除溶劑或者加入PGMEA以使固體成分濃度成為30±3質量%,並攪拌至變均勻。藉由以上的操作,反應中所使用之溶劑被去除,溶劑被置換為PGMEA。 藉由以上,獲得了含有聚合物P24、殘存(游離)A-TMM-3LM-N及殘存(游離)4-HBA、殘存(游離)GMA之樹脂混合物(聚合物溶液P24),該聚合物P24藉由使原料聚合物9中的來自於順丁烯二酸酐之結構單元用A-TMM-3LM-N及4-HBA開環,接著,與含有環氧基之(甲基)丙烯酸化合物(GMA)進行反應而獲得。 在與製備例23相同的條件下,藉由凝膠滲透層析法分析所獲得之聚合物溶液P24而測量了溶液中所含有之聚合物P24、游離多官能(甲基)丙烯酸化合物及游離單官能(甲基)丙烯酸化合物的量以及聚合物P24的重量平均分子量及多分散度。將結果示於表2。 (Preparation Example 24) A resin compound (polymer solution P24) containing polymer P24 was prepared by using the MA unit of the raw material polymer 9 with a trifunctional (meth)acrylic acid compound (A-TMM-3LM-N) and a monomer. It is obtained by ring opening a functional (meth)acrylic acid compound (4-HBA) and then reacting with a (meth)acrylic acid compound (GMA) containing an epoxy group. First, 102.63 g of MEK was added to 60.00 g of the raw material polymer 9 (0.242 mole calculated from the composition ratio calculated based on the GC measurement of the raw material polymer 9 and converted to MA) to prepare a solution. Next, 38.75 g of A-TMM-3LM-N was added to the solution, and then 18.00 g (0.178 mol) of triethylamine was added, and the reaction was carried out at a temperature of 70° C. for 2 hours. Thereafter, 33.76 g (0.234 mol) of 4-HBA was further added, and the reaction was carried out at a temperature of 70° C. for 4 hours. Thereafter, 19.97 g (0.140 mol) of GMA was further added, and the reaction was carried out at a temperature of 70° C. for 4 hours to prepare a reaction solution. The prepared reaction solution was diluted with MEK, and treated with a formic acid aqueous solution and a citric acid aqueous solution, thereby removing the water phase from the reaction solution. Furthermore, liquid-liquid extraction was performed by the following procedure, and then solvent replacement was performed. ·Liquid-liquid extraction: The reaction solution was diluted with MEK, and then a water/methanol mixed solvent was added and processed to remove the aqueous phase from the reaction solution. The same operation was further performed once. ·Solvent replacement: The solvent was removed from the obtained reaction mixture using a rotary evaporator under reduced pressure and at 50°C. It was confirmed that the solid content concentration of the polymer solution was 27±2% by mass as measured by a heating drying moisture meter, and the operation of removing the solvent was discontinued. Thereafter, PGMEA was added so that the solid content concentration became 18% by mass, and the mixture was mixed until uniform. The same operation was repeated two more times: the solvent was removed under reduced pressure at 50°C, and the solid content concentration was adjusted to 27±2 mass% by measurement with a heating drying moisture meter. , further add PGMEA so that the solid content concentration becomes 18% by mass, and mix until uniform. Thereafter, the solvent was removed or PGMEA was added so that the solid content concentration became 30±3% by mass, and the mixture was stirred until it became uniform. Through the above operation, the solvent used in the reaction was removed and the solvent was replaced with PGMEA. Through the above, a resin mixture (polymer solution P24) containing polymer P24, residual (free) A-TMM-3LM-N, residual (free) 4-HBA, and residual (free) GMA was obtained. The polymer P24 By ring-opening the structural units derived from maleic anhydride in the raw material polymer 9 with A-TMM-3LM-N and 4-HBA, and then, with a (meth)acrylic acid compound (GMA) containing an epoxy group ) obtained by reaction. Under the same conditions as Preparation Example 23, the obtained polymer solution P24 was analyzed by gel permeation chromatography to measure the polymer P24, free polyfunctional (meth)acrylic acid compound and free monomer contained in the solution. The amount of functional (meth)acrylic compounds and the weight average molecular weight and polydispersity of polymer P24. The results are shown in Table 2.

(製備例25) 使原料聚合物7的MA單元用3官能(甲基)丙烯酸化合物(A-TMM-3LM-N)開環,添加水而使其進一步開環,接著,與含有環氧基之(甲基)丙烯酸化合物(GMA)進行反應,從而製作出聚合物P25。以下,對詳細內容進行說明。 首先,對原料聚合物7 60.00g(由根據原料聚合物7的GC測量計算之組成比算出並以MA換算為0.213莫耳)加入MEK 139.02g而製作出溶解液。接著,對該溶解液加入A-TMM-3LM-N 58.12g,其後,加入三乙胺18.00g(0.178莫耳),並在溫度70℃反應2小時而製作出反應溶液。接著,不對所獲得之反應溶液進行後處理,而向該反應溶液中加入水1.50g(0.083莫耳),並在溫度70℃反應了2小時。其後,進一步加入GMA 26.62g(0.187莫耳),並在溫度70℃反應4小時,從而製作出反應溶液。 將所製作之反應溶液用MEK進行稀釋,並且用甲酸水溶液及檸檬酸水溶液進行處理,藉此從反應溶液中去除了水相。其後,使用與製備例23相同的液液萃取、溶劑置換、再沉澱法對聚合物進行了純化。 藉由以上,獲得了原料聚合物7中的來自於順丁烯二酸酐之結構單元用A-TMM-3LM-N及水開環並與GMA進行了反應之聚合物P25。 藉由聚合物P25的GPC測量,確認到所使用之多官能(甲基)丙烯酸化合物、含有環氧基之(甲基)丙烯酸化合物的峰的消失。藉此,確認到在所獲得之聚合物P25中不含有未反應的(甲基)丙烯酸化合物、不具有羥基之(甲基)丙烯酸化合物、未反應的含有環氧基之(甲基)丙烯酸化合物。 (Preparation Example 25) The MA unit of the base polymer 7 was ring-opened with a trifunctional (meth)acrylic acid compound (A-TMM-3LM-N), water was added to further open the ring, and then, it was mixed with (methyl) containing an epoxy group. The acrylic acid compound (GMA) reacts to produce polymer P25. The details are explained below. First, 139.02 g of MEK was added to 60.00 g of the raw material polymer 7 (0.213 mol calculated from the composition ratio calculated based on the GC measurement of the raw material polymer 7 and converted to MA) to prepare a solution. Next, 58.12 g of A-TMM-3LM-N was added to the solution, and then 18.00 g (0.178 mol) of triethylamine was added, and the reaction was carried out at a temperature of 70° C. for 2 hours to prepare a reaction solution. Next, without post-processing the obtained reaction solution, 1.50 g (0.083 mol) of water was added to the reaction solution, and the reaction was carried out at a temperature of 70° C. for 2 hours. Thereafter, 26.62 g (0.187 mol) of GMA was further added, and the reaction was carried out at a temperature of 70° C. for 4 hours to prepare a reaction solution. The prepared reaction solution was diluted with MEK, and treated with a formic acid aqueous solution and a citric acid aqueous solution, thereby removing the water phase from the reaction solution. Thereafter, the polymer was purified using the same liquid-liquid extraction, solvent replacement, and reprecipitation methods as in Preparation Example 23. Through the above, a polymer P25 was obtained in which the structural unit derived from maleic anhydride in the raw material polymer 7 was ring-opened with A-TMM-3LM-N and water and reacted with GMA. By GPC measurement of polymer P25, it was confirmed that the peak of the polyfunctional (meth)acrylic compound used and the (meth)acrylic compound containing an epoxy group disappeared. Through this, it was confirmed that the obtained polymer P25 did not contain an unreacted (meth)acrylic compound, a (meth)acrylic compound that did not have a hydroxyl group, or an unreacted epoxy group-containing (meth)acrylic compound. .

又,藉由 13C-NMR測量,確認到聚合物P25具有原料聚合物7的來自於順丁烯二酸酐之結構單元用A-TMM-3LM-N及水開環之結構及導入有GMA之結構。 Furthermore, through 13 C-NMR measurement, it was confirmed that the polymer P25 has a structure in which the structural unit derived from maleic anhydride of the raw material polymer 7 is ring-opened with A-TMM-3LM-N and water, and has a structure in which GMA is introduced. structure.

(製備例26) 製作出含有聚合物P26之樹脂混合物(聚合物溶液P26),該聚合物P26藉由使原料聚合物7的MA單元用3官能(甲基)丙烯酸化合物(A-TMM-3LM-N)開環,添加水而使其進一步開環,接著,與含有環氧基之(甲基)丙烯酸化合物(GMA)進行反應而獲得。以下,對詳細內容進行說明。 首先,對原料聚合物7 60.00g(由根據原料聚合物7的GC測量計算之組成比算出並以MA換算為0.213莫耳)加入MEK 139.02g而製作出溶解液。接著,對該溶解液加入A-TMM-3LM-N 58.12g,其後,加入三乙胺18.00g(0.178莫耳),並在溫度70℃反應2小時而製作出反應溶液。接著,不對所獲得之反應溶液進行後處理,而向該反應溶液中加入水1.50g(0.083莫耳),並在溫度70℃反應了2小時。其後,進一步加入GMA 26.62g(0.187莫耳),並在溫度70℃反應4小時,從而製作出反應溶液。 將所製作之反應溶液用MEK進行稀釋,並且用甲酸水溶液及檸檬酸水溶液進行處理,藉此從反應溶液中去除了水相。其後,使用與製備例23相同的液液萃取、溶劑置換法對聚合物進行純化,從而獲得了含有聚合物P26、殘存(游離)A-TMM-3LM-N及殘存(游離)GMA之樹脂混合物(聚合物溶液P26),該聚合物P26藉由使原料聚合物7的MA單元用3官能(甲基)丙烯酸化合物開環,添加水而使其進一步開環,接著,與含有環氧基之(甲基)丙烯酸化合物(GMA)進行反應而獲得。 利用凝膠滲透層析法分析所獲得之聚合物溶液P26而測量了溶液中所含有之聚合物P26、游離多官能(甲基)丙烯酸化合物的量以及聚合物P26的重量平均分子量及多分散性。將結果示於表2。再者,游離(甲基)丙烯酸化合物的量係以樹脂混合物的凝膠滲透層析(GPC)圖譜中之游離(甲基)丙烯酸化合物的峰面積相對於聚合物P26的峰面積之比例(%)表示。 (Preparation Example 26) A resin mixture (polymer solution P26) containing polymer P26 by ring-opening the MA unit of the raw material polymer 7 with a trifunctional (meth)acrylic acid compound (A-TMM-3LM-N) was produced. , add water to further open the ring, and then react with a (meth)acrylic acid compound (GMA) containing an epoxy group to obtain it. The details are explained below. First, 139.02 g of MEK was added to 60.00 g of the raw material polymer 7 (0.213 mol calculated from the composition ratio calculated based on the GC measurement of the raw material polymer 7 and converted to MA) to prepare a solution. Next, 58.12 g of A-TMM-3LM-N was added to the solution, and then 18.00 g (0.178 mol) of triethylamine was added, and the reaction was carried out at a temperature of 70° C. for 2 hours to prepare a reaction solution. Next, without post-processing the obtained reaction solution, 1.50 g (0.083 mol) of water was added to the reaction solution, and the reaction was carried out at a temperature of 70° C. for 2 hours. Thereafter, 26.62 g (0.187 mol) of GMA was further added, and the reaction was carried out at a temperature of 70° C. for 4 hours to prepare a reaction solution. The prepared reaction solution was diluted with MEK, and treated with a formic acid aqueous solution and a citric acid aqueous solution, thereby removing the water phase from the reaction solution. Thereafter, the polymer was purified using the same liquid-liquid extraction and solvent replacement methods as in Preparation Example 23, thereby obtaining a resin containing polymer P26, residual (free) A-TMM-3LM-N, and residual (free) GMA. Mixture (polymer solution P26). The polymer P26 is ring-opened by ring-opening the MA unit of the base polymer 7 with a trifunctional (meth)acrylic acid compound, adding water to further open the ring, and then, with an epoxy group-containing It is obtained by reacting with (meth)acrylic acid compound (GMA). The obtained polymer solution P26 was analyzed by gel permeation chromatography to measure the amount of the polymer P26 contained in the solution, the free polyfunctional (meth)acrylic acid compound, and the weight average molecular weight and polydispersity of the polymer P26. . The results are shown in Table 2. Furthermore, the amount of free (meth)acrylic acid compound is based on the ratio (%) of the peak area of the free (meth)acrylic acid compound to the peak area of polymer P26 in the gel permeation chromatography (GPC) spectrum of the resin mixture. )express.

(製備例27) 使用了原料聚合物10 60.00g(由根據原料聚合物10的GC測量計算之組成比算出並以MA換算之莫耳為0.128莫耳),除此以外,以與製備例19相同的方式製作出含有使原料聚合物10的MA單元用3官能(甲基)丙烯酸化合物、單官能(甲基)丙烯酸化合物及水開環而獲得之聚合物P27之樹脂混合物(聚合物溶液P27)。 在與製備例19相同的條件下,藉由凝膠滲透層析法分析所獲得之聚合物溶液P27而測量了聚合物溶液P27中所含有之聚合物P27、游離多官能(甲基)丙烯酸化合物及游離單官能(甲基)丙烯酸化合物的量以及聚合物P27的重量平均分子量及多分散性。將結果示於表2。再者,游離(甲基)丙烯酸化合物的量係以樹脂混合物的凝膠滲透層析(GPC)圖譜中之游離(甲基)丙烯酸化合物的峰面積相對於聚合物P27的峰面積之比例(%)表示。 (Preparation Example 27) It was produced in the same manner as Preparation Example 19 except that 60.00 g of the base polymer 10 was used (the mole calculated from the composition ratio calculated based on the GC measurement of the base polymer 10 and converted to MA was 0.128 mol). A resin mixture (polymer solution P27) containing polymer P27 obtained by ring-opening the MA unit of the raw material polymer 10 with a trifunctional (meth)acrylic acid compound, a monofunctional (meth)acrylic acid compound, and water. Under the same conditions as Preparation Example 19, the obtained polymer solution P27 was analyzed by gel permeation chromatography, and the polymer P27 and the free polyfunctional (meth)acrylic acid compound contained in the polymer solution P27 were measured. and the amount of free monofunctional (meth)acrylic compounds as well as the weight average molecular weight and polydispersity of polymer P27. The results are shown in Table 2. Furthermore, the amount of the free (meth)acrylic acid compound is based on the ratio (%) of the peak area of the free (meth)acrylic acid compound to the peak area of the polymer P27 in the gel permeation chromatography (GPC) spectrum of the resin mixture. )express.

(製備例28) 使用了原料聚合物11 60.00g(由根據原料聚合物11的GC測量計算之組成比算出並以MA換算之莫耳為0.167莫耳),除此以外,以與製備例19相同的方式製作出含有使原料聚合物16的MA單元用3官能(甲基)丙烯酸化合物、單官能(甲基)丙烯酸化合物及水開環而獲得之聚合物P28之樹脂混合物(聚合物溶液P28)。 在與製備例19相同的條件下,藉由凝膠滲透層析法分析所獲得之聚合物溶液P28而測量了聚合物溶液P28中所含有之聚合物P28、游離多官能(甲基)丙烯酸化合物及游離單官能(甲基)丙烯酸化合物的量以及聚合物P27的重量平均分子量及多分散性。將結果示於表2。再者,游離(甲基)丙烯酸化合物的量係以樹脂混合物的凝膠滲透層析(GPC)圖譜中之游離(甲基)丙烯酸化合物的峰面積相對於聚合物P28的峰面積之比例(%)表示。 (Preparation Example 28) It was produced in the same manner as Preparation Example 19 except that 60.00 g of the base polymer 11 was used (the mole calculated from the composition ratio calculated from the GC measurement of the base polymer 11 and converted to MA was 0.167 mol). A resin mixture (polymer solution P28) containing a polymer P28 obtained by ring-opening the MA unit of the raw material polymer 16 with a trifunctional (meth)acrylic acid compound, a monofunctional (meth)acrylic acid compound, and water. Under the same conditions as Preparation Example 19, the obtained polymer solution P28 was analyzed by gel permeation chromatography to measure the polymer P28 and the free polyfunctional (meth)acrylic acid compound contained in the polymer solution P28. and the amount of free monofunctional (meth)acrylic compounds as well as the weight average molecular weight and polydispersity of polymer P27. The results are shown in Table 2. Furthermore, the amount of free (meth)acrylic acid compound is based on the ratio (%) of the peak area of the free (meth)acrylic acid compound to the peak area of polymer P28 in the gel permeation chromatography (GPC) spectrum of the resin mixture. )express.

(製備例29) 製作出含有聚合物P29之樹脂化合物(聚合物溶液P29),該聚合物P29藉由使原料聚合物11的MA單元用3官能(甲基)丙烯酸化合物(A-TMM-3LM-N)及單官能(甲基)丙烯酸化合物(4-HBA)開環,接著,與含有環氧基之(甲基)丙烯酸化合物(GMA)進行反應而獲得。以下,對詳細內容進行說明。 首先,對原料聚合物11 60.00g(由根據原料聚合物11的GC測量計算之組成比算出並以MA換算為0.167莫耳)加入MEK 99.93g而製作出溶解液。接著,對該溶解液加入A-TMM-3LM-N 77.49g,其後,加入三乙胺18.00g(0.178莫耳),並在溫度70℃反應了2小時。其後,進一步加入4-HBA 56.27g(0.390莫耳),並在溫度70℃反應了4小時。其後,進一步加入GMA 13.31g(0.094莫耳),並在溫度70℃反應4小時而製作出反應溶液。將所獲得之反應溶液用MEK進行稀釋,並且用甲酸水溶液及檸檬酸水溶液進行處理,藉此從反應溶液中去除了水相。進而,藉由以下的程序進行液液萃取,接著進行了溶劑置換。 ·液液萃取:將反應溶液用MEK進行稀釋,接著加入水進行處理,藉此從反應溶液中去除水相之後,進一步進行了1次相同的操作。 ·溶劑置換:利用旋轉蒸發器將所獲得之反應混合物在減壓下且在50℃進行了溶劑的去除。確認聚合物溶液的固體成分濃度在藉由加熱乾燥式水分計之測量中成為27±2質量%,並中斷了去除溶劑之操作。其後,加入PGMEA以使固體成分濃度成為18質量%,並混合至變均勻。藉由相同的操作,進一步反覆進行了2次如下操作:在減壓下於50℃進行溶劑的去除,將固體成分濃度在藉由加熱乾燥式水分計之測量中調整為27±2質量%之後,進一步加入PGMEA以使固體成分濃度成為18質量%,並混合至變均勻。其後,進行了如下操作:去除溶劑或者加入PGMEA以使固體成分濃度成為30±3質量%,並攪拌至變均勻。藉由以上的操作,反應中所使用之溶劑被去除,溶劑被置換為PGMEA。 (Preparation Example 29) A resin compound (polymer solution P29) containing polymer P29 was prepared by using the MA unit of the raw material polymer 11 with a trifunctional (meth)acrylic acid compound (A-TMM-3LM-N) and a monomer. It is obtained by ring opening a functional (meth)acrylic acid compound (4-HBA) and then reacting with a (meth)acrylic acid compound (GMA) containing an epoxy group. The details are explained below. First, 99.93 g of MEK was added to 60.00 g of the raw material polymer 11 (calculated from the composition ratio calculated based on the GC measurement of the raw material polymer 11 and converted to 0.167 mol in MA) to prepare a solution. Next, 77.49 g of A-TMM-3LM-N was added to the solution, and then 18.00 g (0.178 mol) of triethylamine was added, and the reaction was carried out at a temperature of 70° C. for 2 hours. Thereafter, 56.27 g (0.390 mol) of 4-HBA was further added, and the reaction was carried out at a temperature of 70° C. for 4 hours. Thereafter, 13.31 g (0.094 mol) of GMA was further added, and the reaction was carried out at a temperature of 70° C. for 4 hours to prepare a reaction solution. The obtained reaction solution was diluted with MEK, and treated with a formic acid aqueous solution and a citric acid aqueous solution, thereby removing the aqueous phase from the reaction solution. Furthermore, liquid-liquid extraction was performed by the following procedure, and then solvent replacement was performed. ·Liquid-liquid extraction: The reaction solution was diluted with MEK, and then water was added for treatment to remove the aqueous phase from the reaction solution. The same operation was further performed once. ·Solvent replacement: The solvent was removed from the obtained reaction mixture using a rotary evaporator under reduced pressure and at 50°C. It was confirmed that the solid content concentration of the polymer solution was 27±2% by mass as measured by a heating drying moisture meter, and the operation of removing the solvent was discontinued. Thereafter, PGMEA was added so that the solid content concentration became 18% by mass, and the mixture was mixed until uniform. The same operation was repeated two more times: the solvent was removed under reduced pressure at 50°C, and the solid content concentration was adjusted to 27±2 mass% by measurement with a heating drying moisture meter. , further add PGMEA so that the solid content concentration becomes 18% by mass, and mix until uniform. Thereafter, the solvent was removed or PGMEA was added so that the solid content concentration became 30±3% by mass, and the mixture was stirred until it became uniform. Through the above operation, the solvent used in the reaction was removed and the solvent was replaced with PGMEA.

藉由以上,獲得了含有聚合物P29、殘存(游離)A-TMM-3LM-N及殘存(游離)4-HBA、殘存(游離)GMA之樹脂混合物(聚合物溶液P29),該聚合物P29藉由使原料聚合物11中的來自於順丁烯二酸酐之結構單元用A-TMM-3LM-N、4-HBA開環,接著,與含有環氧基之(甲基)丙烯酸化合物(GMA)進行反應而獲得。 在與製備例24相同的條件下,藉由凝膠滲透層析法分析所獲得之聚合物溶液P29而測量了聚合物溶液P29中所含有之聚合物P29、游離多官能(甲基)丙烯酸化合物及游離單官能(甲基)丙烯酸化合物的量以及聚合物P29的重量平均分子量及多分散性。將結果示於表2。再者,游離(甲基)丙烯酸化合物的量係以樹脂混合物的凝膠滲透層析(GPC)圖譜中之游離(甲基)丙烯酸化合物的峰面積相對於聚合物P29的峰面積之比例(%)表示。 Through the above, a resin mixture (polymer solution P29) containing polymer P29, residual (free) A-TMM-3LM-N, residual (free) 4-HBA, and residual (free) GMA was obtained. The polymer P29 By ring-opening the structural units derived from maleic anhydride in the raw material polymer 11 with A-TMM-3LM-N and 4-HBA, and then, with a (meth)acrylic acid compound (GMA) containing an epoxy group ) obtained by reaction. Under the same conditions as Preparation Example 24, the obtained polymer solution P29 was analyzed by gel permeation chromatography, and the polymer P29 and the free polyfunctional (meth)acrylic acid compound contained in the polymer solution P29 were measured. and the amount of free monofunctional (meth)acrylic compounds as well as the weight average molecular weight and polydispersity of polymer P29. The results are shown in Table 2. Furthermore, the amount of the free (meth)acrylic acid compound is based on the ratio (%) of the peak area of the free (meth)acrylic acid compound to the peak area of the polymer P29 in the gel permeation chromatography (GPC) spectrum of the resin mixture. )express.

(物性評價) 利用以下所示之方法測量了製備例6、8、12、14、16、18、21及23中所製備之各聚合物P的酸值及雙鍵當量。 (physical property evaluation) The acid value and double bond equivalent of each polymer P prepared in Preparation Examples 6, 8, 12, 14, 16, 18, 21 and 23 were measured using the method shown below.

(酸值) 聚合物的酸值利用以下的方法來測量。 計量聚合物約50mg及作為內部標準物質之對苯二甲酸二甲酯約5mg,並將其溶解於DMSO-d6中。使用核磁共振分光裝置JNM-AL300(JEOL Co.,Ltd.製造)針對該溶液進行了 1H-NMR的測量。以 1H-NMR測量內標的對苯二甲酸二甲酯的苯基的4H的峰(8.1ppm附近)的積分值作為基準,由聚合物的羧基(-COOH)的H的峰(12.4ppm附近)的積分值求出羧基的量。然後,能夠由其量算出酸值(mgKOH/g)。酸值的值愈大,表示聚合物每單位質量中的羧基的量愈多。 將結果示於表2。藉由酸值為50gKOH/g以上,可視為聚合物為了具有充分的顯影性所需要之羧基存在於聚合物中。 (Acid value) The acid value of the polymer is measured by the following method. About 50 mg of polymer and about 5 mg of dimethyl terephthalate as internal standard material were measured and dissolved in DMSO-d6. 1 H-NMR measurement was performed on this solution using a nuclear magnetic resonance spectrometer JNM-AL300 (manufactured by JEOL Co., Ltd.). Based on the integrated value of the 4H peak (near 8.1 ppm) of the phenyl group of dimethyl terephthalate measured by 1 H-NMR as the internal standard, the H peak (near 12.4 ppm) of the carboxyl group (-COOH) of the polymer ) to determine the amount of carboxyl groups. Then, the acid value (mgKOH/g) can be calculated from the amount. The larger the acid value, the greater the amount of carboxyl groups per unit mass of the polymer. The results are shown in Table 2. When the acid value is 50 gKOH/g or more, it can be considered that carboxyl groups necessary for the polymer to have sufficient developability are present in the polymer.

(雙鍵當量) 利用以下的方法測量了聚合物的雙鍵當量。 與上述酸值的測量方法同樣地進行了 1H-NMR的測量。由所獲得之光譜圖譜的來自於丙烯醯基之訊號(5.6-5.8ppm,3H)與內部標準物質的苯基的訊號(8.1ppm,4H)的積分比算出聚合物中的丙烯醯基量(mol/g),並由來自於甲基丙烯醯基之訊號(5.6-5.8ppm,2H)與內部標準物質的苯基的訊號(8.1ppm、4H)的積分比算出了聚合物中的甲基丙烯醯基量(mol/g)。在此,6.0-6.1ppm的來自於甲基丙烯醯基之訊號為微小,亦與丙烯醯基的訊號重複,因此作為丙烯醯基的訊號而進行了計算。由所算出之聚合物中的丙烯醯基量(mol/g)與甲基丙烯醯基(mol/g)的合計算出雙鍵量(mol/g),並由雙鍵量算出了雙鍵當量(g/mol)。 將結果示於表2。雙鍵當量的值愈小,表示聚合物每單位質量中的C=C雙鍵的量愈多。 (Double bond equivalent) The double bond equivalent of the polymer was measured using the following method. 1 H-NMR was measured in the same manner as the acid value measurement method described above. The amount of acryl group in the polymer was calculated from the integral ratio of the signal from the acryl group (5.6-5.8 ppm, 3H) in the obtained spectrum and the signal from the phenyl group (8.1 ppm, 4H) of the internal standard material ( mol/g), and calculated the methyl group in the polymer from the integral ratio of the signal from the methacrylyl group (5.6-5.8ppm, 2H) and the signal from the phenyl group of the internal standard material (8.1ppm, 4H) Acrylic acid group content (mol/g). Here, the signal originating from the methacryl group of 6.0-6.1 ppm is very small and overlaps with the signal of the acryl group, so it is calculated as the signal of the acryl group. The amount of double bonds (mol/g) was calculated from the sum of the calculated amount of acrylic groups (mol/g) and methacrylic groups (mol/g) in the polymer, and the double bond equivalent was calculated from the amount of double bonds. (g/mol). The results are shown in Table 2. The smaller the value of the double bond equivalent, the greater the amount of C=C double bonds per unit mass of the polymer.

[表2] 表2 製備例No. 聚合物P No. (聚合物溶液No.) 原料聚合物No. (原料聚合物的組成) 與原料聚合物反應之化合物 投入比率 (莫耳比) (vs MA) 導入比率 (莫耳比) (vs 整體結構) 酸值 (mgKOH/g) 雙鍵當量 (g/mol) 聚合物P的重量平均分子量Mw 聚合物P的多分散性 Mw/Mn 殘存多官能(甲基)丙烯酸化合物的量(vs 聚合物P) (基於GPC面積) 殘存單官能(甲基)丙烯酸化合物的量(vs 聚合物P) (基於GPC面積) 軟化點 (℃) (TMA) 熔點 (℃) (Tg-DTA) 製備例1 聚合物P1 原料聚合物1 (NB/MAN/PEMP) 4-HBA(單官能) 1.250 - - - 4400 1.51 0.0% 0.0% 73 114 製備例2 聚合物P2 原料聚合物1 (NB/MAN/PEMP) A-TMM-3LM-N(3官能) 4-HBA(單官能) 水 0.500 1.250 0.535 - - - 6900 1.56 0.0% 0.0% 119 144 製備例3 聚合物P3 (聚合物溶液P3) 原料聚合物1 (NB/MAN/PEMP) A-TMM-3LM-N(3官能) 4-HBA(單官能) 水 0.500 1.250 0.535 - - - 5500 1.49 46.7% 25.0% - - 製備例4 聚合物P4 (聚合物溶液P4) 原料聚合物2 (NB/MAN/PEMP) A-TMM-3LM-N(3官能) 4-HBA(單官能) 水 0.500 1.250 0.535 - - - 4800 1.53 51.2% 28.6% - - 製備例5 聚合物P5 (聚合物溶液P5) 原料聚合物2 (NB/MAN/PEMP) A-TMM-3LM-N(3官能) 4-HBA(單官能) 水 0.750 1.250 0.535 - - - 5100 1.54 73.7% 26.0% - - 製備例6 聚合物P6 原料聚合物4 (NB/FADB/MAN/PEMP) 4-HBA(單官能) 1.911 - 107 598 5800 1.60 0.0% 0.0% 96 114 製備例7 聚合物7 (聚合物溶液P7) 原料聚合物3 (NB/FADB/MAN/PEMP) A-TMM-3LM-N(3官能) 4-HBA(單官能) 水 0.709 1.773 0.759 - - - 4100 1.40 47.3% 27.6% - - 製備例8 聚合物P8 原料聚合物4 (NB/FADB/MAN/PEMP) A-TMM-3LM-N(3官能) 4-HBA(單官能) 水 0.765 1.911 0.818 - 89 362 7400 1.99 0.0% 0.0% 70 120 製備例9 聚合物P9 (聚合物溶液P9) 原料聚合物4 (NB/FADB/MAN/PEMP) A-TMM-3LM-N(3官能) 4-HBA(單官能) 水 0.765 1.911 0.818 - - - 4600 1.47 49.9% 25.6% - - [表3] 表2(接續) 製備例No. 聚合物P No. (聚合物溶液No.) 原料聚合物No. (原料聚合物的組成) 與原料聚合物反應之化合物 投入比率 (莫耳比) (vs MA) 導入比率 (莫耳比) (vs 整體結構) 酸值 (mgKOH/g) 雙鍵當量 (g/mol) 聚合物P的重量平均分子量Mw 聚合物P的多分散性 Mw/Mn 殘存多官能(甲基)丙烯酸化合物的量(vs 聚合物P) (基於GPC面積) 殘存單官能(甲基)丙烯酸化合物的量(vs 聚合物P) (基於GPC面積) 軟化點 (℃) (TMA) 熔點 (℃) (Tg-DTA) 製備例10 聚合物P10 (聚合物溶液P10) 原料聚合物4 (NB/FADB/MAN/PEMP) A-TMM-3LM-N(3官能) 4-HBA(單官能) 水 1.147 1.911 0.818 - - - 4600 1.44 79.3% 25.9% - - 製備例11 聚合物P11 (聚合物溶液P11) 原料聚合物5 (NB/FADB/MAN/PEMP) A-TMM-3LM-N(3官能) 4-HBA(單官能) 水 0.653 1.632 0.698 - - - 5000 1.52 49.1% 25.4% - - 製備例12 聚合物P12 原料聚合物5 (NB/FADB/MAN/PEMP) A-TMM-3LM-N(3官能) 4-HBA(單官能) 水 0.653 1.632 0.698 - 104 316 8500 2.05 0.0% 0.0% 73 121 製備例13 聚合物P13 (聚合物溶液P13) 原料聚合物6 (NB/FADE/MAN/PEMP) A-TMM-3LM-N(3官能) 4-HBA(單官能) 水 0.678 1.696 0.726 - - - 4400 1.47 48.8% 26.7% - - 製備例14 聚合物P14 原料聚合物6 (NB/FADE/MAN/PEMP) A-TMM-3LM-N(3官能) 4-HBA(單官能) 水 0.678 1.696 0.726 - 101 310 7700 2.00 0.0% 0.0% 83 127 製備例15 聚合物P15 (聚合物溶液P15) 原料聚合物7 (NB/FABEH/MAN/PEMP) A-TMM-3LM-N(3官能) 4-HBA(單官能) 水 0.733 1.831 0.784 - - - 4300 1.44 53.9% 27.0% - - 製備例16 聚合物16 原料聚合物7 (NB/FABEH/MAN/PEMP) A-TMM-3LM-N(3官能) 4-HBA(單官能) 水 0.733 1.831 0.784 - 100 303 7600 2.01 0.0% 0.0% 70 110 製備例17 聚合物P17 (聚合物溶液P17) 原料聚合物8 (NB/MADB/MAN/PEMP) A-TMM-3LM-N(3官能) 4-HBA(單官能) 水 0.635 1.587 0.679 - - - 4100 1.44 45.7% 24.3% - - 製備例18 聚合物P18 原料聚合物8 (NB/MADB/MAN/PEMP) A-TMM-3LM-N(3官能) 4-HBA(單官能) 水 0.635 1.587 0.679 - 103 302 6900 2.05 0.0% 0.0% 78 109 製備例19 聚合物P19 (聚合物溶液P19) 原料聚合物3 (NB/FADB/MAN/PEMP) A-TMM-3LM-N(3官能) 4-HBA(單官能) 水 0.709 1.773 0.759 - - - 3800 1.38 5.1% 0.3% - - 製備例20 聚合物P20 (聚合物溶液P20) 原料聚合物6 (NB/FADE/MAN/PEMP) A-TMM-3LM-N(3官能) 水 0.678 0.726 - - - 5500 1.42 52.1% 0.0% - - [表4] 表2(接續) 製備例No. 聚合物P No. (聚合物溶液No.) 原料聚合物No. (原料聚合物的組成) 與原料聚合物反應之化合物 投入比率 (莫耳比) (vs MA) 導入比率 (莫耳比) (vs 整體結構) 酸值 (mgKOH/g) 雙鍵當量 (g/mol) 聚合物P的重量平均分子量Mw 聚合物P的多分散性 Mw/Mn 殘存多官能(甲基)丙烯酸化合物的量(vs 聚合物P) (基於GPC面積) 殘存單官能(甲基)丙烯酸化合物的量(vs 聚合物P) (基於GPC面積) 軟化點 (℃) (TMA) 熔點 (℃) (Tg-DTA) 製備例21 聚合物P21 原料聚合物9 (NB/MAN/FADB/PEMP) 4-HBA(單官能) GMA 1.608 0.772 0.210 0.019 74 552 4,600 1.54 0.0% 0.0% 53 73 製備例22 聚合物P22 (聚合物溶液P22) 原料聚合物9 (NB/MAN/FADB/PEMP) 4-HBA(單官能) GMA 1.608 0.772 - - - 4,600 1.41 0.0% 0.8% - - 製備例23 聚合物P23 原料聚合物9 (NB/MAN/FADB/PEMP) A-TMM-3LM-N(3官能) 4-HBA(單官能) GMA 0.322 0.965 0.579 0.046 0.133 0.016 74 431 9,100 2.69 0.0% 0.0% 104 128 製備例24 聚合物P24 (聚合物溶液P24) 原料聚合物9 (NB/MAN/FADB/PEMP) A-TMM-3LM-N(3官能) 4-HBA(單官能) GMA 0.322 0.965 0.579 - - - 5,300 1.52 5.1% 0.8% - - 製備例25 聚合物P25 原料聚合物7 (NB/MAN/FABEH/PEMP) A-TMM-3LM-N(3官能) 水 GMA 0.653 1.632 0.698 - - - 8,900 2.51 0.0% 0.0% 88 107 製備例26 聚合物P26 (聚合物溶液P26) 原料聚合物7 (NB/MAN/FABEH/PEMP) A-TMM-3LM-N(3官能) 水 GMA 0.653 1.632 0.698 - - - 4,700 1.44 12.5% 0.1% - - 製備例27 聚合物P27 (聚合物溶液P27) 原料聚合物10 (NB/MAN/FADB/PhMI/PEMP) A-TMM-3LM-N(3官能) 4-HBA(單官能) 水 1.390 3.477 1.502 - - - 3,200 1.27 94.7% 51.6% - - 製備例28 聚合物P28 (聚合物溶液P28) 原料聚合物11 (NB/MAN/FADB) A-TMM-3LM-N(3官能) 4-HBA(單官能) 水 0.934 2.335 1.000 - - - 4,400 1.32 64.4% 30.9% - - 製備例29 聚合物P29 (聚合物溶液P29) 原料聚合物11 (NB/MAN/FADB) A-TMM-3LM-N(3官能) 4-HBA(單官能) GMA 0.701 2.335 0.560 - - - 5,000 1.50 66.6% 35.2% - - [Table 2] Table 2 Preparation Example No. Polymer P No. (polymer solution No.) Raw polymer No. (Composition of raw polymer) Compounds that react with raw polymers Input ratio (mol ratio) (vs MA) Import ratio (mol ratio) (vs overall structure) Acid value (mgKOH/g) Double bond equivalent (g/mol) Weight average molecular weight Mw of polymer P Polydispersity Mw/Mn of polymer P Amount of residual polyfunctional (meth)acrylic compound (vs Polymer P) (based on GPC area) Amount of residual monofunctional (meth)acrylic compound (vs polymer P) (based on GPC area) Softening point (℃) (TMA) Melting point (℃) (Tg-DTA) Preparation Example 1 Polymer P1 Raw polymer 1 (NB/MAN/PEMP) 4-HBA (monofunctional) 1.250 - - - 4400 1.51 0.0% 0.0% 73 114 Preparation Example 2 Polymer P2 Raw polymer 1 (NB/MAN/PEMP) A-TMM-3LM-N (trifunctional) 4-HBA (monofunctional) water 0.500 1.250 0.535 - - - 6900 1.56 0.0% 0.0% 119 144 Preparation Example 3 Polymer P3 (polymer solution P3) Raw polymer 1 (NB/MAN/PEMP) A-TMM-3LM-N (trifunctional) 4-HBA (monofunctional) water 0.500 1.250 0.535 - - - 5500 1.49 46.7% 25.0% - - Preparation Example 4 Polymer P4 (polymer solution P4) Raw polymer 2 (NB/MAN/PEMP) A-TMM-3LM-N (trifunctional) 4-HBA (monofunctional) water 0.500 1.250 0.535 - - - 4800 1.53 51.2% 28.6% - - Preparation Example 5 Polymer P5 (polymer solution P5) Raw polymer 2 (NB/MAN/PEMP) A-TMM-3LM-N (trifunctional) 4-HBA (monofunctional) water 0.750 1.250 0.535 - - - 5100 1.54 73.7% 26.0% - - Preparation Example 6 Polymer P6 Raw polymer 4 (NB/FADB/MAN/PEMP) 4-HBA (monofunctional) 1.911 - 107 598 5800 1.60 0.0% 0.0% 96 114 Preparation Example 7 Polymer 7 (polymer solution P7) Raw polymer 3 (NB/FADB/MAN/PEMP) A-TMM-3LM-N (trifunctional) 4-HBA (monofunctional) water 0.709 1.773 0.759 - - - 4100 1.40 47.3% 27.6% - - Preparation Example 8 Polymer P8 Raw polymer 4 (NB/FADB/MAN/PEMP) A-TMM-3LM-N (trifunctional) 4-HBA (monofunctional) water 0.765 1.911 0.818 - 89 362 7400 1.99 0.0% 0.0% 70 120 Preparation Example 9 Polymer P9 (polymer solution P9) Raw polymer 4 (NB/FADB/MAN/PEMP) A-TMM-3LM-N (trifunctional) 4-HBA (monofunctional) water 0.765 1.911 0.818 - - - 4600 1.47 49.9% 25.6% - - [table 3] Table 2 (continued) Preparation Example No. Polymer P No. (polymer solution No.) Raw polymer No. (Composition of raw polymer) Compounds that react with raw polymers Input ratio (mol ratio) (vs MA) Import ratio (mol ratio) (vs overall structure) Acid value (mgKOH/g) Double bond equivalent (g/mol) Weight average molecular weight Mw of polymer P Polydispersity Mw/Mn of polymer P Amount of residual polyfunctional (meth)acrylic compound (vs Polymer P) (based on GPC area) Amount of residual monofunctional (meth)acrylic compound (vs polymer P) (based on GPC area) Softening point (℃) (TMA) Melting point (℃) (Tg-DTA) Preparation Example 10 Polymer P10 (polymer solution P10) Raw polymer 4 (NB/FADB/MAN/PEMP) A-TMM-3LM-N (trifunctional) 4-HBA (monofunctional) water 1.147 1.911 0.818 - - - 4600 1.44 79.3% 25.9% - - Preparation Example 11 Polymer P11 (polymer solution P11) Raw polymer 5 (NB/FADB/MAN/PEMP) A-TMM-3LM-N (trifunctional) 4-HBA (monofunctional) water 0.653 1.632 0.698 - - - 5000 1.52 49.1% 25.4% - - Preparation Example 12 Polymer P12 Raw polymer 5 (NB/FADB/MAN/PEMP) A-TMM-3LM-N (trifunctional) 4-HBA (monofunctional) water 0.653 1.632 0.698 - 104 316 8500 2.05 0.0% 0.0% 73 121 Preparation Example 13 Polymer P13 (polymer solution P13) Raw polymer 6 (NB/FADE/MAN/PEMP) A-TMM-3LM-N (trifunctional) 4-HBA (monofunctional) water 0.678 1.696 0.726 - - - 4400 1.47 48.8% 26.7% - - Preparation Example 14 Polymer P14 Raw polymer 6 (NB/FADE/MAN/PEMP) A-TMM-3LM-N (trifunctional) 4-HBA (monofunctional) water 0.678 1.696 0.726 - 101 310 7700 2.00 0.0% 0.0% 83 127 Preparation Example 15 Polymer P15 (polymer solution P15) Raw polymer 7 (NB/FABEH/MAN/PEMP) A-TMM-3LM-N (trifunctional) 4-HBA (monofunctional) water 0.733 1.831 0.784 - - - 4300 1.44 53.9% 27.0% - - Preparation Example 16 Polymer 16 Raw polymer 7 (NB/FABEH/MAN/PEMP) A-TMM-3LM-N (trifunctional) 4-HBA (monofunctional) water 0.733 1.831 0.784 - 100 303 7600 2.01 0.0% 0.0% 70 110 Preparation Example 17 Polymer P17 (polymer solution P17) Raw polymer 8 (NB/MADB/MAN/PEMP) A-TMM-3LM-N (trifunctional) 4-HBA (monofunctional) water 0.635 1.587 0.679 - - - 4100 1.44 45.7% 24.3% - - Preparation Example 18 Polymer P18 Raw polymer 8 (NB/MADB/MAN/PEMP) A-TMM-3LM-N (trifunctional) 4-HBA (monofunctional) water 0.635 1.587 0.679 - 103 302 6900 2.05 0.0% 0.0% 78 109 Preparation Example 19 Polymer P19 (polymer solution P19) Raw polymer 3 (NB/FADB/MAN/PEMP) A-TMM-3LM-N (trifunctional) 4-HBA (monofunctional) water 0.709 1.773 0.759 - - - 3800 1.38 5.1% 0.3% - - Preparation Example 20 Polymer P20 (polymer solution P20) Raw polymer 6 (NB/FADE/MAN/PEMP) A-TMM-3LM-N (3 functional) water 0.678 0.726 - - - 5500 1.42 52.1% 0.0% - - [Table 4] Table 2 (continued) Preparation Example No. Polymer P No. (polymer solution No.) Raw polymer No. (Composition of raw polymer) Compounds that react with raw polymers Input ratio (mol ratio) (vs MA) Import ratio (mol ratio) (vs overall structure) Acid value (mgKOH/g) Double bond equivalent (g/mol) Weight average molecular weight Mw of polymer P Polydispersity Mw/Mn of polymer P Amount of residual polyfunctional (meth)acrylic compound (vs Polymer P) (based on GPC area) Amount of residual monofunctional (meth)acrylic compound (vs polymer P) (based on GPC area) Softening point (℃) (TMA) Melting point (℃) (Tg-DTA) Preparation Example 21 Polymer P21 Raw polymer 9 (NB/MAN/FADB/PEMP) 4-HBA (monofunctional) GMA 1.608 0.772 0.210 0.019 74 552 4,600 1.54 0.0% 0.0% 53 73 Preparation Example 22 Polymer P22 (polymer solution P22) Raw polymer 9 (NB/MAN/FADB/PEMP) 4-HBA (monofunctional) GMA 1.608 0.772 - - - 4,600 1.41 0.0% 0.8% - - Preparation Example 23 Polymer P23 Raw polymer 9 (NB/MAN/FADB/PEMP) A-TMM-3LM-N (3 functional) 4-HBA (mono functional) GMA 0.322 0.965 0.579 0.046 0.133 0.016 74 431 9,100 2.69 0.0% 0.0% 104 128 Preparation Example 24 Polymer P24 (polymer solution P24) Raw polymer 9 (NB/MAN/FADB/PEMP) A-TMM-3LM-N (3 functional) 4-HBA (mono functional) GMA 0.322 0.965 0.579 - - - 5,300 1.52 5.1% 0.8% - - Preparation Example 25 Polymer P25 Raw polymer 7 (NB/MAN/FABEH/PEMP) A-TMM-3LM-N (3 functional) Water GMA 0.653 1.632 0.698 - - - 8,900 2.51 0.0% 0.0% 88 107 Preparation Example 26 Polymer P26 (polymer solution P26) Raw polymer 7 (NB/MAN/FABEH/PEMP) A-TMM-3LM-N (3 functional) Water GMA 0.653 1.632 0.698 - - - 4,700 1.44 12.5% 0.1% - - Preparation Example 27 Polymer P27 (polymer solution P27) Raw polymer 10 (NB/MAN/FADB/PhMI/PEMP) A-TMM-3LM-N (trifunctional) 4-HBA (monofunctional) water 1.390 3.477 1.502 - - - 3,200 1.27 94.7% 51.6% - - Preparation Example 28 Polymer P28 (polymer solution P28) Raw polymer 11 (NB/MAN/FADB) A-TMM-3LM-N (trifunctional) 4-HBA (monofunctional) water 0.934 2.335 1.000 - - - 4,400 1.32 64.4% 30.9% - - Preparation Example 29 Polymer P29 (polymer solution P29) Raw polymer 11 (NB/MAN/FADB) A-TMM-3LM-N (3 functional) 4-HBA (mono functional) GMA 0.701 2.335 0.560 - - - 5,000 1.50 66.6% 35.2% - -

[實施例1~24、比較例1~5] 在各實施例及比較例中製作樹脂組成物,並針對以下的項目進行了評價。 <評價> [樹脂組成物的鹼溶解速度] 將製備例1、2、6、8、12、14、16、18、21、23、25中所獲得之聚合物P1、P2、P6、P8、P12、P14、P16、P18、P21、P23、P25溶解於丙二醇單甲醚乙酸酯(PGMEA)而製作出固體成分濃度30質量%的樹脂組成物1、2、6、8、12、14、16、18、21、23、25。 接著,在晶圓上旋塗上述樹脂組成物1、2、6、8、12、14、16、18、12、14、16、18、21、23、25或由製備例3~5、7、9、10、11、13、15、17、19、20、22、24、26~29中所獲得之聚合物溶液P3~P5、P7、P9、P10、P11、P13、P15、P17、P19、P20、P22、P24、P26~P29構成之樹脂組成物3~5、7、9、10、11、13、15、17、19、20、22、24、26~29,並使PGMEA乾燥,然後,在溫度100℃預烘烤2分鐘,藉此製作出膜厚約2μm的樹脂膜。 將該樹脂膜連同晶圓一起浸漬於溫度23℃的2%碳酸鈉水溶液中,並測量了樹脂膜的溶解速度。 溶解速度藉由如下方式來算出:目視觀察浸漬之晶圓,測量樹脂膜溶解而看不到干涉模樣為止之時間,將膜厚除以該時間。將結果示於表3。若鹼溶解速度為20nm/s以上,則能夠毫無問題地用作感光性材料,若為100nm/s以上,則能夠視為顯影性良好,若為500nm/s以上,則能夠視為更良好,進而,若為1000nm/s以上,則能夠視為尤其良好。 [Examples 1 to 24, Comparative Examples 1 to 5] In each of the Examples and Comparative Examples, a resin composition was prepared and evaluated for the following items. <Evaluation> [Alkali dissolution rate of resin composition] The polymers P1, P2, P6, P8, P12, P14, P16, P18, P21, P23, P25 was dissolved in propylene glycol monomethyl ether acetate (PGMEA) to produce resin compositions 1, 2, 6, 8, 12, 14, 16, 18, 21, 23, and 25 having a solid content concentration of 30% by mass. Next, the above-mentioned resin compositions 1, 2, 6, 8, 12, 14, 16, 18, 12, 14, 16, 18, 21, 23, 25 are spin-coated on the wafer or prepared according to Preparation Examples 3 to 5 and 7. , 9, 10, 11, 13, 15, 17, 19, 20, 22, 24, 26~29, polymer solutions P3~P5, P7, P9, P10, P11, P13, P15, P17, P19 , resin compositions 3 to 5, 7, 9, 10, 11, 13, 15, 17, 19, 20, 22, 24, 26 to 29 composed of P20, P22, P24, P26 to P29, and dry the PGMEA, Then, it was prebaked at a temperature of 100° C. for 2 minutes to produce a resin film with a film thickness of approximately 2 μm. The resin film and the wafer were immersed in a 2% sodium carbonate aqueous solution at a temperature of 23°C, and the dissolution rate of the resin film was measured. The dissolution rate is calculated by visually observing the immersed wafer, measuring the time until the resin film dissolves and no interference pattern is visible, and dividing the film thickness by the time. The results are shown in Table 3. If the alkali dissolution rate is 20 nm/s or more, it can be used as a photosensitive material without any problem. If it is 100 nm/s or more, the developability can be considered to be good. If it is 500 nm/s or more, it can be considered to be even better. , and further, if it is 1000 nm/s or more, it can be considered to be particularly good.

[原料聚合物的軟化點] 利用以下的方法測量了原料聚合物1~11的軟化點。 首先,將測量對象的聚合物(原料聚合物1~11)0.1~1.0mg放入鋁製樣品盤中,在氮環境下使用示差熱分析裝置(Hitachi High-Tech Science Corporation製造,「EXSTAR TMA/SS6100」)測量了軟化點。測量模式為壓縮、荷重設為30mN,在30℃至200℃的範圍以3℃/分鐘的升溫速度進行了升溫。若試樣因升溫而軟化,則試樣發生變形,被檢測為移位量(μm),低溫側的無移位的直線部分的延長或移位速度的最小部分的切線與移位速度的最大部分的切線的交點設為軟化點。作為一例,將原料聚合物4的TMA圖譜示於圖3。將軟化點的測量結果示於表1。 若原料聚合物的軟化點為130℃以下,則可以說軟化點低,若為120℃以下,則可以說更低,若為100℃以下,則可以說尤其更低,若為90℃以下,則可以說進一步尤其更低。 [Softening point of raw polymer] The softening points of raw material polymers 1 to 11 were measured by the following method. First, 0.1 to 1.0 mg of the polymer to be measured (raw material polymers 1 to 11) was placed in an aluminum sample pan, and a differential thermal analysis device (manufactured by Hitachi High-Tech Science Corporation, "EXSTAR TMA/ SS6100") measured the softening point. The measurement mode was compression, the load was set to 30 mN, and the temperature was raised at a heating rate of 3°C/min in the range of 30°C to 200°C. If the sample softens due to temperature rise, the sample deforms, which is detected as the displacement amount (μm), the extension of the straight line portion without displacement on the low temperature side or the tangent line of the minimum portion of the displacement speed and the maximum displacement speed. The intersection point of the tangent lines of the parts is set as the softening point. As an example, the TMA spectrum of raw material polymer 4 is shown in FIG. 3 . The measurement results of the softening point are shown in Table 1. If the softening point of the raw material polymer is 130°C or lower, it can be said to be low. If it is 120°C or lower, it can be said to be lower. If it is 100°C or lower, it can be said to be particularly lower. If it is 90°C or lower, it can be said to be particularly lower. It can be said that it is even lower.

[原料聚合物的熔點] 利用以下的方法測量了原料聚合物1~11的熔點。 首先,將測量對象的聚合物(原料聚合物1~11)1~2mg放入鋁製樣品盤中,在氮環境下使用示差熱分析裝置(Hitachi High-Tech Science Corporation製造,「STA7200RV」)一邊觀察圖像,一邊從30℃以10℃/分鐘的升溫速度進行了升溫。目視確認試樣開始熔融之溫度,將其作為熔點。 若原料聚合物的熔點為160℃以下,可以說熔點低,若為140℃以下,則可以說更低,若為120℃以下,則可以說尤其更低,若為110℃以下,則可以說進一步尤其更低。將結果示於表1。 [Melting point of raw material polymer] The melting points of raw material polymers 1 to 11 were measured by the following method. First, 1 to 2 mg of the polymer to be measured (raw material polymers 1 to 11) are placed in an aluminum sample pan, and a differential thermal analysis device (manufactured by Hitachi High-Tech Science Corporation, "STA7200RV") is used in a nitrogen environment. While observing the image, the temperature was raised from 30°C at a temperature increase rate of 10°C/min. The temperature at which the sample begins to melt is visually confirmed and used as the melting point. If the melting point of the raw material polymer is 160°C or lower, it can be said to be low. If it is 140°C or lower, it can be said to be lower. If it is 120°C or lower, it can be said to be particularly lower. If it is 110°C or lower, it can be said to be particularly low. Further especially lower. The results are shown in Table 1.

[聚合物P的軟化點] 利用以下的方法測量了製備例1、2、6、8、12、14、16、18、21、23、25中所獲得之聚合物P1、P2、P6、P8、P12、P14、P16、P18、P21、P23、P25的軟化點。 首先,將測量對象的聚合物(聚合物P1、P2、P6、P8、P12、P14、P16、P18、P21、P23、P25)0.1-1.0mg放入鋁製樣品盤中,在氮環境下使用示差熱分析裝置(Hitachi High-Tech Science Corporation製造,「EXSTAR TMA/SS6100」)測量了軟化點。測量模式為壓縮、荷重設為30mN,在30℃至200℃的範圍以3℃/分鐘的升溫速度進行了升溫。若試樣因升溫而軟化,則試樣發生變形,被檢測為移位量(μm),低溫側的無移位的直線部分的延長或移位速度的最小部分的切線與移位速度的最大部分的切線的交點設為軟化點。將結果示於表2。 若聚合物P的軟化點為110℃以下,則可以說軟化點低,若為90℃以下,則可以說更低,若為80℃以下,則可以說尤其更低,若為70℃以下,則可以說進一步尤其更低。 [Softening point of polymer P] The polymers P1, P2, P6, P8, P12, P14, P16, and P18 obtained in Preparation Examples 1, 2, 6, 8, 12, 14, 16, 18, 21, 23, and 25 were measured using the following method. , P21, P23, P25 softening point. First, place 0.1-1.0 mg of the polymer to be measured (polymer P1, P2, P6, P8, P12, P14, P16, P18, P21, P23, P25) into an aluminum sample pan and use it in a nitrogen environment The softening point was measured using a differential thermal analysis device ("EXSTAR TMA/SS6100" manufactured by Hitachi High-Tech Science Corporation). The measurement mode was compression, the load was set to 30 mN, and the temperature was raised at a heating rate of 3°C/min in the range of 30°C to 200°C. If the sample softens due to temperature rise, the sample deforms, which is detected as the displacement amount (μm), the extension of the straight line portion without displacement on the low temperature side or the tangent line of the minimum portion of the displacement speed and the maximum displacement speed. The intersection point of the tangent lines of the parts is set as the softening point. The results are shown in Table 2. If the softening point of the polymer P is 110°C or lower, it can be said to be low. If it is 90°C or lower, it can be said to be lower. If it is 80°C or lower, it can be said to be particularly lower. If it is 70°C or lower, it can be said to be particularly lower. It can be said that it is even lower.

[聚合物P的熔點] 利用以下的方法測量了製備例1、2、6、8、12、14、16、18、21、23、25中所獲得之聚合物P1、P2、P6、P8、P12、P14、P16、P18、P21、P23、P25的熔點。 首先,將測量對象的聚合物(聚合物P1、P2、P6、P8、P12、P14、P16、P18、P21、P23、P25)1~2mg放入鋁製樣品盤中,在氮環境下使用示差熱分析裝置(Hitachi High-Technologies Corporation製造,「STA7200RV」)一邊觀察圖像,一邊從30℃以10℃/分鐘的升溫速度進行了升溫。目視確認試樣開始熔融之溫度,將其作為熔點。將結果示於表2。 若聚合物P的熔點為140℃以下,則可以說熔點低,若為130℃以下,則可以說更低,若為120℃以下,則可以說尤其更低,若為110℃以下,則可以說進一步尤其更低。 [Melting point of polymer P] The polymers P1, P2, P6, P8, P12, P14, P16, and P18 obtained in Preparation Examples 1, 2, 6, 8, 12, 14, 16, 18, 21, 23, and 25 were measured using the following method. , P21, P23, P25 melting point. First, put 1 to 2 mg of the polymer to be measured (polymers P1, P2, P6, P8, P12, P14, P16, P18, P21, P23, P25) into an aluminum sample pan, and use differential pressure in a nitrogen environment. The thermal analysis device (manufactured by Hitachi High-Technologies Corporation, "STA7200RV") was heated from 30°C at a temperature increase rate of 10°C/min while observing the image. The temperature at which the sample begins to melt is visually confirmed and used as the melting point. The results are shown in Table 2. If the melting point of the polymer P is 140°C or lower, it can be said to be low. If it is 130°C or lower, it can be said to be lower. If it is 120°C or lower, it can be said to be particularly lower. If it is 110°C or lower, it can be said to be lower. Said further, it is even lower.

[感光性樹脂組成物的硬化物的軟化點] 利用以下的方法測量了由製備例1、2、6、8、12、14、16、18、21、23、25中所獲得之聚合物P1、P2、P6、P8、P12、P14、P16、P18、P21、P23、P25或製備例3~5、7、9、10、11、13、15、17、19、20、22、24、26~29中所獲得之聚合物溶液P3~P5、P7、P9、P10、P11、P13、P15、P17、P19、P20、P22、P24、P26~P29製作之感光性樹脂組成物的軟化點。 首先,以使總固體成分濃度成為30質量%之方式將以下成分溶解於丙二醇單甲醚乙酸酯(PGMEA)而獲得了感光性樹脂組成物。 ·聚合物P1、P2、P6、P8、P12、P14、P16、P18、P21、P23、P25(分別為製備例1、2、6、8、12、14、16、18、21、23、25中所獲得之聚合物P)或樹脂混合物3~5、7、9、10、11、13、15、17、19、20、22、24、26~29(分別為製備例3~5、7、9、10、11、13、15、17、19、20、22、24、26~29的聚合物溶液P3~P5、P7、P9、P10、P11、P13、P15、P17、P19、P20、P22、P24、P26~P29):100質量份 (在此,針對樹脂混合物3~5、7、9、10、11、13、15、17、19、20、22、24、26~29,以使固體成分(聚合物P3~P5、P7、P9、P10、P11、P13、P15、P17、P19、P20、P22、P24、P26~P29)與多官能(甲基)丙烯酸化合物的合計量)成為100質量份的方式進行了秤量。) ·光聚合起始劑(BASF公司製造,Irgacure OXE01):5質量份 使所獲得之感光性樹脂組成物流入毫無間隙地貼附有鐵氟龍黏著膠帶(NITOFLON黏著膠帶,Nо.903UL(厚度0.08mm、寬度25mm、長度10mm),Nitto Denko Corporation)之尺寸2cm×2cm、高度5mm的容器中之後,在40℃真空乾燥16小時而去除了溶劑。其後,對該薄膜用Canon Inc.製造之g+h+i射線遮罩對準器(PLA-600F)以100mJ/cm 2的曝光量進行了g+h+i射線的曝光。曝光後,從鐵氟龍黏著膠帶剝取硬化物,獲得了感光性樹脂組成物的硬化物。 將測量對象的感光性樹脂組成物的硬化物0.1~1.0mg放入鋁製樣品盤中,在氮環境下使用示差熱分析裝置(Hitachi High-Tech Science Corporation製造,「EXSTAR TMA/SS6100」)測量了軟化點。測量模式為壓縮、荷重設為30mN,在30℃至200℃的範圍以1℃/分鐘的升溫速度進行了升溫。若試樣因升溫而軟化,則試樣發生變形,被檢測為移位量(μm),低溫側的無移位的直線部分的延長或移位速度的最小部分的切線與移位速度的最大部分的切線的交點設為軟化點。 將以下述的基準評價之感光性樹脂組成物的硬化物的軟化點的評價結果示於表3。 A:軟化點低於100℃ B:軟化點為100℃以上 若感光性樹脂組成物的硬化物的軟化點低於100℃,則可以說軟化點低,圖案形成性良好。 [Softening Point of Cured Material of Photosensitive Resin Composition] The polymer P1 obtained in Preparation Examples 1, 2, 6, 8, 12, 14, 16, 18, 21, 23, and 25 was measured by the following method. , P2, P6, P8, P12, P14, P16, P18, P21, P23, P25 or Preparation Examples 3 to 5, 7, 9, 10, 11, 13, 15, 17, 19, 20, 22, 24, 26 Softening points of photosensitive resin compositions produced from polymer solutions P3 to P5, P7, P9, P10, P11, P13, P15, P17, P19, P20, P22, P24, P26 to P29 obtained in step 29. First, the following components were dissolved in propylene glycol monomethyl ether acetate (PGMEA) so that the total solid content concentration became 30 mass %, and a photosensitive resin composition was obtained. ·Polymers P1, P2, P6, P8, P12, P14, P16, P18, P21, P23, P25 (preparation examples 1, 2, 6, 8, 12, 14, 16, 18, 21, 23, 25, respectively) Polymer P) or resin mixtures 3 to 5, 7, 9, 10, 11, 13, 15, 17, 19, 20, 22, 24, 26 to 29 (preparation examples 3 to 5, 7 respectively) obtained in , 9, 10, 11, 13, 15, 17, 19, 20, 22, 24, 26~29 polymer solutions P3~P5, P7, P9, P10, P11, P13, P15, P17, P19, P20, P22, P24, P26~P29): 100 parts by mass (here, for resin mixtures 3~5, 7, 9, 10, 11, 13, 15, 17, 19, 20, 22, 24, 26~29, The total amount of the solid content (polymers P3 to P5, P7, P9, P10, P11, P13, P15, P17, P19, P20, P22, P24, P26 to P29) and the polyfunctional (meth)acrylic compound) is Weighed in 100 parts by mass. ) · Photopolymerization initiator (Irgacure OXE01 manufactured by BASF): 5 parts by mass. The obtained photosensitive resin composition was poured into the Teflon adhesive tape (NITOFLON adhesive tape, No. 903UL) without any gaps. Thickness 0.08mm, width 25mm, length 10mm), Nitto Denko Corporation) in a container with dimensions 2cm × 2cm, height 5mm, and then vacuum dried at 40°C for 16 hours to remove the solvent. Thereafter, the film was exposed to g+h+i rays using a g+h+i ray mask aligner (PLA-600F) manufactured by Canon Inc. at an exposure dose of 100 mJ/cm 2 . After exposure, the hardened material was peeled off from the Teflon adhesive tape, and a hardened material of the photosensitive resin composition was obtained. 0.1 to 1.0 mg of the cured product of the photosensitive resin composition to be measured was placed in an aluminum sample pan, and measured using a differential thermal analysis device ("EXSTAR TMA/SS6100" manufactured by Hitachi High-Tech Science Corporation) in a nitrogen environment. softening point. The measurement mode was compression, the load was set to 30 mN, and the temperature was raised in the range of 30°C to 200°C at a heating rate of 1°C/min. If the sample softens due to temperature rise, the sample deforms, which is detected as the displacement amount (μm), the extension of the straight line portion without displacement on the low temperature side or the tangent line of the minimum portion of the displacement speed and the maximum displacement speed. The intersection point of the tangent lines of the parts is set as the softening point. Table 3 shows the evaluation results of the softening point of the cured product of the photosensitive resin composition evaluated based on the following standards. A: The softening point is lower than 100°C. B: The softening point is 100°C or higher. If the softening point of the cured product of the photosensitive resin composition is lower than 100°C, it can be said that the softening point is low and the pattern formability is good.

[感光性樹脂組成物的靈敏度評價1(殘膜率成為90%以上之曝光量)] 首先,以使總固體成分濃度成為30質量%之方式將以下成分溶解於丙二醇單甲醚乙酸酯(PGMEA)而獲得了感光性樹脂組成物。 ·聚合物P1、P2、P6、P8、P12、P14、P16、P18(分別為製備例1、2、6、8、12、14、16、18的聚合物P)或樹脂組成物3~5、7、9、10、11、13、15、17、19、20(分別為製備例3~5、7、9、10、11、13、15、17、19、20的聚合物溶液P3~P5、P7、P9、P10、P11、P13、P15、P17、P19、P20):100質量份 (在此,針對樹脂組成物3~5、7、9、10、11、13、15、17、19、20,以使固體成分(聚合物P3~P5、P7、P9、P10、P11、P13、P15、P17、P19、P20)與多官能(甲基)丙烯酸化合物的合計量)成為100質量份之方式進行了秤量。) ·多官能丙烯酸酯(二新戊四醇六丙烯酸酯,Shin-Nakamura Chemical Co.,Ltd.製造,A-DPH):50質量份 ·光聚合起始劑(BASF公司製造,Irgacure OXE01):5質量份 ·密接助劑(Shin-Etsu Chemical Co.,Ltd.製造,KBM-403):1質量份 ·界面活性劑(DIC Corporation製造,F-556):0.5質量份 [Sensitivity evaluation of photosensitive resin composition 1 (exposure amount at which film residual rate becomes 90% or more)] First, the following components were dissolved in propylene glycol monomethyl ether acetate (PGMEA) so that the total solid content concentration became 30 mass %, and a photosensitive resin composition was obtained. ·Polymers P1, P2, P6, P8, P12, P14, P16, and P18 (polymer P of Preparation Examples 1, 2, 6, 8, 12, 14, 16, and 18, respectively) or resin compositions 3 to 5 , 7, 9, 10, 11, 13, 15, 17, 19, 20 (respectively the polymer solutions P3~ of Preparation Examples 3~5, 7, 9, 10, 11, 13, 15, 17, 19, and 20 P5, P7, P9, P10, P11, P13, P15, P17, P19, P20): 100 parts by mass (Here, for resin compositions 3 to 5, 7, 9, 10, 11, 13, 15, 17, 19, and 20, the solid content (polymers P3 to P5, P7, P9, P10, P11, P13 , P15, P17, P19, P20) and the total amount of the polyfunctional (meth)acrylic compound) were weighed so that it became 100 parts by mass. ) ·Polyfunctional acrylate (dineopenterythritol hexaacrylate, manufactured by Shin-Nakamura Chemical Co., Ltd., A-DPH): 50 parts by mass ·Photopolymerization initiator (Irgacure OXE01 manufactured by BASF): 5 parts by mass · Adhesion additive (KBM-403, manufactured by Shin-Etsu Chemical Co., Ltd.): 1 part by mass ·Surface active agent (manufactured by DIC Corporation, F-556): 0.5 parts by mass

將所獲得之感光性樹脂組成物旋塗於經HMDS(Hexamethyldisilazane)處理之3英吋矽晶圓上,並在100℃於加熱板上烘烤120秒鐘而獲得了約3.0μm厚度(±0.3μm)的薄膜A。 對該薄膜A介隔具有遮光率1~100%的灰度(gradation)之光罩,用Canon Inc.製造之g+h+i射線遮罩對準器(PLA-501F)以100mJ/cm 2的曝光量進行了g+h+i射線的曝光。 曝光後,將薄膜在2.0質量%碳酸鈉水溶液中在23℃顯影60秒鐘(連同晶圓一起浸漬),藉此獲得了以1~100mJ/cm 2的各曝光量進行了曝光、顯影之薄膜B。 根據利用上述的方法獲得之薄膜A、薄膜B的膜厚,由以下的式算出殘膜率。 殘膜率(%)=(各曝光量下的薄膜B的膜厚/薄膜A的膜厚)×100 然後,將殘膜率成為90%以上之曝光量作為各感光性樹脂組成物的靈敏度。將結果示於表3。若殘膜率成為90%以上之曝光量為25mJ/cm 2以下,則能夠毫無問題地用作感光性組成物,若為20mJ/cm 2以下,則能夠視為靈敏度良好,若為15mJ/cm 2以下,則能夠視為更良好,進而,若為12mJ/cm 2以下,則能夠視為尤其良好。 The obtained photosensitive resin composition was spin-coated on a 3-inch silicon wafer treated with HMDS (Hexamethyldisilazane), and baked on a hot plate at 100°C for 120 seconds to obtain a thickness of about 3.0 μm (±0.3 μm) film A. The film A is separated from a mask having a gradation of 1 to 100% light shielding rate, and a g+h+i ray mask aligner (PLA-501F) manufactured by Canon Inc. is used to 100 mJ/cm 2 The exposure amount was g+h+i ray exposure. After exposure, the film was developed in a 2.0 mass% sodium carbonate aqueous solution at 23°C for 60 seconds (immersed together with the wafer), thereby obtaining a film exposed and developed at each exposure dose of 1 to 100 mJ/cm 2 B. Based on the film thicknesses of film A and film B obtained by the above method, the remaining film rate is calculated from the following formula. Remaining film rate (%) = (film thickness of film B at each exposure dose/film thickness of film A) × 100 Then, the exposure dose at which the film remaining rate became 90% or more was defined as the sensitivity of each photosensitive resin composition. The results are shown in Table 3. If the exposure dose at which the residual film rate becomes 90% or more is 25 mJ/cm 2 or less, it can be used as a photosensitive composition without any problem. If it is 20 mJ/cm 2 or less, the sensitivity can be considered to be good. If it is 15 mJ/cm 2 If it is 12 mJ/cm 2 or less, it can be considered to be better, and if it is 12 mJ/cm 2 or less, it can be considered to be particularly good.

[感光性樹脂組成物的靈敏度評價2(以低曝光量曝光後的殘膜率)] (5mJ/cm 2的曝光量下的殘膜率) 將上述的靈敏度評價1中所製備之感光性樹脂組成物旋塗於經HMDS(Hexamethyldisilazane)處理之3英吋矽晶圓上,並在100℃於加熱板上烘烤120秒鐘而獲得了3.0μm厚度(±0.3μm)的薄膜A。 對該薄膜A介隔具有遮光率1~100%的灰度之光罩,用Canon Inc.製造之g+h+i射線遮罩對準器(PLA-501F)以5mJ/cm 2的曝光量進行了g+h+i射線的曝光。 曝光後,將薄膜在2.0質量%碳酸鈉水溶液中在23℃顯影60秒鐘(連同晶圓一起浸漬),藉此獲得了薄膜B。 根據利用上述的方法獲得之薄膜A、薄膜B的膜厚,由以下的式算出殘膜率。 殘膜率(%)=(各曝光量下的薄膜B的膜厚/薄膜A的膜厚)×100 將結果示於表3。5mJ/cm 2的曝光量下的殘膜率愈大,愈以低曝光量硬化,能夠視為靈敏度良好。 [Sensitivity Evaluation 2 of the Photosensitive Resin Composition (Residual Film Rate after Exposure at Low Exposure)] (Remaining Film Rate at an Exposure of 5 mJ/cm 2 ) The photosensitive resin prepared in the above sensitivity evaluation 1 The composition was spin-coated on a 3-inch silicon wafer treated with HMDS (Hexamethyldisilazane), and baked on a hot plate at 100°C for 120 seconds to obtain a 3.0 μm thick (±0.3 μm) film A. The film A was separated from a grayscale mask with a light shielding rate of 1 to 100%, and the g+h+i ray mask aligner (PLA-501F) manufactured by Canon Inc. was used to expose the film A at an exposure dose of 5 mJ/cm 2 Exposure to g+h+i rays was performed. After exposure, the film was developed in a 2.0 mass% sodium carbonate aqueous solution at 23°C for 60 seconds (immersed together with the wafer), thereby obtaining film B. Based on the film thicknesses of film A and film B obtained by the above method, the remaining film rate is calculated from the following formula. Residual film rate (%) = (film thickness of film B at each exposure dose/film thickness of film A) × 100. The results are shown in Table 3. The greater the residual film rate at the exposure dose of 5 mJ/cm 2 , the better Hardening with low exposure can be considered to have good sensitivity.

(10mJ/cm 2的曝光量下的殘膜率) 將上述的靈敏度評價1中所製備之感光性樹脂組成物旋塗於經HMDS(Hexamethyldisilazane)處理之3英吋矽晶圓上,並在100℃於加熱板上烘烤120秒鐘而獲得了3.0μm厚度(±0.3μm)的薄膜A。 對該薄膜A介隔具有遮光率1~100%的灰度之光罩,用Canon Inc.製造之g+h+i射線遮罩對準器(PLA-501F)以10mJ/cm 2的曝光量進行了g+h+i射線的曝光。 曝光後,將薄膜在2.0質量%碳酸鈉水溶液中在23℃顯影60秒鐘(連同晶圓一起浸漬),藉此獲得了薄膜B。 根據利用上述的方法獲得之薄膜A、薄膜B的膜厚,由以下的式算出殘膜率。 殘膜率(%)=(各曝光量下的薄膜B的膜厚/薄膜A的膜厚)×100 將結果示於表3。10mJ/cm 2的曝光量下的殘膜率愈大,愈以低曝光量硬化,能夠視為靈敏度良好。 (Remaining film rate at an exposure dose of 10mJ/ cm2 ) The photosensitive resin composition prepared in the above sensitivity evaluation 1 was spin-coated on a 3-inch silicon wafer treated with HMDS (Hexamethyldisilazane), and inlaid at 100 ℃ and baked on a hot plate for 120 seconds to obtain film A with a thickness of 3.0 μm (±0.3 μm). The film A is separated from a gray mask having a light shielding rate of 1 to 100%, and a g+h+i ray mask aligner (PLA-501F) manufactured by Canon Inc. is used to expose the film A at an exposure dose of 10 mJ/cm 2 Exposure to g+h+i rays was performed. After exposure, the film was developed in a 2.0 mass% sodium carbonate aqueous solution at 23°C for 60 seconds (immersed together with the wafer), thereby obtaining film B. Based on the film thicknesses of film A and film B obtained by the above method, the remaining film rate is calculated from the following formula. Residual film rate (%) = (film thickness of film B at each exposure dose/film thickness of film A) × 100. The results are shown in Table 3. The greater the residual film rate at the exposure dose of 10mJ/ cm2 , the better Hardening with low exposure can be considered to have good sensitivity.

[感光性樹脂組成物的鹼溶解速度(2.0質量%碳酸鈉水溶液)] 將上述靈敏度評價1中所製備之感光性樹脂組成物旋塗於晶圓上,並使PGMEA乾燥,然後,在溫度100℃預烘烤2分鐘,藉此製作出膜厚約2μm的樹脂膜。 將該樹脂膜連同晶圓一起浸漬於溫度23℃的2%碳酸鈉水溶液中,並測量了樹脂膜的溶解速度。 溶解速度藉由如下方式來算出:目視觀察浸漬之晶圓,測量樹脂膜溶解而看不到干涉模樣為止之時間,將膜厚除以該時間。將結果示於表3。若鹼溶解速度為100nm/s以上,則能夠毫無問題地用作感光性材料,若為200nm/s以上,則能夠視為顯影性良好,若為400nm/s以上,則能夠視為更良好,進而,若為700nm/s以上,則能夠視為尤其良好。 [Alkali dissolution rate of photosensitive resin composition (2.0 mass% sodium carbonate aqueous solution)] The photosensitive resin composition prepared in the above sensitivity evaluation 1 was spin-coated on the wafer, and the PGMEA was dried, and then prebaked at a temperature of 100° C. for 2 minutes to produce a resin film with a film thickness of approximately 2 μm. The resin film and the wafer were immersed in a 2% sodium carbonate aqueous solution at a temperature of 23°C, and the dissolution rate of the resin film was measured. The dissolution rate is calculated by visually observing the immersed wafer, measuring the time until the resin film dissolves and no interference pattern is visible, and dividing the film thickness by the time. The results are shown in Table 3. If the alkali dissolution rate is 100 nm/s or more, it can be used as a photosensitive material without any problem. If it is 200 nm/s or more, the developability can be considered to be good. If it is 400 nm/s or more, it can be considered to be even better. , and further, if it is 700 nm/s or more, it can be considered to be particularly good.

[黃色指數] 將上述的靈敏度評價1中所製備之感光性樹脂組成物旋塗於EAGLE XG玻璃(Corning Incorporated Co.,Ltd.製造,厚度0.5mm)上,並在100℃於加熱板上烘烤120秒鐘而獲得了約3.0μm厚度(±0.1μm)的薄膜。 接著,對該薄膜用Canon Inc.製造之g+h+i射線遮罩對準器(PLA-600F)以100mJ/cm 2的曝光量進行了g+h+i射線的曝光。 曝光後,將薄膜在2.0質量%碳酸鈉水溶液中在23℃顯影60秒鐘(連同晶圓一起浸漬),藉此獲得了以100mJ/cm 2的曝光量進行了曝光、顯影之薄膜。 將薄膜在230℃且在空氣下加熱處理了30分鐘。將薄膜在室溫空氣下進行冷卻之後、再度將薄膜在230℃且在空氣下加熱處理了30分鐘。反覆進行相同的操作,合計進行了3次在空氣下加熱處理30分鐘。 使用色彩色差計CR-5(Konica Minolta, Inc.製造),改變測量部位而測量3次藉由上述方法而獲得之薄膜的黃色指數(YI),將其平均值作為YI的值。測量類型為透射測量,100%校正使用了未塗佈的EAGLE XG玻璃(Corning Incorporated Co.,Ltd.製造,厚度0.5mm)。將結果示於表3。若黃色指數為1.30以下,則能夠毫無問題地用作感光性材料,若為1.10以下,則能夠視為耐熱變色性良好,若為1.00以下,則能夠視為耐熱變色性更良好,進而,若為0.85以下,則能夠視為尤其良好。 [Yellow Index] The photosensitive resin composition prepared in the above sensitivity evaluation 1 was spin-coated on EAGLE XG glass (manufactured by Corning Incorporated Co., Ltd., thickness 0.5 mm), and baked on a hot plate at 100°C. Bake for 120 seconds to obtain a film with a thickness of approximately 3.0 μm (±0.1 μm). Next, the film was exposed to g+h+i rays using a g+h+i ray mask aligner (PLA-600F) manufactured by Canon Inc. at an exposure dose of 100 mJ/cm 2 . After exposure, the film was developed in a 2.0 mass% sodium carbonate aqueous solution at 23°C for 60 seconds (immersed together with the wafer), thereby obtaining a film exposed and developed at an exposure dose of 100 mJ/cm 2 . The film was heat treated at 230°C under air for 30 minutes. After the film was cooled in air at room temperature, the film was again heat-treated at 230° C. in air for 30 minutes. The same operation was repeated, and heat treatment under air for 30 minutes was performed a total of three times. Using a colorimeter CR-5 (manufactured by Konica Minolta, Inc.), the yellowness index (YI) of the film obtained by the above method was measured three times while changing the measurement location, and the average value was used as the value of YI. The measurement type is transmission measurement, and 100% correction uses uncoated EAGLE XG glass (manufactured by Corning Incorporated Co., Ltd., thickness 0.5mm). The results are shown in Table 3. If the yellow index is 1.30 or less, it can be used as a photosensitive material without any problem. If it is 1.10 or less, the heat discoloration resistance can be considered to be good. If it is 1.00 or less, the heat discoloration resistance can be considered to be better. Furthermore, If it is 0.85 or less, it can be regarded as particularly good.

將顯影性評價及靈敏度評價的結果示於表3。Table 3 shows the results of developability evaluation and sensitivity evaluation.

[表5] 表3 實施例No. 樹脂組成物No. 聚合物No. (聚合物溶液No.) 樹脂組成物的性能評價 感光性樹脂組成物的硬化物的性能評價 感光性樹脂組成物的性能評價 鹼溶解速度DR (nm/s) 軟化點的評價 熱處理後的黃色指數 (YI) 鹼溶解速度DR (nm/s) 90%殘膜曝光量 (mJ/cm 2 5mJ/cm 2曝光時殘膜率 10mJ/cm 2曝光時殘膜率 比較例1 樹脂組成物1 聚合物P1 172 A 0.99 479 50 23% 38% 比較例2 樹脂組成物2 聚合物P2 149 B 1.12 301 20 0% 40% 比較例3 樹脂組成物3 聚合物P3 (聚合物溶液P3) >1000 B 0.88 1174 30 55% 80% 比較例4 樹脂組成物4 聚合物P4 (聚合物溶液P4) >1000 B 0.88 1460 15 60% 86% 比較例5 樹脂組成物5 聚合物P5 (聚合物溶液P5) >1000 B 0.77 2217 50 29% 85% 實施例1 樹脂組成物6 聚合物P6 116 A 1.05 460 25 2% 78% 實施例2 樹脂組成物7 聚合物P7 (聚合物溶液P7) >1000 A 0.85 834 18 69% 79% 實施例3 樹脂組成物8 聚合物P8 67 A 1.01 296 15 44% 84% 實施例4 樹脂組成物9 聚合物P9 (聚合物溶液P9) >1000 A 0.74 178 12 69% 86% 實施例5 樹脂組成物10 聚合物P10 (聚合物溶液P10) >1000 A 0.70 447 20 61% 84% 實施例6 樹脂組成物11 聚合物P11 (聚合物溶液P11) >1000 A 0.75 443 12 62% 87% 實施例7 樹脂組成物12 聚合物P12 157 A 0.95 273 12 54% 87% 實施例8 樹脂組成物13 聚合物P13 (聚合物溶液P13) >1000 A 0.74 288 15 62% 83% 實施例9 樹脂組成物14 聚合物P14 107 A 0.95 370 13 58% 85% 實施例10 樹脂組成物15 聚合物P15 (聚合物溶液P15) >1000 A 0.77 215 15 66% 79% [表6] 表3(接續) 實施例No. 樹脂組成物No. 聚合物No. (聚合物溶液No.) 樹脂組成物的性能評價 感光性樹脂組成物的硬化物的性能評價 感光性樹脂組成物的性能評價 鹼溶解速度DR (nm/s) 軟化點的評價 熱處理後的黃色指數 (YI) 鹼溶解速度DR (nm/s) 90%殘膜曝光量 (mJ/cm 2 5mJ/cm 2曝光時殘膜率 10mJ/cm 2曝光時殘膜率 實施例11 樹脂組成物16 聚合物P16 52 A 0.99 151 13 45% 77% 實施例12 樹脂組成物17 聚合物P17 (聚合物溶液P17) >1000 A 0.75 561 15 64% 83% 實施例13 樹脂組成物18 聚合物P18 157 A 0.98 385 15 3% 79% 實施例14 樹脂組成物19 聚合物P19 (聚合物溶液P19) 89 A 0.88 355 18 61% 76% 實施例15 樹脂組成物20 聚合物P20 (聚合物溶液P20) >1000 A 0.81 181 15 63% 77% 實施例16 樹脂組成物21 聚合物P21 31 A 0.97 158 40 8% 71% 實施例17 樹脂組成物22 聚合物P22 (聚合物溶液P22) 45 A 0.99 131 45 2% 67% 實施例18 樹脂組成物23 聚合物P23 28 A 1.09 124 5 4% 92% 實施例19 樹脂組成物24 聚合物P24 (聚合物溶液P24) 47 A 1.01 151 6 63% 88% 實施例20 樹脂組成物25 聚合物P25 65 A 1.10 210 7 4% 89% 實施例21 樹脂組成物26 聚合物P26 (聚合物溶液P26) 67 A 1.02 232 8 56% 75% 實施例22 樹脂組成物27 聚合物P27 (聚合物溶液P27) 64 A 1.04 271 20 65% 70% 實施例23 樹脂組成物28 聚合物P28 (聚合物溶液P28) 30 A 1.24 145 20 34% 71% 實施例24 樹脂組成物29 聚合物P29 (聚合物溶液P29) 28 A 1.29 124 18 36% 70% [table 5] table 3 Example No. Resin composition No. Polymer No. (Polymer solution No.) Performance evaluation of resin compositions Performance evaluation of cured products of photosensitive resin compositions Performance evaluation of photosensitive resin compositions Alkali dissolution rate DR (nm/s) Evaluation of softening point Yellow index (YI) after heat treatment Alkali dissolution rate DR (nm/s) 90% residual film exposure (mJ/cm 2 ) Residual film rate when exposed to 5mJ/ cm2 Residual film rate when exposed to 10mJ/ cm2 Comparative example 1 Resin composition 1 Polymer P1 172 A 0.99 479 50 twenty three% 38% Comparative example 2 Resin composition 2 Polymer P2 149 B 1.12 301 20 0% 40% Comparative example 3 Resin composition 3 Polymer P3 (polymer solution P3) >1000 B 0.88 1174 30 55% 80% Comparative example 4 Resin composition 4 Polymer P4 (polymer solution P4) >1000 B 0.88 1460 15 60% 86% Comparative example 5 Resin composition 5 Polymer P5 (polymer solution P5) >1000 B 0.77 2217 50 29% 85% Example 1 Resin composition 6 Polymer P6 116 A 1.05 460 25 2% 78% Example 2 Resin composition 7 Polymer P7 (polymer solution P7) >1000 A 0.85 834 18 69% 79% Example 3 Resin composition 8 Polymer P8 67 A 1.01 296 15 44% 84% Example 4 Resin composition 9 Polymer P9 (polymer solution P9) >1000 A 0.74 178 12 69% 86% Example 5 Resin composition 10 Polymer P10 (polymer solution P10) >1000 A 0.70 447 20 61% 84% Example 6 Resin composition 11 Polymer P11 (polymer solution P11) >1000 A 0.75 443 12 62% 87% Example 7 Resin composition 12 Polymer P12 157 A 0.95 273 12 54% 87% Example 8 Resin composition 13 Polymer P13 (polymer solution P13) >1000 A 0.74 288 15 62% 83% Example 9 Resin composition 14 Polymer P14 107 A 0.95 370 13 58% 85% Example 10 Resin composition 15 Polymer P15 (polymer solution P15) >1000 A 0.77 215 15 66% 79% [Table 6] Table 3 (continued) Example No. Resin composition No. Polymer No. (Polymer solution No.) Performance evaluation of resin compositions Performance evaluation of cured products of photosensitive resin compositions Performance evaluation of photosensitive resin compositions Alkali dissolution rate DR (nm/s) Evaluation of softening point Yellow index (YI) after heat treatment Alkali dissolution rate DR (nm/s) 90% residual film exposure (mJ/cm 2 ) Residual film rate when exposed to 5mJ/ cm2 Residual film rate when exposed to 10mJ/ cm2 Example 11 Resin composition 16 Polymer P16 52 A 0.99 151 13 45% 77% Example 12 Resin composition 17 Polymer P17 (polymer solution P17) >1000 A 0.75 561 15 64% 83% Example 13 Resin composition 18 Polymer P18 157 A 0.98 385 15 3% 79% Example 14 Resin composition 19 Polymer P19 (polymer solution P19) 89 A 0.88 355 18 61% 76% Example 15 Resin composition 20 Polymer P20 (polymer solution P20) >1000 A 0.81 181 15 63% 77% Example 16 Resin composition 21 Polymer P21 31 A 0.97 158 40 8% 71% Example 17 Resin composition 22 Polymer P22 (polymer solution P22) 45 A 0.99 131 45 2% 67% Example 18 Resin composition 23 Polymer P23 28 A 1.09 124 5 4% 92% Example 19 Resin composition 24 Polymer P24 (polymer solution P24) 47 A 1.01 151 6 63% 88% Example 20 Resin composition 25 Polymer P25 65 A 1.10 210 7 4% 89% Example 21 Resin composition 26 Polymer P26 (polymer solution P26) 67 A 1.02 232 8 56% 75% Example 22 Resin composition 27 Polymer P27 (polymer solution P27) 64 A 1.04 271 20 65% 70% Example 23 Resin composition 28 Polymer P28 (polymer solution P28) 30 A 1.24 145 20 34% 71% Example 24 Resin composition 29 Polymer P29 (polymer solution P29) 28 A 1.29 124 18 36% 70%

根據原料聚合物3~11與原料聚合物1及2的比較,與原料聚合物1及2相比,含有來自於不飽和二羧酸二烷基酯之結構單元之原料聚合物3~11,其軟化點或熔點大幅下降。 又,含有來自於不飽和二羧酸二烷基酯之結構單元之聚合物P6、P8、P12、P14、P16、P18、P21、P23、P25,其軟化點為110℃以下,熔點為140℃以下,具有低軟化點及低熔點。 由不含有來自於不飽和二羧酸二烷基酯之結構單元之比較例2~5的聚合物製作之感光性樹脂組成物的硬化物,其軟化點為100℃以上。另一方面,由含有來自於不飽和二羧酸二烷基酯之結構單元之實施例1~24的聚合物製作之感光性樹脂組成物的硬化物,其軟化點未達100℃,硬化時容易因熱而熔融,可預測光刻處理中之加工性及圖案形成性良好。又,含有實施例1~24的聚合物之感光性樹脂組成物,其平衡良好地具有鹼溶性、靈敏度及耐熱變色性。由比較例1的聚合物製作之感光性樹脂組成物的硬化物,其軟化點低於100℃,但感光性樹脂組成物的靈敏度不足。含有來自於不飽和二羧酸二烷基酯之結構單元且含有具有用多官能(甲基)丙烯酸化合物開環之結構之聚合物之實施例2~15、18~24的感光性樹脂組成物,其殘膜率成為90%以上之曝光量更低,靈敏度尤其優異。又,含有來自於不飽和二羧酸二烷基酯之結構單元且含有具有用多官能(甲基)丙烯酸化合物開環之結構之聚合物且含有具有衍生自含硫醇基化合物之碳數1~30的1~6價的有機基之聚合物之實施例1~22的感光性樹脂組成物,其黃色指數低,耐熱變色性更優異。 According to the comparison between raw material polymers 3 to 11 and raw material polymers 1 and 2, compared with raw material polymers 1 and 2, raw material polymers 3 to 11 containing structural units derived from unsaturated dicarboxylic acid dialkyl ester, Its softening point or melting point drops significantly. In addition, polymers P6, P8, P12, P14, P16, P18, P21, P23, and P25 containing structural units derived from unsaturated dialkyl dicarboxylate have a softening point of 110°C or less and a melting point of 140°C. Below, it has a low softening point and low melting point. The softening point of the cured product of the photosensitive resin composition produced from the polymer of Comparative Examples 2 to 5 that does not contain a structural unit derived from unsaturated dialkyl dicarboxylate is 100° C. or higher. On the other hand, the softening point of the cured product of the photosensitive resin composition made from the polymer of Examples 1 to 24 containing a structural unit derived from unsaturated dialkyl dicarboxylate did not reach 100°C. It is easily melted by heat and is expected to have good processability and patterning properties in photolithography processing. Furthermore, the photosensitive resin composition containing the polymers of Examples 1 to 24 has alkali solubility, sensitivity, and heat discoloration resistance in a well-balanced manner. The cured product of the photosensitive resin composition made from the polymer of Comparative Example 1 has a softening point lower than 100°C, but the sensitivity of the photosensitive resin composition is insufficient. Photosensitive resin compositions of Examples 2 to 15 and 18 to 24 containing a structural unit derived from an unsaturated dialkyl dicarboxylate and a polymer having a structure ring-opened with a polyfunctional (meth)acrylic compound , the residual film rate becomes more than 90%, the exposure is lower, and the sensitivity is particularly excellent. Also, a polymer containing a structural unit derived from an unsaturated dialkyl dicarboxylate and having a structure ring-opened with a polyfunctional (meth)acrylic compound, and containing a carbon number 1 derived from a thiol group-containing compound. The photosensitive resin compositions of Examples 1 to 22, which are polymers of 1 to 6 valent organic groups of ~30, have a low yellow index and are more excellent in heat discoloration resistance.

<濾色器/間隙物的製作> 製備出著色感光性樹脂組成物,該著色感光性樹脂組成物藉由對實施例1~24中所製備之感光性樹脂組成物進一步加入適量的顏料分散液NX-061(Dainichiseika Color & Chemicals Mfg.Co.,Ltd.製造,綠色)而成。 將其在基板上進行製膜,並進行曝光、鹼顯影處理等,藉此能夠形成綠色的濾色器。 又,作為顏料分散液,代替NX-061而使用該公司製造之NX-053(藍色)、NX-032(紅色)等,能夠形成藍色或紅色的濾色器。 <Preparation of color filter/gap> A colored photosensitive resin composition was prepared by further adding an appropriate amount of pigment dispersion NX-061 (Dainichiseika Color & Chemicals Mfg.) to the photosensitive resin composition prepared in Examples 1 to 24. Co., Ltd. (manufactured, green). A green color filter can be formed by forming a film on a substrate and subjecting it to exposure, alkali development, etc. In addition, as the pigment dispersion liquid, a blue or red color filter can be formed by using NX-053 (blue), NX-032 (red), etc. manufactured by this company instead of NX-061.

<黑色矩陣/黑堤/黑色間隙物的製作> 製備出黑色感光性樹脂組成物,該黑色感光性樹脂組成物藉由對實施例1~24中所製備之感光性樹脂組成物進一步加入適量的碳黑分散液NX-595(Dainichiseika Color & Chemicals Mfg.Co.,Ltd.製造)而成。 將其在基板上製膜,並進行曝光、鹼顯影處理等,藉此能夠形成黑色矩陣/黑堤/黑色間隙物。 <Preparation of black matrix/black bank/black gap> A black photosensitive resin composition was prepared by further adding an appropriate amount of carbon black dispersion NX-595 (Dainichiseika Color & Chemicals Mfg.) to the photosensitive resin composition prepared in Examples 1 to 24. Co., Ltd.). The film is formed on a substrate and subjected to exposure, alkali development, etc., thereby forming a black matrix/black bank/black spacer.

本申請主張以於2022年1月21日申請之日本申請特願2022-008091號為基礎之優先權,並將其揭示之全部內容併入於此。This application claims priority based on Japanese Patent Application Application No. 2022-008091 filed on January 21, 2022, and the entire disclosure of the application is incorporated herein by reference.

10:基板 11:黑色矩陣 12:濾色器 13:保護膜 14:透明電極層 10:Substrate 11: black matrix 12: Color filter 13:Protective film 14:Transparent electrode layer

[圖1]係示意性地表示液晶顯示裝置及/或固體攝像元件的結構的一例之圖(剖面圖)。 [圖2]係原料聚合物4的 13C-NMR圖譜。 [圖3]係原料聚合物4的TMA圖譜。 [圖4]係製備例23中所獲得之聚合物P23的 1H-NMR圖譜。 [Fig. 1] is a diagram (cross-sectional view) schematically showing an example of the structure of a liquid crystal display device and/or a solid-state imaging element. [Fig. 2] It is the 13 C-NMR spectrum of raw material polymer 4. [Fig. 3] shows the TMA spectrum of the raw material polymer 4. [Fig. 4] is a 1 H-NMR spectrum of polymer P23 obtained in Preparation Example 23.

10:基板 10:Substrate

11:黑色矩陣 11: black matrix

12:濾色器 12: Color filter

13:保護膜 13:Protective film

14:透明電極層 14:Transparent electrode layer

Claims (25)

一種聚合物,其含有: 式(NB)所表示之結構單元; 式(AD)所表示之結構單元;及 選自式(1-2)所表示之結構單元及式(1-3)所表示之結構單元中之至少1個結構單元,其中, 通式(NB)中,R 1、R 2、R 3及R 4分別獨立地為氫原子或碳數1~30的有機基,a 1為0、1或2, 式(AD)中,R 11及R 12分別獨立地為碳數1~12的直鏈或支鏈的烷基,R 13及R 14分別獨立地為氫原子或碳數1~3的烷基, 式(1-2)中,R p為具有2個以上的(甲基)丙烯醯基之基,R 22為氫原子或碳數1~3的有機基, 式(1-3)中,R s為具有1個(甲基)丙烯醯基之基,R 22為氫原子或碳數1~3的有機基。 A polymer containing: a structural unit represented by formula (NB); a structural unit represented by formula (AD); and a structural unit selected from formula (1-2) and formula (1-3) At least 1 structural unit among the structural units, wherein, In the general formula (NB), R 1 , R 2 , R 3 and R 4 are each independently a hydrogen atom or an organic group having 1 to 30 carbon atoms, a 1 is 0, 1 or 2, In the formula (AD), R 11 and R 12 are each independently a linear or branched alkyl group having 1 to 12 carbon atoms, and R 13 and R 14 are each independently a hydrogen atom or an alkyl group having 1 to 3 carbon atoms. , In formula (1-2), R p is a group having two or more (meth)acrylyl groups, R 22 is a hydrogen atom or an organic group having 1 to 3 carbon atoms, In formula (1-3), R s is a group having one (meth)acrylyl group, and R 22 is a hydrogen atom or an organic group having 1 to 3 carbon atoms. 如請求項1之聚合物,其進一步含有式(1-1)所表示之結構單元, 式(1-1)中, R 21為氫原子或碳數1~3的有機基, Z為含有1個以上的(甲基)丙烯醯基之基, Q為氫原子或經取代或未經取代之碳數1~6的烷基, X表示氧原子或經取代或未經取代之碳數1~4的伸烷基, 當Q為前述烷基且X為前述伸烷基時,Q與X可以縮合而形成環式基。 The polymer of claim 1 further contains a structural unit represented by formula (1-1), In the formula (1-1), R 21 is a hydrogen atom or an organic group having 1 to 3 carbon atoms, Z is a group containing one or more (meth)acrylyl groups, Q is a hydrogen atom or a substituted or unsubstituted group. Substituted alkyl group having 1 to 6 carbon atoms, X represents an oxygen atom or a substituted or unsubstituted alkyl group having 1 to 4 carbon atoms. When Q is the aforementioned alkyl group and X is the aforementioned alkylene group, Q and X may condense to form a cyclic group. 如請求項1之聚合物,其進一步含有式(1-4)所表示之結構單元, 式(1-4)中, R 22為氫原子或碳數1~3的有機基。 Such as the polymer of claim 1, which further contains structural units represented by formula (1-4), In formula (1-4), R 22 is a hydrogen atom or an organic group having 1 to 3 carbon atoms. 如請求項1之聚合物,其進一步含有選自式(1)所表示之結構單元及式(2)所表示之結構單元中之至少1個, 式(1)中,R p為具有2個以上的(甲基)丙烯醯基之基,R 21及R 22分別獨立地為氫原子或碳數1~3的有機基, 式(2)中,R s為具有1個(甲基)丙烯醯基之基,R 21及R 22分別獨立地為氫原子或碳數1~3的有機基。 The polymer of claim 1, which further contains at least one selected from the structural unit represented by formula (1) and the structural unit represented by formula (2), In formula (1), R p is a group having two or more (meth)acrylyl groups, R 21 and R 22 are each independently a hydrogen atom or an organic group having 1 to 3 carbon atoms, In formula (2), R s is a group having one (meth)acrylyl group, and R 21 and R 22 are each independently a hydrogen atom or an organic group having 1 to 3 carbon atoms. 如請求項1之聚合物,其進一步含有式(3)所表示之結構單元, 式(3)中,R 21及R 22分別獨立地為氫原子或碳數1~3的有機基。 The polymer of claim 1 further contains a structural unit represented by formula (3), In formula (3), R 21 and R 22 are each independently a hydrogen atom or an organic group having 1 to 3 carbon atoms. 如請求項2之聚合物,其進一步含有選自式(8)所表示之結構單元及式(9)所表示之結構單元中之至少1個, 式(8)中, Z為含有1個以上的(甲基)丙烯醯基之基, Q為氫原子或經取代或未經取代之碳數1~6的烷基, X表示氧原子或經取代或未經取代之碳數1~4的伸烷基, 當Q為前述烷基且X為前述伸烷基時,Q與X可以縮合而形成環式基, R p為具有2個以上的(甲基)丙烯醯基之基, R 21及R 22為氫原子或碳數1~3的有機基, 式(9)中, Z為含有1個以上的(甲基)丙烯醯基之基, Q為氫原子或經取代或未經取代之碳數1~6的烷基, X表示氧原子或經取代或未經取代之碳數1~4的伸烷基, 當Q為前述烷基且X為前述伸烷基時,Q與X可以縮合而形成環式基, R s為具有1個(甲基)丙烯醯基之基, R 21及R 22為氫原子或碳數1~3的有機基。 The polymer of claim 2, which further contains at least one selected from the structural unit represented by formula (8) and the structural unit represented by formula (9), In formula (8), Z is a group containing one or more (meth)acrylyl groups, Q is a hydrogen atom or a substituted or unsubstituted alkyl group having 1 to 6 carbon atoms, and X represents an oxygen atom or A substituted or unsubstituted alkylene group having 1 to 4 carbon atoms. When Q is the aforementioned alkyl group and X is the aforementioned alkylene group, Q and (meth)acrylyl group, R 21 and R 22 are hydrogen atoms or organic groups with 1 to 3 carbon atoms, In formula (9), Z is a group containing one or more (meth)acrylyl groups, Q is a hydrogen atom or a substituted or unsubstituted alkyl group having 1 to 6 carbon atoms, and X represents an oxygen atom or an alkyl group having 1 to 6 carbon atoms. A substituted or unsubstituted alkylene group with 1 to 4 carbon atoms. When Q is the aforementioned alkyl group and X is the aforementioned alkylene group, Q and group) acrylic group, R 21 and R 22 are hydrogen atoms or organic groups having 1 to 3 carbon atoms. 如請求項2之聚合物,其進一步含有式(5)所表示之結構單元, 式(5)中, Z為含有1個以上的(甲基)丙烯醯基之基, Q為氫原子或經取代或未經取代之碳數1~6的烷基, X表示氧原子或經取代或未經取代之碳數1~4的伸烷基, 當Q為前述烷基且X為前述伸烷基時,Q與X可以縮合而形成環式基, R 21及R 22為氫原子或碳數1~3的有機基。 Such as the polymer of claim 2, which further contains structural units represented by formula (5), In formula (5), Z is a group containing one or more (meth)acrylyl groups, Q is a hydrogen atom or a substituted or unsubstituted alkyl group having 1 to 6 carbon atoms, and X represents an oxygen atom or Substituted or unsubstituted alkylene group having 1 to 4 carbon atoms. When Q is the aforementioned alkyl group and X is the aforementioned alkylene group, Q and X may be condensed to form a cyclic group. R 21 and R 22 are hydrogen atoms. Or an organic group having 1 to 3 carbon atoms. 如請求項2之聚合物,其進一步含有式(6)所表示之結構單元, 式(6)中, Z為含有1個以上的(甲基)丙烯醯基之基, Q為氫原子或經取代或未經取代之碳數1~6的烷基, X表示氧原子或經取代或未經取代之碳數1~4的伸烷基, 當Q為前述烷基且X為前述伸烷基時,Q與X可以縮合而形成環式基, R 21及R 22為氫原子或碳數1~3的有機基。 The polymer of claim 2 further contains a structural unit represented by formula (6), In formula (6), Z is a group containing one or more (meth)acrylyl groups, Q is a hydrogen atom or a substituted or unsubstituted alkyl group having 1 to 6 carbon atoms, and X represents an oxygen atom or Substituted or unsubstituted alkylene group having 1 to 4 carbon atoms. When Q is the aforementioned alkyl group and X is the aforementioned alkylene group, Q and X may be condensed to form a cyclic group. R 21 and R 22 are hydrogen atoms. Or an organic group having 1 to 3 carbon atoms. 如請求項1之聚合物,其進一步含有式(MA)所表示之結構單元, 式(MA)中,R 21及R 22分別獨立地為氫原子或碳數1~3的有機基。 The polymer of claim 1 further contains a structural unit represented by formula (MA), In the formula (MA), R 21 and R 22 are each independently a hydrogen atom or an organic group having 1 to 3 carbon atoms. 如請求項1之聚合物,其中, 該聚合物含有前述式(1-2)所表示之結構單元, 前述式(1-2)中的R p為選自式(1b)所表示之基、式(1c)所表示之基及式(1d)所表示之基中之至少1個, 式(1b)中, k為2或3, R為氫原子或甲基,複數個R可以相同亦可以不同, X 1為單鍵、碳數1~6的伸烷基或-Z-X-所表示之基,其中Z為-O-或-OCO-,X為碳數1~6的伸烷基,存在複數個之X 1可以相同亦可以不同, X 1’為單鍵、碳數1~6的伸烷基或-X’-Z’-所表示之基,其中X’為碳數1~6的伸烷基,Z’為-O-或-COO-, X 2為碳數1~12的(k+1)價的有機基, 式(1c)中, k、R、X 1及X 2分別與上述通式(1b)中之R、k、X 1及X 2同義,複數個R彼此可以相同亦可以不同,複數個X 1彼此可以相同亦可以不同, X 3為單鍵或碳數1~6的2價的有機基, X 4及X 5分別獨立地為單鍵或碳數1~6的2價的有機基, X 6為碳數1~6的2價的有機基, 式(1d)中, n為2~5的整數, R獨立地為氫原子或甲基。 The polymer of claim 1, wherein the polymer contains the structural unit represented by the aforementioned formula (1-2), and R p in the aforementioned formula (1-2) is selected from the group represented by the formula (1b), At least one of the base represented by formula (1c) and the base represented by formula (1d), In formula (1b), k is 2 or 3, R is a hydrogen atom or a methyl group, and the plurality of R may be the same or different. X 1 is a single bond, an alkylene group with 1 to 6 carbon atoms, or -ZX-. The base , where Z is -O- or -OCO-, Alkylene group or a group represented by -X'-Z'-, where X' is an alkylene group with 1 to 6 carbon atoms, Z' is -O- or -COO-, and X 2 is an alkylene group with 1 to 12 carbon atoms The organic radical with (k+1) valence, In formula (1c), k , R, X 1 and X 2 are respectively synonymous with R, k, X 1 and They may be the same or different from each other. X 3 is a single bond or a divalent organic group having 1 to 6 carbon atoms. X 4 and X 5 are each independently a single bond or a divalent organic group having 1 to 6 carbon atoms. 6 is a divalent organic group having 1 to 6 carbon atoms, In formula (1d), n is an integer of 2 to 5, and R is independently a hydrogen atom or a methyl group. 如請求項1之聚合物,其中, 該聚合物含有前述式(1-3)所表示之結構單元, 前述式(1-3)中的R s為式(2a)所表示之基, 式(2a)中,X 10為2價的有機基,R為氫原子或甲基。 The polymer of claim 1, wherein the polymer contains the structural unit represented by the aforementioned formula (1-3), R s in the aforementioned formula (1-3) is a group represented by the formula (2a), In formula (2a), X 10 is a divalent organic group, and R is a hydrogen atom or a methyl group. 如請求項1之聚合物,其進一步含有式(MI)所表示之結構單元, 式(MI)中, R 31為氫原子或碳數1~30的有機基, R 32及R 33分別獨立地為氫原子或碳數1~3的有機基。 The polymer of claim 1 further contains a structural unit represented by formula (MI), In the formula (MI), R 31 is a hydrogen atom or an organic group having 1 to 30 carbon atoms, and R 32 and R 33 are each independently a hydrogen atom or an organic group having 1 to 3 carbon atoms. 如請求項1之聚合物,其中, 該聚合物具有式(P3)所表示之結構, 式(P3)中, n為1~6的整數, p、q及r表示n個[ ]內的每一個聚合物鏈中所含之結構單元A、B及C的莫耳含有率, p、q及r在n個[ ]內的每一個聚合物鏈中可以相同亦可以不同, p+q+r=1,p為0以上,q為0以上,r為0以上, 若將該聚合物中所含有之各結構單元A、B及C的莫耳含有率分別設為p t、q t及r t,則p t+q t+r t=1,p t大於0,q t大於0,r t大於0, X為氫原子或碳數1~30的有機基, Y為衍生自單官能或2官能以上的含硫醇基化合物之碳數1~30的1~6價的有機基, A表示前述式(NB)所表示之結構單元, B含有選自前述式(1-2)所表示之結構單元及前述式(1-3)所表示之結構單元中之至少1個結構單元, C表示前述式(AD)所表示之結構單元, 存在複數個之A彼此、B彼此、C彼此可以相同亦可以不同。 The polymer of claim 1, wherein the polymer has a structure represented by formula (P3), In formula (P3), n is an integer from 1 to 6, p, q and r represent the molar content of structural units A, B and C contained in each polymer chain within n [ ], p, q and r can be the same or different in each polymer chain within n [ ], p+q+r=1, p is 0 or more, q is 0 or more, r is 0 or more, if the polymer The molar content of each structural unit A, B and C contained in is set to p t , q t and r t respectively, then p t +q t +r t =1, p t is greater than 0, q t is greater than 0 , r t is greater than 0, X is a hydrogen atom or an organic group with 1 to 30 carbon atoms, Y is a 1-6 valent organic group with 1 to 30 carbon atoms derived from a monofunctional or difunctional or higher-functional thiol group-containing compound. , A represents the structural unit represented by the aforementioned formula (NB), and B contains at least one structural unit selected from the structural unit represented by the aforementioned formula (1-2) and the structural unit represented by the aforementioned formula (1-3). , C represents the structural unit represented by the aforementioned formula (AD), and there are a plurality of A's, B's, and C's which may be the same or different. 如請求項12之聚合物,其具有式(P4)所表示之結構, 式(P4)中, n為1~6的整數, p、q、r及s表示n個[ ]內的每一個聚合物鏈中所含之結構單元A、B、C及D的莫耳含有率, p、q、r及s在n個[ ]內的每一個聚合物鏈中可以相同亦可以不同, p+q+r+s=1,p為0以上,q為0以上,r為0以上,s為0以上, 若將該聚合物中所含有之各結構單元A、B、C及D的莫耳含有率分別設為p t、q t、r t及s t,則p t+q t+r t+s t=1,p t大於0,q t大於0,r t大於0,s t大於0, X為氫原子或碳數1~30的有機基, Y為衍生自單官能或2官能以上的含硫醇基化合物之碳數1~30的1~6價的有機基, A表示前述式(NB)所表示之結構單元, B含有選自前述式(1-2)所表示之結構單元及前述式(1-3)所表示之結構單元中之至少1個結構單元, C表示前述式(AD)所表示之結構單元, D表示前述式(MI)所表示之結構單元, 存在複數個之A彼此、B彼此、C彼此、D彼此可以相同亦可以不同。 For example, the polymer of claim 12 has a structure represented by formula (P4), In formula (P4), n is an integer from 1 to 6, p, q, r and s represent the molar content of structural units A, B, C and D contained in each polymer chain within n [ ] rate, p, q, r and s can be the same or different in each polymer chain within n [ ], p+q+r+s=1, p is 0 or more, q is 0 or more, r is 0 or more, s is 0 or more, if the molar content of each structural unit A, B, C and D contained in the polymer is respectively p t , q t , r t and s t , then p t +q t +r t +s t =1, p t is greater than 0, q t is greater than 0, r t is greater than 0, s t is greater than 0, X is a hydrogen atom or an organic group with 1 to 30 carbon atoms, Y is derived from A 1- to 6-valent organic group having a carbon number of 1 to 30 in a monofunctional or bifunctional or higher-functional thiol group-containing compound, A represents a structural unit represented by the aforementioned formula (NB), and B contains a member selected from the group consisting of the aforementioned formula (1-2 ) and at least one structural unit represented by the aforementioned formula (1-3), C represents the structural unit represented by the aforementioned formula (AD), D represents the structural unit represented by the aforementioned formula (MI) As for the structural unit, there are a plurality of A's, B's, C's and D's which may be the same or different. 如請求項1之聚合物,其中, 該聚合物的重量平均分子量為2,000以上且20,000以下。 Such as the polymer of claim 1, wherein, The weight average molecular weight of this polymer is 2,000 or more and 20,000 or less. 一種聚合物溶液,其含有請求項1至15中任一項之聚合物。A polymer solution containing the polymer of any one of claims 1 to 15. 如請求項16之聚合物溶液,其進一步含有多官能(甲基)丙烯酸化合物或單官能(甲基)丙烯酸化合物或該等的組合。The polymer solution of claim 16 further contains a multifunctional (meth)acrylic acid compound or a monofunctional (meth)acrylic acid compound or a combination thereof. 如請求項16之聚合物溶液,其用於濾色器、黑色矩陣、間隙物或隔壁材料的形成。The polymer solution of claim 16 is used for the formation of color filters, black matrices, spacers or partition materials. 一種感光性樹脂組成物,其含有: 請求項1至15中任一項之聚合物;及 光自由基聚合起始劑。 A photosensitive resin composition containing: The polymer of any one of claims 1 to 15; and Photoradical polymerization initiator. 一種硬化物,其由請求項19之感光性樹脂組成物形成。A hardened product formed from the photosensitive resin composition of claim 19. 一種聚合物,其含有: 式(NB)所表示之結構單元; 式(AD)所表示之結構單元;及 式(MA)所表示之結構單元,其中, 通式(NB)中,R 1、R 2、R 3及R 4分別獨立地為氫原子或碳數1~30的有機基,a 1為0、1或2, 式(MA)中,R 21及R 22分別獨立地為氫原子或碳數1~3的有機基, 式(AD)中,R 11及R 12分別獨立地為碳數1~12的直鏈或支鏈的烷基,R 13及R 14分別獨立地為氫原子或碳數1~3的烷基。 A polymer containing: a structural unit represented by formula (NB); a structural unit represented by formula (AD); and a structural unit represented by formula (MA), wherein, In the general formula (NB), R 1 , R 2 , R 3 and R 4 are each independently a hydrogen atom or an organic group having 1 to 30 carbon atoms, a 1 is 0, 1 or 2, In formula (MA), R 21 and R 22 are each independently a hydrogen atom or an organic group having 1 to 3 carbon atoms, In the formula (AD), R 11 and R 12 are each independently a linear or branched alkyl group having 1 to 12 carbon atoms, and R 13 and R 14 are each independently a hydrogen atom or an alkyl group having 1 to 3 carbon atoms. . 如請求項21之聚合物,其進一步含有式(MI)所表示之結構單元, 式(MI)中, R 31為氫原子或碳數1~30的有機基, R 32及R 33分別獨立地為氫原子或碳數1~3的有機基。 Such as the polymer of claim 21, which further contains a structural unit represented by formula (MI), In the formula (MI), R 31 is a hydrogen atom or an organic group having 1 to 30 carbon atoms, and R 32 and R 33 are each independently a hydrogen atom or an organic group having 1 to 3 carbon atoms. 如請求項21之聚合物,其中, 該聚合物具有式(P3’)所表示之結構, 式(P3')中, n為1~6的整數, p、q'及r表示n個[ ]內的每一個聚合物鏈中所含之結構單元A、B'及C的莫耳含有率, p、q'及r在n個[ ]內的每一個聚合物鏈中可以相同亦可以不同, p+q'+r=1,p為0以上,q'為0以上,r為0以上, 若將該聚合物中所含有之各結構單元A、B及C的莫耳含有率分別設為p t、q t'及r t,則p t+q t'+r t=1,p t大於0,q t'大於0,r t大於0, X為氫原子或碳數1~30的有機基, Y為衍生自單官能或2官能以上的含硫醇基化合物之碳數1~30的1~6價的有機基, A表示前述式(NB)所表示之結構單元, B’表示前述式(MA)所表示之結構單元, C表示前述式(AD)所表示之結構單元, 存在複數個之A彼此、B’彼此、C彼此可以相同亦可以不同。 The polymer of claim 21, wherein the polymer has a structure represented by formula (P3'), In formula (P3'), n is an integer from 1 to 6, p, q' and r represent the molar content of structural units A, B' and C contained in each polymer chain within n [ ] , p, q' and r can be the same or different in each polymer chain within n [ ], p+q'+r=1, p is 0 or more, q' is 0 or more, r is 0 or more , if the molar content of each structural unit A, B and C contained in the polymer is set to p t , q t ' and r t respectively, then p t +q t '+r t =1, p t is greater than 0, qt ' is greater than 0, rt is greater than 0, 30 is an organic group of 1 to 6 valence, A represents the structural unit represented by the aforementioned formula (NB), B' represents the structural unit represented by the aforementioned formula (MA), C represents the structural unit represented by the aforementioned formula (AD), There are a plurality of A's, B''s, and C's, which may be the same or different. 如請求項22之聚合物,其中, 該聚合物具有式(P4')所表示之結構, 式(P4')中, n為1~6的整數, p、q'、r及s表示n個[ ]內的每一個聚合物鏈中所含之結構單元A、B'、C及D的莫耳含有率, p、q'、r及s在n個[ ]內的每一個聚合物鏈中可以相同亦可以不同, p+q'+r+s=1,p為0以上,q'為0以上,r為0以上,s為0以上, 若將該聚合物中所含有之各結構單元A、B'、C及D的莫耳含有率分別設為p t、q t'、r t及s t,則p t+q t'+r t+s t=1,p t大於0,q t'大於0,r t大於0,s t大於0, X為氫原子或碳數1~30的有機基, Y為衍生自單官能或2官能以上的含硫醇基化合物之碳數1~30的1~6價的有機基, A表示前述式(NB)所表示之結構單元, B’表示前述式(MA)所表示之結構單元, C表示前述式(AD)所表示之結構單元, D表示前述式(MI)所表示之結構單元, 存在複數個之A彼此、B’彼此、C彼此、D彼此可以相同亦可以不同。 The polymer of claim 22, wherein the polymer has a structure represented by formula (P4'), In formula (P4'), n is an integer from 1 to 6, p, q', r and s represent the structural units A, B', C and D contained in each polymer chain within n [ ]. Molar content, p, q', r and s can be the same or different in each polymer chain within n [ ], p+q'+r+s=1, p is 0 or more, q' is 0 or more, r is 0 or more, s is 0 or more, if the molar content of each structural unit A, B', C and D contained in the polymer is respectively set to p t , q t ', r t and s t , then p t +q t '+r t +s t =1, p t is greater than 0, q t ' is greater than 0, r t is greater than 0, s t is greater than 0, X is a hydrogen atom or carbon number 1 ~30 organic groups, Y is a 1-6 valent organic group with 1 to 30 carbon atoms derived from a monofunctional or bifunctional or higher-functional thiol group-containing compound, A represents the structural unit represented by the aforementioned formula (NB), B' represents the structural unit represented by the aforementioned formula (MA), C represents the structural unit represented by the aforementioned formula (AD), D represents the structural unit represented by the aforementioned formula (MI), and there are a plurality of A and B'. , C and D may be the same or different from each other. 如請求項20之聚合物,其中, 該聚合物的軟化點為60℃以上且130℃以下。 The polymer of claim 20, wherein, The softening point of this polymer is 60°C or more and 130°C or less.
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